TWI740723B - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
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- TWI740723B TWI740723B TW109140484A TW109140484A TWI740723B TW I740723 B TWI740723 B TW I740723B TW 109140484 A TW109140484 A TW 109140484A TW 109140484 A TW109140484 A TW 109140484A TW I740723 B TWI740723 B TW I740723B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
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- H10P72/3302—
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
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- H10P72/0424—
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- Chemical Kinetics & Catalysis (AREA)
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
[課題]使功能部有效地發揮功能,並防止功能部與基板的干涉。 [解決手段]升降體(33),是在搬送基準面(18)的上方配置在第1旋轉軸(42)與第2旋轉軸(44)之間,在第1及第2輥子(31、32)之雙方尚未載放於基板(1)之上面的期間,是對於搬送基準面(18)維持在既定的下降位置,在第1及第2輥子(31、32)之至少一方載放於基板(1)之上面的期間,是藉由載放於基板(1)之上面的輥子之旋轉軸來被從下降位置抬到上方並維持著。升降方向限制手段(35、36),是將從下降位置進行升降之際之升降體(33)的升降方向,限制成對搬送基準面(18)大致垂直的方向。功能部(50),以在升降體(33)下降至下降位置的狀態下位於搬送基準面(18)之上方的方式固定或一體地設置於升降體(33),從上方面對於搬送途中之基板(1)之上面來發揮功能。 [Problem] Make the functional part function effectively and prevent interference between the functional part and the substrate. [Solution] The elevating body (33) is arranged between the first rotating shaft (42) and the second rotating shaft (44) above the transport reference plane (18), and on the first and second rollers (31, During the period when both of 32) have not been placed on the upper surface of the substrate (1), they are maintained at a predetermined lowering position with respect to the transport reference surface (18) and placed on at least one of the first and second rollers (31, 32) The upper surface of the substrate (1) is lifted and maintained from the lowered position to the upper side by the rotating shaft of the roller placed on the upper surface of the substrate (1). The elevating direction restricting means (35, 36) restricts the elevating direction of the elevating body (33) when elevating from the lowered position to a direction substantially perpendicular to the transport reference plane (18). The functional part (50) is fixed or integrally provided on the lifting body (33) in a state where the lifting body (33) is lowered to the lowered position, and is located above the transport reference plane (18). The upper surface of the substrate (1) functions.
Description
本發明,是關於將印刷配線板或引線框架等之金屬板(以下,將成為對象之印刷配線板、引線框架等之金屬板簡稱為基板)予以搬送並進行處理的基板處理裝置。The present invention relates to a substrate processing apparatus that transports and processes metal plates such as printed wiring boards and lead frames (hereinafter referred to as target metal plates such as printed wiring boards and lead frames).
於專利文獻1,記載有噴霧處理裝置,其具備:具有水平並排之印刷電路板面的印刷電路板的搬送手段、配列在印刷電路板之搬送面的上部並將由供給容器供給之液體狀的處理媒體噴灑到印刷電路板的上面用的噴嘴裝置、以及在噴霧操作期間將噴灑到印刷電路板之上面的處理媒體予以吸引用的吸引噴嘴單元(吸引管)。
吸引管,具備複數個吸引噴嘴,吸引噴嘴,在吸引管的圓周上呈狹縫狀的開口部。吸引管,固定在支撐構件的前面,支撐構件,被2個上側搬送輥子給軸承支撐。 [先前技術文獻] [專利文獻] The suction tube is provided with a plurality of suction nozzles, and the suction nozzle has a slit-shaped opening on the circumference of the suction tube. The suction tube is fixed to the front of the supporting member, and the supporting member is supported by the two upper conveying rollers. [Prior Technical Literature] [Patent Literature]
[專利文獻]日本特開2003-243811號公報[Patent Document] JP 2003-243811 A
[發明所欲解決之問題][The problem to be solved by the invention]
專利文獻1的裝置,在支撐構件(升降體)軸承支撐有2個上側搬送輥子(搬送方向上游側的第1輥子與搬送方向下游側的第2輥子),故在第1輥子載放於印刷電路板(基板)之上面後,到第2輥子載放於基板之上面為止的期間、以及第1輥子從基板之上面下降之後,到第2輥子從基板之上面下降為止的期間,升降體是對基板呈傾斜的狀態。因此,吸引管(功能部)的開口部與基板的上面之間的距離不固定,有無法有效發揮吸引功能的可能性。且,在基板的厚度增大的情況(處理厚度較厚之基板的情況),有基板干涉到升降體或功能部之虞。The device of
於是本發明之目的在於,使功能部在基板之上面之搬送方向的全長區域有效地發揮功能,並確實防止升降體及功能部與基板的干涉。 [解決問題之技術手段] Therefore, the object of the present invention is to enable the functional part to function effectively over the entire length of the conveying direction of the upper surface of the substrate, and to surely prevent interference between the lifting body and the functional part and the substrate. [Technical means to solve the problem]
為了達成上述目的,本發明的第1態樣,是基板處理裝置,以使平躺姿勢之板狀之基板的下面沿著搬送基準面大致水平移動的方式來搬送基板並進行處理,其具備:第1輥子、第2輥子、升降體、升降方向限制手段、功能部。In order to achieve the above-mentioned object, the first aspect of the present invention is a substrate processing apparatus that transports and processes the substrate in such a manner that the lower surface of the plate-shaped substrate in the lying posture moves substantially horizontally along the transport reference plane, and includes: The first roller, the second roller, the lifting body, the lifting direction restricting means, and the functional part.
第1輥子,具有在搬送基準面的上方可對搬送基準面升降的第1旋轉軸,在載放於搬送途中之基板之上面的狀態下,一邊接觸基板之上面一邊以第1旋轉軸為中心來旋轉。第2輥子,具有在第1輥子之搬送方向下游側之搬送基準面的上方可對搬送基準面升降的第2旋轉軸,在載放於搬送途中之基板之上面的狀態下,一邊接觸基板之上面一邊以第2旋轉軸為中心來旋轉。The first roller has a first rotating shaft that can be raised and lowered above the conveying reference surface. When it is placed on the upper surface of the substrate during transportation, it is centered on the first rotating shaft while touching the upper surface of the substrate Come spin. The second roller has a second rotating shaft that can move up and down the transport reference surface above the transport reference surface on the downstream side of the transport direction of the first roller. The upper side rotates around the second rotation axis.
升降體,是在搬送基準面的上方配置在第1旋轉軸與前述第2旋轉軸之間,在第1及第2輥子之雙方尚未載放於基板之上面的期間,是對於搬送基準面維持在既定的下降位置,在第1及第2輥子之至少一方載放於基板之上面的期間,是藉由載放於基板之上面的輥子之旋轉軸來被從下降位置抬到上方並維持著。升降方向限制手段,是將從下降位置進行升降(上升之後下降)之際之升降體的升降方向,限制成對搬送基準面大致垂直的方向。功能部,以在升降體下降至下降位置的狀態下位於搬送基準面之上方的方式固定或一體地設置於升降體,從上方面對於搬送途中之基板之上面來發揮功能。The elevator body is arranged above the transport reference plane between the first rotation axis and the aforementioned second rotation axis, and maintains the transport reference plane while both the first and second rollers are not yet placed on the substrate. At the predetermined lowering position, while at least one of the first and second rollers is placed on the top of the substrate, it is lifted from the lowered position to the upper side and maintained by the rotation axis of the roller placed on the top of the substrate. . The elevating direction restricting means restricts the elevating direction of the elevating body when elevating from the descending position (ascending and descending) to a direction substantially perpendicular to the transport reference plane. The functional part is fixed or integrally provided on the lifting body so as to be located above the transport reference plane when the lifting body is lowered to the lowered position, and functions from the top to the upper surface of the substrate in the transport.
在上述構造中,沿著基板之搬送方向的第1輥子之下端與第2輥子之下端的距離(第1旋轉軸與第2旋轉軸的距離),是設定成比沿著搬送方向的基板之全長(搬送方向下游端與搬送方向上游端的距離)還短。搬送途中之基板的搬送方向下游端,依序通過第1輥子的下端與第2輥子的下端,基板的搬送方向上游端,是在搬送方向下游端到達第2輥子的下端之後通過第1輥子的下端,且通過第2輥子的下端。In the above structure, the distance between the lower end of the first roller and the lower end of the second roller along the conveying direction of the substrate (the distance between the first rotation axis and the second rotation axis) is set to be greater than that of the substrate along the conveying direction. The overall length (the distance between the downstream end in the conveying direction and the upstream end in the conveying direction) is also short. The downstream end of the substrate in the conveying direction passes through the lower end of the first roller and the lower end of the second roller in sequence. The upstream end of the substrate in the conveying direction passes through the first roller after the downstream end in the conveying direction reaches the lower end of the second roller. The lower end, and passes through the lower end of the second roller.
在上述構造,第1輥子,在基板的搬送方向下游端到達第1輥子的下端之前,是對於搬送基準面維持在既定的初始高度,在基板的搬送方向下游端到達第1輥子的下端之後到基板的搬送方向上游端通過第1輥子的下端為止的期間,是載放於基板的上面,在基板的搬送方向上游端通過第1輥子的下端之後,下降至初始高度。In the above structure, the first roller is maintained at a predetermined initial height for the transport reference plane before the downstream end of the substrate in the conveying direction reaches the lower end of the first roller. The substrate is placed on the upper surface of the substrate until the upstream end in the conveying direction passes the lower end of the first roller, and after passing the lower end of the first roller at the upstream end in the conveying direction of the substrate, it descends to the initial height.
第2輥子,在基板的搬送方向下游端到達第2輥子的下端之前,是維持在初始高度,在通過第1輥子之下端的基板之搬送方向下游端到達第2輥子的下端之後到基板的搬送方向上游端通過第2輥子的下端為止的期間,是載放於基板的上面,在基板的搬送方向上游端通過第2輥子的下端之後,下降至初始高度。The second roller is maintained at the initial height before the downstream end of the substrate in the conveying direction reaches the lower end of the second roller, and the substrate is conveyed to the substrate after the downstream end in the conveying direction of the substrate passing through the lower end of the first roller reaches the lower end of the second roller. It is placed on the upper surface of the substrate until the upstream end in the direction passes the lower end of the second roller, and after passing the lower end of the second roller in the conveying direction of the substrate, it descends to the initial height.
升降體,在基板的搬送方向下游端到達第1輥子的下端之前,是對搬送基準面維持在既定的下降位置。若基板的搬送方向下游端到達第1輥子的下端,使第1輥子載放於基板的上面的話,升降體,是藉由第1旋轉軸而被從下降位置往上方抬起。升降方向限制手段,是將從下降位置進行升降之際之升降體的升降方向限制成對搬送基準面大致垂直的方向,故升降體,是在第1輥子載放於基板之上面的大致同時,從下降位置上升有基板的厚度分量。之後,即使基板的搬送方向上游端通過第1輥子的下端,在第2輥子載放於基板之上面的期間,升降體亦不會從上升了基板之厚度分量的上升位置下降,而是在到基板的搬送方向上游端通過第2輥子的下端為止維持在上升位置。若基板的搬送方向上游端通過第2輥子的下端而使第2輥子下降的話,升降體,是從上升位置往下降位置下降。The lifting body maintains a predetermined lowered position with respect to the conveying reference surface before the downstream end in the conveying direction of the substrate reaches the lower end of the first roller. When the downstream end of the substrate in the conveying direction reaches the lower end of the first roller, and the first roller is placed on the upper surface of the substrate, the elevating body is lifted upward from the lowered position by the first rotating shaft. The lifting direction restricting means restricts the lifting direction of the lifting body when lifting from the lowered position to a direction that is substantially perpendicular to the transport reference plane. Therefore, the lifting body is placed approximately at the same time as the first roller is placed on the top of the substrate. The thickness component of the substrate rises from the lowered position. After that, even if the upstream end of the substrate in the conveying direction passes through the lower end of the first roller, while the second roller is placed on top of the substrate, the elevator body will not drop from the rising position where the thickness component of the substrate has been raised, but will reach The upstream end in the conveyance direction of the substrate is maintained at the raised position until it passes the lower end of the second roller. If the upstream end of the substrate in the conveying direction passes through the lower end of the second roller and the second roller is lowered, the lifting body descends from the raised position to the lowered position.
將功能部在升降體固定地設置成在升降體下降至下降位置的狀態下位於搬送基準面的上方,使升降體配置在第1輥子與第2輥子之間,使升降體的上升位置成為從搬送基準面起算比基板的厚度更高的位置,故升降體在基板的搬送方向下游端到達升降體的下方為止的期間,不會對基板傾斜,而是與功能部一起從下降位置往上升位置上升,在基板的搬送方向上游端通過升降體的下方之後,不會對基板傾斜,而是與功能部一起從上升位置往下降位置下降。The functional part is fixedly installed on the lifting body so that it is located above the transport reference plane when the lifting body is lowered to the lowered position, and the lifting body is arranged between the first roller and the second roller, so that the lifting position of the lifting body is from Since the transport reference plane is a position higher than the thickness of the substrate, the elevator will not tilt the substrate until the downstream end of the substrate in the transport direction reaches below the elevator, but will move from the lowered position to the raised position together with the functional section. Ascending, after the upstream end of the substrate in the conveying direction passes under the lifting body, the substrate does not incline, but descends from the ascending position to the descending position together with the functional part.
於是,不論基板的厚度,功能部對基板之上面的高度位置,是在基板之上面之搬送方向的全長區域維持成固定,可有效率地使功能部發揮功能。且,可確實防止升降體及功能部與基板的干涉。Therefore, regardless of the thickness of the substrate, the height position of the functional portion relative to the upper surface of the substrate is maintained constant over the entire length of the upper surface of the substrate in the conveying direction, so that the functional portion can function efficiently. In addition, it is possible to surely prevent the interference between the lifting body and the functional part and the substrate.
本發明的第2態樣,是第1態樣的基板處理裝置,具備第2升降方向限制手段,其將第1旋轉軸的升降方向及第2旋轉軸的升降方向,限制成對搬送基準面大致垂直的方向。A second aspect of the present invention is the substrate processing apparatus of the first aspect, and includes a second lifting direction restricting means that restricts the lifting direction of the first rotating shaft and the lifting direction of the second rotating shaft to a pair of transport reference planes Roughly vertical direction.
在上述構造,第2升降方向限制手段,將第1旋轉軸的升降方向及第2旋轉軸的升降方向限制成對搬送基準面大致垂直的方向,故可使升降體及功能部升降之際的動作變穩定,可進一步確實防止升降體及功能部與基板的干涉。In the above structure, the second lifting direction restricting means restricts the lifting direction of the first rotating shaft and the lifting direction of the second rotating shaft to the direction substantially perpendicular to the transport reference plane, so that the lifting body and the functional part can be lifted and lowered. The operation becomes stable, and the interference between the lifting body and the functional part and the substrate can be further reliably prevented.
本發明的第3態樣,是第1或第2態樣的基板處理裝置,功能部具有從基板之上面吸引液體的吸引口。The third aspect of the present invention is the substrate processing apparatus of the first or second aspect, and the functional part has a suction port for sucking liquid from the upper surface of the substrate.
在上述構造,可使吸引口從基板的上面維持一定的距離,故可有效率地從基板的上面吸引並去除液體。 [發明之效果] In the above structure, the suction port can be maintained at a certain distance from the upper surface of the substrate, so that the liquid can be efficiently sucked and removed from the upper surface of the substrate. [Effects of Invention]
根據本發明,可使功能部在基板之上面之搬送方向的全長區域有效地發揮功能,並確實防止升降體及功能部與基板的干涉。According to the present invention, the functional part can function effectively in the full-length area of the conveying direction on the upper surface of the substrate, and the interference between the lifting body and the functional part and the substrate is surely prevented.
以下,基於圖式來說明將本發明的基板處理裝置適用於蝕刻裝置的一實施形態。Hereinafter, an embodiment in which the substrate processing apparatus of the present invention is applied to an etching apparatus will be described based on the drawings.
首先,針對使用本實施形態之蝕刻裝置的印刷配線板之製造方法之概要,參照圖2的剖面圖來說明。First, the outline of the manufacturing method of the printed wiring board using the etching apparatus of the present embodiment will be described with reference to the cross-sectional view of FIG. 2.
如圖2(a)所示般,在由環氧樹脂等之熱硬化性樹脂或其他樹脂等所成之絕緣性的基板(處理對象物)1的兩面,例如以數μm~數十μm的膜厚來形成銅箔等的導電層(被蝕刻層)2。形成導電層2的方法,可用張貼、電鍍、氣相沉積等之任何方法,使基板1的兩面成為蝕刻對象面。As shown in Figure 2(a), on both sides of an insulating substrate (processed object) 1 made of thermosetting resin such as epoxy resin or other resins, for example, a thickness of several μm to several tens of μm A conductive layer (layer to be etched) 2 such as copper foil is formed with a film thickness. The method of forming the
接著,如圖2(b)所示般,藉由光刻工程(乾膜阻劑或液狀阻劑等)來在導電層2的上層使阻劑膜3成膜,圖形曝光來進行顯像處理,藉此在導電層2的上層圖形形成阻劑膜3。阻劑膜3的形成處理,是對基板1的兩面分別進行。Next, as shown in FIG. 2(b), the
接著,如圖2(c)所示般,對基板1之兩面上的導電層2實施以阻劑膜3為遮罩的蝕刻處理。亦即,沿著阻劑膜3的圖形來蝕刻導電層2,而圖形形成配線部2a。Next, as shown in FIG. 2(c), the
圖形形成配線部2a之後,例如,藉由強鹼溶液或有機溶劑處理等來剝離阻劑膜3。藉此,形成所期望的印刷配線板。After patterning the
以上述阻劑膜3為遮罩之對導電層2的蝕刻處理,是使用本實施形態的蝕刻裝置(基板處理裝置)來進行。圖1,是示意表示本實施形態之蝕刻裝置的概略構造圖。The etching process of the
在蝕刻裝置10的處理室11內,從一側(圖1中左側)的入口14朝向另一側(圖1中右側)的出口15設定沿著水平直線狀的搬送路徑,作為搬送手段於該搬送路徑設有複數對上下的搬送輥子(下方的搬送輥子16與上方的搬送輥子17)。搬送輥子16、17,是將圖形形成有阻劑膜3的基板1,保持成一面朝向上方另一面朝向下方的大致水平狀來沿著搬送路徑搬送。下側之搬送輥子16的上端,規定出從上游側往下游側沿著大致水平面狀的搬送基準面18,搬送輥子16、17,將基板1搬送成使平躺姿勢之板狀之基板1的下面沿著搬送基準面18大致水平地移動。搬送輥子16、17,僅由以馬達等來驅動旋轉的驅動輥子來構成亦可,含有非驅動輥子(藉由基板1的移動來旋轉的從動輥子)亦可。且,含有不與上側的搬送輥子17成對之下側的搬送輥子16、不與下側的搬送輥子16成對之上側的搬送輥子17亦可。In the
入口14與出口15之間之處理室11內的上部,構成進行蝕刻工程的蝕刻處理部12。於蝕刻處理部12配列設有複數個噴射噴嘴20。噴射噴嘴20,噴射蝕刻液來噴灑至處理室11內的基板1。噴射噴嘴20,對搬送路徑為固定(靜置)亦可,為晃動(振盪)亦可。噴射噴嘴20的噴射形態並未限定,為單流體噴嘴亦可,雙流體噴嘴亦可。且,藉由單流體噴嘴與雙流體噴嘴來構成複數個噴射噴嘴20亦可。The upper part of the
於搬送路徑之下方之處理室11內的底部,貯藏有以氯化銅、氯化鐵或鹼性物質為基底的蝕刻液(處理液體)5。於各噴射噴嘴20,連接有蝕刻液供給管路21,其供給貯藏在處理室11內的蝕刻液5。於蝕刻液供給管路21設有泵22與過濾器24與壓力計23,處理室11內的蝕刻液5,從泵22藉由過濾器24過濾之後,以既定壓力供給至各噴射噴嘴20。往噴射噴嘴20之蝕刻液的供給壓力,是藉由壓力計23來測量。At the bottom of the
噴射噴嘴20,分別配置在搬送路徑的上方與下方。上側及下側的噴射噴嘴20,分別將蝕刻液噴射並噴灑至藉由搬送輥子16來搬送之基板1的上面及下面。The spray nozzles 20 are respectively arranged above and below the conveying path. The spray nozzles 20 on the upper and lower sides respectively spray and spray the etching liquid onto the upper surface and the lower surface of the
含有蝕刻液成分的處理室11內之氣體,是藉由排氣處理裝置(圖示省略)來淨化處理之後,從排氣管路(圖示省略)往大氣中排放。The gas in the
於蝕刻處理部12之搬送路徑(搬送基準面18)的上方,配列設有複數個吸引單元(功能部)50,其將從上側的噴射噴嘴20噴灑至基板1之上面的蝕刻液予以吸引並去除。各吸引單元50,是由吸引管55與複數個狹縫狀的吸引噴嘴(吸引口)56所構成,該吸引管55是以覆蓋基板1之全寬度的方式往與搬送路徑大致正交的方向(裝置寬度方向)延伸成大致水平狀(參照圖5及圖6),該吸引噴嘴56是形成在吸引管55的外周面(本實施形態為下面)且朝向搬送基準面18(本實施形態為下方)開口(參照圖6),吸引噴嘴56,配置在從噴射噴嘴20噴射之蝕刻液的噴灑區域之間,在該配置區域產生所期望的吸引作用。Above the transport path (transport reference surface 18) of the
各吸引管55,透過吸引管路51而連接於設在液體循環管路54之途中的噴射器52之吸引口52a。液體循環管路54,是兩端與處理室11內連通,且在途中設有循環泵53的閉迴路。循環泵53,吸取處理室11內的蝕刻液5,作為以噴射器52施加壓力的狀態,再次回到處理室11。於液體循環管路54循環的蝕刻液,在通過噴射器52之際,由於噴射器52的吸引口52a為負壓,故噴灑在基板1之上面的蝕刻液,會從吸引噴嘴56通過吸引管路51而被吸引。Each
如上述般,從噴射噴嘴20噴灑的蝕刻液會從基板1的上面被早期去除,可事前防止對蝕刻液的噴灑成為阻礙之蝕刻液的滯留之發生,可進行面內均勻性較高的蝕刻。As described above, the etching liquid sprayed from the
接著,針對各吸引單元50(吸引管55)的支撐構造30,參照圖3~圖6進行說明。又,在以下,將基板1之搬送方向的上游側作為後方,將下游側作為前方,將與基板1之搬送方向正交的水平方向作為裝置寬度方向(左右方向),將與搬送基準面18正交的方向作為上下方向來說明。Next, the
支撐構造30,具備:上游側上輥子(第1輥子)31、下游側上輥子(第2輥子)32、滑塊(升降體)33、複數個升降導引34~37,且對複數個吸引單元50個別設置。升降導引34~37,各自由矩形狀的塊體所構成,在裝置寬度方向的兩側且沿著前後方向的左右之裝置框架13的上面,是各自於前後方向並排配置四個,固定在裝置框架13而往鉛直上方延伸。裝置寬度方向之各側的四個升降導引34~37,是由以下來構成:上游側升降導引(第2升降方向限制手段)34、中央後側升降導引(升降方向限制手段、第2升降方向限制手段)35、中央前側升降導引(升降方向限制手段、第2升降方向限制手段)36、下游側升降導引(第2升降方向限制手段)37,該等是從上游側朝向下游側空出既定間隔並排成直線狀。The
在左右之裝置框架13的上面,分別配置有:上下的上游側軸支撐塊38、39、上述滑塊33、上下的下游側軸支撐塊40、41。On the upper surface of the left and right device frames 13, upper and lower upstream shaft support blocks 38, 39, the above-mentioned
上游側軸支撐塊38、39的後端面與前端面,分別具有可於上下方向滑動移動地卡合於上游側升降導引34之前端面與中央後側升降導引35之後端面的凹形狀(參照圖5)。下方的上游側軸支撐塊39,從上方插入至上游側升降導引34與中央後側升降導引35之間,在與升降導引34、35卡合的狀態下載放於裝置框架13的上面而被支撐。上方的上游側軸支撐塊38,是在使下方的上游側軸支撐塊39與升降導引34、35卡合而被支撐在裝置框架13之上面的狀態下,從上方插入至上游側升降導引34與中央後側升降導引35之間,在與升降導引34、35卡合的狀態下配置在下方之上游側軸支撐塊39的上方。The rear end surface and the front end surface of the upstream shaft support blocks 38, 39 respectively have a concave shape (refer to Figure 5). The lower upstream
上游側升降導引34與中央後側升降導引35,將上方之上游側軸支撐塊38(及後述之上方之上游側輥子支撐軸42)的升降方向限制成對搬送基準面18大致垂直的方向。又,上游側軸支撐塊38、39與上游側升降導引34及中央後側升降導引35的卡合形態,並不限定於上述,亦可為使上游側軸支撐塊38、39被支撐成可於上下方向滑動移動的形態。The
與上游側同樣地,下游側軸支撐塊40、41的後端面與前端面,分別具有可於上下方向滑動移動地卡合於中央前側升降導引36之前端面與下游側升降導引37之後端面的凹形狀(參照圖5)。下方的下游側軸支撐塊41,從上方插入至中央前側升降導引36與下游側升降導引37之間,在與升降導引36、37卡合的狀態下載放於裝置框架13的上面而被支撐。上方的下游側軸支撐塊40,是在使下方的下游側軸支撐塊41與升降導引36、37卡合而被支撐在裝置框架13之上面的狀態下,從上方插入至中央前側升降導引36與下游側升降導引37之間,在與升降導引36、37卡合的狀態下配置在下方之下游側軸支撐塊41的上方。As with the upstream side, the rear end surface and the front end surface of the downstream shaft support blocks 40, 41 respectively have a front end surface that is slidably engaged with the center front
中央前側升降導引36與下游側升降導引37,將上方之下游側軸支撐塊40(及後述之上方之下游側輥子支撐軸44)的升降方向,限制成對搬送基準面18大致垂直的方向。又,下游側軸支撐塊40、41與中央前側升降導引36及下游側升降導引37的卡合形態,並不限定於上述,只要是使下游側軸支撐塊40、41被支撐成可於上下方向滑動移動的形態即可。The central
滑塊33的後端面與前端面,具有可於上下方向滑動移動地卡合於中央後側升降導引35之前端面與中央前側升降導引36之後端面的凹形狀(參照圖5)。滑塊33,從上方插入至中央後側升降導引35與中央前側升降導引36之間,可與升降導引35、36卡合而於上下方向滑動。The rear end surface and the front end surface of the
在左右的上游側軸支撐塊38、39之間,分別於上下並排配置有往裝置寬度方向延伸的上游側輥子支撐軸42、43。上方的上游側輥子支撐軸(第1旋轉軸)42的兩端部,旋轉自如地支撐在左右之上方的上游側軸支撐塊38,下方的上游側輥子支撐軸43的兩端部,旋轉自如地支撐在左右之下方的上游側軸支撐塊39。Between the left and right upstream shaft support blocks 38 and 39, upstream
於上方的上游側輥子支撐軸42,在裝置寬度方向分開固定有複數個上游側上輥子31,於下方的上游側輥子支撐軸43,以複數個上游側下輥子46與上游側上輥子31相對向的方式在裝置寬度方向分開固定。上游側下輥子46與上游側上輥子31,構成搬送輥子16、17,上游側下輥子46的上端規定出搬送基準面18。上方的上游側輥子支撐軸42(上方的上游側軸支撐塊38及上游側上輥子31)的最下降位置,是藉由上方的上游側軸支撐塊38與下方的上游側軸支撐塊39之間的抵接及/或上游側上輥子31與上游側下輥子46之間的抵接來規定,在上游側上輥子31對於搬送基準面18下降至最低的起始高度中,上游側上輥子31的下端是接近或接觸於上游側下輥子46的上端(搬送基準面18)。若搬送途中之基板1的前端到達上游側上輥子31的下端(上游側上輥子31與上游側下輥子46之間)的話,上游側下輥子46的上下位置不會變動,上游側上輥子31會搭上基板1的上面,而從初始高度以基板1的厚度分量上升。若上游側上輥子31上升的話,上方的上游側輥子支撐軸42及上方的上游側軸支撐塊38亦上升。又,上游側上輥子31與上游側下輥子46,為驅動輥子亦可,為從動輥子亦可。且,不設置上游側下輥子46亦可。On the upper upstream
在左右的下游側軸支撐塊40、41之間,分別於上下並排配置有往裝置寬度方向延伸的下游側輥子支撐軸44、45。上方的下游側輥子支撐軸(第2旋轉軸)44的兩端部,旋轉自如地支撐在左右之上方的下游側軸支撐塊40,下方的下游側輥子支撐軸45的兩端部,旋轉自如地支撐在左右之下方的下游側軸支撐塊41。Between the left and right downstream side shaft support blocks 40 and 41, downstream side
於上方的下游側輥子支撐軸44,在裝置寬度方向分開固定有複數個下游側上輥子32,於下方的下游側輥子支撐軸45,以複數個下游側下輥子47與下游側上輥子32相對向的方式在裝置寬度方向分開固定。下游側下輥子47與下游側上輥子32,構成搬送輥子16、17,下游側下輥子47的上端規定出搬送基準面18。上方的下游側輥子支撐軸44(上方的下游側軸支撐塊40及下游側上輥子32)的最下降位置,是藉由上方的下游側軸支撐塊40與下方的下游側軸支撐塊41之間的抵接及/或下游側上輥子32與下游側下輥子47之間的抵接來規定,在下游側上輥子32對於搬送基準面18下降至最低的起始高度中,下游側上輥子32的下端是接近或接觸於下游側下輥子47的上端(搬送基準面18)。若搬送途中之基板1的前端到達下游側上輥子32的下端(下游側上輥子32與下游側下輥子47之間)的話,下游側下輥子47的上下位置不會變動,下游側上輥子32會搭上基板1的上面,而從初始高度以基板1的厚度分量上升。若下游側上輥子32上升的話,上方的下游側輥子支撐軸44及上方的下游側軸支撐塊40亦上升。又,下游側上輥子32與下游側下輥子47,為驅動輥子亦可,為從動輥子亦可。且,不設置下游側下輥子47亦可。On the upper downstream side
於上方的上游側軸支撐塊38與上方的下游側軸支撐塊40,分別安裝有往上方延伸的上游側心軸60與下游側心軸61。於上游側心軸60的下端部與下游側心軸61的下端部,分別形成有公螺紋部62,於上方的上游側軸支撐塊38與上方的下游側軸支撐塊40,分別形成有從上端面往下方延伸的母螺紋孔48。於各母螺紋孔48螺合公螺紋部62,並分別鎖緊上游側及下游側的螺帽63、64,藉此使上游側心軸60與下游側心軸61固定於上游側軸支撐塊38與下游側軸支撐塊40。The upstream side
於滑塊33的上端面,透過倒U狀的連結構件65來固定有輔助板件66,於輔助板件66,形成有於上下方向貫通的上游側心軸插通孔67與下游側心軸插通孔68。從上游側支撐塊38往上方突出之上游側心軸60的上側部分,插通上游側心軸插通孔67,從下游側支撐塊40往上方突出之下游側心軸61的上側部分,插通下游側心軸插通孔68。On the upper end surface of the
若上游側上輥子31從初始高度被抬起來的話,上方的上游側軸支撐塊38,會被上游側升降導引34及中央後側升降導引35給導引,以從下方的上游側軸支撐塊39分離的方式,往對搬送基準面18大致正交的方向上升。若上游側軸支撐塊38上升的話,輔助板件66會被螺帽63推起,滑塊33亦與上游側上輥子31同樣地上升。滑塊33的上升方向,是藉由中央後側升降導引35與中央前側升降導引36,而被限制成對搬送基準面18大致正交的方向。另一方面,下游側上輥子32不上升而維持在初始高度(參照圖8)。If the
相反地,若下游側上輥子32從初始高度被抬起來的話,上方的下游側軸支撐塊40,會被中央前側升降導引36及下游側升降導引37給導引,以從下方的下游側軸支撐塊41分離的方式,往對搬送基準面18大致正交的方向上升。若下游側軸支撐塊40上升的話,輔助板件66會被螺帽64推起,滑塊33亦與下游側上輥子32同樣地上升。滑塊33的上升方向,是藉由中央後側升降導引35與中央前側升降導引36,而被限制成對搬送基準面18大致正交的方向。另一方面,上游側上輥子31不上升而維持在初始高度(參照圖10)。Conversely, if the
吸引單元50(吸引管55)之裝置寬度方向的兩端部,分別被固定支撐在左右的滑塊33。滑塊33,例如除了使用小螺絲等之締結構件來締結固定以外,還可用任意的方法來固定。在吸引管55的內部,設有將從吸引噴嘴56吸引的蝕刻液予以整流的整流板57,吸引管55內的蝕刻液,流通於形成在整流板57的貫通孔57a,透過管接頭58而往吸引管路51流出。滑塊33及吸引單元50(吸引管55)之後下端的緣部,以難以與基板1干涉的方式形成為傾斜面狀或彎曲面狀。Both ends of the suction unit 50 (suction tube 55) in the width direction of the device are fixedly supported on the left and
如上述般,上游側上輥子31,具有在搬送基準面18的上方可對搬送基準面18升降的上游側輥子支撐軸42,在載放於搬送途中之基板1之上面的狀態下,一邊接觸基板1之上面一邊以上游側輥子支撐軸42為中心來旋轉。下游側上輥子32,具有在上游側上輥子31之搬送方向下游側之搬送基準面18的上方可對搬送基準面18升降的下游側輥子支撐軸44,在載放於搬送途中之基板1之上面的狀態下,一邊接觸基板1之上面一邊以下游側輥子支撐軸44為中心來旋轉。As described above, the upstream
滑塊33,在搬送基準面18的上方配置在上方的上游側輥子支撐軸42與上方的下游側輥子支撐軸44之間。滑塊33,在上游側上輥子31及下游側上輥子32之雙方沒有載放於基板1之上面的期間,是對搬送基準面18維持在既定的下降位置,在上游側上輥子31及下游側上輥子32之至少一方載放於基板1之上面的期間,是藉由載放於基板1之上面的輥子的旋轉軸(上方的上游側輥子支撐軸42及/或上方的下游側輥子支撐軸44)來被從下降位置抬到上方並維持著。The
中央後側升降導引35及中央前側升降導引36,是將從下降位置升降(上升之後下降)之際之滑塊33的升降方向,限制成對搬送基準面18大致垂直的方向。上游側升降導引34、中央後側升降導引35、中央前側升降導引36、及下游側升降導引37,是將上方的上游側輥子支撐軸42及上方的下游側輥子支撐軸44的升降方向,限制成對搬送基準面18大致垂直的方向。The center
吸引單元50(吸引管55),以在滑塊33下降至下降位置的狀態下位於搬送基準面18之上方的方式固定設置於滑塊33,從上方面對於搬送途中之基板1之上面來發揮功能。The suction unit 50 (suction tube 55) is fixedly installed on the
且,沿著基板1之搬送方向的上游側上輥子31之下端與下游側上輥子32之下端的距離(上方的上游側輥子支撐軸42與上方的下游側輥子支撐軸44的距離),是設定成比沿著搬送方向的基板1之全長(前端(搬送方向下游端)與後端(搬送方向上游端)的距離)還短。搬送途中之基板1的前端,依序通過上游側上輥子31的下端與下游側上輥子32的下端,基板1的後端,是在基板的前端到達下游側上輥子32的下端之後通過上游側上輥子31的下端,且通過下游側上輥子32的下端。And, the distance between the lower end of the
接著,針對伴隨著基板1的搬送而升降的上游側上輥子31、下游側上輥子32、滑塊33、及吸引單元50的動作,參照圖7~圖10進行說明。Next, the operations of the
上游側上輥子31,在基板1的前端到達上游側上輥子31的下端之前,是對於搬送基準面18維持在既定的初始高度(參照圖7),在基板1的前端到達上游側上輥子31的下端之後到基板1的後端通過上游側上輥子31的下端為止的期間,是載放於基板1的上面(參照圖8及圖9),在基板1的後端通過上游側上輥子31的下端之後,下降至初始高度(參照圖10)。The
下游側上輥子32,在基板1的前端到達下游側上輥子32的下端之前,是維持在初始高度(參照圖7及圖8),在通過上游側上輥子31之下端的基板1之前端到達下游側上輥子32的下端之後到基板1的後端通過下游側上輥子32的下端為止的期間,是載放於基板1的上面(參照圖9及圖10),在基板1的後端通過下游側上輥子32的下端之後,下降至初始高度(參照圖7)。The
滑塊33,在基板1的前端到達上游側上輥子31的下端之前,是對搬送基準面18維持在既定的下降位置(參照圖7)。若基板1的前端到達上游側上輥子31的下端,上游側上輥子31載放於基板1的上面的話,滑塊33,是藉由上方的上游側輥子支撐軸42而被從下降位置往上方抬起(參照圖8)。中央後側升降導引35及中央前側升降導引36,是將從下降位置升降(上升之後下降)之際之滑塊33的升降方向,限制成對搬送基準面18大致垂直的方向,故滑塊33,是在上游側上輥子31往基板1的上面載放的大致同時,從下降位置上升有基板1的厚度D分量。之後,即使基板1的後端通過上游側上輥子31的下端,在下游側上輥子32載放於基板1之上面的期間,滑塊33,亦不會從上升了基板1之厚度D分量的上升位置下降,而是在到基板1的後端通過下游側上輥子32的下端為止維持在上升位置(參照圖10)。若基板1的後端通過下游側上輥子32的下端而使下游側上輥子32下降的話,滑塊33,是從上升位置往下降位置下降(參照圖7)。The
將吸引單元50在滑塊33固定地設置成在滑塊33下降至下降位置的狀態下位於搬送基準面18的上方(對於搬送基準面18的既定高度),使滑塊33配置在上游側上輥子31與下游側上輥子32之間,使滑塊33的上升位置成為從搬送基準面18起算比基板1的厚度D更高的位置,故滑塊33在基板1的前端到達滑塊33的下方為止的期間,不會對基板1(搬送基準面18)傾斜,而是與吸引單元50一起從下降位置往上升位置上升,在基板1的後端通過滑塊33的下方之後,不會對基板1傾斜,而是與吸引單元50一起從上升位置往下降位置下降。The
於是,不論基板1的厚度D,吸引單元50(吸引噴嘴56)對基板1之上面的高度,是在基板1之上面之搬送方向的全長區域(前後方向的全域)維持在固定的位置(以得到較高吸引效果的方式接近基板1之上面的位置),可有效率地使吸引單元50發揮功能。且,可確實防止滑塊33及吸引單元50與基板1的干涉。Therefore, regardless of the thickness D of the
且,上游側升降導引34、中央後側升降導引35、中央前側升降導引36、及下游側升降導引37,是將上方的上游側輥子支撐軸42的升降方向及上方的下游側輥子支撐軸44的升降方向限制成對搬送基準面18大致垂直的方向,故可使滑塊33及吸引單元50升降之際的動作變穩定,可進一步確實防止滑塊33及吸引單元50與基板1的干涉。In addition, the
且,可使吸引噴嘴56從基板1的上面維持一定的距離,故可有效率地從基板1的上面吸引並去除蝕刻液。In addition, the
以上,雖針對本發明,基於上述實施形態進行了說明,但本發明並不限定於上述實施形態的內容,在不超脫本發明的範圍當然可適當變更。As mentioned above, although this invention was demonstrated based on the said embodiment, this invention is not limited to the content of the said embodiment, of course, it can change suitably without deviating from the scope of the present invention.
例如,吸引單元50之支撐構造30的形態不限定於上述實施形態,構成為使滑塊33被第1及第2旋轉軸的至少一方給抬起而對搬送基準面18往大致垂直的方向上升,直到第1及第2旋轉軸之雙方下降為止都維持上升位置即可。例如在圖11及圖12所示之支撐構造70之例,是取代輔助板件66,設置上游側板件71、下游側板件72及中央板件73,省略輔助板件66所附帶的上游側心軸60及下游側心軸61。上游側板件71,固定設置在上方的上游側軸支撐塊38,使裝置寬度方向的一側往下游側延伸。圖示之例的上游側板件71,固定在上方的上游側軸支撐塊38的上面,使裝置寬度方向的內側往下游側延伸。下游側板件72,固定設置在上方的下游側軸支撐塊40,使裝置寬度方向的另一側往上游側延伸。圖示之例的下游側板件72,固定在上方的下游側軸支撐塊40的上面,使裝置寬度方向的外側往上游側延伸。中央板件73,固定設置於滑塊33(在圖示之例,是固定在滑塊33的上面),往比滑塊33還靠裝置寬度方向的內側及外側突出。上游側板件71之裝置寬度方向之一側的前部,是從下方來面對於中央板件73之裝置寬度方向之一側(在圖示之例為內側),下游側板件72之裝置寬度方向之另一側的後部,是從下方來面對於中央板件73之裝置寬度方向之另一側(在圖示之例為外側)。若上方的上游側輥子支撐軸42上升的話,上游側板件71會推起中央板件73,使滑塊33上升。同樣地,若上方的下游側輥子支撐軸44上升的話,下游側板件72會推起中央板件73,使滑塊33上升。滑塊33,直到上方的上游側輥子支撐軸42及上方的下游側輥子支撐軸44之雙方下降為止,都維持在上升位置。For example, the form of the
且,固定設置在升降體33的功能部,並不限定於上述實施形態般的吸引單元50,為具有其他功能者(例如具有朝向基板1的上面噴射氣體及/或液體之功能的狹縫噴嘴等)亦可。In addition, the functional part fixed to the lifting
且,在上述實施形態,是個別形成滑塊33與吸引單元50來固定兩者,但兩者形成為一體亦可。In addition, in the above-mentioned embodiment, the
且,取代或除了裝置寬度方向的兩端部以外,將吸引單元50的支撐構造30設在裝置寬度方向的中間部亦可。Furthermore, instead of or in addition to the both ends in the width direction of the device, the
1:基板 5:蝕刻液(處理液體) 10:蝕刻裝置(基板處理裝置) 11:處理室 12:蝕刻處理部 13:裝置框架 16,17:搬送輥子(搬送手段) 20:噴射噴嘴 30,70:吸引單元的支撐構造 31:上游側上輥子(第1輥子) 32:下游側上輥子(第2輥子) 33:滑塊(升降體) 34:上游側升降導引(第2升降方向限制手段) 35:中央後側升降導引(升降方向限制手段、第2升降方向限制手段) 36:中央前側升降導引(升降方向限制手段、第2升降方向限制手段) 37:下游側升降導引(第2升降方向限制手段) 38:上方的上游側軸支撐塊 39:下方的上游側軸支撐塊 40:上方的下游側軸支撐塊 41:下方的下游側軸支撐塊 42:上方的上游側輥子支撐軸(第1旋轉軸) 43:下方的上游側輥子支撐軸 44:上方的下游側輥子支撐軸(第2旋轉軸) 45:下方的下游側輥子支撐軸 46:上游側下輥子 47:下游側下輥子 50:吸引單元(功能部) 55:吸引管 56:吸引噴嘴(吸引口) 60:上游側心軸 61:下游側心軸 65:連結構件 66:輔助板件 71:上游側板件 72:下游側板件 73:中央板件1: substrate 5: Etching liquid (treatment liquid) 10: Etching device (substrate processing device) 11: Processing room 12: Etching department 13: device frame 16,17: Conveying roller (conveying means) 20: Jet nozzle 30, 70: Support structure of suction unit 31: Upper roller on the upstream side (1st roller) 32: Upper roller on the downstream side (2nd roller) 33: Slider (lifting body) 34: Upstream side lift guide (2nd lift direction restriction means) 35: Center rear lifting guide (lifting direction restriction means, second lifting direction restriction means) 36: Center front side lift guide (lifting direction restriction means, second lifting direction restriction means) 37: Downstream side lift guide (2nd lift direction restriction means) 38: Upper upstream shaft support block 39: Lower upstream shaft support block 40: Upper downstream shaft support block 41: Lower downstream shaft support block 42: Upper upstream roller support shaft (1st rotating shaft) 43: Lower upstream roller support shaft 44: Upper downstream roller support shaft (2nd rotating shaft) 45: Lower downstream roller support shaft 46: Lower roller on the upstream side 47: Lower roller on the downstream side 50: Suction Unit (Functional Department) 55: Suction tube 56: Suction nozzle (suction port) 60: Upstream mandrel 61: Downstream mandrel 65: connecting member 66: auxiliary board 71: Upstream side plate 72: Downstream side plate 73: Central plate
[圖1] 表示本發明之一實施形態之基板處理裝置的概略構造圖。 [圖2] 用來說明蝕刻處理的印刷配線板之擴大剖面圖。 [圖3] 從裝置寬度方向的外側來觀看吸引單元之支撐構造的側視圖。 [圖4] 從裝置寬度方向的內側來觀看吸引單元之支撐構造的側視圖。 [圖5] 圖3的V-V箭頭剖面圖。 [圖6] 圖5的VI-VI箭頭剖面圖。 [圖7] 表示滑塊維持在下降位置之狀態的側視圖。 [圖8] 表示上游側上輥子載放於基板之狀態的側視圖。 [圖9] 表示上游側上輥子及下游側上輥子載放於基板之狀態的側視圖。 [圖10] 表示上游側上輥子下降之後,且下游側上輥子下降之前之狀態的側視圖。 [圖11] 從裝置寬度方向的內側來觀看吸引單元之支撐構造之其他例的側視圖。 [圖12] 從上方來觀看圖11之支撐構造的俯視圖。 [Fig. 1] A schematic configuration diagram showing a substrate processing apparatus according to an embodiment of the present invention. [Figure 2] An enlarged cross-sectional view of the printed wiring board used to illustrate the etching process. [Fig. 3] A side view of the supporting structure of the suction unit viewed from the outside in the width direction of the device. [Fig. 4] A side view of the supporting structure of the suction unit viewed from the inside in the width direction of the device. [Fig. 5] Fig. 3 is a cross-sectional view taken along the line V-V. [Fig. 6] Fig. 5 is a sectional view taken along the line VI-VI. [Figure 7] A side view showing the state where the slider is maintained at the lowered position. [Fig. 8] A side view showing the state where the roller on the upstream side is placed on the substrate. [Fig. 9] A side view showing the state where the upper roller on the upstream side and the upper roller on the downstream side are placed on the substrate. [Fig. 10] A side view showing the state after the upper roller on the upstream side descends and before the upper roller on the downstream side descends. [Fig. 11] A side view of another example of the support structure of the suction unit viewed from the inside in the width direction of the device. [Fig. 12] A plan view of the supporting structure of Fig. 11 viewed from above.
1:基板 1: substrate
13:裝置框架 13: device frame
18:搬送基準面 18: Transport reference plane
30:吸引單元的支撐構造 30: Support structure of suction unit
31:上游側上輥子(第1輥子) 31: Upper roller on the upstream side (1st roller)
32:下游側上輥子(第2輥子) 32: Upper roller on the downstream side (2nd roller)
33:滑塊(升降體) 33: Slider (lifting body)
34:上游側升降導引(第2升降方向限制手段) 34: Upstream side lift guide (2nd lift direction restriction means)
35:中央後側升降導引(升降方向限制手段、第2升降方向限制手段) 35: Center rear lifting guide (lifting direction restriction means, second lifting direction restriction means)
36:中央前側升降導引(升降方向限制手段、第2升降方向限制手段) 36: Center front side lift guide (lifting direction restriction means, second lifting direction restriction means)
37:下游側升降導引(第2升降方向限制手段) 37: Downstream side lift guide (2nd lift direction restriction means)
38:上方的上游側軸支撐塊 38: Upper upstream shaft support block
39:下方的上游側軸支撐塊 39: Lower upstream shaft support block
40:上方的下游側軸支撐塊 40: Upper downstream shaft support block
41:下方的下游側軸支撐塊 41: Lower downstream shaft support block
42:上方的上游側輥子支撐軸(第1旋轉軸) 42: Upper upstream roller support shaft (1st rotating shaft)
43:下方的上游側輥子支撐軸 43: Lower upstream roller support shaft
44:上方的下游側輥子支撐軸(第2旋轉軸) 44: Upper downstream roller support shaft (2nd rotating shaft)
45:下方的下游側輥子支撐軸 45: Lower downstream roller support shaft
46:上游側下輥子 46: Lower roller on the upstream side
47:下游側下輥子 47: Lower roller on the downstream side
50:吸引單元(功能部) 50: Suction Unit (Functional Department)
60:上游側心軸 60: Upstream mandrel
61:下游側心軸 61: Downstream mandrel
63:螺帽 63: Nut
64:螺帽 64: Nut
65:連結構件 65: connecting member
66:輔助板件 66: auxiliary board
67:上游側心軸插通孔 67: Mandrel insertion hole on the upstream side
68:下游側心軸插通孔 68: Downstream mandrel insertion hole
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2020097667A JP7056972B2 (en) | 2020-06-04 | 2020-06-04 | Board processing equipment |
| JP2020-097667 | 2020-06-04 |
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| TWI740723B true TWI740723B (en) | 2021-09-21 |
| TW202147496A TW202147496A (en) | 2021-12-16 |
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| JP (1) | JP7056972B2 (en) |
| KR (1) | KR102432828B1 (en) |
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| US20170155005A1 (en) * | 2015-12-01 | 2017-06-01 | National Chung Shan Institute Of Science And Technology | Selenization/sulfurization process apparatus for use with single-piece glass substrate |
| TW201732879A (en) * | 2016-01-25 | 2017-09-16 | 斯庫林集團股份有限公司 | Substrate processing apparatus and substrate processing method |
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| Publication number | Publication date |
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| CN113764318B (en) | 2024-10-15 |
| CN113764318A (en) | 2021-12-07 |
| KR20210150945A (en) | 2021-12-13 |
| TW202147496A (en) | 2021-12-16 |
| JP2021190658A (en) | 2021-12-13 |
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| KR102432828B1 (en) | 2022-08-16 |
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