TWI639369B - Method for manufacturing a layer of dual-axis circuit pattern and electronic device - Google Patents

Abstract

The invention discloses a method for fabricating a single-layer biaxial circuit pattern, comprising the steps of: forming a catalyst pattern layer on a substrate, wherein the catalyst pattern layer comprises at least two first rows arranged along a first axis a catalyst structure unit and at least two second catalyst structure units arranged along the second axis; forming a first bridge member for connecting the two first catalyst structure units; forming an insulation layer for covering the a first bridge member; a second bridge member formed on the insulating layer for connecting the two second catalyst structure units; and an electroless plating process for the two of the first catalyst structure units and two The second catalyst structural unit is plated with a layer of metal.

Description

Method for manufacturing single-layer biaxial circuit pattern and electronic device

The present invention relates to a method of fabricating a circuit pattern, and more particularly to a method of fabricating a single layer biaxial circuit pattern, and an electronic device having an internal circuit pattern formed by the method.

In today's consumer electronics market, portable electronic products such as personal digital assistants (PDAs), mobile phones, notebooks, tablet PCs, etc. all use touch panels ( Touch panel) as an interface tool for data communication. In addition, since the design direction of such electronic products is mainly light and thin, it is hoped that the traditional input devices such as keyboards and mice can be omitted in the design of the products, especially in the demand for tablet computers with humanized design. Driven by this, the touch panel has become a new user interface and has become one of the key components.

The structure of the currently popular Projective Capacitive Touch Panel can be roughly classified into the following types: glass/film/film (Glass/Film/Film), glass/film (Glass/Film). , One Glass Solution (OGS), and One Film Solution (OFS). In the layout design of the touch electrodes, a single-layer dual-axis touch sensing structure (Single ITO, SITO) or a single-layer upper and lower double-sided touch sensing structure (Double ITO, DITO) is commonly used. In the SITO structure, the X/Y axial electrodes are bridged (bridged). Without generating a signal short circuit, an insulating layer is usually designed at the bridge of the axial series, and a bridge wire is formed on the insulating layer to transmit the touch signal, and the X/Y axial touch sensing electrode is provided. No interference and misjudgment will occur.

In the manufacturing process of the touch panel, a coating process is often used to form a metal layer or a transparent conductive layer, and the metal is combined with a lithography and etching process (including photoresist coating, exposure, development, etching, photoresist removal, etc.). The layer or transparent conductive layer is patterned to form a single layer biaxial touch sensing structure. However, the conventional patterning process is too complicated and the manufacturing cost is high. Especially after the multi-pass exposure and development process, the etching stability and the etching quality are easily controlled, and the yield of the touch panel is affected.

In view of the lack of prior art, the inventors have been engaged in design and manufacturing experience in related fields for many years, and actively studied how to pattern conductive films under limited resources and time, and finally prudently in all conditions. The present invention has been developed in consideration.

The invention aims to provide a method for manufacturing a single-layer biaxial circuit pattern capable of effectively reducing process difficulty and process cost, and an electronic having an internal circuit pattern formed by the method, from the viewpoint of improving production efficiency. Device.

According to a preferred embodiment of the present invention, the method for fabricating the single-layer biaxial circuit pattern includes the steps of: forming a catalyst pattern layer on a substrate, wherein the catalyst pattern layer includes at least two An axially aligned first catalyst structural unit and at least two second catalytic structural units arranged along the second axial direction, the second axial direction being substantially perpendicular to the first axial direction; forming a first bridge a member for connecting two of the first catalyst structure units; forming an insulating layer for covering the first bridge member; forming a second bridge member on the insulating layer for connecting the two second portions a catalyst structure unit; and plating a layer of metal on the two first catalyst structure units and the two catalyst structure units by using an electroless plating process, wherein the two first catalyst structure units and The catalyst in the two second catalyst structural units can trigger metal ions Original deposit.

According to another preferred embodiment of the present invention, the method for fabricating the single-layer biaxial circuit pattern includes the steps of: forming at least two first catalyst structural units arranged along the first axial direction on a substrate; forming a first bridge member for connecting the two first catalyst structure units; an insulating layer for covering the first bridge member; and at least two second catalyst structures arranged along the second axial direction Unit on the substrate, the second axial direction is substantially perpendicular to the first axial direction; forming a second bridge on the insulating layer for connecting the two second catalyst structural units; Coating a layer of metal on the two first catalyst structural units and the two second catalytic structural units by an electroless plating process, wherein the two first catalytic structural units and the two second The catalyst in the catalytic unit can trigger metal ion reduction deposition.

According to still another preferred embodiment of the present invention, the electronic device uses a structural member having a single-layer biaxial circuit pattern, wherein the structural member having a single-layer biaxial circuit pattern includes a substrate At least two first conductive structural units, a first bridge, an insulating layer, at least two second conductive structural units, and a second bridge. Two of the first conductive structural units are arranged on the substrate along a first axial direction, wherein each of the first conductive structural units comprises a first catalytic structure unit and a first catalyst structure a metal film of a portion of the surface of the cell; the first bridge extending from a leading edge of any of the first catalyst structural units to a leading edge of another of the first catalyst structural units; the insulating layer covering a surface of the first bridge member; two of the second conductive structural units are arranged on the substrate along a second axial direction substantially perpendicular to the first axial direction, wherein each of the second conductive structural units a second catalyst structure unit and a metal film covering a portion of a surface of the second catalyst structure unit; the second bridge member extending across a leading edge of any of the second catalyst structure units The insulating layer is to a leading edge of another of the second catalyst structural units.

The present invention has at least the following beneficial effects: the method for fabricating the single-layer biaxial circuit pattern provided by the embodiment of the present invention is arranged by "simultaneous printing to form along the first axial direction. a first catalyst structure unit and a second catalyst structure unit arranged along the second axis, and then depositing a metal film on the outer surface of the first and second catalyst structure units by using an electroless plating process and Printing forms a first catalyst structural unit arranged along the first axial direction and a second catalytic structural unit arranged along the second axial direction, and then using an electroless plating process on the outer surfaces of the first and second catalytic structural units The process of depositing a layer of metal film can effectively simplify complicated and time-consuming process steps to reduce process difficulty and improve process yield.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

S101~S105‧‧‧Steps

S201~S206‧‧‧Steps

100‧‧‧Structural parts with single-layer biaxial circuit pattern

1‧‧‧catalyst pattern layer

11‧‧‧First Catalyst Structure Unit

11'‧‧‧First Conductive Structural Unit

12‧‧‧Second catalyst structural unit

12'‧‧‧Second conductive structural unit

13‧‧‧flat layer

2‧‧‧Substrate

3‧‧‧First bridge

4‧‧‧Insulation

5‧‧‧Second bridge

M‧‧‧ metal layer

D‧‧‧ step structure

1 is a flow chart showing a method of fabricating a single-layer biaxial circuit pattern according to a first embodiment of the present invention.

2A to 2E are schematic diagrams showing a process of a first embodiment of a method for fabricating a single-layer biaxial circuit pattern according to a first embodiment of the present invention.

Figure 3 is a cross-sectional view taken along line III-III of Figure 2.

4A to 4E are schematic diagrams showing a process of a second embodiment of a method for fabricating a single-layer biaxial circuit pattern according to a first embodiment of the present invention.

Figure 5 is a cross-sectional view taken along line V-V of Figure 4;

6A-6E are schematic diagrams showing processes of a third embodiment of a method for fabricating a single-layer biaxial circuit pattern according to a first embodiment of the present invention.

Figure 7 is a cross-sectional view taken along line VII-VII of Figure 6.

8A to 8E are schematic diagrams showing processes of a fourth embodiment of a method for fabricating a single-layer biaxial circuit pattern according to a first embodiment of the present invention.

9 is a flow chart showing a method of fabricating a single-layer biaxial circuit pattern according to a second embodiment of the present invention.

10A to 10E are diagrams showing a single-layer biaxial circuit pattern according to a second embodiment of the present invention; A schematic diagram of the process of the method.

The invention discloses an innovative method for fabricating a single-layer biaxial circuit pattern required for an electronic device, such as a notebook computer, a tablet computer, a smart phone, a stock machine, or other touch function or communication. Functional electronic device. It is worth mentioning that this innovative method has the advantages of reducing process difficulty and process cost and improving process yield when manufacturing circuit patterns with complicated shapes and small dimensions; further, the operation method of the innovative method is simple. It is very easy to implement and has broad application prospects.

The following is a specific embodiment to illustrate the implementation of the "method of manufacturing a single-layer biaxial circuit pattern" disclosed by the present invention. Those skilled in the art can understand the advantages and technical effects of the present invention from the contents disclosed in the specification. The present invention can be implemented or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not described in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

[First Embodiment]

Please refer to FIG. 1 to FIG. 2E. FIG. 1 is a flowchart of a method for fabricating a single-layer biaxial circuit pattern according to a first embodiment of the present invention, and FIGS. 2A to 2E are single-layer biaxial circuit patterns according to the present invention. A schematic diagram of a process of the first embodiment of the method of fabrication.

The method for fabricating the single-layer biaxial circuit pattern provided in this embodiment first performs step S101: forming a catalyst pattern layer 1 on a substrate 2, and the catalyst pattern layer 1 includes at least two arranged along the first axial direction. The first catalyst structure unit 11 and at least two second catalyst structure units 12 arranged along a second axis substantially perpendicular to the first axis. In practice, the catalyst pattern layer 1 can follow a predetermined circuit pattern and pass through the screen (screen The printing method is formed on the substrate 2, and the thickness of the catalyst pattern layer 1 is between 0.1 μm and 30 μm, wherein the first and second catalyst structural units 11, 12 may have any suitable geometric shape, such as a square, a rectangle, a diamond , trapezoidal, hexagonal, etc., but the invention is not limited thereto.

In this embodiment, the substrate 2 can be a plastic substrate, and the material can be polycarbonate (PC), polypropylene (PP), acrylonitrile-butadiene-styrene copolymer (ABS), polyethylene terephthalate. Diester (PET), polyimine (PI), etc., but the invention is not limited thereto. The catalyst pattern layer 1 contains a catalyst and a hardener. Specifically, the material of the catalyst pattern layer 1 is a resin composition formed by mixing a resin material with a catalyst and a hardener, wherein the catalyst can be in an electroless plating process ( Metal plating is triggered in the electroless plating process, and the type of the catalyst can be changed according to the metal to be plated. For example, the catalyst can be a palladium catalyst, a silver catalyst, a carbon catalyst, or a combination thereof, and the hardener can not only The molding of the resin composition containing the catalyst is assisted, and a good adhesion between the catalyst pattern layer 1 and the substrate 2 is also achieved.

Preferably, the catalyst in the catalyst pattern layer 1 is a palladium catalyst, such as palladium sulfate, palladium chloride, dichlorodiammine palladium, dichlorotetraammine palladium, palladium diamine nitrite, etc. The content of the hardener is from 1% to 10%, and the hardener may be selected from the group consisting of fatty amines, cyclic aliphatic amines, polyamines, aromatic amines, acid anhydrides, and Lewis acids. , an imidazole hardener, or a combination thereof.

Furthermore, the catalyst pattern layer 1 can be fabricated in the following manner: First, a screen (not shown) is placed over the substrate 2, wherein the screen has a hollow pattern relative to a predetermined circuit pattern; A doctor blade (not shown) extrudes the resin composition containing the catalyst from above the screen to pass through the screen and transfer onto the surface of the substrate 2; then, heat treatment and/or light curing treatment is performed according to the resin material used. To cure the resin composition.

Next, step S102 is performed to form a first bridge 3 for connecting the two first catalyst structure units 11. In practice, the material of the first bridge member 3 may be coated by screen printing or spraying, and then subjected to heat treatment and/or light curing treatment to cure the film; structurally, because of the catalyst pattern layer 1 relative to the substrate 2 There is a step difference in which a difference structure D is formed between the two first catalyst structure units 11, so that the first bridge member 3 is extended from the leading edge of any of the first catalyst structure units 11 along the step difference structure D to another The leading edge of a catalyst structure unit 11. In this embodiment, the material of the first bridge member 3 may be a conductive ink, such as a silver-based, copper-based, carbon-based conductive ink, etc., but the invention is not limited thereto.

Then, step S103 is performed to form an insulating layer 4 for covering the first bridge 3. In practice, the material of the insulating layer 4 can be coated by screen printing or spraying, and then heat-treated and/or light-cured to form a solidified molding, wherein the insulating layer 4 is followed by the existence of the step structure D. The configuration of the step structure D is formed on the surface of the first bridge 3. In this embodiment, the material of the insulating layer 4 may be an insulating ink, but the invention is not limited thereto; in addition, the insulating layer 4 does not completely cover the first bridge member 3, and the edge of the first bridge member 3 is exposed to the insulation. Layer 4.

Thereafter, step S104 is performed to form a second bridge member 5 on the insulating layer 4 for connecting the two second catalyst structure units 12. In practice, the material of the second bridge member 5 can be coated by screen printing or spraying, and then subjected to heat treatment and/or light curing treatment to cure the molding, wherein the second bridge member 5 is composed of any second catalyst. The leading edge of the structural unit 12 extends across the leading edge of the insulating layer 4 to the other second catalyst structure unit 12. The second bridge member 5 may be made of the same material as the catalyst pattern layer 1 as needed, or may be made of the same material as the first bridge member 3.

Finally, step S105 is performed: a layer of metal is plated on the two first catalyst structure units 11 and the two second catalyst structure units 12 by an electroless plating process. In practice, the substrate 2 printed with the catalyst pattern layer 1 may be immersed in an electroless plating solution containing metal ions (such as gold, silver, copper, nickel, aluminum, chromium, etc.) to be reacted for a certain period of time (eg, After 5 minutes), the metal ions in the plating solution are reductively deposited on the catalyst pattern layer 1 by the catalytic action of the catalyst to form a structural member having a single-layer biaxial circuit pattern.

Referring to FIG. 3, further, the first conductive structure unit 11 is formed on the first catalyst structure unit 11 by depositing the metal thin film M, and the two first conductive layers are formed. The structural unit 11' is electrically connected by the first bridge member 3; it should be noted that the exposed portion of the edge of the first bridge member 3 also has a chance to be covered by the metal film M during the electroless plating process. Similarly, the second conductive structural unit 12' is formed on the second catalyst structure unit 12 because the metal thin film M is deposited, and the second conductive structural unit 12 can be made on the second bridge 5 due to the deposition of the metal thin film M. 'An electrical connection between the '.

In this embodiment, the plating solution used in the electroless plating process may be an alkaline plating solution (such as a copper chloride plating solution), wherein the temperature of the plating solution is between 20 ° C and 100 ° C, and the pH value of the plating solution is between 9 to 14; the electroless plating process has a reaction time of 5 to 500 minutes, but the actual reaction time can be adjusted according to the thickness of the film to be coated.

As described above, after the main flow of the method for fabricating the single-layer biaxial circuit pattern provided by the embodiment is introduced, several different embodiments of the method will be further described below.

Referring to FIG. 1 and FIG. 4A to FIG. 4E , FIG. 4A to FIG. 4E are schematic diagrams showing a process of a second embodiment of a method for fabricating a single-layer biaxial circuit pattern according to the present invention. The embodiment is mainly characterized in that, in step S101, when the catalyst pattern layer 1 is formed, a flat layer 13 is further formed between the two first catalyst structure units 11 as a base of the first bridge member 3; As a result, a step difference between the surface of the first catalyst structure unit 11 and the surface of the substrate 2 can be avoided, thereby preventing the first bridge member 3 from being broken from the bend.

Referring to FIG. 5 again, from the structural point of view, since the thickness of the flat layer 13 is the same as the thickness of the first catalyst structure unit 11, there is no step difference between the surface of the catalyst pattern layer 1 and the surface of the substrate 2, and the first bridge The member 3 may extend straight from the leading edge of any of the first catalyst structure units 11 to the leading edge of the other first catalyst structure unit 11 while the insulating layer 4 covers the surface of the first bridge member 3 in a flat manner.

Please refer to FIG. 1 and FIG. 6A to FIG. 6E , wherein FIG. 6A to FIG. 6E are schematic diagrams of processes of a third embodiment of a method for fabricating a single-layer biaxial circuit pattern according to the present invention. The feature of this embodiment is mainly that: in step S103, the insulating layer is The width of 4 is increased to extend from the leading edge of any second catalyst structure unit 12 to the leading edge of the other second catalyst structure unit 12; thus, the second bridge member 5 can be bent The degree tends to be gentle, which in turn prevents the second bridge 5 from breaking from the bend.

Referring to FIG. 7 , structurally, there is a difference between the surface of the first bridge member 3 and the surface of the substrate 2 , and the surface of the second catalyst structure unit 12 and the surface of the substrate 2 also have a step difference, and the width of the insulating layer 4 is increased. The step difference between the surface of the first bridge member 3, the surface of the second catalyst structure unit 12, and the surface of the substrate 2 can be filled.

Please refer to FIG. 1 and FIG. 8A to FIG. 8E , wherein FIG. 8A to FIG. 8E are schematic diagrams showing a process of a fourth embodiment of a method for fabricating a single-layer biaxial circuit pattern according to the present invention. The feature of this embodiment is mainly that in the step S104, the second bridge member 5 is made of the same material as the first bridge member 3, that is, the materials of the first and second bridge members 3, 5 are all conductive ink. It should be noted that since there is no catalyst in the second bridge member 5, there is no deposition of the metal film on the second bridge member 5 in the electroless plating process.

[Second embodiment]

Please refer to FIG. 9 and FIG. 10A to FIG. 10E. FIG. 9 is a flowchart of a method for fabricating a single-layer biaxial circuit pattern according to a second embodiment of the present invention, and FIG. 10A to FIG. 10E are single-layer doubles according to the present invention. A schematic diagram of a process for fabricating an axial circuit pattern.

It should be noted that the related technical details of the method for fabricating the single-layer biaxial circuit pattern provided by this embodiment are substantially the same as those of the first embodiment, and the main difference between the two is that the first embodiment is simultaneous printing forming along the edge. a first axially arranged first catalyst structure unit 11 and a second catalyst structure unit 12 arranged along the second axial direction, and then using an electroless plating process outside the first and second catalyst structure units 11, 12 A metal film is deposited on the surface; in this embodiment, the first catalyst structure unit 11 arranged along the first axial direction and the second catalyst structure unit 12 arranged along the second axial direction are sequentially printed, and then the electroless plating is utilized. The process deposits a thin metal film on the outer surfaces of the first and second catalyst structural units 11, 12.

The method for fabricating the single-layer biaxial circuit pattern provided in this embodiment includes: Step 201: forming at least two first catalyst structure units 11 arranged along the first axial direction on a substrate 2; Step 202: forming a The first bridge member 3 is used to connect the two first catalyst structure units 11; Step 203: an insulating layer 4 is formed to cover the first bridge member 3; Step 204: forming at least two rows arranged along the second axis The second catalyst structure unit 12 is on the substrate 2; Step 205: forming a second bridge member 5 on the insulating layer 4 for connecting the two second catalyst structure units 12; and Step 206: using an electroless plating process on the two The first catalyst structure unit 11 and the two second catalyst structure units 12 are plated with a layer of metal.

It should be noted that the method for fabricating the single-layer biaxial circuit pattern provided in this embodiment may also have a plurality of different embodiments described above, that is, a flat is further formed between the two first catalyst structure units 11. The layer 13 and/or the material of the second bridge member 5 is widened and/or replaced. For the related technical details, reference may be made to the content of the first embodiment, and details are not described herein.

[Application of the embodiment]

Referring to FIG. 3, FIG. 5, and FIG. 7, the structural member 100 with a single-layer biaxial circuit pattern can be formed by the method for fabricating the single-layer biaxial circuit pattern provided by the first and second embodiments. It can be used as a circuit substrate or an antenna substrate for an electronic device (such as an electronic device or a communication device with a touch function). The structural member 100 with a single-layer biaxial circuit pattern includes a substrate 2, at least two first conductive structural units 11', at least two second conductive structural units 12', a first bridge 3, and a The insulating layer 4 and a second bridge member 5.

Specifically, the two first conductive structural units 11' are arranged along a first axial direction (such as an X axis), wherein each of the first conductive structural units 11' is covered by a first catalytic structure unit 11 and a first a metal thin film M of at least a portion of an outer surface of the catalyst structural unit 11; two second conductive structural units 12' are arranged along a second axial direction (such as a Y-axis) substantially perpendicular to the first axial direction, wherein each second The conductive structural unit 12' is composed of a second catalyst The structure unit 12 is composed of a metal film M covering at least a portion of the outer surface of the second catalyst structure unit 12; the first bridge member 3 is extended from the leading edge of any of the first catalyst structure units 11 to another first contact The leading edge of the dielectric unit 11, the insulating layer 4 covers the surface of the first bridge 3, and the second bridge 5 extends from the leading edge of any of the second catalyst unit 12 across the insulating layer 4 to another second contact The leading edge of the media structure unit 12.

For one aspect of the structural member 100 with a single-layer biaxial circuit pattern, as shown in FIG. 3, the surface of the first catalyst structure unit 11 and the surface of the substrate 2 have a difference structure D, the first bridge The member 3 extends from the leading edge of any first catalyst structure unit 11 along the step structure D to the leading edge of the other first catalyst structure unit 11, and the insulating layer 4 is formed along the configuration of the step structure D. On the surface of a bridge 3.

For another aspect of the structural member 100 with a single-layer biaxial circuit pattern, as shown in FIG. 5, a flat layer 13 is disposed between the two first conductive structural units 11', and the flat layer 13 is The thickness is the same as the thickness of the first catalyst structure unit 11; the first bridge 3 extends straight from the leading edge of any of the first catalyst structure units 11 to the leading edge of the other first catalyst structure unit 11, while the insulating layer 4 covers the surface of the first bridge 3 flatly.

For still another aspect of the structural member 100 with a single-layer biaxial circuit pattern, the width of the insulating layer 4 can be increased, as shown in FIG. 7, by any of the second catalyst structural units 12. The leading edge extends to the leading edge of the other second catalyst structure unit 12; thus, the degree of bending of the second bridge member 5 can be made gentle, thereby preventing the second bridge member 5 from being broken from the bend. .

In still another aspect of the structural member 100 with a single layer biaxial circuit pattern, the materials of the first and second bridge members 3, 5 are all conductive inks. In still another aspect of the structural member 100 with a single-layer biaxial circuit pattern, the material of the first bridge 3 is a conductive ink, the material of the first bridge 3 and the first and second catalyst structures. The units 11, 12 are identical, and the surface of the first bridge 3 also has a metal film M.

[Possible effects of the examples]

The method for fabricating the single-layer biaxial circuit pattern provided by the embodiment of the present invention is to form a first catalyst structure unit arranged along the first axial direction and a second catalyst structure unit arranged along the second axial direction by simultaneous printing. And then depositing a metal film on the outer surface of the first and second catalyst structural units by using an electroless plating process and "sequentially printing to form first catalyst structural units arranged along the first axial direction and arranged along the second axial direction The process of designing the second catalyst structure unit and then depositing a metal film on the outer surface of the first and second catalyst structural units by using an electroless plating process can effectively simplify complicated and time-consuming process steps. To reduce process difficulty and improve process yield.

In view of the above, the manufacturing method of the single-layer biaxial circuit pattern is simple and very easy to implement, and has wide application prospects, and is also suitable for industrial mass production.

The above is only an embodiment of the present invention, and is not intended to limit the scope of the invention. It is still within the scope of patent protection of the present invention to make any substitutions and modifications of the modifications made by those skilled in the art without departing from the spirit and scope of the invention.

Claims (21)

A method for fabricating a single-layer biaxial circuit pattern, comprising the steps of: forming a catalyst pattern layer on a substrate, wherein the catalyst pattern layer comprises at least two first catalyst structures arranged along a first axial direction a unit and at least two second catalyst structural units arranged along a second axis, the second axial direction being substantially perpendicular to the first axial direction; forming a first bridge member for connecting the two first ones a catalyst structural unit; an insulating layer is formed to cover the first bridge; a second bridge is formed on the insulating layer for connecting the two second catalyst structural units; and an electroless plating process is utilized Depositing a layer of metal on the two first catalyst structure units and the two second catalyst structure units, wherein the two first catalyst structure units and the two second catalyst structure units The catalyst in the medium can trigger the metal ion reduction deposition. The method for fabricating a single-layer biaxial circuit pattern according to claim 1, wherein in the step of forming the catalyst pattern layer on the substrate, the method further comprises: forming a flat layer on the two of the first Between the catalyst structural units serves as a base for the first bridge. The method for fabricating a single-layer biaxial circuit pattern according to claim 2, wherein in the step of forming the first bridge member for connecting the two first catalyst structural units, the method further comprises: a first bridge member is formed on the flat layer such that the first bridge member extends straight from a leading edge of any of the first catalyst structural units to a leading edge of another of the first catalyst structural units . The method of fabricating a single-layer biaxial circuit pattern according to claim 3, wherein in the step of forming the insulating layer to cover the first bridge, the insulating layer covers the first layer evenly On the surface of the bridge. The method for fabricating a single-layer biaxial circuit pattern according to claim 1, wherein the catalyst pattern layer comprises a palladium catalyst and a hardener, and the hardener accounts for the catalyst pattern. 1% to 10% in the layer, and the hardener is selected from the group consisting of fatty amines, cyclic aliphatic amines, polyamines, aromatic amines, acid anhydrides, Lewis acids, and imidazole hardeners. At least one or a combination thereof. The method for fabricating a single-layer biaxial circuit pattern according to claim 5, wherein the material of the first bridge member is a conductive ink, and the material of the second bridge member is the same as the material of the catalyst pattern layer. The second bridge can trigger metal ion reduction deposition. The method for fabricating a single-layer biaxial circuit pattern according to claim 1, wherein the material of the first bridge member is a conductive ink, and the material of the second bridge member is a conductive ink. A method for fabricating a single-layer biaxial circuit pattern includes the steps of: forming at least two first catalyst structural units arranged along a first axial direction on a substrate; forming a first bridge member for connecting two a first catalyst structure unit; forming an insulating layer for covering the first bridge; forming at least two second catalyst structure units arranged along the second axis on the substrate, the second An axial direction substantially perpendicular to the first axial direction; a second bridge member formed on the insulating layer for connecting the two second catalyst structural units; and an electroless plating process for the two first portions The catalyst structure unit and the two of the second catalyst structure units are plated with a layer of metal, wherein the catalysts of the two of the first catalyst structure units and the two of the second catalyst structure units can trigger metal Ion reduction deposition. The method for fabricating a single-layer biaxial circuit pattern according to claim 8, wherein in the step of forming at least two first catalyst structural units arranged along the first axial direction on the substrate, the method further includes Forming a flat layer between the two first catalyst structural units as a base of the first bridge. The method for fabricating a single-layer biaxial circuit pattern according to claim 9, wherein in the step of forming the first bridge to connect the two first catalyst structural units, the method further comprises: a first bridge member is formed on the flat layer such that the first bridge member extends straight from a leading edge of any of the first catalyst structural units to a leading edge of another of the first catalyst structural units . The method of fabricating a single-layer biaxial circuit pattern according to claim 10, wherein in the step of forming the insulating layer to cover the first bridge, the insulating layer covers the first layer evenly On the surface of the bridge. The method for fabricating a single-layer biaxial circuit pattern according to claim 8, wherein the catalyst pattern layer comprises a palladium catalyst and a hardener, and the hardener accounts for 1% to 10% of the catalyst pattern layer. %, and the hardener is selected from at least one of a fatty amine, a cyclic aliphatic amine, a polyamine, an aromatic amine, an acid anhydride, a Lewis acid, and an imidazole hardener, or a combination thereof. . The method for fabricating a single-layer biaxial circuit pattern according to claim 12, wherein the material of the first bridge member is a conductive ink, and the material of the second bridge member is the same as the material of the catalyst pattern layer. The second bridge can trigger metal ion reduction deposition. The method for fabricating a single-layer biaxial circuit pattern according to claim 8, wherein the material of the first bridge member is a conductive ink, and the material of the second bridge member is a conductive ink. An electronic device using a structural member having a single-layer biaxial circuit pattern, wherein the structural member having a single-layer biaxial circuit pattern comprises: a substrate; at least two first conductive structural units Arranging on the substrate along a first axial direction, wherein each of the first conductive structural units includes a first catalyst structural unit and a metal film covering a portion of a surface of the first catalyst structural unit. Wherein the first catalyst structural unit can trigger metal ion reduction deposition to form the metal thin film on a surface thereof; a first bridge member extending from a leading edge of any of the first catalyst structural units to a leading edge of another of the first catalyst structural units; an insulating layer covering a surface of the first bridge member And at least two second conductive structural units are arranged on the substrate along a second axial direction substantially perpendicular to the first axial direction, wherein each of the second conductive structural units comprises a second catalytic structure unit and a a metal thin film covering a portion of a surface of the second catalyst structural unit, wherein the second catalytic structural unit is capable of triggering metal ion reduction deposition to form the metal thin film on a surface thereof; and a second bridge member Extending from the insulating layer to a leading edge of another of the second catalyst structural units by a leading edge of any of the second catalyst structural units. The electronic device of claim 15, wherein a surface of the first catalyst structural unit and a surface of the substrate have a poor structure, and the first bridge is formed by any of the first catalyst structures. A leading edge of the unit extends along the step structure to a leading edge of another of the first catalyst structure units, and the insulating layer is formed on a surface of the first bridge along a configuration of the step structure on. The electronic device of claim 15, wherein a flat layer is provided between the two first conductive structural units, and the thickness of the flat layer is the same as the thickness of the two first catalytic structural units. The first bridge member extends straight from the leading edge of any of the first catalyst structural units to the leading edge of another of the first catalyst structural units, while the insulating layer covers the first bridge evenly On the surface of the piece. The electronic device according to claim 15, wherein the catalyst pattern layer comprises a palladium catalyst and a hardener, the hardener accounts for 1% to 10% of the catalyst pattern layer, and the hardener is selected A combination of at least one of a fatty amine, a cyclic aliphatic amine, a polyamine, an aromatic amine, an acid anhydride, a Lewis acid, and an imidazole hardener, or the like. The electronic device of claim 18, wherein the material of the first bridge member is a conductive ink, the material of the second bridge member and the first catalyst structure unit and the second catalyst structure unit The materials are the same. The electronic device of claim 15, wherein the material of the first bridge member is a conductive ink, and the material of the second bridge member is a conductive ink. The electronic device of claim 15, wherein the insulating layer extends from a leading edge of any of the second catalyst structural units to a leading edge of another of the second catalyst structural units.