TWI639013B - Circuit board detection method - Google Patents

Abstract

The invention relates to a “parameter method for circuit board detection”. A detecting device first obtains a standard image sample defining measurement parameter of a circuit board, and sends the object to be tested, and obtains a sample to be tested by using an image capturing device. After comparing the images, the image comparison between the standard image sample and the comparison image is performed to find the comparison image measurement position introduction measurement corresponding to the central measurement point of the standard image sample. The parameters can be used to accurately measure the line width or line spacing of the board to solve the image shift problem such as the conventional two-dimensional motion positioning deviation and the object to be measured. Moreover, the implementation of this case is carried out without changing the existing equipment, and the feasibility is high and there is no cost increase.

Description

Circuit board detection method

The "parallel method for circuit board detection" of the present invention relates to a technical field for obtaining a correct measurement position of a circuit board by using an image capture and comparison processing method.

Based on the increasingly stringent requirements of the electronics industry for the quality of the production line, the correctness of quality inspection is very important. Printed circuit boards are the main components of electronic, communication, computer and automotive electronics. In order to meet the market's light, thin, short and small product characteristics, today's printed circuit boards are manufactured with blind buried holes. The multilayer wiring board is connected to the wiring of the surface. In the process of etching, film, laser blind hole, electroplating, etc., the printed circuit board process must test the finished product, the result of the finished product such as the line, the circular groove, the circle or the arc, in order to judge the goodness of the process, and the judgment standard In order to check the width of the upper and lower bottoms of the ladder line width of the finished pattern, and the average median center coordinate line width and spacing, for the printed circuit board, the line width quality inspection work of the finished product or the semi-finished product becomes It is very important, especially the line width, aperture, spacing, etc. need to be measured and conform to the specifications. The so-called line width of a printed circuit board refers to the line width of a line, a circle or an arc after being processed by etching, electroplating, etc., and the line width of the printed circuit board is generally a ladder shape of a wide width and a narrow shape, and is generally called a ladder. Line width. The requirements for line width are based on customer design rules. If the finished product line width exceeds the design specifications, it will often cause the electronic product to be unstable and cause downtime.

When the line width and the line spacing of the measuring circuit board are performed, the measuring device is mounted on a vacuum fixed platform, which is fixed during the measurement, and is moved with the visual image capturing module over the object to be tested. Draw the entire line width image of the object to be tested. However, after the optical measuring device is manually loaded, the alignment method of the object to be tested is firstly positioned by using a side or fixed pin method, and then the alignment target on the circuit board is captured by the camera device in the measuring system. After the calculation is performed to obtain the zero point position and the coordinate compensation value is completed, a control mechanism is used to control a motion mechanism to perform at least two-dimensional motion displacement, and the visual image capturing device fixed to the motion mechanism is moved to arrive. Calculating the two-dimensional coordinate measurement position of the compensation value by the alignment target image, so that the image capturing device can obtain the image of the measured object, and finally calculating the line of the measured object according to the captured image by an image processing device Wide line spacing. However, due to the rapid advancement of electronic products, the printed circuit boards have become thinner and shorter, but the functions require more stable performance. Therefore, the development of process technology is becoming more and more difficult, such as the currently highly regarded flip chip ( Flip chip), ball grid array (BGA) substrates, and circuit boards for portable products such as mobile phones have all entered the high-density (HDI) substrate process, and the line width requirement has reached 20 (micro). Density, using the image alignment method of the above-mentioned conventional alignment target, because the circuit of the circuit board itself is offset by the image transfer process, and the size variation of the circuit board material itself, plus the two-dimensional coordinate motion mechanism The deviation of the positioning accuracy, often resulting in the measurement position shift, causes the measurement error to occur, and the above requirements cannot be accurately measured. Online wide-ranging measurement pays attention to the accurate and rapid trend, how to get rid of the bottleneck of traditional skills, and can automatically measure correctly The position is the subject of hard work and improvement.

In view of this, the inventor has made it possible to improve the limitations and limitations of the existing measurement technology by making the cost of research and development, and to make the measurement technology perfect, ideal and practical.

In order to solve the above-mentioned conventional methods, there are image shift problems such as two-dimensional motion positioning deviation and object torsion error, and the main purpose of the present invention is to provide an innovative measurement method. In the method, the detecting device first obtains a standard image sample definition measurement parameter of a circuit board, and the standard image sample may include multiple line widths or other images for the image alignment to find the position, and then in the standard image. For example, the parameters such as line width, line spacing, line length and angle defined in the sample, such as line width, line spacing, line length and angle, are sent to the object to be tested, and an image capturing device is used to obtain a comparison of the objects to be tested. After the image is imaged, the standard image sample and the comparison image are subjected to image comparison processing, so that the comparison image measurement position introduction measurement parameter corresponding to the central measurement point of the standard image sample can be found, thereby It can accurately measure the line width or line spacing of the board; thereby, it can effectively improve the image shift problem such as the conventional two-dimensional motion positioning deviation and the object to be measured.

The second object of the present invention is to provide a new method which can be carried out without changing the existing equipment, and has high feasibility, no need to modify or redesign and manufacture new equipment, no The problem of cost increase is to achieve the purpose of rapid introduction and implementation.

To achieve the above objective, the specific content of the present invention includes the following steps: Step 1: Obtain a standard image sample definition measurement parameter of a circuit board, The standard image sample can include multiple line widths or other images for the image to find the position, and then define the parameters of the line width and line position to be measured in the standard image sample, such as line width and line spacing. , line length and angle, etc.; Step 2: using an image capturing device to obtain a comparison image of the object to be tested; Step 3: performing image comparison processing on the standard image sample and the comparison image; Step 4: Looking for A comparison measurement parameter is input to the comparison image measurement position corresponding to the central measurement point of the standard image sample; and step 5: performing measurement.

The step 1 is to obtain a standard image sample of a circuit board, wherein the standard image sample is pre-captured by an image capturing device or directly by computer data (GERBER); The standard image sample is measured at the center of the standard image sample.

The image capturing device of the second step can be used to capture an image of the object to be tested on the moving mechanism; the moving mechanism can be used to perform at least two-dimensional motion, and the motion is fixed to the motion mechanism. The upper image capturing device reaches the set two-dimensional coordinate measuring position, so that the image capturing device obtains the image of the object to be tested at the position.

More specifically, the detailed process of the method of the present method includes, in order, loading, positioning, CCD standard alignment target positioning, edge-to-edge, positioning PIN, performing two-dimensional motion, performing image comparison, and obtaining the final position of the measurement position. Measurement.

The specific effect of the invention is that it can be implemented without modifying the existing equipment at all, and can completely solve the image shift problem such as the conventional two-dimensional motion positioning deviation and the object to be measured.

11‧‧‧Get a standard image sample definition measurement parameter for a board

12‧‧‧Using an image capture device to obtain a comparison image of a test object

13‧‧‧Image comparison between the standard image sample and the comparison image

14‧‧‧ Find the comparison image measurement position introduction measurement parameter corresponding to the central measurement point of the standard image sample

15‧‧‧Measurement

21‧‧‧Feeding

22‧‧‧ Positioning

23‧‧‧CCD standard alignment target positioning

24‧‧‧

25‧‧‧Target PIN

26‧‧‧Two-dimensional movement

27‧‧‧Image comparison

28‧‧‧Get the measurement position

29‧‧‧Measurement

3‧‧‧Circuit board

31‧‧‧ lines

32‧‧‧ line spacing

4‧‧‧Comparative images

The first figure is a block diagram of the process of the present invention.

The second figure is a block diagram of the process of the present invention.

The third figure is a schematic diagram of the ratio of the image area of the circuit board when the invention is implemented.

The fourth figure is another schematic diagram of the comparison image range of the circuit board when the invention is implemented.

The fifth figure is another schematic diagram of the ratio of the image of the circuit board when the invention is implemented.

The structure of the "parameter method for circuit board detection" of the present invention, and the effect thereof, together with the drawings, a preferred embodiment of the present invention is described in detail as follows: First, please refer to the first figure, In the present case, the "parameter method for circuit board detection" includes the following steps: Step 1: Obtain a standard image sample definition measurement parameter 11 of a circuit board, which defines the line width and line spacing position to be measured. Parameters such as line width, line spacing, line length and angle; step 2: using an image capture device to obtain a comparison image of the object to be tested 12; step 3: image the standard image sample and the comparison image Alignment processing 13; Step 4: Finding the comparison image measurement position introduction measurement parameter 14 corresponding to the central measurement point of the standard image sample, and introducing the parameter of the line width and the line distance position to be measured Such as line width, line spacing, line length and angle; Step 5: Perform measurement 15.

The first step of the first step is to obtain a standard image sample of the circuit board, wherein the standard image sample is pre-captured by the image capturing device to obtain a standard circuit board image, or directly by computer data (GERBER); The image sample is measured at the center of the standard image sample.

The image capturing device of the second step can be used to capture an image of the object to be tested on the moving mechanism; the moving mechanism can be used to perform at least two-dimensional movement, and the movement is fixed on the moving mechanism. The image capturing device reaches the set two-dimensional coordinate measuring position, so that the image capturing device obtains the image of the object to be tested at the position.

As shown in the second figure, the detailed process of the method of the present method includes: feeding 21, positioning 22, CCD standard alignment target positioning 23, edge 24, positioning PIN 25, performing two-dimensional motion 26, performing image comparison 27 The measurement position 28 is taken and finally measured 29 .

Since the measurement in this case is mainly to obtain the center measurement point by means of image comparison, it is not the traditional way to move the motion mechanism to reach the center of the preset measurement point, so there is no motion deviation. The shortcomings are also irrelevant to the error of the test object, which is extremely ideal.

The third to fifth figures show that the circuit board 3 includes a plurality of lines 31, and each line 31 has a line spacing of 32. In this case, the comparison image 4 is obtained by using the 撷, and then compared with the standard image sample. For example, by finding the comparison image measurement position corresponding to the central measurement point of the standard image sample, the measurement can be performed, and the two-dimensional movement of the circuit board to the specific zero position can be performed, thereby effectively improving the efficiency. With precision.

In summary, the "parallel method for circuit board detection" of the present invention, according to the provisions of the current patent law, has not been able to obtain a patent; the case is in production It has indeed been used in the industry, and has not been seen in publications or publicly used before the application, and is not a technology known to the public. Furthermore, the present invention effectively solves the long-standing problems in the prior art and achieves long-term needs of related users and consumers, and it is corroborated that the present invention is not easily accomplished. The case is in full compliance with the requirements of "industry useability", "novelty" and "progressiveness" as stipulated in the Patent Law. The patents are submitted in accordance with the law, and the Bureau is invited to conduct a detailed investigation and to approve the patent as soon as possible to protect the wisdom of the applicant. Property rights, encourage innovation.

The present invention has been described by way of example only, and it is to be understood by those skilled in the art. The preferred embodiment of the present invention is only one of the ways in which the present invention can be implemented in a specific manner, but is not limited thereto, and should be defined in the scope of the appended patent application.

Claims (1)

A "parameter method for circuit board detection" includes the following steps: Step 1: Obtain a standard image sample setting measurement parameter of a circuit board, and the standard image sample is pre-captured by a video capture device. The image of the board is formed by defining a parameter for measuring the position of the line width. The standard image sample is directly made by computer data (GERBER), which has a central measuring point. , the method is to measure the position; the second step: using an image capturing device to obtain a comparison image of the object to be tested, which can be used to capture an image of the object to be tested located on a moving mechanism, wherein the moving mechanism can For performing at least two-dimensional motion, moving the image capturing device fixed on the moving mechanism to the set two-dimensional coordinate measuring position, so that the image capturing device obtains the image of the measured object at the position; Step 3 : performing image comparison processing on the standard image sample and the comparison image; Step 4: finding a comparison measurement parameter corresponding to the image measurement position corresponding to the standard image sample measurement point; Fives Measurement was carried out.