TWI639008B - Electrical connection device, probe support and method for manufacturing probe with latching portion - Google Patents

Abstract

An electrical connection device includes: a probe substrate 16; and a probe 20 having a linear body portion 21 whose front end portion 20a is in contact with an object to be inspected and a base end portion 20b is in contact with the aforementioned probe. A needle substrate; and a plate-shaped guide portion 30, which is disposed on the subject side of the probe substrate 16 and has a guide hole 30a through which a probe is inserted between a front end portion 20a and a base end portion 20b; and The locking portion 40 locks the main body portion 21 inserted into the guide hole 30a to the guide portion 30. The locking portion is formed of an elastic member having a wide portion wider than the diameter of the guide hole 30a. .

Description

Electrical connection device, probe support and manufacturing method of probe with locking portion

The present invention relates to an electrical connection device and a probe support for electrical inspection of an object to be inspected.

Most integrated circuits incorporated into a semiconductor wafer are generally subjected to an electrical inspection before they are cut and separated from the wafer to have the performance described in the specification. An example of the electrical connection device used for such an inspection is a probe card having a plurality of probes (for example, refer to Patent Document 1).

In the probe card, each probe is inserted into each guide hole formed in a plate-shaped guide portion. Thereby, each probe is guided from the probe substrate located above the thickness direction of the plate-shaped guide portion toward the inspection object located below the thickness direction.

In the probe card, the plate-shaped guide portion is pressed against the probe substrate side by a predetermined crimping member. In addition, the base end portion of the probe projecting upward from the plate-shaped guide portion is maintained in a crimped state with a connection pad which is crimped to the probe substrate with a predetermined load (so-called pre-compression). Thereby, the probe is electrically connected to the probe substrate.

Here, the probe is provided with a main body portion made of a linear metal member, and a locking portion for forming a part of the main body portion to be wider than the hole diameter of the guide hole is arranged in the main body portion (for example, refer to Patent Document 2) .

This locking portion functions as a stopper that locks the probe to the plate-shaped guide portion. When the probe is locked to the guide portion by the locking portion, the base end portion of the probe is pressed. It is connected to the probe substrate so as to maintain the above-mentioned crimped state.

    [Prior technical literature]         [Patent Literature]    

Patent Document 1: Japanese Utility Model Publication No. 7-29838

Patent Document 2: Japanese Patent Application Laid-Open No. 2003-185677

In addition, as the method of forming the locking portion, a method of thickening a metal member constituting the main body portion of the probe by melting or a method of crushing and thickening the main body portion of the probe is adopted.

However, since the locking portions provided on the probes are very fine, it is difficult to form the locking portions provided on the plurality of probes to have the same size, and the thickness of the plate-shaped guide portion may cause the locking portions to be formed. The length varies. In addition, with this unevenness, unevenness may also occur in the protruding length of the plurality of probes from the guide portion to the base end portion of the probe.

If a plurality of probes with uneven protrusion lengths are used to crimp the base end portion of each probe to the connection pad of the probe substrate, the load is concentrated on the probe with a longer protrusion length. The base end portion is strongly crimped to the probe substrate. In addition, the material of the locking portion is a hard material composed of the same metal member as the main body portion of the probe. Therefore, when the pressure bonding is performed, the connection pad of the probe substrate may be distorted or broken, which may cause the probe and The connection to the probe substrate is defective.

On the other hand, a probe with a short extension length is limited by the distance between the guide portion and the probe substrate due to other probes with a long extension length. Therefore, a sufficient crimping state cannot be ensured. Poor electrical connection may be caused between the substrates.

The present invention has been made by a researcher in view of such a problem, and an object thereof is to provide an electrical connection device and a probe support capable of preventing poor connection between a probe and a probe substrate.

In order to achieve the above object, the electrical connection device of the present invention includes: a probe substrate; and a probe having a linear body portion, wherein the front end portion is in contact with the object to be inspected, and the base end portion is in contact with the foregoing. A probe substrate; a plate-shaped guide portion arranged on the subject side of the probe substrate and having a guide hole through which the probe is inserted between the front end portion and the base end portion; and a locking portion The main body portion inserted into the guide hole is locked to the guide portion; the lock portion is formed of an elastic member having a wide portion wider than a diameter of the guide hole.

The electrical connection device of the present invention is the above-mentioned electrical connection device, wherein the locking portion is formed such that a width of an end portion on the side of the guide hole is smaller than a diameter of the guide hole, and A shape having a width larger than the diameter of the aforementioned guide hole.

The probe supporting system of the present invention includes: a probe having a linear body portion whose front end portion is in contact with an object to be inspected and a base end portion is in contact with a probe substrate; and a plate-shaped guide portion is arranged A guide hole is provided on the subject side of the probe substrate, and the probe is inserted between the front end portion and the base end portion; and a locking portion is the body to be inserted into the guide hole. The locking portion is locked to the guide portion. The locking portion is formed of an elastic member having a wider portion than a diameter of the guide hole.

According to the present invention, it is possible to provide an electrical connection device and a probe support capable of preventing poor connection between a probe and a probe substrate.

1‧‧‧ Electrical connection device

12‧‧‧ Clamp

14‧‧‧semiconductor wafer

14a‧‧‧electrode pad

16‧‧‧ Probe substrate

16a‧‧‧Wiring

16b‧‧‧test plate

16c‧‧‧Connecting pad

18‧‧‧ probe support

20‧‧‧ Probe

20a‧‧‧Front end

20b‧‧‧Base end

20z‧‧‧Bend

21‧‧‧Body

26‧‧‧ Reinforcing board

30‧‧‧Guide

30a‧‧‧Guide hole

34‧‧‧ Spacer

40‧‧‧Detent

40a‧‧‧end

40b‧‧‧end

40w‧‧‧elastic member

50a‧‧‧Arrow

120‧‧‧ Probe

120b‧‧‧base end

121‧‧‧Body

140‧‧‧Detent

200‧‧‧mould

210‧‧‧hole

220‧‧‧ Formation Room

Ha‧‧‧ length

Hb‧‧‧ length

L1‧‧‧ extended length

L2‧‧‧ extended length

W1‧‧‧ diameter

W2‧‧‧Width

W3‧‧‧Width

FIG. 1 is a schematic side view showing an electrical connection device according to a first embodiment of the present invention.

Fig. 2 is a partially enlarged sectional view schematically showing a part of an electrical connection device according to a first embodiment of the present invention.

Fig. 3 is a partially enlarged sectional view schematically showing a part of a probe according to a first embodiment of the present invention.

Fig. 4 is a partially enlarged perspective view schematically showing a part of a probe according to a first embodiment of the present invention.

Fig. 5 (a) is an explanatory diagram schematically showing a preparation process of a method for manufacturing a probe and a locking portion according to the first embodiment of the present invention. (b) is an explanatory view schematically showing an insertion process of a method for manufacturing a probe and a locking portion according to the first embodiment of the present invention. (c) is an explanatory diagram schematically showing a filling process of a method for manufacturing a probe and a locking portion according to the first embodiment of the present invention. (d) is an explanatory view schematically showing a forming process of a method for manufacturing a probe and a locking portion according to the first embodiment of the present invention.

Fig. 6 is a partially enlarged sectional view schematically showing a part of a conventional electrical connection device.

Fig. 7 (a) is a partially enlarged sectional view schematically showing a part of the electrical connection device according to the first embodiment of the present invention. (b) is a partially enlarged sectional view schematically showing a part of the electrical connection device according to the first embodiment of the present invention.

Fig. 8 is a partially enlarged sectional view schematically showing a part of a probe and a locking portion according to a modification of the first embodiment of the present invention.

Hereinafter, an electrical connection device according to an embodiment of the present invention will be described in detail with reference to the drawings. In addition, the embodiment shown below exemplifies a device and the like for embodying the technical idea of the present invention, and the technical idea of the present invention does not limit the arrangement and the like of each constituent member to the following. Various technical changes can be added to the technical idea of the present invention within the scope of patent application.

    (Implementation Mode 1)    

FIG. 1 is a schematic side view showing an electrical connection device 1 according to a first embodiment of the present invention.

As shown in FIG. 1, the electrical connection device 1 according to the embodiment 1 of the present invention is called a vertical action type probe card, and is held on a frame (not shown) above the clamp 12 that can be raised and lowered. A semiconductor wafer 14, which is an example of an inspection object, is held on the holder 12. A plurality of integrated circuits are incorporated in the semiconductor wafer 14.

The semiconductor wafer 14 is arranged on the holder 12 with the plurality of electrode pads 14 a of the integrated circuit facing upward for the electrical inspection of the integrated circuit.

The electrical connection device 1 includes a probe substrate 16 and a probe support 18.

The probe substrate 16 is composed of, for example, a circular hard wiring substrate. The lower end portion of the probe substrate 16 is connected to the base end portion 20 b (upper end portion) of the probe 20.

A plurality of test pads 16b are provided on a peripheral edge portion of one surface (upper surface shown in FIG. 1) of the probe substrate 16 as connection terminals to be connected to a tester (not shown). Each test pad 16 b is connected to a wiring 16 a provided on the probe substrate 16.

In addition, on one surface (the upper surface shown in FIG. 1) of the probe substrate 16, for example, a reinforcing plate 26 made of metal for reinforcing the probe substrate 16 is provided. The reinforcing plate is disposed in a central portion of the probe substrate 16 other than the peripheral edge portion of the probe plate 16 on which the test disc 16b is provided. A probe support 18 is disposed on the other surface (lower surface shown in FIG. 1) of the probe substrate 16.

The probe support 18 is held on the probe substrate 16. The probe support 18 includes a plurality of probes 20. The probe support 18 prevents the probes 20 from interfering with each other when the front end portion 20a (lower end portion) of the probe 20 is pressed against the semiconductor wafer 14.

The probe 20 is in contact with the semiconductor wafer 14 with the front end portion 20 a of the probe 20, and is in contact with the probe substrate 16 with the base end portion 20 b of the probe 20.

The front end portion 20 a of the probe 20 is connected to the electrode pad 14 a on the opposite semiconductor wafer 14 under the guidance of the probe support 18.

The base end portion 20b of the probe 20 is abutted in a crimped state in a crimped state with a connection pad 16c (see FIG. 2 described later) provided on the probe substrate 16 correspondingly.

The proximal end portion 20 b of the probe 20 is connected to the connection pad 16 c under the guidance of the probe support 18 (see FIG. 2). Thereby, the probe 20 is electrically connected to the corresponding test pad 16b via the connection pad 16c and the wiring 16a.

Next, the configurations of the probe support 18 and the probe 20 will be described in detail with reference to FIGS. 2 to 4. Fig. 2 is a partially enlarged sectional view showing a part of an electrical connection device according to a first embodiment of the present invention. Fig. 3 is a partially enlarged sectional view showing a part of a probe according to a first embodiment of the present invention. Fig. 4 is a partially enlarged perspective view showing a part of a probe according to a first embodiment of the present invention.

For the sake of explanation, the up-down direction in the drawing is set to the thickness direction Y, and the left-right direction is set to a right-angle direction X perpendicular to the thickness direction Y.

As shown in FIG. 2, the probe support 18 includes a plate-shaped guide portion 30, a probe 20, and a locking portion 40. In addition, the probe support 18 includes another guide portion disposed parallel to the guide portion 30 below the guide portion 30 in the thickness direction Y, but a description thereof is omitted here.

The guide portion 30 is formed of, for example, a ceramic plate or a polyimide synthetic resin plate. When the guide portion 30 is supported by the spacer member 34, the guide portion 30 is disposed so as to provide a predetermined interval with respect to the probe substrate 16.

The guide portion 30 is located on the semiconductor wafer 14 side of the probe substrate 16 and is arranged parallel to the probe substrate 16. The guide portion 30 includes a guide hole 30 a through which the probe 20 is inserted between a front end portion 20 a of the probe 20 and a base end portion 20 b of the probe 20.

The guide hole 30 a formed in the guide portion 30 penetrates in the thickness direction Y and guides the base end portion 20 b of each probe 20 to a connection pad 16 c arranged corresponding to the wiring 16 a of the probe substrate 16.

The base end portion 20b of the probe 20 guided to the connection pad 16c through the guide hole 30a may be fixed to the connection pad 16c by, for example, welding.

As shown in FIG. 2, the probe 20 includes a bent portion 20z. The bent portion 20z is elastically deformed in the same shape and in the same posture in each probe 20.

For example, in the electrical inspection of the semiconductor wafer 14, the electrode pad 14 a lifts the tip portion 20 a of the corresponding probe 20 upward in the thickness direction Y by raising the clamp 12. Then, by pushing up, the tip end portion 20 a of the probe 20 moves linearly in the thickness direction Y under the guidance of the guide hole 30 a of the guide portion 30.

In addition, the base end portion 20b of the probe 20 is prevented from moving by the probe substrate 16. Therefore, as the front end portion 20a of the probe 20 is pushed up, the curved portion 20z of the probe 20 is bowed in a right angle direction. X is largely elastically deformed in one direction.

The tip end portion 20 a of each probe 20 is pressed against the corresponding electrode pad 14 a by a moderate toughness imparted by the elasticity of the probe 20, and thus is surely connected to the electrode pad 14 a. As a result, each electrode pad 14 a is electrically connected to a tester (not shown) through a corresponding test pad 16 b of the probe substrate 16 to perform an electrical inspection of the semiconductor wafer 14.

As shown in FIG. 3, the probe 20 includes a main body portion 21. The main body portion 21 is composed of a linear metal member. The metal member may be, for example, tungsten.

The main body portion 21 is inserted into a guide hole 30 a of the guide portion 30. The upper end portion of the body portion 21 in the thickness direction Y is the base end portion 20 b of the probe 20, and the lower end portion is the front end portion 20 a of the probe 20.

The locking portion 40 is fixed to the main body portion 21 of the probe 20. The locking portion 40 locks the main body portion 21 of the probe 20 inserted into the guide hole 30 a to the guide portion 30. The locking portion 40 has a wide portion wider than the diameter W1 of the guide hole 30a, and the wide portion serves as a stopper that prevents the body portion 21 from being pulled into the guide hole 30a.

The width W2 of the locking portion 40 in the right-angle direction X is larger than the diameter W1 of the right-direction X of the guide hole 30 a of the guide portion 30. In addition, as shown in FIG. 4, the locking portion 40 is formed in a cylindrical shape and has a wide portion having a width W2 throughout the entire thickness direction Y.

The locking portion 40 is formed of an elastic member. The elastic member is, for example, a rubber member. Since the locking portion 40 is made of an elastic member, when the base end portion 20b is compressed downward in the thickness direction Y by the probe substrate 16, it is compressed and deformed in the thickness direction Y. Moreover, if an elastic member is a member which has elasticity and can be compressively deformed, it is not limited to a rubber member, and other members may be applied.

    <Manufacturing method of probe and locking part>    

Next, a method for manufacturing the probe 20 and the locking portion 40 according to the first embodiment of the present invention will be described. The manufacturing method includes a preparation process, an insertion process, a filling process, and a forming process. 5 (a) to (d) are conceptual diagrams for explaining a method of manufacturing the probe 20 and the locking portion 40.

First, during the preparation process, as shown in FIG. 5 (a), a mold 200 is prepared. The mold 200 includes a hole 210 in which the main body portion 21 of the probe 20 is arranged, and a formation chamber 220 connected to the hole 210 and forming the locking portion 40. In order to easily take out the completed probe 20, it is preferable that a release material is formed on the inner surfaces of the hole 210 and the formation chamber 220.

Next, in the insertion process, as shown in FIG. 5 (b), the main body portion 21 is inserted into the hole 210 of the mold 200.

Next, during the filling process, as shown in FIG. 5 (c), the forming chamber 220 is filled with a liquid elastic member 40 w. For example, a liquid rubber member is filled. After filling, wait until the elastic member 40w is sufficiently hardened.

Then, in the forming process, as shown in FIG. 5 (d), a part of the hardened elastic member is removed, and the locking portion 40 having an adjusted length is formed. In the method for removing a part of the elastic member, the elastic member may be burned by irradiating a laser, or the elastic member may be dissolved by a chemical solution.

    <Effect of Implementation Mode 1 of the Present Invention>    

Next, effects of the electrical connection device 1 according to the first embodiment of the present invention will be described.

Here, FIG. 6 is a partially enlarged sectional view schematically showing a part of a conventional electrical connection device. In the conventional technology, the locking portion 140 of the probe 120 adopts a method of thickening a part of the body part 121 by melting, a method of feeding a part of the body part 121 and thickening it, and the like.

Therefore, depending on the length of the locking portion 140 in the thickness direction Y (crimping direction), the protruding length from the guide portion 30 to the base end portion 120 b of the probe 120 may vary.

For example, as shown in FIG. 6, the plurality of probes 120 includes a probe 120 having a protruding length L1 (hereinafter referred to as a right probe 120), and a probe having a longer protruding length L2 than the protruding length L1. Probe 120 (hereinafter referred to as left probe 120).

Accordingly, as shown by an arrow 50a in FIG. 6, when the guide portion 30 is pressed against the probe substrate 16, and the base end portions 120 b of the right and left probes 120 are crimped to the connection pad 16 c of the probe substrate 16. Since the load of the base end portion 120b of the left probe 120 is concentrated, it is strongly crimped. Therefore, the connection pad 16c of the probe substrate 16 may be distorted, cracked, or the like, and the connection between the left probe 120 and the probe substrate 16 may be poor.

In addition, the distance between the right-side probe 120 series guide 30 and the probe substrate 16 having the extended length L1 shorter than the extended length L2 is limited by the extended length L2 probe, so that a sufficient crimping state cannot be secured. , May cause a poor electrical connection between the right probe 120 and the probe substrate 16.

On the other hand, (a) and (b) of FIG. 7 are partially enlarged sectional views schematically showing a part of the electrical connection device according to the first embodiment of the present invention. In the electrical connection device 1 according to the embodiment 1 of the present invention, the locking portion 40 fixed to the main body portion 21 of the probe 20 is made of an elastic member.

Therefore, as shown in FIG. 7 (a), the plurality of probes 20 include a probe with an extension length of L1 (hereinafter referred to as the right probe 20) and a probe with an extension length of L2 (hereinafter referred to as the probe 20) (Left probe 20), as shown by arrow 50a in FIG. 7 (a), when the guide portion 30 is pressed against the probe substrate 16, it is fixed to the body portion 21 of the probe 20 extending by the length L2. The locking portion 40 having a length of Ha is compressively deformed in the thickness direction Y.

In addition, as shown in FIG. 7 (b), the length Ha of the locking portion 40 is reduced to a length Hb, and the base end portion 20b of the left probe 20 having the locking portion 40 extended by the length L2 is oriented in the thickness direction Y. Is pressed down. Thereby, the extension length of each probe 20 from the guide part 30 to the base end part 20b of the probe 20 is easily averaged to the extension length L1.

As described above, in the electrical connection device 1 according to the embodiment 1 of the present invention, since the base end portion 20b of each probe 20 can be satisfactorily crimped to the connection pad 16c of the probe substrate 16, the crimped state can be maintained. Prevents poor electrical connection between the probe 20 and the probe substrate 16.

    (Modification)    

Next, a configuration of an electrical connection device 1 according to a modification of the embodiment 1 of the present invention will be described. FIG. 8 is a partially enlarged sectional view showing a part of the electrical connection device 1 according to a modification of the embodiment 1 of the present invention.

Here, in Embodiment 1 of the present invention described above, the case where the locking portion 40 is a cylindrical shape having a fixed width W2 will be described as an example.

In a modification of the embodiment 1 of the present invention, the width W3 of the end portion 40b on the side of the guide hole 30a of the locking portion 40 is smaller than the diameter W1 of the guide hole 30a, and the width W2 of the end portion 40a on the probe substrate 16 side is greater than The shape of the diameter W1 of the guide hole 30a. That is, the locking portion 40 has a tapered shape at the tip.

Specifically, as shown in FIG. 8, the locking portion 40 is formed in a conical trapezoid shape with the main body portion 21 extending in the thickness direction Y as a central axis. As shown in FIG. 8, the locking portion 40 is formed in a trapezoidal shape in a cross section along the right-angle direction X and the thickness direction Y.

The width W3 of the end portion 40b of the locking portion 40 is set to be smaller than the diameter W1 of the guide hole 30a. On the other hand, the width W2 of the end portion 40a above the thickness direction Y of the locking portion 40 is set to be larger than the diameter W1 of the guide hole 30a. That is, the locking portion 40 has a wide portion that is wider than the diameter W1 of the guide hole 30a at least at the end portion 40a above the thickness direction Y.

As described above, in the electrical connection device 1 according to the modification of the embodiment 1 of the present invention, the width W3 of the end portion 40b on the side of the guide hole 30a of the locking portion 40 is smaller than the diameter W1 of the guide hole 30a, and the probe substrate The width W2 of the end portion 40a on the 16 side is larger than the diameter W1 of the guide hole 30a.

Thereby, when the guide portion 30 is pressed against the probe substrate 16 and the base end portion 120b of the probe 120 is crimped to the connection pad 16c of the probe substrate 16, the end portion 40b of the locking portion 40 is easily fitted into the guide. The guide hole 30a of the part 30.

Here, when the base end portion 20b of the probe 20 is crimped to the connection pad 16c of the probe substrate 16, the probe with a longer extension length is compared to the probe with a longer extension length than the base end portion 20b of the probe 20 with a shorter extension length. Since the base end portion 20b of the needle 20 is strongly crimped, the locking portion 40 is more compressed and deformed, and is easily fitted into the guide hole 30a. Therefore, since the base end portion 20b of the probe 20 having a longer extension length is pressed deeper downward in the thickness direction Y, the extension length of each probe 20 is easily averaged.

Therefore, the plurality of probes 20 can maintain the crimped state of the base end portion 20b of each probe 20 to the connection pad 16c of the probe substrate 16 with good pressure, so that the probes 20 and probes can be more prevented. The electrical connection of the pin substrate 16 is poor.

In addition, since the locking portion 40 is easily fitted into the guide hole 30a, even if the shape of the locking portion 40 is slightly uneven, the extended length of each probe 20 can be averaged. Therefore, the probe 20 to which the locking portion 40 is mounted can be easily manufactured and productivity can be improved.

In FIG. 8, the locking portion 40 is exemplified in the case of a conical trapezoid, but the invention is not limited to this. For example, the locking portion 40 may be formed in a conical shape. That is, the locking portion 40 may be triangular in cross section along the right-angle direction X and the thickness direction Y.

    [Other embodiments of the present invention]    

The present invention has been described in detail by using the above-mentioned embodiments, but it is obvious to those skilled in the art that the present invention is not limited to the embodiments described in this specification.

For example, in the above-mentioned embodiment, as shown in FIG. 4, although the shape of the locking portion 40 has been described as an example of a cylindrical shape, it may be a polygonal column shape, for example, a quadrangular column shape or a hexagonal column shape. Wait. As described above, if the wide portion is wider than the diameter W1 of the guide hole 30a, the shape of the locking portion 40 can be applied to various shapes.

In addition, in the above-mentioned embodiment, the electrical connection device 1 is described by taking an example of a vertical action type probe card, but it is not limited to this, and can also be applied to a probe card having various needle shapes.

In addition, although the case where the probe 20 includes the bent portion 20z has been described in the above embodiment, the probe 20 need not necessarily include the bent portion 20z.

In this way, the present invention is not limited to the disclosed original appearance of the above-mentioned embodiment, but can be changed and embodied in the scope of the implementation without changing the scope of the gist. In addition, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above-mentioned embodiments. For example, some elements may be deleted from all the constituent elements shown in the implementation form.

Claims (8)

An electrical connection device includes: a probe substrate; a probe having a linear body portion whose front end portion is in contact with an object to be inspected and a base end portion is in contact with the probe substrate; and a board. The guide portion is arranged on the probe side of the probe substrate, and has a guide hole through which the probe is inserted between the front end portion and the base end portion. The electrical connection device is provided with a lock. The main body portion inserted into the guide hole is locked to the guide portion; a bent portion is provided between the front end portion of the probe and the base end portion; the front end portion and the base end portion are located between Positions in a right-angle direction perpendicular to the thickness direction of the probe substrate are different; the locking portion is composed of an elastic member having a wide portion wider than a diameter of the guide hole. The electrical connection device according to item 1 of the patent application scope, wherein the locking portion is formed such that a width of an end portion on the side of the inspection object is smaller than a diameter of the guide hole, and an end portion on the probe substrate side. A shape having a width larger than the diameter of the aforementioned guide hole. A probe support includes: a probe having a linear body portion whose front end portion is in contact with an object to be inspected and a base end portion is in contact with a probe substrate; and a plate-shaped guide portion, The probe support system is provided on the subject side of the probe substrate, and has a guide hole through which the probe is inserted between the front end portion and the base end portion; the probe support system includes a locking portion for inserting the probe to The body portion of the guide hole is locked to the guide portion; a bent portion is provided between the front end portion of the probe and the base end portion; the front end portion and the base end portion are perpendicular to the probe substrate. The positions in the right-angle direction in the thickness direction are different; the locking portion is formed of an elastic member having a wide portion wider than the diameter of the guide hole. A method for manufacturing a probe with a locking portion, wherein the probe forms a locking portion in a probe support provided with a linear probe, a plate-shaped guide portion, and a locking portion, wherein: The front end portion of the probe system is in contact with the object to be inspected, and the base end portion is in contact with the probe substrate; the plate-shaped guide portion is disposed on the object side of the probe substrate, A guide hole through which the probe is inserted between the base end portions; the locking portion is formed of an elastic member, and the probe inserted through the guide hole is locked on the guide portion; the manufacturing method includes: preparing a process In order to prepare a mold, the mold is provided with a hole for arranging the probe, and a formation chamber connected to the hole and for forming the locking portion, and at least a part of the formation chamber is formed more than the guide hole The diameter is wider so that the locking part forms a wider part than the diameter of the guide hole; the insertion process is to insert the probe into the hole; the filling process is to fill the liquid-like elasticity in the forming chamber. Component and Hardening; and a forming process, removing a portion of the elastic member has hardened, the formed into the engaging portion. The method for manufacturing a probe with a locking portion according to item 4 of the scope of patent application, wherein the locking portion is formed such that a width of an end portion on a side of the guide hole is smaller than a diameter of the guide hole, and the probe is The width of the end portion on the substrate side is larger than the diameter of the guide hole. The method for manufacturing a probe with a locking portion according to item 4 of the scope of patent application, wherein a release material is formed on an inner surface of at least one of the hole of the mold and the formation chamber. According to the method for manufacturing a probe with a locking portion according to item 4 of the scope of patent application, in the forming process, a part of the elastic member is removed by burning the elastic member by irradiating a laser. According to the method for manufacturing a probe with a locking portion according to item 4 of the scope of patent application, in the forming process, the elastic member is dissolved with a chemical solution to remove a part of the elastic member.