TWI638415B - A detection method of wafer shipping box and detection system of wafer shipping box - Google Patents

Abstract

A wafer box detection method includes the following steps: a detection step: using a plurality of detection modules to detect a predetermined position, and using a processing module to convert the detection results of the plurality of detection modules into a plurality of detection values; Two adjacent detection modules have overlapping detection areas. Judgment step: the processing module judges whether an auxiliary member is provided at a predetermined position of the wafer box according to a plurality of detection values; when the processing module judges that more than half of the detection values fall within the first predetermined value interval, the processing module Then, it is determined that the predetermined position of the wafer cassette is provided with an auxiliary member; when the processing module determines that more than half of the detection value falls within the second predetermined value interval, the processing module determines that the predetermined position of the wafer cassette is not provided with the auxiliary member.

Description

Wafer box detection method and wafer box detection system

The invention relates to a detection method and a detection system, in particular to a detection method and a detection system for a wafer box for detecting whether an auxiliary member is provided outside the wafer box.

Wafers need to be moved between different production stations during the production process. Therefore, the wafers are often set in a wafer cassette to facilitate the transportation of the wafers to a specific production station. In order to facilitate the transportation of wafer cassettes or the operation of wafer cassettes by related personnel, relevant manufacturers will provide detachable auxiliary components (such as handle structures or related snap-in structures, etc.) on the outside of the wafer cassettes. This is convenient for the relevant robotic arm or personnel in a specific production station. Therefore, it has become an important issue to accurately determine whether an auxiliary member should be provided at a predetermined position on the wafer cassette in various cases of wafer cassette transportation. In practical applications, most of the determination of the auxiliary components on the wafer cassette is performed manually, which is prone to omissions.

For this reason, the present inventors have devoted themselves to the study and cooperated with the application of the scientific principles, and have proposed a reasonable design and effective improvement of the present invention.

The main purpose of the present invention is to provide a wafer cassette inspection method and a wafer cassette inspection system, which are used to improve whether the predetermined position of the wafer cassette is provided with an auxiliary member in a manual manner in the prior art, which is easy There is a problem of omission.

In order to achieve the above object, the present invention provides a wafer cassette inspection method, which is used to inspect at least a predetermined position of a wafer cassette, and the predetermined position is used to provide an auxiliary member. The wafer cassette inspection method includes the following steps : A detection step: use a plurality of detection modules to detect the predetermined position, and use a processing module to convert the detection results of the plurality of detection modules into a plurality of detection values; wherein, two detection modules arranged adjacent to each other The detection range of the group overlaps with each other. A judging step: judging whether the auxiliary position is provided at the predetermined position of the wafer box by the processing module according to a plurality of detection values; wherein, when the processing module judges that more than half of the detection values fall within a first predetermined value interval , The processing module determines that the auxiliary component is provided at the predetermined position; when the processing module determines that more than half of the detection value falls within a second predetermined value interval, the processing module determines that the auxiliary component is not provided at the predetermined position.

In order to achieve the above object, the present invention also provides a wafer box inspection system, which is used to detect at least one predetermined position of a wafer box, and the predetermined position is used to provide an auxiliary member. The wafer box detection system includes: A carrier, multiple detection modules and a processing module. The stage is used to carry the wafer box. A plurality of detection modules can respectively detect predetermined positions, and the detection ranges of two detection modules arranged adjacent to each other overlap with each other. The processing module is electrically connected to multiple detection modules, and the processing module can convert the detection results of the multiple detection modules into multiple detection values, and the processing module can determine the wafer box's Whether the predetermined position is provided with an auxiliary member. When the processing module determines that more than half of the detection value falls within a first predetermined value interval, the processing module correspondingly determines that a predetermined position of the wafer cassette is provided with an auxiliary member; when the processing module determines that more than half of the detection value falls During a second predetermined value interval, the processing module correspondingly determines that no auxiliary member is provided at the predetermined position of the wafer cassette.

In order to achieve the above object, the present invention also provides a wafer cassette detection method, which is used to detect at least a predetermined position of a wafer cassette, and the predetermined position is used to provide an auxiliary member. The wafer cassette detection method includes the following Step: Provide An inspection system of the wafer cassette contained in the foregoing; using a processing module to control a plurality of inspection modules to inspect a predetermined position, and using the processing module to convert the inspection results of the plurality of inspection modules into a plurality of inspection values; The processing module determines whether a predetermined position of the wafer cassette is provided with an auxiliary member according to a plurality of detection values; wherein, when the processing module determines that more than half of the detection values fall within a first predetermined value interval, the processing module determines An auxiliary member is provided at the predetermined position; when the processing module determines that more than half of the detection value falls within a second predetermined value interval, the processing module determines that the auxiliary member is not provided at the predetermined position.

The beneficial effect of the present invention may be that the wafer cassette detection system and the wafer cassette detection method of the present invention can accurately determine whether an auxiliary member is provided at a predetermined position of the wafer cassette, even if a small number of detection modules cannot When the inspection is performed correctly, the wafer cassette inspection system and the wafer cassette inspection method of the present invention can still accurately determine whether the predetermined position of the wafer cassette is provided with an auxiliary member.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and explanation only, and are not intended to limit the present invention.

1‧‧‧ Wafer box inspection system

10‧‧‧ stage

101‧‧‧Surface

20‧‧‧Support structure

201‧‧‧Top structure

2011‧‧‧The first horizontal structure

2012‧‧‧Second horizontal structure

2013‧‧‧Longitudinal structure

202‧‧‧Column structure

30‧‧‧Detection module

301‧‧‧detection signal

31‧‧‧Receiving unit

32‧‧‧ Launch unit

40‧‧‧ auxiliary detection module

401‧‧‧detection signal

50‧‧‧Processing module

501‧‧‧Detection value

502‧‧‧Initial value

60‧‧‧ Information Acquisition Module

601‧‧‧ reservation information

70‧‧‧Storage unit

701‧‧‧Prestored information

7011‧‧‧ First value

7012‧‧‧second value

B‧‧‧wafer box

B1, B2, B3, B1 ’, B1” ‧‧‧‧ auxiliary components

B4‧‧‧ Information storage unit

B41‧‧‧ reservation information

P1‧‧‧ Pre-position on the right

P2‧‧‧ Pre-position on the left

P3‧‧‧Predetermined position on the top

R1, R2, R3 ‧‧‧ detection range

S10, S1, S2 ‧‧‧ process steps

1 and 2 are schematic diagrams of the inspection system of the wafer cassette of the present invention.

FIG. 3 is a partial top view of the wafer cassette inspection system of the present invention.

4A, 4B, and 4C are schematic diagrams of the wafer box provided with different auxiliary members.

Fig. 5 is a top view of Fig. 1.

Fig. 6 is a side view of Fig. 1.

7 is a block diagram of the wafer cassette inspection system of the present invention.

FIG. 8 is a schematic diagram of another embodiment of the wafer cassette inspection system of the present invention.

FIG. 9 is a schematic flowchart of the wafer cassette inspection method of the present invention.

FIG. 10 is another schematic flow chart of the wafer cassette inspection method of the present invention.

The following is a specific specific example to illustrate the implementation of the wafer cassette inspection method and wafer cassette inspection system of the present invention. Those skilled in the art can easily understand other advantages and advantages of the present invention from the contents disclosed in this specification efficacy. The present invention can also be implemented or applied by other different specific examples. Various details in this specification can also be based on different views and applications, and various modifications and changes can be made without departing from the spirit of the present invention. In addition, the drawings of the present invention are only for simple description, and are not depicted according to actual sizes, that is, the actual sizes of related components are not reflected, and will be described first. The following embodiments further describe the viewpoint of the present invention in detail, but do not limit the scope of the present invention in any viewpoint.

Please refer to FIG. 1 and FIG. 2 together, which are schematic diagrams of the wafer cassette inspection system of the present invention. As shown in FIG. 1, the wafer box inspection system 1 includes a carrier 10, a support structure 20, three sets of inspection modules 30, three auxiliary inspection modules 40 and a processing module 50. The stage 10 is used to carry a wafer box B. The support structure 20 is disposed adjacent to the stage 10, and the support structure 20 may be disposed adjacent to each side of the wafer box B not in contact with the stage 10 according to requirements. The number of detection modules 30 and auxiliary detection modules 40 is not limited to the above, and can be changed according to requirements.

In practical applications, the support structure 20 may include a top structure 201 and two upright structures 202. The top structure 201 may include a first lateral structure 2011, a second lateral structure 2012, and a longitudinal structure 2013; the first lateral The structure 2011 and the second horizontal structure 2012 may be arranged substantially parallel to each other, and both ends of the vertical structure 2013 are connected to the first horizontal structure 2011 and the second horizontal structure 2012, respectively. The first lateral structure 2011 corresponds roughly to a predetermined position P1 on the right side of the wafer box B, the second lateral structure 2012 corresponds roughly to a predetermined position P2 on the left side of the wafer box B, and the vertical structure 2013 corresponds roughly to the wafer A top surface of the cartridge B is above the predetermined position P3.

The two pillar structures 202 are respectively connected to the first lateral structure 2011 and the second lateral structure 2012, and the two pillar structures 202 are not provided in the movement range when the wafer box B is operated; specifically, as shown in FIG. 1, Wafer box B is personnel or related When the mechanical device moves, its movement range is roughly in the positive X-axis direction, positive Y-axis direction, and negative Y-axis direction shown in the figure, and the two column structures 202 are preferably disposed on the negative X-axis of the stage 10 In this way, the two pillar structures 202 will not affect the movement of the wafer box B by personnel or related mechanical devices. The first horizontal structure 2011 is provided with three sets of detection modules 30, and each set of detection modules 30 is used to detect a predetermined position P1 on the right side of the wafer box B; the second horizontal structure 2012 is provided with three sets of detection modules 30, each set of detection The module 0 is used to detect the predetermined position P2 on the left side of the wafer box B; the vertical structure 2013 may be provided with three auxiliary detection modules 40 for detecting the predetermined position P3 on the top surface of the wafer box B.

The processing module 50 is electrically connected to each set of detection modules 30 and three auxiliary detection modules 40, and the processing module 50 can accordingly receive each detection module 30 and each auxiliary detection module 40 to detect a predetermined position P1 on the right side and a predetermined reservation on the left side The signals generated at the position P2 and the top surface predetermined position P3 are used to determine whether the right side predetermined position P1, the left side predetermined position P2 and the top surface predetermined position P3 are provided with auxiliary members B1, B2, B3. In practical applications, the processing module 50 may be any device or equipment that can process signals and information, such as a computer device, a microprocessor, etc., which is not limited herein. By this, through the cooperation of each group of inspection modules 30, three auxiliary inspection modules 40 and processing modules 50, the wafer cassette inspection system 1 can determine the right-side predetermined position P1 of the wafer cassette B and the left-side predetermined Whether the position P2 and the predetermined position P3 on the top surface are provided with auxiliary members B1, B2, B3. In practical applications, the plurality of inspection modules 30 and the plurality of auxiliary inspection modules 40 may inspect any side of the wafer cassette B not in contact with the stage 10 according to requirements, and are not limited to the above three predetermined Location (P1, P2, P3).

Please refer to FIG. 1 to FIG. 3 together, each group of detection modules 30 may be a member adopting the interruption detection method. For example, each group of detection modules 30 may include a receiving unit 31 and a transmitting unit 32 ; Each receiving unit 31 is a sensing element that can receive a light beam, such as various types of photo sensors (Photo Detector), and each emitting unit 32 may be, for example, a light-emitting diode or a related emitting unit that can emit laser light; Ground, each emitting unit 32 may be a light emitting diode, and its irradiation range is larger than that of laser light, therefore, the detection effect can be effectively improved. It ’s worth mentioning that To prevent each receiving unit 31 from being affected by the illumination light source of the place where the stage 10 is installed (for example, a clean room); preferably, each emitting unit 32 may be arranged on the upper surface 101 of the stage 10, and each emitting unit 32 The light beam is emitted in a direction away from the upper surface 101 of the stage 10, and the receiving surface of each receiving unit 31 faces the upper surface 101 of the stage 10. In this way, each receiving unit 31 will not directly receive the light beam emitted from the illumination light source, but will enable each detection module 30 to have a relatively better detection effect.

In different applications, the detection module 30 for detecting a predetermined position of the wafer box B may include a different number of receiving units 31 and transmitting units 32, wherein the number of receiving units 31 is greater than one Odd number. For example, the detection module 30 may include three receiving units 31 and four light emitting units 32. The three receiving units 31 may generate the detection value correspondingly according to the amount of light they receive, and the processing module may It is based on the detection values transmitted by the odd number of receiving units 31 to perform related judgment operations.

As shown in FIG. 3, the three sets of detection modules 30 for detecting the predetermined position P1 on the right side or the predetermined position P2 on the left side may be arranged side by side and arranged substantially along the X axis direction in the figure (the X axis is not shown in the figure), The detection ranges of two adjacent detection modules 30 partially overlap, that is, the detection ranges R2 of one set of detection modules 30 overlap with the detection ranges R1 and R3 of the other two sets of detection modules 30, respectively. As shown in FIGS. 4A, 4B, and 4C, the auxiliary members B1, B1 ', B1 "may be, for example, handle structures or engaging structures having various shapes, and the auxiliary members B1, B1', B1" may be It is set at a specific position of the wafer box B according to requirements.

In different applications, the arrangement of the three sets of detection modules 30 for detecting the right-side predetermined position P1 or the left-side predetermined position P2 of the wafer cassette B, respectively, can be based on different shapes of auxiliary members B1, B2 and The installation position corresponding to the wafer cassette B changes correspondingly, and is not limited to the aspect shown in the figure of this embodiment. In contrast, the number of the detection modules 30 for detecting the right-side predetermined position P1 or the left-side predetermined position P2 of the wafer box B may also be based on the appearance and installation positions of the auxiliary members B1, B2 to be detected, and Corresponding changes.

Please refer to FIG. 1, FIG. 2, FIG. 5 and FIG. 6 together. The three auxiliary detection modules 40 may be disposed on the support structure 20, and the three auxiliary detection modules 40 may be corresponding surfaces for carrying the stage 10. The upper surface 101 of the wafer cassette B. That is, when the wafer cassette B is carried on the stage 10, the three auxiliary detection modules 40 can detect the predetermined position P3 of the top surface of the wafer cassette B correspondingly. In a specific embodiment, each auxiliary detection module 40 may include any component for measuring distance, such as an ultrasonic measurement unit, whereby the processing module 50 may be based on three auxiliary detection modules 40 As a result of the measurement, it is determined whether the auxiliary position B3 is provided at the predetermined position P3 on the top surface of the wafer cassette B; for example, when the auxiliary position B3 is indeed provided at the predetermined position P3 on the top surface of the wafer cassette B, at least two The distance measured by the auxiliary detection module 40 should be smaller than the distance measured by each auxiliary detection module 40 when the auxiliary member B3 is not provided at the predetermined position P3 on the top surface of the wafer cassette B. The setting methods of the three auxiliary detection modules 40 may be changed according to actual needs, and are not limited to the methods shown in the figures. Preferably, the detection ranges of the two auxiliary detection modules 40 adjacent to each other overlap each other.

Please refer to FIG. 7, which is a block diagram of the wafer cassette inspection system of the present invention. As shown in the figure, the processing module 50 is electrically connected to a plurality of detection modules 30 and a plurality of auxiliary detection modules 40. The processing module 50 can correspondingly receive the detection signals 301 and 401 generated by detecting the corresponding positions of the wafer cassette B by the multiple detection modules 30 and the multiple auxiliary detection modules 40, and the processing module 50 can The detection signals 301 are correspondingly converted into a plurality of detection values 501.

Then, the processing module 50 can determine whether the auxiliary members B1, B2, B3 are provided on the right side predetermined position P1, the left side predetermined position P2, and the top surface predetermined position P3 of the wafer cassette B based on the plurality of detection values 501. When the processing module 50 determines that more than half of the detection value 501 falls within a first predetermined value interval, the processing module 50 determines that the predetermined positions P1, P2, P3 are provided with auxiliary members B1, B2, B3; when the processing module 50. When it is determined that more than half of the detection value 501 falls within a second predetermined value interval, the processing module 50 determines that the auxiliary members B1, B2, B3 are not provided at the predetermined positions P1, P2, P3.

Specifically, please refer to FIG. 1, FIG. 3 and FIG. 7 together, the processing module 50 After receiving three sets of detection modules 30 for detecting the predetermined position P1 on the right side to detect the predetermined position P1 on the right side, the three detection signals 301 correspondingly generated, the processing module 50 will correspondingly generate three detection values 501, and then process the module The group 50 can determine whether each detected value 501 corresponds to the first predetermined value interval or the second predetermined value interval.

If the processing module 50 determines that two or more detection values 501 fall within the first predetermined value interval, the processing module 50 may determine that the corresponding detection module 30 detects that the auxiliary member B1 is provided at the predetermined position P1 on the right side.

If the processing module 50 determines that two or more detection values 501 fall within the second predetermined value interval, the processing module 50 may determine that the corresponding detection module 30 detects that the auxiliary member B1 is not provided at the predetermined position P1 on the right side.

If the processing module 50 determines that the two or more detection values 501 do not fall within the first predetermined value interval or the second predetermined value interval, then the processing module 50 may determine that the corresponding detection module 30 has failed detection, The processing module 50 can selectively control the plurality of detection modules 30 to detect the predetermined position P1 again, that is, in practical applications, the processing module 50 can determine more than two detection values according to the needs When 501 does not fall within the first predetermined value interval or the second predetermined value interval, the processing module 50 controls the plurality of detection modules 30 to detect the predetermined position P1 again, or the processing module 30 does not check the predetermined position again P1 performs the detection, and the corresponding warning unit is controlled to prompt the user that the detection fails. If the processing module 50 determines that two of the detection values 501 fall within the first predetermined value interval and the second predetermined value interval, respectively, and the other detection value 501 does not fall within the first predetermined value interval or the second predetermined value interval, then The processing module 50 determines that the corresponding detection module 30 has a detection failure problem.

In other words, the processing module 50 determines whether a predetermined position P1 of the wafer cassette B is provided with an auxiliary member B1, mainly by using a plurality of detection modules 30 to detect the same predetermined position P1, and in more than half of the number of detection modes When all the groups 30 judge that the predetermined position P1 is provided with the auxiliary member B1, it is judged that the predetermined position P1 is provided with the auxiliary member B1; while more than half of the detection modules 30 all judge the predetermined position P1 When the auxiliary member B1 is not provided, it is determined that the predetermined position P1 is not provided with the auxiliary member B1; when no more than half of the detection modules 30 determine that the predetermined position P1 is provided or not provided with the auxiliary member B1, the detection fails . Therefore, the inspection system of the wafer cassette of the present invention can still determine whether the auxiliary member B1 is provided at the predetermined position P1 of the wafer cassette B when a small number of inspection modules 30 fail.

In a preferred application, after the processing module 50 receives the detection signal 301 transmitted by a plurality of detection modules 30 that detect the same predetermined position P1, the processing module 50 may first standardize the plurality of detection signals 301 Operation, and then convert multiple detection signals 301 into multiple detection values 501. For example, in the standardization operation, the processing module 50 may first convert a plurality of detection signals into a plurality of initial values (VX) 502, and then use a first value V1 and a second value V2 to utilize A standardized formula to convert each initial value 502 to a detected value (S) 501, the standardized formula is as follows:

The above standardized formulas are represented by symbols as follows:

Specifically, the first value may be that when a related technician does install the auxiliary member B1 at the predetermined position P1 of the wafer cassette B, the processing module 50 receives the detection signals 301 of the plurality of detection modules 30 The second value can be set by the relevant technician at the predetermined position P1 of the wafer box B without the auxiliary member B1, according to the processing module 50 receiving the detection signals 301 of the plurality of detection modules 30 set up.

When the auxiliary member B1 is indeed provided at the predetermined position P1 of the wafer cassette B, the processing module 50 converts a plurality of detection signals into a plurality of initial values (VX) 502 Then, use a standardized formula to convert each initial value (VX) 502 into a detection value (S) 501. If the detection value is 1, the first predetermined value interval can be correspondingly set to 0.8 ~ 1.2; When the auxiliary component B1 is not provided at the predetermined position P1 of B, the processing module 50 converts the multiple detection signals into multiple initial values (VX) 502, and then uses a standardized formula to convert each initial value (VX) 502 to A detection value (S) 501. If the detection value is -1, the second predetermined value interval may be correspondingly set to -1.2 ~ -0.8.

If the processing module calculates the received initial value VX through the above standardized formula, the detection value S is between -1.2 ~ -0.8, then the processing module will determine the corresponding detection module to wafer box B The detection result of the predetermined position is "the predetermined position does not have an auxiliary member". If the processing module calculates the received initial value VX through the above standardized formula and the detection value S is between 0.8 and 1.2, the processing module will determine the corresponding detection module's reservation for wafer box B The detection result of the position is "the predetermined position has an auxiliary member".

If the processing module calculates the received initial value VX through the above standardized formula, the detection value S is between -0.8 ~ 0.8, then the processing module will determine the corresponding detection module to the wafer box B The detection result of the predetermined position is "inadequate discrimination", that is, the corresponding detection module may fail to detect.

If the processing module calculates the received initial value VX through the above standardized formula and the detected value S is less than -1.2 or greater than 1.2, the processing module will determine the corresponding detection module to the wafer box B The detection result of the predetermined position is "the first value (V1) and the second value (V2) are incorrectly defined", that is, the first value (V1) and the second value (V2) in the corresponding standardized formula may be incorrectly defined. As a result, the detection module has a detection failure problem. In this state, the related technical personnel will be able to reset the first value (V1) and the second value (V2) according to the processing module 50 receiving the detection signals 301 of the plurality of detection modules 30 again.

In practical applications, the processing module 50 can also be electrically connected to an information acquisition module 60 and a storage unit 70. The information acquisition module 60 is used to acquire A predetermined information B41 stored in an information storage unit B4 of the wafer cassette B. The information storage unit B4 may be, for example, various types of electronic labels capable of storing data, chips or labels printed with barcodes, etc., which is not limited here; on the contrary, the information acquisition module 60 corresponds to any readable electronic A device with a label, chip, or label printed with a barcode, and the information acquisition module 60 is used to read the predetermined information B41 stored in the information storage unit B4 to correspondingly generate an acquisition information 601. In addition to the scheduled information B41, other related information can also be included according to requirements, such as reading time, information about the information acquisition module, etc.

The predetermined information B41 stored in the information storage unit B4 may be, for example, various data of the wafer cassette B, especially whether the predetermined positions P1, P2, P3 of the wafer cassette B should be provided with data of auxiliary members B1, B2, B3 , And the types of auxiliary members B1, B2, B3 provided at each predetermined position P1, P2, P3.

The storage unit 70 may be a data storage unit independent of the processing module 50 or integrated into the processing module 50. The storage unit 70 may store multiple pieces of pre-stored information 701, and each of the pre-stored information 701 is, for example, various types of auxiliary Components, corresponding first predetermined value interval, second predetermined value interval, first value 7011 (V1) and second value 7012 (V2), etc.

After the processing module 50 receives the acquired information 601 of the information acquisition module 60, it can correspondingly acquire whether each predetermined position P1, P2, P3 of the wafer box B should be provided with auxiliary members B1, B2, B3 and their auxiliary members B1 , B2, B3 types and other related data, and the post-processing module 50 can correspond to the storage unit 70 to find the corresponding pre-stored information 701 to use the corresponding first predetermined value interval, second predetermined value interval, the first A value 7011 (V1) and a second value 7012 (V2) are used for subsequent detection and judgment.

The multiple detection modules 30 detect the same predetermined position P1 or P2 of the wafer box B. Of the multiple detection values 501 generated by the processing module 50, if more than half of the detection values 501 do not fall within the first predetermined value In the interval or the second predetermined value interval, the processing module 50 may control the multiple detection modules 30 to restart Detection; when the processing module 50 repeatedly controls multiple detection modules 30 for detection, when the above problem still occurs. The processing module 50 controls related warning units (such as warning lights, warning sound players, etc.) to remind the user that the detection module 30 may be damaged, or may be the first predetermined value interval, the second predetermined value interval, the first A value 7011 (V1) and a second value 7012 (V2) are set incorrectly (for example, the storage unit 70 stores erroneous pre-stored information 701, the wafer storage B information storage unit B4 stores erroneous predetermined information B41, etc.). The processing module 50 is electrically connected to a plurality of auxiliary detection modules 40 to receive each auxiliary detection module 40 to detect the predetermined position P3 of the top surface of the wafer cassette B, and the corresponding detection signal 401 generated to carry out the wafer cassette B The method for determining whether the auxiliary member B3 is provided at the predetermined position P3 is the same as the aforementioned manner in which the processing module 50 and the detection module 30 cooperate with each other, and details are not described herein again.

Please refer to FIG. 8, which is a schematic diagram of another embodiment of the wafer cassette inspection system of the present invention. The following only detects the biggest difference between this embodiment and the foregoing embodiment for description. For the rest of the description, please refer to the foregoing embodiment, which will not be repeated here. As shown in FIG. 8, the biggest difference between this embodiment and the previous embodiment is that the three groups of detection modules 30 for detecting the predetermined position P1 on the right side of the wafer box B, and the three receiving units 31 included in the three groups can be The three emitting units 32 included in the three sets of detection modules 30 may be arranged side by side substantially along the Y axis direction in the figure, that is, three The receiving unit 31 and the three transmitting units 32 may be arranged side by side along two substantially perpendicular axes, thereby, the detection module 30 may have a larger detection range. Of course, in different applications, the three receiving units 31 and the three transmitting units 32 may also be arranged side by side along the Y-axis and X-axis directions, respectively, and are not limited to those shown in the figures. The numbers of the receiving unit 31 and the transmitting unit 32 are not limited to those shown in the figure, and the numbers of the receiving unit 31 and the transmitting unit 32 are not necessarily the same. The figure shows only three groups of detection modules 30, which detect the predetermined position P1 on the right side of the wafer box B, but not limited to this, the detection module 30 which detects the predetermined position P2 on the left side of the wafer box B, which The included receiving unit 31 and the transmitting unit 32 can also be arranged in the manner shown in the figure.

Please refer to FIG. 9, which is a schematic flowchart of the wafer box inspection method of the present invention. This wafer box detection method is used to detect at least one predetermined position of a wafer box, and the predetermined position is used to provide an auxiliary member (such as the aforementioned handle structure or related engagement structure, etc.). The detection method of the wafer box includes the following steps: detection step S1: using a plurality of detection modules to detect a predetermined position of the wafer box, and using a processing module to convert the detection results of the plurality of detection modules into a plurality of Detection value; wherein, two detection modules arranged adjacent to each other overlap part of the detection range; and determination step S2: determine whether the predetermined position of the wafer cassette is set based on the plurality of detection values by the processing module There are auxiliary members; wherein, when the processing module judges that more than half of the detection value falls within a first predetermined value interval, the processing module judges that the auxiliary position is provided at the predetermined position of the wafer box; when the processing module judges that it is greater than half When the above detection value falls within a second predetermined value interval, the processing module determines that no auxiliary member is provided at the predetermined position of the wafer cassette.

In practical applications, in the above determination step S2, when the processing module determines that more than half of the detection value does not fall within the first predetermined value interval or the second predetermined value interval, the processing module may determine that the detection fails, The processing module may control multiple detection modules to perform the detection step S1 again. Or, the processing module does not execute the detection step S1 again, but controls the warning unit correspondingly to warn the relevant user that the detection has failed. When the processing module repeatedly controls the detection module to perform the detection step S1, and the processing module still determines that more than half of the detection values do not fall within the first predetermined value interval or the second predetermined value interval, the processing module may determine At least one detection module may have a problem, and the post-processing module may control related warning units according to requirements to warn the user that these detection modules may have a problem.

In a preferred application, in the above detection step S1, the processing module may first detect multiple detection modules during the process of converting the detection results of multiple detection modules into multiple detection values The result is a standardized operation, and After that, multiple detection values are converted. The standardization operation is the same as the previous embodiment, and will not be repeated here.

Please refer to FIG. 10, which is a schematic flowchart of another embodiment of the wafer box inspection method of the present invention. As shown in the figure, the biggest difference between the wafer cassette inspection method of this embodiment and the wafer cassette inspection method of the previous embodiment is that before the inspection step S1 is performed, the following steps may also be included: information acquisition step S10: Using an information acquisition module, a predetermined information of the wafer box is acquired. Then, in the determining step S2, the processing module may determine whether an auxiliary member is provided at a predetermined position of the wafer cassette according to the predetermined information and the plurality of detection values. The relevant information processing methods of the information acquisition module and the processing module are the same as the embodiments of the aforementioned wafer cassette inspection system, and are not repeated here.

In particular, the embodiments of the foregoing two wafer cassette inspection methods may preferably be implemented using the foregoing wafer cassette inspection system, but not limited thereto.

The above is only a preferred and feasible embodiment of the present invention, and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention. .

Claims (14)

A wafer box detection method, which is used to detect at least a predetermined position of a wafer box, where the predetermined position is used to provide an auxiliary member, and the wafer box detection method includes the following steps: a detection step : Use a plurality of detection modules to detect the predetermined position, and use a processing module to convert the detection results of the plurality of detection modules into a plurality of detection values; wherein, two A detection module whose parts of the detection range overlap each other; and a judging step: the processing module judges whether the predetermined position of the wafer cassette is provided with the auxiliary according to a plurality of the detection values Component; wherein, when the processing module determines that more than half of the detection value falls within a first predetermined value interval, the processing module determines that the auxiliary component is provided at the predetermined position; when the When the processing module determines that more than half of the detection value falls within a second predetermined value interval, the processing module determines that the auxiliary member is not provided at the predetermined position. The method for detecting a wafer cassette according to claim 1, wherein, in the determining step, when the processing module determines that more than half of the detection value does not fall within the first predetermined value interval or In the second predetermined value interval, the processing module determines that the detection fails, and the processing module selectively controls a plurality of detection modules to perform the detection step again. The method for inspecting a wafer cassette according to claim 1, wherein in the inspection step, after the plurality of inspection modules inspect the predetermined position, a plurality of inspection signals will be generated correspondingly, and the processing module receives After a plurality of the detection signals, the plurality of the detection signals can be subjected to a standardized operation to convert the plurality of detection signals into a plurality of the detection values. The method for inspecting a wafer cassette according to claim 3, wherein in the standardization operation, the processing module first converts a plurality of the inspection signals into a plurality of initial values, and then The numerical value and a second numerical value, and using a standardized formula to convert the initial numerical value to the detected numerical value, the standardized formula is as follows:

The method for inspecting a wafer cassette according to claim 1, further comprising an information acquisition step before the inspection step: using an information acquisition module to acquire predetermined information of the wafer cassette; In the judging step, the processing module judges whether the auxiliary member is provided at the predetermined position of the wafer cassette according to the predetermined information and the plurality of detection values. A wafer box detection system for detecting at least one predetermined position of a wafer box, where the predetermined position is used to provide an auxiliary member, the wafer box detection system includes: a carrier, which Used to carry the wafer box; a plurality of detection modules, which can respectively detect the predetermined position, and the detection ranges of the two detection modules arranged adjacent to each other overlap each other; a process A module, which is electrically connected to a plurality of the detection modules, and the processing module can convert the detection results of the plurality of detection modules into a plurality of detection values, and the processing module can be based on a plurality of The detection value to determine whether the predetermined position of the wafer box is provided with the auxiliary member; wherein, when the processing module determines that more than half of the detection value falls within a first predetermined value During the interval, the processing module correspondingly determines that the auxiliary member is provided at the predetermined position of the wafer box; when the processing module determines that more than half of the detection value falls within a second predetermined value Interval Said processing module is determined corresponding to the predetermined position of the wafer cassette of the auxiliary member is not provided. The wafer cassette inspection system according to claim 6, wherein when the processing module determines that more than half of the inspection value does not fall within the first predetermined value interval or the second predetermined value interval , The processing module determines that at least one of the detection modules fails to detect, and the processing module selectively controls a plurality of the detection modules to detect the predetermined position again. The wafer box inspection system according to claim 6, wherein the wafer box inspection system further includes a plurality of auxiliary inspection modules, and each of the auxiliary inspection modules is electrically connected to the processing module, Each of the auxiliary detection modules can detect another predetermined position of the wafer box; the processing module can determine another predetermined position of the wafer box according to the detection result of each of the auxiliary detection modules Whether the position is provided with the auxiliary member. The wafer cassette inspection system according to claim 8, wherein the wafer cassette inspection system further includes an information acquisition module that can acquire predetermined information of the wafer cassette and correspondingly generate an acquisition Information, the information acquisition module is electrically connected to the processing module, the processing module can accept the acquired information, and detect the predetermined position based on the acquired information and a plurality of the detection modules As a result, it is judged whether the auxiliary member is provided at the predetermined position. The wafer box inspection system according to claim 9, wherein the processing module can search for multiple pieces of pre-stored information stored in a storage unit according to the acquired information, and the processing module can check one of the The pre-stored information and the detection results of the predetermined positions by the plurality of detection modules determine whether the auxiliary member is provided at the predetermined position. The wafer box inspection system according to claim 6, wherein a plurality of the inspection modules will generate a plurality of inspection signals correspondingly after detecting the predetermined position, and the processing module after receiving the plurality of inspection signals , A plurality of the detection signals can be standardized, so that the plurality of detection signals can be converted into a plurality of detection values. The wafer box inspection system according to claim 11, wherein, in the standardization operation, the processing module first converts a plurality of the inspection signals into a plurality of initial values, and then Value and a second value, and using a standardized formula to convert the initial value to the detection value, the standardized formula is as follows

The inspection system for a wafer cassette according to claim 6, wherein each of the inspection modules includes a plurality of transmitting units and a plurality of receiving units, the plurality of transmitting units is disposed on the stage, the plurality of the The receiving units are correspondingly located above the predetermined position, and a plurality of the receiving units are used to receive the light beams emitted by the plurality of transmitting units; wherein, the plurality of the transmitting units are arranged side by side along an axis, and the plurality of the The receiving units are arranged side by side at a distance from each other along another axis. A wafer box detection method is used to detect at least a predetermined position of a wafer box, and the predetermined position is used to provide an auxiliary member. The wafer box detection method includes the following steps: providing a method such as The inspection system of the wafer box contained in claim 7; using the processing module to control a plurality of the inspection modules to inspect the predetermined position, and using the processing module to convert the plurality of inspection modules The detection result is converted into a plurality of detection values; and the processing module determines whether the auxiliary member is provided at the predetermined position of the wafer cassette according to the plurality of detection values; wherein, when the processing When the module determines that more than half of the detection value falls within a first predetermined value interval, the processing module determines that the auxiliary member is provided at the predetermined position; when the processing module determines that more than half When the detection value falls within a second predetermined value interval, the processing module determines that the auxiliary member is not provided at the predetermined position.