TWI634676B - Support structure, illuminating device using same and processing method thereof - Google Patents

Abstract

A support structure includes a first bracket, a second bracket and a body. The first bracket contains a metallic material. The second bracket includes a metal material, wherein the first bracket and the second bracket are electrically insulated from each other. The body comprises a non-metallic material and covers the first bracket and the second bracket. The body includes a first opening and a first through hole. A portion of the first bracket and a portion of the second bracket are commonly exposed from the first opening, and another portion of the first bracket is exposed from the first through hole, wherein the first opening and the first through hole are transmitted through the body and the first bracket At least one first air gap therebetween is in communication with each other.

Description

Support structure, illuminating device using the same, and processing thereof method

The present invention relates to a support structure, a light-emitting device using the same, and a method of processing the same.

In recent years, light-emitting diodes (LEDs) have been widely used in general lighting and commercial lighting applications. When used as a light source, the light-emitting diode has many advantages, such as lower energy consumption, longer life, smaller size and faster switching. Therefore, the light-emitting diode has gradually replaced the incandescent light source as a light source and assembled for use in different products. When the light-emitting diode is assembled, it is first placed in the support structure, and then the encapsulant is filled. In this regard, the bonding relationship between the support structure, the light-emitting diode, and the encapsulant will affect the yield and performance of the product.

An embodiment of the present invention provides a support structure including a bracket, a second bracket and a body. The first bracket contains a metallic material. The second bracket includes a metal material, wherein the first bracket and the second bracket are electrically insulated from each other. The body comprises a non-metallic material and covers the first bracket and the second bracket. The body includes a first opening and a first through hole. A portion of the first bracket and a portion of the second bracket are commonly exposed from the first opening, and another portion of the first bracket is exposed from the first through hole, wherein the first opening and the first through hole are transmitted through the body and the first bracket At least one first air gap therebetween is in communication with each other.

One embodiment of the present invention provides a light emitting device including a support structure, a light emitting element, and an encapsulant. The illuminating element is disposed in the first opening and includes a first electrode and a second electrode, wherein the first electrode and the second electrode are electrically connected to the first bracket and the second bracket, respectively. The encapsulant is disposed in the first opening and covers the light emitting component.

One embodiment of the present invention provides a method of processing a support structure comprising the following steps. An opening is formed in the non-metallic substrate of the support structure to expose a portion of the metal substrate of the support structure. Forming a through hole in the non-metal substrate of the support structure to expose another portion of the metal substrate of the support structure, wherein the opening and the through hole communicate with each other through at least one air gap existing between the non-metal substrate and the metal substrate .

100A, 100B, 100C, 100D‧‧‧ support structure

110‧‧‧First bracket

112‧‧‧second bracket

114A, 114B, 114C, 114D, 114E, 114F‧‧‧ bracket

116‧‧‧First groove

118‧‧‧Second trench

120‧‧‧ body

122‧‧‧ first opening

124‧‧‧second opening

126‧‧‧ third opening

128‧‧‧First through hole

130‧‧‧Second through hole

132‧‧‧Isolation Department

200‧‧‧Lighting device

210‧‧‧Lighting elements

212‧‧‧First electrode

214‧‧‧second electrode

220‧‧‧Package

1-1’, 2-2’‧‧‧ segments

D1‧‧ Direction

G1‧‧‧First air gap

G2‧‧‧Second air gap

S1‧‧‧ first upper surface

S2‧‧‧ first lower surface

S3‧‧‧Second upper surface

S4‧‧‧Second lower surface

S5‧‧‧ third upper surface

S6‧‧‧ third lower surface

FIG. 1A is a perspective view showing a support structure according to a first embodiment of the present disclosure.

FIG. 1B is a top plan view showing the support structure of FIG. 1A.

Fig. 1C is a schematic cross-sectional view showing a line segment 1-1' of Fig. 1B.

FIG. 1D is a schematic bottom view showing the support structure of FIG. 1A.

FIG. 1E is a schematic bottom view showing a support structure according to some embodiments of the disclosure.

Fig. 1F is a schematic cross-sectional view showing a light-emitting device formed using the support structure of Fig. 1A.

FIG. 2A is a schematic top view showing the support structure according to the second embodiment of the disclosure.

Fig. 2B is a schematic cross-sectional view showing the line segment 2-2' of Fig. 2A.

FIG. 3A is a top view showing the support structure according to the third embodiment of the disclosure.

FIG. 3B is a perspective view showing the first bracket of FIG. 3A.

FIG. 3C is a front elevational view showing the first bracket viewed in the direction D1 of FIG. 3B.

4 is a top plan view showing a support structure according to a fourth embodiment of the present disclosure.

The embodiments of the present invention are disclosed in the following drawings, and the details of However, it should be understood that these practical details are not intended to limit the invention. That is, in some embodiments of the invention, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.

The words "first, second, third, etc." are used herein to describe various elements, components, regions, and layers. However, these elements, components, regions, and layers should not be limited by these terms. These terms are used to identify a single element, component, region, or layer. Thus, a singular element, component, region, or layer may be hereinafter referred to as a second element, component, region, layer, without departing from the spirit of the invention.

1A, 1B, 1C, and 1D, wherein FIG. 1A is a perspective view showing a support structure 100A according to the first embodiment of the present disclosure, and FIG. 1B is a first FIG. FIG. 1C is a schematic cross-sectional view of the line segment 1-1' of FIG. 1B. The supporting structure 100A includes a first bracket 110, a second bracket 112 and a body 120, and the supporting structure 100A can be used as a supporting structure of an electronic component (not shown), wherein the electronic component can be, for example, a light emitting diode chip or a light emitting diode. Polar body component.

The first bracket 110 and the second bracket 112 comprise a metal material, and the first bracket 110 and the second bracket 112 are electrically insulated from each other. For example, the first bracket 110 and the second bracket 112 may be made of metal, or the first bracket 110 and the second bracket 112 may be made of the same or different metal materials, such as copper, copper alloy, Brass or iron.

The body 120 includes a non-metallic material such as, for example, a PPA resin, a thermosetting resin-based material (such as EMC), or a thermoplastic resin-based material (such as PCT), and covers the first holder 110 and the second holder 112. That is, the body 120 can fix the first bracket 110 and the second bracket 112 therein by restricting the movement of the first bracket 110 and the second bracket 112. That is, the body 120 is relatively first The fixed relationship between the bracket 110 and the second bracket 112 can be regarded as a structural engagement. Therefore, there may be an air gap between the body 120 and the bracket. For example, as shown in FIG. 1C, there may be a first air gap G1 between the body 120 and the first bracket 110, or the body 120 and the second bracket. There will be a second air gap G2 between 112.

The body 120 includes a first opening 122 , a second opening 124 , a third opening 126 , a first through hole 128 , and a second through hole 130 . The first opening 122 is in communication with the second opening 124 , and the first opening 122 is also in communication with the third opening 126 , wherein the second opening 124 and the third opening 126 are respectively located on opposite sides of the first opening 122 .

A portion of the first bracket 110 and a portion of the second bracket 112 are collectively exposed from the first opening 122. Specifically, as shown in FIG. 1C, the first bracket 110 wrapped in the body 120 has a first upper surface S1 and a first lower surface S2, and the second bracket 112 wrapped in the body 120 has The second upper surface S3 and the second lower surface S4, wherein the first opening 122 exposes a portion of the first upper surface S1 of the first bracket 110 and a portion of the second upper surface S3 of the second bracket 112. In addition, the first bracket 110 and the second bracket 112 can be electrically isolated by a portion of the body 120. For example, as shown in the first opening 122 of the body 120 of FIG. 1C, the first bracket 110 and the second bracket 112 can be The isolation portion 132 of the body 120 is electrically isolated.

On the other hand, the first bracket 110 can extend from the interior of the body 120 to the outside of the body 120 through the second opening 124, and the second bracket 112 can extend from the interior of the body 120 to the outside of the body 120 through the third opening 126, wherein The first bracket 110 and the second bracket 112 extending toward the outside of the body 120 can be returned to the bottom of the body 120 by bending, as shown in FIG. 1C and FIG. 1D. FIG. 1D is a schematic bottom view showing the support structure 100A of FIG. 1A.

In addition, the brackets may also be arranged in an array, as shown in FIG. 1E, wherein FIG. 1E is a schematic view showing a support structure according to a part of the embodiment of the disclosure. In FIG. 1E, six brackets 114A, 114B, 114C, 114D, 114E, and 114F are respectively arranged in an array in the body 120, and each of the brackets 114A, 114B, 114C, 114D, 114E, and 114F is electrically insulated from each other.

Please return to Figure 1C. The first through hole 128 and the second through hole 130 of the body 120 are respectively located on the upper sides of the first bracket 110 and the second bracket 112, and respectively expose the first bracket 110 and the second bracket 112. Specifically, the body 120 has a third upper surface S5, wherein the first opening 122 can be seen to extend from the third upper surface S5 of the body 120 toward the inside of the body 120 and extend to the first bracket 110 and the second bracket 112. The first through hole 128 and the second through hole 130 also extend from the third upper surface S5 of the body 120 toward the inside of the body 120 and extend to the first bracket 110 and the second bracket 112 respectively. That is, another portion of the first upper surface S1 of the first bracket 110 may be exposed from the first through hole 128, and another portion of the second upper surface S3 of the second bracket 112 may be exposed from the second through hole 130.

The first through hole 128 can communicate with the first opening 122 through the first air gap G1 existing between the body 120 and the first bracket 110. Similarly, the second through hole 130 can also exist through the body 120. The second air gap G2 between the second bracket 112 and the first opening 122 communicate with each other. Here, the opening and the through hole that communicate through the "air gap" mean that the fluid (for example, moisture) entering from the opening can be separated from the through hole, or the fluid entering from the through hole can be opened from the opening. open. On the other hand, since the first opening 122 is in communication with the second opening 124 and the third opening 126, the first through hole 128 and the second opening 124 can also communicate with each other through the first air gap G1, and the second pass The hole 130 and the third opening 126 are also communicated with each other through the second air gap G2.

Through the above configuration, when the support structure 100A has a heating demand, the first through hole 128 and the second through hole 130 can serve as pressure relief holes of the support structure 100A. Specifically, when the support structure 100A is heated by heat during the process, the fluid (for example, moisture) existing in the air gap of the support structure 100A may evaporate and expand due to heat, and escape from the support structure 100A. At this time, the fluid existing in the air gap can escape from the support structure 100A through the first through hole 128 and the second through hole 130, thereby preventing the escaped fluid from undesirably causing damage during the process. Thereby increasing the reliability and yield of the support structure 100A in the process being performed.

For example, please refer to FIG. 1F. FIG. 1F is a schematic cross-sectional view of the light-emitting device 200 formed by using the support structure 100A of FIG. 1A, and the cross-sectional position of the first F-figure is the same as that of the first C-figure. In FIG. 1F, the light-emitting device includes the support structure 100A of FIG. 1A, the light-emitting element 210, and the encapsulant 220, wherein the light-emitting element 210 may be a light-emitting diode element. The light emitting device 210 is disposed in the first opening 122 and includes a first electrode 212 and a second electrode 214. The first electrode 212 and the second electrode 214 are electrically connected to the first bracket 110 and the second bracket 112 respectively. That is, the first bracket 110 and the second bracket 112 including the metal material can be used as the electrical connection portion of the support structure 100A, so that when an applied voltage is applied to the first bracket 110 and the second bracket 112, respectively, the light-emitting element 210 It can be turned on by this. The encapsulant 220 is disposed in the first opening 122 and is packaged The light emitting element 210 is covered, wherein the material of the encapsulant 220 may comprise an epoxy resin.

Through the above configuration, when the process related to the support structure 100A is performed (for example, when performing a surface mount technology process, if the process performed has a heating demand, the fluid existing in the air gap of the support structure 100A) (eg, moisture) may escape from the support structure 100A through the first through hole 128 and the second through hole 130 during the process, thereby preventing the escaped fluid from escaping from the first opening 122, thereby preventing such The fluid undesirably destroys the light-emitting element 210 or the encapsulant 220 in the first opening 122. For example, if the escaping fluid escapes from the first opening 122, the light-emitting element 210 and the first bracket 110 or the first The bonding between the two brackets 112 may be affected, and the color temperature or brightness of the light-emitting device 200 may be changed, or the encapsulant 220 may also form a hole and reduce the service life of the light-emitting device 200. The first through hole 128 or the second through hole 130 is provided to increase the reliability and yield of the light emitting device 200 in the manufacturing process, and further improve the service life of the light emitting device 200.

On the other hand, the support structure 100A of the present embodiment can be formed by the following steps. First, a metal-made bracket (for example, the first bracket 110 or the second bracket 112 described above) is coated with a non-metal material, and the non-metal material is solidified into the aforementioned body 120, thereby forming a support structure 100A. The metal material may be a PPA resin, a thermosetting resin-based material (such as EMC) or a thermoplastic resin-based material (such as PCT) as mentioned above. After forming the body 120, an opening (such as the aforementioned first opening 122) is formed in the body 120 to expose a portion of the bracket. Next, a through hole (for example, the aforementioned first through hole 128 or the second through hole 130) is formed in the body 120 of the support structure 100A to expose another part of the bracket The step of forming the opening and the step of forming the through hole are performed by processing the same surface of the body 120. Further, in other embodiments, the step of forming the opening and the step of forming the through hole may also be performed simultaneously. That is, the step of forming the opening and the step of forming the through hole can be regarded as being independent of each other.

2A and 2B, wherein FIG. 2A is a top view of the support structure 100B according to the second embodiment of the present disclosure, and FIG. 2B is a line 2-2 of FIG. 2A. 'The schematic diagram of the section. At least one difference between this embodiment and the first embodiment is that the first through hole 128 and the second through hole 130 of the body 120 of the present embodiment are located on the lower side of the first bracket 110 and the second bracket 112, respectively. The first through hole 128 and the second through hole 130 still expose the first bracket 110 and the second bracket 112 respectively. Specifically, the body 120 has an opposite third upper surface S5 and a third lower surface S6, wherein the first opening 122 is viewed from the third upper surface S5 of the body 120 toward the inside of the body 120 and extends to the first bracket The first through hole 128 and the second through hole 130 extend from the third lower surface S6 of the body 120 toward the inside of the body 120 and extend to the first bracket 110 and the second, respectively. Where the bracket 112 is located. That is, a portion of the first lower surface S2 of the first bracket 110 may be exposed from the first through hole 128, and a portion of the second lower surface S4 of the second bracket 112 may be exposed from the second through hole 130.

Through the configuration of the embodiment, the first through hole 128 and the second through hole 130 can still serve as a pressure relief hole of the supporting structure 100B, thereby preventing the fluid in the air gap from being unintentionally damaged due to the escape in the process. Thereby increasing the reliability and yield of the support structure 100B in the process.

On the other hand, the support structure of the present embodiment can be made in a manner It is substantially similar to the above-described production method, and at least one difference between the manufacturing method of the support structure of the present embodiment and the above-described manufacturing method is that the opening step is formed in the manufacturing method of the support structure of the present embodiment. The steps of forming the through holes are performed on opposite surfaces of the body, for example, the third upper surface S5 and the third lower surface S6 of the body 120, respectively.

3A, 3B, and 3C, wherein FIG. 3A is a top view of the support structure 100C according to the third embodiment of the disclosure, and FIG. 3B is a 3A view. A perspective view of the first bracket 110, and FIG. 3C is a front elevational view of the first bracket 110 viewed in the direction D1 of FIG. 3B. In order not to make the drawing too complicated, the first bracket 110 of the mesh bottom in FIGS. 3B and 3C is not shown. At least one difference between this embodiment and the first embodiment is that the first bracket 110 of the present embodiment has a first groove 116, and the second bracket 112 has a second groove 118, which will be the first bracket 110 The first trench 116 is illustrated by way of example.

The first groove 116 of the first bracket 110 is located on the first upper surface S1 and the first lower surface S2 of the first bracket 110 and extends from the interior of the body 120 to the outside of the body 120 through the second opening 124. In the present embodiment, the first trench 116 of the first bracket 110 is located on opposite sides of the first opening 122, that is, the first trench 116 of the first bracket 110 does not open from the first opening. 122 exposed. On the other hand, the extending direction of the first trench 116 of the first bracket 110 may be orthogonal to the first through hole 128 and the second through hole 130.

The first groove 116 of the first bracket 110 and the second groove 118 of the second bracket 112 can be used as a venting groove. For example, when there is a need for a processing process for the support structure 100C, there is a space between the bracket and the body 120. The moisture can be discharged along the first trench 116 or the second trench 118, thereby increasing the reliability and yield of the support structure 100C in the processing process. In addition, although the patterns of the first trench 116 and the second trench 118 depicted in this embodiment are presented in inverted triangles, in other embodiments, the first trench 116 and the second trench 118 The pattern can also be an inverted trapezoid, a circular arc or other recessed groove.

4 is a top view of the support structure 100D according to the fourth embodiment of the present disclosure. At least one difference between this embodiment and the third embodiment is that the first trench 116 of the first bracket 110 and the second trench 118 of the second bracket 112 of the present embodiment are exposed from the first opening 122. Through this configuration, the moisture present between the bracket and the body 120 can be further discharged along the first trench 116 or the second trench 118, thereby increasing the reliability and yield of the support structure 100D in the processing process.

Further, in the above embodiment, the through hole as the pressure relief hole is illustrated as a circular hole, however, the through hole may have other patterns. For example, in other embodiments, the through holes may also be triangular, rectangular or other polygonal in plan view. Furthermore, although the number of through holes in which the two brackets are exposed in each of the foregoing embodiments is one each, in other embodiments, the number of the through holes may be plural. For example, a single bracket can also be exposed by multiple through holes.

In summary, the support structure of the present disclosure includes a first bracket, a second bracket, and a body, wherein the body covers the first bracket and the second bracket. The first bracket and the second bracket may respectively be used as electrical connections of electronic components that are subsequently disposed on the support structure. The body includes an opening, a first through hole and a second through hole, wherein the opening is configured to make a portion of the first bracket and a portion of the second bracket together The first through hole and the second through hole are used to expose the other portion of the first bracket and the other portion of the second bracket, respectively. Through this configuration, when the support structure has a heating demand, the first through hole and the second through hole can be used as a vent hole of the support structure, so that the fluid (such as moisture) existing in the air gap of the support structure can be processed in the process. The first through hole and the second through hole escape from the support structure, thereby preventing the fluid from undesirably causing damage to the process performed, thereby increasing the reliability and yield of the support structure in the process.

While the invention has been described above in terms of various embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application attached.

Claims (18)

A support structure comprising: a first bracket comprising a metal material; a second bracket comprising a metal material, wherein the first bracket and the second bracket are electrically insulated from each other; and a body comprising a non-metallic material and including Covering the first bracket and the second bracket, wherein the body includes a first opening and a first through hole, a portion of the first bracket and a portion of the second bracket are commonly exposed from the first opening, and the first Another portion of a bracket is exposed from the first through hole, wherein the first opening and the first through hole communicate with each other through at least a first air gap existing between the body and the first bracket. The support structure of claim 1, wherein the first bracket covered in the body has a surface, the first opening exposing a portion of the surface, and the first through hole exposes the surface Another part. The support structure of claim 1, wherein the first bracket covered in the body has an upper surface and a lower surface, the first opening exposing a portion of the upper surface, and the first pass The aperture exposes a portion of the lower surface. The support structure according to claim 1, wherein the body further comprises: a second opening, wherein the first bracket extends from the interior of the body toward the outside of the body through the second opening, and the first through hole and the second opening communicate with each other through the first air gap. The support structure of claim 4, wherein the first bracket has at least one groove, and the groove extends through the second opening from an interior of the body to an exterior of the body, wherein the groove The extending direction is orthogonal to the extending direction of the first through hole. The support structure of claim 5, wherein the first bracket covered in the body has an opposite upper surface and a lower surface, the first opening exposing a portion of the upper surface, wherein the The groove is located on the upper surface and the lower surface of the first bracket. The support structure of claim 5, wherein the first bracket covered in the body has an upper surface, and the first opening exposes a portion of the upper surface, wherein the groove is located at the first The upper surface of a bracket and the first opening exposes a portion of the trench. The support structure of claim 5, wherein the groove located inside the body is covered by the body. The support structure according to claim 1, wherein the body further comprises: a second through hole, wherein another portion of the second bracket is exposed from the second through hole, and the first opening and the second through hole pass through at least a second existing between the body and the second bracket The air gaps are in communication with each other. The support structure of claim 9, wherein the second bracket covered in the body has a surface, the first opening exposing a portion of the surface, and the second through hole exposing the surface Another part. The support structure of claim 9, wherein the second bracket covered in the body has an upper surface and a lower surface, the first opening exposing a portion of the upper surface, and the second pass The aperture exposes a portion of the lower surface. The support structure of claim 9, wherein the body further comprises: a third opening, wherein the second bracket extends from the interior of the body toward the outside of the body through the third opening, and the second The through hole and the third opening communicate with each other through the second air gap. The support structure of claim 1, wherein the first through hole has a triangular, rectangular, polygonal or circular shape. A light emitting device comprising: The support structure of any one of the items 1-13, wherein a light-emitting element is disposed in the first opening and includes a first electrode and a second electrode, wherein the first electrode and the second electrode Electrically connected to the first bracket and the second bracket respectively; and an encapsulant disposed in the first opening and covering the light emitting component. A method for processing a support structure, comprising: forming an opening in a non-metal substrate of a support structure to expose a portion of a metal substrate of the support structure; and forming at least one through hole in the non-metal substrate of the support structure And another portion of the metal substrate exposing the support structure, wherein the opening and the through hole communicate with each other through at least one air gap existing between the non-metal substrate and the metal substrate. The processing method of claim 15, further comprising: coating the metal substrate with a non-metallic material and solidifying the non-metal material into the non-metal substrate before forming the opening, thereby forming the support structure. The processing method of claim 15, wherein the step of forming the opening and the step of forming the through hole are performed on the same surface of the non-metal substrate. The processing method of claim 15, wherein the step of forming the opening and the step of forming the opening are performed on an upper surface and a lower surface of the non-metal substrate, respectively.