[go: up one dir, main page]

TWI634355B - A back light module, an assembly method of the back light module, and a method for manufacturing light guide plate - Google Patents

A back light module, an assembly method of the back light module, and a method for manufacturing light guide plate Download PDF

Info

Publication number
TWI634355B
TWI634355B TW107102358A TW107102358A TWI634355B TW I634355 B TWI634355 B TW I634355B TW 107102358 A TW107102358 A TW 107102358A TW 107102358 A TW107102358 A TW 107102358A TW I634355 B TWI634355 B TW I634355B
Authority
TW
Taiwan
Prior art keywords
guide plate
light guide
light
protective film
backlight module
Prior art date
Application number
TW107102358A
Other languages
Chinese (zh)
Other versions
TW201932889A (en
Inventor
蘇東權
吳健君
玉慕凱
Original Assignee
茂林光電科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 茂林光電科技股份有限公司 filed Critical 茂林光電科技股份有限公司
Priority to TW107102358A priority Critical patent/TWI634355B/en
Application granted granted Critical
Publication of TWI634355B publication Critical patent/TWI634355B/en
Publication of TW201932889A publication Critical patent/TW201932889A/en

Links

Landscapes

  • Planar Illumination Modules (AREA)

Abstract

本發明提供一種背光模組、背光模組之組裝方法及其導光板製造方法,於組裝時,係先提供具有相互垂直鄰接之表面與入光面之一導光板,且表面覆設有一保護膜,保護膜具有透過一裁切線而鄰接設置之一保留部及一撕除部,且保留部鄰近入光面設置;接續對應入光面設置一燈條,並沿裁切線移除撕除部,使保留部留置於表面,藉此係可提升整體組裝速率並使背光模組可有效消除熱點現象。而導光板係可於保護膜覆設在表面後,再透過雷射加工於保護膜形成至少一裁切線以快速且精確地於保護膜分隔出保留部及撕除部,提升製程效率。 The invention provides a backlight module, a method for assembling the backlight module, and a method for manufacturing the light guide plate. When assembling, a light guide plate having a vertically adjacent surface and a light incident surface is first provided, and the surface is covered with a protective film , The protective film has a retaining portion and a tearing portion adjacent to each other through a cutting line, and the retaining portion is disposed adjacent to the light incident surface; then a light bar is provided corresponding to the light incident surface, and the tearing portion is removed along the cutting line, The retention part is left on the surface, thereby the overall assembly rate can be improved and the backlight module can effectively eliminate hot spots. After the protective film is covered on the surface, the light guide plate can form at least one cutting line on the protective film through laser processing to quickly and accurately separate the retaining part and the tearing part from the protective film to improve the process efficiency.

Description

背光模組、背光模組之組裝方法及其導光板製造方法 Backlight module, method for assembling backlight module and method for manufacturing light guide plate

本發明係與背光模組領域相關,尤其是一種背光模組、背光模組之組裝方法及其導光板製造方法。 The invention relates to the field of backlight modules, in particular to a backlight module, a method for assembling the backlight module, and a method for manufacturing the light guide plate.

背光模組係為一種可應用於顯示裝置內之光學產品,其係將點光源導引形成均勻之面光源,以提供顯示面板所需光線,進而達到顯示畫面之目的。 The backlight module is an optical product that can be used in a display device. It guides a point light source to form a uniform surface light source, so as to provide the light required by the display panel, and then achieve the purpose of displaying a picture.

背光模組一般係指透過導光元件,將呈點光源之光線導引形成呈面光源光線之模組產品。實際應用上,受到點光源的發光特性影響,背光模組極易產生亮暗不均的出光狀態,亦即所謂的熱點現象(Hot Spot),從而影響顯示畫面的呈現。為解決熱點現象,背光模組更可進一步組設如擴散片及稜鏡片等光學元件。擴散片又稱擴散板或擴散膜,其係皆為一板體並另設置於導光元件的出光側,擴散片主要用途在於讓導光板射出之光線分布更為均勻,減緩背光模組供予顯示面板之光線過於亮暗不均而影響畫面顯示效能的情況。然而不論是擴散片、擴散板或擴散膜,皆指獨立於導光元件而另外附加之光學元件。 The backlight module generally refers to a module product that guides the light of the point light source to form the light of the surface light source through the light guide element. In practical applications, due to the light-emitting characteristics of the point light source, the backlight module is prone to produce uneven light-out states, also known as hot spots, which affects the display of the display screen. In order to solve the hot spot phenomenon, the backlight module can be further equipped with optical elements such as diffusion sheets and prism sheets. The diffuser, also known as a diffuser plate or diffuser film, is a plate body and is additionally provided on the light exit side of the light guide element. The main purpose of the diffuser is to make the light emitted by the light guide plate more evenly distributed and slow down the backlight module supply. The light of the display panel is too uneven to affect the display performance of the screen. However, regardless of whether it is a diffuser, a diffuser plate, or a diffuser film, it refers to an optical element that is additionally added independently of the light guide element.

惟,雖於背光模組內增設如前述之光學元件,可讓背光模組具有更佳的光學調整,讓出光效果更符合應用需求,但基於生產成本考量,增設元件勢必會使成本提高,同時,亦多了設置附加光學元件之組裝步驟, 造成組裝效率下降。故如何使背光模組兼符光學效能與成本上的考量,實為相關廠商目前亟需克服的問題。 However, although the addition of optical components as described above in the backlight module can allow the backlight module to have better optical adjustment and make the light extraction effect more in line with the application requirements, based on production cost considerations, the addition of components will inevitably increase the cost. , It also has more assembly steps with additional optical components, The assembly efficiency is reduced. Therefore, how to make the backlight module meet the optical performance and cost considerations is a problem that the related manufacturers need to overcome at present.

有鑑於此,本發明人係構思一種背光模組、背光模組之組裝方法及其導光板製造方法,以期有效改善現有背光模組之缺失。 In view of this, the present inventors conceived a backlight module, a method for assembling the backlight module, and a method for manufacturing the light guide plate, in order to effectively improve the deficiency of the existing backlight module.

本發明之一目的,旨在提供一種背光模組、背光模組之組裝方法及其導光板之製造方法,係可降低材料成本,提升組裝效率,同時使背光模組於應用時可有效消除熱點現象。 An object of the present invention is to provide a backlight module, a method for assembling a backlight module, and a method for manufacturing a light guide plate, which can reduce material costs and improve assembly efficiency, while enabling the backlight module to effectively eliminate hot spots during application phenomenon.

為達上述目的,本發明於一實施方式中提出一種背光模組之組裝方法,包含以下步驟:提供一導光板,該導光板具有一表面及一入光面,且該表面與該入光面為垂直鄰接設置,該表面並覆設有一保護膜,該保護膜具有一保留部及一撕除部,該保留部及該撕除部係透過一裁切線而鄰接設置,且該保留部鄰近該入光面設置;提供一燈條,對應該入光面設置;及沿該裁切線移除該撕除部,使該保留部留置於該表面。藉此係可有效增進組裝效率,同時降低背光模組之成本,以及在後續應用上可具有更佳之出光效能。 In order to achieve the above object, the present invention provides a method for assembling a backlight module in one embodiment, which includes the following steps: providing a light guide plate, the light guide plate having a surface and a light incident surface, and the surface and the light incident surface For vertical abutment, the surface is covered with a protective film, the protective film has a retaining portion and a tearing portion, the retaining portion and the tearing portion are adjacently disposed through a cutting line, and the retaining portion is adjacent to the The light incident surface is provided; a light bar is provided corresponding to the light incident surface; and the tearing portion is removed along the cutting line to leave the retaining portion on the surface. This can effectively improve the assembly efficiency, at the same time reduce the cost of the backlight module, and can have better light output performance in subsequent applications.

本發明亦於另一實施方式中,揭示一種背光模組,其包含:一導光板,具有一表面及一入光面,且該表面與該入光面為垂直鄰接設置;一保留部,該保留部為一膜片,並貼覆於該表面且鄰近該入光面設置,其中該保留部係為一保護膜沿一裁切線移除一撕除部後之部分;及一燈條,對應該入光面設置,以相對該導光板形成側入光線;其中,該導光板與該燈條相互組裝後,該保留部留置於該表面以達消除熱點現象之功效。 The present invention also discloses a backlight module in another embodiment, which includes: a light guide plate having a surface and a light incident surface, and the surface and the light incident surface are vertically adjacent to each other; a reserved portion, the The reserved part is a film, which is attached to the surface and is arranged adjacent to the light incident surface, wherein the reserved part is a part of a protective film after removing a tearing part along a cutting line; and a light bar, right The light incident surface should be provided to form side incident light relative to the light guide plate; wherein, after the light guide plate and the light bar are assembled with each other, the retention portion is left on the surface to achieve the effect of eliminating hot spots.

基於前述二實施方式,於一實施方式中係揭示更包含組設一框架於該燈條與該導光板一側,以固定該燈條與該導光板,且該框架一端係壓合於該保留部,以加強燈條與導光板之相對固定。 Based on the foregoing two embodiments, in one embodiment, it is disclosed that a frame is further disposed on the side of the light bar and the light guide plate to fix the light bar and the light guide plate, and one end of the frame is pressed against the reserved To strengthen the relative fixing of the light bar and the light guide plate.

於另一實施方式中,該保留部表面係具有複數光學微粒,以霧化光線,增強熱點現象之消除功效。 In another embodiment, the surface of the retention portion has a plurality of optical particles to atomize light and enhance the elimination of hot spots.

此外,本發明亦於一實施方式中提出一種導光板之製造方法,包含以下步驟:提供一導光板;覆設一保護膜於該導光板之一表面;及透過雷射加工於該保護膜形成至少一裁切線,使該保護膜因應該裁切線具有至少一保留部及至少一撕除部,該保留部及該撕除部係透過該裁切線相互鄰接,藉此即可快速生產具較佳產品良率之可移除部分保護膜之導光板。 In addition, the present invention also provides a method for manufacturing a light guide plate in one embodiment, including the following steps: providing a light guide plate; covering a surface of the light guide plate with a protective film; and forming the protective film through laser processing At least one cutting line, so that the protective film has at least one retaining portion and at least one tearing portion corresponding to the cutting line, the retaining portion and the tearing portion are adjacent to each other through the cutting line, thereby making it possible to quickly produce a better The light guide plate with part of the protective film can be removed in product yield.

於另一實施方式中,係可透過雷射間隔燒熔加工以形成裁切線,是以該裁切線係由雷射加工形成之複數燒熔點所組成。 In another embodiment, the cutting line can be formed by laser interval sintering processing, and the cutting line is composed of a plurality of melting melting points formed by laser processing.

並於再一實施方式中,係揭示雷射加工形成該裁切線後,係再透過雷射切割該導光板至所需尺寸,藉此係可快速且精準地將導光板切割至指定大小,並可於同一產線實施。 In yet another embodiment, it is disclosed that after the laser processing forms the cutting line, the light guide plate is cut to the required size through the laser, by which the light guide plate can be quickly and accurately cut to a specified size, and Can be implemented on the same production line.

綜上所述,本發明所提出之背光模組、背光模組之組裝方法及其導光板製造方法,係提供了具優異出光效能且有效降低成本之產品與製造方法。透過於組裝時留置部分保護膜於導光板之結構與組裝方式,除可藉此於應用時有效消除熱點現象外,亦可有效降低產品成本,另一方面,在組裝上亦具有更佳之效率。並針對此種欲保留部分保護膜之導光板,本發明亦提出具備高生產效率及產品良率之製造方法。 In summary, the backlight module, the method for assembling the backlight module and the method for manufacturing the light guide plate provided by the present invention provide products and manufacturing methods that have excellent light output efficiency and effectively reduce costs. Through the structure and assembly method of leaving a part of the protective film on the light guide plate during assembly, in addition to effectively eliminating hot spots during application, it can also effectively reduce product costs. On the other hand, it also has better efficiency in assembly. For this kind of light guide plate that wants to retain part of the protective film, the present invention also proposes a manufacturing method with high production efficiency and product yield.

1‧‧‧背光模組 1‧‧‧Backlight module

10‧‧‧導光板 10‧‧‧Light guide plate

101‧‧‧表面 101‧‧‧Surface

102‧‧‧入光面 102‧‧‧entrance

11‧‧‧保護膜 11‧‧‧Protection film

111‧‧‧保留部 111‧‧‧Reservation Department

1111‧‧‧光學微粒 1111‧‧‧Optical particles

112‧‧‧撕除部 112‧‧‧Tear off

113‧‧‧裁切線 113‧‧‧Cut line

1131‧‧‧燒熔點 1131‧‧‧Burn melting point

12‧‧‧燈條 12‧‧‧Light bar

13‧‧‧框架 13‧‧‧Frame

10’‧‧‧導光板 10’‧‧‧Light guide plate

S01~S08‧‧‧步驟 S01 ~ S08‧‧‧Step

第1圖,為本發明第一實施方式之組裝方法步驟流程圖。 Figure 1 is a flow chart of the steps of the assembly method according to the first embodiment of the present invention.

第2A圖,為本發明第一實施方式之組裝步驟示意圖(一)。 FIG. 2A is a schematic diagram (1) of the assembly steps of the first embodiment of the present invention.

第2B圖,為本發明第一實施方式之組裝步驟示意圖(二)。 Figure 2B is a schematic diagram (2) of the assembly steps of the first embodiment of the present invention.

第2C圖,為本發明第一實施方式之組裝步驟示意圖(三)。 Figure 2C is a schematic diagram (3) of the assembly steps of the first embodiment of the present invention.

第3圖,為本發明第一實施方式之組裝後背光模組示意圖。 FIG. 3 is a schematic diagram of the assembled backlight module according to the first embodiment of the present invention.

第4圖,為本發明第二實施方式之組裝方法步驟流程圖。 FIG. 4 is a flow chart of the assembly method of the second embodiment of the present invention.

第5A圖,為本發明第二實施方式之導光板示意圖。 FIG. 5A is a schematic diagram of a light guide plate according to a second embodiment of the invention.

第5B圖,為本發明第二實施方式之組裝後背光模組示意圖。 FIG. 5B is a schematic diagram of the assembled backlight module according to the second embodiment of the present invention.

第6圖,為本發明第三實施方式之製造方法步驟流程圖。 FIG. 6 is a flowchart of steps of a manufacturing method according to a third embodiment of the present invention.

第7A圖,為本發明第三實施方式之製造步驟示意圖(一)。 FIG. 7A is a schematic diagram (1) of the manufacturing steps of the third embodiment of the present invention.

第7B圖,為本發明第三實施方式之製造步驟示意圖(二)。 FIG. 7B is a schematic diagram (2) of the manufacturing steps of the third embodiment of the present invention.

第8圖,為本發明第四實施方式之製造方法步驟流程圖。 Fig. 8 is a flowchart of steps in the manufacturing method according to the fourth embodiment of the present invention.

第9圖,為本發明第四實施方式之製造步驟示意圖。 Fig. 9 is a schematic diagram of manufacturing steps in a fourth embodiment of the present invention.

如前述,為使背光模組具有均勻之出光效能,同時又可有效降低生產成本,本發明人遂構思並提出如下各實施方式所述之技術內容,以留置部分保護膜之應用與概念,提供更佳之光學產品及組裝與製造方法。請參閱第1、2A~2C及3圖,其係為本發明第一實施方式之組裝方法步驟流程圖、各組裝步驟示意圖及組裝後背光模組示意圖。本發明係提出一種背光模組1之組裝方法,包含如下所述之步驟。 As mentioned above, in order to make the backlight module have a uniform light output efficiency, and at the same time can effectively reduce the production cost, the inventor conceived and proposed the technical content described in the following embodiments, to retain some of the application and concept of protective film, Better optical products and assembly and manufacturing methods. Please refer to FIGS. 1, 2A to 2C, and 3, which are flowcharts of assembly steps of the first embodiment of the present invention, schematic diagrams of each assembly step, and schematic diagrams of the backlight module after assembly. The present invention provides a method for assembling the backlight module 1, which includes the following steps.

首先,提供一導光板10,其中導光板10具有一表面101及一入光面102,且表面101與入光面102為垂直鄰接設置,表面101並覆設有一保護膜11。前述保護膜11具有一保留部111及一撕除部112,保留部111與撕除部112係透過一裁切線113鄰接設置,且保留部111鄰近入光面102設置(步驟S01)。其中,入光面102係供以接收光線,以使光線進入導光板10內部而被導引形成出光,較佳者,導光板10內部受到導引調整之光線係可於前述之表面101出光。並為破壞光線於導光板10內部之全反射,於導光板10之表面101或相對於該表面101之另一面,係可設置如網點狀之光學微結構(圖中未示),以利導光板10內部光線受光學微結構調整而出光,惟此已為業界之習知技術,故於此不再贅述。 First, a light guide plate 10 is provided, wherein the light guide plate 10 has a surface 101 and a light incident surface 102, and the surface 101 and the light incident surface 102 are vertically adjacent to each other, and the surface 101 is covered with a protective film 11. The protective film 11 has a retaining portion 111 and a tearing portion 112. The retaining portion 111 and the tearing portion 112 are disposed adjacent to each other through a cutting line 113, and the retaining portion 111 is disposed adjacent to the light incident surface 102 (step S01). Wherein, the light incident surface 102 is used to receive light, so that the light enters the light guide plate 10 and is guided to form light. Preferably, the light guided and adjusted inside the light guide plate 10 can emit light on the aforementioned surface 101. In order to destroy the total reflection of the light inside the light guide plate 10, on the surface 101 of the light guide plate 10 or the other surface opposite to the surface 101, optical microstructures like dots (not shown) can be provided to facilitate the light guide The light inside the optical panel 10 is adjusted by the optical microstructure to emit light, but this is a common technology in the industry, so it will not be repeated here.

接續,提供一燈條12,對應入光面102設置(步驟S02)。較佳者,燈條12可為多個LED間隔設置於電路板之結構。而後,沿裁切線113移除撕除部112,使保留部111留置於表面101(步驟S03),方可完成背光模組1之組裝。藉此,即可快速地組裝並生產背光模組1,且背光模組1係可藉由留置於導光板10之保留部111,達到消除熱點現象之功效。其中該組裝方法之步驟非侷限於本實施方式中所述之順序,例如步驟S02與步驟S03亦可相互對調,將撕除部112移除後再設置燈條12於入光面102處亦可完成組裝。 Next, a light bar 12 is provided corresponding to the light incident surface 102 (step S02). Preferably, the light bar 12 may be a structure in which a plurality of LEDs are arranged on the circuit board at intervals. Then, the tearing part 112 is removed along the cutting line 113, and the retaining part 111 is left on the surface 101 (step S03) to complete the assembly of the backlight module 1. In this way, the backlight module 1 can be quickly assembled and produced, and the backlight module 1 can achieve the effect of eliminating hot spots by leaving the reserved portion 111 of the light guide plate 10. The steps of the assembly method are not limited to the sequence described in this embodiment. For example, steps S02 and S03 can also be swapped with each other, and the strip 12 can be placed on the light-incident surface 102 after the tear-off portion 112 is removed. Complete assembly.

舉例說明,如第2A圖所示,導光板10之表面101係覆設有保護膜11,且保留部111係鄰近於入光面102設置,保留部111及撕除部112之間透過裁切線113鄰接設置。於燈條12對應設置於入光面102側後,即可沿著裁切線113將保護膜11的撕除部112移除,如第2B圖所示。接續 部分之保護膜11亦即保留部111,即留置於導光板10上,而如第2C圖所示。藉此燈條12之光線由入光面102進入導光板10後,即可藉由保留部111結構達到消除亮暗不均現象之功效。 For example, as shown in FIG. 2A, the surface 101 of the light guide plate 10 is covered with a protective film 11, and the retaining portion 111 is disposed adjacent to the light incident surface 102, and a cutting line passes between the retaining portion 111 and the tearing portion 112 113 adjacency settings. After the light bar 12 is correspondingly disposed on the light incident surface 102 side, the tearing portion 112 of the protective film 11 can be removed along the cutting line 113, as shown in FIG. 2B. Splice A part of the protective film 11 that is the retention portion 111 is left on the light guide plate 10 as shown in FIG. 2C. Therefore, after the light from the light bar 12 enters the light guide plate 10 from the light incident surface 102, the effect of eliminating uneven brightness and darkness can be achieved by the structure of the retaining portion 111.

特別一提的是,於本實施方式中,覆設於導光板10之保護膜11,在進行組裝前可達到防止導光板10表面損傷之功效,而在組裝時則移除部分之保護膜11,並藉由留置於導光板10上的保留部111來達到消除熱點現象之功效。換言之,在組裝背光模組時,相較於全部撕除並捨棄之使用方式,於此所揭露之技術內容,係跳脫須將保護膜完全撕下的應用,反其道而行地使部分保護膜11留置於導光板10,除了可提升組裝速度、並消除後續使用時的熱點現象外,亦可藉此降低背光模組1增設其餘光學元件之需求與成本。而關於本實施方式所應用具備可撕除部分保護膜11之導光板10,本發明人亦有提出其對應之製造方法,此部分請容後詳述。 In particular, in this embodiment, the protective film 11 covered on the light guide plate 10 can achieve the effect of preventing damage to the surface of the light guide plate 10 before assembly, and part of the protective film 11 is removed during assembly And, by retaining the portion 111 left on the light guide plate 10, the effect of eliminating hot spots is achieved. In other words, when assembling the backlight module, compared with the usage method of tearing off and discarding it, the technical content disclosed here is an application that requires the protective film to be completely torn off. The protective film 11 is left on the light guide plate 10, which can not only increase the assembly speed and eliminate hot spots in subsequent use, but also reduce the requirement and cost of the backlight module 1 to add other optical components. As for the light guide plate 10 with the tear-off part of the protective film 11 applied in this embodiment, the inventor has also proposed its corresponding manufacturing method. This part will be described in detail later.

而組裝後之背光模組1結構,即如第2C或3圖所示,包含了導光板10、保留部111及燈條12,導光板10如前述具有入光面102及表面101,保留部111係為保護膜11沿裁切線113移除撕除部112後之部分,並為貼覆於表面101鄰近入光面102區域之一膜片結構,燈條12則對應入光面102設置而可相對導光板10形成側入光線,藉此,前述背光模組1因應留置於表面101之保留部111即可達消除熱點現象之功效。 The assembled backlight module 1 structure, as shown in FIG. 2C or 3, includes a light guide plate 10, a retention portion 111, and a light bar 12. As described above, the light guide plate 10 has a light incident surface 102 and a surface 101, and the retention portion 111 is a part of the protective film 11 after removing the tear-off portion 112 along the cutting line 113, and is a film structure that is attached to the area of the surface 101 adjacent to the light incident surface 102, and the light bar 12 is provided corresponding to the light incident surface 102. The side entrance light can be formed relative to the light guide plate 10, whereby the aforementioned backlight module 1 can be left on the reserved portion 111 of the surface 101 to achieve the effect of eliminating hot spots.

請續參閱第4、5A及5B圖,其係為本發明第二實施方式之組裝方法步驟流程圖、導光板示意圖及組裝後背光模組示意圖。基於前述內容,在移除撕除部112後,可更組設一框架13於燈條12與導光板10一側,且框架13一端係壓合於保留部111(步驟S04),藉以固定燈條12與導光 板10,且框架13係壓合於保留部111亦可同時達到固定保留部之功效,參第5B圖所示。此外,為提升熱點現象之消除效能,於本實施方式中,係揭示使保留部111表面具有複數光學微粒1111,以達到霧化光線之功效,更可確切地消除熱點現象,均勻化整體出光,參第5A圖所示。而組裝後之背光模組1結構,即會更包含組設於燈條12與導光板10一側之框架13,以固定燈條12與導光板10,且保留部111表面係具有光學微粒1111,參照第5A及5B圖所示。其中,燈條12係可固設於框架13上,以藉框架13達到固定燈條12位置及固定與入光面102距離的效果。且較佳者,前述框架13材質係可為遮光材料,以防止燈條12光線溢漏至外界,降低光線的損耗。 Please continue to refer to Figures 4, 5A and 5B, which are a flow chart of the assembly method, a schematic diagram of the light guide plate and a schematic diagram of the backlight module after assembly in the second embodiment of the present invention. Based on the foregoing, after removing the tear-off portion 112, a frame 13 may be further assembled on the side of the light bar 12 and the light guide plate 10, and one end of the frame 13 is pressed against the retaining portion 111 (step S04) to fix the lamp Strip 12 with light guide The board 10, and the frame 13 pressed against the retaining portion 111 can also achieve the effect of fixing the retaining portion, as shown in FIG. 5B. In addition, in order to improve the elimination effect of the hot spot phenomenon, in this embodiment, it is disclosed that the surface of the retaining portion 111 has a plurality of optical particles 1111 to achieve the effect of atomizing light, and the hot spot phenomenon can be more accurately eliminated and the overall light emission can be uniformly See Figure 5A. The assembled backlight module 1 structure further includes a frame 13 disposed on the side of the light bar 12 and the light guide plate 10 to fix the light bar 12 and the light guide plate 10, and the surface of the retention portion 111 has optical particles 1111 , See Figures 5A and 5B. Wherein, the light bar 12 can be fixed on the frame 13 to achieve the effect of fixing the position of the light bar 12 and the distance from the light incident surface 102 by the frame 13. Moreover, preferably, the material of the frame 13 may be a light-shielding material to prevent the light of the light bar 12 from leaking to the outside and reduce the loss of light.

請參閱第6及7A~7B圖,其係為本發明第三實施方式之製造方法步驟流程圖及各製造步驟示意圖。本發明亦揭示一種導光板之製造方法,包含如下所述之步驟。首先,提供一導光板10’(步驟S05),接續覆設一保護膜11於導光板10’之一表面101(步驟S06)。最後透過雷射加工於保護膜11形成至少一裁切線113,使保護膜11因應裁切線113具有至少一保留部111及至少一撕除部112,且保留部111及撕除部112透過裁切線113相互鄰接(步驟S07)。藉此,透過在導光板10’先覆設保護膜11,而後再進行加工形成裁切線113之方式,係可使製成之導光板上的保留部111與撕除部112位置相當精準,除增進製程效率,更可提升產品良率。且導光板產品製成後,即先透過保護膜11之裁切線113形成欲撕除及欲保留之部分,相對在後續組裝上亦可增進其效率。其中,於此所述之導光板10’係指供以執行覆設與加工保護膜11之板材。實際應用上,導光板10’係可為已符合出廠尺寸之板體或仍需裁切之長形板體,當導光板10’為符合尺寸之板 體時,透過雷射使裁切線113成形後即可製成供以應用於背光模組之導光板產品。當導光板10’為長形板體時,則可在覆設保護膜11後先行切割至所需尺寸,再透過雷射於保護膜11上形成裁切線113,於本實施方式中係以此為例。當然,亦可於保護膜11上形成裁切線113後再行切割,此部分則請容後詳述。 Please refer to FIGS. 6 and 7A-7B, which are flowcharts of manufacturing methods and schematic diagrams of the manufacturing steps according to the third embodiment of the present invention. The invention also discloses a method for manufacturing a light guide plate, which includes the following steps. First, a light guide plate 10 'is provided (step S05), and a protective film 11 is successively coated on a surface 101 of the light guide plate 10' (step S06). Finally, at least one cutting line 113 is formed on the protective film 11 by laser processing, so that the protective film 11 has at least one reserved part 111 and at least one tearing part 112 according to the cutting line 113, and the retaining part 111 and the tearing part 112 pass through the cutting line 113 are adjacent to each other (step S07). In this way, by covering the light guide plate 10 'with the protective film 11, and then processing to form the cutting line 113, the positions of the retaining portion 111 and the tearing portion 112 on the finished light guide plate can be made quite accurate, except Improve process efficiency and product yield. After the light guide plate product is made, the cutting line 113 of the protective film 11 is first used to form a part to be removed and to be retained, which can also improve its efficiency in subsequent assembly. Here, the light guide plate 10 'mentioned herein refers to a plate material for performing coating and processing of the protective film 11. In practical application, the light guide plate 10 'can be a plate body that has conformed to the factory size or an elongated plate body that still needs to be cut. When the light guide plate 10' is a plate that meets the size When the body is cut, the cutting line 113 can be formed by laser to form a light guide plate product for use in a backlight module. When the light guide plate 10 'is an elongated plate body, it can be cut to the desired size after covering with the protective film 11, and then a cutting line 113 is formed on the protective film 11 through the laser, which is used in this embodiment For example. Of course, the cutting line 113 can also be formed on the protective film 11 and then cut. This part will be described in detail later.

透過前述方法製成之導光板10,係可復搭配參閱第2A或5A圖,該種可移除部分保護膜11之導光板10,由於在後續組裝過程中需撕除部分保護膜11,而留置鄰近入光面102之保護膜11於導光板10上,是以保護膜11及裁切線113於導光板10的位置需要相當精準,以避免影響後續應用之出光效能。為製成組裝形成前述背光模組之導光板10,起初本發明人採用先於保護膜上形成裁切線,再將具有裁切線之保護膜覆設於導光板上的方式進行生產。惟此種方式在貼覆保護膜時需要與導光板逐一對位,以確保導光板組裝形成背光模組時,確實地於鄰近入光面位置留有一定大小的保護膜,是以大幅降低了導光板生產效率,甚或產生因貼覆對位不準而致使留置於導光板上的保護膜偏移,影響後續出光效能等問題。因此本發明人續以構思應如何有效率地製作滿足前述需求考量之可移除部分保護膜之導光板10,進而提出先將保護膜11覆設於導光板10’上,再透過雷射加工方式於保護膜11切割形成裁切線113之方法,藉此即可精準控制於所需位置形成裁切線113,避免後續導光板產品上的保護膜11位置有所偏移,同時大幅提升製程速率。 The light guide plate 10 made by the aforementioned method can be combined with reference to FIG. 2A or 5A. This kind of light guide plate 10 with a part of the protective film 11 can be removed, because part of the protective film 11 needs to be removed in the subsequent assembly process, and The protective film 11 adjacent to the light incident surface 102 is left on the light guide plate 10, so that the position of the protective film 11 and the cutting line 113 on the light guide plate 10 needs to be quite accurate to avoid affecting the light output performance of subsequent applications. In order to make the light guide plate 10 that is assembled to form the aforementioned backlight module, the inventors initially formed a cutting line on the protective film, and then overlaid the protective film with the cutting line on the light guide plate for production. However, this method needs to be aligned with the light guide plate one by one when attaching the protective film to ensure that when the light guide plate is assembled to form the backlight module, a certain size of protective film is left near the light entrance surface, so it is greatly reduced The production efficiency of the light guide plate may even cause the protective film left on the light guide plate to shift due to the misalignment of the lamination, which affects the subsequent light output performance and other problems. Therefore, the inventor continued to conceive how to efficiently manufacture a light guide plate 10 with a removable protective film that satisfies the aforementioned requirements, and then proposes to first coat the protective film 11 on the light guide plate 10 'and then process it through laser processing The method of cutting the protective film 11 to form the cutting line 113 can accurately control the formation of the cutting line 113 at the desired position, to avoid the position of the protective film 11 on the subsequent light guide plate products from shifting, and at the same time greatly improve the process rate.

較佳者,係可採用雷射以等間隔燒熔之加工方式形成裁切線113,故於本實施方式中,保護膜11上之裁切線113係由雷射加工形成之複 數燒熔點1131所組成。 Preferably, the cutting line 113 can be formed by laser processing at equal intervals, so in this embodiment, the cutting line 113 on the protective film 11 is a complex formed by laser processing Composed of several burning point 1131.

請參閱第8及9圖,其係為本發明第四實施方式之製造方法步驟流程圖及製造步驟示意圖。其中,於此係揭露在雷射加工形成裁切線113後,係可再透過雷射切割導光板10’至所需尺寸(步驟S08)。於此係揭示導光板10’上保護膜11之裁切線113成形後,再透過雷射切割板材至所需的大小,進而製成可供以組裝至背光模組內之導光板10,而雷射切割之斷面即可形成導光板10之入光面,此種方式係具快速且精準地之裁切功效,且可於同一產線一次製成。 Please refer to FIG. 8 and FIG. 9, which are a flowchart of manufacturing steps and a schematic diagram of manufacturing steps according to the fourth embodiment of the present invention. Here, it is disclosed that after the laser processing forms the cutting line 113, the light guide plate 10 'can be cut through the laser to a desired size (step S08). Here, it is disclosed that after the cutting line 113 of the protective film 11 on the light guide plate 10 'is formed, the sheet is cut to the required size through laser, and then the light guide plate 10 that can be assembled into the backlight module is made. The cut surface of the laser cutting can form the light incident surface of the light guide plate 10. This method has a fast and accurate cutting effect, and can be made at the same time on the same production line.

綜上所述,本發明所提出之背光模組、背光模組之組裝方法及其導光板製造方法,係透過留置部分保護膜於導光板之結構與方法,提供了具優異出光效能且有效降低成本之產品及組裝與製造方式,除可藉此於應用時有效消除熱點現象外,亦可免除背光模組需增設其他光學元件以獲取較佳出光效能之需求,進而有效降低產品成本,另一方面,在組裝上亦具有更佳之效率。 In summary, the backlight module, the method for assembling the backlight module and the method for manufacturing the light guide plate proposed by the present invention are structures and methods that leave part of the protective film on the light guide plate to provide excellent light output efficiency and effectively reduce Cost-effective products and assembly and manufacturing methods can not only eliminate hot spots during application, but also eliminate the need for additional optical components for the backlight module to obtain better light output performance, thereby effectively reducing product costs. In terms of assembly, it also has better efficiency in assembly.

Claims (9)

一種背光模組之組裝方法,包含以下步驟:提供一導光板,該導光板具有一表面及一入光面,且該表面與該入光面為垂直鄰接設置,該表面並覆設有一保護膜,該保護膜具有一保留部及一撕除部,該保留部及該撕除部係透過一裁切線而鄰接設置,且該保留部鄰近該入光面設置;提供一燈條,對應該入光面設置;及沿該裁切線移除該撕除部,使該保留部留置於該表面。A method for assembling a backlight module includes the following steps: providing a light guide plate having a surface and a light incident surface, and the surface and the light incident surface are vertically adjacent to each other, and the surface is covered with a protective film , The protective film has a reserved part and a tear-off part, the reserved part and the tear-off part are arranged adjacent to each other through a cutting line, and the reserved part is arranged adjacent to the light incident surface; a light bar is provided, corresponding to Glossy setting; and remove the tearing part along the cutting line to leave the retaining part on the surface. 如申請專利範圍第1項所述之背光模組之組裝方法,更包含組設一框架於該燈條與該導光板一側,以固定該燈條與該導光板,且該框架一端係壓合於該保留部。The method for assembling the backlight module as described in item 1 of the patent application scope further includes assembling a frame on one side of the light bar and the light guide plate to fix the light bar and the light guide plate, and one end of the frame is pressed It fits in the reserved department. 如申請專利範圍第1項所述之背光模組之組裝方法,其中,該保留部表面係具有複數光學微粒,以霧化光線。The method for assembling a backlight module as described in item 1 of the patent application scope, wherein the surface of the retaining portion has a plurality of optical particles to atomize light. 一種背光模組,其包含:一導光板,具有一表面及一入光面,且該表面與該入光面為垂直鄰接設置,一保留部,該保留部為一膜片,並貼覆於該表面且鄰近該入光面設置,其中該保留部係為一保護膜沿一裁切線移除一撕除部後之部分;及一燈條,對應該入光面設置,以相對該導光板形成側入光線;其中,該導光板與該燈條相互組裝後,該保留部留置於該表面以達消除熱點現象之功效。A backlight module includes: a light guide plate having a surface and a light incident surface, and the surface and the light incident surface are vertically adjacent to each other, a reserved portion, the reserved portion is a diaphragm, and is attached to The surface is disposed adjacent to the light incident surface, wherein the retention portion is a portion of a protective film after a tearing portion is removed along a cutting line; and a light bar is disposed corresponding to the light incident surface to oppose the light guide plate Forming side-entry light; wherein, after the light guide plate and the light bar are assembled with each other, the retention portion is left on the surface to achieve the effect of eliminating hot spots. 如申請專利範圍第4項所述之背光模組,更包含一框架,係組設於該燈條與該導光板一側,供以固定該燈條與該導光板,且該框架一端係壓合於該保留部。The backlight module as described in item 4 of the patent application scope further includes a frame, which is arranged on one side of the light bar and the light guide plate for fixing the light bar and the light guide plate, and one end of the frame is pressed It fits in the reserved department. 如申請專利範圍第4項所述之背光模組,其中,該保留部表面係具有複數光學微粒,以霧化光線。The backlight module as described in item 4 of the patent application scope, wherein the surface of the reserved portion has a plurality of optical particles to atomize light. 一種導光板之製造方法,包含以下步驟:提供一導光板;覆設一保護膜於該導光板之一表面;及透過雷射加工於該保護膜形成至少一裁切線,使該保護膜因應該裁切線具有至少一保留部及至少一撕除部,該保留部及該撕除部係透過該裁切線相互鄰接。A method of manufacturing a light guide plate includes the following steps: providing a light guide plate; covering a surface of the light guide plate with a protective film; and forming at least one cutting line on the protective film through laser processing to adapt the protective film The cutting line has at least one retaining portion and at least one tearing portion, and the retaining portion and the tearing portion are adjacent to each other through the cutting line. 如申請專利範圍第7項所述之導光板之製造方法,其中,該裁切線係由雷射加工形成之複數燒熔點所組成。The method for manufacturing a light guide plate as described in item 7 of the patent application scope, wherein the cutting line is composed of a complex sintering melting point formed by laser processing. 如申請專利範圍第7項所述之導光板之製造方法,其中,雷射加工形成該裁切線後,係再透過雷射切割該導光板至所需尺寸。The manufacturing method of the light guide plate as described in item 7 of the patent application scope, wherein after the laser processing forms the cutting line, the light guide plate is cut to the required size through the laser.
TW107102358A 2018-01-23 2018-01-23 A back light module, an assembly method of the back light module, and a method for manufacturing light guide plate TWI634355B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW107102358A TWI634355B (en) 2018-01-23 2018-01-23 A back light module, an assembly method of the back light module, and a method for manufacturing light guide plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107102358A TWI634355B (en) 2018-01-23 2018-01-23 A back light module, an assembly method of the back light module, and a method for manufacturing light guide plate

Publications (2)

Publication Number Publication Date
TWI634355B true TWI634355B (en) 2018-09-01
TW201932889A TW201932889A (en) 2019-08-16

Family

ID=64453013

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107102358A TWI634355B (en) 2018-01-23 2018-01-23 A back light module, an assembly method of the back light module, and a method for manufacturing light guide plate

Country Status (1)

Country Link
TW (1) TWI634355B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113777691A (en) * 2021-08-17 2021-12-10 苏州茂立光电科技有限公司 Manufacturing and assembling mechanism for light guide plate with preset tearing off rim charge and manufacturing and assembling method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012068543A1 (en) * 2010-11-18 2012-05-24 Flex Lighting Ii, Llc Light emitting device comprising a lightguide film and aligned coupling lightguides
TWM434065U (en) * 2008-04-02 2012-07-21 Alliance Material Co Ltd Light shielding reflective tape
US20130295312A1 (en) * 2012-05-02 2013-11-07 Tredegar Film Products Corporation Low Peel Force Surface Protection Film And Method Of Using Same
TW201617658A (en) * 2014-11-05 2016-05-16 茂林光電科技股份有限公司 Method for manufacturing edge-lighting light guide plate
CN105974635A (en) * 2016-07-18 2016-09-28 京东方科技集团股份有限公司 Shading adhesive tape, display device with shading adhesive tape and preparation method of shading adhesive tape
TW201701037A (en) * 2015-06-16 2017-01-01 友達光電(廈門)有限公司 Backlight module and protection film of optical films of the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM434065U (en) * 2008-04-02 2012-07-21 Alliance Material Co Ltd Light shielding reflective tape
WO2012068543A1 (en) * 2010-11-18 2012-05-24 Flex Lighting Ii, Llc Light emitting device comprising a lightguide film and aligned coupling lightguides
US20130295312A1 (en) * 2012-05-02 2013-11-07 Tredegar Film Products Corporation Low Peel Force Surface Protection Film And Method Of Using Same
TW201617658A (en) * 2014-11-05 2016-05-16 茂林光電科技股份有限公司 Method for manufacturing edge-lighting light guide plate
TW201701037A (en) * 2015-06-16 2017-01-01 友達光電(廈門)有限公司 Backlight module and protection film of optical films of the same
CN105974635A (en) * 2016-07-18 2016-09-28 京东方科技集团股份有限公司 Shading adhesive tape, display device with shading adhesive tape and preparation method of shading adhesive tape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113777691A (en) * 2021-08-17 2021-12-10 苏州茂立光电科技有限公司 Manufacturing and assembling mechanism for light guide plate with preset tearing off rim charge and manufacturing and assembling method thereof
CN113777691B (en) * 2021-08-17 2023-12-05 苏州茂立光电科技有限公司 Light guide plate manufacturing and assembling mechanism with predetermined tearing edge material and manufacturing and assembling method thereof

Also Published As

Publication number Publication date
TW201932889A (en) 2019-08-16

Similar Documents

Publication Publication Date Title
JP4435774B2 (en) Backlight assembly and liquid crystal display device
CN102734697B (en) Back light unit and video display apparatus using the same
US20160091760A1 (en) Backlight device and liquid crystal display
CN203500982U (en) Backlight module and display device
JP2005062541A (en) Optical member and its manufacturing method, and surface emitting device and liquid crystal display device
CN102818187B (en) Backlight module, display device and method for reducing hot spot phenomenon
CN104460112B (en) Backlight, LED light bar and display device
JP2017090578A (en) Laminated optical film sheet having a frame-shaped sealing part
TWI634355B (en) A back light module, an assembly method of the back light module, and a method for manufacturing light guide plate
CN102080789A (en) Liquid crystal display and backlight module thereof
CN108333666A (en) The manufacturing method of backlight module, the assemble method of backlight module and light guide plate
KR101070686B1 (en) Composite Sheet for LCD, and Backlight Unit Using The Same
CN207833186U (en) A kind of side-light type liquid crystal module
WO2020207102A1 (en) Area light source device and manufacturing method therefor, display device
CN106443870B (en) It is a kind of for improving the method for manufacturing light guide plate, light guide plate and backlight module of colour gamut and yield
TWM558920U (en) Backlight module and display device
CN207318773U (en) Backlight module of liquid crystal display
JP2018530129A5 (en)
KR101211726B1 (en) Pattern Light Guiding Plate Integrated Reflector and Method of Manufacture The Same
JP5646985B2 (en) Light guide plate and light guide plate manufacturing method
TW201816439A (en) Light guide plate, processing method and backlight module for eliminating hot spot phenomenon
TWI393956B (en) Flexible backlight module structure
TWI624716B (en) Backlight module of liquid crystal display and manufacturing method thereof
TWI663450B (en) A thin light guide structure and assembly method of thin optical module
WO2025251718A1 (en) Light guide structure, backlight module and display device