TWI630675B - Wafer suction placement device - Google Patents

Abstract

The invention provides a wafer pick-and-place device comprising a wafer pick-up head and a attracting rubber. The wafer pick-up seat has a plurality of clamping faces extending downwardly from the edge of the bottom surface of the base to tightly fit the closed façade of the rubber attracting member, or the at least one flange formed by the locating portion is closed by the positioning portion thereof, and The strip-shaped grooves provided on the inner façade of the rubber tank are coupled to each other to complete the combination of the wafer suction head and the attraction rubber. The design of the structure can achieve the problem that the improved conventional bonding method is not stable enough or the joint is easy to wear and loose, and the vacuum is leaked, so that the bonding effect of the attracting rubber is better, the ability to suck the wafer is improved, and the service life is longer.

Description

Wafer suction placement device

The present invention relates to a wafer pick-and-place device; more particularly, to a wafer pick-and-place device for improving the combination of a wafer pick-up head and a suction rubber.

According to the wafer pick-up device used in the "wafer coating process" after wafer dicing, a wafer pick-up head having a through-hole is used in combination with a suction rubber provided with a plurality of through-holes. The attraction of the through hole to evacuate the wafer is taken out and then subjected to subsequent processing and packaging.

The combination of the current wafer pick-up head and the attracting rubber is mostly based on the bottom surface of the base of the wafer pick-up base having one or more joint members combined with the top surface of the attracting rubber. For example, a conventional grain picking device transmits the bottom surface of the base. The positioning portion and the protruding structure are combined with the positioning groove for attracting the rubber, thereby sucking the die wafer after the wafer is cut.

However, this type of design is provided on the bottom surface of the base of the wafer pick-up base. There are two problems: 1. After the positioning portion of the bottom surface of the base is combined with the positioning groove for attracting the rubber, since it is only a point-like fixing on the plane, The bottom surface of the base is difficult to adhere to the top surface of the attracting rubber, which affects the effect of vacuum drawing the wafer; 2. The positioning portion provided on the bottom surface of the base portion and the positioning groove for attracting the rubber are taken out a plurality of times, and the positioning groove is prone to wear, so that the combination of the two is gradually loosened, thereby causing a vacuum leakage problem and reducing the service life of the attracting rubber. .

The problem to be solved by the present invention is to use a plurality of clamping faces extending downward from the edge of the bottom surface of the base of the base of the base of the base to closely engage the closed façade of the rubber attraction, or to close the façade by using the "positioning portion" Providing at least one strip-shaped flange to engage with a strip-shaped groove provided on the inner façade of the rubber tank body to complete the combination of the wafer pick-up seat and the attracting rubber to improve the conventional "draw-up device has poor bonding effect" and "Due to wear and tear to reduce the service life".

In order to solve the above problems, the present invention discloses a wafer pick-and-place device comprising: a wafer pick-up head comprising a joint portion, a base portion, a through hole and a positioning portion, the base portion being a flat structure a top surface and a bottom surface, the joint portion is disposed on the top surface of the base portion, and is a vertical structure. The bottom surface of the base portion is provided with a positioning portion having a flat bottom surface and a bottom surface of the bottom surface. The edge extends upwardly from a closed façade to the bottom surface of the base, the closed façade is provided with at least one strip-shaped flange, and the through hole is axially penetrated from the top of the joint portion to the locating portion a bottom surface of the plane; and a suction rubber, which is a semi-closed casing which is open on one side, the casing is provided with a planar bottom surface, and the bottom surface of the plane is provided with a plurality of through-holes, and the edge of the bottom surface of the plane extends upwardly to have a closed elevation, the closure Forming a groove body on the inner side of the bottom surface of the plane, the inner dimension of the groove body is matched with the positioning portion, and the inner side surface of the groove body is also provided with the strip Location of the flange, the number and shape of the strip coincides trench.

Or a wafer pick-and-place device comprising: a wafer pick-up head comprising a joint portion, a base portion, a through hole and a positioning portion, the base portion being a flat structure having a top surface and a top surface a bottom surface, the joint portion is disposed on the top surface of the base portion, and is a vertical structure. The bottom surface of the base portion is provided with a positioning portion. The bottom surface of the bottom portion has a plurality of clamping surfaces extending downwardly, and the positioning portion has a planar bottom surface. Extending upwardly from an edge of the bottom surface of the plane, a closed façade to the bottom surface of the base, the closed façade being provided with at least one strip-shaped flange, the through hole extending axially through the strip-shaped opening from the top of the joint portion a bottom surface of the positioning portion; and a suction rubber is a semi-closed housing that is open on one side, the housing is provided with a planar bottom surface, the bottom surface of the plane is provided with a plurality of through holes, and an edge of the bottom surface of the plane extends upwardly. a closed façade, the closed façade and the inner side of the bottom surface of the plane form a trough body, the inner dimension of the trough body is matched with the positioning portion, and the inner façade of the trough body is also disposed The flange strip position, number and shape of the stripe groove fit.

In an embodiment of the above two devices, the strip flanges may be disposed in pairs on one or more sets of opposing faces of the closed facade.

In an embodiment of the above two devices, the planar bottom surface of the attracting rubber may protrude from a boss having an average thickness, and the through hole also penetrates the bottom surface of the boss.

In an embodiment of the above two devices, the bottom surface of the plane of the positioning portion may be provided with a connecting flow channel, and the flow channel penetrates through the through hole to the hole position of the bottom surface.

Or a wafer pick-and-place device comprising: a wafer pick-up head comprising a joint portion, a base portion and a through hole, the base portion The utility model has a flat structure and a top surface and a bottom surface, wherein the joint portion is disposed on the top surface of the base portion, and is an upright vertical structure, and the bottom surface edge of the base portion has a plurality of clamping surfaces extending downward. The through hole is axially penetrated from the top of the joint portion to the bottom surface of the base portion; and a suction rubber is a flat structure provided with a plurality of through holes, the suction rubber profile A tight fit design is formed on the inside of the gripping surface.

In an embodiment of the apparatus, the bottom surface of the base portion may be provided with a flow passage communicating with the through passage, and the flow passage penetrates through the through hole to the hole position of the bottom surface.

The two achievable effects of the present invention are as follows: 1. Using a strip-shaped flange at the bottom edge of the positioning portion or a clamping surface extending downward from the base, the attracting rubber is linearly or planarly fixed to the wafer. The suction seat can have a better bonding effect with the attraction rubber; 2. moving the bonding member to the wafer suction seat and the structural façade of the rubber attraction, and the wear of the bonding member is not easily caused when vacuum suction is performed, thereby prolonging the attraction The service life of rubber.

The present invention will be further described in conjunction with the drawings and specific embodiments, so that those skilled in the art can understand the invention and practice.

1‧‧‧ wafer pick-and-place device

11‧‧‧ wafer pick-up head

111‧‧‧ joints

112‧‧‧ base

1121‧‧‧ top surface

1122‧‧‧ bottom

113‧‧‧through holes

114‧‧‧ Positioning Department

1141‧‧‧planar bottom

11411‧‧‧Flow channel

1142‧‧‧Closed facade

1143‧‧‧ Strip flange

12‧‧‧Attracting rubber

121‧‧‧Shell

1211‧‧‧ planar bottom surface

1212‧‧‧Closed facade

1213‧‧‧ Strip groove

122‧‧‧through through hole

123‧‧‧Boss

1231‧‧‧Bottom of the boss

2‧‧‧ wafer pick-and-place device

21‧‧‧ wafer pick-up head

211‧‧‧ joints

212‧‧‧ base

2121‧‧‧ top surface

2122‧‧‧ bottom

21221‧‧‧Flow channel

2123‧‧‧Clamped surface

213‧‧‧through holes

22‧‧‧Attraction rubber

221‧‧‧Flat structure

222‧‧‧through through hole

3‧‧‧ wafer pick-and-place device

31‧‧‧ wafer pick-up head

311‧‧‧ joints

312‧‧‧ base

3121‧‧‧ top surface

3122‧‧‧ bottom

3123‧‧‧Clamped surface

313‧‧‧through holes

314‧‧‧ Positioning Department

3141‧‧‧ planar bottom surface

31411‧‧‧Flow channel

3142‧‧‧Closed facade

3143‧‧‧Rated flange

32‧‧‧Attraction rubber

321‧‧‧Shell

3211‧‧‧planar bottom

3212‧‧‧Closed facade

3213‧‧‧ Strip groove

322‧‧‧through through hole

323‧‧‧Boss

3231‧‧‧Bottom of the boss

1 is a perspective view of a first embodiment of the present invention; FIG. 2A is a side view of a front structure of a first embodiment of the present invention; FIG. 2C is a first aspect of the flow channel of the present invention; FIG. 2D is a second aspect of the flow channel of the present invention; FIG. 2E is a first aspect of the strip flange of the present invention; 2F is a second aspect of the strip flange of the present invention; FIG. 2G is a second perspective view of the second embodiment of the present invention; FIG. Figure 3B is a side view showing a structure of a second embodiment of the present invention; Figure 4B is a perspective view showing a structure of a third embodiment of the present invention; and Figure 4B is a side view showing the structure of a third embodiment of the present invention.

As described above, the improvement of the present invention is mainly directed to the change in the bonding member, which is exemplified by the following three embodiments: 1. The first embodiment: at least one strip-shaped flange provided by the positioning portion to close the façade, and the attraction rubber a strip-shaped groove provided on the inner side of the trough body is coupled; 2. a second embodiment: a plurality of clamping faces extending downwardly from the edge of the bottom surface of the base portion to tightly fit the closed façade that attracts the rubber; 3. Third Embodiment: At the same time, at least one strip-shaped flange provided by the positioning portion closing the façade is engaged with the strip-shaped groove provided on the inner façade of the suction rubber groove body, and the plurality of edges of the bottom surface of the base portion are downwardly extended. Clamp the face to fit tightly to the closed façade that will attract the rubber.

1 is a perspective view of a first embodiment of the present invention. The wafer pick-and-place device 1 of the first embodiment of the present invention can be divided into a wafer pick-up head of the upper half. 11 and the lower half The part attracts rubber 12.

Next, the detailed structure of the wafer pick-and-place device 1 will be described with reference to Figs. 2A to 2F. 2A to 2B are a side view of a combined front structure and a side view of a combined structure according to a first embodiment of the present invention; the wafer pick-and-place device 1 includes a wafer pick-up head 11 including a joint portion 111 and a base portion. 112, a through hole 113 and a positioning portion 114, the base portion 112 is a flat structure, has a top surface 1121 and a bottom surface 1122, the joint portion 111 is disposed on the top surface 1121 of the base portion 112, which is an upright The bottom surface 1122 of the base portion 112 is provided with a positioning portion 114. The positioning portion 114 has a flat bottom surface 1141, and a closed vertical surface 1142 extends to the bottom surface 1122 of the base portion 112 to the bottom surface 1122 of the base portion 112. The closed façade 1142 is provided with at least one strip-shaped flange 1143. The through-hole 113 is axially penetrated from the top of the joint portion 111 to the planar bottom surface 1141 of the positioning portion 114; and a suction rubber 12 The housing 121 is provided with a planar bottom surface 1211. The planar bottom surface 1211 is provided with a plurality of through holes 122. The bottom surface of the planar bottom surface 1211 extends upwardly with a closed elevation 12 12, the closed façade 1212 and the inner side of the planar bottom surface 1211 form a trough body, the inner dimension of the trough body is matched with the positioning portion 114, and the inner façade of the trough body is also provided with the strip flange 1143 position, number and shape of the strip groove 1213.

In this embodiment, the planar bottom surface 1141 of the positioning portion 114 may be provided with a communicating flow channel 11411, and the flow channel 11411 penetrates through the through hole 113 to the hole of the planar bottom surface 1141; accordingly, when the vacuum tube is When it is placed on the joint portion 111 and begins to evacuate, it is evenly distributed on the bottom surface of the plane. The flow channel 11411 of the 1141 generates a suction force that is uniformly and evenly distributed to the through hole 122 of the attracting rubber 12, so that the wafer (or the die) after the wafer is cut is sucked by the average suction force as shown in FIG. 2B. Therefore, the wafer is prevented from colliding during the suction process to cause defects.

The flow channel 11411 is evenly distributed on the bottom surface 1141 of the plane. Please refer to FIG. 2C and FIG. 2D. FIG. 2C and FIG. 2D are the first and second aspects of the flow channel 11411 of the present invention; As shown in FIG. 2C and FIG. 2D, the planar bottom surface 1141 may be provided with a communicating channel 11411, and the flow channel 11411 penetrates through the through hole 113 to the hole of the planar bottom surface 1141.

Referring to FIG. 2E and FIG. 2F, FIG. 2E and FIG. 2F are two aspects of the strip flange 1143 of the present invention; in an embodiment, the strip flange 1143 can be as shown in FIG. 2E. Two sets are disposed on a pair of opposite faces of the closed facade 1142 (shown in FIG. 2A), or as shown in FIG. 2F, a plurality of sets of relatives disposed on the closed facade 1142 (shown in FIG. 2A). On the surface.

However, the design of the flow channel 11411 and the strip flange 1143 of the present invention is only a preferred embodiment of the present invention, and other equivalent structural changes of the flow channel 11411 and the strip flange 1143 are applied. It is intended to be included in the scope of the patent application of the present invention.

The attracting rubber 12 of the first embodiment can also exhibit a second aspect as shown in FIG. 2G. A boss 123 having an average thickness protrudes from the bottom surface 1211 of the plane, and the through hole 122 also penetrates the convex portion. The bottom surface of the table 1231; the local thickening of the boss 123 enhances the strength of the bottom surface of the attraction rubber 12, and prevents the attraction rubber 12 from being deformed due to frequent vacuum operations. The components in FIG. 2G are substantially the same as in FIG. 2A, and the same components are denoted by the same reference numerals, and the difference is only the above-mentioned boss 123. structure.

3A and 3B, FIG. 3A and FIG. 3B are side views of a three-dimensional structure and structure according to a second embodiment of the present invention. The wafer pick-and-place device 2 includes a wafer pick-up head 21 including a joint portion 211 and a a base portion 212 and a through hole 213. The base portion 212 is a flat structure having a top surface 2121 and a bottom surface 2122. The joint portion 211 is disposed on the top surface 2121. The bottom surface of the base portion 212 has a plurality of clamping faces 2123 extending downward from the edge of the bottom portion 2122. The through hole 213 extends through the strip hole from the top of the joint portion 211 to the bottom surface 2122 of the base portion 212; The rubber 22 is a flat structure 221 provided with a plurality of through-holes 222. The outer contour of the attracting rubber 22 and the inner side of the clamping surface 2123 are closely matched, that is, the attracting rubber 22 can be utilized. The façade that is tightly fitted to the clamping surface 2123 allows the clamping surface 2123 to stably clamp the attraction rubber 22 to achieve an effective bonding effect.

In the second embodiment, the bottom surface 2122 of the base portion 212 can be provided with a communicating passage 21221. The flow passage 21221 passes through the through hole 213 to the hole of the bottom surface 2122 (refer to FIG. 2C and FIG. 2D). .

Finally, a side view of a three-dimensional structure and structure of a third embodiment of the present invention is shown in FIG. 4A and FIG. 4B. The structure of the wafer pick-and-place device 3 of FIGS. 4A and 4B includes a wafer pick-up head 31 including a joint portion. 311, a base portion 312, a through hole 313 and a positioning portion 314. The base portion 312 is a flat structure having a top surface 3121 and a bottom surface 3122. The joint portion 311 is disposed on the top surface of the base portion 312. The bottom surface 3122 of the base 312 is provided with a positioning portion 314, and the bottom surface 3122 A plurality of clamping faces 3123 extend downwardly from the edge. The positioning portion 314 has a planar bottom surface 3141, and a closed vertical surface 3142 extends upwardly from the edge of the planar bottom surface 3141 to the bottom surface 3122 of the base portion 312. The closed surface 3142 An at least one strip-shaped flange 313 is disposed, the through-hole 313 is axially penetrated from the top of the joint portion 311 to the planar bottom surface 3141 of the positioning portion 314; and a suction rubber 32 is open on one side. The semi-closed housing 321 is formed with a planar bottom surface 3211. The planar bottom surface 3211 can protrude from a convex base 323 and is provided with a plurality of through holes 322 extending through the bottom surface 3231 of the boss. The planar bottom surface 3211 A closed façade 3212 extends upwardly from the edge, and the closed façade 3212 forms a slot with the inner side of the planar bottom surface 3211. The inner dimension of the slot is matched with the positioning portion 314, and the inner façade of the slot body is also A strip-shaped groove 3213 matching the position, number, and shape of the strip-shaped flange 3143 is provided.

In the third embodiment, the planar bottom surface 3141 of the positioning portion 314 can be provided with a communicating channel 31411. The flow channel 31411 passes through the through hole 313 to penetrate the hole of the planar bottom surface 3141 (refer to FIG. 2C and FIG. 2C). Figure 2D).

In the third embodiment, the strip-shaped flanges 3143 can be disposed on the opposite faces of the closed façade 3142, or two or more of the opposite faces of the closed fascia 3142 (refer to the figure). 2E and Figure 2F).

In the above, it is merely described that the present invention is an embodiment or an embodiment of the technical means for solving the problem, and is not intended to limit the scope of implementation of the present invention. That is, the equivalent changes and modifications made to the scope of the patent application of the present invention, or the scope of the patent application of the present invention, are covered by the scope of the invention.

Claims (10)

A wafer pick-and-place device comprising: a wafer pick-up head comprising a joint portion, a base portion, a through hole and a positioning portion, the base portion being a flat structure having a top surface and a bottom surface The joint portion is disposed on the top surface of the base portion, and has a vertical structure. The bottom surface of the base portion is provided with a positioning portion having a flat bottom surface, and a closed vertical surface extends upwardly from the edge of the bottom surface of the base portion. The bottom surface of the base portion is provided with at least one strip-shaped flange, the through hole is axially penetrated from the top of the joint portion to the bottom surface of the positioning portion of the positioning portion; and a suction rubber a semi-closed casing that is open on one side, the casing is provided with a planar bottom surface, the bottom surface of the plane is provided with a plurality of through-holes, and an edge of the bottom surface of the plane extends upwardly to have a closed elevation surface, and the closed elevation surface forms an inner side of the bottom surface of the plane a groove body having a size inside the groove portion coincident with the positioning portion, and the inner side surface of the groove body is also disposed to match the position, number and shape of the strip flange Strip grooves. The wafer pick-and-place device of claim 1, wherein the strip-shaped flanges are disposed in pairs on one or more sets of opposing faces of the closed facade. The wafer pick-and-place device of claim 1, wherein the planar bottom surface of the attracting rubber protrudes from a boss having an average thickness, and the through-hole is also penetrated to the bottom surface of the boss. The wafer pick-and-place device according to claim 1, wherein The bottom surface of the plane of the positioning portion may be provided with a flow passage communicating with the through passage, and the flow passage penetrates through the through hole to the hole position of the bottom surface of the plane. A wafer pick-and-place device comprising: a wafer pick-up head comprising a joint portion, a base portion and a through hole, the base portion being a flat structure having a top surface and a bottom surface, the joint portion being The top surface of the base portion is an upright vertical structure, and the bottom surface edge of the base portion has a plurality of clamping faces extending downwardly, and the through hole is axially penetrated from the top of the joint portion to the plurality of holes The bottom surface of the base portion; and a suction rubber is a flat structure provided with a plurality of through-holes, and the suction rubber profile has a tight fit design with the inner side of the clamping surface. The wafer suction and placement device of claim 5, wherein the bottom surface of the base portion is provided with a flow passage that communicates with the flow passage through the through hole to the hole position of the bottom surface. A wafer pick-and-place device comprising: a wafer pick-up head comprising a joint portion, a base portion, a through hole and a positioning portion, the base portion being a flat structure having a top surface and a bottom surface The joint portion is disposed on the top surface of the base portion, and has a vertical structure. The bottom surface of the base portion is provided with a positioning portion, and the edge of the bottom surface extends downwardly with a plurality of clamping surfaces, the positioning portion has a planar bottom surface, and Extending upwardly from an edge of the bottom surface of the plane, a closed elevation to the bottom surface of the base, the closed elevation being provided with at least one strip-shaped flange, the through hole being axially penetrating through the strip-shaped passage from the top of the joint to the The bottom surface of the positioning portion; And a suction rubber, which is an open semi-closed casing, the casing is provided with a flat bottom surface, and the bottom surface of the plane is provided with a plurality of through holes, and the edge of the bottom surface of the plane extends upwardly to have a closed elevation, the closed elevation and the closed elevation A groove body is formed on the inner side of the bottom surface of the plane, and the inner dimension of the groove body is matched with the positioning portion, and the inner side surface of the groove body is also provided with a strip shape corresponding to the position, the quantity and the shape of the strip flange. Groove. The wafer pick-and-place device of claim 7, wherein the strip-shaped flanges are disposed in pairs on one or more sets of opposing faces of the closed facade. The wafer pick-and-place device of claim 7, wherein the bottom surface of the flat surface of the attracting rubber protrudes from a boss having an average thickness, and the through-hole is also penetrated to the bottom surface of the boss. The wafer suction and placement device of claim 7, wherein the planar bottom surface of the positioning portion is provided with a flow passage that communicates with the flow passage through the through hole to a hole in the bottom surface of the plane.