TWI630398B - How to use the preheating device - Google Patents

Abstract

The invention discloses a preheating device for heating a circuit board. The preheating device comprises a heating structure. The heating structure comprises a jig and a work table. The jig comprises at least one mechanical arm and a first heating plate, and the machine The arm is mounted on the first heating plate, and the working table includes a second heating plate. The mechanical arm can move relative to the first heating plate and grab the circuit board. The first heating plate and the second heating plate heat up and respectively respectively and the two sides of the circuit board Resist to heat the circuit board. The invention also relates to a method of using the above preheating device.

Description

How to use the preheating device

The present invention relates to a preheating device, and more particularly to a preheating device capable of repeatedly heating and cooling a circuit board.

During the manufacturing process of the board, it is necessary to test whether the performance can be maintained in a harsh environment with a sharp temperature change. In particular, whether the through holes and blind holes on the circuit board shrink at high temperature and low temperature affect the performance of the circuit board. Prior to testing, the board was subjected to repeated heating and cooling for analogy. The existing preheating device cannot meet the requirements of repeated heating and cooling, and requires manual handling.

In order to overcome the deficiencies of the prior art, it is an object of the present invention to provide a preheating device capable of repeatedly heating and cooling a circuit board.

The object of the present invention is achieved by the following technical solution: a preheating device for heating a circuit board, the preheating device comprising a heating structure, the heating structure comprising a jig and a work table, the jig comprising at least one mechanical arm and one a first heating plate, the robot arm is movably mounted on the first heating plate, and the working table comprises a second heating plate. The mechanical arm can move relative to the first heating plate and grab the circuit board, and the first heating plate and the second heating plate generate heat and respectively interfere with the two sides of the circuit board to heat the circuit board.

Preferably, the jig further comprises a first heating block, and the first heating block is fixed to the first heating plate to heat the first heating plate.

Preferably, the at least one mechanical arm further comprises an adsorption portion, and the adsorption portion adsorbs the circuit board by using a vacuum principle to move the circuit board in a first direction.

Preferably, the first direction is perpendicular to the first heating plate.

Preferably, the workbench includes a second heating block, and the second heating block is fixed to the second heating plate to heat the second heating plate.

Preferably, the preheating device further comprises a cooling structure, and the cooling structure is a fan to cool the circuit board.

Preferably, the first heating plate is made of an aluminum plate.

Preferably, the second heating plate is made of an aluminum plate.

A method for using a preheating device includes the following steps: Step 1: placing a circuit board on a workbench; and step 2, moving the mechanical arm toward a first direction relative to the first heating plate to grab the circuit board; Step 3: First The heating plate generates heat, and the mechanical arm moves relative to the first heating plate in a second direction opposite to the first direction until one side of the circuit board is in contact with the first heating plate; in step 4, the second heating plate generates heat and is opposite to the first heating plate Moving in the second direction until it is in contact with the other side of the circuit board, at which time both sides of the circuit board are heated by the first heating plate and the second heating plate; in step 5, the first heating plate and the second heating plate stop heating, and the second heating plate Moving back to the original position in the first direction; step six, the mechanical arm moves relative to the first heating plate in the first direction, so that the circuit board is suspended, and a fan cools the circuit board.

Compared with the prior art, the invention has the beneficial effects that the heating structure of the preheating device of the present invention heats the circuit board by the first heating plate and the second heating plate through the mechanical arm adsorption circuit board, and cools the circuit board through the cooling structure, The board can be repeatedly heated and cooled repeatedly at one station to make the test reliable.

The detailed description of the preferred embodiments of the present invention is intended to be limited to the scope of the invention, and is not intended to limit the scope of the invention. The patent scope of this case.

100‧‧‧Preheating unit

10‧‧‧Refrigeration structure

20‧‧‧heating structure

22‧‧‧ fixture

220‧‧‧Installation table

222‧‧‧ Robotic arm

2220‧‧‧Adsorption Department

224‧‧‧First heating plate

226‧‧‧First heating block

24‧‧‧Workbench

240‧‧‧second heating plate

242‧‧‧second heating block

200‧‧‧ circuit board

Figure 1 is a perspective view of a preheating device of the present invention.

2 is a schematic structural view of a heating structure of the preheating device of FIG. 1.

3 is a schematic view showing a state of use of the heating structure of FIG. 2.

4 is a schematic view showing another use state of the heating structure of FIG. 2.

FIG. 5 is a schematic view showing still another use state of the heating structure of FIG. 2. FIG.

Fig. 6 is a schematic view showing a state of use of the preheating device of Fig. 1.

The spirit and scope of the present invention will be described in the following detailed description of the preferred embodiments of the present invention, which can be modified and modified by the teachings of the present invention. The spirit and scope of the present invention.

The terms "first", "second", ..., etc. used in this article are not specifically meant to refer to the order or order, nor are they used to limit the case, but only to distinguish the same technical terms. The component or operation described.

The terms used in this document, unless otherwise specified, generally have the usual meaning of each term used in the art, in the context of the disclosure, and in the particular content. Certain terms used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the disclosure.

Referring to FIG. 1 , a preheating device 100 is used for repeatedly heating and cooling a circuit board 200 . The preheating device 100 includes a cooling structure 10 and a heating structure 20 . In an embodiment, the refrigeration structure 10 is a fan.

The heating structure 20 includes a jig 22 and a table 24. The jig 22 includes a mounting table 220, a plurality of robot arms 222 fixed to the mounting table 220, a first heating plate 224, and a first heating block 226 fixed to the first heating plate 224. Each robot arm 222 is movably mounted to the first heating plate 224. Each robot arm 222 includes a suction portion 2220. The plurality of robot arms 222 are parallel to each other. Each robot arm 222 is generally perpendicular to the first heating plate 224. In an embodiment, the first heating plate 224 is made of aluminum.

The table 24 includes a second heating plate 240 and a second heating block 242 fixed to the second heating plate 240. The second heating plate 240 is substantially parallel to the first heating plate 224. In an embodiment, the second heating plate 240 is made of aluminum.

Please refer to FIG. 2 to FIG. 6. When the preheating device is used, the following steps are included: Step 1: Place the circuit board 200 on the worktable 24; Step 2. Move the mechanical arm 222 toward the first direction relative to the first heating plate 224. In order to grasp the circuit board 200; in step 3, the first heating plate 224 generates heat, and the mechanical arm 222 moves relative to the first heating plate 224 in a second direction opposite to the first direction until the side of the circuit board 200 and the first heating plate 224 Conflict; step four, second heating The plate 240 generates heat and moves in a second direction relative to the first heating plate 224 until it abuts against the other side of the circuit board 200. At this time, both sides of the circuit board 200 are heated by the first heating plate 224 and the second heating plate 240; Step 5: The heating plate 224 and the second heating plate 240 stop heating, and the second heating plate 240 moves back to the original position in the first direction; in step 6, the mechanical arm 222 moves in the first direction relative to the first heating plate 224, so that the circuit board 200 Suspended, the refrigeration structure 10 cools the circuit board 200. By repeating the above steps, the circuit board 200 can be repeatedly heated and cooled to meet the requirements before testing.

The detailed description of the present invention is intended to be illustrative of a preferred embodiment of the invention, and is not intended to limit the scope of the invention. The patent scope of this case.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

Claims (1)

A method of using a preheating device, wherein the preheating device is for heating a circuit board, the preheating device comprising a heating structure, the heating structure comprising a jig and a work table, the jig comprising at least one mechanical arm And a first heating plate, the mechanical arm is movably mounted on the first heating plate, the working table includes a second heating plate, the mechanical arm can move relative to the first heating plate and grasp the circuit board, the first The heating plate and the second heating plate generate heat and respectively abut against the two sides of the circuit board to heat the circuit board, wherein the method of using the preheating device comprises the following steps: Step 1: placing the circuit board on the workbench Step 2: the mechanical arm moves in a first direction relative to the first heating plate to grasp the circuit board; Step 3, the first heating plate generates heat, and the mechanical arm faces the first direction relative to the first heating plate The opposite second direction moves until one side of the circuit board is in contact with the first heating plate; in step 4, the second heating plate generates heat and moves toward the second direction relative to the first heating plate To the other side of the circuit board, the two sides of the circuit board are heated by the first heating plate and the second heating plate; step 5, the first heating plate and the second heating plate stop heating, the first The second heating plate moves back to the original position in the first direction; in step 6, the mechanical arm moves relative to the first heating plate in the first direction, so that the circuit board is suspended, and a fan cools the circuit board.