TWI628988B - Electronic device and method of manufacturing same - Google Patents

Abstract

The electronic device (100) is provided with a resin structure layer (10, 20, 30, 40) and external wiring (104) formed on end faces (10a, 10b, 10c, 10d) of the resin structure layer (10, 20, 30, 40). . Each of the resin structural layers (10, 20, 30, 40) includes: an electronic component (11, 21, 31, 41); and a resin molded body (13, in which the electronic component (11, 21, 31, 41) is embedded and fixed, respectively. 23, 33, 43); and internal wiring (14, 24, 34) and external wiring (44). Thereby, it is possible to provide an electronic circuit including a three-dimensional structure capable of shortening the wiring length and having a low manufacturing cost.

Description

Electronic device and method of manufacturing same

The present technology relates to an electronic device in which a plurality of wirings are laminated and a method of manufacturing the same.

In recent years, the demand for ultra-small size of electronic devices or wearable mobile devices equipped with wireless functions has been increasing, and the integration of electronic circuits using multilayer printed boards has been actively promoted. Or three-dimensional.

The multilayer printed circuit board can be produced by laminating an insulating adhesive layer between layers, and stacking a plurality of printed circuit boards having wiring formed on one or both sides, and using through-holes provided in the respective layers. Connect the wiring of each layer.

In the case of a two-dimensional design of only a single layer, there may be a problem that the wiring crosses, the number of connection terminals of the electronic component is large, the wiring becomes complicated, the substrate area increases, and the signal is delayed due to the lengthening of the wiring. By using a multilayer printed substrate, wiring can be formed in each layer, and thus these problems can be suppressed.

However, in the case of using a multilayer printed substrate, the wiring is formed three-dimensionally, but the electronic component is mounted only on both the upper surface and the lower surface of the multilayer printed substrate. Therefore, the number of mounting or mounting positions of electronic components is limited, and the miniaturization of electronic devices has a limit.

Therefore, Japanese Patent Laid-Open No. 2000-200977 (Patent Literature) FIG. 3 of 1) discloses a technique in which a concave portion is formed on a main surface of a multilayer printed circuit board including a plurality of insulator layers and electrode layers, and a circuit component is mounted on a bottom surface of the concave portion, thereby achieving downsizing. Further, the electronic component is mounted on the back surface of the main surface, and is connected to the internal electrode layer via a via hole.

FIG. 3 of Japanese Laid-Open Patent Publication No. 2008-263240 (Patent Document 2) discloses a laminated substrate bonding including a first build-up substrate and a second build-up substrate, and the first build-up substrate is bonded to the side surface of the second build-up substrate. body. Regarding the first build-up substrate and the second build-up substrate, the side connection pads formed on the respective side faces are electrically connected to each other, and a via conductor filled in the through hole formed in the first build-up substrate is connected to the side connection pad, This electrically connects the first build-up substrate to the second build-up substrate. Thus, an increase in the number of mounting of electronic components is achieved by utilizing the side faces of the second build-up substrate.

[Prior Art Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-200977

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-263240

However, in the technique disclosed in Japanese Laid-Open Patent Publication No. 2000-200977, since the complicated structure including the concave portion in the multilayer printed substrate is provided, there is a problem that the number of installation steps of the electronic component increases and the manufacturing cost increases. In addition, in the technique disclosed in Japanese Laid-Open Patent Publication No. 2008-263240, The complicated structure of the pads and the via conductors that are conducted to the side connection pads increases the manufacturing cost. Further, in any of the techniques, since only the electronic component is mounted on the upper surface and the lower surface of the multilayer printed circuit board, there is a limit to shortening the wiring length.

The present invention has been made in view of the above problems in the prior art, and an object of the invention is to provide an electronic circuit including a three-dimensional structure capable of shortening a wiring length, and which is low in manufacturing cost and a method of manufacturing the same.

According to one aspect, in an electronic device including a plurality of resin structure layers, a surface of each of the plurality of resin structure layers includes: a first surface; and an end portion connected to the first surface and not adjacent to the first surface Parallel second side. The plurality of resin structural layers are laminated along a normal direction of the first surface, and each of the plurality of resin structural layers includes: an electronic component; and a resin molded body, the electronic component is buried in such a manner that the electronic component is exposed on the first surface And a first wiring formed on the first surface and connected to a portion of the electronic component exposed on the first surface. The electronic device further includes: a second wiring formed on the second surface of at least one of the plurality of resin structural layers, and connected to at least one of the electronic component and the plurality of resin structural layers of at least one of the plurality of resin structural layers At least one of the first wirings.

Preferably, the electronic component of at least one of the plurality of resin structural layers is exposed on both the first surface and the second surface. The second wiring is connected to a portion of the electronic component that is exposed on the second surface. Preferably, the second side of each of the plurality of resin structural layers is present on the same plane.

Preferably, the first resin structure layer of the plurality of resin structure layers is laminated Above the first side of the second resin structural layer in the resin structural layer. A portion of the end of the second face of the first resin structural layer is located within the first face of the second resin structural layer. The second wiring is formed on the first resin structural layer such that at least one of the electronic component of the first resin structural layer and the first wiring is connected to at least one of the electronic component of the second resin structural layer and the first wiring. The second side.

Preferably, the angle formed by the second surface of the first resin structural layer and the first surface of the first resin structural layer is 120 degrees or more and less than 180 degrees.

According to another aspect, a method of manufacturing an electronic device includes: a step of attaching a first electronic component to a first sheet; and disposing the first sheet in the first molding die, and filling the resin in the first molding die; This step of molding the first resin molded body of the first electronic component; peeling the first sheet from the first resin molded body to the first sheet joint surface of the first resin molded body that is in contact with the first sheet a step of forming a first wiring connected to the first electronic component; a step of attaching the second electronic component to the second sheet; and disposing the second sheet and the first resin molded body in the second forming mold, and The resin is filled in the second molding die, whereby the second resin-embedded volume layer in which the second electronic component is embedded is formed on the first sheet bonding surface of the first resin molded body. In the step of laminating, the first end surface of the first resin molded body which is connected to the end portion of the first sheet joint surface and which is not parallel to the first sheet joint surface, and the second resin molded body are connected to Forming a second resin forming volume layer on the first sheet of the first resin molded body in such a manner that the end portions of the second piece of the contact second bonding surface and the second end surface not parallel to the second sheet bonding surface are present on the same plane Above the joint surface. The method of manufacturing an electronic device further includes: peeling the second sheet from the second resin molded body, and second Forming a second wiring connected to the second electronic component on the bonding surface; and forming the first wiring, the first electronic component, the second wiring, and the first surface on at least one of the first end surface and the second end surface The step of connecting at least one of the third wires of the two electronic components.

According to another aspect, a method of manufacturing an electronic device includes: a step of attaching a first electronic component to a first sheet; and disposing the first sheet in the first molding die, and filling the resin in the first molding die; This step of molding the first resin molded body of the first electronic component; peeling the first sheet from the first resin molded body to the first sheet joint surface of the first resin molded body that is in contact with the first sheet a step of forming a first wiring connected to the first electronic component; a step of attaching the second electronic component to the second sheet; and disposing the second sheet and the first resin molded body in the second forming mold, and The resin is filled in the second molding die, whereby the second resin-embedded volume layer in which the second electronic component is embedded is formed on a portion of the first sheet bonding surface of the first resin molded body. The surface of the second resin molded body includes: a second sheet joint surface that is in contact with the second sheet; and an end surface that is connected to the end portion of the second sheet joint surface and that is not parallel to the second sheet joint surface. In the step of laminating, the second resin is formed into a volume layer on a portion of the first sheet joint surface of the first resin molded body such that a portion of the end portion of the end surface is located in the first sheet joint surface. Further, the method of manufacturing an electronic device further includes: peeling the second sheet from the second resin molded body, forming a second wiring connected to the second electronic component on the second sheet joint surface, and forming the first wiring on the end surface; a step of at least one connected third wiring of the first electronic component, the second wiring, and the second electronic component.

According to the present invention, it is possible to provide an electronic circuit including a three-dimensional structure capable of shortening the wiring length, and it is possible to reduce the manufacturing cost of the electronic device.

10, 20, 30, 40, 50, 60‧‧‧ resin structural layers

10a, 20a, 30a, 40a, 50a, 60a, 101‧‧‧ upper surface

End faces 10b, 10c, 20b, 20c, 30b, 30c, 40b, 40c, 60b‧‧

11 (11a~11e), 21(21a~21d), 31(31a~31c), 41(41a~41f), 51(51a~51e), 61(61a~61c)‧‧‧Electronic parts

12a~12e, 22a~22d, 32a~32c, 42a~42f, 52a~52e, 62a~62c‧‧‧ electrodes

13, 23, 33, 43, 53, 63‧‧‧ resin molded body

14, 24, 34‧‧‧ Internal wiring

44, 64, 104, 106, 108‧‧‧ External wiring

54‧‧‧Wiring

100, 100A‧‧‧ electronic devices

103, 105, 511‧‧‧ side

200, 300, 400, 500‧‧‧ temporary fixation

210, 310, 410, 510‧‧‧ forming dies

230, 330, 430, 530 ‧ ‧ space

513‧‧‧ protruding parts

A, B‧‧ arrows

‧‧‧‧ angle

Fig. 1 is a perspective view showing a schematic configuration of an electronic device according to a first embodiment.

FIG. 2 is an exploded perspective view of the electronic device of FIG. 1. FIG.

Figure 3 is a plan view of the electronic device of Figure 1.

4 is a side view of the electronic device shown in FIG. 1 as seen from the direction of arrow A.

Fig. 5 is a side elevational view of the electronic device of Fig. 1 as seen from the direction of arrow B.

(a) to (c) of FIG. 6 are views showing a first stage of a method of manufacturing an electronic device according to the first embodiment.

(a) to (c) of FIG. 7 are views showing a second stage of the method of manufacturing the electronic device of the first embodiment.

(a) to (c) of FIG. 8 are views showing a third stage of the method of manufacturing the electronic device of the first embodiment.

FIG. 9 is a plan view showing a schematic configuration of an electronic device according to a second embodiment.

Fig. 10 is a cross-sectional view taken along line XI-XI of Fig. 9.

(a) to (f) of FIG. 11 are views for explaining an example of a method of manufacturing an electronic device according to the second embodiment.

The embodiment of the present invention will be described in detail with reference to the drawings. Bright. In addition, the same or equivalent parts in the drawings are denoted by the same reference numerals and the description thereof is not repeated.

<Embodiment 1>

(Composition of electronic devices)

A schematic configuration of an electronic device 100 according to the first embodiment will be described with reference to Figs. 1 to 5 .

FIG. 1 is a perspective view showing a schematic configuration of an electronic device 100 according to the first embodiment. FIG. 2 is an exploded perspective view of the electronic device 100. FIG. 3 is a plan view of the electronic device 100. 4 is a side view of the electronic device 100 of FIG. 1 as seen from the direction of arrow A. FIG. 5 is a side view of the electronic device 100 of FIG. 1 as seen from the direction of arrow B.

As shown in FIG. 1, the electronic device 100 has a rectangular parallelepiped shape in which six planes are used as surfaces. The upper surface 101 and the side surface 103 and the side surface 105 are included in the six planes. The electronic device 100 is assembled in various electronic devices such as a wearable mobile device or a small sensor, and assumes primary or auxiliary functions of the electronic device.

The electronic device 100 includes four resin structure layers 10, a resin structure layer 20, a resin structure layer 30, a resin structure layer 40, an external wiring 104 formed on the side surface 103, and an external wiring 106 formed on the side surface 105.

As shown in FIG. 2, the four resin structural layers 10, the resin structural layer 20, the resin structural layer 30, and the resin structural layer 40 have a plate shape of the same size.

The surface of the resin structural layer 10 includes an upper surface 10a, and an end surface 10b and an end surface 10c which are connected to the end of the upper surface 10a and are orthogonal to the upper surface 10a. to The surface of the resin structural layer 20 includes an upper surface 20a, and an end surface 20b and an end surface 20c which are connected to the end of the upper surface 20a and are orthogonal to the upper surface 20a. The surface of the resin structural layer 30 includes an upper surface 30a, and an end surface 30b and an end surface 30c which are connected to the end of the upper surface 30a and are orthogonal to the upper surface 30a. The surface of the resin structural layer 40 includes an upper surface 40a, and an end surface 40b and an end surface 40c which are connected to the end of the upper surface 40a and are orthogonal to the upper surface 40a.

The resin structural layer 10, the resin structural layer 20, the resin structural layer 30, and the resin structural layer 40 are laminated in this order along the normal directions of the respective upper surface 10a, upper surface 20a, upper surface 30a, and upper surface 40a. The upper surface 40a of the resin structure layer 40 as the uppermost layer is the upper surface 101 of the electronic device 100 shown in FIG.

The resin structural layer 10, the resin structural layer 20, the resin structural layer 30, and the resin structural layer 40 are in the same plane with the end surface 10b, the end surface 20b, the end surface 30b, and the end surface 40b, and the end surface 10c, the end surface 20c, the end surface 30c, and the end surface 40c are in the same plane. The way to build up. The side surface 103 of the electronic device 100 shown in FIG. 1 is constituted by the end surface 10b, the end surface 20b, the end surface 30b, and the end surface 40b, and the side surface 105 of the electronic device 100 shown in FIG. 1 is constituted by the end surface 10c, the end surface 20c, the end surface 30c, and the end surface 40c.

That is, the two end faces adjacent to each other in the end surface 10b, the end surface 20b, the end surface 30b, and the end surface 40b constitute a continuous surface. Similarly, the two end faces adjacent to each other in the end surface 10c, the end surface 20c, the end surface 30c, and the end surface 40c constitute a continuous surface. Here, the term "continuous" on both faces means that the step between the two faces is as small as the extent of the wires formed on the two faces not being cut.

The resin structural layer 10 includes a plurality of electronic components 11 (11a to 11e) and a tree. The fat molded body 13 and the internal wiring 14.

The resin structure layer 20 includes a plurality of electronic components 21 (21a to 21d), a resin molded body 23, and an internal wiring 24.

The resin structure layer 30 includes a plurality of electronic components 31 (31a to 31c), a resin molded body 33, and internal wirings 34.

The resin structure layer 40 includes a plurality of electronic components 41 (41a to 41f), a resin molded body 43, and an external wiring 44.

The electronic component 11, the electronic component 21, the electronic component 31, and the electronic component 41 are electronic components such as a chip capacitor, a chip resistor, and an integrated circuit (IC). The number and type of the electronic component 11, the electronic component 21, the electronic component 31, and the electronic component 41 are not particularly limited.

The resin molded body 13, the resin molded body 23, the resin molded body 33, and the resin molded body 43 are substantially plate-shaped, and include polycarbonate (PC) or acrylonitrile-butadiene-styrene (ABS). ) and other resins. In addition, the shape of the resin molded body 13, the resin molded body 23, the resin molded body 33, and the resin molded body 43 is not particularly limited, and may be appropriately designed in accordance with the shape of the electronic device 100. The material of the resin molded body 13, the resin molded body 23, the resin molded body 33, and the resin molded body 43 may be other types of resins (for example, polypropylene (PP), elastomer, or the like).

The resin molded body 13 is fixed to the electronic component 11a to the electronic component 11e by embedding the electronic component 11a to the electronic component 11e therein. The resin molded body 13 is exposed from the upper surface 10a and the end surface 10b by the electronic component 11a and the electronic component 11b, and is electrically The electronic component 11a to the electronic component 11e are embedded in the sub-assembly 11c from the upper surface 10a and the end surface 10c, and the electronic component 11d and the electronic component 11e are exposed from the upper surface 10a.

The resin molded body 23 is fixed to the electronic component 21a to the electronic component 21d by embedding the electronic component 21a to the electronic component 21d therein. In the resin molded body 23, the electronic component 21a and the electronic component 21d are embedded in the electronic component 21a and the electronic component 21b from the upper surface 20a and the end surface 20b, and the electronic component 21c and the electronic component 21d are exposed from the upper surface 20a.

The resin molded body 33 is fixed by embedding the electronic component 31a to the electronic component 31c in the electronic component 31a to the electronic component 31c. In the resin molded body 33, the electronic component 31a to the electronic component 31c are embedded so that the electronic component 31a to the electronic component 31c are exposed from the upper surface 30a and the end surface 30b.

The resin molded body 43 is fixed to the electronic component 41a to the electronic component 41f by embedding the electronic component 41a to the electronic component 41f therein. In the resin molded body 43, the electronic component 41a and the electronic component 41b are exposed from the upper surface 40a and the end surface 40b, the electronic component 41c is exposed from the upper surface 40a and the end surface 40c, and the electronic component 41d to the electronic component 41f are exposed from the upper surface 40a. Parts 41a to 41f.

In the electronic component 11a to the electronic component 11e, the electronic component 21a to the electronic component 21d, the electronic component 31a to the electronic component 31c, and the electronic component 41a to the electronic component 41f, the resin molded body 13, the resin molded body 23, the resin molded body 33, and the resin The surface on which the molded body 43 is exposed is formed with electrodes 12a to 12e and electrodes 22a to The electrode 22d, the electrode 32a to the electrode 32c, and the electrode 42a to the electrode 42f.

The internal wiring 14 is formed in a predetermined pattern on the upper surface 10a of the resin structural layer 10. The internal wiring 14 is connected between the electronic component 11a of the upper surface 10a and the electrode 12a to the electrode 12e of the electronic component 11e. The electronic component 11a to the electronic component 11e and the internal wiring 14 constitute an internal electronic circuit in the resin structure layer 10.

The internal wiring 24 is formed in a predetermined pattern on the upper surface 20a of the resin structural layer 20. The internal wiring 24 is connected between the electronic component 21a of the upper surface 20a and the electrode 22a to the electrode 22d of the electronic component 21d. The electronic component 21a to the electronic component 21d and the internal wiring 24 constitute an internal electronic circuit in the resin structure layer 20.

The internal wiring 34 is formed in a predetermined pattern on the upper surface 30a of the resin structural layer 30. The internal wiring 34 is connected between the electronic component 31a to the electrode 30a to the electrode 32c of the electronic component 31c exposed on the upper surface 30a. The electronic component 31a to the electronic component 31c and the internal wiring 34 constitute an internal electronic circuit in the resin structure layer 30.

As shown in FIGS. 2 and 3, the external wiring 44 is formed in a predetermined pattern on the upper surface 40a of the resin structural layer 40 (the upper surface 101 of the electronic device 100). The external wiring 44 is connected between the electronic component 41a to the electrode 42a to the electrode 42f of the electronic component 41f exposed on the upper surface 40a. The electronic component 41a to the electronic component 41f and the external wiring 44 constitute an internal electronic circuit in the resin structure layer 40.

As shown in FIG. 4, the external wiring 104 is formed on the side surface 103 of the electronic device 100. As described above, the electronic component 11a, the electronic component 11b, the electronic component 21a, the electronic component 21b, the electronic component 31a, the electronic component 31c, the electronic component 41a, and the electronic body are exposed on the end surface 10b, the end surface 20b, the end surface 30b, and the end surface 40b constituting the side surface 103. zero Pieces 41b. The external wiring 104 is connected to the electronic component 11a, the electronic component 11b, the electronic component 21a, the electronic component 21b, the electronic component 31a to the electronic component 31c, the electronic component 41a, the electrode 12a of the electronic component 41b, the electrode 12b, the electrode 22a, and the electrode 22b. Electrode 32a to electrode 32c, electrode 42a, and electrode 42b. The electronic component 11a, the electronic component 11b, the electronic component 21a, the electronic component 21b, the electronic component 31a to the electronic component 31c, the electronic component 41a, the electronic component 41b, and the external wiring 104 constitute an external electronic circuit on the side surface 103.

The external wiring 104 may be formed by connecting two of the electronic component 11a, the electronic component 11b, the electronic component 21a, the electronic component 21b, the electronic component 31a to the electronic component 31c, the electronic component 41a, and the electronic component 41b. Alternatively, the external wiring 104 may be connected to one of the electronic component 11a, the electronic component 11b, the electronic component 21a, the electronic component 21b, the electronic component 31a to the electronic component 31c, the electronic component 41a, and the electronic component 41b, and assembled with the electronic component. The terminal (for example, a ground terminal) provided in the electronic device of the device 100 is configured to be in contact with each other.

In addition, in FIG. 4, the external wiring 44 formed in the upper surface 40a of the resin structural layer 40 is abbreviate|omitted by thickness thin. In the other FIGS. 5 to 8 (a), 8 (b), and 8 (c), the internal wiring 14 to the internal wiring 34 and the external wiring 44 are also omitted in the drawings viewed from the side. Icon.

As shown in FIG. 5, the external wiring 106 is formed on the side surface 105 of the electronic device 100. As described above, the electronic component 11c and the electronic component 41c are exposed on the end surface 10c, the end surface 20c, the end surface 30c, and the end surface 40c constituting the side surface 105. The external wiring 106 is connected to the electronic component 11c, the electrode 12c of the electronic component 41c, and the electrode 42c. Electronic zero The device 11c, the electronic component 41c, and the external wiring 106 constitute an external electronic circuit on the side surface 105.

In the example shown in FIG. 5, the external wiring 106 is formed to connect the electronic component 11c and the electronic component 41c, but may be connected to one of the electronic component 11c and the electronic component 41c, and the electronic device 100 may be assembled. The terminal (for example, the ground terminal) provided in the electronic device is configured to be in contact with each other.

The internal wiring 14, the internal wiring 24, the internal wiring 34, the external wiring 44, the external wiring 104, and the external wiring 106 can be easily formed, for example, by ejecting silver (Ag) ink by an inkjet printing method. The inkjet printing method is a printing method in which ink is ejected from a nozzle to deposit particulate ink on the ejection target surface.

As described above, the side surface 103 includes the resin structural layer 10, the resin structural layer 20, the resin structural layer 30, the end surface 10b of the resin structural layer 40, the end surface 20b, the end surface 30b, and the end surface 40b on the same plane. Similarly, the side surface 105 includes an end surface 10c, an end surface 20c, an end surface 30c, and an end surface 40c which are on the same plane. Therefore, the external wiring 104 and the external wiring 106 can be easily formed by ejecting silver (Ag) ink by an inkjet printing method.

As shown in FIG. 2, the electronic component 11a and the electronic component 11b are exposed on the upper surface 10a and the end surface 10b of the resin structural layer 10. Therefore, the internal electronic circuit of the resin structural layer 10 can be electrically connected to the external electronic circuit on the side surface 103 via the electronic component 11a or the electronic component 11b.

Further, the same electrode 12a in the electronic component 11a is exposed on both the upper surface 10a and the end surface 10b, whereby the internal wiring 14 can be connected to the external wiring 104. Connected to the same electrode 12a.

The electronic component 11c is exposed on the upper surface 10a and the end surface 10c of the resin structural layer 10. Therefore, the internal electronic circuit of the resin structural layer 10 can be electrically connected to the external electronic circuit on the side surface 105 via the electronic component 11c.

Similarly, the electronic component 21a and the electronic component 21b are exposed on the upper surface 20a and the end surface 20b of the resin structural layer 20. The electronic component 31a to the electronic component 31c are exposed on the upper surface 30a and the end surface 30b of the resin structural layer 30. The electronic component 41a and the electronic component 41b are exposed on the upper surface 40a and the end surface 40b of the resin structural layer 40. Thereby, the internal electronic circuit of the resin structural layer 20 and the external electronic circuit on the side surface 103 can be electrically connected via the electronic component 21a and the electronic component 21b. Further, the internal electronic circuit of the resin structural layer 30 and the external electronic circuit on the side surface 103 can be electrically connected via the electronic component 31a to the electronic component 31c. Further, the internal electronic circuit of the resin structural layer 40 and the external electronic circuit on the side surface 103 can be electrically connected via the electronic component 41a and the electronic component 41b.

Further, the electronic component 41c is exposed on the upper surface 40a and the end surface 40c of the resin structural layer 40. Thereby, the internal electronic circuit of the resin structural layer 40 can be electrically connected to the external electronic circuit on the side surface 105 via the electronic component 41c.

(Method of manufacturing electronic device)

Next, the electrons of the first embodiment are described with reference to FIGS. 6(a), 6(b), 6(c) to 8(a), 8(b), and 8(c). An example of a method of manufacturing the device 100 will be described.

(a) to (c) of FIG. 6 are diagrams showing a method of manufacturing the electronic device 100. A diagram of the first stage (the stage of fabrication of the resin structural layer 10). (a) to (c) of FIG. 7 are views showing a second stage (production stage of the resin structure layer 20) of the method of manufacturing the electronic device 100. (a) to (c) of FIG. 8 are diagrams showing a third stage (a stage of producing the resin structure layer 30, the resin structure layer 40, the external wiring 104, and the external wiring 106) of the method of manufacturing the electronic device 100.

6(a) to 6(c) are views for explaining first to third steps for manufacturing the electronic device 100, respectively. In (a) of FIG. 6 and (c) of FIG. 6, the upper half shows a plan view, and the lower half shows a side view. (b) of Fig. 6 is a cross-sectional view.

(a) to (c) of FIG. 7 respectively show diagrams for explaining the fourth to sixth steps for manufacturing the electronic device 100. In (a) and (c) of Fig. 7, the upper half shows a plan view and the lower half shows a side view. Fig. 7 (b) is a cross-sectional view.

(a) to (c) of FIG. 8 are diagrams for explaining the seventh to ninth steps for manufacturing the electronic device 100, respectively. In Figs. 8(a) and 8(b), the upper half shows a plan view and the lower half shows a side view. In (c) of FIG. 8, the left side is a side view corresponding to the side surface 103, and the right side is a side view corresponding to the side surface 105.

(first step)

As shown in FIG. 6( a ), first, the electronic component 11 ( 11 a to 11 e ) is attached by an adhesive (not shown) and temporarily fixed to the rectangular temporary fixing sheet 200 . At this time, the electronic component 11 (11a to 11e) is attached so that the surface on which the electrodes 12a to 12e are formed contacts the temporary fixing sheet 200.

The electronic component 11 a and the electronic component 11 b are attached to the temporary fixing piece 200 so as to be located at the end of the long side of the temporary fixing piece 200. Further, the electronic component 11c is attached to the temporary fixing piece 200 so as to be located at the end of the short side of the temporary fixing piece 200.

As a material of the temporary fixing sheet 200, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS) can be used. Wait. For the reason described later, the temporary fixing sheet 200 preferably contains a material that transmits ultraviolet rays and has flexibility.

The temporary fixation can be performed, for example, using an ultraviolet curable adhesive (not shown) applied to one surface of the temporary fixing sheet 200. For example, an ultraviolet curable adhesive is applied to a PET temporary fixing sheet 200 having a thickness of 50 μm in a thickness of 2 μm to 3 μm. This coating may be carried out by a method such as an inkjet printing method. Thereafter, the electronic component 11a to the electronic component 11e are respectively placed at the set positions. Then, the surface of the temporary fixing sheet 200 on which the electronic component 11a to the electronic component 11e is not temporarily fixed is irradiated with ultraviolet rays having a strength of, for example, 3000 mJ/cm ² to cure the adhesive, thereby temporarily fixing the electronic component 11a to the electronic component 11e. The sheet 200 is temporarily fixed.

(second step)

Next, as shown in FIG. 6(b), the temporary fixing piece 200 to which the electronic component 11a to the electronic component 11e is temporarily fixed is placed inside the molding die 210. At this time, the surface of the temporary fixing piece 200 to which the electronic component 11a to the electronic component 11e are attached is formed. The temporary fixing piece 200 is placed on the forming die 210 in such a manner that a space 230 is formed between the inner surfaces of the mold 210. Further, the side faces of the electronic component 11a to the electronic component 11c attached to the end portion of the temporary fixing piece 200 are in contact with the inner surface of the molding die 210. Then, the resin material is injected into the space 230 to perform injection molding of the resin.

The conditions for the injection molding may be appropriately selected depending on the resin. For example, when polycarbonate (PC) is used, injection molding is carried out at an injection resin temperature of 270 ° C and an injection pressure of 100 MPa. Alternatively, in the case of using acrylonitrile butadiene styrene (ABS), injection molding is carried out at an injection resin temperature of 180 ° C and an injection pressure of 20 kgf / cm ² .

Various resin materials can be used for the resin for injection molding. Further, the conditions for performing injection molding are not particularly limited.

(third step)

After the second step, the resin molded body 13 in which the electronic component 11a to the electronic component 11e is embedded is taken out from the molding die 210, and the temporary fixing sheet 200 is peeled off from the resin molded body 13. Thereby, the sheet joint faces of the electronic component 11a to the electronic component 11e and the resin molded body 13 which are in contact with the temporary fixing sheet 200 are exposed. The bonding surface of the sheet becomes the upper surface 10a of the resin structural layer 10.

When the temporary fixing sheet 200 is a PET film, the temporary fixing sheet 200 is largely deformed by the thermal change in the second step, so that the temporary fixing sheet 200 can be easily peeled off from the resin molded body 13.

As shown in FIG. 6(c), the internal wiring 14 of a predetermined pattern connected to the electrodes 12a to 12e of the electronic component 11a to the electronic component 11e is formed in a patch. Face (top surface 10a). Thereby, the production of the resin structural layer 10 including the electronic component 11a to the electronic component 11e, the resin molded body 13, and the internal wiring 14 is completed.

The formation of the internal wiring 14 can be performed by a method of spraying a conductive material (for example, silver ink or the like) by an inkjet printing method or the like, a method using an aerosol, or a method using a dispenser.

The internal wiring 14 can be easily formed with a high degree of freedom in circuit design by a suitable selection method, and each of the electronic components 11a to 11e can be easily electrically connected without soldering or the like. Further, in the industry, the electronic components 11a to 11e can be wired after the positions of the electronic components 11a to 11e are determined. Therefore, for example, compared with the case where the electronic components are aligned with the printed substrate, The electronic components 11a to 11e are electrically connected to each other accurately and easily.

Further, in the second step, since the side faces of the electronic component 11a to the electronic component 11c are in contact with the inner surface of the molding die 210, the electronic component 11a and the electronic component 11b are also exposed from the end surface 10b of the resin structural layer 10, and the electronic component 11c is also self-contained. The end surface 10c of the resin structural layer 10 is exposed.

(fourth step)

Next, as shown in FIG. 7(a), the electronic component 21 (21a to 21d) is attached by an adhesive (not shown) and temporarily fixed to the temporary fixing piece 300. The method in which the electronic component 21 is temporarily fixed to the temporary fixing piece 300 is the same as the method described in the first step, and thus detailed description thereof will be omitted.

The electronic component 21a and the electronic component 21b are attached to the temporary fixing piece 300 so as to be located at the end of the long side of the temporary fixing piece 300.

(fifth step)

As shown in FIG. 7(b), the temporary fixing piece 300 to which the electronic component 21a to the electronic component 21d is temporarily fixed and the resin structural layer 10 obtained in the fourth step are placed inside the molding die 310. At this time, the temporary fixing piece 300 and the resin structural layer 10 are formed in a shape in which the space 330 is formed between the surface of the temporary fixing piece 300 to which the electronic component 21a to the electronic component 21d is attached and the upper surface 10a of the resin structural layer 10. Mold 310.

The electronic component 21a and the side surface of the electronic component 21b attached to the end of the temporary fixing piece 300 are in contact with the inner surface of the molding die 310.

Then, the resin material is injected into the space 330 to perform injection molding of the resin. The conditions for performing the injection molding of the resin are the same as those of the second step, and thus detailed description thereof will be omitted.

(sixth step)

After the fifth step, the structure in which the resin molded body 23 in which the electronic component 21a to the electronic component 21d is embedded is laminated on the resin structural layer 10 is taken out from the molding die 310.

Even if a slight gap is formed between the end surface 10b of the resin structural layer 10 and the end surface 10c and the inner surface of the molding die 310, the resin material flows into the gap. Therefore, when taken out from the molding die 310, the side surface of the resin molded body 23 is flush with the end surface 10b and the end surface 10c of the resin structural layer 10.

Then, the temporary fixing sheet 300 is peeled off from the resin molded body 23. Thereby, the electronic component 21a to the electronic component 21d and the resin molded body 23 and the temporary fixing piece 300 The contact faces of the sheets are exposed. The bonding surface of the sheet becomes the upper surface 20a of the resin structural layer 20.

As shown in FIG. 7(c), the internal wiring 24 of a predetermined pattern that is connected to the electrodes 22a to 22d of the electronic component 21a to the electronic component 21d is formed on the sheet bonding surface (upper surface 20a). The method of forming the internal wiring 24 is the same as that of the third step, and thus detailed description thereof will be omitted.

By the fourth to sixth steps, the resin structural layer 20 including the electronic component 21a to the electronic component 21d, the resin molded body 23, and the internal wiring 24 can be laminated on the resin structural layer 10.

In the fifth step, since the side surfaces of the electronic component 21a and the electronic component 21b contact the inner surface of the molding die 310, the electronic component 21a and the electronic component 21b are exposed from the end surface 10b of the resin structural layer 10.

(seventh step)

Then, the resin structure layer 30 including the electronic component 31a to the electronic component 31c, the resin molded body 33, and the internal wiring 34 is laminated on the resin structural layer 20 by performing the same steps as the fourth to sixth steps.

As a result, as shown in FIG. 8( a ), a laminate in which the resin structure layer 20 is laminated on the resin structure layer 10 and the resin structure layer 30 is laminated on the resin structure layer 20 is formed. The electronic component 31a to the electronic component 31c are exposed from the end surface 30b of the resin structural layer 30.

(eighth step)

Secondly, by performing the same steps as the fourth step to the sixth step, The resin structure layer 40 of the electronic component 41a to the electronic component 41f, the resin molded body 43, and the external wiring 44 is laminated on the resin structural layer 30.

Thereby, as shown in FIG. 8(b), the resin structure layer 20 is formed on the resin structure layer 10, the resin structure layer 30 is laminated on the resin structure layer 20, and the resin structure is laminated on the resin structure layer 30. A layered body of layer 40. The electronic component 41a and the electronic component 41b are exposed from the end surface 40b of the resin structural layer 40. The electronic component 41c is exposed from the end surface 40c of the resin structural layer 40.

(the ninth step)

Next, the external wiring 104 is formed on the side surface 103 of the laminated body obtained in the eighth step, and the external wiring 106 is formed on the side surface 105.

In the same manner as the internal wiring 14 , the internal wiring 24 , the internal wiring 34 , and the external wiring 44 , the external wiring 104 and the external wiring 106 can be formed by spraying a conductive material (for example, silver ink or the like) by an inkjet printing method or the like. It is carried out by a method using an aerosol or a method using a dispenser.

Specifically, the laminated body obtained in the eighth step is disposed such that the side surface 103 faces the nozzle of the ink jet printing apparatus, and the external wiring 104 is formed on the side surface 103. Similarly, the laminated body obtained by the eighth step is disposed such that the side surface 105 faces the nozzle of the ink jet printing apparatus, and the external wiring 106 is formed on the side surface 105.

Thereby, the production of the electronic device 100 including the resin structure layer 10, the resin structure layer 20, the resin structure layer 30, the resin structure layer 40, the external wiring 104, and the external wiring 106 is completed.

(Modification)

In the above description, the side surface 103 is a flat surface, and the end surface 10b, the end surface 20b, the end surface 30b, and the end surface 40b are formed on the same plane. However, the side surface 103 can also be a curved surface. In this case, the inner surface of the molding die is designed such that the end surface 10b, the end surface 20b, the end surface 30b, and the end surface 40b are on the same curved surface, and the resin structural layer 10, the resin structural layer 20, the resin structural layer 30, and the resin structural layer 40 are formed. It can be layered. When the end surface 10b, the end surface 20b, the end surface 30b, and the end surface 40b exist on the same plane, the external wiring 104 can be easily formed on the side surface 103 by the inkjet printing method.

In addition, the number of layers of the resin structural layer constituting the electronic device 100 is not limited to the above four layers, and may be two or more layers.

Further, the resin structure layer 10 may be provided with a conductor (for example, a copper block) on which the upper surface 10a and the end surface 10b or the upper surface 10a and the end surface 10c are exposed. The internal wiring 14 is connected to the conductor. Thereby, the conductor is formed as a part of the internal wiring 14. Then, the external wiring 104 or the external wiring 106 is connected to the conductor of the portion exposed at the end surface 10b or the end surface 10c. Thereby, an electronic circuit having a three-dimensional structure in which the internal electronic circuit in the resin structural layer 10 and the external electronic circuit in the side surface 103 are connected via a conductor is produced.

(advantage)

As described above, the electronic device 100 includes the plurality of resin structure layers 10, the resin structure layer 20, the resin structure layer 30, and the resin structure layer 40. The surface of the resin structural layer 10 includes: an upper surface (first surface) 10a; and an end portion connected to the upper surface 10a and upper The end surface 10b and the end surface 10c which are not parallel to the surface 10a. Similarly, the surfaces of the resin structural layer 20, the resin structural layer 30, and the resin structural layer 40 respectively include an upper surface 20a and an end surface 20b, an end surface 20c, an upper surface 30a and an end surface 30b, an end surface 30c, an upper surface 40a, an end surface 40b, and an end surface. 40c.

The resin structural layer 10 includes an electronic component 11 and a resin molded body 13 in which the electronic component 11 is embedded and fixed so that the electronic component 11 is exposed on the upper surface 10a, and an internal wiring (first wiring) 14 formed on the upper surface 10a. And connected to the portion of the electronic component 11 that is exposed on the upper surface 10a. Similarly, the resin structure layer 20 includes an electronic component 21 , a resin molded body 23 , and an internal wiring (first wiring) 24 . The resin structure layer 30 includes an electronic component 31, a resin molded body 33, and an internal wiring (first wiring) 34. The resin structure layer 40 includes an electronic component 41 , a resin molded body 43 , and an external wiring (first wiring) 44 .

The electronic device 100 further includes an external wiring (second wiring) 104 and an external wiring (second wiring) 106 formed on at least one end surface 10b of the resin structural layer 10, the resin structural layer 20, the resin structural layer 30, and the resin structural layer 40. The end surface 10c, the end surface 20b, the end surface 20c, the end surface 30b, the end surface 30c, the end surface 40b, and the end surface 40c are connected to the electronic component 11, the electronic component 21, the electronic component 31, the electronic component 41 and the internal wiring 14, the internal wiring 24, and the inside. At least one of the wiring 34 and the external wiring 44.

Thereby, each of the resin structural layer 10, the resin structural layer 20, the resin structural layer 30, and the resin structural layer 40 may have an internal electronic circuit in which electronic components are connected by wiring. Then, the resin structural layer 10, the resin structural layer 20, and the resin structural layer 30. The internal electronic circuit of the resin structural layer 40 is connected to an external electronic circuit formed on the side surface 103, the external wiring 104 of the side surface 105, and the external wiring 106. As a result, it is possible to shorten the wiring length of the electronic circuit having a three-dimensional structure.

Further, the external wiring 104 and the external wiring 106 are formed on at least one end surface 10b, the end surface 10c, the end surface 20b, the end surface 20c, the end surface 30b, and the end surface 30c of the resin structure layer 10, the resin structure layer 20, the resin structure layer 30, and the resin structure layer 40. End face 40b, end face 40c. In other words, the resin structure layer 10, the resin structure layer 20, the resin structure layer 30, and the resin structure layer 40 can be electronically provided without providing the via conductors in the resin structure layer 10, the resin structure layer 20, the resin structure layer 30, and the resin structure layer 40. The circuits are connected to each other. Therefore, the manufacturing cost of the electronic device 100 can be suppressed.

The external wiring 104 and the external wiring 106 are connected to electronic components exposed from the end surface 10b, the end surface 10c, the end surface 20b, the end surface 20c, the end surface 30b, the end surface 30c, the end surface 40b, and the end surface 40c. Thereby, the electronic circuit of the resin structural layer 10, the resin structural layer 20, the resin structural layer 30, and the resin structural layer 40 can be easily connected to the electronic circuit formed on the side surface 103, the external wiring 104 of the side surface 105, and the external wiring 106. .

The end surface 10b, the end surface 20b, the end surface 30b, and the end surface 40b exist on the same plane. Similarly, the end surface 10c, the end surface 20c, the end surface 30c, and the end surface 40c exist on the same plane. Therefore, the external wiring 104 and the external wiring 106 can be easily formed.

The method of manufacturing the electronic device 100 includes at least the following steps (1) to (7).

(1) Attaching an electronic component (first electronic component) 11 to a temporary fixing piece (No. One piece) 200 steps.

(2) The temporary fixing piece 200 is placed in the molding die (first molding die) 210, and the resin is filled in the molding die 210, whereby the resin molded body (first resin molded body) 13 in which the electronic component 11 is embedded is placed. The step of forming.

(3) The sheet fixing surface (first sheet joining surface) which is in contact with the temporary fixing sheet 200 in the resin molded body 13 from the resin molded body 13 (corresponding to the upper surface 10a of the resin structural layer 10) The step of forming the internal wiring (first wiring) 14 connected to the electronic component 11 is formed.

(4) A step of attaching the electronic component (second electronic component) 21 to the temporary fixing piece (second piece) 300.

(5) The temporary molded piece 300 and the resin molded body 13 are placed in a molding die (second molding die) 310, and the resin is filled in the molding die 310, whereby the resin molded body in which the electronic component 21 is embedded is formed. The two resin molded body 23 is laminated on the sheet joint surface of the resin molded body 13. In addition, the resin molded body 23 is laminated on the sheet joint surface of the resin molded body 13 so as to correspond to the resin structural layer 10 so that the end surface (first end surface) 10b and the end surface (second end surface) 20b exist on the same plane. Above the surface 10a).

(6) The temporary fixing piece 300 is peeled off from the resin molded body 23, and internal wiring connected to the electronic component 21 is formed on the sheet bonding surface (second bonding surface) (corresponding to the upper surface 20a of the resin structural layer 20) ( The step of the second wiring) 24.

(7) forming at least one of the internal wiring 14, the electronic component 11, the internal wiring 24, and the electronic component 21 on at least one of the end surface 10b and the end surface 20b. The step of the external wiring (third wiring) 104.

In this manner, the electronic device 100 having the three-dimensional electronic circuit in which the internal electronic circuits of the resin structural layer 10 and the resin structural layer 20 are connected to each other can be easily manufactured without providing the via conductors in the resin structural layer 10 and the resin structural layer 20 . Therefore, the manufacturing cost of the electronic device 100 can be suppressed.

<Embodiment 2>

Hereinafter, an electronic device according to Embodiment 2 of the present invention will be described. In the electronic device 100 of the first embodiment, the resin structural layer 10 is formed such that the side faces of each of the resin structural layer 10, the resin structural layer 20, the resin structural layer 30, and the resin structural layer 40 are on the same plane. The resin structural layer 20, the resin structural layer 30, and the resin structural layer 40 are laminated. Then, the external wiring 104 and the external wiring 106 are formed on the side surface 103 and the side surface 105 of the electronic device 100, respectively. On the other hand, in the electronic device of the second embodiment, the second resin structure layer is laminated on the first resin structure layer so as to form a segment, and the external wiring is formed on the side surface of the second resin structure layer constituting the segment.

(Composition of electronic devices)

FIG. 9 is a plan view showing a schematic configuration of an electronic device 100A according to the second embodiment. Fig. 10 is a cross-sectional view taken along line XI-XI of Fig. 9.

As shown in FIGS. 9 and 10 , the electronic device 100A includes a resin structure layer 50 , a resin structure layer 60 , and an external wiring 108 .

The resin structural layer 50 and the resin structural layer 60 have a plate shape. The resin structural layer 60 has a smaller size than the resin structural layer 50, and is laminated on the upper surface 50a of the resin structural layer 50 in such a manner as to form a segment. The end face 60b of the resin structural layer 60 constitutes this segment. That is, the lower end portion (lower side) of the end surface 60b of the resin structural layer 60 is located in the upper surface 50a of the resin structural layer 50.

The end surface 60b of the resin structural layer 60 is inclined with respect to the upper surface 60a of the resin structural layer 60. The angle α between the end surface 60b of the resin structural layer 60 and the upper surface 60a is preferably 120 degrees or more and less than 180 degrees, more preferably 120 degrees or more and less than 150 degrees.

The resin structure layer 50 includes a plurality of electronic components 51 (51a to 51e), a resin molded body 53 and wirings 54.

The resin structure layer 60 includes a plurality of electronic components 61 (61a to 61c), a resin molded body 63, and an external wiring 64.

The electronic component 51 and the electronic component 61 are electronic components such as a capacitor, a resistor, and an IC. The number of the electronic component 51 and the electronic component 61 is not particularly limited.

The resin molded body 53 and the resin molded body 63 are substantially plate-shaped and include a resin such as polycarbonate (PC) or acrylonitrile butadiene styrene (ABS). In addition, the shape of the resin molded body 53 and the resin molded body 63 is not particularly limited, and may be appropriately designed in accordance with the shape of the electronic device 100A. The material of the resin molded body 53 and the resin molded body 63 may be other types of resins.

The resin molded body 53 is fixed to the electronic component 51 (51a to 51e) by embedding the electronic component 51 (51a to 51e) therein. In the resin molded body 53, the electronic component 51a to the electronic component 51e are embedded so that the electronic component 51a to the electronic component 51e are exposed from the upper surface 50a.

The resin molded body 63 is embedded in the electronic component 61 (61a to 61c) by The electronic component 61 (61a to 61c) is fixed inside. In the resin molded body 63, the electronic component 61a to the electronic component 61c are embedded so that the electronic component 61a - the electronic component 61c are exposed from the upper surface 60a.

Electrodes are formed on the surfaces of the electronic component 51a to the electronic component 51e and the electronic component 61a to the electronic component 61c exposed from the resin molded body 53 and the resin molded body 63. The electrodes 52c to 52e are electrodes of the electronic component 51c to the electronic component 51e, and the electrodes 62a to 62c are electrodes of the electronic component 61a to the electronic component 61c.

The wiring 54 is formed in a predetermined pattern on the upper surface 50a of the resin structural layer 50. The wiring 54 is connected between the electronic component 51a to the electronic component 51e exposed on the upper surface 50a, and the electrode 52a to the electrode 52e (the electrodes 52a and 52b are shown in (c) of FIG. 11). A part of the wiring 54 has the resin structure layer 60 laminated thereon, and is disposed inside the electronic device 100A. The remaining portion of the wiring 54 is disposed on the surface of the electronic device 100A.

The external wiring 64 is formed in a predetermined pattern on the upper surface 60a of the resin structural layer 60. The external wiring 64 is connected between the electronic component 61a to the electrode 62a to the electrode 62c of the electronic component 61c exposed on the upper surface 60a.

The external wiring 108 is on the end surface 60b and the upper surface 60a of the resin structure layer 60 and the upper surface 50a of the resin structure layer 50 to connect the electrode 52c of the electronic component 51c with the electronic component 61b, the electrode 62b of the electronic component 61c, and the electrode 62c. The way is formed in a prescribed pattern. Thereby, the electronic circuit in the resin structural layer 50 can be electrically connected to the electronic circuit in the resin structure layer 60.

The wiring 54, the external wiring 64, and the external wiring 108 can be used, for example, by using The inkjet printing method ejects silver (Ag) ink and is easily formed. The inkjet printing method is a printing method in which ink is ejected from a nozzle to deposit particulate ink on the ejection target surface.

As described above, the end surface 60b is not perpendicular to the upper surface 60a of the resin structure layer 60 but is inclined. Therefore, by arranging the nozzles so as to face both the end surface 60b and the upper surface 60a, both the external wiring 64 and the external wiring 108 can be formed in the same step.

(Method of manufacturing electronic device)

Next, an example of a method of manufacturing the electronic device 100A of the second embodiment will be described with reference to FIGS. 11(a) to 11(f). (a) to (f) of FIG. 11 are views for explaining an example of a method of manufacturing the electronic device 100A.

(a) to (f) of FIG. 11 are views for explaining first to sixth steps for manufacturing the electronic device 100A, respectively. In (a) of FIG. 11 and (d) of FIG. 11, the upper half shows a plan view, and the lower half shows a side view. (b) of FIG. 11 and (e) of FIG. 11 show a cross-sectional view. In (c) of FIG. 11 and (f) of FIG. 11, the upper half shows a plan view, and the lower half shows an arrow cross-sectional view taken along line XI-XI of the plan view.

(first step)

As shown in FIG. 11(a), first, the electronic component 51 (51a to 51e) is attached by an adhesive (not shown) and temporarily fixed to the rectangular temporary fixing piece 400. At this time, the electronic component 51 (51a to 51e) is attached so that the surface on which the electrodes 52a to 52e are formed contacts the temporary fixing piece 400. The method in which the electronic component 51 is temporarily fixed to the temporary fixing piece 400 is the same as the method described in the first embodiment, and thus is omitted. Slightly detailed description.

(second step)

Next, as shown in FIG. 11(b), the temporary fixing piece 400 to which the electronic component 51a to the electronic component 51e is temporarily fixed is placed inside the molding die 410. At this time, the temporary fixing piece 400 is placed on the molding die 410 so that the space 430 is formed between the surface of the temporary fixing piece 400 to which the electronic component 51a to the electronic component 51e is attached and the inner surface of the molding die 410. Then, the resin material is injected into the space 430 to perform injection molding of the resin. The conditions for performing the injection molding of the resin are the same as those of the second step of the first embodiment, and thus detailed description thereof will be omitted.

(third step)

As shown in FIG. 11( c ), after the second step, the resin molded body 53 in which the electronic component 51 a to the electronic component 51 e is embedded is taken out from the molding die 410 , and the temporary fixing sheet 400 is peeled off from the resin molded body 53 . As a result, the sheet joining faces that are in contact with the temporary fixing sheets 400 in the electronic component 51a to the electronic component 51e and the resin molded body 53 are exposed. The bonding surface of the sheet becomes the upper surface 50a of the resin structural layer 50.

A wiring 54 of a predetermined pattern that is connected to the electrodes 52a to 52e of the electronic component 51a to the electronic component 51e is formed on the sheet bonding surface. Thereby, the production of the resin structural layer 50 including the electronic component 51a to the electronic component 51e, the resin molded body 53, and the wiring 54 is completed.

The method of forming the wiring 54 is the same as the third step of the first embodiment, and thus detailed description thereof will be omitted.

(fourth step)

Next, as shown in FIG. 11(d), the electronic component 61 (61a to 61c) is attached by an adhesive (not shown) and temporarily fixed to the temporary fixing piece 500. The method in which the electronic component 61 is temporarily fixed to the temporary fixing piece 500 is the same as the method described in the first step, and thus detailed description thereof will be omitted.

(fifth step)

As shown in FIG. 11(e), the temporary fixing piece 500 to which the electronic component 61a to the electronic component 61c is temporarily fixed and the resin structural layer 50 obtained in the third step are placed inside the molding die 510. At this time, the temporary fixing piece 500 and the resin structure are formed so that the space 530 is formed between the surface of the temporary fixing piece 500 to which the electronic component 61a to the electronic component 61c is attached and the upper surface 50a of the resin structure layer 50 in which the wiring 54 is formed. The layer 50 is disposed on the forming die 510.

In the molding die 510, a part of the inner surface opposed to the upper surface 50a of the resin structural layer 50 has a protruding portion 513 that protrudes in contact with the upper surface 50a of the resin structural layer 50. Then, the temporary fixing piece 500 is placed on a portion of the inner surface opposite to the upper surface 50a of the resin structural layer 50 where the protruding portion 513 is not formed.

The side surface 511 of the protruding portion 513 is inclined with respect to the inner surface of the portion where the temporary fixing piece 500 is provided. The angle formed by the side surface 511 of the protruding portion 513 and the inner surface of the forming mold 510 where the temporary fixing piece 500 is provided is, for example, 120 degrees.

Then, the resin material is injected into the space 530 to perform injection molding of the resin. The conditions for performing the injection molding of the resin are the same as those of the second step, and thus detailed description thereof will be omitted.

(sixth step)

As shown in FIG. 11(f), after the fifth step, the structure in which the resin molded body 63 in which the electronic component 61a to the electronic component 61c is embedded is laminated on the resin structural layer 50 is taken out from the molding die 510. Then, the temporary fixing sheet 500 is peeled off from the resin molded body 63. As a result, the sheet joining faces that are in contact with the temporary fixing sheets 500 in the electronic component 61a to the electronic component 61c and the resin molded body 63 are exposed. The bonding surface of the sheet becomes the upper surface 60a of the resin structural layer 60.

Then, the external wiring 64 of a predetermined pattern that is connected to the electrodes 62a to 62c of the electronic component 61a to the electronic component 61c is formed on the sheet bonding surface. Thereby, the production of the resin structure layer 60 including the electronic component 61a to the electronic component 61c, the resin molded body 63, and the external wiring 64 is completed.

In addition, the side surface of the resin molded body 63 which is in contact with the side surface 511 of the protruding portion 513 of the molding die 510 is a surface which is inclined with respect to the sheet joining surface. This surface becomes the end surface 60b of the resin structural layer 60.

The end surface 60b is inclined with respect to the upper surface 60a of the resin structural layer 60 and faces upward of the resin structural layer 60. Therefore, when the external wiring 64 is formed, the external wiring 108 of a predetermined pattern in which the wiring 54 of the resin structural layer 50 is connected to the electronic component 61b, the electrode 62b of the electronic component 61c, and the electrode 62c is also formed on the end surface 60b.

The method of forming the external wiring 64 and the external wiring 108 is the same as the ninth step of the first embodiment, and thus detailed description thereof will be omitted.

Thereby, the manufacture of the electronic device 100A including the resin structure layer 50, the resin structure layer 60, and the external wiring 108 is completed.

(advantage)

The electronic device 100A includes a resin structure layer (first resin structure layer) 60 and a resin structure layer (second resin structure layer) 50. The resin structural layer 60 is laminated on the resin structural layer 50. A part (lower side) of the end portion of the end surface 60b of the resin structural layer 60 is located in the upper surface 50a of the resin structural layer 50. The external wiring 108 is formed on the end surface 60b so as to connect the electronic component 61 to the wiring 54 of the resin structural layer 50.

Thereby, the electronic circuit including the electronic component 61 and the external wiring 64 in the resin structural layer 60 and the electronic circuit including the electronic component 51 and the wiring 54 in the resin structural layer 50 can be easily connected. As a result, it is possible to shorten the wiring length of the electronic circuit having a three-dimensional structure.

The method of manufacturing the electronic device 100A includes at least the following steps (1) to (6).

(1) A step of attaching an electronic component (first electronic component) 51 to a temporary fixing piece (first piece) 400.

(2) The temporary fixing piece 400 is placed in the molding die (first molding die) 410, and the resin is filled in the molding die 410, whereby the resin molded body (first resin molded body) 53 in which the electronic component 51 is embedded is provided. The step of forming.

(3) The temporary fixing sheet 400 is peeled off from the resin molded body 53 to the sheet joining surface (first sheet joining surface) of the resin molded body 53 which is in contact with the temporary fixing sheet 400 (corresponding to the upper surface 50a of the resin structural layer 50) The step of forming a wiring (first wiring) 54 connected to the electronic component 51 is formed.

(4) Attaching the electronic component (second electronic component) 61 to the temporary fixing piece (No. Two pieces) steps of 500.

(5) The temporary molded piece 500 and the resin molded body 53 are placed in a molding die (second molding die) 510, and the resin is filled in the molding die 510, whereby the resin molded body in which the electronic component 61 is embedded is used. The two-resin molded body 63 is laminated on a part of the sheet joint surface of the resin molded body 53. In addition, the resin molded body 63 is laminated on the sheet joint surface of the resin molded body 53 so that a part of the end portion of the end surface 60b is positioned on the sheet joint surface of the resin molded body 53 (corresponding to the upper surface 50a of the resin structure layer 50). Above.

(6) The temporary fixing piece 500 is peeled off from the resin molded body 63, and external wiring connected to the electronic component 61 is formed on the sheet bonding surface (second bonding surface) (corresponding to the upper surface 60a of the resin structural layer 60). The second wiring 64 is formed by forming an external wiring (third wiring) 108 connected to at least one of the wiring 54, the electronic component 51, the external wiring 64, and the electronic component 61 on the end surface 60b.

In this manner, the electronic device 100A having the three-dimensional electronic circuit in which the internal electronic circuits of the resin structural layer 50 and the resin structural layer 60 are connected to each other can be easily manufactured without providing the via conductors in the resin structural layer 50 or the resin structural layer 60. Therefore, the manufacturing cost of the electronic device 100A can be suppressed.

It is to be understood that the embodiments disclosed herein are illustrative and not restrictive. The scope of the present invention is defined by the scope of the claims, and is intended to be

Claims (7)

An electronic device having a plurality of resin structure layers, and a surface of each of the plurality of resin structure layers includes: a first face; and an end connected to the first face and the first a second surface non-parallel, the plurality of resin structural layers being laminated along a normal direction of the first surface, each of the plurality of resin structural layers comprising: an electronic component; a resin molded body, The electronic component is embedded and fixed in a manner that the first surface is exposed; and a first wiring is formed on the first surface and is connected to the first surface of the electronic component In the exposed portion, the electronic device further includes: a second wiring formed on the second surface of at least one of the plurality of resin structural layers, and connected to at least one of the plurality of resin structural layers At least one of the electronic component and the first wiring of at least one of the plurality of resin structural layers. The electronic device according to claim 1, wherein the electronic component of at least one of the plurality of resin structural layers is exposed on the first surface and the second surface, the second The wiring is connected to a portion of the electronic component that is exposed on the second surface. The electronic device according to claim 1 or 2, wherein the second surface of each of the plurality of resin structural layers exists on the same plane. The electronic device according to claim 1, wherein the first resin structure layer of the plurality of resin structure layers is laminated to the first of the second resin structure layers of the plurality of resin structure layers Above the surface, a portion of an end of the second surface of the first resin structural layer is located in the first surface of the second resin structural layer, and the second wiring is to be the first resin The first part of the electronic component of the structural layer and the first wiring is connected to at least one of the electronic component of the second resin structural layer and the first wiring, and is formed in the first The second side of the resin structural layer. The electronic device according to claim 4, wherein an angle formed by the second surface of the first resin structural layer and the first surface of the first resin structural layer is 120 degrees or more And less than 180 degrees. A method of manufacturing an electronic device, comprising: a step of attaching a first electronic component to a first sheet; disposing the first sheet in a first forming mold, and filling a resin into the first forming mold a step of molding the first resin molded body in which the first electronic component is embedded; peeling the first sheet from the first resin molded body, and in the first resin molded body a step of forming a first wiring connected to the first electronic component over a first bonding surface of the first contact; a step of attaching the second electronic component to the second component; and the second film And the first resin molded body is disposed in the second molding die, and the resin is filled in the second molding die, thereby forming a second resin forming volume layer in which the second electronic component is embedded a step of the first resin molded body on the first sheet joint surface, the surface of the first resin molded body comprising: a first end surface connected to an end portion of the first sheet joint surface, and The first piece of joint surface is not parallel, the second tree The surface of the fat molded body includes: a second sheet joint surface in contact with the second sheet; and a second end surface connected to an end of the second sheet joint surface and not parallel to the second sheet joint surface, In the step of laminating, the second resin is formed into a volume layer on the first sheet of the first resin formed body in such a manner that the first end surface and the second end surface are present on the same plane. Further, the method of manufacturing an electronic device includes: peeling the second sheet from the second resin molded body, and forming a second electronic component on the second sheet joint surface a second wiring step; and forming the first wiring, the first electronic component, the second wiring, and the first portion on at least one of the first end surface and the second end surface The step of connecting at least one of the third wires of the two electronic components. A method of manufacturing an electronic device, comprising: a step of attaching a first electronic component to a first sheet; disposing the first sheet in a first forming mold, and filling a resin into the first forming mold a step of molding the first resin molded body in which the first electronic component is embedded; peeling the first sheet from the first resin molded body, and in the first resin molded body a step of forming a first wiring connected to the first electronic component over a first bonding surface of the first contact; a step of attaching the second electronic component to the second component; and the second film And the first resin molded body is disposed in the second molding die, and the resin is filled in the second molding die, thereby forming a second resin forming volume layer in which the second electronic component is embedded a step of a portion of the first sheet forming surface of the first resin formed body, the surface of the second resin formed body comprising: a second sheet joining surface in contact with the second sheet; and The end of the second piece of joint and a second non-parallel end surface of the joint surface, wherein in the step of laminating, the second resin is formed into a volume layer in a manner that a portion of the end portion of the end surface is located in the first sheet joint surface The electronic device manufacturing method further includes: peeling the second sheet from the second resin molded body to the second sheet, on a part of the first sheet joint surface of the first resin molded body Forming a second wiring connected to the second electronic component over the bonding surface, and forming the first wiring, the first electronic component, the second wiring, and the second electron on the end surface The step of at least one connected third wire of the part.