TWI626451B - Probe head architecture of probe and its probe card - Google Patents

Abstract

A probe head structure of a probe and a probe card thereof, which is formed by pressing a cylindrical elongated needle body, and is a long needle having a square cross section and a curved surface adjacent to each other The probe head is composed of a plurality of probes, a first fixing plate, a second fixing plate, a third fixing plate, a plurality of spacers, and a plurality of Composed of an insulating sheet, the plurality of probes, in the lower position, respectively, by a first fixing plate, the second fixing plate, and a third fixing plate with limited, a plurality of spacers and a plurality of The insulating sheet spaced in a staggered manner distributed on, the lower section of the Mining insulating sheet spacer segment to limit the amount of bending deformation of the probe; thereby to provide a suitable strength, elastic and can withstand high current vertical correlation of test probe and probe head architecture.

Description

Probe head architecture of probe and its probe card

The invention relates to the technical field of a probe head of a probe and a probe card thereof, in particular to a prismatic vertical probe formed by a press processing method and an assembled probe head structure.

The wafer testing method uses the probe to establish electrical contact between the circuit board of the test device and the plurality of contact pads of the semiconductor wafer. The probe is used to apply a voltage to the contact pad and cooperate with the control of the relevant test instrument and the software to determine whether the test semiconductor wafer is defective.

With the evolution of the integrated circuit process, the turns and spacing between circuits are shrinking, and the spacing between adjacent complex contact pads is gradually becoming the same and shrinking, so the probe head used in conjunction with it also encounters some problems. As shown in FIG. 1A, it is a schematic diagram of a probe distribution of a probe head used for testing such a wafer, wherein the probe 11 is a metal fine needle having a circular cross section, and the distance T between the probes 11 is the same. In the present embodiment, the pitch T is only 20 um. As the manufacturer desires to increase the amount of current for related testing, the shape probe can no longer increase due to the cross-sectional size, and gradually cannot meet the requirements of the manufacturer.

In addition, although the probe can use the microelectromechanical etching technology to produce a rectangular body with a rectangular cross section, the periphery is straight, and the probe head must be mounted on a matching ceramic substrate, but the ceramic substrate is The mounting hole for mounting is formed by laser processing, and the four corners of the mounting hole form a circular arc surface. As a result, during the test, the probe is frequently bent up and down due to the contact being compressed, and the right side of the right angle is easily over-installed. The arc surface of the hole is in contact with the friction, causing the dust to fall, which may affect the operation of the wafer test.

Furthermore, for the testing of microchips in the past, because the pitch of the complex contact pads is small and tends to be the same, a vertical probe card is generally used, and a probe having a smaller size (below 50 μm) must be used, and the elasticity and strength thereof are relatively high. It is difficult to control. If the probe is too short, the strength is good but the elasticity is poor. However, if it is too long, the amount of elastic deformation is large and the contact effect is poor, so there is a need for improved design.

The main object of the present invention is to provide a probe which is processed by pressing, and the probe is a long needle body having a square cross section and a curved surface adjacent to each other, thereby enabling the probe to be Under the condition of limited spacing, a probe with a larger cross-sectional area is provided, and the relevant test is performed at a higher current amount.

A secondary object of the present invention is to provide a multi-spaced limited probe head structure utilizing multiple spaced edges The louver limits the amount of deformation of the plurality of probes, maintains the preferred strength and moderate deformation of the probe, and ensures that the probe maintains good contact with the semiconductor wafer during the test.

For the above purpose, the probe of the present invention is formed by pressing a cylindrical elongated needle body, and is a long needle body having a square cross section and a curved surface at the adjacent side edges.

Furthermore, the probe head structure of the present invention includes a first fixing plate, a second fixing plate, a third fixing plate, a plurality of spacers, and a plurality of Insulating sheet, and a plurality of probes, the first distribution plate fixing a plurality of first positioning holes; the second distribution plate fixing a plurality of second positioning holes; fixing plate of the third plurality of third positioning distributed Hole Insulating sheet distributed plurality of limiting holes, the plurality of spacers and the plurality Insulating sheet stack in a staggered manner are fixed to the fixing plate between the first and the second fixing plate, and between the second fixing plate and the third plate is fixed; the probe is square and the section was a strip-shaped needle body having a curved surface at the adjacent sides, each of the probes being sequentially restricted from the top to the bottom to the first positioning hole, the plurality of limiting holes, the second positioning hole, and the plurality a limiting hole and the third positioning hole.

The embodiments of the present invention will be described in more detail below with reference to the drawings and the <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt;

11‧‧‧Probe

T‧‧‧ spacing

2‧‧‧ probe

21‧‧‧ curved surface

22‧‧ ‧ raised parts

23‧‧‧ Inside recess

3‧‧‧First fixed plate

31‧‧‧First positioning hole

4‧‧‧Second fixed plate

41‧‧‧Second positioning hole

5‧‧‧ third fixed plate

6‧‧‧ Spacer

61‧‧‧ hollow area

7‧‧‧ The insulating sheet

71‧‧‧Limited holes

1 is a schematic view of a probe distribution of a conventional probe head; FIG. 2A is a perspective view of a probe of the present invention; FIG. 2B is a partial enlarged view of the probe of the present invention; and FIG. 3 is an enlarged view of a lateral end surface of the probe of the present invention. Figure 4 is a cross-sectional view of the probe head of the probe card of the present invention; Figure 5 is a partial enlarged view of the probe head of the probe card of the present invention; Figure 6 is a first fixed plate, spacer and Schematic structural diagram of the insulating sheet; FIG. 7 of the first positioning hole enlarged schematic view of the present invention.

2A and 2B are respectively a perspective view and a partial enlarged view of the probe of the present invention, and FIG. 3 is an enlarged view of the lateral end surface of the probe of the present invention. The probe 2 of the present invention is a long needle body having a square cross section and a curved surface 21 at the adjacent side edges, and the processing method is formed by pressing a cylindrical elongated needle body, so that The curved surface 21 is formed at the intersection of the two sides. The cross-sectional dimension of the probe 2 is less than or equal to (50 um or less), and the processing method can increase the strength of the probe 2, and the degree of fit during assembly is better. In addition, when a plurality of probes are required to be assembled into a probe head, the present invention provides the probe 2 having the largest sectional area under the condition that the probe pitch is the same, thereby satisfying the requirement that the manufacturer desires to increase the current amount to perform the relevant test. In addition, at least one convex portion 22 is formed at an intermediate position of the probe 2, which is used as a position jam during assembly. use. Since the probe 2 of the present invention is formed by press working, in the present embodiment, the probe 2 is formed with two oppositely opposed convex portions 22 and two oppositely opposed concave portions 23.

4 and 5 are schematic cross-sectional views and partial enlarged views of a vertical elastic probe head made by using the present invention. The probe head structure of the present invention comprises a plurality of probes 2, a first fixed plate 3, a second fixed plate 4, a third fixed plate 5, a plurality of spacers 6, and a plurality of Insulating sheet 7.

The probe 2 is an elongated needle body having a square cross section and a curved surface at the adjacent side edges, and has at least one outwardly convex convex portion 22, which has two convex portions in the present embodiment. The starting portion 22 is located at the opposite side (as shown in Figure 5). The raised portion 22 is for snapping onto the second fixing plate 4. In addition, in the embodiment, the probe 2 is a miniature metal probe having a cross-sectional dimension of less than or equal to 50 um and having flexibility for flexible bending.

The first fixing plate 3, the second fixing plate 4, and the third fixing plate 5 are respectively used to limit the positions of the probes 2, the middle, and the bottom. The first fixing plate 3 is provided with a plurality of first positioning holes 31, the second fixing plate 4 is distributed with a plurality of second positioning holes 41, and the third fixing plate 5 is provided with a plurality of third positioning holes 51; The first positioning hole 31, the second positioning hole 41, and the third positioning hole 51 are the same size and shape as the probe 2 and smaller than the position of the convex portion 22. In addition, since the first positioning hole 31, the second positioning hole 41, and the third positioning hole 51 are small micro holes formed by laser processing, the adjacent surfaces of the micro holes and the adjacent vertical surfaces form a circular arc surface (as shown in FIG. 7). The first positioning hole 31 is shown, and the other second positioning holes 42 and the third positioning holes 51 are the same. However, the probe 2 of the present invention has a square section and the adjacent sides are also curved. Work with it.

The spacer 6 is an annular fixing piece (as shown in FIG. 6), and the intermediate hollow area 61 is a distribution area of the plurality of probes 2. In the embodiment, the spacer 6 is a metal foil for spacing and fixing each 7 position of the insulating sheet. Therefore, the spacer 6 does not necessarily need to be annular, and only needs to be spaced apart from the edge. 7 between the sheets must, without prejudice to the operation of the probe 2.

The 7 the distribution of the insulating sheet a plurality of stopper holes 71, 71 of the limiting hole size is greater than or equal to the lateral position where the projection portion 22 of the probe 2. When assembled, multiple spacers 6, multiple edges The fins 7 are respectively fixed between the first fixing plate 3 and the second fixing plate 4 and between the second fixing plate 4 and the third fixing plate 5 in a staggered stack manner. The Objective insulating sheet for limiting the amount of deformation of the curved pressure receiving probe 7, characterized spaced segments: Let the probe 2 when the vertical contact pressure, bending deformation can be small in curvature between the segments, Maintain proper strength to avoid excessive bending and maintain good contact with the wafer. In addition, in this embodiment, Insulating sheet 7 is composed of a transparent plastic material.

During assembly, the plurality of probes 2 are inserted into the plurality of second positioning holes 41 of the second fixing plate 4 from top to bottom. Due to the relationship of the protrusions 22, the intermediate position of the probe 2 is limited to The second fixing plate 4. After the spacer 6, Insulating sheet 7 are sequentially stacked on the second fixing plate 4, wherein a plurality of the probe 2 by a plurality of stopper holes 71 also, and finally the first fixing plate 1 is fixed to the topmost position, the completion of the superstructure Assembly. After that, the probe 2 can be pushed up, and then the lower layer of the plurality of spacers 6 and the plural are completed. 7 intersects insulating sheet stacking operation, with a plurality of process Placing the insulating sheet 7, the probe 2 is also lowered by the limiting hole 71, and finally the third fixing plate 5 is attached to the bottom, wherein the first fixing plate 3, the second fixing plate 4, the third The fixing plate 5 and the plurality of spacers 6 can be fixed by bolts or clamped and fixed by other members, so that a probe head can be assembled. A section of the probe 2 protruding from the first fixing plate 3 is for contacting the circuit board, and a section of the bottom end protruding from the third fixing plate 5 is for contacting the wafer to be tested.

In summary, in the assembled probe head of the present invention, each probe 2 is sequentially limited from the top to the bottom to the first positioning hole 31, the plurality of the limiting holes 71, the second positioning hole 41, and the plurality The limiting hole 71 and the third positioning hole 51 are inside. plural Insulating spacer sheet 7 segment limit the amount of bending deformation probes 2, the probe 2 with the longitudinal length of the longer design, it has good elasticity and strength. In addition, the probe 2 has a square-shaped design. This type of vertical probe provides the ability to withstand higher currents for related tests, meets the needs of manufacturers, and overcomes the testing problems of such wafers. Furthermore, the adjacent sides of the probe have a curved surface design, which is more accurate in assembly.

The above is only a preferred embodiment for explaining the present invention, and is not intended to limit the present invention in any way, and any modifications or alterations to the present invention made in the spirit of the same invention. All should still be included in the scope of the intention of the present invention.

Claims (10)

The utility model relates to a probe which is formed by pressing a cylindrical long strip body, has a square cross section and has a curved stripe at the adjacent sides, and the cross-sectional width of the probe is less than or equal to 50 um. The intermediate position of the probe forms at least one convex portion, which is formed by pressing, and the position forms two convex portions opposite to each other and two opposite concave portions. The probe of claim 1, wherein the probe has at least one raised portion at the intermediate section. a probe head structure of a probe card, comprising: a first fixing plate, a second fixing plate, a third fixing plate, a plurality of spacers, a plurality of insulating sheets, and a plurality of probes; wherein the first fixing plate is distributed a plurality of first positioning holes; the second fixing plate is distributed with a plurality of second positioning holes; the third fixing plate is distributed with a plurality of third positioning holes; the insulating sheet is distributed with a plurality of limiting holes, and the plurality a spacer, the plurality of insulating sheets are respectively fixed between the first fixing plate and the second fixing plate, and between the second fixing plate and the third fixing plate in a staggered stack manner; and the probe is broken a long strip body having a square shape and a curved surface adjacent to each other, wherein each probe is sequentially restricted from the top to the bottom to the first positioning hole, the plurality of limiting holes, and the second a positioning hole, the plurality of limiting holes, and the third positioning hole. The probe head structure of the probe card of claim 3, wherein the first positioning hole, the second positioning hole, and the third positioning hole have the same shape as the probe. The probe head architecture of the probe card of claim 3, wherein the intermediate section of the probe has at least one raised portion. The probe head structure of the probe card of claim 5, wherein the first positioning hole, the second positioning hole and the third positioning hole are smaller than a size of the probe having the position of the protrusion. The probe head structure of the probe card of claim 5, wherein the plurality of limit holes are greater than or equal to a size of the probe having the position of the protrusion. The probe head structure of the probe card of claim 5, wherein the protrusion is restricted between the first fixing plate and the second fixing plate. The probe head structure of the probe card according to claim 3, wherein the insulating sheet is a transparent plastic sheet. The probe head structure of the probe card according to claim 3, wherein the plurality of spacers are annular fixing pieces, and the hollow portion in the middle is a distribution area of the plurality of probes.