TWI625523B - Detection system - Google Patents
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Abstract
一種偵測系統,係包含有一用以裝載作用液體以與作用氣體發生反應之反應設備,一裝載有該作用液體之液體供應設備,以及一用以操控該液體供應設備供應該作用液體至該反應設備之控制設備,俾藉由該控制設備依據來自該反應設備之液位資料而操控液體供應設備供應作用液體至該反應設備中,以達到自動補充作用液體之目的。 A detection system includes a reaction device for loading a reaction liquid to react with a reaction gas, a liquid supply device for loading the reaction liquid, and a liquid supply device for controlling the liquid supply device to supply the reaction liquid to the reaction The control equipment of the equipment, through which the control equipment controls the liquid supply equipment to supply the working liquid to the reaction equipment according to the liquid level data from the reaction equipment, so as to achieve the purpose of automatically replenishing the working liquid.
Description
本發明係關於一種半導體製程設備,特別是關於一種用於用於半導體回銲製程之偵測系統。 The present invention relates to a semiconductor process equipment, and more particularly to a detection system for a semiconductor reflow process.
隨著半導體封裝技術的演進,半導體裝置(Semiconductor device)已開發出不同的封裝型態。習知覆晶封裝製程係先將半導體晶片藉由複數銲錫凸塊設於一基板上,再回銲(reflow)該些銲錫凸塊,之後以底膠包覆該些銲錫凸塊,藉以避免該些銲錫凸塊遭受汙損及損毀。 With the evolution of semiconductor packaging technology, semiconductor devices have developed different packaging types. The conventional flip-chip packaging process is to first set a semiconductor wafer on a substrate with a plurality of solder bumps, then reflow the solder bumps, and then cover the solder bumps with a primer to avoid this. These solder bumps were subject to fouling and damage.
回銲之目的係利用高溫熔融銲錫凸塊,以利於銲錫凸塊接固該半導體晶片與該基板,且於目前的回銲作業中,均會偵測回銲爐內的氧含量(符合需求之規格係小於50ppm),以確保回銲品質。 The purpose of reflow is to use high temperature melting solder bumps to facilitate the solder bumps to fix the semiconductor wafer and the substrate. In the current reflow operation, the oxygen content in the reflow furnace is detected (in line with the requirements). Specifications are less than 50ppm) to ensure reflow quality.
如第1A圖所示,習知用於偵測回銲爐內的氧含量之偵測系統1係藉由導管120將回銲爐內之作用氣體A導入一分析儀(analyzer)12,之後藉由反應槽10內之電解液(electrolytic solution)F將該作用氣體A的氫離子與氧離子分離,此時,位於該反應槽10中之金屬感測探棒11會與該氧離子產生化學反應,該分析儀12藉此計算出氧氣的濃 度值(即氧含量),並將此濃度值顯示在該分析儀12上。 As shown in FIG. 1A, the conventional detection system 1 for detecting the oxygen content in a reflow furnace uses a pipe 120 to introduce the active gas A in the reflow furnace into an analyzer 12, and then The electrolytic solution F in the reaction tank 10 separates the hydrogen ions and oxygen ions of the reactive gas A. At this time, the metal sensing probe 11 located in the reaction tank 10 will chemically react with the oxygen ions. The analyzer 12 then calculates the concentration of oxygen Value (ie, oxygen content), and the concentration value is displayed on the analyzer 12.
惟,習知偵測系統1在回銲作業時需不斷分析,使得該電解液F因持續產生化學反應而會減少(部分減少係因蒸發作用),致使電解液F’的液面降低,如第1B圖所示,此時,該金屬感測探棒11之大部分結構會裸露而接觸空氣,導致該金屬感測探棒11之裸露段11a會鏽蝕損壞,故於回銲作業之偵測過程中,該金屬感測探棒11將大幅降低氧氣濃度測量的精準度,因而導致後續製程相關的機台操作異常。 However, the conventional detection system 1 needs to continuously analyze during the reflow operation, so that the electrolyte F will be reduced due to the continuous chemical reaction (part of the reduction is due to evaporation), which will cause the level of the electrolyte F 'to decrease. As shown in FIG. 1B, at this time, most of the structure of the metal sensing probe 11 will be exposed and contact the air, which will cause the exposed section 11a of the metal sensing probe 11 to rust and be damaged. During the process, the metal sensing probe 11 will greatly reduce the accuracy of the oxygen concentration measurement, thus causing abnormal operation of the machine related to subsequent processes.
因此,如何克服上述習知技術中之問題,實已成目前亟欲解決的課題。 Therefore, how to overcome the problems in the above-mentioned conventional technologies has become an urgent problem to be solved.
鑑於上述習知技術之缺失,本發明遂提供一種偵測系統,係包括:反應設備,係用以裝載一作用液體俾與一作用氣體發生反應;液體供應設備,係裝載有該作用液體;以及控制設備,係依據該反應設備之作用液體之液位資料,以操控該液體供應設備供應該作用液體至該反應設備。 In view of the lack of the above-mentioned conventional technology, the present invention provides a detection system including: a reaction device for loading a working liquid and a reaction gas; a liquid supply device for loading the working liquid; and The control device is based on the liquid level data of the reaction liquid of the reaction device to control the liquid supply device to supply the reaction liquid to the reaction device.
前述之偵測系統中,該反應設備係為箱體,其具有一用以裝載該作用液體之儲存空間、及一設於儲存空間中之監控器,且該監控器係用以偵測該作用液體於該儲存空間內之高度位置。例如,該作用液體於該儲存空間內之高度位置係定義有高水位、低水位或警戒水位。 In the aforementioned detection system, the reaction device is a box, which has a storage space for loading the working liquid, and a monitor set in the storage space, and the monitor is used to detect the function. The height of the liquid in the storage space. For example, the height position of the acting liquid in the storage space is defined as a high water level, a low water level, or a warning water level.
前述之偵測系統中,該反應設備具有監控器,係用以偵測該作用液體之液位並傳遞訊息至該控制設備。 In the aforementioned detection system, the reaction device has a monitor for detecting the liquid level of the acting liquid and transmitting a message to the control device.
前述之偵測系統中,復包括分析設備,係包含電子儀器與偵測器,該偵測器係用以偵測該反應之其中一特徵,且該電子儀器係用以分析處理該特徵。例如,該偵測器係為探棒式,其平置或斜躺於該反應設備內。進一步,該偵測器係置於該反應設備之底部,較佳者,該偵測器係低於該反應設備所設定之警戒水位。 The foregoing detection system further includes an analysis device, which includes an electronic instrument and a detector, the detector is used to detect one of the characteristics of the response, and the electronic instrument is used to analyze and process the characteristic. For example, the detector is a probe type, and it is lying flat or reclining in the reaction device. Further, the detector is placed at the bottom of the reaction device. Preferably, the detector is lower than the alert water level set by the reaction device.
前述之偵測系統中,該液體供應設備係包含檢測器,係用以量測檢查該液體供應設備內之作用液體之液位。 In the aforementioned detection system, the liquid supply device includes a detector for measuring and checking a liquid level of a working liquid in the liquid supply device.
前述之偵測系統中,該液體供應設備係包含連通該反應設備之管路,該管路設有一用以開放或阻止該作用液體進入該反應設備之開關。 In the aforementioned detection system, the liquid supply equipment includes a pipeline communicating with the reaction equipment, and the pipeline is provided with a switch for opening or preventing the action liquid from entering the reaction equipment.
前述之偵測系統中,該控制設備係包含控制裝置,係用以接收及處理該反應設備之作用液體之液位資料,以操控該液體供應設備供應該作用液體至該反應設備。例如,該控制設備復包含電子裝置,係用以接收來自該控制裝置之訊號並發出警示訊號。 In the aforementioned detection system, the control device includes a control device for receiving and processing liquid level data of the reaction liquid of the reaction device to control the liquid supply device to supply the reaction liquid to the reaction device. For example, the control device includes an electronic device for receiving a signal from the control device and issuing a warning signal.
由上可知,本發明之偵測系統,主要藉由該控制設備依據該反應設備之作用液體之液位資料而操控該液體供應設備供應該作用液體至該反應設備,以自動補充該作用液體至該反應設備內,故相較於習知技術,本發明之偵測系統在回銲作業時,即使該電解液因不斷產生化學反應致使其量減少,該反應設備內之作用液體液面仍可維持正常,使該偵測器(例如金屬電極棒)之結構幾乎不會裸露接觸空氣,因而可有效避免該偵測器鏽蝕損壞。 It can be known from the above that the detection system of the present invention mainly controls the liquid supply device to supply the reaction liquid to the reaction device by the control device according to the liquid level data of the reaction liquid of the reaction device to automatically supplement the reaction liquid to In the reaction equipment, compared with the conventional technology, the detection system of the present invention is capable of reducing the amount of the liquid in the reaction equipment during the reflow operation even if the amount of the electrolyte is reduced due to the continuous chemical reaction. Keep it normal so that the structure of the detector (such as a metal electrode rod) is barely exposed to the air, so it can effectively prevent the detector from rusting and damaging.
1,2‧‧‧偵測系統 1,2‧‧‧detection system
10‧‧‧反應槽 10‧‧‧ reaction tank
11‧‧‧金屬感測探棒 11‧‧‧ Metal Sensing Probe
11a‧‧‧裸露段 11a‧‧‧exposed section
12‧‧‧分析儀 12‧‧‧ Analyzer
120‧‧‧導管 120‧‧‧ Catheter
21‧‧‧分析設備 21‧‧‧analysis equipment
20‧‧‧反應設備 20‧‧‧Reaction equipment
200‧‧‧監控器 200‧‧‧Monitor
201‧‧‧線路 201‧‧‧ route
211‧‧‧偵測器 211‧‧‧ Detector
212‧‧‧電子儀器 212‧‧‧Electronic instruments
220‧‧‧收集部 220‧‧‧Collection Department
23‧‧‧液體供應設備 23‧‧‧Liquid supply equipment
23a‧‧‧箱體 23a‧‧‧Box
23b‧‧‧檢測器 23b‧‧‧detector
23c‧‧‧管路 23c‧‧‧Pipe
230‧‧‧開關 230‧‧‧Switch
24‧‧‧控制設備 24‧‧‧Control Equipment
24a‧‧‧控制裝置 24a‧‧‧Control device
24b‧‧‧通訊裝置 24b‧‧‧communication device
24c‧‧‧電子裝置 24c‧‧‧Electronic device
240‧‧‧顯示器 240‧‧‧ Display
241,242,243‧‧‧主機 241,242,243‧‧‧Host
A‧‧‧作用氣體 A‧‧‧acting gas
C‧‧‧容置空間 C‧‧‧accommodation space
F,F’‧‧‧電解液 F, F’‧‧‧electrolyte
F1,F2‧‧‧作用液體 F1, F2 ‧‧‧ acting liquid
H‧‧‧高水位 H‧‧‧high water level
h‧‧‧高度 h‧‧‧ height
L,d‧‧‧低水位 L, d‧‧‧Low water level
S‧‧‧儲存空間 S‧‧‧Storage
W‧‧‧警戒水位 W‧‧‧ alert water level
第1A圖為習知偵測系統之剖面示意圖;第1B圖為習知偵測系統顯現問題之剖面示意圖;第2圖為本發明之偵測系統之示意圖;以及第3圖係為對應第2圖之另一實施例之局部配置示意圖。 Figure 1A is a schematic cross-sectional view of a conventional detection system; Figure 1B is a schematic cross-sectional view of a problem in a conventional detection system; Figure 2 is a schematic view of a detection system of the present invention; and Figure 3 is a corresponding second FIG. Is a schematic partial configuration diagram of another embodiment.
以下藉由特定的具體實施例說明本發明之實施方式,熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供熟悉此技藝之人士之瞭解與閱讀,並非用以限定本發明可實施之限定條件,故不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「下」、「底」及「一」等之用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。 It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The limited conditions are not technically significant. Any modification of the structure, change of the proportional relationship, or adjustment of the size shall still fall within the scope of this invention without affecting the effects and goals that the invention can produce. The technical content disclosed by the invention can be covered. At the same time, the terms such as "upper", "lower", "bottom", and "one" cited in this specification are only for the convenience of description, and are not intended to limit the scope of the present invention. The change or adjustment of the relationship shall be regarded as the scope in which the present invention can be implemented without substantially changing the technical content.
第2圖係為本發明之偵測系統2之示意圖。如第2圖所示,所述之偵測系統2係包括:一反應(reaction)設備20、一包含一偵測器211(圖中僅表示其佈設位置,並未顯示 其詳細構件)與一電子儀器212(圖中僅表示其佈設位置,並未顯示其詳細構件)之分析設備21、一液體供應設備23(圖中僅表示其佈設位置,並未顯示其詳細構件)以及一控制設備24(圖中僅表示其佈設位置,並未顯示其詳細構件)。 FIG. 2 is a schematic diagram of the detection system 2 of the present invention. As shown in FIG. 2, the detection system 2 includes: a reaction device 20 and a detector 211 (the figure only shows the layout position and is not shown) Its detailed components) and an electronic device 212 (the figure only shows its layout position, and its detailed components are not shown), an analysis device 21, a liquid supply device 23 (the figure only shows its layout position, and its detailed components are not shown) ) And a control device 24 (only the layout position is shown in the figure, and its detailed components are not shown).
於本實施例中,該偵測系統2係用於偵測回銲爐(圖略)之作用氣體(氧氣)含量。 In this embodiment, the detection system 2 is used to detect the active gas (oxygen) content in the reflow furnace (not shown).
所述之反應設備20係用以裝載一作用液體F1,以與回銲爐之作用氣體A發生反應。 The reaction device 20 is used to load an action liquid F1 to react with the action gas A of the reflow furnace.
於本實施例中,該反應設備20可為封閉式或開放式箱體(tank),其具有一用以裝載該作用液體F1之儲存空間(storage space)S及一設於該儲存空間S中之監控器(monitor)200,該監控器200係用以偵測該作用液體F1於該儲存空間S內之高度位置,如高水位(high water level)H、低水位(low water level)L或警戒水位(warning stage)W等。 In this embodiment, the reaction device 20 may be a closed or open tank, which has a storage space S for loading the working liquid F1 and a storage space S provided in the storage space S. Monitor 200, which is used to detect the height position of the working liquid F1 in the storage space S, such as high water level H, low water level L or The warning stage (warning stage) W and so on.
再者,該作用液體F1係為電解液(electrolytic solution),且該作用氣體A係包含氫離子與氧離子,以令該電解液將該作用氣體A之氫離子與氧離子分離,亦即該反應係為分離該氫離子與該氧離子。 Furthermore, the working liquid F1 is an electrolytic solution, and the working gas A contains hydrogen ions and oxygen ions, so that the electrolyte separates the hydrogen ions and oxygen ions of the working gas A, that is, the The reaction system is to separate the hydrogen ion and the oxygen ion.
所述之分析設備21係為一種分析儀(analyzer),其種類繁多,並無特別限制。 The analysis device 21 is an analyzer. There are many types of analyzers, and there is no particular limitation.
所述之偵測器211係用以偵測該反應之其中一特徵,如含氧量。 The detector 211 is used to detect one of the characteristics of the reaction, such as the oxygen content.
於本實施例中,該偵測器211係為探棒式,如金屬電極棒(metal electrode bar),且該偵測器211係躺置於該反應設備20之儲存空間S內之底部。例如,該偵測器211係為平躺或斜躺於該儲存空間S內,較佳地,該偵測器211於放置後之高度h不超過該警戒水位W,故當該作用液體F1之液面高於該警戒水位W時,該作用液體F1能淹沒該偵測器211,以避免該偵測器211(金屬電極棒)接觸環境(如氣體)而受損(如生鏽)。因此,該偵測器211於平躺時能確保於回銲作業之分析過程中,其完全沉浸於該作用液體F1中。應可理解地,該偵測器211亦可直立於該反應設備20之底側上且沉浸於該作用液體F1中,如第1A圖所示之金屬感測探棒11之設置方式。 In this embodiment, the detector 211 is a probe type, such as a metal electrode bar, and the detector 211 is lying on the bottom of the storage space S of the reaction device 20. For example, the detector 211 is lying flat or reclining in the storage space S. Preferably, the height h of the detector 211 after being placed does not exceed the warning water level W, so when the acting liquid F1 When the liquid level is higher than the warning water level W, the action liquid F1 can flood the detector 211 to prevent the detector 211 (metal electrode rod) from contacting the environment (such as gas) and being damaged (such as rust). Therefore, the detector 211 can ensure that it is completely immersed in the action liquid F1 during the analysis process of the reflow operation when lying down. It should be understood that the detector 211 can also stand upright on the bottom side of the reaction device 20 and be immersed in the working liquid F1, as shown in FIG. 1A for the arrangement of the metal sensing probe 11.
所述之電子儀器212係接收該偵測器211所偵測到之特徵(含氧量)並分析處理該特徵(含氧量)。 The electronic device 212 receives the feature (oxygen content) detected by the detector 211 and analyzes and processes the feature (oxygen content).
於本實施例中,該電子儀器212係鄰接該反應設備20底部且電性連接該偵測器211。 In this embodiment, the electronic device 212 is adjacent to the bottom of the reaction device 20 and is electrically connected to the detector 211.
再者,該電子儀器212具有一收集部(intake)220,如埠口結構,其用以收集(或導入)回銲爐之作用氣體A。 Furthermore, the electronic instrument 212 has an intake 220, such as a port structure, which is used to collect (or introduce) the action gas A of the reflow furnace.
因此,該作用氣體A會從該收集部220進入該電子儀器212並流至該反應設備20,以令該作用氣體A、偵測器211及作用液體F1相互反應作用,例如該作用液體F1分解該作用氣體A之氫離子與氧離子,此時,該氧離子會觸發該偵測器211。之後,該電子儀器212會分析該作用氣體A之化學變化、作用液體F1變化及/或該偵測器211之 感應變化,以整理出關於該作用氣體A之氣體濃度(gas concentration)之資料(如含氧量)。 Therefore, the action gas A enters the electronic device 212 from the collection unit 220 and flows to the reaction device 20, so that the action gas A, the detector 211, and the action liquid F1 react with each other, for example, the action liquid F1 is decomposed. The hydrogen ions and oxygen ions of the acting gas A, at this time, the oxygen ions will trigger the detector 211. After that, the electronic instrument 212 analyzes the chemical change of the acting gas A, the change of the acting liquid F1 and / or the detector 211. Induced changes to sort out data (such as oxygen content) on the gas concentration of the reactive gas A.
另外,有關該分析設備21之配置組件可依需求設計,並不限於上述兩組件(即該偵測器211與該電子儀器212),特此述明。 In addition, the configuration components of the analysis device 21 can be designed according to requirements, and are not limited to the two components described above (ie, the detector 211 and the electronic instrument 212), which are hereby described.
所述之液體供應設備23係包含一具有容置空間C之箱體(tank body)23a、一液位式檢測器(liquid level gage)23b及至少一管路(pipe)23c。 The liquid supply device 23 includes a tank body 23a having a receiving space C, a liquid level gage 23b, and at least one pipe 23c.
於本實施例中,該箱體23a可為封閉式或開放式,其容置空間C用以裝載作用液體F2。 In this embodiment, the box body 23a may be a closed type or an open type, and the containing space C is used for loading the working liquid F2.
再者,該檢測器23b係例如浮子開關(float switch),其用以量測檢查該容置空間C內之作用液體F2之液位(例如,是否高於低水位d)。 In addition, the detector 23b is, for example, a float switch, which is used to measure and check the liquid level (for example, whether it is higher than the low water level d) of the working liquid F2 in the accommodation space C.
又,該管路23c係用以導通該箱體23a之容置空間C與該反應設備20之儲存空間S,以供應(或補充)該作用液體F2至該儲存空間S。例如,該管路23c設有一開關230,以開放或阻止該作用液體F2流入該儲存空間S。 In addition, the pipeline 23c is used to communicate the accommodation space C of the box 23a and the storage space S of the reaction device 20 to supply (or supplement) the working liquid F2 to the storage space S. For example, the pipeline 23c is provided with a switch 230 to open or prevent the action liquid F2 from flowing into the storage space S.
所述之控制設備24係包含至少一控制裝置24a、至少一通訊裝置24b及至少一電子裝置24c。 The control device 24 includes at least one control device 24a, at least one communication device 24b, and at least one electronic device 24c.
於本實施例中,該控制裝置24a係具有例如中央處理器(Central Processing Unit,簡稱CPU)、可程式邏輯控制器(programmable logic controller,簡稱PLC)或其它電路模組(circuit module)等電子元件,其用以接收及處理該監控器200所發出之液位資料,以操控該箱體23a(如該開 關230)供應(或補充)該作用液體F2至該反應設備20。具體地,該控制裝置24a可藉由線路201或無線方式接收該監控器200所發出之液位資料。應可理解地,該控制裝置24a亦可藉由有線或無線方式接收及處理該檢測器23b所發出之液位資料。 In this embodiment, the control device 24a includes electronic components such as a central processing unit (CPU), a programmable logic controller (PLC), or other circuit modules. , Which is used to receive and process the liquid level data sent by the monitor 200 to control the box 23a (such as the opening (230) to supply (or supplement) the reaction liquid F2 to the reaction device 20. Specifically, the control device 24a can receive the liquid level data sent by the monitor 200 through the line 201 or wirelessly. It should be understood that the control device 24a can also receive and process the liquid level data sent by the detector 23b by wired or wireless means.
再者,該通訊裝置24b係如天線或線路等,其用以傳輸訊號或資料。具體地,該通訊裝置24b可應用例如觸控(如透明導電膜)、射頻(Radio frequency,簡稱RF)、Wi-Fi、非對稱數位用戶迴路(Asymmetric Digital Subscriber Line,ADSL)、超高速數位用戶迴路(Very-high-bit-rate digital subscriber line,簡稱VDSL)、無線區域網路(Wireless local area network,簡稱WLAN)、藍芽(Bluetooth)、光纖(fiber)等方式進行製作。 Furthermore, the communication device 24b is, for example, an antenna or a line, and is used to transmit signals or data. Specifically, the communication device 24b can be applied to, for example, touch (such as transparent conductive film), radio frequency (RF), Wi-Fi, Asymmetric Digital Subscriber Line (ADSL), and ultra-high-speed digital users. Very-high-bit-rate digital subscriber line (VDSL for short), Wireless local area network (WLAN), Bluetooth, Fiber, etc.
又,該電子裝置24c係例如工業電腦(Industrial PC,簡稱IPC)或其它機電裝置等之電腦配置,其包含顯示器240、主機241等相關配備,使該控制裝置24a可藉由該通訊裝置24b(如天線或線路)傳輸訊號至該電子裝置24c,以令該電子裝置24c能分析/處理/儲存來自該控制裝置24a之資料,且該電子裝置24c亦能發出警示訊號(圖略),以提醒作業員該作用液體F1,F2之液位過低,其中,該警示訊號係例如燈號、聲音、氣味、手機訊息(messages of mobile phone)等方式。 In addition, the electronic device 24c is a computer configuration such as an industrial computer (IPC) or other electromechanical devices, which includes a display 240, a host 241, and other related equipment, so that the control device 24a can use the communication device 24b ( (Such as an antenna or a line) to transmit a signal to the electronic device 24c, so that the electronic device 24c can analyze / process / store data from the control device 24a, and the electronic device 24c can also issue a warning signal (not shown) to remind The liquid level of the liquids F1 and F2 is too low for the operator. The warning signals are, for example, lights, sounds, odors, messages of mobile phone, and the like.
另外,如第3圖所示,該電子裝置24c係例如包含複數主機241,242,243,以分析/處理/儲存相關資料。 In addition, as shown in FIG. 3, the electronic device 24c includes, for example, a plurality of hosts 241, 242, 243 to analyze / process / store related data.
因此,該偵測系統2於使用過程中,當該監控器200偵測到該反應設備20之儲存空間S中之作用液體F1之液面等於或低於該低水位L時,該監控器200會傳遞訊號至該控制裝置24a,此時,該控制裝置24a會開啟該開關230,使該作用液體F2流入該反應設備20之儲存空間S中。接著,當該監控器200偵測到該儲存空間S中之作用液體F1,F2之液面達到高水位H時,該監控器200會傳遞訊號至該控制裝置24a,此時,該控制裝置24a會關閉該開關230,使該作用液體F2無法流入該儲存空間S中。藉此,達到自動補充作用液體(電解液)之目的。 Therefore, during the use of the detection system 2, when the monitor 200 detects that the level of the working liquid F1 in the storage space S of the reaction device 20 is equal to or lower than the low water level L, the monitor 200 A signal is transmitted to the control device 24a. At this time, the control device 24a turns on the switch 230, so that the working liquid F2 flows into the storage space S of the reaction device 20. Then, when the monitor 200 detects that the liquid level of the working liquids F1, F2 in the storage space S reaches a high water level H, the monitor 200 transmits a signal to the control device 24a. At this time, the control device 24a The switch 230 is closed, so that the working liquid F2 cannot flow into the storage space S. Thereby, the purpose of automatically replenishing the working liquid (electrolyte) is achieved.
另一方面,當該檢測器23b量測到該箱體23a之容置空間C中之作用液體F2之液面等於或低於該低水位d時,該檢測器23b會傳遞訊號至該控制裝置24a,此時,該控制裝置24a會傳輸訊號至該電子裝置24c,以令該電子裝置24c提醒作業員該作用液體F2之液位過低,使該作業員能立即補充該作用液體F2至該箱體23a。 On the other hand, when the detector 23b measures that the liquid level of the working liquid F2 in the accommodation space C of the box 23a is equal to or lower than the low water level d, the detector 23b transmits a signal to the control device 24a, at this time, the control device 24a will transmit a signal to the electronic device 24c, so that the electronic device 24c reminds the operator that the liquid level of the working liquid F2 is too low, so that the operator can immediately replenish the working liquid F2 to the箱体 23a。 23a.
應可理解地,當該監控器200偵測到該反應設備20之作用液體F1之液面低於警戒水位W時,該監控器200會傳遞訊號至該控制裝置24a,此時,該控制裝置24a會傳輸訊號至該電子裝置24c,以令該電子裝置提醒作業員該作用液體F1之液位過低,使該作業員能立即補充該作用液體F1至該反應設備20。 It should be understood that when the monitor 200 detects that the liquid level of the working liquid F1 of the reaction device 20 is lower than the warning water level W, the monitor 200 transmits a signal to the control device 24a. At this time, the control device 24a will transmit a signal to the electronic device 24c, so that the electronic device reminds the operator that the liquid level of the working liquid F1 is too low, so that the worker can immediately replenish the working liquid F1 to the reaction device 20.
另一方面,該控制裝置24a、電子儀器212、監控器200及該檢測器23b也能記錄/分析各種作用液體(電解液) 之物理或化學變化,如溫度、酸鹼值(PH)、含鹽度(salt)、時間(time)、流速(flow speed)/耗損(consumption)等,並傳送至該電子裝置24c進行大數據(Big Data)統計。 On the other hand, the control device 24a, the electronic device 212, the monitor 200, and the detector 23b can also record / analyze various working liquids (electrolyte) Physical or chemical changes such as temperature, pH, salt, time, flow speed / consumption, etc., and send it to the electronic device 24c for big data (Big Data) statistics.
綜上所述,本發明之偵測系統2係藉由液體供應設備23與該控制設備24之設計,以自動補充該作用液體F2至該反應設備20內,故相較於習知技術,本發明之偵測系統2在回銲作業時,即使該電解液F因不斷產生化學反應致使其量減少,該反應設備20內之作用液體F1,F2的液面仍會高於該低水位L,因而該偵測器211之結構幾乎不會裸露接觸空氣(特別是,當該偵測器211躺置時,其於放置後之高度h不會超過該警戒水位W,致使該偵測器211於該偵測系統2正常運作時完全不會裸露接觸空氣),進而有效避免該偵測器211鏽蝕損壞。 In summary, the detection system 2 of the present invention is designed by the liquid supply device 23 and the control device 24 to automatically replenish the working liquid F2 into the reaction device 20, so compared with the conventional technology, the detection system 2 During the reflow operation of the detection system 2 of the invention, even if the amount of the electrolytic solution F is reduced due to continuous chemical reactions, the level of the working liquids F1 and F2 in the reaction device 20 will still be higher than the low water level L. Therefore, the structure of the detector 211 is barely exposed to the air (especially, when the detector 211 is lying down, its height h after being placed does not exceed the warning water level W, causing the detector 211 to The detection system 2 will not be exposed to air at all during normal operation), thereby effectively preventing the detector 211 from being rusted and damaged.
因此,於回銲作業之偵測過程中,該分析設備21之偵測器211得以維持氧氣濃度測量的精準度,而能提升回銲作業可靠性,使後續製程相關的機台操作正常。 Therefore, during the detection process of the reflow operation, the detector 211 of the analysis device 21 can maintain the accuracy of the oxygen concentration measurement, which can improve the reliability of the reflow operation and make the machines related to subsequent processes operate normally.
上述實施例係用以例示性說明本發明之原理及其功效,而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下,對上述實施例進行修改。因此本發明之權利保護範圍,應如後述之申請專利範圍所列。 The above embodiments are used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be listed in the scope of patent application described later.
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| TW201534769A (en) * | 2010-03-19 | 2015-09-16 | Novellus Systems Inc | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system |
| US20160367716A1 (en) * | 2014-04-18 | 2016-12-22 | Thomas A. Conroy | Method and system for switching between packages in a diffusion device based on a liquid level sensor |
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| TW201534769A (en) * | 2010-03-19 | 2015-09-16 | Novellus Systems Inc | Electrolyte loop with pressure regulation for separated anode chamber of electroplating system |
| TW201518205A (en) * | 2013-11-01 | 2015-05-16 | Gen Optics Corp | Hydrogen solution manufacturing equipment |
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