TWI621282B - Light-emitting diode device with fluorine-containing phosphor composition - Google Patents
Light-emitting diode device with fluorine-containing phosphor composition Download PDFInfo
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- TWI621282B TWI621282B TW103131484A TW103131484A TWI621282B TW I621282 B TWI621282 B TW I621282B TW 103131484 A TW103131484 A TW 103131484A TW 103131484 A TW103131484 A TW 103131484A TW I621282 B TWI621282 B TW I621282B
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910052731 fluorine Inorganic materials 0.000 title claims abstract description 49
- 239000011737 fluorine Substances 0.000 title claims abstract description 49
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 54
- 230000005284 excitation Effects 0.000 claims description 13
- 238000000295 emission spectrum Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 230000005855 radiation Effects 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 8
- 238000000695 excitation spectrum Methods 0.000 claims description 7
- 230000000737 periodic effect Effects 0.000 claims description 7
- 238000001228 spectrum Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 17
- 239000000047 product Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 7
- 229910020440 K2SiF6 Inorganic materials 0.000 description 4
- 238000002441 X-ray diffraction Methods 0.000 description 4
- 238000000975 co-precipitation Methods 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910000590 K2MnF6 Inorganic materials 0.000 description 2
- 229910003202 NH4 Inorganic materials 0.000 description 2
- 208000003464 asthenopia Diseases 0.000 description 2
- 229910052792 caesium Inorganic materials 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 229910052701 rubidium Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- GEYXPJBPASPPLI-UHFFFAOYSA-N manganese(III) oxide Inorganic materials O=[Mn]O[Mn]=O GEYXPJBPASPPLI-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
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Abstract
本發明揭示一種使用含氟螢光材料之發光二極體,其包含一發光二極體晶片受電源驅動放出不連續光,其中不連續光包含發光之發光時間及不發光之空白時間;以及設置於發光二極體晶片上之含氟螢光材料。含氟螢光材料吸收發光二極體晶片發出之不連續光並放出一螢光,其中,含氟螢光材料具有一螢光半衰期,且螢光半衰期大於或等於空白時間。 The invention discloses a light-emitting diode using a fluorine-containing fluorescent material, which comprises a light-emitting diode chip driven by a power source to emit discontinuous light, wherein the discontinuous light includes a light-emitting time and a blank time of no light emission; and setting A fluorine-containing phosphor material on a light-emitting diode wafer. The fluorine-containing phosphor material absorbs discontinuous light emitted from the light-emitting diode wafer and emits a fluorescent light, wherein the fluorine-containing fluorescent material has a fluorescence half-life and the fluorescence half-life is greater than or equal to the blank time.
Description
本發明係關於一種使用含氟螢光材料之發光二極體,尤其是指包含一種螢光半衰期大於或等於發光二極體不發光之空白時間之含氟螢光材料,可利用螢光填補空白時間以減少發光二極體之閃爍現象者。 The invention relates to a light-emitting diode using a fluorine-containing fluorescent material, in particular to a fluorine-containing fluorescent material containing a blank time with a fluorescence half-life greater than or equal to that of the light-emitting diode, which can be filled with fluorescence. Time to reduce the flicker phenomenon of the light-emitting diode.
發光二極體目前全球用電量約有兩成來自於照明,傳統照明領域使用之白熾燈耗電量高、發光效率低、使用壽命短,各國政府皆意識到禁用白熾燈為有效率的節能管道,故將白熾燈列為首要管制重點。澳洲於2007年率先提出淘汰白熾燈作為節能政策之方案,中國於2012年起階段性禁用白熾燈,至2015年包括美、英、日、歐盟等超過9個大國都將全面禁用,全球性之禁用白熾燈政策使得白光發光二極體於數年內即大規模地取代傳統白熾燈照明。 At present, about 20% of the global electricity consumption of the LEDs comes from lighting. The incandescent lamps used in the traditional lighting field have high power consumption, low luminous efficiency and short service life. Governments all recognize that the incandescent lamps are disabled for efficient energy conservation. Pipes, so incandescent lamps are listed as the primary control focus. In 2007, Australia took the lead in proposing the elimination of incandescent lamps as an energy-saving policy. China has phased off incandescent lamps in 2012. By 2015, more than 9 major countries including the United States, Britain, Japan and the European Union will be completely banned. The ban on incandescent lamps has enabled white light-emitting diodes to replace traditional incandescent lighting on a large scale within a few years.
由於發光二極體具有較高發光效率(高於高壓鈉燈或水銀燈)、壽命長(可達10萬小時以上,為高壓鈉燈之5倍以上及水銀燈之10倍以上)、體積小(可塑性強,配合應用設備小型化)、耗電量低(用電量為一般燈泡之1/8至1/10、日光燈之1/2,可節省電力約50~90%)、環保無汞、發熱量低(操作時熱 輻射量低)以及反應速度佳(可高頻率操作)等優點,可克服過去白熾燈與日光燈所面臨之問題。由於發光二極體同時兼具省電與環保之效果,因此被喻為「新世代之綠色照明」。 Because the light-emitting diode has higher luminous efficiency (higher than high-pressure sodium lamp or mercury lamp), long life (up to 100,000 hours or more, more than 5 times that of high-pressure sodium lamp and 10 times or more of mercury lamp), small volume (strong plasticity, With the application equipment miniaturization), low power consumption (power consumption is 1/8 to 1/10 of the general bulb, 1/2 of the fluorescent lamp, which can save about 50~90% of electricity), environmental protection, no mercury, low calorific value (heat during operation The low radiation level and good reaction speed (high frequency operation) can overcome the problems faced by incandescent lamps and fluorescent lamps in the past. Because the light-emitting diode has both power saving and environmental protection effects, it is called "the green lighting of the new generation."
早期發展直流發光二極體為市場趨勢,將發光二極體應用於市電(交流電)時必須藉由變壓器與整流器等轉換設備,將交流電源轉換為直流電源,以驅動發光二極體於交流電下正常運作,然而,此種轉換設備運作時將產生大量熱能,造成元件壽命縮短、電力損耗、發光效率降低等問題,即使發光二極體之壽命可長達10萬小時以上,由於一般轉換設備壽命僅為2萬小時,使得發光二極體被提前汰換或產生額外更換轉換設備之成本,相當不經濟。 Early development of DC light-emitting diodes is a market trend. When using LEDs for commercial power (AC), it is necessary to convert AC power to DC power by converting equipment such as transformers and rectifiers to drive the LEDs under AC. Normal operation, however, such conversion equipment will generate a large amount of thermal energy when operating, resulting in problems such as shortened component life, power loss, and reduced luminous efficiency, even if the life of the LED can be as long as 100,000 hours or more, due to the general conversion equipment life. Only 20,000 hours, making the LEDs replaced in advance or generating additional replacement conversion equipment costs, is quite uneconomical.
因此,現今已研發出交流發光二極體之技術,淘汰體積大且重量重之轉換設備,並可節省直流/交流電間轉換時造成之15~30%電力耗損,此外,交流發光二極體擁有低電路能量損耗、防止靜電衝擊等性質,可提升整體發光效率。 Therefore, the technology of the AC light-emitting diode has been developed to eliminate the bulky and heavy-duty conversion equipment, and can save 15-30% of the power loss caused by the DC/AC conversion. In addition, the AC LED has Low circuit energy loss, prevention of electrostatic shock and other properties can improve overall luminous efficiency.
然而,交流發光二極體在交流定電壓驅動下將產生週期性明滅(頻閃),例如交流發光二極體於電壓為80伏特,頻率為120赫茲(Hz)之交流電環境下操作,轉換電壓時將形成1/120秒,約相當於8.3毫秒之時間差,造成發光閃爍之現象,用於一般照明時容易引起使用者眼睛疲勞。 However, the AC light-emitting diode will generate periodic blinking (stroboscopic) under AC constant voltage driving. For example, the AC light-emitting diode operates at an AC environment with a voltage of 80 volts and a frequency of 120 Hertz (Hz). It will form 1/120 second, which is equivalent to the time difference of 8.3 milliseconds, causing the phenomenon of illuminating and flickering, which is easy to cause eye fatigue of the user when used for general illumination.
本發明揭示了一種使用含氟螢光材料之發光二極體,包含受電源驅動放出不連續光之發光二極體晶片,其中不連 續光包含發光之發光時間以及不發光之空白時間;以及設置於發光二極體晶片上之含氟螢光材料。含氟螢光材料吸收發光二極體晶片發出之不連續光並放出螢光,其中含氟螢光材料具有大於或等於空白時間之螢光半衰期。由於含氟螢光材料之螢光半衰期大於或等於空白時間,螢光可填補空白時間,減低發光二極體週期性明滅造成之光線閃爍現象。 The invention discloses a light-emitting diode using a fluorine-containing fluorescent material, comprising a light-emitting diode chip driven by a power source to emit discontinuous light, wherein the light-emitting diode chip is not connected The continuation light includes a luminescence time of luminescence and a blank time of no luminescence; and a fluorofluorescent material disposed on the illuminating diode chip. The fluorine-containing phosphor material absorbs discontinuous light emitted from the light-emitting diode wafer and emits fluorescence, wherein the fluorine-containing phosphor material has a fluorescence half-life greater than or equal to the blank time. Since the fluorescence half-life of the fluorine-containing fluorescent material is greater than or equal to the blank time, the fluorescence can fill the blank time and reduce the light flicker caused by the periodic extinction of the light-emitting diode.
此外,本發明另揭示了一種使用含氟螢光材料之發光二極體,包含以一整流電路電性連接於一交流電源之發光二極體晶片與設置於發光二極體晶片上之一含氟螢光材料。發光二極體晶片之基板上磊晶形成複數發光單元,複數發光單元之間相互以串聯、並聯或串並聯之方式電性連接,並隨交流電源之輸入週期性地導通及非導通,每一週期非導通時間導致發光單元發光時出現一空白時間,含氟螢光材料吸收第一發光二極體或第二發光二極體發出的光後放出一螢光,由於含氟螢光材料之螢光半衰期大於或等於空白時間,螢光可填補空白時間,降低空白時間造成發光二極體晶片之閃爍現象。 In addition, the present invention further discloses a light-emitting diode using a fluorine-containing phosphor material, comprising a light-emitting diode chip electrically connected to an alternating current power source by a rectifying circuit and one of the light-emitting diode chips disposed on the light-emitting diode chip. Fluoride fluorescent material. Forming a plurality of light-emitting units on the substrate of the light-emitting diode chip, and the plurality of light-emitting units are electrically connected in series, parallel or series-parallel, and are periodically turned on and off according to the input of the alternating current power source, each of which is periodically turned on and off. The periodic non-conduction time causes a blank time when the light-emitting unit emits light, and the fluorine-containing fluorescent material absorbs the light emitted by the first light-emitting diode or the second light-emitting diode, and then emits a fluorescent light, due to the fluorescent light of the fluorine-containing fluorescent material. The light half-life is greater than or equal to the blank time, and the fluorescence can fill the blank time, and the blanking time is reduced to cause the flashing of the LED chip.
其中,含氟螢光材料之通式為A2[MF6]:Mn4+,A選自Li、Na、K、Rb、Cs、NH4所構成之群組,M則選自Ge、Si、Sn、Ti、Zr所構成之群組。含氟螢光材料之螢光特性可包含:激發光波長介於350至500奈米、放射光波長介於600至700奈米、螢光半衰期為毫秒(msec)等級,另可具有兩個激發波峰。 Wherein, the fluorine-containing fluorescent material has the general formula A2[MF6]:Mn4+, A is selected from the group consisting of Li, Na, K, Rb, Cs, and NH4, and M is selected from the group consisting of Ge, Si, Sn, and Ti. A group of Zr. The fluorescent characteristics of the fluorine-containing fluorescent material may include: excitation light having a wavelength of from 350 to 500 nm, a radiation wavelength of from 600 to 700 nm, a fluorescence half-life of milliseconds (msec), and two excitation peaks.
1‧‧‧發光二極體晶片 1‧‧‧Light Emitter Wafer
10‧‧‧基板 10‧‧‧Substrate
12‧‧‧發光二極體 12‧‧‧Lighting diode
14‧‧‧第一發光二極體 14‧‧‧First Light Emitting Diode
16‧‧‧第二發光二極體 16‧‧‧Second light-emitting diode
2‧‧‧含氟螢光材料 2‧‧‧Fluorescent Fluorescent Materials
3‧‧‧交流電源 3‧‧‧AC power supply
30‧‧‧濾波電解電容 30‧‧‧Filter electrolytic capacitor
32‧‧‧橋式整流電路 32‧‧‧Bridge rectifier circuit
T‧‧‧空白時間 T‧‧‧ blank time
第一A圖為本發明一實施例之立體結構示意圖(一)。 The first A is a schematic perspective view (1) of an embodiment of the present invention.
第一B圖為本發明一實施例之電路示意圖。 The first B diagram is a schematic circuit diagram of an embodiment of the invention.
第一C圖為本發明另一實施例之立體結構示意圖(二)。 The first C is a schematic view of a three-dimensional structure (2) according to another embodiment of the present invention.
第一D圖為本發明另一實施例之立體結構示意圖(三)。 The first D diagram is a schematic perspective view of a three-dimensional structure (3) according to another embodiment of the present invention.
第二A圖為本發明另一實施例之電路示意圖。 FIG. 2A is a schematic circuit diagram of another embodiment of the present invention.
第二B圖為本發明另一實施例之電流畸變圖。 The second B diagram is a current distortion diagram of another embodiment of the present invention.
第三A圖為本發明又一實施例之含氟螢光材料X光繞射圖。 The third A is a X-ray diffraction diagram of a fluorine-containing fluorescent material according to still another embodiment of the present invention.
第三B圖為本發明又一實施例之含氟螢光材料激發與放射光譜圖。 Figure 3B is an excitation and emission spectrum of a fluorine-containing fluorescent material according to still another embodiment of the present invention.
第三C圖為本發明又一實施例之含氟螢光材料放射光譜面積相對比值與加熱溫度相對作圖。 The third C is a graph showing the relative ratio of the emission spectrum area of the fluorine-containing phosphor material to the heating temperature according to still another embodiment of the present invention.
第三D圖為本發明又一實施例之含氟螢光材料螢光衰減圖。 The third D is a fluorescence attenuation diagram of the fluorine-containing fluorescent material according to still another embodiment of the present invention.
本發明係關於一種使用含氟螢光材料之發光二極體,此含氟螢光材料具有較長之螢光半衰期,其吸光後放出之螢光可填補發光二極體發光時之空白時間,降低發光二極體之閃爍現象。 The invention relates to a light-emitting diode using a fluorine-containing fluorescent material, wherein the fluorine-containing fluorescent material has a long fluorescence half-life, and the fluorescent light emitted after the light absorption can fill the blank time when the light-emitting diode emits light. Reduce the flicker of the LED.
請參閱第一A圖與第一B圖,其係本發明第一實施例之立體結構示意圖(一)與電路示意圖。如圖所示,本發明一實施例使用含氟螢光材料之交流發光二極體,其至少包含一發光二極體晶片1與一含氟螢光材料2,發光二極體晶片1電性連接於一交流電源3,並以交流電源3直接驅動發光二極體晶片1,含氟螢光材料2設置於發光二極體晶片1上(第一A圖中採用個別封裝於各第一發光二極體14與各第二發光二極體16上之方式)。 發光二極體晶片1包含一基板10與分別設置於基板10上之複數第一發光二極體14與複數第二發光二極體16。第一發光二極體14間與第二發光二極體16間可透過串聯、並聯或串並聯之方式電性連接。如第一B圖所示,本實施例中,第一發光二極體14間彼此以串聯之方式電性連接,第二發光二極體16間彼此亦以串聯之方式電性連接,串聯之第一發光二極體14與串聯之第二發光二極體16間則以並聯之方式電性連接,且第一發光二極體14與第二發光二極體16之導通方向相反。 Please refer to FIG. 1A and FIG. 2B, which are schematic diagrams (1) and circuit diagrams of a first embodiment of the present invention. As shown in the figure, an embodiment of the present invention uses an alternating current light-emitting diode of a fluorine-containing phosphor material, which comprises at least one light-emitting diode wafer 1 and a fluorine-containing phosphor material 2, and the light-emitting diode wafer 1 is electrically Connected to an AC power source 3, and directly drives the LED chip 1 with the AC power source 3, and the fluorine-containing phosphor material 2 is disposed on the LED body 1 (the first A picture is individually packaged in each of the first illuminations) The manner of the diode 14 and each of the second light-emitting diodes 16). The LED chip 1 includes a substrate 10 and a plurality of first LEDs 14 and a plurality of LEDs 16 respectively disposed on the substrate 10. The first light-emitting diodes 14 and the second light-emitting diodes 16 can be electrically connected in series, in parallel or in series and parallel. As shown in FIG. B, in the embodiment, the first LEDs 14 are electrically connected to each other in series, and the second LEDs 16 are electrically connected to each other in series, in series. The first light-emitting diodes 14 and the second light-emitting diodes 16 connected in series are electrically connected in parallel, and the first light-emitting diodes 14 and the second light-emitting diodes 16 are electrically connected in opposite directions.
由於第一發光二極體14與第二發光二極體16之導通方向相反,第一發光二極體14隨交流電源3之電流輸入進行一致之週期性導通及非導通時,第二發光二極體16一致進行與第一發光二極體14相反之週期性導通及非導通。在本實施例中,當交流電源3之電壓或電流呈一正半週期輸入時,第一發光二極體14導通而發光,第二發光二極體16不導通呈熄滅狀態;相反地,當交流電源3之電壓或電流呈一負半週期輸入時,第二發光二極體16導通而發光,第一發光二極體16不導通呈熄滅。因為第一發光二極體14不導通熄滅至第二發光二極體16導通發光之時間差以及第二發光二極體16不導通熄滅至第一發光二極體14導通發光之時間差皆會造成發光二極體晶片1發光產生空白時間,使得發光二極體晶片1週期性地出現短暫閃爍之現象。 Since the first light emitting diode 14 and the second light emitting diode 16 are opposite in conduction direction, the first light emitting diode 14 is periodically turned on and off when the current input of the alternating current power source 3 is consistent, and the second light emitting second The pole body 16 consistently performs periodic conduction and non-conduction opposite to the first light-emitting diode 14. In this embodiment, when the voltage or current of the alternating current power source 3 is input in a positive half cycle, the first light emitting diode 14 is turned on to emit light, and the second light emitting diode 16 is not turned on in an extinguished state; conversely, when When the voltage or current of the AC power source 3 is input in a negative half cycle, the second LED 26 is turned on to emit light, and the first LED 16 is not turned on and is extinguished. Because the time difference between the first light-emitting diode 14 and the second light-emitting diode 16 being turned on and off and the second light-emitting diode 16 being non-conducting to the first light-emitting diode 14 are caused by the time difference The light emission of the diode wafer 1 generates a blank time, so that the light-emitting diode wafer 1 periodically appears to blink briefly.
當第一發光二極體14或第二發光二極體16發光時,含氟螢光材料2吸收第一發光二極體14或第二發光二極體16發出之光而被激發,並放出一螢光,由於本發明實施例中含氟螢光材料2具有之一螢光半衰期大於或等於空白時間,使螢光產生時可填補空白時間,而使得發光二極體晶片1於空白時間內閃爍 之現象變得不明顯。 When the first light-emitting diode 14 or the second light-emitting diode 16 emits light, the fluorine-containing phosphor material 2 absorbs light emitted from the first light-emitting diode 14 or the second light-emitting diode 16 to be excited and discharged. A fluorescent light, because the fluorine-containing fluorescent material 2 in the embodiment of the present invention has a fluorescence half-life greater than or equal to the blank time, so that the blank time can be filled when the fluorescent light is generated, so that the light-emitting diode wafer 1 is in the blank time. flicker The phenomenon becomes less obvious.
本實施例中選用之第一發光二極體14與第二發光二極體16可為相同之藍光發光二極體或紫外光發光二極體。另一種實施方式為第一發光二極體14為藍光發光二極體,第二發光二極體16則為紅光發光二極體,此種情況下含氟螢光材料2僅需設置於第一發光二極體14之上,而不需設置於第二發光二極體16之上。含氟螢光材料2受第一發光二極體14發出之藍光激發後所放出之紅色螢光可銜接或疊合於第二發光二極體16發出之紅光。 The first light-emitting diode 14 and the second light-emitting diode 16 used in this embodiment may be the same blue light-emitting diode or ultraviolet light-emitting diode. In another embodiment, the first light emitting diode 14 is a blue light emitting diode, and the second light emitting diode 16 is a red light emitting diode. In this case, the fluorine fluorescent material 2 only needs to be disposed in the first Above one of the light-emitting diodes 14, there is no need to be disposed on the second light-emitting diode 16. The red fluorescent light emitted by the fluorine-containing fluorescent material 2 after being excited by the blue light emitted by the first light-emitting diode 14 can be connected or superposed on the red light emitted by the second light-emitting diode 16.
透過上述元件之設置,本發明實施例中所揭示含氟螢光材料之交流發光二極體可藉由螢光半衰期較長之含氟螢光材料發出之螢光填補交流電源下發光二極體週期性非導通導致發光中斷之空白時間,降低填補交流發光二極體發光之閃爍程度,而可改善習知交流發光二極體發光時高頻閃爍造成使用者眼睛容易疲勞之問題。 Through the arrangement of the above components, the AC light-emitting diode of the fluorine-containing fluorescent material disclosed in the embodiment of the present invention can fill the light-emitting diode under the AC power source by the fluorescent light emitted by the fluorine-containing fluorescent material with a long half-life of fluorescence. The periodic non-conduction leads to the blanking time of the luminescence interruption, which reduces the degree of flickering of the illuminating LED light, and can improve the problem that the user's eyes are easily fatigued by the high-frequency flicker when the conventional AC illuminator emits light.
除了以第一A圖所示將第一發光二極體14與第二發光二極體16分別設置於基板10上之方式以外,本發明實施例中也可將第一發光二極體14與第二發光二極體16以磊晶形成於基板10上,並以電性連接將各發光二極體間作串聯、並聯或串並聯,以形成發光二極體晶片1。發光二極體晶片1上之第一發光二極體14與第二發光二極體16可如第一C圖所示,將含氟螢光材料2分別設置於發光二極體上,或如第一D圖所示,將含氟螢光材料2同時設置於複數個發光二極體14及16上。 The first light-emitting diode 14 can also be disposed in the embodiment of the present invention, except that the first light-emitting diode 14 and the second light-emitting diode 14 are respectively disposed on the substrate 10 as shown in FIG. The second LEDs 16 are epitaxially formed on the substrate 10, and electrically connected to electrically or electrically connect the LEDs in series, in parallel, or in series and in parallel to form the LEDs 1. The first light-emitting diodes 14 and the second light-emitting diodes 16 on the light-emitting diode chip 1 can be respectively disposed on the light-emitting diodes as shown in FIG. As shown in the first D diagram, the fluorine-containing phosphor material 2 is simultaneously provided on the plurality of light-emitting diodes 14 and 16.
請參閱第二A圖、第二B圖,其係本發明第二實施例之電路示意圖以及電流畸變圖。如第二A圖所示,本實施例中, 一交流電源3電性連接一濾波電解電容30與一橋式整流電路32,複數發光二極體12間彼此以串聯、並聯或串並聯之方式電性連接後電性連接於濾波電解電容30。如前面實施例所述,發光二極體12可分別設置於基板10之上,或以磊晶方式形成於基板10上。在本實施例中,含氟螢光材料2可分別覆蓋於各發光二極體12上,或一次覆蓋於各發光二極體12上。 Please refer to FIG. 2A and FIG. 2B, which are circuit diagrams and current distortion diagrams of the second embodiment of the present invention. As shown in FIG. 2A, in this embodiment, An AC power source 3 is electrically connected to a filter electrolytic capacitor 30 and a bridge rectifier circuit 32. The plurality of LEDs 12 are electrically connected to each other in series, parallel or series-parallel, and then electrically connected to the filter electrolytic capacitor 30. As shown in the previous embodiment, the LEDs 12 can be respectively disposed on the substrate 10 or formed on the substrate 10 in an epitaxial manner. In the present embodiment, the fluorine-containing phosphor material 2 may be respectively covered on each of the light-emitting diodes 12 or may be covered on each of the light-emitting diodes 12 at a time.
由交流電源3輸出之一交流電流進入橋式整流電路32後,被整流為一直流電流,直流電流經過濾波電解電容30時,透過濾波電解電容30之充放電行為可達成濾波之功能,使得原先具有明顯脈衝之電壓(如第二B圖中顯示之VAC)變得較為平緩(如第二B圖中顯示之VC)。然而,濾波電解電容30之充放電行為造成之容性負載特性使得橋式整流電路32只有在交流電源3輸出之交流電壓到達峰值附近時,橋式整流電路32之整流二極體才會有電流導通(如第二B圖中顯示之IAC),此時導通角θ縮減至60°左右,使得隨後輸入發光二極體晶片1之直流電流呈現尖狀脈衝(電流畸變),脈衝之脈寬約為1/2週期之1/3左右,導致發光二極體12在交流電壓兩峰值之間出現一非導通之空白時間T。 When an alternating current output from the alternating current power source 3 enters the bridge rectifier circuit 32, it is rectified into a direct current. When the direct current passes through the filter electrolytic capacitor 30, the charging and discharging behavior of the filter electrolytic capacitor 30 can achieve a filtering function, so that the original The voltage with a significant pulse (as shown in the second B diagram) becomes more gradual (as shown in the second panel B). However, the capacitive load characteristic caused by the charge and discharge behavior of the filter electrolytic capacitor 30 causes the bridge rectifier circuit 32 to have a current only in the rectifying diode of the bridge rectifier circuit 32 when the AC voltage output from the AC power source 3 reaches a peak value. Turning on (such as the IAC shown in Figure B), the conduction angle θ is reduced to about 60°, so that the DC current input to the LED chip 1 then exhibits a sharp pulse (current distortion), and the pulse width of the pulse is about Approximately one-third of the 1/2 period causes the light-emitting diode 12 to have a non-conducting blank time T between the two peaks of the alternating voltage.
同時使用濾波電解電容30與橋式整流電路32將交流電源3整流為直流電流時,所產生之電流畸變現象將造成發光二極體12非導通之空白時間,故搭配本發明實施例中所揭露之含氟螢光材料,將含氟螢光材料以個別封裝或整體封裝之方式設置於發光二極體12之上,藉由含氟螢光材料螢光半衰期較長之特性,利用含氟螢光材料放出之螢光填補空白時間T。 When the alternating current source 3 is rectified into a direct current using the filter electrolytic capacitor 30 and the bridge rectifier circuit 32, the current distortion phenomenon will cause the blank time of the light-emitting diode 12 to be non-conductive, so it is disclosed in the embodiment of the present invention. The fluorine-containing fluorescent material is provided on the light-emitting diode 12 in a single package or in a whole package, and the fluorine-containing fluorescent material has a long fluorescence half-life characteristic, and the fluorine-containing fluorescent material is utilized. The fluorescent material emitted by the light material fills the blank time T.
前述含氟螢光材料之通式為A2[MF6]:Mn4+,A選自 由Li、Na、K、Rb、Cs、NH4構成之群組,M選自由Ge、Si、Sn、Ti、Zr所構成之群組,其螢光特性可包含:激發光波長介於350至500奈米、放射光波長則介於600至700奈米、螢光半衰期係為毫秒(msec)等級,於一實施例中,螢光半衰期介於5至15毫秒、激發光譜內可具有兩個激發波峰等。 The fluorine-containing fluorescent material has the general formula A2[MF6]: Mn4+, and A is selected from A group consisting of Li, Na, K, Rb, Cs, NH4, M is selected from the group consisting of Ge, Si, Sn, Ti, and Zr, and the fluorescence characteristics thereof may include: excitation light wavelengths between 350 and 500 The wavelength of the meter and the emitted light is between 600 and 700 nm, and the half-life of the fluorescence is in the order of milliseconds (msec). In one embodiment, the fluorescence half-life is between 5 and 15 milliseconds, and the excitation spectrum can have two excitation peaks. Wait.
本發明之第三實施例中,係以K2Si1-XF6:MnX作為例子,說明含氟螢光材料之合成方法與螢光特性測試。K2Si1-XF6:MnX中以Mn作為發光中心,其含量比例X值則介於0.01到0.1之間,並可透過以下兩種方法製備。 In the third embodiment of the present invention, the synthesis method and the fluorescence characteristic test of the fluorine-containing fluorescent material will be described using K2Si1-XF6:MnX as an example. K2Si1-XF6: MnX uses Mn as the luminescent center, and its content ratio X is between 0.01 and 0.1, and can be prepared by the following two methods.
方法一係利用化學共沉澱法合成K2Si1-XF6:MnX,首先合成K2MnF6(可透過如2KMnO4+2KHF2+8HF+3H2O2→2K2MnF6+8H2O+3O2之化學反應合成),再將K2MnF6倒入含有K2SiF6之氫氟酸溶液中攪拌以發生共沉澱反應,過濾溶液取得之黃色沉澱物以去離子水與丙酮清洗後烘乾,即可獲得產物K2Si1-XF6:MnX。 The first method is to synthesize K2Si1-XF6:MnX by chemical coprecipitation method. Firstly, K2MnF6 can be synthesized (synthesized by chemical reaction such as 2KMnO4+2KHF2+8HF+3H2O2→2K2MnF6+8H2O+3O2), and then K2MnF6 is poured into hydrogen containing K2SiF6. The product is stirred to obtain a coprecipitation reaction, and the yellow precipitate obtained by filtering the solution is washed with deionized water and acetone, and then dried to obtain the product K2Si1-XF6:MnX.
方法二則利用矽晶片蝕刻法製備K2Si1-XF6:MnX,首先以6克過錳酸鉀加入100毫升氫氟酸(濃度50%)與100毫升去離子水配製溶液,再將n型或p型之矽晶片浸泡於上述溶液中以進行蝕刻反應,過程中不可攪拌溶液,反應2小時後,取出晶片並以去離子水清洗殘餘溶液,使用刮勺由晶片表面取下粉末,烘乾粉末即可獲得產物K2Si1-XF6:MnX。 In the second method, K2Si1-XF6:MnX is prepared by ruthenium wafer etching. First, 6 g of potassium permanganate is added to 100 ml of hydrofluoric acid (concentration: 50%) and 100 ml of deionized water to prepare a solution, and then n-type or p-type The wafer is immersed in the above solution to carry out an etching reaction. During the process, the solution is not stirred. After reacting for 2 hours, the wafer is taken out and the residual solution is washed with deionized water. The powder is removed from the surface of the wafer using a spatula, and the powder is dried. The product K2Si1-XF6: MnX was obtained.
上述兩種製作K2Si1-XF6:MnX之過程皆相當簡單,無須高溫化學反應,成本低廉,可大量合成並運用於本發明實施例中之使用含氟螢光材料之發光二極體。 The above two processes for producing K2Si1-XF6:MnX are relatively simple, do not require high-temperature chemical reaction, are low in cost, and can be synthesized in a large amount and used in the light-emitting diode using the fluorine-containing fluorescent material in the embodiment of the present invention.
第三A圖為利用前述方法一(化學共沉澱法)合成之K2Si1-XF6:MnX產物與K2SiF6標準品之X光繞射圖,K2Si1-XF6:MnX(以K2Si0.95F6:Mn0.05為例)之X光繞射圖以藍色表示,K2SiF6標準品之X光繞射圖則以紅色表示。比較兩者可知,以化學共沉澱法所製得之K2Si1-XF6:MnX,其晶相為純相,且無雜相生成。K2SiF6為正立方體單位晶格結構,Si位於六個面中心與八個頂角,K2Si1-XF6:MnX中則由加入的Mn取代Si於晶格中之位子,圖中可看出Mn成功地取代部分Si之位子,且無副相(Mn2O3)生成。 The third A is a X-ray diffraction diagram of K2Si1-XF6:MnX product synthesized by the aforementioned method 1 (chemical coprecipitation method) and K2SiF6 standard, K2Si1-XF6:MnX (taking K2Si0.95F6:Mn0.05 as an example) The X-ray diffraction pattern is shown in blue, and the X-ray diffraction pattern of the K2SiF6 standard is shown in red. Comparing the two, K2Si1-XF6:MnX prepared by chemical coprecipitation method has a pure phase and no impurity phase. K2SiF6 is a positive cubic unit lattice structure. Si is located at the center of six faces and eight apex angles. In K2Si1-XF6:MnX, the added Mn is substituted for the position of Si in the crystal lattice. It can be seen that Mn is successfully replaced. Part of the Si seat, and no secondary phase (Mn2O3) is generated.
第三B圖則為前述K2Si1-XF6:MnX產物與習知紅色螢光粉末CaAlSiN3:Eu之激發與放射光譜圖,K2Si1-XF6:MnX產物之激發與放射光譜以紅色表示,顯示K2Si0.95F6:Mn0.05產物可有效地受波長430~470奈米之藍光激發,並具有兩個激發波峰,受激發後可放射出600~650奈米之紅光螢光,CaAlSiN3:Eu之激發與放射光譜則以黑色表示,由圖中可知習知紅色螢光粉末CaAlSiN3:Eu之放射光譜延伸至750奈米,形成多餘之紅外光,因本身激發與放射光譜重疊,造成自身吸收效應而降低放光效率,且放射光譜之短波部份又會與黃綠色螢光粉末之激發光譜重疊而造成再吸收效應,致使放射螢光之效能降低。相較之下,本實施例中揭露之K2Si1-XF6:MnX放射光譜集中於600~650奈米,可改善習知紅色螢光粉末CaAlSiN3:Eu之缺點。 The third B diagram is the excitation and emission spectrum of the aforementioned K2Si1-XF6:MnX product and the conventional red fluorescent powder CaAlSiN3:Eu. The excitation and emission spectra of the K2Si1-XF6:MnX product are shown in red, showing K2Si0.95F6: The Mn0.05 product can be effectively excited by blue light with a wavelength of 430-470 nm and has two excitation peaks. After excitation, it can emit red light fluorescence of 600-650 nm, and excitation and emission spectra of CaAlSiN3:Eu It is shown in black. It can be seen from the figure that the emission spectrum of the conventional red fluorescent powder CaAlSiN3:Eu extends to 750 nm, which forms excess infrared light, which causes self-absorption effect and reduces light-emitting efficiency due to the overlap of the excitation and the emission spectrum. And the short-wave portion of the emission spectrum overlaps with the excitation spectrum of the yellow-green fluorescent powder to cause a resorption effect, resulting in a decrease in the efficacy of the radiation. In contrast, the K2Si1-XF6:MnX emission spectrum disclosed in this embodiment is concentrated at 600-650 nm, which can improve the disadvantages of the conventional red fluorescent powder CaAlSiN3:Eu.
第三C圖為前述K2Si1-XF6:MnX產物之放射光譜積分面積相對比值與加熱溫度相對作圖,由於熱容易致使螢光物質不穩定,此量測可證明本實施例揭露之K2Si1-XF6:MnX含氟化合物在一般發光二極體之操作溫度(150~200℃)下,其放射光譜積 分面積相對比值相較於室溫時,仍可達103%至104%,顯示其放射光強度仍維持在室溫下之水準,本K2Si1-XF6:MnX產物具有高熱穩定性,可克服習知紅色螢光粉末熱穩定性差之缺點,更適合應用於本發明之使用含氟螢光材料之發光二極體中。 The third C is a plot of the relative area ratio of the radiation spectrum of the K2Si1-XF6:MnX product to the heating temperature. Since the heat easily causes the phosphor to be unstable, the measurement can prove the K2Si1-XF6 disclosed in the embodiment: The emission spectrum product of MnX fluorine-containing compound at the operating temperature (150~200 °C) of a general light-emitting diode The relative area ratio is still 103% to 104% compared with room temperature, indicating that the radiation intensity is still maintained at room temperature. The K2Si1-XF6:MnX product has high thermal stability and can overcome the conventional knowledge. The red fluorescent powder has the disadvantage of poor thermal stability, and is more suitable for use in the light-emitting diode of the present invention using a fluorine-containing fluorescent material.
第三D圖則為前述K2Si1-XF6:MnX產物之螢光半衰期圖,利用460奈米之激發光波長激發K2Si1-XF6:MnX後,連續偵測K2Si1-XF6:MnX放射之螢光強度,如圖中所示,含氟螢光材料K2Si1-XF6:MnX之螢光半衰期為9.4毫秒,可填補交流電轉換電壓時產生之8.3毫秒空白時間,大幅降低發光二極體晶片發光時之閃爍現象,並減少疊影之產生。 The third D-graph is the fluorescence half-life diagram of the aforementioned K2Si1-XF6:MnX product. After exciting K2Si1-XF6:MnX with a wavelength of 460 nm excitation light, the fluorescence intensity of K2Si1-XF6:MnX radiation is continuously detected, such as As shown in the figure, the fluorescence half-life of the fluorine-containing fluorescent material K2Si1-XF6:MnX is 9.4 milliseconds, which can fill the 8.3 millisecond blank time generated by the alternating current conversion voltage, and greatly reduce the flicker phenomenon when the light-emitting diode wafer emits light, and Reduce the occurrence of overlays.
綜上所述,本發明之使用含氟螢光材料之發光二極體可透過螢光半衰期較長之含氟螢光材料發出之螢光填補發光二極體不發光之空白時間,以降低光線閃爍之程度,避免使用者眼睛疲勞。 In summary, the light-emitting diode of the present invention using a fluorine-containing fluorescent material can pass through the fluorescent light emitted by the fluorine-containing fluorescent material having a long half-life of fluorescence to fill the blank time of the light-emitting diode to emit light, thereby reducing the light. The degree of flickering to avoid eye fatigue.
惟以上所述者,僅為本發明之較佳實施例而已,並非用來限定本發明實施之範圍,舉凡依本發明申請專利範圍所述之特徵及精神所為之均等變化與修飾,均應包括於本發明之申請專利範圍內。 The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the equivalents and modifications of the features and spirits described in the claims of the present invention should be included. Within the scope of the patent application of the present invention.
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| US20120007102A1 (en) * | 2010-07-08 | 2012-01-12 | Soraa, Inc. | High Voltage Device and Method for Optical Devices |
| US20130187556A1 (en) * | 2012-01-25 | 2013-07-25 | Intemetix Corporation | Long Decay Phosphors for Lighting Applications |
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| CN103980896A (en) * | 2014-04-29 | 2014-08-13 | 中国科学院福建物质结构研究所 | Preparation method of fluoride fluorescent powder material |
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| US20120007102A1 (en) * | 2010-07-08 | 2012-01-12 | Soraa, Inc. | High Voltage Device and Method for Optical Devices |
| US20130187556A1 (en) * | 2012-01-25 | 2013-07-25 | Intemetix Corporation | Long Decay Phosphors for Lighting Applications |
| CN103839511A (en) * | 2012-11-21 | 2014-06-04 | 晶元光电股份有限公司 | Light-emitting device and driving method for light-emitting diodes |
| CN103980896A (en) * | 2014-04-29 | 2014-08-13 | 中国科学院福建物质结构研究所 | Preparation method of fluoride fluorescent powder material |
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