TWI620975B - Camera module - Google Patents

Abstract

The invention provides a camera module comprising a lens driving mechanism, a lens unit, a circuit board, and a photosensitive element. The lens unit is disposed on the lens driving mechanism, and the photosensitive element is disposed on the circuit board. The circuit board includes a metal member, an insulating layer, and a metal line, wherein the insulating layer is disposed between the metal member and the metal line, and the metal line is electrically connected to the photosensitive element. The lens driving module can drive the lens unit to move relative to the photosensitive element, and the photosensitive element can capture light passing through the lens unit.

Description

Camera module

The invention relates to a camera module. More specifically, the present invention relates to a camera module having a photosensitive member and a circuit board, wherein the photosensitive member is disposed on the circuit board, and the circuit board has a metal member.

With the development of technology, many electronic devices (such as smart phones or digital cameras) now have the functions of photography or video recording. The use of these electronic devices is becoming more common and is moving toward a convenient and lightweight design to provide users with more choices.

The aforementioned electronic device having a camera or video function is usually provided with a driving module for driving one or more optical lens groups to move along an optical axis to achieve autofocus and/or zoom functions. Light can be imaged on a photosensitive element through the aforementioned optical lens set.

Therefore, the flatness of the aforementioned driving module and the photosensitive element is very important. However, the conventional photosensitive member is usually carried by a printed circuit board, and it is easy to bend at the time of assembly or movement, resulting in a decrease in flatness.

In order to solve the above problems, the present invention provides a camera module including a lens driving mechanism, a lens unit, a circuit board, and a sense Optical component. The lens unit is disposed on the lens driving mechanism, and the photosensitive element is disposed on the circuit board. The circuit board includes a metal member, an insulating layer, and a metal line, wherein the insulating layer is disposed between the metal member and the metal line, and the metal line is electrically connected to the photosensitive element. The lens driving module can drive the lens unit to move relative to the photosensitive element, and the photosensitive element can capture light passing through the lens unit.

In an embodiment of the invention, the thickness of the metal member is greater than the sum of the thicknesses of the insulating layer and the metal line.

In an embodiment of the invention, the thickness of the metal member is between 0.10 mm and 0.35 mm.

In an embodiment of the invention, the metal circuit is formed on the insulating layer by molding the interconnected object.

In an embodiment of the invention, the metal line is formed on the insulating layer by means of a plating film.

In an embodiment of the invention, the metal member and the metal line have the same coefficient of thermal expansion.

In an embodiment of the invention, the photosensitive element is attached to the insulating layer.

In an embodiment of the invention, the camera module further includes a plurality of lens driving mechanisms, a plurality of lens units, and a plurality of photosensitive elements, wherein the lens units are respectively disposed on the lens driving mechanisms, and the photosensitive elements are disposed on On the circuit board, the positions of the lens units respectively correspond to the positions of the photosensitive elements.

In an embodiment of the invention, the camera module further includes a base disposed between the photosensitive element and the lens unit.

In an embodiment of the invention, the base further includes a metal substrate, a first conductive layer electrically connected to the lens driving mechanism, and a first insulating layer disposed between the metal substrate and the first conductive layer.

In an embodiment of the invention, the thickness of the metal substrate is greater than the sum of the thicknesses of the first insulating layer and the first conductive layer.

In an embodiment of the invention, the metal substrate has a thickness of 0.10 mm to 0.35 mm.

In an embodiment of the invention, the base further includes a second insulating layer and a second conductive layer, wherein the second insulating layer is formed on the metal substrate, and the first insulating layer and the second insulating layer are located on opposite sides of the metal substrate. And the second wire layer is formed on the second insulation layer.

In an embodiment of the invention, the thickness of the metal substrate is greater than the sum of the thicknesses of the second insulating layer and the second conductive layer.

In an embodiment of the invention, the second wire layer is electrically connected to the photosensitive element.

In an embodiment of the invention, the first conductive layer and the second conductive layer are respectively formed on the first insulating layer and the second insulating layer by molding the interconnection object.

In an embodiment of the invention, the metal substrate, the first conductive layer and the second conductive layer have the same thermal expansion coefficient.

In an embodiment of the invention, the camera module further includes a housing surrounding the lens driving mechanism and having a metal material.

In an embodiment of the invention, the housing and the base are connected to each other by welding.

10‧‧‧ camera module

20‧‧‧Electronic devices

100‧‧‧shell

200‧‧‧Lens drive mechanism

210‧‧‧Lens carrier

211‧‧‧ accommodating space

212‧‧‧ concave structure

220‧‧‧ frame

221‧‧‧ Housing Department

222‧‧‧ Groove

230‧‧‧First electromagnetic drive assembly

240‧‧‧Second electromagnetic drive assembly

250‧‧‧First elastic element

251‧‧‧ inner circle

252‧‧‧ outer circle

260‧‧‧Second elastic element

261‧‧‧ inner circle

262‧‧‧ outer circle

270‧‧‧ coil plate

280‧‧‧ring loop

290‧‧‧Location detector

300‧‧‧Lens unit

400‧‧‧Base

410‧‧‧Metal substrate

420‧‧‧First insulation

430‧‧‧First conductive layer

440‧‧‧Second insulation

450‧‧‧Second conductive layer

500‧‧‧Photosensitive elements

600‧‧‧ boards

610‧‧‧Metal components

611‧‧‧ openings

620‧‧‧Insulation

621‧‧‧ openings

630‧‧‧Metal lines

O1‧‧‧ openings

O2‧‧‧ openings

1 is a schematic view showing an electronic device according to an embodiment of the present invention.

Fig. 2 is a view showing an exploded view of a camera module according to an embodiment of the present invention.

Fig. 3 is a view showing a photosensitive member and a circuit board according to an embodiment of the present invention.

Fig. 4 is a cross-sectional view taken along line A-A in Fig. 3.

Figure 5 is a bottom plan view showing a lens holder in an embodiment of the present invention.

Figure 5 is a schematic view showing a base in an embodiment of the present invention.

Figure 6 is a schematic view showing a base in another embodiment of the present invention.

Figure 7 is a schematic view showing a camera module according to another embodiment of the present invention.

The camera module of the embodiment of the present invention will be described below. However, it will be readily understood that the embodiments of the present invention are susceptible to many specific embodiments of the invention and can The specific embodiments disclosed are merely illustrative of the invention, and are not intended to limit the scope of the invention.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning meaning It will be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the context or context of the present disclosure, and should not be in an idealized or overly formal manner. Interpretation, unless specifically defined here Righteousness.

Please refer to FIG. 1 . The camera module 10 of the embodiment of the present invention can be installed in an electronic device 20 for photographing or photographing. The electronic device 20 can be, for example, a smart phone or a digital camera. When photographing or photographing, the camera module 10 can receive light and image, and the image can be transmitted to a processor (not shown) disposed in the electronic device 20, and the image is post-processed by the processor.

As shown in FIG. 2 , the camera module 10 mainly includes a housing 100 , a lens driving mechanism 200 , a lens unit 300 , a base 400 , a photosensitive element 500 , and a circuit board 600 . Wherein, the housing 100 and the base 400 can be combined into a hollow box, and the lens driving mechanism 200 can be surrounded by the housing 100, so that the lens driving mechanism 200, the lens unit 300 and the base 400 are accommodated in the foregoing box body. The photosensitive element 500 and the circuit board 600 are disposed on one side of the casing, and the housing 100 and the base 400 respectively have openings O1 and O2, and the light can sequentially reach the photosensitive element 500 through the opening O1, the lens unit 300 and the opening O2, to Imaging is performed on the photosensitive element 500.

The lens driving mechanism 200 includes a lens carrier 210, a frame 220, at least one first electromagnetic driving component 230, at least one second electromagnetic driving component 240, a first elastic component 250, a second elastic component 260, and a lens assembly. A coil plate 270, a plurality of loop wires 280, and a plurality of position detectors 290.

The lens holder 210 has an accommodating space 211 and a concave structure 212. The accommodating space 211 is formed in the center of the lens carrier 210, and the concave structure 212 is formed on the outer wall of the lens carrier 210 and surrounds the lens holder 210. Space 211. The lens unit 300 can be fixed on the lens carrier 210 and accommodated in the accommodating space 211, and the first The electromagnetic drive assembly 230 can then be disposed in the recessed structure 212.

The frame 220 has a receiving portion 221 and a plurality of grooves 222. The lens holder 210 is received in the receiving portion 221, and the second electromagnetic driving assembly 240 is fixed in the recess 222 and adjacent to the first electromagnetic driving assembly 230.

The first elastic member 250 and the second elastic member 260 are respectively disposed on opposite sides of the lens holder 210 / the frame 220 such that the lens holder 210 / the frame 220 is located between the first elastic member 250 and the second elastic member 260 . The inner ring segment 251 of the first elastic member 250 is coupled to the lens carrier 210, and the outer ring segment 252 of the first elastic member 250 is coupled to the frame 220. Similarly, the inner ring segment 261 of the second elastic member 260 is coupled to the lens carrier 210, and the outer ring segment 262 of the second elastic member 260 is coupled to the frame 220. In this way, the lens carrier 210 can be suspended in the receiving portion 221 of the frame 220 by the first elastic member 250 and the second elastic member 260, and the movement amplitude in the Z-axis direction can also be first. The second elastic members 250, 260 are limited.

The lens carrier 210 and the lens unit 300 disposed on the lens carrier 210 can be driven along the Z axis with respect to the frame 220 by electromagnetic induction between the first electromagnetic driving component 230 and the second electromagnetic driving component 240. Move in direction. For example, in the embodiment, the first electromagnetic driving component 230 may be a driving coil surrounding the accommodating space 211 of the lens carrier 210, and the second electromagnetic driving component 240 may include at least one magnet. When a current is passed into the driving coil (the first electromagnetic driving component 230), electromagnetic induction is generated between the driving coil and the magnet, so that the lens carrier 210 and the lens unit 300 disposed thereon can be driven relative to the frame. 220 moves in the Z-axis direction, and then moves relative to the photosensitive element 500 in the Z-axis direction to achieve adjustment of the focal length The purpose.

In some embodiments, the first electromagnetic drive assembly 230 can be a magnet and the second electromagnetic drive assembly 240 can be a drive coil.

Referring to FIG. 2, the coil plate 270 is disposed on the base 400. Similarly, when current flows through the coil plate 270, electromagnetic induction will be generated between the coil plate 270 and the aforementioned second electromagnetic drive assembly 240 (or the first electromagnetic drive assembly 230), so that the lens holder 210 and the frame 220 are opposite to each other. The coil plate 270 moves in the X-axis direction and/or the Y-axis direction, thereby driving the lens unit 300 to move in the X-axis direction and/or the Y-axis direction with respect to the photosensitive element 500 to achieve the purpose of sway compensation.

In this embodiment, the camera module 10 includes four loop wires 280 disposed at four corners of the coil plate 270 and connected to the coil plate 270, the base 400, and the first elastic member 250. When the lens holder 210 and the lens unit 300 are moved in the X-axis direction and/or the Y-axis direction, the loop wires 280 can limit the magnitude of their movement. In addition, since the loop wire 280 includes a metal material (such as copper or its alloy), it can also be used as a conductor, for example, current can flow into the first electromagnetic drive assembly 230 via the base 400 and the loop wire 280.

The position detector 290 is disposed on the base 400 to determine the position of the lens carrier 210 and the lens unit 300 in the X-axis direction and the Y-axis direction by detecting the displacement of the second electromagnetic driving component 240.

For example, the position detector 290 can be a Hall sensor, a Magnetoresistance Effect Sensor (MR Sensor), or a Giant Magnetoresistance Effect (Giant Magnetoresistance Effect). Sensor, GMR Sensor), Tunneling Magnetoresistance Effect Sensor (TMR Sensor), or Fluxgate.

As shown in FIGS. 3 and 4, the circuit board 600 has a three-layer structure including a metal member 610, an insulating layer 620, and a metal line 630, wherein the insulating layer 620 is disposed between the metal member 610 and the metal line 630. The photosensitive element 500 is attached to the insulating layer 620 and electrically connected to the metal line 630. Further, the metal member 610 and the insulating layer 620 have openings 611, 621 which are aligned with each other and have substantially the same appearance, and the photosensitive member 500 can capture light passing through the lens unit 300 through the openings 611, 621.

It should be particularly noted that the thickness of the metal member 610 in the Z-axis direction is greater than the sum of the thicknesses of the insulating layer 620 and the metal line 630 in the Z-axis direction, so the circuit board 600 will have sufficient hardness to maintain the flatness of the circuit board 600 and avoid The photosensitive member 500 is skewed. The thickness of the metal member 610 may be, for example, from 0.10 mm to 0.35 mm. In addition, the lower surface of the metal member 610 is directly exposed without being covered by other components, thereby improving the heat dissipation efficiency of the circuit board 600. The metal member 610 and the metal line 630 may have the same coefficient of thermal expansion, so that when the circuit board 600 is heated, no relative displacement occurs between the metal member 610 and the metal line 630.

In this embodiment, the metal line 630 is formed on the insulating layer 620 by molding a Molded Interconnect Device (MID), such as Laser Direct Structuring (LDS) and micro-volume processing technology. (Microscopic Integrated Processing Technology, MIPTEC), Laser Induced Metallization (Laser Induced Metallization, LIM), Laser Restructuring Print (LRP), Aerosol Jet Process, or Two-shot molding method. In some embodiments, the metal line 630 can also be formed on the insulating layer 620 through a coating method.

Referring to FIG. 5 , in the embodiment, the base 400 includes a metal substrate 410 , a first insulating layer 420 , a first conductive layer 430 , a second insulating layer 440 , and a second conductive layer 450 . The first insulating layer 420 and the second insulating layer 440 are respectively formed on opposite sides of the metal substrate 410, and the first conductive layer 430 is formed on the first insulating layer 420, and the second conductive layer 450 is formed on the second insulating layer 440. The first conductive layer 430 can be electrically connected to the loop wire 280 , and the second conductive layer 450 can be electrically connected to the photosensitive element 500 .

Similarly, the thickness of the metal substrate 410 in the Z-axis direction is greater than the sum of the thicknesses of the first insulating layer 420 and the first conductive layer 430 in the Z-axis direction, and is greater than the second insulating layer 440 and the second conductive layer 450 in the Z-axis direction. The thickness of the metal substrate 410 may be, for example, 0.10 mm to 0.35 mm. The metal substrate 410, the first conductive layer 430, and the second conductive layer 450 may have the same coefficient of thermal expansion to avoid relative displacement of the chassis 400 when heated.

It should be noted that the housing 100 may have a metal material to reduce electromagnetic interference generated by the camera module 10 to other electronic components in the electronic device 20. Since the base 400 includes the metal base 410, the base 400 can be connected to the housing 100 by soldering without causing plastic melting and skewing of the pins due to soldering.

As shown in FIG. 6, in another embodiment, the base 400 may also only be included. The metal substrate 410, the first insulating layer 420, and the first conductive layer 430 are omitted, and the second insulating layer 440 and the second conductive layer 450 are omitted to lower the height of the camera module 10 in the Z-axis direction.

Referring to FIG. 7 , in another embodiment, the camera module 10 includes a plurality of housings 100 , a plurality of lens driving mechanisms 200 , a plurality of lens units 300 , a plurality of bases 400 , a plurality of photosensitive elements 500 , and a The circuit board 600, in which the photosensitive element 500 disposed on the circuit board 600 corresponds to the lens unit 300 disposed on the lens driving mechanism 200, allows light to be imaged on the photosensitive element 500 through the lens unit 300. Since the camera module 10 has the aforementioned circuit board 600 of the metal member 610, the photosensitive elements 500 can be substantially coplanar, so that the camera module 10 can simultaneously acquire a plurality of images.

In summary, the present invention provides a camera module, wherein the circuit board in the camera module can include a metal member, an insulating layer, and a metal line, and the thickness of the metal member is greater than the total thickness of the insulating layer and the metal line. Since the metal member has sufficient hardness, it can provide good flatness of the photosensitive member and can be used to assist heat dissipation of the photosensitive member.

Although the embodiments of the present invention and its advantages are disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. In addition, the scope of the present invention is not limited to the processes, machines, manufacture, compositions, devices, methods, and steps in the specific embodiments described in the specification. Any one of ordinary skill in the art can. Understand current, future development of processes, machines, manufacturing, material compositions, devices, methods and procedures, as long as they can The implementation of substantially the same function or substantially the same result in the described embodiments can be used in accordance with the present invention. Accordingly, the scope of the invention includes the above-described processes, machines, manufactures, compositions, devices, methods, and steps. In addition, the scope of each of the claims constitutes an individual embodiment, and the scope of the invention also includes the combination of the scope of the application and the embodiments.

While the invention has been described above in terms of several preferred embodiments, it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. In addition, each patent application scope is constructed as a separate embodiment, and various combinations of patents and combinations of embodiments are within the scope of the invention.

Claims (19)

A camera module includes: a lens driving mechanism; a lens unit disposed on the lens driving mechanism; a circuit board comprising: a metal member; a metal circuit; and an insulating layer disposed on the metal member and the Between the metal lines; and a photosensitive element disposed on the circuit board and electrically connected to the metal line, wherein the lens driving mechanism can drive the lens unit to move relative to the photosensitive element, and the photosensitive element can capture through the The light of the lens unit. The camera module of claim 1, wherein the thickness of the metal member is greater than a sum of thicknesses of the insulating layer and the metal line. The camera module of claim 1, wherein the metal member has a thickness of 0.10 mm to 0.35 mm. The camera module of claim 1, wherein the metal circuit is formed on the insulating layer by molding the interconnection object. The camera module of claim 1, wherein the metal circuit is formed on the insulating layer by coating. The camera module of claim 1, wherein the metal member and the metal line have the same coefficient of thermal expansion. The camera module of claim 1, wherein the photosensitive element is attached Attached to the insulation layer. The camera module of claim 1, wherein the camera module further comprises a plurality of lens driving mechanisms, a plurality of lens units, and a plurality of photosensitive elements, wherein the lens units are respectively disposed on the lens driving mechanisms And the photosensitive elements are disposed on the circuit board, wherein the positions of the lens units respectively correspond to the positions of the photosensitive elements. The camera module of claim 1, wherein the camera module further comprises a base disposed between the photosensitive element and the lens unit. The camera module of claim 9, wherein the base further comprises: a metal substrate; a first conductive layer electrically connected to the lens driving mechanism; and a first insulating layer disposed on the metal substrate And the first conductive layer. The camera module of claim 10, wherein the thickness of the metal substrate is greater than a sum of thicknesses of the first insulating layer and the first conductive layer. The camera module of claim 10, wherein the metal substrate has a thickness of 0.10 mm to 0.35 mm. The camera module of claim 10, wherein the base further comprises: a second insulating layer formed on the metal substrate, wherein the first insulating layer and the second insulating layer are located on the metal substrate The opposite surface; and a second conductive layer formed on the second insulating layer. The camera module of claim 13, wherein the thickness of the metal substrate is greater than a sum of thicknesses of the second insulating layer and the second conductive layer. The camera module of claim 13, wherein the second conductive layer is electrically connected to the photosensitive element. The camera module of claim 13, wherein the first conductive layer and the second conductive layer are respectively formed on the first insulating layer and the second insulating layer by molding interconnected objects. . The camera module of claim 13, wherein the metal substrate, the first conductive layer and the second conductive layer have the same coefficient of thermal expansion. The camera module of claim 10, wherein the camera module further comprises a casing surrounding the lens driving mechanism and having a metal material. The camera module of claim 18, wherein the housing and the base are connected to each other in a welded manner.