TWI620834B - Flexible light-emitting apparatus and method of fabricating the same - Google Patents

Abstract

The invention discloses a flexible light emitting device and a manufacturing method thereof. The flexible light-emitting device of the present invention comprises a polymer substrate, an electrical circuit, and at least one encapsulated light-emitting diode element. The circuit includes an electroless plating catalytic ink layer coated on a deposition region of the polymer substrate and a first metal layer. The first metal layer is deposited on the electroless plating catalyst layer by an electroless plating process. The circuit contains at least one pair of pins. Each of the packaged light emitting diode elements corresponds to one of the at least one pair of pins and includes a pair of pins. Each of the packaged light emitting diode elements is fixed on the polymer substrate, and the pair of pins are electrically connected to the corresponding pair of pins.

Description

Flexible light emitting device and method of manufacturing same

The present invention relates to a flexible light-emitting device and a method of manufacturing the same, and more particularly to a flexible light-emitting device having a good quality wire and a bend-resistant bending region, and a method of manufacturing the same.

The flexible light-emitting device has a wide range of applications, for example, being installed in a light-emitting keyboard as a backlight.

The prior art regarding flexible light-emitting devices is to electrically connect the packaged light-emitting diodes to a circuit on a flexible substrate. Some of the prior art techniques for forming circuits on flexible substrates have been partial coating of silver paste to form conductive traces. However, the line formed by the silver paste has a problem that the resistance value is not easily controlled.

The prior art for forming a circuit on a flexible substrate additionally has a copper foil attached to the substrate, and a yellow etching process is used to remove unnecessary portions of the copper foil to achieve a stable copper line. However, this prior art wastes a lot of copper and copper foil and is costly.

In addition, the prior art flexible illumination device has room for improvement in the strength of the line at the bend region as well as its thickness.

Therefore, one technical problem to be solved by the present invention is to provide a flexible light-emitting device and a method of manufacturing the same. The flexible light-emitting device of the present invention has a good quality wire and a bending-resistant bending region, and further reduces the thickness of the flexible light-emitting device of the present invention. Moreover, the flexible illuminating device of the present invention The manufacturing method is inexpensive.

A flexible light-emitting device according to a first preferred embodiment of the present invention comprises a polymer substrate, an electrical circuit, and at least one encapsulated light-emitting diode element. The polymer substrate defines a deposition region thereon. The polymer substrate has a first region and a second region. The circuit includes an electroless plating catalytic ink layer and a first metal layer. The electroless plating catalyst layer is coated on the deposition area of the polymer substrate. The first metal layer is deposited on the electroless plating catalyst layer by an electroless plating process. The circuit contains at least one pair of pins. At least one pair of pins is located on the first region of the polymeric substrate. Each of the packaged light emitting diode elements corresponds to one of the at least one pair of pins and includes a pair of pins. Each of the packaged light emitting diode elements is fixed on the polymer substrate, and the pair of pins are electrically connected to the corresponding pair of pins.

A flexible light-emitting device according to a second preferred embodiment of the present invention comprises a polymer substrate, an electric circuit, at least one light-emitting diode bare crystal, and at least one protective cover. The polymer substrate defines a deposition region thereon. The polymer substrate has a first region and a second region. The circuit includes an electroless plating catalytic ink layer and a first metal layer. The electroless plating catalyst layer is coated on the deposition area of the polymer substrate. The first metal layer is deposited on the electroless plating catalyst layer by an electroless plating process. The circuit contains at least one pair of pins. At least one pair of pins is located on the first region of the polymeric substrate. Each of the light emitting diodes corresponds to one of the pair of pins and includes a pair of pads. Each of the light emitting diodes is fixed on the polymer substrate, and the pair of pads are electrically connected to the corresponding pair of pins. Each protective cover corresponds to one LED diode. Each protective cover is formed to cover its corresponding light-emitting diode die.

In a specific embodiment, the polymer substrate may be formed of polyethylene terephthalate, polyimide, polymethyl methacrylate, polymethyl methacrylate, or other similar commercial polymer materials. .

In a specific embodiment, the first metal layer may be a single layer of Cu. Layer, multilayer Ag/Au layer/multilayer Ag/Au/Sn/Ni layer/single layer Cu layer, single layer Sn layer/single layer Cu layer, single layer Ag layer/single layer Cu layer, single layer Au layer/single layer Cu layer, single layer Ag layer / single layer Ni layer / single layer Cu layer, single layer Au layer / single layer Ni layer / single layer Cu layer, single layer Sn layer / single layer Au layer / single layer Ag layer / single layer Ni layer / single layer Cu layer, and the like.

Further, the second zone defines a bendable area. A circuit located in a bendable region and comprising a second metal layer. The second metal layer may be deposited on the first metal layer by an electroplating process. A circuit located at the end of the second zone is used to connect an external power source.

In one embodiment, each of the protective covers incorporates a plurality of uniformly distributed phosphor particles.

A method of manufacturing a flexible light-emitting device according to a third preferred embodiment of the present invention first prepares a polymer substrate, wherein the polymer substrate defines a deposition region thereon, and the polymer substrate has a first region and a second region. Next, according to the method of the third preferred embodiment of the present invention, the electroless plating catalytic ink layer is coated on the deposition region of the polymer substrate. Then, according to the method of the third preferred embodiment of the present invention, an electroless plating process is performed on the polymer substrate, and then a metal layer is deposited on the electroless plating catalyst ink layer, wherein the electroless plating catalytic ink layer and the metal layer form a circuit, and the circuit The at least one pair of pins are included, and at least one pair of pins are located on the first region of the polymer substrate. Finally, at least one packaged light-emitting diode element is fixed on the polymer substrate according to the method of the third preferred embodiment of the present invention, wherein each packaged light-emitting diode element corresponds to at least one pair One of the pins is a pair of pins and includes a pair of pins, each of the packaged LED components having the pair of pins electrically connected to the corresponding pair of pins.

Further, the second region of the polymer substrate defines a bendable region. The circuit includes a coverage block located on the bend region and a pair of auxiliary lines. The pair of auxiliary lines are electrically connected to the coverage block, respectively. Third preferred according to the present invention The method of the specific embodiment and between the step of performing an electroless plating process on the polymer substrate and the step of fixing the at least one packaged light emitting diode element on the polymer substrate, first by the pair of auxiliary lines The capping block performs an electroplating process, thereby depositing a second metal layer on the capping block, and removing a portion of the capping block on which the second metal layer has been deposited to form a plurality of main lines, wherein the polymer substrate is in the first The circuit on the end of the second zone is used to connect an external power source.

Further, the second region of the polymer substrate defines a bendable region. According to the method of the third preferred embodiment of the present invention and between the step of performing an electroless plating process on the polymer substrate and the step of fixing the at least one packaged light emitting diode element on the polymer substrate, First covering the insulating layer except for other portions of the circuit located on the bendable region, and performing an electroplating process to deposit a second metal layer on the first metal layer located in the bendable region, and removing the insulating layer, A circuit in which the end of the second region of the polymer substrate is connected to an external power source.

A method of manufacturing a flexible light-emitting device according to a fourth preferred embodiment of the present invention first prepares a polymer substrate, wherein the polymer substrate defines a deposition region thereon, and the polymer substrate has a first region and a second region. Next, according to the method of the fourth preferred embodiment of the present invention, the electroless plating catalytic ink layer is coated on the deposition region of the polymer substrate. Then, according to the method of the fourth preferred embodiment of the present invention, an electroless plating process is performed on the polymer substrate, and then a metal layer is deposited on the electroless plating catalyst layer, wherein the electroless plating catalyst layer and the metal layer form a circuit, and the circuit The at least one pair of pins are included, and at least one pair of pins are located on the first region of the polymer substrate. Next, according to the method of the fourth preferred embodiment of the present invention, at least one light emitting diode is barely fixed on the polymer substrate, wherein each of the light emitting diodes corresponds to at least one pair of pins. a pair of pins and comprising a pair of pads, each of the LEDs being electrically connected to the corresponding pair of pins. Finally, at least one protective cover is formed according to the method of the fourth preferred embodiment of the present invention, wherein each protective cover corresponds to one of the light emitting diode bare crystals, and each protective cover It is formed to cover its corresponding light-emitting diode bare crystal.

Unlike the prior art, the flexible light-emitting device of the present invention has a good quality wire and a bend-resistant bending region. Further, the flexible light-emitting device of the present invention employs a light-emitting diode bare crystal instead of a packaged light-emitting diode element, whereby the thickness of the flexible light-emitting device of the present invention is reduced. Further, the method of manufacturing the flexible light-emitting device of the present invention is inexpensive.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

1‧‧‧Flexible illuminating device

10‧‧‧ polymer substrate

102‧‧‧Deposition area

104‧‧‧First District

106‧‧‧Second District

108‧‧‧Flexible area

12‧‧‧ Circuitry

122‧‧‧Chemical plating catalytic ink layer

124‧‧‧First metal layer

125‧‧‧Second metal layer

126a, 126b, 126c, 126d, 126e, 126f‧‧‧ pins

127‧‧‧ Coverage block

128a, 128b‧‧‧Auxiliary lines

129a, 129b‧‧‧ main line

14a, 14b, 14c‧‧‧ packaged light-emitting diode components

142a, 142b, 142c, 142d, 142e, 142f‧‧‧ pins

2‧‧‧Flexible lighting device

20‧‧‧ polymer substrate

202‧‧‧Deposition area

204‧‧‧First District

206‧‧‧Second District

208‧‧‧Flexible area

22‧‧‧ Circuitry

222‧‧‧ Electroless plating catalytic ink layer

224‧‧‧First metal layer

225‧‧‧Second metal layer

226a, 226b, 226c, 226d, 226e, 226f‧‧‧ pins

24a, 24b, 24c‧‧‧Lighting diodes

242a, 242b, 242c, 242d, 242e, 242f‧‧ ‧ pads

26a, 26b, 26c‧‧‧ protective cover

30‧‧‧ plating bath

32a‧‧‧ positive electrode

32b‧‧‧negative electrode

34‧‧‧ electrolyte

36‧‧‧Insulation

1 is a top plan view of a flexible light-emitting device in accordance with a first preferred embodiment of the present invention.

Figure 2 is a top plan view of an essential component of a flexible light-emitting device of the first preferred embodiment of the present invention - a polymer substrate.

3 is a cross-sectional view of the flexible light-emitting device of FIG. 1 taken along line A-A.

4 is a cross-sectional view of the flexible light-emitting device of FIG. 1 taken along line B-B.

Figure 5 is a top plan view of a flexible light emitting device in accordance with a second preferred embodiment of the present invention.

Figure 6 is a top plan view of an essential component of a flexible light-emitting device of the second preferred embodiment of the present invention - a polymer substrate.

7 and 8 are cross-sectional views of the flexible light-emitting device of FIG. 5 taken along line D-D, respectively.

Figure 9 is a cross-sectional view of the flexible light-emitting device of Figure 5 taken along line E-E.

10, FIG. 11, and FIG. 12 are schematic views showing the structure of each stage of the electroplating process of the circuit on the second region of the polymer substrate of the flexible light-emitting device of the first preferred embodiment of the present invention.

13 and FIG. 14 are respectively schematic diagrams showing the structure of the partial structure of the flexible light-emitting device of FIG. 1 along the line C-C and disposed in the plating bath to perform various stages of the electroplating process.

Referring to Figures 1, 2, 3 and 4, the drawings schematically depict a flexible illumination device 1 of a first preferred embodiment of the present invention. 1 is a top plan view schematically showing a flexible light-emitting device 1 of a first preferred embodiment of the present invention. 2 is a top plan view of an essential component of the flexible light-emitting device 1 of the first preferred embodiment of the present invention - a polymer substrate 10 -. 3 is a cross-sectional view of the flexible light-emitting device 1 of FIG. 1 taken along line A-A. 4 is a cross-sectional view of the flexible light-emitting device 1 of FIG. 1 taken along line B-B. The flexible light-emitting device 1 of the first preferred embodiment of the present invention can be used as a backlight in an illuminated keyboard, but is not limited thereto.

As shown in FIG. 1, a flexible light-emitting device 1 according to a first preferred embodiment of the present invention comprises a polymer substrate 10, a circuit 12, and at least one packaged light-emitting diode element (14a, 14b, 14c). . In Fig. 1, only three packaged light emitting diode elements (14a, 14b, 14c) are shown as representative.

As shown in FIG. 2, the polymer substrate 10 defines a deposition region 102 thereon. The polymer substrate 10 has a first region 104 and a second region 106.

As shown in FIG. 3, circuit 12 includes an electroless plating catalytic ink layer 122 and a first metal layer 124. The electroless plating catalyst ink layer 122 is coated on the deposition region 102 of the polymer substrate 10. The first metal layer 124 is deposited on the electroless plating catalyst ink layer 122 by an electroless plating process.

As shown in FIG. 3, circuit 12 includes at least one pair of pins (126a, 126b, 126c, 126d, 126e, 126f). In FIGS. 1 and 3, only three pairs of pins (126a, 126b, 126c, 126d, 126e, 126f) are shown as representative. At least one pair of pins (126a, 126b, 126c, 126d, 126e, 126f) are located on the first region 104 of the polymeric substrate 10. Each of the packaged LED components (14a, 14b, 14c) corresponds to one of the at least one pair of pins (126a, 126b, 126c, 126d, 126e, 126f) (126a, 126b, 126c, 126d) , 126e, 126f), and includes a pair of pins (142a, 142b, 142c, 142d, 142e, 142f). In FIG. 3, the packaged LED component 14a includes a pair of pins (142a, 142b) and corresponds to a pair of pins (126a, 126b). The packaged LED component 14b includes a pair of pins (142c). 142d) and corresponding to a pair of pins (126c, 126d), the packaged LED component 14c includes a pair of pins (142e, 142f) and corresponds to a pair of pins (126e, 126f). In FIG. 3, each of the packaged LED components (14a, 14b, 14c) emits light from the top thereof. In practical applications, each packaged LED component (14a, 14b, 14c) It can also be a component that emits light from the side.

As shown in FIG. 3, each of the packaged light emitting diode elements (14a, 14b, 14c) is fixed on the polymer substrate 10, and the pair of pins (142a, 142b, 142c, 142d, 142e, 142f) The pair of pins (126a, 126b, 126c, 126d, 126e, 126f) corresponding thereto are electrically connected.

In one embodiment, the polymer substrate 10 may be made of polyethylene terephthalate, polyimide, polymethyl methacrylate, polymethyl methacrylate, or other similar commercial polymer materials. form.

In a specific embodiment, the first metal layer 124 may be a single layer of Cu layer, a plurality of layers of Ag/Au layer/multilayer Ag/Au/Sn/Ni layer/single layer of Cu layer, a single layer of Sn layer/single layer of Cu layer, Single layer Ag layer/single layer Cu layer, single layer Au layer/single layer Cu layer, single layer Ag layer/single layer Ni layer/single layer Cu layer, single layer Au layer/single layer Ni layer/single layer Cu layer, Single-layer Sn layer/single-layer Au layer/single-layer Ag layer/single-layer Ni layer/single-layer Cu layer, and the like.

Further, as shown in FIG. 4, the second zone 106 defines a bendable region 108. The circuit 12 is located in the bendable region 108 and includes a second metal layer 125. The second metal layer 125 may be deposited on the first metal layer 124 by an electroplating process. Circuit 12 located at the end of second zone 106 is used to connect an external power source (not shown in Figure 1).

In a specific embodiment, the second metal layer 125 may be formed of Cu, Ni, Ag, Au, Sn, or the like.

Please refer to FIG. 5, FIG. 6, FIG. 7, FIG. 8, and FIG. 9, which schematically depict the flexible light-emitting device 2 of the second preferred embodiment of the present invention. Figure 5 is a top plan view schematically showing a flexible light-emitting device 2 of a second preferred embodiment of the present invention. Figure 6 is a top plan view of an essential component of the flexible light-emitting device 2 of the second preferred embodiment of the present invention - a polymer substrate 20 -. 7 and 8 are cross-sectional views of the flexible light-emitting device 2 of FIG. 5 taken along line D-D, respectively. Figure 9 is a cross-sectional view of the flexible light-emitting device 2 of Figure 5 taken along line E-E. The flexible light-emitting device 2 of the second preferred embodiment of the present invention can be used as a backlight in the illuminated keyboard, but is not limited thereto.

As shown in FIG. 5, the flexible light-emitting device 2 of the second preferred embodiment of the present invention comprises a polymer substrate 20, a circuit 22, at least one LED dipole (24a, 24b, 24c) and at least A protective cover (26a, 26b, 26c). In FIG. 3, only three LED dipoles (24a, 24b, 24c) and three protective covers (26a, 26b, 26c) are shown as representative.

As shown in FIG. 6, the polymer substrate 20 defines a deposition region 202 thereon. The polymer substrate 20 has a first region 204 and a second region 206.

As shown in FIG. 7, circuit 22 includes an electroless plating catalytic ink layer 222 and a first metal layer 224. The electroless plating catalyst ink layer 222 is coated on the deposition region 202 of the polymer substrate 20. The first metal layer 224 is deposited on the electroless plating catalyst ink layer 222 by an electroless plating process.

As shown in Figure 7, circuit 22 includes at least one pair of pins (226a, 226b, 226c, 226d, 226e, 226f). In FIG. 3, only three pairs of pins (226a, 226b, 226c, 226d, 226e, 226f) are shown as representative. At least one pair of pins (226a, 226b, 226c, 226d, 226e, 226f) are located on the first region 204 of the polymeric substrate 20. Each of the light emitting diodes (24a, 24b, 24c) corresponds to one of the pair of pins (226a, 226b, 226c, 226d, 226e, 226f) (226a, 226b, 226c, 226d, 226e) , 226f), and includes a pair of pads (242a, 242b, 242c, 242d, 242e, 242f). In FIG. 3, the LED die 24a includes a pair of pads (242a, 242b) and corresponding to a pair of pins (226a, 226b), and the LED die 24b includes a pair of pads (242c, 242d). And corresponding to a pair of pins (226c, 226d), the LED die 24c includes a pair of pads (242e, 242f) and corresponding to a pair of pins (226e, 226f).

As shown in FIG. 7, each of the LED dipoles (24a, 24b, 24c) is fixed on the polymer substrate 20, and the pair of pads (242a, 242b, 242c, 242d, 242e, 242f) The pair of pins (226a, 226b, 226c, 226d, 226e, 226f) corresponding thereto form an electrical connection. For example, as shown in FIG. 7, the pair of pads (242a, 242b, 242c, 242d, 242e, 242f) of each of the LEDs (24a, 24b, 24c) are surface mount. Electrically connected to the pair of pins (226a, 226b, 226c, 226d, 226e, 226f). Furthermore, as shown in FIG. 8, the pair of pads (242a, 242b, 242c, 242d, 242e, 242f) of each of the LED diodes (24a, 24b, 24c) are wire bonded. The method is electrically connected to the pair of pins (226a, 226b, 226c, 226d, 226e, 226f). The components in FIG. 8 having the same reference numerals as those in FIG. 7 have the same or similar structures and functions, and will not be further described herein.

As shown in FIG. 5, FIG. 7, and FIG. 8, each of the protective covers (26a, 26b, 26c) corresponds to one of the light emitting diodes (24a, 24b, 24c). In FIG. 5, FIG. 7, and FIG. 8, the protective cover 26a corresponds to the LED bare crystal 24a, the protective cover 26b corresponds to the LED dipole 24b, and the protective cover 26c corresponds to the LED dipole 24c. Each protective cover (26a, 26b, 26c) is formed to cover its corresponding Light-emitting diode bare crystals (24a, 24b, 24c).

In one embodiment, each of the protective covers (26a, 26b, 26c) incorporates a plurality of uniformly distributed phosphor particles. Thereby, the LED diodes (24a, 24b, 24c) emit light to illuminate the plurality of phosphor particles, and the plurality of phosphor particles are down-converted into another color.

The material for forming the polymer substrate 20 is the same as the material for forming the polymer substrate 10, and will not be described here.

The material and structure of the first metal layer 224 are the same as those of the first metal layer 124, and will not be described here.

Further, as shown in FIG. 9, the second zone 206 defines a bendable region 208. The circuit 22 is located in the bendable region 208 and includes a second metal layer 225. The second metal layer 225 may be deposited on the first metal layer 224 by an electroplating process. Circuitry 22 located at the end of second zone 206 is used to connect an external power source (not shown in Figure 5).

In a specific embodiment, the second metal layer 225 may be formed of Cu, Ni, Ag, Au, Sn, or the like.

The method according to the third preferred embodiment of the present invention is to manufacture the flexible light-emitting device 1 as shown in Figs. According to the method of the third preferred embodiment of the present invention, the polymer substrate 10 is first prepared, wherein the polymer substrate 10 defines a deposition region 102 thereon, and the polymer substrate 10 has a first region 104 and a second region 106.

Next, the electroless plating catalyst layer 122 is coated on the deposition region 102 of the polymer substrate 10 in accordance with the method of the third preferred embodiment of the present invention.

Next, an electroless plating process is performed on the polymer substrate 10 according to the method of the third preferred embodiment of the present invention, and then a metal layer 124 is deposited on the electroless plating catalyst layer 122, wherein the electroless plating catalyst layer 122 and the metal layer are electrolessly plated. 124 constitutes circuit 12. Circuit 12 includes at least one pair of pins (126a, 126b, 126c, 126d, 126e, 126f). In FIG. 1, only three pairs of pins (126a, 126b, 126c, 126d, 126e, 126f) are shown as representative. At least one pair of pins (126a, 126b, 126c, 126d, 126e, 126f) are located on the first region of the polymeric substrate.

Finally, at least one packaged light-emitting diode element (14a, 14b, 14c) is attached to the polymeric substrate in accordance with the method of the third preferred embodiment of the present invention. In Fig. 1, only three packaged light emitting diode elements (14a, 14b, 14c) are shown as representative. Each packaged light-emitting diode (14a, 14b, 14c) component corresponds to at least one of a pair of pins (126a, 126b, 126c, 126d, 126e, 126f) (126a, 126b, 126c, 126d, 126e, 126f) and includes a pair of pins (142a, 142b, 142c, 142d, 142e, 142f). In FIG. 1, the packaged LED component 14a includes a pair of pins (142a, 142b) and corresponds to a pair of pins (126a, 126b). The packaged LED component 14b includes a pair of pins (142c). 142d) and corresponding to a pair of pins (126c, 126d), the packaged LED component 14c includes a pair of pins (142e, 142f) and corresponds to a pair of pins (126e, 126f). Each of the packaged LED components (14a, 14b, 14c) has its pair of pins (142a, 142b, 142c, 142d, 142e, 142f) corresponding to the pair of pins (126a, 126b, 126c, 126d, 126e, 126f) form an electrical connection.

Referring to FIG. 10, FIG. 11, and FIG. 12, the drawings schematically depict a flexible light-emitting device 1 of a first preferred embodiment of the present invention, wherein the circuit 12 is executed on the second region 106 of the polymer substrate 10. The structure of each stage of the electroplating process.

Further, as shown in FIG. 10, the second region 106 of the polymer substrate 10 defines a bendable region 108. Circuit 12 includes a footprint 127 located on bend region 108 and a pair of auxiliary lines (128a, 128b). The pair of auxiliary lines (128a, 128b) are electrically connected to the coverage block 127, respectively. According to the method of the third preferred embodiment of the present invention and performing electroless plating on the polymer substrate 10 The steps of the process and the step of fixing at least one packaged LED component (14a, 14b, 14c) on the polymer substrate 10 are first covered by the pair of auxiliary lines (128a, 128b) The block 127 performs an electroplating process to deposit a second metal layer 125 on the capping block 127. The structure after the electroplating process is performed is as shown in FIG. Next, a portion of the cover block 127 where the second metal layer 125 has been deposited is removed by laser engraving or the like. The reserved portion of the cover block 127 forms a plurality of main lines (129a, 129b), and the structure after the partial cover block 127 is removed is as shown in FIG. In Fig. 12, only two main lines (129a, 129b) are shown as representative. The circuit 12 on the end of the second region 106 of the polymer substrate 10 is used to connect an external power source (not shown in FIG. 1). In the process of removing part of the coverage block 127, the connection portion of the auxiliary line (128a, 128b) and the coverage block 127 may be moved and removed, or may be retained, but the main lines (129a, 129b) must be secured. Not connected.

Referring to FIG. 13 and FIG. 14 , the drawings schematically depict the structure of the partial structure of the flexible light-emitting device 1 of FIG. 1 along the CC line of the present invention and are disposed in the plating bath 30 to perform various stages of the electroplating process. .

Further, the second region 106 of the polymer substrate 10 defines a bendable region 108. As shown in FIG. 13, the electrolytic solution 34 is housed in the plating tank 3. According to the method of the third preferred embodiment of the present invention and the step of performing an electroless plating process on the polymer substrate 10 and fixing at least one packaged light emitting diode element (14a, 14b, 14c) to the polymer Between the steps on the substrate 10, the insulating layer 36 is coated on the other portion of the circuit 12 except for the bendable region 108, and the polymer substrate 10 having the circuit 12 is placed in the electrolytic cell 30 and immersed in the electrolysis. The liquid 34 connects the positive electrode 32a to one end of the circuit 12 on the bendable region 108 and the negative electrode 32b to the other end of the circuit 12 on the bendable region 108. Next, an electroplating process is performed in accordance with the method of the third preferred embodiment of the present invention to deposit a second metal layer 125 on the first metal layer 124 of the bendable region 108, as shown in FIG. Next, the insulating layer 36 is removed according to the method of the third preferred embodiment of the present invention, that is, as shown in FIG. structure. The circuit 12 on the end of the second region 106 of the polymer substrate 10 is used to connect an external power source (not shown in FIG. 1).

The flexible light-emitting device 2 shown in Figs. 5, 7 and 8 is manufactured according to the method of the fourth preferred embodiment of the present invention. According to the method of the fourth preferred embodiment of the present invention, a polymer substrate 20 is first prepared, wherein the polymer substrate 20 defines a deposition region 202 thereon, and the polymer substrate 20 has a first region 204 and a second region 206.

Next, the electroless plating catalytic ink layer 222 is coated on the deposition region 202 of the polymer substrate 20 according to the method of the fourth preferred embodiment of the present invention.

Next, an electroless plating process is performed on the polymer substrate 20 according to the method of the fourth preferred embodiment of the present invention, and a metal layer 224 is deposited on the electroless plating catalyst ink layer 222, wherein the electroless plating catalyst layer 222 and the metal layer are deposited. 224 constitutes circuit 22. Circuit 22 includes at least one pair of pins (226a, 226b, 226c, 226d, 226e, 226f). In FIG. 3, only three pairs of pins (226a, 226b, 226c, 226d, 226e, 226f) are shown as representative. At least one pair of pins (226a, 226b, 226c, 226d, 226e, 226f) are located on the first region 204 of the polymeric substrate 20.

Next, at least one of the light emitting diode bare crystals (24a, 24b, 24c) is fixed on the polymer substrate 20 in accordance with the method of the fourth preferred embodiment of the present invention. In FIG. 3, only three LED dipoles (24a, 24b, 24c) and three protective covers (26a, 26b, 26c) are shown as representative. Each of the light emitting diodes (24a, 24b, 24c) corresponds to one of the pair of pins (226a, 226b, 226c, 226d, 226e, 226f) (226a, 226b, 226c, 226d, 226e) , 226f), and includes a pair of pads (242a, 242b, 242c, 242d, 242e, 242f). In FIG. 3, the LED die 24a includes a pair of pads (242a, 242b) and corresponding to a pair of pins (226a, 226b), and the LED die 24b includes a pair of pads (242c, 242d). And corresponding to a pair of pins (226c, 226d), the LED die 24c includes a pair of pads (242e, 242f) and corresponds to a pair of pins (226e, 226f). Each of the light-emitting diodes (24a, 24b, 24c) has the pair of pads (242a, 242b, 242c, 242d, 242e, 242f) corresponding to the pair of pins (226a, 226b, 226c, 226d, 226e) , 226f) forms an electrical connection.

Finally, at least one protective cover (26a, 26b, 26c) is formed in accordance with the method of the fourth preferred embodiment of the present invention. In Fig. 3, only three protective covers (26a, 26b, 26c) are shown as representative. Each of the protective covers (26a, 26b, 26c) corresponds to one of the light emitting diodes (24a, 24b, 24c). In FIG. 3, the protective cover 26a corresponds to the LED bare die 24a, the protective cover 26b corresponds to the LED dipole 24b, and the protective cover 26c corresponds to the LED dipole 24c. Each of the protective covers (26a, 26b, 26c) is formed to cover its corresponding light emitting diode die (24a, 24b, 24c).

Further, the second region 206 of the polymeric substrate 20 defines a bendable region 208. The process of depositing the second metal layer 225 on the first metal layer 224 of the bendable region 208 is the same as the process of depositing the second metal layer 125 on the first metal layer 124 of the bendable region 108 as described above. I will not repeat them here.

By the above detailed description of the present invention, the flexible light-emitting device of the present invention has a good quality wire and a bend-resistant bending region. Further, the flexible light-emitting device of the present invention employs a light-emitting diode bare crystal instead of a packaged light-emitting diode element, whereby the thickness of the flexible light-emitting device of the present invention is reduced. Further, the method of manufacturing the flexible light-emitting device of the present invention is inexpensive.

The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents that are within the scope of the invention as claimed. Therefore, the scope of the patent scope of the invention claimed The broadest interpretation should be made in light of the above description so that it covers all possible changes and equivalence arrangements.

Claims (20)

A flexible light-emitting device comprising: a polymer substrate defining a deposition region thereon, the polymer substrate having a first region and a second region; a circuit comprising an electroless plating catalytic ink layer and a a first metal layer, the electroless plating catalyst layer is coated on the deposition region of the polymer substrate, and the first metal layer is deposited on the electroless plating catalyst layer by an electroless plating process, the circuit comprising At least one pair of pins, the at least one pair of pins being located on the first region; and at least one packaged light emitting diode element, each packaged light emitting diode element corresponding to at least one pair of pins a pair of pins and comprising a pair of pins, each of the packaged LED components being fixed on the polymer substrate and having the pair of pins electrically connected to the corresponding pair of pins, wherein the pair The second region defines a bendable region, the circuit located in the bendable region and includes a second metal layer deposited on the first metal layer by an electroplating process. One end of the second zone The circuit for connection of an external power source. The flexible light-emitting device according to claim 1, wherein the polymer substrate is composed of selected from the group consisting of polyethylene terephthalate, polyimine, polymethyl methacrylate and polymethyl methacrylate. One of the groups is formed. The flexible light-emitting device of claim 1, wherein the first metal layer is selected from the group consisting of a single layer of Cu layer, a plurality of layers of Ag/Au layer/multilayer Ag/Au/Sn/Ni layer/single layer of Cu layer, and a single layer. Sn layer / single layer Cu layer, single layer Ag layer / single layer Cu layer, single layer Au layer / single layer Cu layer, single layer Ag layer / single layer Ni layer / single layer Cu layer, single layer Au layer / single One of a group consisting of a Ni layer/single layer Cu layer and a single layer Sn layer/single layer Au layer/single layer Ag layer/single layer Ni layer/single layer Cu layer. A flexible light-emitting device comprising: a polymer substrate defining a deposition region thereon, the polymer substrate having a first region and a second region; a circuit comprising an electroless plating catalytic ink layer and a a first metal layer, the electroless plating catalyst layer is coated on the deposition region of the polymer substrate, and the first metal layer is deposited on the electroless plating catalyst layer by an electroless plating process, the circuit comprising At least one pair of pins, the at least one pair of pins are located on the first region; at least one of the LEDs is bare, and each of the LEDs is corresponding to at least one of the pair of pins And comprising a pair of solder pads, each of the light emitting diodes being fixed on the polymer substrate and having the pair of pads electrically connected to the corresponding pair of pins; and at least one protective cover, each The protective cover corresponds to one of the light emitting diode bare crystals, and each protective cover is formed to cover the corresponding light emitting diode bare crystal, wherein the second area defines a bendable region, and the bent region is located in the bendable region Circuit and contains a second gold Layer, the second metal layer by an electroplating process based on the first deposited metal layer, the circuit is one bit on the end of the second zone for connecting to an external power source. The flexible light-emitting device according to claim 4, wherein the polymer substrate is composed of selected from the group consisting of polyethylene terephthalate, polyimine, polymethyl methacrylate and polymethyl methacrylate. One of the groups is formed. The flexible light-emitting device of claim 4, wherein the first metal layer is selected Free single-layer Cu layer, multi-layer Ag/Au layer/multilayer Ag/Au/Sn/Ni layer/single-layer Cu layer, single-layer Sn layer/single-layer Cu layer, single-layer Ag layer/single-layer Cu layer, single-layer Au Layer/single layer Cu layer, single layer Ag layer/single layer Ni layer/single layer Cu layer, single layer Au layer/single layer Ni layer/single layer Cu layer, and single layer Sn layer/single layer Au layer/single layer Ag One of a group consisting of a layer/single layer of Ni/single layer of Cu. The flexible light-emitting device of claim 4, wherein each of the protective covers incorporates a plurality of uniformly distributed phosphor particles. A method of manufacturing a flexible light-emitting device, comprising the steps of: (a) preparing a polymer substrate, wherein the polymer substrate defines a deposition region thereon, the polymer substrate having a first region and a a second region; (b) coating an electroless plating catalyst layer on the deposition region of the polymer substrate; (c) performing an electroless plating process on the polymer substrate, and further performing the electroless plating catalyst layer Depositing a metal layer thereon, wherein the electroless plating catalytic ink layer and the metal layer form a circuit, the circuit comprising at least one pair of pins, the at least one pair of pins are located on the first region, and the second region defines a a bendable region, the circuit comprising a cover block located on the bend region and a pair of auxiliary lines, the pair of auxiliary lines being electrically connected to the cover block respectively; (d) performing an electroplating process on the capping block by the pair of auxiliary lines, thereby depositing a second metal layer on the capping block; (e) removing the capping region on which the second metal layer has been deposited a portion of the block to form a plurality of main lines, wherein the circuit at one end of the second region is for connecting an external power source; and (f) securing at least one packaged light emitting diode element On the polymer substrate, each of the packaged LED components corresponds to at least one of the pair of pins and includes a pair of pins, each of the packaged LED components having the pair of pins The pair of pins corresponding thereto form an electrical connection. The method of claim 8, wherein the polymer substrate is selected from the group consisting of polyethylene terephthalate, polyimide, polymethyl methacrylate, and polymethyl methacrylate. One of them is formed. The method of claim 8, wherein the first metal layer is selected from the group consisting of a single layer of Cu layer, a plurality of layers of Ag/Au layer/multilayer Ag/Au/Sn/Ni layer/single layer of Cu layer, and a single layer of Sn layer/single Layer Cu layer, single layer Ag layer/single layer Cu layer, single layer Au layer/single layer Cu layer, single layer Ag layer/single layer Ni layer/single layer Cu layer, single layer Au layer/single layer Ni layer/single One of a group consisting of a layer of Cu layer and a single layer of Sn layer/single layer of Au layer/single layer of Ag layer/single layer of Ni layer/single layer of Cu layer. A method of manufacturing a flexible light-emitting device, comprising the steps of: (a) preparing a polymer substrate, wherein the polymer substrate defines a deposition region thereon, the polymer substrate having a first region and a a second region; (b) coating an electroless plating catalyst layer on the deposition region of the polymer substrate; (c) performing an electroless plating process on the polymer substrate, and further performing the electroless plating catalyst layer Depositing a metal layer thereon, wherein the electroless plating catalytic ink layer and the metal layer form a circuit, the circuit comprising at least one pair of pins, the at least one pair of pins are located on the first region, and the second region defines a Can bend the area; (d) coating an insulating layer on other portions of the circuit other than the bendable region; (e) performing an electroplating process to deposit a layer on the first metal layer of the bendable region a second metal layer; (f) removing the insulating layer, wherein the circuit at one end of the second region is used to connect an external power source; and (g) at least one packaged light emitting diode component Fixed on the polymer substrate, wherein each packaged LED component corresponds to at least one pair of pins and includes a pair of pins, each of which has a packaged LED component The pair of pins are electrically connected to the corresponding pair of pins. The method of claim 11, wherein the polymer substrate is selected from the group consisting of polyethylene terephthalate, polyimide, polymethyl methacrylate, and polymethyl methacrylate. One of them is formed. The method of claim 11, wherein the first metal layer is selected from the group consisting of a single layer of Cu layer, a plurality of layers of Ag/Au layer/multilayer Ag/Au/Sn/Ni layer/single layer of Cu layer, and a single layer of Sn layer/single Layer Cu layer, single layer Ag layer/single layer Cu layer, single layer Au layer/single layer Cu layer, single layer Ag layer/single layer Ni layer/single layer Cu layer, single layer Au layer/single layer Ni layer/single One of a group consisting of a layer of Cu layer and a single layer of Sn layer/single layer of Au layer/single layer of Ag layer/single layer of Ni layer/single layer of Cu layer. A method of manufacturing a flexible light-emitting device, comprising the steps of: (a) preparing a polymer substrate, wherein the polymer substrate defines a deposition region thereon, the polymer substrate having a first region and a Second district; (b) coating an electroless plating catalyst layer on the deposition region of the polymer substrate; (c) performing an electroless plating process on the polymer substrate, and depositing a metal on the electroless plating catalyst layer a layer, wherein the electroless plating catalytic ink layer and the metal layer form a circuit, the circuit comprising at least one pair of pins, the at least one pair of pins being located on the first region, the second region defining a bendable region The circuit includes a coverage block located on the bend region and a pair of auxiliary lines respectively electrically connected to the coverage block; (d) performing the coverage block by the pair of auxiliary lines An electroplating process to deposit a second metal layer on the cover block; (e) removing a portion of the cover block from which the second metal layer has been deposited to form a plurality of main lines, wherein The circuit at one end of the second region is used to connect an external power source; (f) the at least one light emitting diode is barely fixed on the polymer substrate, wherein each of the light emitting diodes is at least One pair of pins and one pair of pins Each of the light emitting diodes has a pair of solder pads electrically connected to the corresponding pair of pins; and (g) at least one protective cover is formed, wherein each of the protective covers corresponds to one of the light emitting diodes Each protective cover is formed to cover its corresponding light emitting diode die. The method of claim 14, wherein the polymeric substrate is selected from the group consisting of polyethylene terephthalate, polyimide, polymethyl methacrylate, and polymethyl methacrylate. One of them is formed. The method of claim 14, wherein the first metal layer is selected from the group consisting of a single layer Cu layer, multilayer Ag/Au layer/multilayer Ag/Au/Sn/Ni layer/single layer Cu layer, single layer Sn layer/single layer Cu layer, single layer Ag layer/single layer Cu layer, single layer Au layer/single Layer Cu layer, single layer Ag layer/single layer Ni layer/single layer Cu layer, single layer Au layer/single layer Ni layer/single layer Cu layer, and single layer Sn layer/single layer Au layer/single layer Ag layer/single One of a group consisting of a layer of Ni/single layer of Cu. The method of claim 14, wherein each of the protective covers incorporates a plurality of uniformly distributed phosphor particles. A method of manufacturing a flexible light-emitting device, comprising the steps of: (a) preparing a polymer substrate, wherein the polymer substrate defines a deposition region thereon, the polymer substrate having a first region and a a second region; (b) coating an electroless plating catalyst layer on the deposition region of the polymer substrate; (c) performing an electroless plating process on the polymer substrate, and further performing the electroless plating catalyst layer Depositing a metal layer thereon, wherein the electroless plating catalytic ink layer and the metal layer form a circuit, the circuit comprising at least one pair of pins, the at least one pair of pins are located on the first region, and the second region defines a a bendable region; (d) covering an insulating layer other than the other portion of the circuit on the bendable region; (e) performing an electroplating process, and thereby placing the first portion in the bendable region Depositing a second metal layer on the metal layer; (f) removing the insulating layer, wherein the circuit at one end of the second region is used to connect an external power source; (g) at least one light emitting diode The bare crystal is fixed on the polymer substrate, and each of the light emitting diodes Crystal should be at least one pair of pins, one pair of a pin and a pair of pads, each of the LEDs being electrically connected to the corresponding pair of pins; and (h) forming at least one protective cover, wherein each of the protective covers Corresponding to one of the LED diodes, each of the protective caps is formed to cover its corresponding LED dipole. The method of claim 18, wherein the polymeric substrate is selected from the group consisting of polyethylene terephthalate, polyimide, polymethyl methacrylate, and polymethyl methacrylate. One of the first metal layers is selected from a single layer of Cu layer, a plurality of layers of Ag/Au layer/multilayer Ag/Au/Sn/Ni layer/single layer of Cu layer, a single layer of Sn layer/single layer of Cu layer, Single layer Ag layer/single layer Cu layer, single layer Au layer/single layer Cu layer, single layer Ag layer/single layer Ni layer/single layer Cu layer, single layer Au layer/single layer Ni layer/single layer Cu layer and One of a group consisting of a single-layer Sn layer/single-layer Au layer/single-layer Ag layer/single-layer Ni layer/single-layer Cu layer. The method of claim 18, wherein each of the protective covers incorporates a plurality of uniformly distributed phosphor particles.