TWI620634B - Expander, breaking device and breaking method - Google Patents

Abstract

The object of the present invention is to divide a composite substrate having a functional area on one side and a resin layer coated on the substrate for each functional area.

The expander 30 includes a plurality of expansion rods 32a to 32n, and the plurality of expansion rods 32a to 32n are formed into a strip shape on a flat substrate 31 at a fixed interval and a ridge line becomes a flat surface, and a cross-section thereof becomes an arc. shape. When the resin layer 12 of the composite substrate 10 is fractured, the expansion rods 32a to 32n are pressed along the fracture line to cause cracks to progress. In this way, it can be divided into a plurality of chips including functional regions.

Description

Expander, breaking device and breaking method

The present invention relates to a spreader, a breaking device, and a breaking method for breaking a composite substrate formed by coating a resin layer or the like on a substrate of a brittle material such as a semiconductor substrate and a ceramic substrate.

A semiconductor wafer is manufactured by dividing an element region formed on a semiconductor wafer at a boundary position of the element region. Previously, when the wafer was divided into wafers, the dicing blade was rotated by a dicing device, so that the semiconductor wafer was cut smaller by cutting.

However, in the case of using a dicing device, water must be used to discharge the discharged debris generated by cutting. In order to prevent the water or the discharged debris from adversely affecting the performance of the semiconductor wafer, it is necessary to protect the semiconductor wafer and Before and after washing out water or draining debris. Therefore, there are disadvantages in that the steps become complicated, which cannot reduce costs or shorten processing time. In addition, since cutting is performed using a dicing blade, problems such as film peeling or chipping may occur. In addition, in a MEMS (Micro-Electro-Mechanical Systems) substrate having a micro-mechanical structure, the structure is damaged due to the surface tension of water, so water cannot be used, which causes a problem that it cannot be cut by cutting. .

In addition, Patent Documents 1 and 2 propose a substrate breaking device that presses a semiconductor wafer on which a scribe line is formed from the back surface of the scribe line surface and presses the scribe line perpendicularly to the surface. And break it. The outline of cracking using such a cracking device is shown below. A plurality of functional regions are formed in a neat array on a semiconductor wafer to be broken. area. In the case of breaking, first, on the semiconductor wafer, scribe lines are formed in the vertical and horizontal directions at equal intervals between the functional regions. Then, it is divided | segmented by the breaking device along this scribe line. FIG. 1 (a) is a cross-sectional view of a semiconductor wafer placed in a breaking device before singulation. As shown in this figure, functional regions 101a, 101b are formed on the composite substrate 101, and scribe lines S1, S2, S3, ... are formed between the functional regions 101a, 101b. In the case of cutting, an adhesive tape 102 is attached to the back surface of the composite substrate 101, and a protective film 103 is attached to the front surface thereof. Then, as shown in FIG. 1 (b), when the crack is broken, a scribe line that should be broken is arranged in the middle of the supporting blades 105 and 106. In this case, the scribe line S2 is used to align the blade 104 from the upper part The scribe line is lowered, thereby pressing the composite substrate 101. In this manner, the three-point bending of the pair of support blades 105, 106 and the blade 104 is used for cracking.

[Prior technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2004-39931

[Patent Document 2] Japanese Patent Laid-Open No. 2010-149495

In the cracking device having such a configuration, when the blade 104 is pressed down and pressed during the cracking, the composite substrate 101 is slightly bent, so stress is concentrated on the composite substrate 101 and the support blade 105. , 106 The part where the leading edge touches. Therefore, if the parts of the supporting blades 105 and 106 of the breaking device contact the functional areas 101a and 101b as shown in FIG. 1 (a), a force is applied to the functional area during the breaking. Therefore, there is a problem that functional regions on the semiconductor wafer may be damaged.

In addition, as a substrate that is cut using a cracking device, there is a composite substrate formed by applying a silicone resin to a ceramic substrate. In such a composite substrate, after the ceramic substrate is fractured, the resin layer is directly pressed by the fracture bar. In this case, there is a problem that the resin layer is deformed and easily damaged. In addition, in order to solve the above problems, if you want to use laser to cut off, However, there is a problem that the laser beam is damaged due to the thermal influence of the laser, or after the laser is irradiated, splashes adhere to the surroundings.

The present invention has been made focusing on such a problem, and an object thereof is to be able to break a composite substrate in which a brittle material substrate has been fractured without damage.

In order to solve this problem, the expander of the present invention is used when breaking a composite substrate. The composite substrate is coated with a resin on a brittle material substrate having a plurality of functional areas arranged in a vertical and horizontal direction, and the brittleness is described above. The material substrate is formed with a broken line to cut off each of the above-mentioned functional areas; and the expander includes: a flat-shaped base; and a plurality of strip-shaped expansion rods, which are integrally formed on the flat-shaped base; Each ridge line of the expansion rod forms the same plane, and has an interval of an integer multiple of 2 or more between the functional areas of the composite substrate.

In order to solve this problem, the breaking device of the present invention is a breaking device that breaks a resin layer of a composite substrate. The composite substrate is coated with resin on a brittle material substrate having a functional area on one side, and a crack is formed on the brittle material substrate. The breaking device includes: a work table; an elastic support plate disposed on the work table, and holding the composite substrate with a surface on which the broken line is formed as an upper surface; and an expander including A flat substrate and a plurality of strip-shaped expansion rods integrally formed on the above substrate. Each ridge line of each of the expansion rods forms the same plane and has an integer multiple of 2 or more between the functional regions of the composite substrate. Interval; a moving mechanism that moves the table along its surface; and a lifting mechanism that holds the composite substrate and the expansion rod in parallel while lifting the expander toward the surface of the composite substrate on the elastic support plate.

In order to solve the problem, the breaking method of the present invention is a breaking method of breaking a composite substrate. The composite substrate is coated with a resin on a brittle material substrate having a plurality of functional regions arranged in a vertical and horizontal direction in a uniform manner. And a break line is formed to break each of the above Functional area; and the composite substrate is arranged on the elastic support plate so that the brittle material substrate becomes the upper surface, and the expansion rod of the expander corresponds to the lower end along the line that has been broken, and the expander is pushed down, The resin layer is broken.

In order to solve the problem, the breaking method of the present invention is a breaking method of breaking a composite substrate. The composite substrate is coated with a resin on a brittle material substrate having a plurality of functional regions arranged in a vertical and horizontal direction in a uniform manner. And a break line is formed to cut off each of the above-mentioned functional areas; and the composite substrate is arranged on the elastic support plate so that the brittle material substrate becomes the upper surface, and the above-mentioned expansion of the expander is extended along the line that has been broken. The rod corresponds to the lower end and presses down the expander, so that the fracture progresses to the resin layer for fracture. By shifting the position of the composite substrate by an amount equivalent to the distance between the functional regions, and then pressing the expander down again, The resin layer is broken.

Here, the lower end section of the expansion rod of the expander may be formed in an arc shape.

According to the present invention having such a feature, the composite substrate is arranged on the elastic support plate, and the bottom end line of the strip-shaped expansion rod corresponds to the break line to perform position alignment, thereby breaking. Therefore, it is possible to obtain an effect that the resin layer can be broken along the break line without damaging the functional area.

10‧‧‧ composite substrate

11‧‧‧ceramic substrate

12‧‧‧ Silicone

13‧‧‧ Functional Area

20‧‧‧ Breaking device

21‧‧‧Workbench

22, 25‧‧‧Horizontal fixed members

23‧‧‧Servo Motor

24‧‧‧ Ball Screw

26, 29‧‧‧ Mobile components

27‧‧‧female thread

28a‧‧‧ support shaft

28b‧‧‧ support shaft

30‧‧‧ Expander

31‧‧‧ substrate

32a ~ 32n‧‧‧Expansion Stick

40‧‧‧ Elastic support plate

50‧‧‧ scribing wheel

51‧‧‧ Splitting Rod

101‧‧‧ composite substrate

101a‧‧‧functional area

101b‧‧‧functional area

102‧‧‧Tape

103‧‧‧ protective film

104‧‧‧Blade

105‧‧‧Support knife

106‧‧‧Support knife

B _{xi + 1} , B _{xi + 3} , B _{xi + 5} ‧‧‧

S1‧‧‧ crossed

S2‧‧‧ crossed

S3‧‧‧ crossed

S _x1 ~ S _xm ‧‧‧ scribe line

S _y1 ~ S _yn

1 (a) and 1 (b) are cross-sectional views showing a state when a conventional semiconductor wafer is broken.

2 (a) and 2 (b) are a front view and a side view of a substrate to be cut off according to an embodiment of the present invention.

Fig. 3 is a perspective view showing an example of a device for breaking a resin layer according to this embodiment.

FIG. 4 is a perspective view showing an example of an expander according to this embodiment.

Fig. 5 is a perspective view showing an elastic support plate for breaking according to an embodiment of the present invention.

Figs. 6 (a) to (d) are schematic diagrams showing the breaking process of the composite substrate in this embodiment.

Figs. 7 (a) to 7 (c) are schematic diagrams showing the breaking process of the resin layer in this embodiment.

8 (a) to 8 (c) are schematic diagrams showing the breaking process of the resin layer in this embodiment.

Next, an embodiment of the present invention will be described. FIG. 2 shows a front view and a side view of a rectangular composite substrate 10 formed with a semiconductor element as an example of such a substrate. In this embodiment, the composite substrate 10 to be cut is a composite substrate 10 formed by applying a resin layer, for example, a silicone resin 12 on the ceramic substrate 11. Here, the breaking of only the ceramic substrate 11 of the composite substrate 10 is performed by extending the scribe vertically to the substrate and breaking it at one time. Therefore, this breaking is described as “cracking”, and the breaking of the silicone resin layer 12 The cracks in the resin layer are gradually expanded and cracked by the application of a force. Therefore, this division is described as "fracture". The division of the entire composite substrate 10 is referred to as "disconnection". In the manufacturing steps of the composite substrate 10, a plurality of functional regions 13 are formed in a grid pattern at the same pitch in a horizontal and vertical arrangement along lines parallel to the x-axis and y-axis. This functional area 13 is, for example, a MEMS functional area in which an LED (Light-Emitting Diode) or a mechanical component, a sensor, an actuator, or the like is incorporated. In addition, in order to divide each functional area into semiconductor wafers, as shown by a chain of dots, the lines at equal intervals in the vertical direction are set as the scribe lines S _y1 to S _yn , and the lines at equal intervals in the horizontal direction are set. In order to scribe the predetermined lines S _x1 to S _xm , the parts of the functional area are located in the center of the square surrounded by the predetermined scribe lines. In addition, the composite substrate 10 may be square or rectangular. In FIG. 2, the composite substrate 10 is rectangular. However, the grid-shaped functional area is a square. Regarding the number of the predetermined scribe lines, the y-direction scribe line S _y1 ~ S _{yn is} more than the predetermined scribe lines S _x1 to S _{xm in the} x direction.

Next, a breaking device 20 for breaking a resin layer in this embodiment will be described. As shown in FIG. 3, the breaking device 20 includes a table 21 capable of moving and rotating in the y-direction. In the breaking device 20, a moving mechanism is provided below the table 21, and the moving mechanism moves the table 21 along its surface in the y-axis direction, and further rotates the table 21 along its surface. Then, the composite substrate 10 to be cut off is placed on the table 21 via the elastic support plate 40 described below. Provided above the work table 21 The horizontal fixing member 22 in the shape of a letter holds a servo motor 23 above the horizontal fixing member 22. A ball screw 24 is directly connected to the rotation shaft of the servo motor 23, and the lower end of the ball screw 24 is supported by another horizontal fixing member 25, so that the ball screw 24 can rotate. The upper moving member 26 includes a female screw 27 that is screwed with the ball screw 24 at a central portion, and includes support shafts 28 a and 28 b from both ends of the upper moving member 26 downward. The support shafts 28 a and 28 b pass through one pair of through holes of the horizontal fixing member 25 and are connected to the lower moving member 29. An expander 30 described below is mounted on the lower surface of the lower moving member 29 in parallel with the surface of the table 21. Accordingly, when the ball screw 24 is rotated by the servo motor 23, the upper moving member 26 and the lower moving member 29 are integrated and moved up and down, and the expander 30 is also moved up and down at the same time. Here, the servo motor 23, the horizontal fixed members 22, 25, and the upper and lower moving members 26, 29 constitute a lifting mechanism that raises and lowers the expander 30.

Next, the expander 30 used at the time of a break is demonstrated. For example, as shown in the perspective view of FIG. 4, the expander 30 forms a plurality of parallel strip-shaped expansion rods 32 a to 32 n side by side on a flat base 31. All the ridges of the expansion rods form a plane. In addition, the interval between the extension rods may be a fixed number and an integer multiple of two or more between the intervals for scoring a predetermined line, and in this embodiment, it is doubled. The cross-section of each expansion rod is not particularly limited as long as it has a shape capable of being pressed along a break line, but it is preferably a curved arc shape as described below. In addition, the number of expansion rods is one less than the number of more scribe lines on the composite substrate. In addition, in FIG. 4, in order to clearly show the expansion rods 32 a to 32 n and the expansion rods 32 a to 32 n are shown on the upper surface, they are mounted on the lower moving member 29 such that the expansion rods 32 a to 32 n are lowered in use. .

In this embodiment, the elastic support plate 40 is used when the resin layer of the composite substrate 10 is broken. As shown in the perspective view of FIG. 5, the elastic supporting plate 40 is a rectangular flat plate made of rubber jig, and its size is the same as that of the composite substrate 10, and for example, the thickness is set to about several mm.

Next, a method of dividing the composite substrate 10 will be described. FIG. 6 is a diagram showing a breaking process, and FIG. 6 (a) shows a part of the composite substrate 10. First, as shown in FIG. 6 (b), the surface of the ceramic substrate 11 is used as an upper surface, and a scribing wheel 50 is moved by a scribing device (not shown) to perform scribing along a predetermined scribing line. Thus, as shown in FIG. 2 (a), scribe lines S _x1 to S _xm in the x direction and scribe lines S _y1 to S _{yn in the} y direction are formed.

Next, in the cracking step of the ceramic substrate 11, as shown in FIG. 6 (c), the composite substrate 10 is first reversed. Then, using a cracking device (not shown), the cracking rod 51 is positioned directly above the formed scribe line, and the ceramic substrate 11 is cracked only by pressing the cracking rod 51 downward.

As a result, only the ceramic substrate 11 is broken along the scribe lines S _x1 to S _xm and S _y1 to _Syn . FIG. 6 (d) shows a part of the composite substrate 10 after the scribe lines are broken along the x-direction and the y-direction. Further, scribing _{S x1 ~ S xm, S y1} ~ S yn are breaking, cracking breakage therefore hereinafter referred to as _{B x1 ~ B xm, B y1} ~ B yn.

Next, as shown in FIG. 7, a method of ending the breaking of the composite substrate 10 by extending the break lines formed on the ceramic substrate 11 to the silicone resin layer will be described. FIG. 7 is a diagram showing the fracture process of the resin layer 12, and FIG. 7 (a) shows a part of the composite substrate 10, the elastic support plate 40, and the extension rod 30. First, an elastic supporting plate 40 is disposed on the table 21 of the breaking device 20, and a composite substrate 10 is further disposed on the upper surface of the elastic supporting plate 40. At this time, as shown in FIG. 7 (a), the silicone resin layer 12 is disposed so as to be in contact with the elastic support plate 40 so that the surface of the ceramic substrate 11 is the upper surface. Then, positioning is performed in such a manner that the lowermost ridge lines of the expansion rods of the expander 30, such as 32b, 32c, and 32d, are aligned with the broken lines. In this way, the other expansion rods also become every other split line, just above the split line.

Then, the servo motor 23 is driven to lower the upper moving member 26 and the lower moving member 29 at the same time, and the extension rod 30 of the expander 30 is gradually lowered while being kept parallel to the table 21. Then, as shown in FIG. 7 (b), the expansion rods 32 b, 32 c, 32 d,... Are broken directly above the ceramic substrate 11 by the self-split lines B _{xi + 1} , B _{xi + 3} , B _{xi + 5} ,... In this way, as shown in FIG. 7 (c), the ceramic substrate 11 is deformed by being pressed by the expansion rods, and is lowered to deform the elastic support plate 40 into a V shape in the same manner. At this time, since the left and right sides of the ceramic substrate are uniformly deformed as the expansion rods are pushed in, cracks can be extended downward along the crack line. Here, the cross-sectional shape below the expansion rod is not particularly limited, but in the case of a triangular shape, for example, the necessity of accurately positioning the apex-aligned break line is relatively high. Therefore, in order to deform the ceramic substrate 11 and the silicone resin 12 in this manner in a balanced manner, the cross section below each expansion rod is made into an arc shape. Thereby, the tolerance range of the positioning accuracy of the ridge line of the expansion rod to the split line is relatively widened. Further, by sufficiently lowering the extension rod, cracks in the resin progress, and a force is pushed to the left and right, thereby ending the fracture. When the break is completed, the servo motor 23 is reversed and the expander 30 is raised.

At this time, a plurality of expansion rods are formed side by side in the expander 30, and the interval is twice as long as the scribe line. Therefore, the expansion rod can be used to split the silicone resin along a plurality of crack lines at the same time every other crack line. 12.

Then, as shown in FIG. 8, moving the table 21 in the y-axis direction is equivalent to the distance between the broken lines. Then, as shown in FIGS. 8 (b) and 8 (c), the expander 30 is lowered, so that the break of the resin layer can also be ended for other adjacent break lines B _xi , B _{xi + 2} , B _{xi + 4} ,... Here, since the interval between the extension rods is twice the distance between the scribe lines, all the x-axis fractures of the composite substrate 10 can be ended by offsetting the table 21 once and performing the fracture. In addition, in a case where the interval between the extension rods is three times the distance between the scribe lines, all the fractures in the x-axis direction can be ended by moving the table 21 twice to perform the fracture.

Then, the table 21 is rotated by 90 °, and the expander 30 is lowered in the same manner with respect to the y-axis crack and break, thereby breaking the resin layer. Then, moving the table 21 in the y-axis direction is equivalent to the distance between the break lines, and similarly, the expander 30 is lowered. In this way, the fracture of the entire surface is ended, and the resin is torn apart along each fracture line to divide the square functional area, so that a plurality of MEMS wafers can be formed.

Furthermore, in this embodiment, a ceramic substrate is described as a substrate serving as a base. However, the present invention is also applicable to various brittle material substrates such as a semiconductor substrate and a glass substrate.

In this embodiment, as the resin applied to the ceramic substrate, silicon resin Although the description has been given, it may be a layer made of other various materials, such as a polarizing plate laminated on a glass substrate.

[Industrial availability]

The invention can be used for breaking a substrate of a brittle material having a region to be protected without damaging the region to be protected when scoring and slicing. Therefore, the invention can be effectively applied to a breaking device for a substrate having a functional region.

Claims (7)

An expander is used for breaking a composite substrate. The composite substrate is coated with resin on a brittle material substrate having a plurality of functional areas arranged in a vertical and horizontal direction, and a crack is formed on the brittle material substrate. The wire is broken to cut off each of the functional areas; the expander includes: a flat-shaped base; and a plurality of strip-shaped expansion rods that are integrally formed on the flat-shaped base; and each ridge of each of the expansion rods. The lines form the same plane and have an interval that is an integer multiple of 2 or more between the functional areas of the composite substrate. The expander as claimed in claim 1, wherein a cross section of the lower end of the expansion rod is formed into an arc shape. A breaking device for breaking a resin layer of a composite substrate. The composite substrate is coated with resin on a brittle material substrate having a functional area on one side, and a fracture line is formed on the brittle material substrate to break the functional area; the fracture is described above. The device includes: a worktable; an elastic support plate arranged on the worktable, and holding the composite substrate with a surface on which a break line is formed as an upper surface; an expander including a flat plate-shaped base and an integral body on the base A plurality of expansion rods in the form of a strip, each ridge line of each of the expansion rods forming the same plane, and having an interval of an integer multiple of 2 or more between the functional areas of the composite substrate; a moving mechanism that makes the above table Moving along its surface; and a lifting mechanism, one side of which holds the composite substrate and the expansion rod in parallel, and one side The expander is raised and lowered toward the surface of the composite substrate on the elastic support plate. The breaking device of claim 3, wherein the lower end section of the expansion rod of the expander is formed in an arc shape. A cutting method for cutting a composite substrate. The composite substrate is coated with a resin on a brittle material substrate having a plurality of functional regions arranged in a vertical and a horizontal direction, and a break line is formed to break each of the above. Functional area; and the above-mentioned breaking method is arranged on an elastic support plate, and the composite substrate is configured such that the fragile material substrate becomes the upper surface; and the expansion rod of the expander as in item 1 is matched along the broken line The expander is pressed down at the lower end to break the resin layer. A cutting method for cutting a composite substrate. The composite substrate is coated with a resin on a brittle material substrate having a plurality of functional regions arranged in a vertical and a horizontal direction, and a break line is formed to break each of the above. Functional area; and the above-mentioned breaking method is arranged on an elastic support plate, and the composite substrate is configured such that the fragile material substrate becomes the upper surface; and the expansion rod of the expander as in item 1 is matched along the broken line Press the expander downward at the lower end to make the fracture progress to the resin layer for fracture; by shifting the position of the composite substrate by an amount equivalent to the distance between the functional regions, and pressing the expander downward again, The resin layer was broken. If the breaking method of claim 5 or 6, the lower end section of the expansion rod of the expander is formed into an arc shape.