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TWI619866B - Illuminating decorating assembly and method for forming the same - Google Patents

Illuminating decorating assembly and method for forming the same Download PDF

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Publication number
TWI619866B
TWI619866B TW105123995A TW105123995A TWI619866B TW I619866 B TWI619866 B TW I619866B TW 105123995 A TW105123995 A TW 105123995A TW 105123995 A TW105123995 A TW 105123995A TW I619866 B TWI619866 B TW I619866B
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Taiwan
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base material
light
wire
illuminating
forming
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TW105123995A
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Chinese (zh)
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TW201804047A (en
Inventor
沈乾龍
黃子豪
黃博雄
馮崇智
吳百翔
林家驤
黃笙洲
蔡宗佑
黃建嘉
王靖翔
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財團法人紡織產業綜合研究所
三芳化學工業股份有限公司
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Priority to TW105123995A priority Critical patent/TWI619866B/en
Publication of TW201804047A publication Critical patent/TW201804047A/en
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Publication of TWI619866B publication Critical patent/TWI619866B/en

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  • Illuminated Signs And Luminous Advertising (AREA)
  • Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)

Abstract

一種發光裝飾物總成及發光裝飾物總成的形成方法。發光裝飾物總成包括:第一基料、第二基料以及發光元件,其中所述第一基料及所述第二基料至少其中之一具有圖案化凹槽,而發光元件位於所述第一基料以及所述第二基料之間並且所述發光元件的部分位於所述圖案化凹槽中。所述發光元件包括:固定層、導線以及發光二極體。導線配置於所述固定層上,而發光二極體與所述導線電性連接且位於所述圖案化凹槽中,其中所述第一基料或所述第二基料具有透光性。A method for forming a luminescent ornament assembly and a luminescent ornament assembly. The illuminating ornament assembly includes: a first base material, a second base material, and a light-emitting element, wherein at least one of the first base material and the second base material has a patterned groove, and the light-emitting element is located at the A substrate and a portion between the second substrates and the light emitting elements are located in the patterned grooves. The light emitting element includes: a fixed layer, a wire, and a light emitting diode. The wire is disposed on the fixed layer, and the light emitting diode is electrically connected to the wire and located in the patterned groove, wherein the first base material or the second base material has light transmissivity.

Description

發光裝飾物總成及發光裝飾物總成的形成方法Method for forming luminous decorative assembly and luminous decorative assembly

本發明是有關於一種織物總成及其形成方法,且特別是有關於一種發光裝飾物總成及發光裝飾物總成的形成方法。 The present invention relates to a fabric assembly and a method of forming the same, and more particularly to a method of forming a luminescent ornament assembly and a luminescent ornament assembly.

隨著經濟加速全球化,紡織產業面臨強大的轉型與競爭壓力,因此必須不斷提升紡織技術,並開發高價值的產品。近年來,由於光電產業的蓬勃發展,一些光電元件(如發光二極體)已逐漸被應用於織物中,以使得織物具有發光甚至顯示的功能。目前已經有許多發光織物的設計相繼地被提出。 As the economy accelerates globalization, the textile industry faces strong transformation and competitive pressures, so it is necessary to continuously upgrade textile technology and develop high-value products. In recent years, due to the booming optoelectronic industry, some optoelectronic components (such as light-emitting diodes) have gradually been applied to fabrics, so that the fabrics have the function of illuminating or even displaying. A number of luminescent fabric designs have been proposed in succession.

現有將發光二極體結合到紡織品的作法,其一為將發光二極體接合到軟性印刷電路板(flexible printed circuit board),再將接合發光二極體的軟性電路板貼合至紡織品上。但是受限於發光二極體及軟性印刷電路板也是電子元件,因此在將接合發光二極體的軟性電路板貼合至紡織品上後,電子元件於織物中占據的體積會使得織物的整體外觀表面凹凸不平,影響織物的整體外觀。 There is a method of bonding a light-emitting diode to a textile, one of which is to bond the light-emitting diode to a flexible printed circuit board, and then attach the flexible circuit board to which the light-emitting diode is bonded to the textile. However, since the light-emitting diode and the flexible printed circuit board are also electronic components, after the flexible circuit board that bonds the light-emitting diodes is attached to the textile, the volume occupied by the electronic components in the fabric causes the overall appearance of the fabric. The surface is uneven and affects the overall appearance of the fabric.

本發明提供一種發光裝飾物總成,其可以廣泛應用在使用織物的產品中。 The present invention provides a luminescent decorative article assembly that can be widely used in products that use fabrics.

本發明提供一種發光裝飾物總成的形成方法,由此形成方法形成的發光裝飾物總成具有平滑的外表面。 The present invention provides a method of forming a luminescent decorative article assembly, whereby the luminescent decorative article assembly formed by the forming method has a smooth outer surface.

本發明的一種發光裝飾物總成(illuminating decorating assembly),包括:第一基料以及第二基料,其中所述第一基料及所述第二基料至少其中之一具有圖案化凹槽;發光元件,位於所述第一基料以及所述第二基料之間,並且所述發光元件的部分位於所述圖案化凹槽中,所述發光元件包括:固定層;導線,配置於所述固定層上;以及發光二極體,與所述導線電性連接,且位於所述圖案化凹槽中,且所述第一基料或所述第二基料具有透光性。 An illuminating decorating assembly of the present invention, comprising: a first base material and a second base material, wherein at least one of the first base material and the second base material has a patterned groove; a light-emitting element between the first base material and the second base material, and a portion of the light-emitting element is located in the patterning groove, the light-emitting element includes: a fixed layer; a wire disposed at the And a light-emitting diode electrically connected to the wire and located in the patterning groove, and the first base material or the second base material has light transmissivity.

在本發明的一實施例中,上述的第一基料及所述第二基料中的至少其中之一為合成皮革或紡織紗布。 In an embodiment of the invention, at least one of the first base material and the second base material is synthetic leather or textile gauze.

在本發明的一實施例中,上述的固定層為可撓性電路板(FPC),而所述導線佈線於所述可撓性電路板上。 In an embodiment of the invention, the fixed layer is a flexible circuit board (FPC), and the wires are wired on the flexible circuit board.

在本發明的一實施例中,上述的固定層為紡織基布,而所述導線為導電纖維,且所述導線以刺繡的方式配置於所述固定層上。 In an embodiment of the invention, the fixing layer is a textile base fabric, and the wire is a conductive fiber, and the wire is disposed on the fixing layer in an embroidery manner.

在本發明的一實施例中,上述的固定層為紡織基布,而所述導線為導電纖維,且所述導線與所述固定層一體地織造。 In an embodiment of the invention, the fixing layer is a textile base fabric, and the wire is a conductive fiber, and the wire is integrally woven with the fixing layer.

在本發明的一實施例中,上述的導線獨立於所述固定層。 In an embodiment of the invention, the wire is independent of the fixed layer.

在本發明的一實施例中,上述的第一基料的厚度範圍介於0.01毫米至2.0毫米。 In an embodiment of the invention, the first binder has a thickness ranging from 0.01 mm to 2.0 mm.

在本發明的一實施例中,上述的第二基料的厚度範圍介於0.05毫米至3.0毫米。 In an embodiment of the invention, the second binder has a thickness ranging from 0.05 mm to 3.0 mm.

在本發明的一實施例中,上述的發光元件的整體厚度範圍介於0.06毫米至5.0毫米。 In an embodiment of the invention, the above-mentioned light-emitting element has an overall thickness ranging from 0.06 mm to 5.0 mm.

在本發明的一實施例中,發光裝飾物總成更包括黏合膠,設置於所述第一基料及所述第二基料之間,以固定所述發光元件。 In an embodiment of the invention, the illuminating ornament assembly further includes an adhesive disposed between the first base material and the second base material to fix the light emitting element.

在本發明的一實施例中,上述的發光裝飾物總成,更包括緩衝層,其中所述第一基料的內側面向所述第二基料的內側,而所述第一基料的外側與所述第二基料的外側朝向相反的方向,所述緩衝層設置在所述第一基料或所述第二基料的所述外側。 In an embodiment of the invention, the illuminating ornament assembly further includes a buffer layer, wherein an inner side of the first base material faces an inner side of the second base material, and an outer side of the first base material The buffer layer is disposed on the outer side of the first base material or the second base material in a direction opposite to an outer side of the second base material.

在本發明的一實施例中,發光裝飾物總成更包括封膜層,包覆所述第一基料或所述第二基料的外側。封膜層中更具有導光元件,用以改變所述發光二極體發出的光的方向。 In an embodiment of the invention, the illuminating decorative assembly further includes a sealing layer covering the outer side of the first base or the second base. The sealing layer further has a light guiding element for changing the direction of the light emitted by the light emitting diode.

一種發光裝飾物總成的形成方法,至少包括下列步驟:提供第一基料及第二基料;於所述第一基料及所述第二基料的至少其中之一形成圖案化凹槽;提供發光元件,並將所述發光元件的部分設置於所述圖案化凹槽中;以及將所述第一基料及所述第 二基料固定在一起,其中所述發光元件位於所述第一基料及所述第二基料之間以形成發光裝飾物總成,且藉由所述圖案化凹槽容納所述發光元件。 A method for forming a luminous ornament assembly, comprising at least the steps of: providing a first base material and a second base material; forming a patterned groove in at least one of the first base material and the second base material; providing a light emitting element, and a portion of the light emitting element is disposed in the patterned groove; and the first base material and the first The two substrates are secured together, wherein the light-emitting elements are positioned between the first substrate and the second substrate to form a light-emitting ornament assembly, and the light-emitting elements are received by the patterned grooves.

在本發明的一實施例中,於所述第一基料或所述第二基料形成圖案化凹槽的方法為雕刻、熱壓成槽或模具切槽。 In an embodiment of the invention, the method of forming the patterned groove on the first base material or the second base material is engraving, hot pressing into a groove or die grooving.

在本發明的一實施例中,上述的發光元件為包含固定層、導線及發光二極體,而使所述發光元件位於所述第一基料及所述第二基料之間的方法包括將所述發光元件的所述固定層設置於所述第一基料及所述第二基料之間,且將所述發光元件的所述發光二極體對應位於所述圖案化凹槽中。 In an embodiment of the invention, the light-emitting element comprises a fixed layer, a wire and a light-emitting diode, and the method for the light-emitting element to be located between the first base material and the second base material comprises The fixing layer of the light emitting element is disposed between the first base material and the second base material, and the light emitting diode of the light emitting element is correspondingly located in the patterned groove.

在本發明的一實施例中,將所述發光元件的部分設置於所述圖案化凹槽中的方法包括:提供紡織基布做為所述發光元件的固定層;將導線設置於所述固定層上;以及將發光二極體固定於所述導線上,其中所述發光二極體的設置位置對應於所述圖案化凹槽中。 In an embodiment of the invention, a method of disposing a portion of the light-emitting element in the patterned groove includes: providing a textile base fabric as a fixed layer of the light-emitting element; and placing a wire on the fixed And affixing the light emitting diode to the wire, wherein the position of the light emitting diode corresponds to the patterned groove.

在本發明的一實施例中,將所述導線設置於所述固定層上的方法包括:使用導電纖維於所述紡織基布上以刺繡的方式進行佈線。 In an embodiment of the invention, the method of disposing the wire on the fixed layer comprises: embedding an electrically conductive fiber on the textile substrate in an embroidery manner.

在本發明的一實施例中,將所述導線設置於所述固定層上的方法包括:使導電纖維與所述紡織基布一體地織造,並於織造過程中進行佈線。 In an embodiment of the invention, a method of disposing the wire on the fixed layer includes: weaving the conductive fiber integrally with the textile base fabric, and routing during the weaving process.

在本發明的一實施例中,將所述導線設置於所述固定層 上的方法包括:選用金屬裸線或漆包線作為所述導線,且所述導線獨立於所述固定層。 In an embodiment of the invention, the wire is disposed on the fixed layer The above method includes selecting a bare metal wire or an enameled wire as the wire, and the wire is independent of the fixed layer.

在本發明的一實施例中,將所述發光二極體固定於所述導線上的方法為點膠黏合、熱壓黏合、覆蓋固化或熔噴。 In an embodiment of the invention, the method of fixing the light emitting diode to the wire is by adhesive bonding, thermocompression bonding, cover curing or melt blowing.

在本發明的一實施例中,發光裝飾物總成的形成方法更包括使用封膜層包覆所述第一基料或所述第二基料的外側。 In an embodiment of the invention, the method of forming the illuminating ornament assembly further comprises coating the outer side of the first base material or the second base material with a sealing film layer.

在本發明的一實施例中,發光裝飾物總成的形成方法更包括於所述第一基料或所述第二基料的外側設置緩衝層。 In an embodiment of the invention, the method for forming the illuminating ornament assembly further includes disposing a buffer layer on an outer side of the first base material or the second base material.

在本發明的一實施例中,所述第一基料的厚度範圍介於0.01毫米至2.0毫米,而所述第二基料的厚度範圍介於0.05毫米至3.0毫米。 In an embodiment of the invention, the first binder has a thickness ranging from 0.01 mm to 2.0 mm, and the second binder has a thickness ranging from 0.05 mm to 3.0 mm.

在本發明的一實施例中,所述發光元件的整體厚度範圍介於0.06毫米至5.0毫米。 In an embodiment of the invention, the overall thickness of the light-emitting element ranges from 0.06 mm to 5.0 mm.

在本發明的一實施例中,將所述第一基料及所述第二基料固定在一起的方法為縫製、膠合或熱壓合。 In an embodiment of the invention, the method of fixing the first base material and the second base material together is sewing, gluing or thermocompression bonding.

基於上述,本發明的發光裝飾物總成的形成方法提供了一種讓織物與發光元件無感融合的發光裝飾物總成,且在發光元件未發光之前,從發光裝飾物總成的外觀看不出也難以用觸摸的方式感覺出發光元件的設置。 Based on the above, the method for forming a luminescent decorative article assembly of the present invention provides a luminescent decorative object assembly that allows the woven fabric to be insensitive to the illuminating element, and the appearance of the illuminating decorative assembly is not visible until the illuminating element is not illuminated. It is also difficult to feel the setting of the light-emitting elements by touch.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the invention will be apparent from the following description.

110‧‧‧第一基料 110‧‧‧First base

120‧‧‧第二基料 120‧‧‧Second base

130‧‧‧圖案化凹槽 130‧‧‧patterned grooves

132‧‧‧黏合膠 132‧‧‧Adhesive

140‧‧‧發光元件 140‧‧‧Lighting elements

142‧‧‧固定層 142‧‧‧Fixed layer

144‧‧‧導線 144‧‧‧Wire

146‧‧‧發光二極體 146‧‧‧Lighting diode

150‧‧‧封膜層 150‧‧‧ Sealing layer

152‧‧‧導光粒子 152‧‧‧Light guiding particles

160‧‧‧緩衝層 160‧‧‧buffer layer

200‧‧‧發光裝飾物總成 200‧‧‧Lighting decoration assembly

圖1A~圖1G是依照本發明的實施例的一種發光裝飾物總成的形成方法的示意圖。 1A-1G are schematic views of a method of forming a luminescent ornament assembly in accordance with an embodiment of the present invention.

圖2是將導線及固定層連同發光二極體共同設置於圖案化凹槽中的示意圖。 2 is a schematic view showing the wire and the fixing layer together with the light-emitting diodes disposed in the patterning groove.

圖3是軟性織物電路的示意圖。 Figure 3 is a schematic illustration of a flexible fabric circuit.

圖4為發光裝飾物總成應用在鞋類產品的結構配置示意圖。 4 is a schematic view showing the structural configuration of a lighting ornament assembly applied to a footwear product.

本發明旨在闡述發光裝飾物總成的形成方法以及藉由該方法形成之發光裝飾物總成。總的來說,藉由在包覆於發光元件之外的織物的內側形成凹槽,且將佔據體積的發光元件內藏地設置在凹槽中,以改變習知的發光裝飾物總成的外表面有凹凸不平的狀況,而使本發明的發光裝飾物總成具有平滑的外表面,進而達到更佳的發光表現。以下將舉實施例說明發光裝飾物總成的形成方法及所形成的發光裝飾物總成。 The present invention is directed to a method of forming a luminescent decorative article assembly and a luminescent decorative article assembly formed by the method. In general, by forming a groove on the inner side of the fabric wrapped around the light-emitting element, and arranging the light-emitting element occupying the volume in the groove, the conventional light-emitting ornament assembly is changed. The outer surface has a rugged condition, so that the illuminating decorative assembly of the present invention has a smooth outer surface, thereby achieving better illuminating performance. Hereinafter, a method of forming a luminous ornament assembly and a formed luminous decorative assembly will be described by way of embodiments.

需先說明的是,以下的第一、第二等指代性用語或上、下、左、右等方向性用語僅用來區分部件及部件之間的設置關係,並不用以限定本實施例的內容。本領域人員應知在基準點更換的情況下,上述的指代性用語或方向性用語也可以隨之改變。 It should be noted that the following first, second, etc., or upper, lower, left, and right directional terms are only used to distinguish the relationship between components and components, and are not intended to limit the embodiment. Content. Those skilled in the art will appreciate that the above-mentioned referential terms or directional terms may also change in the case of a reference point change.

本實施例的發光裝飾物總成的形成方法至少包括下列步 驟。如圖1A,提供第一基料110及第二基料120,其中第一基料110及第二基料120中的至少其中之一為合成皮革或紡織紗布、第一基料110及第二基料120可為合成皮革及紡織紗布的組合,或第一基料110及第二基料120由使用者依據需求而選用適當的材質。於本實施例中,第一基料110以及第二基料120製作為薄膜的形式,且第一基料110的厚度範圍例如是介於0.01毫米至2.0毫米,而第二基料120的厚度範圍例如是介於0.05毫米至3.0毫米,但第一基料110及第二基料120的厚度需求並不限於此處所述,可依照實際需求而變化。 The method for forming the illuminating ornament assembly of the embodiment includes at least the following steps Step. As shown in FIG. 1A, a first base material 110 and a second base material 120 are provided, wherein at least one of the first base material 110 and the second base material 120 is synthetic leather or textile gauze, first base material 110 and second The base material 120 may be a combination of synthetic leather and textile gauze, or the first base material 110 and the second base material 120 may be selected by a user according to requirements. In the present embodiment, the first base material 110 and the second base material 120 are formed in the form of a film, and the thickness of the first base material 110 ranges, for example, from 0.01 mm to 2.0 mm, and the thickness of the second base material 120. The range is, for example, between 0.05 mm and 3.0 mm, but the thickness requirements of the first base material 110 and the second base material 120 are not limited to those described herein, and may vary depending on actual needs.

如圖1B,於第一基料110形成圖案化凹槽130。需注意的是,雖然本實施例是以在第一基料110上形成圖案化凹槽130為例說明,但在其他實施例中也可以是在第二基料120上形成圖案化凹槽130,如圖1C示。或者,也可以是在第一基料110及第二基料120上同時形成有圖案化凹槽130,如圖1D示。在第一基料110或第二基料120形成圖案化凹槽130的方法可為利用人工的方式進行雕刻、使用自動化機械進行熱壓成槽或模具切槽等方式,依照需求選用。 As shown in FIG. 1B, a patterned recess 130 is formed in the first substrate 110. It should be noted that although the embodiment is illustrated by forming the patterned recess 130 on the first substrate 110, in other embodiments, the patterned recess 130 may be formed on the second substrate 120. As shown in Figure 1C. Alternatively, a patterned groove 130 may be simultaneously formed on the first base material 110 and the second base material 120, as shown in FIG. 1D. The method of forming the patterned groove 130 in the first base material 110 or the second base material 120 may be performed by using an artificial method for engraving, using an automatic machine for hot pressing into a groove or a die grooving, and the like.

附帶一提,前述的圖案化凹槽130可以具有單一的深度,也可以被設置為在具有不同的深度,因此前述第一基料110及第二基料120的厚度範圍是指第一基料110及第二基料120的平均厚度,並非特定指第一基料110及第二基料120的特定某處的厚度。 Incidentally, the foregoing patterned grooves 130 may have a single depth, or may be disposed to have different depths, so that the thickness ranges of the first base material 110 and the second base material 120 refer to the first base material. The average thickness of 110 and second binder 120 does not specifically refer to the thickness of a particular portion of first binder 110 and second binder 120.

接著如圖1E,提供發光元件140,並將發光元件140的部分設置於圖案化凹槽130中,其中發光元件140的整體厚度範圍可介於0.06毫米至5.0毫米,較佳可介於0.2毫米至5.0毫米。此處所指的發光元件140的整體厚度是指發光元件140的平均厚度。於本實施例中,發光元件140包括固定層142、導線144(示於圖2)以及發光二極體146,其中固定層142為可撓性電路板,而導線144佈線於可撓性電路板上,且發光二極體146與導線144電性並固定於導線144上,以使導線144的電訊號可以傳遞給發光二極體146,其中可藉由點膠黏合、熱壓黏合、覆蓋固化、熔噴或其他適當的方式將發光二極體146固定於導線144上,且發光二極體146與導線144的電性方式包含實體連接或電耦合。詳細而言,發光元件140藉由黏合膠132固定於第一基料110以及第二基料120之間,其中發光二極體146朝向位於發光二極體146上方的第二基料120發光,換言之即是第二基料120是位在發光二極體146的直接發光方向上,而為了讓發光二極體146發出的光可以直接穿透第二基料120以使得發光裝飾物總成200(標示於圖1F)具備發光效果,因此第二基料120足夠薄而能夠透光,或是直接選用具透光性的材質以製作第二基料120。 Next, as shown in FIG. 1E, a light-emitting element 140 is provided, and a portion of the light-emitting element 140 is disposed in the patterning groove 130. The overall thickness of the light-emitting element 140 may range from 0.06 mm to 5.0 mm, preferably between 0.2 mm. To 5.0 mm. The overall thickness of the light-emitting element 140 referred to herein means the average thickness of the light-emitting element 140. In the present embodiment, the light-emitting element 140 includes a fixed layer 142, a wire 144 (shown in FIG. 2), and a light-emitting diode 146, wherein the fixed layer 142 is a flexible circuit board, and the wire 144 is wired on the flexible circuit board. The LEDs 146 and the wires 144 are electrically connected to the wires 144, so that the electrical signals of the wires 144 can be transmitted to the LEDs 146, which can be bonded by adhesive bonding, thermocompression bonding, and curing. The light-emitting diode 146 is fixed to the wire 144 by melt-blown or other suitable means, and the electrical manner of the light-emitting diode 146 and the wire 144 includes physical or electrical coupling. In detail, the light-emitting element 140 is fixed between the first base material 110 and the second base material 120 by the adhesive 132, wherein the light-emitting diode 146 emits light toward the second base material 120 located above the light-emitting diode 146. In other words, the second substrate 120 is located in the direct light emitting direction of the light emitting diode 146, and the light emitted by the light emitting diode 146 can directly penetrate the second substrate 120 to make the light emitting decorative assembly 200. (shown in FIG. 1F) having a light-emitting effect, the second base material 120 is sufficiently thin to transmit light, or the light-transmitting material is directly selected to form the second base material 120.

承上述,設置在圖案化凹槽130中的發光元件140的部分至少有發光二極體146,且連接發光二極體146的導線144及固定層142可視設計需求而決定是否也位在圖案化凹槽130中。一種設置方式是將發光二極體146設置於圖案化凹槽130中,而導 線144及固定層142自圖案化凹槽130中延伸至圖案化凹槽130之外,但由於導線144及固定層142也具有厚度,因此依照此種設置方式所形成的發光裝飾物總成200的整體厚度會稍厚。另一種設置方式是將導線144及固定層142連同發光二極體146共同設置於圖案化凹槽130中,其中將固定層142的形狀因應圖案化凹槽130而設計(如圖2示)。如此一來,因為發光元件140整體內藏在圖案化凹槽130中,因此以此種方式配置的發光裝飾物總成200的整體厚度相較於前述方式配置的發光裝飾物總成200的整體厚度薄。 In the above, the portion of the light-emitting element 140 disposed in the patterned recess 130 has at least the light-emitting diode 146, and the wire 144 and the fixed layer 142 connecting the light-emitting diode 146 can be determined according to design requirements. In the groove 130. One arrangement is to arrange the LED 146 in the patterning groove 130, and The wire 144 and the fixing layer 142 extend from the patterning groove 130 to the outside of the patterning groove 130. However, since the wire 144 and the fixing layer 142 also have a thickness, the light-emitting decorative assembly 200 formed according to such an arrangement is provided. The overall thickness will be slightly thicker. Another arrangement is to arrange the wire 144 and the fixed layer 142 together with the light-emitting diode 146 in the patterned groove 130, wherein the shape of the fixed layer 142 is designed according to the patterned groove 130 (as shown in FIG. 2). In this way, since the light-emitting element 140 is entirely embedded in the patterning groove 130, the overall thickness of the light-emitting ornament assembly 200 configured in this manner is larger than that of the light-emitting ornament assembly 200 configured in the foregoing manner. Thin thickness.

在其他的實施例中,也可以選用紡織基布作為固定層142,而選用導電纖維作為導線144,以形成軟性織物電路,如圖3示。導電纖維可以刺繡的方式形成於紡織基布上並同時進行佈線。或者,也可以是以一體地織造的方式將導電纖維固定於紡織基布,並且在織造的同時進行導線144的佈線。又一方式,可選用金屬裸線或漆包線作為導線144,而導線144以獨立於固定層142之外的方式設置(即,金屬裸線或漆包線的末端部分與固定層142上的電性接點相連接,而金屬裸線或漆包線的本體部分可相對固定層142分離)。 In other embodiments, a woven base fabric may also be used as the fixed layer 142, and conductive fibers are used as the wires 144 to form a flexible fabric circuit, as shown in FIG. The conductive fibers can be formed on the textile base fabric in an embroidery manner and simultaneously wired. Alternatively, the conductive fibers may be fixed to the woven base fabric in a manner of integrally weaving, and the wiring of the wires 144 may be performed while weaving. In another manner, a bare metal wire or an enameled wire may be selected as the wire 144, and the wire 144 is disposed independently of the fixed layer 142 (ie, the electrical contact between the end portion of the bare metal or enameled wire and the fixed layer 142). The wires are connected, and the body portion of the bare metal or enameled wire can be separated from the fixed layer 142).

接著如圖1F,使第一基料110設置有圖案化凹槽130的該側面對第二基料120,且將第一基料110及第二基料120互相面對的側定義為內側,並且利用縫製、膠合、熱壓合或其他適當的方式將第一基料110及第二基料120固定在一起,以形成發光裝 飾物總成200。藉由在織物的內側形成可容納發光元件140的圖案化凹槽130,發光元件140不再造成發光裝飾物總成200的外表面會有凹凸不平的現象且發光裝飾物總成200的外表面為平滑表面。 Next, as shown in FIG. 1F, the first base material 110 is disposed with the side of the patterned groove 130 facing the second base material 120, and the side where the first base material 110 and the second base material 120 face each other is defined as the inner side. And the first base material 110 and the second base material 120 are fixed together by sewing, gluing, thermocompression or other suitable manner to form a light-emitting device. Ornament assembly 200. By forming the patterned groove 130 accommodating the light-emitting element 140 on the inner side of the fabric, the light-emitting element 140 no longer causes the outer surface of the light-emitting ornament assembly 200 to have unevenness and the outer surface of the light-emitting ornament assembly 200. To smooth the surface.

接著請參考圖1G,可更在第二基料120的外側以封膜層150包覆,以對第二基料120的外表面進行進一步地表面處理,而讓發光裝飾物總成200的外表面可具備所期望的防水效果、區塊化的色彩表現或使外表面刻意粗糙化。此封膜層150的材質可以依照需求選用。另外,封膜層150中可更具有導光元件以對發光二極體146發出的光造成影響,使光折射或反射,改變發光二極體146所發出的光的方向,其中導光元件可以是在封膜層150中放置導光粒子152,或是在封膜層150的表面形成如條狀、菱形、圓形、方形等形狀的微結構(未繪示),並且藉由導光元件達到聚光或散光的目的。 Referring to FIG. 1G, the sealing layer 150 may be further coated on the outer side of the second base material 120 to further surface the outer surface of the second base material 120, and the outer surface of the light-emitting decorative assembly 200 is further disposed. The surface may have a desired water repellent effect, a block of color representation, or a deliberate roughening of the outer surface. The material of the sealing layer 150 can be selected according to requirements. In addition, the sealing layer 150 may further have a light guiding element to affect the light emitted by the LED 146, refract or reflect the light, and change the direction of the light emitted by the LED 146, wherein the light guiding element may The light guide particles 152 are placed in the sealing layer 150, or a microstructure (not shown) such as a strip, a diamond, a circle, a square, or the like is formed on the surface of the sealing layer 150, and the light guiding element is used. To achieve the purpose of concentrating or astigmatism.

此封膜層150可以是在發光裝飾物總成200形成之後再封膜於第二基料120的外側,或是可以在如圖1A的提供第二基料120的步驟前事先將第二基料120進行封膜處理。換言之,封膜層150可同時包覆第二基料120的內、外側。 The sealing film layer 150 may be sealed on the outer side of the second base material 120 after the light-emitting ornament assembly 200 is formed, or may be previously prepared before the step of providing the second base material 120 in FIG. 1A. The material 120 is subjected to a film sealing treatment. In other words, the sealing film layer 150 can simultaneously cover the inside and the outside of the second base material 120.

另外,同樣請參考圖1G,為了增加使用者穿著時的舒適度或增加發光裝飾物總成200的柔軟度,可在第一基料110的外側(相對於第一基料110的內側的另一側)設置緩衝層160,其中緩衝層160的材質例如為泡棉。 In addition, referring also to FIG. 1G, in order to increase the comfort of the user when wearing or to increase the softness of the illuminating ornament assembly 200, the outer side of the first base material 110 (relative to the inner side of the first base material 110) The buffer layer 160 is disposed on one side, wherein the material of the buffer layer 160 is, for example, foam.

前述利用發光裝飾物總成的形成方法所形成的發光裝飾物總成200可應用於例如衣著、鞋子、包包或家飾類的紡織品。圖4為發光裝飾物總成應用在鞋類產品的結構配置示意圖。請參考圖4,以發光裝飾物總成200應用在運動鞋為例說明,發光裝飾物總成200可以放置在運動鞋的鞋頭、鞋內腰、鞋外腰、鞋舌或是鞋後套處。為了提供電力給發光織物總城內的發光元件140,運動鞋中可更設置有供電單元(未繪示),此供電單元獨立於發光裝飾物總成200之外,而導線144連接至供電單元,以使供電單元所提供的電力可藉由導線144提供給發光二極體146,使發光二極體146發光。 The aforementioned illuminating ornament assembly 200 formed by the method of forming a luminescent decorative article assembly can be applied to textiles such as clothing, shoes, bags, or home furnishings. 4 is a schematic view showing the structural configuration of a lighting ornament assembly applied to a footwear product. Referring to FIG. 4 , the illuminating ornament assembly 200 is applied to the sneaker as an example. The illuminating ornament assembly 200 can be placed on the toe of the sneaker, the inner waist of the shoe, the outer waist of the shoe, the tongue or the back cover of the shoe. At the office. In order to provide power to the light-emitting elements 140 in the illuminating fabric, the power shoe may be further provided with a power supply unit (not shown), the power supply unit is independent of the light-emitting ornament assembly 200, and the wire 144 is connected to the power supply unit. The power provided by the power supply unit can be supplied to the light-emitting diode 146 through the wire 144 to cause the light-emitting diode 146 to emit light.

詳細而言,供電單元(未繪示)包括電池(未繪示)、控制器(未繪示)以及另一導線(未繪示)。供電單元的導線與發光裝飾物總成200的發光元件140的導線144電性連接。當供電單元運作時,電池所提供的電力經由供電單元的導線以及導線144傳遞給發光元件140,發光二極體146發光,因此運動鞋裝設有發光裝飾物總成200處便會發亮。此外,可更經由電路設計而使控制器控制發光二極體146的發光或不發光,以達到發光圖案可變化的效果。 In detail, the power supply unit (not shown) includes a battery (not shown), a controller (not shown), and another wire (not shown). The wires of the power supply unit are electrically connected to the wires 144 of the light-emitting elements 140 of the illuminating ornament assembly 200. When the power supply unit is in operation, the power provided by the battery is transmitted to the light-emitting element 140 via the wires of the power supply unit and the wires 144, and the light-emitting diode 146 emits light, so that the light-emitting decorative assembly 200 of the sports shoe is illuminated. In addition, the controller can control the light emission or non-light emission of the light emitting diode 146 through the circuit design to achieve a variable effect of the light emitting pattern.

特別的是,由於發光裝飾物總成200的外表面是平滑表面,因此發光二極體146發光所引發的發光裝飾物總成200的發亮效果符合預期,可以減少由於發光元件140造成發光裝飾物總成200的外表面凹凸不平而引起的光的折射、反射或漫射等不符合預期的發亮效果,讓觀賞者能更清楚地分辨發光區塊的輪廓。 In particular, since the outer surface of the illuminating decorative assembly 200 is a smooth surface, the illuminating effect of the illuminating decorative assembly 200 caused by the illuminating of the illuminating diode 146 is in accordance with expectations, and the illuminating decoration due to the illuminating element 140 can be reduced. The refraction, reflection or diffusion of light caused by the unevenness of the outer surface of the object assembly 200 does not conform to the expected brightening effect, so that the viewer can more clearly distinguish the outline of the light-emitting block.

綜上所述,本發明的發光裝飾物總成的形成方法及藉由該方法所製作而成的發光裝飾物總成中,利用在第一基料及/或第二基料中設置圖案化凹槽,且將發光元件設置在圖案化凹槽中,因此避免了習知的發光裝飾物總成的外表面凹凸不平的現象而具備平滑的外表面,進而達成符合預期的發亮效果。 In summary, the method for forming a luminescent decorative article assembly of the present invention and the illuminating decorative object assembly produced by the method utilize a patterned concave in the first base material and/or the second base material. The groove and the light-emitting element are disposed in the patterning groove, thereby avoiding the uneven surface of the outer surface of the conventional light-emitting ornament assembly and having a smooth outer surface, thereby achieving a desired brightening effect.

此外,將發光元件全部置於圖案化凹槽中,可有效縮小發光裝飾物總成的整體厚度。 In addition, all of the light-emitting elements are placed in the patterned grooves, which can effectively reduce the overall thickness of the light-emitting decorative assembly.

另外,選用紡織基布作為固定層且選用導電纖維作為導線,且利用刺繡或是一體紡織的方式將導電纖維固定在紡織基布上,使得發光元件能夠更貼合於之後要應用的產品(如衣著、鞋子、包包或家飾類)的表面,且不造成產品的外觀表面有突兀的形狀突起。 In addition, the textile base fabric is selected as the fixed layer and the conductive fiber is selected as the wire, and the conductive fiber is fixed on the textile base fabric by embroidery or integral textile, so that the light-emitting component can be more closely attached to the product to be applied later (such as The surface of clothing, shoes, bags or furniture, without causing the appearance of the product to have abrupt shape protrusions.

此外,封膜層的使用能夠對發光裝飾物總成的外表面進行表面處理,以達到期望的防水效果、區塊化的色彩表現或使外表面刻意粗糙化以改變發光效果;而更於封膜層中設置導光粒子,可改變光的行進路線,進而達到更多元化的發光表現。再者,將緩衝層設置在發光裝飾物總成靠近人體的一側,可增加穿著時的舒適度。 In addition, the use of the sealing layer can surface treatment of the outer surface of the illuminating decorative assembly to achieve a desired waterproof effect, a block of color expression or a deliberate roughening of the outer surface to change the illuminating effect; The arrangement of light guiding particles in the film layer can change the traveling route of the light, thereby achieving more diversified luminescent performance. Furthermore, the cushion layer is disposed on the side of the illuminating decorative assembly close to the human body, which can increase the comfort during wearing.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

Claims (21)

一種發光裝飾物總成,包括:第一基料以及第二基料,其中所述第一基料的厚度範圍介於0.01毫米至2.0毫米,所述第二基料的厚度範圍介於0.05毫米至3.0毫米,並且所述第一基料及所述第二基料至少其中之一具有圖案化凹槽;發光元件,位於所述第一基料以及所述第二基料之間,其中所述發光元件的整體厚度範圍介於0.06毫米至5.0毫米,並且所述發光元件的部分位於所述圖案化凹槽中,所述發光元件包括:固定層;導線,配置於所述固定層上;以及發光二極體,與所述導線電性連接,且位於所述圖案化凹槽中,且所述第一基料或所述第二基料具有透光性。 A luminescent decorative article assembly comprising: a first base material and a second base material, wherein the first base material has a thickness ranging from 0.01 mm to 2.0 mm, and the second base material has a thickness ranging from 0.05 mm Up to 3.0 mm, and at least one of the first binder and the second binder has a patterned groove; a light-emitting element between the first binder and the second binder, wherein The overall thickness of the light-emitting element ranges from 0.06 mm to 5.0 mm, and a portion of the light-emitting element is located in the patterned groove, the light-emitting element includes: a fixed layer; a wire disposed on the fixed layer; a light emitting diode electrically connected to the wire and located in the patterned groove, and the first base material or the second base material has light transmissivity. 如申請專利範圍第1項所述的發光裝飾物總成,其中所述第一基料及所述第二基料中的至少其中之一為合成皮革或紡織紗布。 The illuminating decorative article assembly of claim 1, wherein at least one of the first base material and the second base material is synthetic leather or woven gauze. 如申請專利範圍第1項所述的發光裝飾物總成,其中所述固定層為可撓性電路板(FPC),而所述導線佈線於所述可撓性電路板上。 The illuminating decorative article assembly of claim 1, wherein the fixed layer is a flexible circuit board (FPC), and the wire is routed on the flexible circuit board. 如申請專利範圍第1項所述的發光裝飾物總成,其中所述固定層為紡織基布,而所述導線為導電纖維,且所述導線以刺繡的方式配置於所述固定層上。 The illuminating ornament assembly of claim 1, wherein the fixing layer is a woven base fabric, and the wire is a conductive fiber, and the wire is disposed on the fixing layer in an embroidery manner. 如申請專利範圍第1項所述的發光裝飾物總成,其中所述固定層為紡織基布,而所述導線為導電纖維,且所述導線與所述固定層一體地織造。 The illuminating decorative article assembly of claim 1, wherein the fixing layer is a woven base fabric, and the wire is a conductive fiber, and the wire is woven integrally with the fixed layer. 如申請專利範圍第1項所述的發光裝飾物總成,其中所述導線獨立於所述固定層。 The illuminating ornament assembly of claim 1, wherein the wire is independent of the fixed layer. 如申請專利範圍第1項所述的發光裝飾物總成,更包括黏合膠,設置於所述第一基料及所述第二基料之間,以固定所述發光元件。 The illuminating decorative article assembly of claim 1, further comprising an adhesive disposed between the first base material and the second base material to fix the light emitting element. 如申請專利範圍第1項所述的發光裝飾物總成,更包括緩衝層,其中所述第一基料的內側面向所述第二基料的內側,而所述第一基料的外側與所述第二基料的外側朝向相反的方向,所述緩衝層設置在所述第一基料或所述第二基料的所述外側。 The illuminating decorative article assembly of claim 1, further comprising a buffer layer, wherein an inner side of the first base material faces an inner side of the second base material, and an outer side of the first base material The outer side of the second binder faces in an opposite direction, and the buffer layer is disposed on the outer side of the first base or the second base. 如申請專利範圍第1項所述的發光裝飾物總成,更包括封膜層,包覆所述第一基料或所述第二基料的外側。 The illuminating decorative article assembly of claim 1, further comprising a sealing layer covering the outer side of the first base material or the second base material. 如申請專利範圍第9項所述的發光裝飾物總成,其中所述封膜層更具有導光元件,用以改變所述發光二極體發出的光的方向。 The illuminating decorative article assembly of claim 9, wherein the sealing film layer further has a light guiding element for changing a direction of light emitted by the light emitting diode. 一種發光裝飾物總成的形成方法,包括:提供第一基料及第二基料,其中所述第一基料的厚度範圍介於0.01毫米至2.0毫米,以及所述第二基料的厚度範圍介於0.05毫米至3.0毫米;於所述第一基料及所述第二基料的至少其中之一形成圖案化 凹槽;提供發光元件,其中所述發光元件的整體厚度範圍介於0.06毫米至5.0毫米,並將所述發光元件的部分設置於所述圖案化凹槽中;以及將所述第一基料及所述第二基料固定在一起,其中所述發光元件位於所述第一基料及所述第二基料之間以形成發光裝飾物總成,且藉由所述圖案化凹槽容納所述發光元件。 A method of forming a luminescent ornament assembly, comprising: providing a first base material and a second base material, wherein the first base material has a thickness ranging from 0.01 mm to 2.0 mm, and a thickness range of the second base material Between 0.05 mm and 3.0 mm; forming a pattern on at least one of the first binder and the second binder a light-emitting element, wherein the light-emitting element has an overall thickness ranging from 0.06 mm to 5.0 mm, and a portion of the light-emitting element is disposed in the patterning groove; and the first base material and The second substrate is fixed together, wherein the light-emitting element is located between the first base material and the second base material to form a light-emitting ornament assembly, and the said groove is accommodated by the patterned groove Light-emitting element. 如申請專利範圍第11項所述的發光裝飾物總成的形成方法,其中於所述第一基料或所述第二基料形成圖案化凹槽的方法為雕刻、熱壓成槽或模具切槽。 The method for forming a luminescent decorative article assembly according to claim 11, wherein the method for forming a patterned groove in the first base material or the second base material is engraving, hot pressing into a groove or a mold. Grooving. 如申請專利範圍第11項所述的發光裝飾物總成的形成方法,其中所述發光元件為包含固定層、導線及發光二極體,而使所述發光元件位於所述第一基料及所述第二基料之間的方法包括將所述發光元件的所述固定層設置於所述第一基料及所述第二基料之間,且將所述發光元件的所述發光二極體對應位於所述圖案化凹槽中。 The method for forming a luminescent decorative article assembly according to claim 11, wherein the illuminating element comprises a fixing layer, a wire and a light emitting diode, and the light emitting element is located at the first base material and the The method between the second binder includes disposing the fixing layer of the light emitting element between the first base material and the second base material, and the light emitting diode of the light emitting element Correspondingly located in the patterned groove. 如申請專利範圍第11項所述的發光裝飾物總成的形成方法,其中將所述發光元件的部分設置於所述圖案化凹槽中的方法包括:提供紡織基布做為所述發光元件的固定層;將導線設置於所述固定層上;以及 將發光二極體固定於所述導線上,其中所述發光二極體的設置位置對應於所述圖案化凹槽中。 The method of forming a luminescent decorative article assembly according to claim 11, wherein the method of disposing a portion of the illuminating element in the patterned groove comprises: providing a woven base fabric as the illuminating element a fixed layer; the wire is disposed on the fixed layer; The light emitting diode is fixed on the wire, wherein the position of the light emitting diode corresponds to the patterned groove. 如申請專利範圍第14項所述的發光裝飾物總成的形成方法,其中將所述導線設置於所述固定層上的方法包括:使用導電纖維於所述紡織基布上以刺繡的方式進行佈線。 The method for forming a luminescent decorative article assembly according to claim 14, wherein the method of disposing the wire on the fixing layer comprises: using an electrically conductive fiber on the textile base fabric in an embroidery manner wiring. 如申請專利範圍第14項所述的發光裝飾物總成的形成方法,其中將所述導線設置於所述固定層上的方法包括:使導電纖維與所述紡織基布一體地織造,並於織造過程中進行佈線。 The method for forming a luminous ornament assembly according to claim 14, wherein the method of disposing the wire on the fixing layer comprises: integrally weaving the conductive fiber with the textile base fabric, and Wiring is performed during the weaving process. 如申請專利範圍第14項所述的發光裝飾物總成的形成方法,其中將所述導線設置於所述固定層上的方法包括:選用金屬裸線或漆包線作為所述導線,且所述導線獨立於所述固定層。 The method for forming a luminous ornament assembly according to claim 14, wherein the method of disposing the wire on the fixing layer comprises: selecting a bare metal wire or an enameled wire as the wire, and the wire Independent of the fixed layer. 如申請專利範圍第14項所述的發光裝飾物總成的形成方法,其中將所述發光二極體固定於所述導線上的方法為點膠黏合、熱壓黏合、覆蓋固化或熔噴。 The method for forming a luminescent decorative article assembly according to claim 14, wherein the method of fixing the light-emitting diode to the wire is by adhesive bonding, thermocompression bonding, cover curing or melt blowing. 如申請專利範圍第11項所述的發光裝飾物總成的形成方法,更包括使用封膜層包覆所述第一基料或所述第二基料的外側。 The method for forming a luminescent decorative article assembly according to claim 11, further comprising coating the outer side of the first base material or the second base material with a sealing film layer. 如申請專利範圍第11項所述的發光裝飾物總成的形成方法,更包括於所述第一基料或所述第二基料的外側設置緩衝層。 The method for forming a luminescent decorative article assembly according to claim 11, further comprising providing a buffer layer on an outer side of the first base material or the second base material. 如申請專利範圍第11項所述的發光裝飾物總成的形成方法,其中將所述第一基料及所述第二基料固定在一起的方法為縫製、膠合或熱壓合。 The method for forming a luminescent decorative article assembly according to claim 11, wherein the method of fixing the first base material and the second base material together is sewing, gluing or thermocompression bonding.
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TWM353648U (en) * 2008-11-24 2009-04-01 rong-zhou Yang Light emitting ornaments
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