TWI619411B - Interconnect structure - Google Patents

Abstract

The present invention provides an interconnection structure in which at least one 导电-shaped conductive elastic piece is sandwiched between a pair of substrates and the pair of substrates are assembled, thereby solving the problem of pinch of the conductive contact, and can greatly reduce manufacturing cost.

Description

Interconnect structure

This invention relates to the field of electrical conduction, and more particularly to an interconnect structure.

Conventionally, a solder ball such as a tin-lead alloy is generally used as an interconnecting interface for signal transmission, and a Ball Grid Array (BGA) product and a printed circuit board are electrically connected to each other to achieve a good signal. transmission. As shown in FIG. 1, it is a cross-sectional view of a conventional interconnect structure 100. The conventional interconnect structure 100 includes a first substrate 110, a second substrate 120, and at least one solder ball 130. The second substrate 120 is disposed on the first substrate 110. The at least one solder ball 130 is interposed between the first substrate 110 and the second substrate 120. The upper surface of the first substrate 110 has at least one first conductive contact 1101, and the lower surface of the second substrate 120 has at least one second conductive contact 1201. The at least one first conductive contact 1101 is electrically connected to the at least one second conductive contact 1201 by the at least one solder ball 130 .

However, the above-mentioned conventional interconnect structure 100 uses fuses to interconnect each other during processing, and the high temperature and high heat generated during the soldering process may cause deformation of the substrate or integrated circuit (IC) and damage of the electronic components. As a result, the signal transmission quality is abnormal.

Therefore, an improved interconnect structure has been proposed. As shown in FIG. 3, it is a cross-sectional view of a conventionally modified interconnect structure 200. The conventional improved interconnect structure 200 includes a first base The board 210, a second substrate 220, at least one conductive elastic element 230 and a middle layer support frame 240. The second substrate 220 is disposed on the first substrate 210. The at least one conductive elastic component 230 is disposed between the first substrate 210 and the second substrate 220 and disposed in the middle support frame 240. The upper surface of the first substrate 210 has at least one first conductive contact 2101, and the lower surface of the second substrate 220 has at least one second conductive contact 2201. The at least one first conductive contact 2101 is electrically connected to the at least one second conductive contact 2201 by the at least one conductive elastic component 230.

Since the improved interconnect structure 200 does not need to be interconnected in a fusion manner, only the combination of the structures is required to improve the disadvantages of the conventional interconnect structure 100, but the above-described improved interconnect structure 200 There are problems such as high cost and easy to scratch conductive contacts.

Therefore, it is necessary to provide a novel interconnect structure to solve the problems of the prior art.

In view of the above, an object of the present invention is to provide an interconnect structure that solves the problem of pinch of a conductive contact by sandwiching at least one conductive conductive elastic sheet between a pair of substrates and assembling the pair of substrates. And can significantly reduce costs.

In order to achieve the above object, the present invention provides an interconnect structure comprising: a first substrate, an upper surface of the first substrate has at least one first conductive contact; and a second substrate disposed on the first substrate The lower surface of the second substrate has at least one second conductive contact; and at least one conductive conductive elastic piece is sandwiched between the first substrate and the second substrate, the at least one turn The structure of the conductive conductive piece includes a bottom plate and a spring arm extending obliquely upward from one end of the bottom plate, and a lower surface of the bottom plate of the at least one conductive conductive elastic piece correspondingly contacts the at least one first conductive contact The upper surface of the elastic arm of the at least one conductive conductive elastic piece correspondingly contacts the at least one second conductive contact.

In an embodiment of the invention, the length of the bottom plate is between 0.01 millimeters (mm) and 0.3 mm.

In an embodiment of the invention, the width of the bottom plate is between 0.01 mm and 0.3 mm.

In an embodiment of the invention, the elastic arm has a circular arc shape, and the concave surface of the circular arc is oriented toward the bottom plate.

In an embodiment of the invention, an insulating layer is further disposed between the first substrate and the second substrate, and the at least one conductive conductive elastic piece is disposed in the insulating layer, and the at least one conductive conductive elastic piece is exposed The lower surface of the bottom plate and the upper surface of the elastic arm.

In an embodiment of the present invention, the lower surface of the bottom plate and the upper surface of the elastic arm of the at least one conductive conductive elastic piece are a rough surface, the at least one first conductive contact and the at least one second conductive The surface of the contacts is also a rough surface.

In an embodiment of the invention, the material of the at least one conductive conductive elastic sheet comprises copper, tantalum, nickel, iron, tungsten, gold, silver or a combination thereof.

In an embodiment of the invention, the interconnect structure further includes at least three screws and at least three nuts, and the first substrate and the second substrate have at least three positioning holes, and the at least three screws respectively Locking to the at least three nuts through the at least three positioning holes, the Each of the three fewer positioning holes is formed by a first opening included in the first substrate and a second opening included in the second substrate.

In an embodiment of the invention, at least three springs are disposed between the screw heads of the at least three screws and the at least three nuts.

In an embodiment of the present invention, a conductive adhesive is disposed between the lower surface of the bottom plate of the at least one conductive conductive elastic piece and the at least one first conductive contact, and the elastic arm of the at least one conductive conductive elastic piece A conductive paste is further disposed between the upper surface and the at least one second conductive contact.

Compared with the prior art, the present invention provides an interconnection structure by sandwiching the at least one conductive conductive elastic sheet between the first substrate and the second substrate, and assembling the first substrate and the The second substrate solves the problem of the pinch of the conductive contact and can greatly reduce the cost.

100‧‧‧Learning interconnection structure

110, 210, 310‧‧‧ first substrate

120, 220, 320‧‧‧ second substrate

130‧‧‧ solder balls

200‧‧‧Improved interconnect structure

230‧‧‧Electrically conductive elements

240‧‧‧Medium support frame

300‧‧‧Interconnect structure

330‧‧‧ㄥ-shaped conductive shrapnel

340‧‧‧Insulation

350‧‧‧ screws

360‧‧‧ nuts

370‧‧‧ Spring

380‧‧‧Positioning holes

1101, 2101, 3101‧‧‧ first conductive contacts

1201, 2201, 3201‧‧‧ second conductive contacts

310h‧‧‧first opening

320h‧‧‧Second opening

3301‧‧‧floor

3302‧‧‧Boom arm

L‧‧‧ length

W‧‧‧Width

Figure 1 is a cross-sectional view of a conventional interconnect structure.

Figure 2 is a cross-sectional view of the conventional interconnect structure of Figure 1 thermally deformed.

Figure 3 is a cross-sectional view of a conventionally modified interconnect structure.

Figure 4 is a cross-sectional view showing an interconnection structure in an embodiment of the present invention.

Fig. 5 is a perspective view of the meandering conductive elastic piece of Fig. 4.

Figure 6 is a cross-sectional view of the interconnect structure of a further embodiment of Figure 4.

Figure 7 is an exploded perspective view of the interconnect structure shown in Figure 6.

Figure 8 is a cross-sectional view showing an interconnection structure in another embodiment of the present invention.

In order to explain the technical content, structural features, objectives and effects of the present invention in detail, the following detailed description is given by way of example.

Please refer to FIG. 4-5. FIG. 4 is a cross-sectional view of the interconnect structure 300 according to an embodiment of the present invention; and FIG. 5 is a perspective view of the dome-shaped conductive shrapnel 330 of FIG. The interconnect structure 300 includes a first substrate 310, a second substrate 320, and at least one dove-shaped conductive elastic sheet 330. The first substrate 310 is, for example, a conventional printed circuit board, and the second substrate 320 is, for example, a conventional BGA package wafer.

The upper surface of the first substrate 310 has at least one first conductive contact 3101. The second substrate 320 is disposed on the first substrate 310. The lower surface of the second substrate 320 has at least one second conductive contact 3201. In this embodiment, the at least one first conductive contact 3101 and the at least one second conductive contact 3201 are conventional solder pads.

The at least one conductive conductive elastic piece 330 is sandwiched between the first substrate 310 and the second substrate 320. As the name implies, the body of the at least one conductive conductive elastic sheet 330 has a meander shape. The structure of the at least one conductive conductive elastic piece 330 includes a bottom plate 3301 and a spring arm 3302 extending obliquely upward from one end of the bottom plate 3301. The elastic arm 3302 has a circular arc shape, and the circular concave surface faces the bottom plate 3301 as shown in FIG. 5. In the present embodiment, the elastic arm 3302 is a one-piece elastic arm, but the present invention is not limited thereto. The lower surface of the bottom plate 3301 of the at least one conductive conductive elastic piece 330 is electrically connected to the at least one first conductive contact 3101. The upper surface of the elastic arm 3302 of the at least one conductive conductive elastic piece 330 is electrically connected to the at least one second conductive contact 3201.

The material of the at least one conductive conductive elastic sheet 330 is a benign conductor, which may comprise copper, tantalum, nickel, iron, tungsten, gold, silver or a combination thereof, but the invention is not limited thereto. Preferably, the at least one 导电-shaped conductive elastic piece 330 is made of beryllium copper alloy because of its excellent elasticity. In an embodiment of the invention, the length L and the width W of the bottom plate 3301 of the at least one 导电-shaped conductive elastic piece 330 are each between 0.01 mm and 0.3 mm.

Further, as shown in FIGS. 6-7, the interconnect structure 300 of the above embodiment may further include an insulating layer 340, at least three screws 350, at least three nuts 360, and at least three springs 370, and the first A substrate 310 and the second substrate 320 have at least three positioning holes 380. Each of the at least three positioning holes 380 is formed by a first opening 310h included in the first substrate 310 and a second opening 320h included in the second substrate 320.

The insulating layer 340 is disposed between the first substrate 310 and the second substrate 320. The at least one conductive conductive elastic sheet 330 is disposed in the insulating layer 340, and the at least one conductive conductive elastic sheet 330 is exposed. The lower surface of the bottom plate 3301 and the upper surface of the elastic arm 3302. The insulating layer 340 can be, for example, an insulating film for fixing the at least one conductive conductive elastic sheet 330. In another embodiment of the present invention, the insulating film can also have at least three openings for positioning ( Not shown in the figure).

The at least three screws 350 are respectively locked to the at least three nuts 360 through the at least three positioning holes 380, and the at least three springs 370 are screws respectively corresponding to the at least three screws 350 The head is between the at least three nuts 360.

Referring to FIG. 8, FIG. 8 is a cross-sectional view of an interconnect structure 300 in accordance with another embodiment of the present invention. The lower surface of the bottom plate 3301 of at least one of the dome-shaped conductive elastic sheets 330 in the interconnect structure 300 The upper surface of the elastic arm 3302 is a rough surface, and the surfaces of the at least one first conductive contact 3101 and the at least one second conductive contact 3201 of the interconnect structure 300 are also rough surfaces to prevent the surface. The slip of at least one of the conductive conductive fins 330.

Based on the above, in another embodiment of the present invention, a conductive adhesive may be disposed between the lower surface of the bottom plate 3301 of the at least one conductive conductive sheet 330 and the at least one first conductive contact 3101 (not shown) A conductive adhesive (not shown) may be disposed between the upper surface of the elastic arm 3302 and the at least one second conductive contact 3201 of the at least one conductive conductive elastic piece 330.

As described above, the interconnect structure 300 of the present invention is formed by sandwiching the at least one 导电-shaped conductive elastic sheet 330 between the first substrate 310 and the second substrate 320, and assembling the first substrate 310 and the first The two substrates 320 solve the problem of the pinch of the conductive contacts and can greatly reduce the cost.

The present invention has been disclosed in its preferred embodiments, and is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

Claims (9)

An interconnect structure includes: a first substrate, an upper surface of the first substrate has at least one first conductive contact; a second substrate disposed on the first substrate, the lower surface of the second substrate has at least a second conductive contact; and at least one 导电-shaped conductive elastic piece interposed between the first substrate and the second substrate, the structure of the at least one 导电-shaped conductive elastic piece includes a bottom plate and an end of the bottom plate The lower arm surface of the at least one 导电-shaped conductive elastic piece correspondingly contacts the at least one first conductive contact, and the upper surface of the elastic arm of the at least one 导电-shaped conductive elastic piece is correspondingly Contacting the at least one second conductive contact, wherein the lower surface of the bottom plate of the at least one conductive conductive elastic piece and the upper surface of the elastic arm are a rough surface, the at least one first conductive contact and the at least one The surface of the second conductive contact is also a rough surface. The interconnect structure of claim 1, wherein the length of the bottom plate is between 0.01 mm and 0.3 mm. The interconnect structure of claim 2, wherein the width of the bottom plate is between 0.01 mm and 0.3 mm. The interconnect structure of claim 1, wherein the elastic arm has a circular arc shape, and the concave surface of the circular arc faces the bottom plate. The interconnecting structure of claim 1, wherein an insulating layer is further interposed between the first substrate and the second substrate, and the at least one conductive conductive elastic sheet is disposed in the insulating layer and exposed At least one lower surface of the bottom plate and the upper surface of the elastic arm. The interconnecting structure of claim 1, wherein the material of the at least one conductive conductive elastic sheet comprises copper, tantalum, nickel, iron, tungsten, gold, silver or a combination thereof. The interconnecting structure of claim 1, wherein the interconnecting structure further comprises at least three screws and at least three nuts, and the first substrate and the second substrate have at least three positioning holes, At least three screws are respectively locked to the at least three nuts through the at least three positioning holes, each of the at least three positioning holes being a first opening included in the first substrate and A second opening included in the second substrate is formed. The interconnect structure of claim 8, wherein at least three springs are disposed between the screw heads of the at least three screws and the at least three nuts. The interconnecting structure of claim 1, wherein a conductive paste is disposed between the lower surface of the bottom plate of the at least one conductive conductive elastic piece and the at least one first conductive contact, the at least one shape A conductive paste is disposed between the upper surface of the elastic arm of the conductive elastic piece and the at least one second conductive contact.