TWI618165B - Wafer detection device and detection method of the same - Google Patents

Abstract

A wafer detecting device comprising: a bracket; a carrier for loading a plurality of wafers; a dial member having flexibility, the dial member being disposed on the bracket; and a displacement mechanism, and The bracket and one of the carrier members are coupled to cause relative displacement between the bracket and the carrier such that the dial member contacts an edge of each of the wafers. The method for detecting a wafer is: moving one of the dial member and the carrier member such that a relative displacement between the dial member and the carrier member is generated in the first direction, so that the dial member is sequentially Contacting the edges of each of the wafers; thereby, screening the defective wafers by means of the urging member in contact with each of the wafers.

Description

Wafer detecting device and detecting method thereof

The invention relates to wafer inspection; in particular to a detection device and a detection method for screening a wafer having defects.

In the field of semiconductor manufacturing, the process of wafer processing is becoming more and more complicated. Therefore, it is inevitable that after the wafer has undergone certain processes, several wafers may have structural defects, such as defective wafers may have cracks and inner defects. Abnormalities such as cracking or severe decrystallization.

In order to detect the abnormality of the chip early, in the process, most of the wafers are arranged between the stations to enter the inspection site for detecting the abnormality of the wafer, for example, sending the whole batch of wafers into the crack detection module (ATP). The detection is performed. However, the cost of the crack detection module is not only expensive, but also has a long detection period, and has a problem of high detection cost and inefficiency.

On the other hand, some of the operators use the finger of the site to fiddle with the whole batch of wafers, trying to apply external force to the fingers to break the defective wafer through external force to avoid abnormality. The wafer flows to the next process site. However, in the above manner, the force, the angle, and the speed of the wafer applied by the individual personnel are different in the manner in which the worker directly dials the wafer, and thus the standardization of the test operation flow cannot be achieved.

Therefore, how to combine low-cost, high-efficiency and accurate detection of defective wafers, in order to reduce the production cost of abnormal wafer flow to the back-end process and reduce the risk of abnormal wafers flowing to the client due to poor quality, etc. It is one of the directions that current industry players are striving to innovate.

In view of the above, an object of the present invention is to provide a low-cost, high-efficiency wafer inspection apparatus and a detection method thereof, which can efficiently detect a wafer having defects.

In order to achieve the above object, a wafer inspection apparatus provided by the present invention includes a holder; a carrier for loading a plurality of wafers; and a dial member having flexibility, the dial member being disposed on the bracket And a displacement mechanism coupled to one of the bracket and the carrier for causing relative displacement between the bracket and the carrier such that the dial contacts the edges of each of the wafers.

In order to achieve the above object, the present invention further provides a wafer inspection method comprising the steps of: providing a carrier member and a flexible dial member, wherein the carrier member is loaded with a plurality of first directions along a first direction a wafer arranged at intervals; moving one of the dial member and the carrier member to cause a relative displacement between the dial member and the carrier member in the first direction, so that the dial member is sequentially contacted An edge of each of the wafers; thereby, the wafer having the defects is screened by the biasing member in contact with each of the wafers.

The effect of the present invention is that the operation of the paddle force, the angle, and the like can be standardized by the operation of the dial member in contact with each of the wafers, and the wafer having the defect can be effectively detected.

In order to explain the present invention more clearly, the embodiments are described in detail with reference to the drawings. Referring to FIG. 1, a wafer inspection apparatus 100 according to a first embodiment of the present invention includes a displacement mechanism 10, a bracket 20, a carrier member 30, and a dial member 40.

The displacement mechanism 10 is coupled to one of the bracket 20 and the carrier 30 for causing relative displacement between the bracket 20 and the carrier 30. Further, the displacement mechanism 10 is Actuating a power source, thereby driving at least one of the bracket 20 and the carrier 30 to cause relative displacement between the bracket 20 and the carrier 30, wherein the power source is For human, engine or motor, etc., but not limited to this. In the embodiment, the displacement mechanism 10 includes two rails 12 and two driving units 14 . The two rails 12 are arranged side by side on a platform, and each of the driving units 14 is respectively connected to a rail 12 . The carriage 20 disposed on the rail 12 is driven to move along the rail 12. Further, in the embodiment, a ball screw 16 is disposed on the rail 12, and a base 22 is respectively coupled to the bottom of the bracket 20, and the base 22 is sleeved on the ball screw 16 The driving unit 14 is exemplified by a stepping motor, and each of the stepping motors is configured to drive each of the ball screws 16 to rotate to drive the bracket 20 to linearly move along the length of the track 12. In addition, in other practical applications, it is not necessary to provide two driving units 14. In one embodiment, only a single driving unit 14 may be disposed on one of the tracks 12, and the other side of the track 12 may be It is used for sliding the base 22 of the bracket, so that the bottom of the bracket 20 is supported at both ends, so that the movement of the bracket can obtain a relatively stable supporting effect.

The carrier 30 is for loading a wafer. In the embodiment, the carrier 30 is a wafer basket. As shown in FIG. 2, the carrier 30 is internally loaded with a plurality of wafers W arranged along a first direction D1.

The dialing member 40 is disposed on the bracket 20. In use, the dialing member 40 is configured to make contact with each of the wafers W to detect whether the wafer has defects. The dial member 40 has flexibility. For example, the dial member 40 can be mainly made of a polymer having a flexible property such as rubber or resin, or a combination thereof, and in this embodiment, Preferably, the toggle member 40 is mainly made of urethane, which has high wear resistance and antistatic properties, and is particularly suitable for testing semiconductor wafers. In addition, in other practical implementations, the dial member may also be made of other polymers having flexible properties, for example, by other rubbers, resins, plastics, etc., and not limited to the above-mentioned urethane rubber.

In the embodiment, the two dial members 40 are fixed to the bracket 20 through a detachable movable clamp, and the two dial members 40 are spaced apart. The arrangement is such that the edge of each of the wafers W can be applied equally. However, in other implementations, it is not limited thereto, and a single dial member or more than two dial members may be provided for testing.

The wafer inspection method provided by the present invention is used for screening a defective wafer, which comprises the following steps:

Step 1: Provide a carrier and a flexible dial. In this embodiment, a carrier 30 loaded with a plurality of wafers W arranged at intervals in the first direction D1 is placed on a platform; and a toggle member 40 having flexibility is provided above the carrier 30. And the portion of the wafer 40 having a partial overlap with the wafers W in a second direction D2, wherein the second direction D2 is substantially perpendicular to the first direction D1, or the length direction of the dial member 40 parallel.

The area of the overlapping area and the overlapping length of the overlapping portion between the dial 40 and the wafer W can be adjusted according to the magnitude of the force applied to the wafer, the material, the length, and the thickness of the dial 40. Preferably, the ratio of the area of the overlapping area of the dialing member 40 and each of the wafers W to the area of each of the wafers W is not more than 2%. For example, in the present embodiment, the dial member 40 is made of urethane, and has a length and a width of about 10 mm, respectively, and a total height of about 210 mm, which is calculated from the clamp of the bracket 20 to The height of the end for contacting the wafer is 55 mm; the wafer W to be tested is a square wafer having a size of 156 mm * 156 mm and a thickness of about 180 - 200 μm, wherein when the slider 40 and the wafer W are overlapped In terms of length, preferably, the length L of the dial member 40 and the wafer W overlapping between the portions is between 0.5 mm and 2 mm, and more preferably, the length L of the partial overlap is preferably 1 mm; In view of the overlapping area between the dial member 40 and the wafer W, preferably, the overlapping area of the dial member 40 and each of the wafers W is not more than about 486 mm ² . Therefore, the force for providing each wafer can be effectively achieved, and the chance of damaging the crystal plane of the wafer due to contact friction can be reduced. In addition, in other practical implementations, other sizes of the dial members may be used, and are not limited to the dial members 40 of the above size.

Step 2: moving one of the dial member and the carrier member such that a relative displacement between the dial member and the carrier member is generated in the first direction, so that the dial member sequentially contacts each The edge of the wafer. In this embodiment, the driving unit 14 is controlled to drive the rotation of the ball screw 16 to drive the bracket 20 to move along the rail 12 in the first direction D1, so that the dial member 40 disposed on the bracket 20 and the carrier member The relative displacement between the wafers W and the wafers W therein is such that the dial members 40 can sequentially contact the edges of the wafers W, whereby, as shown in FIG. 3, a certain amount can be imparted through the dial members 40, respectively. The force is applied to each of the wafers W, wherein during the process of the dialing member 40 being slid over the wafer W, the deflecting member 40 has a flexible effect, and elastic deformation can be generated, and the wafer W can be effectively applied. Force, but not damage the wafer W.

The wafer W tested in the present embodiment is a square wafer having a size of 156 mm*156 mm and a thickness of about 180 to 200 μm. When the wafer is a normal sheet, the force can be tolerated without breaking. It is within 4 Newtons; when the wafer is a defective piece with defects, it only needs to be subjected to a force of less than about 0.5 Newton, and can be directly destroyed, thereby detecting that the wafer is a defective piece having defects. Therefore, in order to achieve the effect of not destroying the normal piece but effectively destroying the abnormal piece, the abnormal piece is detected from among the plurality of wafers. In the embodiment, the dialing member 40 is further controlled to be applied to each of the chips. The magnitude of the force of W, such as controlling the force applied by the dial member 40 to each of the wafers W, is not more than 3.8 Newtons.

For example, the magnitude of the force when the dial member 40 contacts the wafer W can be adjusted based on the moving speed between the dial member 40 and the wafer W. For example, the dialing member can be based on the present case. The length of 40, the material of the urethane rubber is selected, and the moving speed is set between 10 and 16 cm/sec. Preferably, the moving speed can be set to 12 cm/sec, whereby the respective dial members 40 are in contact. Each of the wafers W can be applied with a force of about 0.5 Newtons of the wafer W (the sum of the forces acting on the wafer W by the two dial members 40 is about 1 Newton), thereby effectively destroying the defective piece with defects. . However, in other practical implementations, when different materials, length, width, and height of the dial member 40 are selected, different moving speeds may be set, and are not limited to the above description.

As shown in FIG. 4, if the wafer W is an abnormal sheet having defects such as dark cracking, internal cracking or severe decrystallization, the wafer W may be broken when subjected to the force of the toggle member contact. Therefore, it is possible to effectively screen out the defective abnormal sheets early before the batch of wafers is sent to the next process, thereby reducing the production cost and reducing the risk of abnormal wafer flow to the downstream process. In addition, the wafer detecting device and the detecting method of the present invention are different from the conventional method of directly touching the wafer by the finger of the worker, and can effectively achieve the same force applied to each of the wafers, and the effect of standardizing the operation flow. .

In addition, the detection by the blind detection module (ATP) takes about 2.5 seconds to detect each wafer, that is, a batch of 50 wafers takes 125 seconds, which is a reflection of the present invention. The provided wafer inspection device and detection method can quickly scan each wafer to complete the detection quickly. Comparing the two phases, the wafer detecting device of the present invention is relatively cheaper than the dark detecting module in terms of device cost, in addition to the detection efficiency superior to the conventional crack detecting module.

Referring to FIG. 5, a wafer detecting device 200 according to a second embodiment of the present invention is substantially the same as the wafer detecting device 100 of the first embodiment, except that a track 212 is provided on only one side. A single driving unit 214 is connected to the track 212, and the bracket 220 is designed in a cantilever manner, that is, the bracket 220 has only one end connected to the rail 212 and the other end is suspended. Thereby, the bracket 220 on the track 212 can be driven to be displaced relative to the carrier 30 by controlling the driving unit 214, so that the dial member 40 can sequentially contact each of the wafers for detection.

In addition, referring to FIG. 6, a wafer detecting device 300 according to a third embodiment of the present invention is substantially the same as the wafer detecting device 200 of the second embodiment, and the bracket 320 is also a cantilever design using a single arm. The difference is that it is only provided with a single track 312, and no driving unit is provided. The bracket 320 is disposed on the track 312 so as to be slidable on the track 312, and is disposed above the bracket 320. There is a hand 322 for the tester to displace the bracket 320 on the track 312 through the hand. In other words, in one embodiment, the power source of the displacement mechanism can also be the manpower provided by the tester.

It is worth mentioning that, in the above-mentioned embodiment, the multi-purpose bearing member is statically placed on a plane, and the operating bracket drives the dial member to move on the rail, so that a relative displacement between the dial member and the carrier member is generated. So that the dial members sequentially contact the edges of each of the wafers. In addition, in other practical implementations, the dial member may also be designed to be stationary, and the manner of moving the carrier member may be such that a relative displacement between the dial member and the carrier member is used for testing. For example, referring to FIG. 7, a wafer detecting device 400 according to a fourth embodiment of the present invention is different from the foregoing embodiment in that the bracket 420 and the dialing member 40 disposed on the bracket 420 are The displacement mechanism includes a track 412 and a driving unit (not shown). The wafer-loaded carrier 30 is placed on the track 412, and the driving unit is coupled to the track 412. The connecting member is configured to drive the carrier on the track 412 to move along the first direction D1, so that the relative displacement between the dial member 40 and the carrier 30 in the first direction D1 is generated. In order to cause the dial member 40 to sequentially contact the edges of each of the wafers.

In addition, in an embodiment, under the framework of the fourth embodiment, the driving unit can also be replaced by a manual force, that is, the carrier carrying the wafer can be moved along the track by human power, thereby enabling the carrier. A relative displacement is generated between the dial member and the dial member, and is not limited to the above embodiment.

The wafers described in the above embodiments are exemplified by a square-like wafer, but in other practical applications, circular wafers (wafers) can be detected without being limited to the above-mentioned square wafers.

It should be noted that, in other practical implementations, the wafer inspection apparatus and the detection method provided by the present invention can also be applied to wafers of other sizes, and not limited to the wafer size mentioned in the above embodiments.

The above description is only a preferred embodiment of the present invention. In other practical applications, the dial member and the carrier member may be simultaneously moved, so that a relative displacement between the dial member and the carrier member is generated. Equivalent changes in the scope of the present invention and the scope of the claims are intended to be included within the scope of the invention.

W‧‧‧ wafer [present invention]
100‧‧‧ wafer inspection device
10‧‧‧displacement mechanism
12‧‧‧ Track
14‧‧‧ drive unit
16‧‧‧Ball screw
20‧‧‧ bracket
22‧‧‧ pedestal
30‧‧‧Carrier
40‧‧‧WD parts
D1‧‧‧ first direction
D2‧‧‧ second direction
L‧‧‧ length
200‧‧‧ wafer inspection device
212‧‧‧ Track
214‧‧‧ drive unit
220‧‧‧ bracket
300‧‧‧ wafer inspection device
312‧‧‧ Track
320‧‧‧ bracket
322‧‧‧Handheld Department
400‧‧‧ wafer inspection device
412‧‧‧ Track
420‧‧‧ bracket

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective view of a wafer inspection apparatus according to a first embodiment of the present invention. Figure 2 is a cross-sectional view taken along line 2-2 of Figure 1. Figure 3 is a schematic illustration of the dial member being pulled over the edge of a wafer. Figure 4 is a schematic illustration of a wafer with defects being broken by force. Figure 5 is a side elevational view of a wafer inspection apparatus in accordance with a second embodiment of the present invention. Figure 6 is a side elevational view of a wafer inspection apparatus in accordance with a third embodiment of the present invention. Figure 7 is a side elevational view of a wafer inspection apparatus in accordance with a fourth embodiment of the present invention.

Claims (12)

A wafer detecting device comprising: a bracket; a carrier for loading a plurality of wafers; a dial member having flexibility, the dial member being disposed on the bracket; and a displacement mechanism, and The bracket and one of the carrier members are coupled to cause relative displacement between the bracket and the carrier such that the dial member contacts an edge of each of the wafers. The wafer detecting device of claim 1, wherein the displacement mechanism comprises a track; the frame is disposed on the track and movable along the track. The wafer detecting device of claim 2, wherein the displacement mechanism comprises a driving unit coupled to the rail for driving the bracket to move along the rail. The wafer detecting device of claim 1, wherein the dial member is mainly made of a rubber material, a resin material, or a combination thereof. The wafer detecting device of claim 1, wherein the displacement mechanism comprises a track on which the carrier is placed and driven by the track to be relatively displaced from the holder. The wafer detecting device of claim 5, wherein the displacement mechanism comprises a driving unit coupled to the rail for driving the carrier to move along the rail such that the carrier and the bracket are between Produce relative displacement. A wafer inspection method for screening a defective wafer, comprising the steps of: providing a carrier and a flexible toggle member, wherein the carrier is loaded with a plurality of spacers arranged along a first direction And moving one of the dial member and the carrier member such that the shifting member and the carrier member are relatively displaced in the first direction, so that the dial member sequentially contacts each of the The edge of the wafer; thereby, the wafer having the defect is screened by contacting the biasing member with each of the wafers. The wafer inspection method of claim 7, further comprising providing a displacement mechanism, the displacement mechanism comprising a track coupled to the carrier and the one of the dial members for driving the carrier A relative displacement is generated with respect to one of the dial members relative to the other. The wafer detecting method of claim 8, wherein the displacement mechanism further comprises a driving unit coupled to the rail for driving one of the carrier and the dialing member to generate relative to the other Relative displacement. The wafer detecting method of claim 7, wherein the dial member has a partial overlap with each of the wafers in a second direction, wherein the second direction is perpendicular to the first direction. The wafer detecting method according to claim 7, wherein a ratio of an area of the overlapping area of the dial member and each of the wafers to an area of each of the wafers is not more than 2%. The wafer detecting method of claim 7, wherein the force applied by the dial member to each of the wafers is not more than 3.8 Newtons.