TWI614199B - Electronic component carrier pick-and-place method and mechanism - Google Patents

Description

Electronic component carrier pick-and-place method and mechanism

The present invention relates to a pick-and-place method and mechanism, and more particularly to an electronic component carrier pick-and-place method and mechanism for picking up and placing a carrier carrying electronic components.

According to the general types of electronic components, there are often two or more electronic component combinations, such as a flexible substrate and a key, depending on the necessity. The actuating element is pressed, so that it cannot be connected by a fixed hardware circuit, and the circuit printed on the flexible substrate must be used for telecommunications conduction with the control system, and the flexibility of the substrate forming the circuit provides the button to be constantly actuated. Displacement response; a process in which electronic components of such a flexible substrate are bonded to a carrier such as a button, in the prior art, a flexible substrate supporting a plurality of matrix arrays is often used on a transported carrier, and the other is coupled The transported carrier carries a plurality of matrix-arranged carriers, and the flexible substrate is picked up by the adsorbing member to be attached to the carrier carried on the other carrier.

The prior art flexible substrate contained in the carrier has flexibility due to its own flexibility, so that it is prone to warp during transportation. To solve this problem, it is an ideal method to provide a cover on the carrier, even if In this way, when the flexible substrate and the carrier are bonded together, the flexible substrate may still have warpage. Therefore, after the flexible substrate and the carrier are bonded together, a cover is required to be covered, but simply covered. The cover of the flexible substrate and the flexible substrate and the carrier after the covering is completed, obviously different covers must be used because of the different coverings, so that the articles to be transported in the process will include separate loading a flexible substrate and a carrier of the carrier, and respectively covering the flexible base The board and the two covers of the flexible substrate and the carrier after the bonding, how many pieces of the object to be transported are efficiently transported in a bonding process, and how to realize the flexible substrate during the complicated transfer process The lamination process of the carrier will be developed and broken. On the other hand, if the cover is added, the transfer process will increase the opening and closing considerations of the cover, so how to make the components with the carrier and the cover The efficient pick-and-place during the transfer process is a problem to be solved.

Accordingly, it is an object of the present invention to provide an electronic component carrier pick-and-place method for picking and placing components having a carrier and a cover.

Another object of the present invention is to provide a mechanism for performing the method of picking up and placing an electronic component carrier.

An electronic component carrier pick-and-place method according to the present invention includes: providing a carrier on which components to be processed are arranged in a matrix, the carrier is covered with an upper cover; a first group of adsorption elements is provided; and a second is provided The adsorption element is assembled; the carrier is adsorbed by the first group of adsorption elements, and the upper cover is adsorbed by the second group of adsorption elements.

An electronic component carrier pick-and-place mechanism according to another object of the present invention includes: means for performing the method of picking and placing the electronic component carrier. .

The electronic component carrier pick-and-place method and mechanism according to the embodiment of the present invention, because the first group of adsorption elements and the second group of adsorption elements can be selectively adsorbed, so that the operation of the carrier and the upper cover is more flexible and flexible, The opening, closing and moving of the carrier and the upper cover can be carried out in a sufficient and efficient manner.

A1‧‧‧ first component

A2‧‧‧ second component

B1‧‧‧first carrier

B11‧‧‧ first cover

B2‧‧‧second carrier

B21‧‧‧Second cover

E‧‧‧ pick-and-place mechanism

E1‧‧‧Longmen rail seat

E11‧‧‧ column

E12‧‧‧ beams

E121‧‧‧beam track

E13‧‧‧left drive

E131‧‧‧First slide

E14‧‧‧Right drive

E141‧‧‧Second slide

E2‧‧‧first take-off arm

E21‧‧‧First suction seat

E22‧‧‧First drive

E23‧‧‧First slide rail

E3‧‧‧Second access arm

E31‧‧‧Second suction seat

E32‧‧‧second drive

E33‧‧‧Second rail

E4‧‧‧ third take-off arm

E41‧‧‧ third suction seat

E42‧‧‧third drive

E43‧‧‧ third slide

E5‧‧‧ fourth take-off arm

E51‧‧‧4th suction seat

E52‧‧‧fourth drive

E53‧‧‧fourth rail

E6‧‧‧First group of adsorption elements

E7‧‧‧Second group of adsorption elements

Y1‧‧‧ spacing

Y2‧‧‧ first positioning

Y3‧‧‧Second positioning

1 is a perspective exploded view showing the relationship between the carrier and the upper cover and the first and second components, respectively, in the embodiment of the present invention.

2 is a schematic perspective view of a pick-and-place mechanism in an embodiment of the present invention.

3 is a schematic view showing the first group of adsorption elements and the second group of adsorption elements of the suction cup jointly adsorbing the carrier and the upper cover in the embodiment of the present invention.

4 is a schematic view showing the position of the first group of adsorption elements and the second group of adsorption elements corresponding to the carrier and the upper cover in the embodiment of the present invention.

FIG. 5 is a schematic view showing the first group of adsorption elements and the second group of adsorption elements collectively adsorbing the carrier and the upper cover in the step of extracting the embodiment of the present invention.

FIG. 6 is a partially enlarged schematic view showing the first group of adsorption elements and the second group of adsorption elements collectively adsorbing the carrier and the upper cover in the step of extracting the embodiment of the present invention.

Figure 7 is a schematic view showing the suction of the upper cover by the second group of adsorption elements in the charging step of the embodiment of the present invention.

FIG. 8 is an enlarged schematic view showing a portion of the suction seat of the embodiment of the present invention in which only the second group of adsorption elements adsorb the upper cover.

FIG. 9 is a schematic view showing the operation of the first sliding seat and the second sliding seat moving inwardly in the embodiment of the present invention.

Referring to FIG. 1 , an embodiment of the present invention is used for performing different component bonding processing. The first component A1 to be processed is held by a rectangular first carrier B1, each first load. A plurality of first elements A1 arranged in a matrix are covered by a rectangular first upper cover B11 on the disk B1, wherein the area of the first carrier B1 is larger than the first upper cover B11, and the first element A1 is flexible, for example, in this embodiment. The substrate (the first component A1 in the figure is only a schematic, non-actual flexible substrate shape); the second component A2 to be processed and fitted is carried by a rectangular second carrier B2, each of the second carrier B2 Each of the second elements A2 arranged in a matrix is covered by a rectangular second upper cover B21, wherein the area of the second carrier B2 is larger than that of the second upper cover B21. In the embodiment, the second component A2 is, for example, a button type carrier ( The second element A2 in the figure is only a schematic, not the actual button shape); the first upper cover A magnet such as a magnet may be disposed between the B11 and the first carrier B1, or between the second upper cover B21 and the second carrier B2, so that the two components form a better combined positioning when the cover is covered.

Referring to FIG. 1 and FIG. 2, the electronic component carrier pick-and-place method and mechanism embodiment of the present invention can be illustrated by the pick-and-place mechanism E as shown in the figure, including: a gantry rail seat E1, which is provided on both sides thereof. The column E11, the cross member E12 disposed above the two sides of the two columns E11 is provided with a Y-axis beam track E121, and a leftward driving member E13 and a right driving member E14; the left driving member E13 drives the left side of the beam E12. a first sliding seat E131 that slides on the beam rail E121, the right driving member E14 drives a second sliding seat E141 on the right side of the beam E12 that can slide on the beam rail E121; the first sliding seat E131 is only on the beam E12 The second slide E141 is repeatedly displaced on the right side of the beam E12, and the two slides are not over the middle of the cross beam E12 to the other side; the first slide E131 is provided with the first set Z axis first. The second pick-and-place arm E2, E3, wherein the first pick-and-place arm E2 is located inside the gantry rail seat E1, the second pick-and-place arm E3 is located outside the gantry rail seat E1, and the first and second pick-and-place arms E2 and E3 respectively Each of the first suction seat E21 and the second suction seat E31 having a rectangular bottom surface disposed horizontally in the X axis; The second sliding seat E141 is provided with the third and fourth picking and lowering arms E4 and E5, wherein the third picking arm E4 is located inside the gantry rail seat E1, and the fourth picking arm E5 is located at the gantry rail seat. On the outer side of the E1, the third and fourth take-off arms E4 and E5 are respectively provided with a third suction seat E41 and a fourth suction seat E51 which are horizontally arranged with a rectangular bottom surface; the first sliding seat E131 and the second The sliding seat E141 is selectively displaced to face or opposite to the left or right; the first pick-and-place arm E2 is interlocked with the first suction seat E21 and driven by a first driving member E22, which can be in a Z-axis Upward and downward displacement to the first slide rail E23; the second pick and place arm E3 is interlocked with the second suction seat E31, and is driven by a second driving member E32, and can be driven by a second sliding rail E33 in a Z-axis. The upper and lower displacement arms E4 are interlocked with the third suction seat E41 and driven by a third driving member E42, and can be displaced up and down on the Z-axis third sliding rail E43. The fourth pick-and-place arm E5 is interlocked with the fourth suction seat E51, and is subjected to The fourth driving member E52 is driven to be moved up and down on a Z-axis fourth sliding rail E53; the first suction seat E21, the second suction seat E31, the third suction seat E41, and the fourth suction seat E51 may be selectively transported up and down to have a first upper cover B11, a first carrier B1 or a second cover B21 and a second carrier B2, wherein the rectangular bottom surface is larger than The first upper cover B11 or the second upper cover B21 of the assembly to be adsorbed has a rectangular bottom surface as shown in FIG. 3, and has a first group of adsorption elements E6 (for example, suction nozzles) located on the outer peripheral side and having a lower suction port, and a second group of adsorption elements E7 (for example, a nozzle) located inside the first group of adsorption elements E6 and having a higher suction port; wherein the second group of adsorption elements E7 is for adsorbing the first object adsorbed by the first group of adsorption elements E6 ( a second object (such as the first upper cover B11) in the area of the first carrier B1), and used to adsorb the first object (such as the first carrier B1) used for adsorption by the first group of adsorption elements E6 And a second object located above the first object (such as the first upper cover B11); the first group of adsorption elements E6, the second group of adsorption The pieces E7 may each be composed of a plurality of nozzles, and each of them is located at a non-selectable fixed height on each of the first suction cup E21, the second suction seat E31, the third suction seat E41, and the fourth suction seat E51. Whereas, the distribution is approximately rectangular and the width of the surface is wide, and the two can be independently controlled by the negative pressure opening and closing, for example, the negative pressure of the first group of adsorption elements E6 is closed, and only the second group of adsorption elements E7 is adsorbed; Referring to FIG. 4 (taking the adsorption of the first suction cup E21 as an example), since the area of the first carrier B1 is larger than that of the first upper cover B11, the first group of adsorption elements E6 are arranged in two columns, and are arranged correspondingly at intervals. The disk surface B12 of the remaining area on both sides of the first carrier B1 except the cover of the upper cover B11 is adsorbed, and the second group of adsorption elements E7 is arranged in three rows and arranged at intervals and only corresponds to the first upper cover B11. The surface of the cover is exposed to the B111 method.

The electronic component carrier pick-and-place method of the embodiment of the present invention comprises: a step of extracting, referring to FIG. 1, 5, and 6, the first carrier B1 and the first upper cover B11 of the first component A1 are attached to the whole set of clips. The assembly is transported in the X-axis direction and moved to the lower position of the first suction seat E21; the first suction seat E21 below the first pick-and-place arm E2 is driven down to the first group of adsorption elements E6 Adsorbing the first carrier B1 and the second group of adsorption elements E7 adsorbing the first upper cover B11 to adsorb the whole assembly and then moving up to complete the reclaiming, wherein the first carrier B1 has a larger area than the first upper cover B11, the first group The adsorption element E6 is adsorbed by adsorbing the upper surface of the remaining area of the first carrier B1 other than the portion covered by the first upper cover B11; and the second set B2 and the second upper cover B21 of the second set A2 are attached to the entire set. The assembly is transported in the X-axis direction and moved to the lower position of the third suction seat E41; the third suction seat E41 below the third pick-and-place arm E4 is driven to move downward, and the first set of adsorption elements E6 is attracted to the second carrier B2. The second group of adsorption elements E7 adsorbs the second upper cover B21, adsorbs the whole assembly and then moves up to complete the reclaiming. wherein, because the area of the second carrier B2 is larger than the second upper cover B21, the first group of adsorption elements E6 is adsorbed. The surface of the remaining area of the second carrier B2 other than the cover portion of the second upper cover B21 is adsorbed; the entire set of the first carrier B1 and the first upper cover B11 of the first component A1 are attached, and the entire group is attached with The second carrier B2 of the second component A2 and the second upper cover B21 are the same Step or asynchronous transmission, a more efficient transmission plan, if the first component A1 is to be preferentially extracted, the entire set of components of the first carrier B1 and the first upper cover B11 of the first component A1 can be attached. Firstly, the first suction seat E21 and the third suction seat E41 will also perform the drawing operation in accordance with the conveying sequence; for the feeding step, please refer to Figures 1, 7, and 8, the first lowering arm E2 is below the first When the suction seat E21 is driven down and the entire group of components is placed and unloaded, the first group of adsorption elements E6 in the first suction cup E21 below the first pick-and-place arm E2 is closed to the negative pressure, and only the second group of adsorption elements E7 The first upper cover B11 is moved up, and the first carrier B1 carrying the first component A1 is separated from the first upper cover B11 to be indwelled; for example, a magnet is disposed between the first upper cover B11 and the first carrier B1. The magnetic member, when the first upper cover B11 is moved up, can perform a pair of first carrier B1 forced fixing operation to help it separate from the first upper cover B11; the third picking arm E4 is below the third suction seat E41 The first group of adsorption elements E6 in the third suction cup E41 below the third take-off arm E4 is driven to be moved down to place the entire set of components. The negative pressure is turned off, and the second upper cover B21 is adsorbed only by the second group of adsorption elements E7. Moving up, the second carrier B2 carrying the second component A2 is separated from the second upper cover B21 and placed; if a magnetic member such as a magnet is disposed between the second upper cover B21 and the second carrier B2, Similarly, when the second upper cover B21 is moved up, a forced fixing operation between the pair of second carriers B2 can be performed to assist in separation from the second upper cover B21.

Referring to FIG. 9, for the same reason, the first sliding seat E131 can be driven to slide on the beam rail E121, so that the second suction seat E31 below the second pick-and-place arm E3 is driven to move down to suck the whole set of components and then move up. At the same time, the second sliding seat E141 can also be driven to slide on the beam rail E121, so that the fourth suction seat E51 below the fourth pick-and-place arm E5 is driven to move downward to adsorb the whole group of components and then move up. The continuous take-up is completed; the rest of the operations are the same as the above-mentioned extraction steps and the loading steps, and will not be described again.

Referring to FIGS. 5, 7, and 9, in the electronic component carrier pick-and-place method of the embodiment of the present invention, the first suction cup E21 and the third suction seat E41 adsorb the first carrier B1 and the second carrier B2. The position of moving or lowering is placed at the first and second positions Y2 and Y3 of the Y-axis spacing Y1, and the first suction seat E21 and the third suction seat E41 are respectively adopted by the first sliding seat E131 and the second sliding seat. The E141 can be selectively displaced to the first and second positioning positions Y2 and Y3 for operation, and the second suction seat E31 and the fourth suction seat E51 are also displaced to the first and second positioning positions Y2 and Y3 for operation; The first suction seat E21 and the second suction seat E31 of the first sliding seat E131 are the same as the first positioning Y2 for picking and placing the first loading tray B1, and the third suction seat is also disposed on the second sliding seat E141. E41, the fourth suction seat E51 is the same as the second positioning Y3 for operating the second carrier B2; in addition, the Z-axis extraction point of the capturing step may be located above the Z-axis placement point of the loading step, Similarly, the first suction seat E21 and the second suction seat E31 disposed on the first sliding seat E131 perform the Z-axis drawing point of the first loading tray B1 and the Z-axis of the loading step. The position of the placement point is the same, and the third suction seat E41 and the fourth suction seat E51 disposed on the second sliding seat E141 perform the Z-axis drawing point of the operation step of the second carrier B2, and the placing step Z axial placement point is the same position; the Y axis is first, The second positioning Y2, Y3 or the Z-axis drawing point of the drawing step and the Z-axis positioning point of the feeding step may be one for the first carrier B1 or the second carrier B2 to be placed thereon The rail-mounted rail that is positioned or transported may also be a carrier on which the first carrier B1 or the second carrier B2 is positioned or transported.

In the electronic component carrier pick-and-place method of the embodiment of the present invention, when the carrier that has completed the work is retracted, the operation may be reversed. The operation of the first suction cup E21 is taken as an example, and the first arm can be taken under the arm E2. The first suction cup E21 is driven to move downward, and the first upper cover B11 under the first suction cup E21 is covered by the original second group of adsorption elements E7 to cover the first carrier B1, and the first group of adsorption is provided. The negative pressure of the component E6 adsorbs the first carrier B1 and the second group of adsorption elements E7 to the first upper cover B11, and delivers the entire assembly to the first suction seat E21; the second suction seat E31 and the third suction seat E41, The fourth suction seat E51 is the same, so I won't go into details.

The electronic component carrier pick-and-place method and mechanism of the embodiment of the present invention, because the first group of adsorption elements E6 and the second group of adsorption elements E7 can be selectively adsorbed, so that the operation of the carrier plate and the upper cover is more flexible and flexible. For the opening, closing and moving of the carrier and the upper cover, it can be carried out efficiently and efficiently.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

B1‧‧‧first carrier

B11‧‧‧ first cover

B2‧‧‧second carrier

B21‧‧‧Second cover

E21‧‧‧First suction seat

E31‧‧‧Second suction seat

E6‧‧‧First group of adsorption elements

E7‧‧‧Second group of adsorption elements

Claims (10)

An electronic component carrier pick-and-place method comprises: providing a carrier disk on which a component to be processed is arranged in a matrix, the carrier disk is covered with an upper cover; a first group of adsorption components is provided; and a second group of adsorption components is provided; The first set of adsorption elements adsorbs the carrier and the second set of adsorption elements adsorbs the cover. The electronic component carrier pick-and-place method according to claim 1, wherein the first group of adsorption elements and the second group of adsorption elements are each composed of a plurality of nozzles, and the two can be independently used for negative pressure activation. Closed manipulation. The method for picking and placing an electronic component carrier according to claim 1, wherein the first group of adsorption elements adsorbs a surface of a remaining surface of the carrier other than the cover of the upper cover to perform an adsorption carrier; the second group of adsorption elements The upper cover for absorbing the area of the carrier disk used for adsorption by the first group of adsorption elements. The electronic component carrier pick-and-place method of claim 1, wherein the first group of adsorption elements are in two rows, and the remaining areas on both sides of the first carrier other than the cover of the upper cover are arranged at intervals The disk is adsorbed by the surface of the disk, and the second group of adsorbing elements are arranged in three rows and arranged at a spacing and adsorbed only in a manner corresponding to the surface of the lid of the upper lid. An electronic component carrier pick-and-place mechanism comprising: means for performing the electronic component carrier pick-and-place method according to any one of claims 1 to 4. The electronic component carrier pick-and-place mechanism according to claim 5, wherein the first group of adsorption elements and the second group of adsorption elements are disposed on the same suction cup. The electronic component carrier pick-and-place mechanism according to claim 6, wherein the first group of adsorption elements are located on the outer circumference side and the suction port is lower, and the second group of adsorption elements are located inside the first group of adsorption elements and the suction port is higher. The electronic component carrier pick-and-place mechanism according to claim 6, wherein the method comprises: a gantry rail seat, the column is provided on both sides thereof, and the cross beam is arranged on the cross beam of the two side pillars; a sliding seat, The drive can be selectively displaced on the beam track; the suction seat is arranged on the slide seat, and the suction seat can be selectively displaced up and down. The electronic component carrier pick-and-place mechanism of claim 8, wherein the sliding seat is provided with a plurality of sliding seats, and the plurality of suction seats are disposed on the same sliding seat. The electronic component carrier pick-and-place mechanism of claim 8, wherein the suction seat is coupled with a pick-and-place arm driven by the driven member, and the pick-and-place arm can be displaced up and down on a slide rail. The suction seat is arranged below the pick and place arm.