TWI613865B - Electronic device - Google Patents
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- TWI613865B TWI613865B TW105115396A TW105115396A TWI613865B TW I613865 B TWI613865 B TW I613865B TW 105115396 A TW105115396 A TW 105115396A TW 105115396 A TW105115396 A TW 105115396A TW I613865 B TWI613865 B TW I613865B
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- 238000004891 communication Methods 0.000 claims abstract description 63
- 238000004146 energy storage Methods 0.000 claims description 19
- 239000003990 capacitor Substances 0.000 claims description 15
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 10
- 239000007769 metal material Substances 0.000 description 8
- 238000010295 mobile communication Methods 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000006698 induction Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- SNAAJJQQZSMGQD-UHFFFAOYSA-N aluminum magnesium Chemical compound [Mg].[Al] SNAAJJQQZSMGQD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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- Near-Field Transmission Systems (AREA)
Abstract
本案揭示一種電子裝置,包含近場通訊電路、包含金屬部的殼體及至少一個導電臂。金屬部與導電臂形成電流環路,以收發近場通訊電路輸出的近場通訊差動訊號組。金屬部包含至少一接地點,其位於電流環路的電位中心。The present invention discloses an electronic device including a near field communication circuit, a housing including a metal portion, and at least one conductive arm. The metal portion and the conductive arm form a current loop for transmitting and receiving the near field communication differential signal group output by the near field communication circuit. The metal portion includes at least one ground point located at the center of the potential of the current loop.
Description
本案是有關於一種電子裝置,特別是有關於一種具有近場通訊電路的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device having a near field communication circuit.
目前,愈來愈多行動通訊裝置的外殼採用金屬材質,然而為了使行動通訊裝置內部的無線通訊訊號不被金屬遮蔽,往往會在外殼對應天線的部份開設孔洞或縫隙,讓天線訊號得以通過孔洞或縫隙,但此舉不免影響外觀美感。At present, more and more mobile communication devices are made of metal. However, in order to prevent wireless communication signals inside the mobile communication device from being obscured by metal, holes or gaps are formed in the corresponding antenna portion of the housing to allow the antenna signals to pass. Holes or gaps, but this will inevitably affect the aesthetic appearance.
本案提供一種電子裝置。此電子裝置包含:一近場通訊電路,傳送包含一第一差動訊號及一第二差動訊號的一近場通訊差動訊號組;一殼體,包含一導通部,該導通部具有相對的一第一側邊及一第二側邊;二導電臂,該二導電臂中的其中之一第一導電臂之一端耦接至導通部的第一側邊,另一端耦接近場通訊電路以收發第一差動訊號,該二導電臂中的另一第二導電臂之一端耦接至導通部的第二側邊,另一端耦接近場通訊電路以收發第二差動訊號;其中第一導電臂、導通部與第二導電臂形成一電流環路,且導通部包含至少一接地點,該接地點位於電流環路的電位中心。The present invention provides an electronic device. The electronic device includes: a near field communication circuit that transmits a near field communication differential signal group including a first differential signal and a second differential signal; and a housing including a conductive portion, the conductive portion has a relative a first side and a second side; two conductive arms, one of the first conductive arms of one of the two conductive arms is coupled to the first side of the conductive portion, and the other end is coupled to the field communication circuit Transceiving the first differential signal, one end of the other of the two conductive arms is coupled to the second side of the conductive portion, and the other end is coupled to the field communication circuit for transmitting and receiving the second differential signal; A conductive arm, the conductive portion and the second conductive arm form a current loop, and the conductive portion includes at least one ground point located at a potential center of the current loop.
本案另提供一種電子裝置。此電子裝置包含:一近場通訊電路,傳送包含一第一差動訊號及一第二差動訊號的一近場通訊差動訊號組;一殼體,包含一導通部,該導通部具有相對的一第一側邊及一第二側邊,該第一側邊耦接近場通訊電路,以收發第一差動訊號;及一導電臂,其一端耦接至導通部的第二側邊,另一端耦接近場通訊電路,以收發第二差動訊號;其中導電臂與導通部形成一電流環路,且導通部包含至少一接地點,該接地點位於該電流環路的電位中心。The present invention further provides an electronic device. The electronic device includes: a near field communication circuit that transmits a near field communication differential signal group including a first differential signal and a second differential signal; and a housing including a conductive portion, the conductive portion has a relative a first side and a second side, the first side being coupled to the field communication circuit for transmitting and receiving the first differential signal; and a conductive arm having one end coupled to the second side of the conductive portion The other end is coupled to the field communication circuit for transmitting and receiving the second differential signal; wherein the conductive arm forms a current loop with the conductive portion, and the conductive portion includes at least one ground point located at a potential center of the current loop.
綜上所述,藉由應用本案之實施例,電子裝置可可使用金屬材質的殼體,並可將殼體之導通部作為電流環路的一部分,使得導通部無須開設縫隙或孔洞,使得電子裝置的外觀可更加美觀。同時,也無須設置線圈,可節省成本與體積。並且由於在電流環路的電位中心設置了接地點,使得電子裝置無須增加平衡不平衡轉換器,而可節省成本與體積。In summary, by applying the embodiment of the present invention, the electronic device can use a metal material casing, and the conduction portion of the casing can be used as a part of the current loop, so that the conduction portion does not need to open a gap or a hole, so that the electronic device The appearance can be more beautiful. At the same time, there is no need to set the coil, which saves cost and volume. And since the grounding point is set at the center of the potential of the current loop, the electronic device does not need to increase the balun, which saves cost and volume.
以下將以圖式揭露本案的複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本案。也就是說,在本案部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之。In the following, a plurality of embodiments of the present invention will be disclosed in the drawings. For the sake of clarity, a number of practical details will be described in the following description. However, it should be understood that these practical details are not applied to limit the case. That is to say, in some implementations of this case, these practical details are not necessary. In addition, some of the conventional structures and elements are shown in the drawings in a simplified schematic manner in order to simplify the drawings.
圖1是依據本案之一實施例繪示的電子裝置的立體示意圖。電子裝置包含殼體100及二導電臂200(分別稱為第一導電臂200a及第二導電臂200b)。殼體100包含導通部121,此導通部121可為金屬材質或其他導電材質。第一導電臂200a、導通部121與第二導電臂200b依序耦接而形成電流環路400(如圖2所示)。殼體100包含前殼110及相對的後殼120,後殼120包含前述導通部121。於一些實施例中,配合殼體100的外型,二導電臂200可大致(即大部分或主要部分)設置於前殼110。其可位於前殼110的外表面上或內表面上、或可嵌設於前殼110,或可設置在殼體100的內部空間而鄰近於前殼110,只要導電臂200的主要部分與導通部121保持相當距離,使得電流環路400包圍有相當面積來轉變出輻射場即可。對於一些實施例之殼體100,前殼110與後殼120之間的間距可能大於導電臂200的主要部分與導通部121之間的間距甚多,二導電臂200可大致設置於前殼110,但不限於此。1 is a perspective view of an electronic device according to an embodiment of the present disclosure. The electronic device includes a housing 100 and two conductive arms 200 (referred to as a first conductive arm 200a and a second conductive arm 200b, respectively). The housing 100 includes a conductive portion 121. The conductive portion 121 can be made of a metal material or other conductive material. The first conductive arm 200a, the conductive portion 121 and the second conductive arm 200b are sequentially coupled to form a current loop 400 (as shown in FIG. 2). The housing 100 includes a front housing 110 and an opposite rear housing 120. The rear housing 120 includes the aforementioned conductive portion 121. In some embodiments, in conjunction with the outer shape of the housing 100, the two conductive arms 200 can be disposed substantially (ie, mostly or predominantly) in the front housing 110. It may be located on the inner surface or the inner surface of the front case 110, or may be embedded in the front case 110, or may be disposed in the inner space of the case 100 adjacent to the front case 110 as long as the main part of the conductive arm 200 is electrically connected The portion 121 maintains a substantial distance such that the current loop 400 encloses a substantial area to transform the radiation field. For the housing 100 of some embodiments, the spacing between the front housing 110 and the rear housing 120 may be greater than the spacing between the main portion of the conductive arm 200 and the conductive portion 121. The two conductive arms 200 may be disposed substantially at the front housing 110. , but not limited to this.
電子裝置可以是手機、平板電腦、筆記型電腦、遙控器等支援近場通訊技術之電子裝置,於此以手機為例。一般而言,若電子裝置具有螢幕190,則具有螢幕190之一面為前殼110。若電子裝置為筆記型電腦(未繪示),則筆記型電腦掀翻開來具有螢幕之一面為前殼110,螢幕背後的之背蓋則為前述之後殼120。若電子裝置不具有螢幕,則以通常操作之面為前殼110,與通常操作之面相對之面為後殼120,例如:遙控器具有按鍵之一面為前殼110,背離按鍵之置放面為後殼120。The electronic device may be an electronic device supporting a near field communication technology such as a mobile phone, a tablet computer, a notebook computer, a remote controller, etc., taking a mobile phone as an example. In general, if the electronic device has a screen 190, one of the screens 190 has a front case 110. If the electronic device is a notebook computer (not shown), the notebook computer is flipped open to have a front cover 110 on one side of the screen, and the back cover 120 on the back cover of the screen. If the electronic device does not have a screen, the normal operation surface is the front case 110, and the surface opposite to the normal operation surface is the rear case 120. For example, the remote control has one side of the button as the front case 110, and the face away from the button is placed. It is the rear case 120.
導電臂200的材質可為金屬(如銅、鋁、鋁合金、鋁鎂合金等)、氧化銦錫(ITO)、氧化鎵銦錫(gallium-indium-tin oxide,GITO)、氧化鋅銦錫(zinc-indium-tin oxide,ZITO)、氧化錫掺氟(fluorine-doped tin oxide,FTO)、氧化鋅、氧化鋁鋅(AZO(Al:ZnO))或氧化銦鋅(IZO)等導電材質。本案之實施例並未限制導電臂200的形狀,導電臂200可為專司電流環路400而設置的結構,或另有其他功能的結構(如其他通訊電路之天線、印刷電路板(PCB)、軟性電路板(FPC)、屏蔽外殼、框架、觸控螢幕的導電走線等)的全部或一部分。The material of the conductive arm 200 can be metal (such as copper, aluminum, aluminum alloy, aluminum-magnesium alloy, etc.), indium tin oxide (ITO), gallium-indium-tin oxide (GITO), zinc indium tin oxide ( Zinc-indium-tin oxide (ZITO), conductive powder such as fluorine-doped tin oxide (FTO), zinc oxide, aluminum zinc oxide (AZO (Al: ZnO)) or indium zinc oxide (IZO). The embodiment of the present invention does not limit the shape of the conductive arm 200. The conductive arm 200 may be a structure provided for the current loop 400, or a structure having other functions (such as an antenna of another communication circuit, a printed circuit board (PCB)). All or part of a flexible circuit board (FPC), a shielded case, a frame, a conductive trace of a touch screen, and the like.
於一些實施例中,電流環路400可設置於鄰近殼體100的一上側面130。在其他實施例中亦可以是鄰近其他側面(如下側面),但本案的實施例不以此為限,若輻射場的強度足夠(或殼體100的體積較小),電流環路400也可以位於殼體100中間部位。In some embodiments, the current loop 400 can be disposed adjacent an upper side 130 of the housing 100. In other embodiments, it may be adjacent to other sides (such as the side), but the embodiment of the present invention is not limited thereto. If the intensity of the radiation field is sufficient (or the volume of the housing 100 is small), the current loop 400 may also be Located at the middle of the housing 100.
圖2是依據本案之第一實施例繪示的電子裝置之電流環路400之俯視示意圖。合併參照圖1與圖2,導通部121具有相對的第一側邊122及第二側邊123。第一導電臂200a之一端耦接至導通部121的第一側邊122;第二導電臂200b之一端耦接至導通部121的第二側邊123,使得第一導電臂200a、導通部121及第二導電臂200b依序耦接而形成電流環路400。電流環路400為接近封閉但仍為開放的環路,電流環路400的二端分別設有饋入點210a、210b,饋入點210a、210b沒有直接電性接觸。亦即,第一導電臂200a相對於耦接於導通部121的一端設有饋入點210a;第二導電臂200b相對於耦接於導通部121的一端設有饋入點210b。並且,第一導電臂200a與第二導電臂200b是從設有饋入點210a、210b之一端各自朝遠離彼此的方向延伸後,再彎折耦接於導通部121。導通部121與第一導電臂200a和第二導電臂200b之間的耦接為電性連接,在此可以是直接接觸連接。然而,在一些實施例中,導通部121與第一導電臂200a和第二導電臂200b之間可透過電容器C或電感器L來耦接(如圖3所示)。第一導電臂200a和第二導電臂200b可為對稱的相同結構,但本案實施例不限於此,第一導電臂200a和第二導電臂200b亦可為不同長度或形狀。2 is a top plan view of a current loop 400 of an electronic device according to a first embodiment of the present disclosure. Referring to FIG. 1 and FIG. 2 together, the conductive portion 121 has opposite first side edges 122 and second side edges 123. One end of the first conductive arm 200a is coupled to the first side 122 of the conductive portion 121; one end of the second conductive arm 200b is coupled to the second side 123 of the conductive portion 121 such that the first conductive arm 200a and the conductive portion 121 The second conductive arm 200b is coupled in sequence to form a current loop 400. The current loop 400 is a closed loop that is still open. The two ends of the current loop 400 are respectively provided with feed points 210a, 210b, and the feed points 210a, 210b are not in direct electrical contact. That is, the first conductive arm 200a is provided with a feeding point 210a with respect to one end coupled to the conducting portion 121; the second conductive arm 200b is provided with a feeding point 210b with respect to an end coupled to the conducting portion 121. Further, the first conductive arm 200a and the second conductive arm 200b are extended from the one end of the feeding points 210a and 210b, and are then bent and coupled to the conductive portion 121. The coupling between the conductive portion 121 and the first conductive arm 200a and the second conductive arm 200b is electrically connected, and may be a direct contact connection. However, in some embodiments, the conductive portion 121 is coupled to the first conductive arm 200a and the second conductive arm 200b via a capacitor C or an inductor L (as shown in FIG. 3). The first conductive arm 200a and the second conductive arm 200b may be the same structure, but the embodiment is not limited thereto, and the first conductive arm 200a and the second conductive arm 200b may be different lengths or shapes.
於一實施例中,近場通訊電路300可整合在一積體電路(IC)中,而可傳送包含一第一差動訊號S1及一第二差動訊號S2的一近場通訊差動訊號組(為了確定接地準位,近場通訊電路300也具有一接地端來連接接地,於此未特別繪示)。在本實施例中,第一差動訊號S1為正訊號;第二差動訊號S2為負訊號。在一實施例中,第一差動訊號S1可為負訊號;第二差動訊號S2則對應為正訊號。第一導電臂200a的饋入點210a耦接於近場通訊電路300以接收第一差動訊號S1;第二導電臂200b的饋入點210b耦接於近場通訊電路300以接收第二差動訊號S2。導通部121包含接地點124,接地點124位於電流環路400的電位中心,使得第一差動訊號S1與第二差動訊號S2由近場通訊電路300輸出能流經電流環路400(或自電流環路400感應而輸入近場通訊電路300),而無須增加線圈作為天線,可減少成本與體積。同時,也因為透過殼體100作為電流環路400的一部分,使得即便殼體100以金屬材質製成,也不影響近場通訊。因此,本案實施例之殼體100的導通部121可無須開設縫隙或孔洞。In an embodiment, the near field communication circuit 300 can be integrated into an integrated circuit (IC), and can transmit a near field communication differential signal including a first differential signal S1 and a second differential signal S2. Group (In order to determine the grounding level, the near field communication circuit 300 also has a grounding terminal to connect to the ground, which is not specifically shown here). In this embodiment, the first differential signal S1 is a positive signal; the second differential signal S2 is a negative signal. In an embodiment, the first differential signal S1 may be a negative signal; and the second differential signal S2 may be a positive signal. The feed point 210a of the first conductive arm 200a is coupled to the near field communication circuit 300 to receive the first differential signal S1; the feed point 210b of the second conductive arm 200b is coupled to the near field communication circuit 300 to receive the second difference. Signal S2. The conducting portion 121 includes a grounding point 124, and the grounding point 124 is located at the potential center of the current loop 400, so that the first differential signal S1 and the second differential signal S2 are output by the near field communication circuit 300 through the current loop 400 (or Induction from the current loop 400 inputs the near field communication circuit 300) without the need to add a coil as an antenna, which reduces cost and size. At the same time, because the housing 100 is used as a part of the current loop 400, even if the housing 100 is made of a metal material, the near field communication is not affected. Therefore, the conductive portion 121 of the housing 100 of the embodiment of the present invention does not need to have a slit or a hole.
所述電位中心可透過量測來選定,其選定的條件是,饋入點210a至所選定的接地點124之間的電位差與此接地點124至饋入點210b之間的電位差為相等。在一些實施例中,亦可以選定二個以上等電位的接地點。透過在導通部121選定接地點124,可使得近場通訊電路300與電流環路400之間不需外加平衡不平衡轉換器(Balun),而可減少成本與體積。並且,對稱的近場通訊差動訊號組可減少雜訊的干擾。The potential center is selected by measurement, and the selected condition is that the potential difference between the feed point 210a to the selected ground point 124 and the potential difference between the ground point 124 and the feed point 210b are equal. In some embodiments, more than two equipotential grounding points may also be selected. By selecting the grounding point 124 at the conducting portion 121, it is possible to eliminate the need for an external balun between the near field communication circuit 300 and the current loop 400, thereby reducing cost and volume. Moreover, the symmetric near-field communication differential signal group can reduce the interference of noise.
在本實施例中,導通部121為金屬材質且分布於整個後殼120,亦即為金屬背蓋。導通部121的整體可由單一金屬材質製成。或者,導通部121的多個部位可分別以不同金屬材質製成。金屬材質可例如為銅、鋁、鋁合金、鋁鎂合金等。然而,一些實施例中,導通部121也可以僅佔據於後殼120的一部分,例如可為金屬飾條;後殼120的其他部分則由非金屬材質構成,例如:塑膠(如聚碳酸酯)、矽膠、木、竹等材質。In this embodiment, the conductive portion 121 is made of a metal material and distributed over the entire rear case 120, that is, a metal back cover. The entirety of the conductive portion 121 may be made of a single metal material. Alternatively, the plurality of portions of the conductive portion 121 may be made of different metal materials. The metal material may be, for example, copper, aluminum, aluminum alloy, aluminum-magnesium alloy or the like. However, in some embodiments, the conductive portion 121 may also occupy only a portion of the rear case 120, for example, may be a metal strip; other portions of the rear case 120 may be made of a non-metal material, such as plastic (such as polycarbonate). , silicone, wood, bamboo and other materials.
圖3是依據本案之第二實施例繪示的電子裝置之電流環路400之俯視示意圖。相較於圖2之實施例,其差異在於,第一導電臂200a透過電容器C連接至導通部121;第二導電臂200b透過電感器L連接至導通部121。透過設置電容器C與電感器L可調整電流環路400與近場電流環路400間的阻抗匹配。在一些實施例中,第一導電臂200a亦可透過電感器L連接至導通部121,第二導電臂200b亦可透過電容器C連接至導通部121。換言之,第一導電臂200a可透過電容器C或電感器L連接至導通部121,第二導電臂200b可透過電容器C或電感器L連接至導通部121。3 is a top plan view of a current loop 400 of an electronic device according to a second embodiment of the present invention. Compared with the embodiment of FIG. 2, the difference is that the first conductive arm 200a is connected to the conductive portion 121 through the capacitor C; the second conductive arm 200b is connected to the conductive portion 121 through the inductor L. Impedance matching between current loop 400 and near field current loop 400 can be adjusted by providing capacitor C and inductor L. In some embodiments, the first conductive arm 200a can also be connected to the conductive portion 121 through the inductor L, and the second conductive arm 200b can also be connected to the conductive portion 121 through the capacitor C. In other words, the first conductive arm 200a can be connected to the conductive portion 121 through the capacitor C or the inductor L, and the second conductive arm 200b can be connected to the conductive portion 121 through the capacitor C or the inductor L.
圖4是依據本案之第三實施例繪示的電子裝置之電流環路400之俯視示意圖。相較於如圖3之實施例,電子裝置更可包含非近場通訊電路。在此,非近場通訊電路以無線保真(Wi-Fi)電路610與行動通訊電路620為例。無線保真電路610經由第一儲能元件510耦接其中一導電臂200(即第一導電臂200a);行動通訊電路620經由另一第一儲能元件510耦接另一導電臂200(即第二導電臂200b)。近場通訊電路300則經由第二儲能元件520分別耦接第一導電臂200a與第二導電臂200b。於此,第一儲能元件510可為電容器,第二儲能元件520則對應為電感器。由於電容器可導引高頻訊號,電感器可導引低頻訊號,只要近場通訊電路400與非近場通訊電路使用的工作頻帶不同,便可共用同一導電臂200來無線通訊。無線保真電路610連接至第一導電臂200a的接點位置可視所需的電流路徑長度(與其工作頻率相關)來調整;行動通訊電路620連接至第二導電臂200b的接點位置亦可視所需的電流路徑長度(與其工作頻率相關)來調整。4 is a top plan view of a current loop 400 of an electronic device according to a third embodiment of the present invention. Compared to the embodiment of FIG. 3, the electronic device may further comprise a non-near field communication circuit. Here, the non-near-field communication circuit is exemplified by a wireless fidelity (Wi-Fi) circuit 610 and a mobile communication circuit 620. The wireless fidelity circuit 610 is coupled to one of the conductive arms 200 (ie, the first conductive arm 200a) via the first energy storage component 510; the mobile communication circuit 620 is coupled to the other conductive arm 200 via the other first energy storage component 510 (ie, Second conductive arm 200b). The near field communication circuit 300 is coupled to the first conductive arm 200a and the second conductive arm 200b via the second energy storage component 520, respectively. Here, the first energy storage component 510 can be a capacitor, and the second energy storage component 520 corresponds to an inductor. Since the capacitor can guide the high frequency signal, the inductor can guide the low frequency signal. As long as the near field communication circuit 400 and the non-near field communication circuit use different operating bands, the same conductive arm 200 can be shared for wireless communication. The position of the contact of the wireless fidelity circuit 610 connected to the first conductive arm 200a can be adjusted according to the required current path length (related to its operating frequency); the contact position of the mobile communication circuit 620 connected to the second conductive arm 200b can also be seen. The required current path length (related to its operating frequency) is adjusted.
圖5是依據本案之第四實施例繪示的電子裝置之電流環路400之俯視示意圖。圖2、圖3及圖4所示之近場通訊電路300雖在導電臂200與導通部121所包圍的空間之外,然而其僅是為了清楚呈現圖式,並非限制其空間關係。如圖5所示,實際上近場通訊電路300是設置在殼體100之內,亦即導電臂200與導通部121所包圍的空間之內。圖5所示之實施例,相較於前述實施例之差異在於,電子裝置更可包含鐵氧體磁片(Ferrite sheet)700,係設置在近場通訊電路300(及非近場通訊電路(如無線保真電路610及行動通訊電路620))與導電臂200之間,及其與導通部121之間,以減少在導電臂200與導通部121上產生渦電流。FIG. 5 is a top plan view of a current loop 400 of an electronic device according to a fourth embodiment of the present invention. The near field communication circuit 300 shown in FIG. 2, FIG. 3, and FIG. 4 is outside the space surrounded by the conductive arm 200 and the conductive portion 121. However, it is only for the sake of clarity, and the spatial relationship is not limited. As shown in FIG. 5, the near field communication circuit 300 is actually disposed within the housing 100, that is, within the space surrounded by the conductive arm 200 and the conductive portion 121. The embodiment shown in FIG. 5 differs from the previous embodiment in that the electronic device further includes a ferrite sheet 700 disposed in the near field communication circuit 300 (and a non-near field communication circuit ( For example, between the wireless fidelity circuit 610 and the mobile communication circuit 620) and the conductive arm 200, and between the conductive portion 121, the eddy current is generated on the conductive arm 200 and the conductive portion 121.
圖6是依據本案之一實施例繪示的電子裝置之電路方塊示意圖。如圖6所示,電子裝置除了包含阻抗匹配電路810之外,還可包含訊號放大電路820。訊號放大電路820耦接於近場通訊電路300與電流環路400之間,於此是位於近場通訊電路300與阻抗批配電路810之間。訊號放大電路820可放大近場通訊電路300輸出的近場通訊差動訊號組,以提升經由電流環路400轉換的輻射場的強度,以增加感應距離。FIG. 6 is a circuit block diagram of an electronic device according to an embodiment of the present disclosure. As shown in FIG. 6, the electronic device may include a signal amplifying circuit 820 in addition to the impedance matching circuit 810. The signal amplifying circuit 820 is coupled between the near field communication circuit 300 and the current loop 400, and is located between the near field communication circuit 300 and the impedance batch circuit 810. The signal amplifying circuit 820 can amplify the near field communication differential signal group outputted by the near field communication circuit 300 to increase the intensity of the radiation field converted via the current loop 400 to increase the sensing distance.
圖7是依據本案之第五實施例繪示的電子裝置之電流環路400之俯視示意圖。如圖7所示,相較於前述實施例,其差異在於本實施例僅有單一導電臂200c(即僅有前述的第二導電臂200b而不具有前述之第一導電臂200a)。導電臂200c的一端耦接於導通部121的第二側邊123,另一端具有饋入點210b來耦接於近場通訊電路300,以傳送第二差動訊號S2。如同前述,導通部121與導電臂200c之間的耦接為電性連接,在此可以是直接接觸連接。然而,在一些實施例中,導通部121與導電臂200c之間可透過電容器C來耦接(如圖8所示)或可透過電感器來耦接。近場通訊電路300還耦接導通部121的第一側邊122,以傳送第一差動訊號S1。藉此,導電臂200c與導通部121同樣可形成電流環路400,並且導通部121同樣具有接地點124,其位於電流環路400的電位中心。在此,由於少了一導電臂200c,使得接地點124的位置與圖2之實施例不同,係較靠近第二側邊123。FIG. 7 is a top plan view of a current loop 400 of an electronic device according to a fifth embodiment of the present invention. As shown in FIG. 7, the difference is that the present embodiment has only a single conductive arm 200c (i.e., only the aforementioned second conductive arm 200b without the aforementioned first conductive arm 200a). One end of the conductive arm 200c is coupled to the second side 123 of the conductive portion 121, and the other end has a feeding point 210b coupled to the near field communication circuit 300 to transmit the second differential signal S2. As described above, the coupling between the conductive portion 121 and the conductive arm 200c is electrically connected, and may be a direct contact connection. However, in some embodiments, the conductive portion 121 and the conductive arm 200c may be coupled via a capacitor C (as shown in FIG. 8) or may be coupled through an inductor. The near field communication circuit 300 is also coupled to the first side 122 of the conductive portion 121 to transmit the first differential signal S1. Thereby, the conductive arm 200c can form the current loop 400 as well as the conductive portion 121, and the conductive portion 121 also has a grounding point 124 which is located at the center of the potential of the current loop 400. Here, since the conductive arm 200c is missing, the position of the grounding point 124 is different from that of the embodiment of FIG. 2, and is closer to the second side 123.
圖8是依據本案之第六實施例繪示的電子裝置之電流環路400之俯視示意圖。電子裝置同樣可包含非近場通訊電路。於此,舉例非近場通訊電路為觸碰控制電路630,係為觸控螢幕的觸控模組的控制電路。觸碰控制電路630經由第一儲能元件510耦接導電臂200c。近場通訊電路300則分別經由第二儲能元件520耦接導電臂200c與導通部121。在此,第一儲能元件510為電感器,第二儲能元件520則對應為電容器。導電臂200c實質可為觸控螢幕的觸控電極走線。FIG. 8 is a top plan view of a current loop 400 of an electronic device according to a sixth embodiment of the present invention. The electronic device can also include non-near-field communication circuitry. For example, the non-near-field communication circuit is a touch control circuit 630, which is a control circuit of the touch module of the touch screen. The touch control circuit 630 is coupled to the conductive arm 200c via the first energy storage element 510. The near field communication circuit 300 is coupled to the conductive arm 200c and the conductive portion 121 via the second energy storage component 520, respectively. Here, the first energy storage element 510 is an inductor, and the second energy storage element 520 is corresponding to a capacitor. The conductive arm 200c can be substantially the touch electrode trace of the touch screen.
綜上所述,藉由應用本案之一實施例,可使用金屬材質的殼體100,並可將殼體100之導通部121作為電流環路400的一部分,使得導通部無須開設縫隙或孔洞,使得電子裝置的外觀可更加美觀。同時,也無須設置線圈,可節省成本與體積。並且由於在電流環路400的電位中心設置了接地點124,使得電子裝置無須增加平衡不平衡轉換器,而可節省成本與體積。此外,由於電流環路400鄰近於殼體的側面,可讓使用者在使用近場通訊功能時,可更加直覺的將殼體的側面置放在感測區域。另一方面,輻射場也因電流環路400鄰近於殼體100的側面,而可經過殼體100的前側與後側,讓使用者使用的感應成功率較傳統的電子裝置更高。不像傳統的近場通訊模組設置在裝置背面,因而僅能以裝置背面感測,且由於使用者不確定近場通訊模組設置於裝置背面的實際位置,容易造成感應失敗。此外,電流環路400還可與其他電路共用,無須 另外設置導電臂200。In summary, by applying an embodiment of the present invention, the metal case 100 can be used, and the conductive portion 121 of the case 100 can be used as a part of the current loop 400, so that the conductive portion does not need to open a gap or a hole. The appearance of the electronic device can be made more beautiful. At the same time, there is no need to set the coil, which saves cost and volume. And since the grounding point 124 is disposed at the center of the potential of the current loop 400, the electronic device does not need to increase the balun, which saves cost and volume. In addition, since the current loop 400 is adjacent to the side of the housing, the user can more intuitively place the side of the housing in the sensing area when using the near field communication function. On the other hand, the radiation field is also adjacent to the side of the housing 100, and can pass through the front and rear sides of the housing 100, allowing the user to use a higher induction success rate than conventional electronic devices. Unlike the conventional near field communication module, which is disposed on the back of the device, it can only be sensed on the back of the device, and since the user is not sure of the actual position of the near field communication module disposed on the back of the device, the induction failure is likely to occur. In addition, the current loop 400 can also be shared with other circuits without the need to additionally provide the conductive arm 200.
雖然本案已以實施方式揭露如上,然其並非用以限定本案,任何熟習此技藝者,在不脫離本案之精神和範圍內,當可作各種之更動與潤飾,因此本案之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present case. Anyone skilled in the art can make various changes and refinements without departing from the spirit and scope of the case. Therefore, the scope of protection of this case is considered. The scope defined in the patent application is subject to change.
100:殼體 110:前殼 120:後殼 121:導通部 122:第一側邊 123:第二側邊 124:接地點 130:上側面 190:螢幕 200、200c:導電臂 200a:第一導電臂 200b:第二導電臂 210a、210b:饋入點 300:近場通訊電路 400:電流環路 510:第一儲能元件 520:第二儲能元件 610:無線保真電路 620: 行動通訊電路 630:觸碰控制電路 700:鐵氧體磁片 810:阻抗匹配電路 820:訊號放大電路 S1:第一差動訊號 S2:第二差動訊號 C:電容器 L:電感器100: housing 110: front case 120: rear case 121: conduction portion 122: first side 123: second side 124: ground point 130: upper side 190: screen 200, 200c: conductive arm 200a: first conductive Arm 200b: second conductive arm 210a, 210b: feed point 300: near field communication circuit 400: current loop 510: first energy storage element 520: second energy storage element 610: wireless fidelity circuit 620: mobile communication circuit 630: touch control circuit 700: ferrite magnetic sheet 810: impedance matching circuit 820: signal amplifying circuit S1: first differential signal S2: second differential signal C: capacitor L: inductor
[圖1]是依據本案之一實施例繪示的電子裝置的立體示意圖。 [圖2]是依據本案之第一實施例繪示的電子裝置之電流環路之俯視示意圖。 [圖3]是依據本案之第二實施例繪示的電子裝置之電流環路之俯視示意圖。 [圖4]是依據本案之第三實施例繪示的電子裝置之電流環路之俯視示意圖。 [圖5]是依據本案之第四實施例繪示的電子裝置之電流環路之俯視示意圖。 [圖6]是依據本案之一實施例繪示的電子裝置之電路方塊示意圖。 [圖7]是依據本案之第五實施例繪示的電子裝置之電流環路之俯視示意圖。 [圖8]是依據本案之第六實施例繪示的電子裝置之電流環路之俯視示意圖。FIG. 1 is a schematic perspective view of an electronic device according to an embodiment of the present disclosure. 2 is a top plan view of a current loop of an electronic device according to a first embodiment of the present invention. FIG. 3 is a schematic top view of a current loop of an electronic device according to a second embodiment of the present invention. 4 is a top plan view of a current loop of an electronic device according to a third embodiment of the present invention. FIG. 5 is a schematic top view of a current loop of an electronic device according to a fourth embodiment of the present invention. FIG. 6 is a circuit block diagram of an electronic device according to an embodiment of the present disclosure. FIG. 7 is a schematic top plan view of a current loop of an electronic device according to a fifth embodiment of the present invention. FIG. 8 is a schematic top plan view of a current loop of an electronic device according to a sixth embodiment of the present invention.
100:殼體 110:前殼 120:後殼 121:金屬部 123:第二側邊 130:上側面 190:螢幕 200:導電臂 200a:第一導電臂 200b:第二導電臂100: housing 110: front case 120: rear case 121: metal portion 123: second side 130: upper side 190: screen 200: conductive arm 200a: first conductive arm 200b: second conductive arm
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| Publication number | Publication date |
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| TW201742311A (en) | 2017-12-01 |
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