TWI611179B - Appearance inspection apparatus - Google Patents

Abstract

An appearance detecting device is adapted to detect a front view detecting surface of at least one wafer and at least one side surface adjacent to the front facing detecting surface. The wafer is disposed on a film having expandability. The appearance detecting device includes at least one mirror, a photographing unit, and a computer unit. The mirror corresponds to at least one side of the wafer. The photographing unit is configured to directly capture an image of the front side of the wafer and simultaneously indirectly photograph the side image via the mirror. The computer unit is coupled to the photographing unit and analyzes the front view detecting surface and the at least one side image of the wafer taken by the photographing unit to obtain an appearance detection result of the wafer.

Description

Appearance detecting device

The present invention relates to a detecting device, and more particularly to an appearance detecting device.

In the existing wafer-related process, after the wafer is diced and a plurality of wafers are formed, it is usually necessary to perform an appearance inspection on the wafer to confirm the goodness. Generally, the wafer formed after cutting needs to be taken and removed first, that is, the wafer is first removed from the film, then moved to the carrier, and then the image is imaged by the photographic device. And based on it to determine whether there is a defect.

However, the process of picking up and dropping the wafer often causes an increase in the processing time, and the risk of wafer damage is also increased during the pick-and-place process by the pick-and-place device (such as a robot arm). Furthermore, the photographic apparatus is generally only capable of detecting the wafer in a plan view or a viewing angle, which is incapable of being accurately detected for the side of the diced wafer which is limited by the load-bearing structure. Based on the above, the prior art cannot effectively improve the process efficiency.

The present invention provides an appearance detecting device which can effectively improve the detection range and detection efficiency of a wafer.

The appearance detecting device of the present invention is adapted to detect a front view detecting surface of at least one wafer and at least one side surface adjacent to the front view detecting surface. The at least one wafer is disposed on the film, and the film has expandability. The appearance detecting device includes at least one mirror, a photographing unit, and a computer unit. A mirror corresponds to a side of the at least one wafer. The photographing unit is configured to directly capture an image of the front view detecting surface of the at least one wafer, and simultaneously indirectly capture an image of at least one side of the wafer via the at least one mirror. The computer unit is coupled to the photographing unit and analyzes the front view detecting surface and the at least one side image of the at least one wafer captured by the photographing unit to obtain an appearance detection result of the at least one wafer.

In an embodiment of the invention, the at least one mirror includes a pair of mirrors, and the mirrors respectively correspond to opposite sides of the at least one wafer, so that the photographing unit photographs the photo via the pair of mirrors An image of at least one side of the wafer.

In an embodiment of the invention, the at least one mirror comprises a plurality of mirrors surrounding the at least one wafer and respectively corresponding to a plurality of sides of the wafer, so that the photographing unit photographs the sides of the wafer via the mirrors. Image.

In an embodiment of the invention, the mirror is formed at an angle of between 30 and 60 degrees from the front side of the wafer.

In an embodiment of the invention, the support unit further includes a support film capable of supporting the at least one wafer via the support film.

In an embodiment of the invention, the mirror and the support plane of the support unit form an angle of 30 to 60 degrees.

In an embodiment of the invention, the supporting unit can push and expand the film to increase the space of the at least one wafer pushed and another wafer adjacent thereto, and the at least one mirror can be moved in. The space corresponds to at least one side of the at least one wafer.

In an embodiment of the invention, the number of the at least one wafer comprises a plurality of wafers divided into a plurality of batches, the same batch of wafers are arranged along an axis, and the at least one mirror corresponds to a plurality of sides of the wafers. The photographing unit directly captures an image of the front view detecting surface of the wafers, and simultaneously indirectly photographs the side surfaces of the wafers via the at least one mirror.

In an embodiment of the invention, the support unit further includes a support film capable of supporting the at least one wafer via the support film. The length of the support unit along the axis is equal to the length of the area of the wafers belonging to the same batch on the film along the axis.

In an embodiment of the invention, the support unit can push and expand the film to increase the space between the wafer being pushed and the other batch of wafers adjacent thereto, and at least one reflection The mirror can be moved into space to correspond to the side of the wafer being pushed up.

In an embodiment of the invention, the at least one mirror comprises a pair of mirrors, and the mirrors are respectively located on opposite sides of the same batch of wafers, so that the photographing unit indirectly photographs the opposite two wafers of the same batch via the mirror. The image on the side.

In an embodiment of the invention, the batch is arranged in an array, and the image detecting device further comprises a moving unit for driving the film so that the wafer on the film moves relative to the photographic unit to make the photographic unit and the at least one reflection The mirror captures an image of the batch of wafers along a path of a shape or a spiral path.

Based on the above, by moving the wafer and the film after cutting directly to the appearance detecting device, the photographing unit is corresponding to the front detecting surface of the wafer to be tested, and the mirror corresponds to the side of the wafer to be tested, and thus the photographing unit is removed. The image of the side surface of the wafer can be directly captured by the mirror in addition to the appearance image of the detection surface of the wafer, so that the wafer after the cutting can be directly subjected to the appearance inspection without being removed from the film. Process, so it can effectively verify the process and improve process efficiency.

The above described features and advantages of the invention will be apparent from the following description.

1 is a side view of an appearance detecting apparatus for describing a state in which the appearance detecting apparatus 100 performs appearance inspection on a wafer 200, in accordance with an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the appearance detecting device 100 is adapted to detect a front detecting surface 210 and at least one side of at least one wafer (the plurality of wafers 200 are exemplified herein). The side faces 220A, 220B are exemplified), the wafer 200 is adapted to be disposed on the adhesive film 300 (ie, the wafer 200 is attached to the adhesive film 300 with its bottom surface), and the adhesive film 300 has expandability. That is, the wafer 200 is obtained by cutting a wafer (not shown), and the wafer is disposed behind the film 300 for cutting process in the cutting process, and in the embodiment, the cutting is completed. The wafer 200 is placed directly in the appearance detecting device 100 along with the film 300. The detection process will be further described later.

Here, the appearance detecting device 100 includes mirrors 130A, 130B, a photographing unit 110, a light source 120, a supporting unit 140, a computer unit 150, and a control unit 160. The photographing unit 110 is configured to capture an image of the appearance of the wafer 200. The light source 120 is, for example, a ring light source, an internal coaxial light source, or the like, and is disposed in the photographing unit 110 and moved to provide illumination required for photographing the image. The photographing unit 110 and the mirrors 130A and 130B are coupled to the light source 120 and coupled to the control unit 160 to be controlled to reach the opened and closed state. The support unit 140 is coupled to the control unit 160 , and the mobile unit 170 is coupled to the control unit 160 and configured to move the adhesive film 300 . In the embodiment of the present invention, the adhesive film 300 can be moved by the mobile unit 170 or the carrier (not shown) carrying the adhesive film 300 can be moved to allow the adhesive film 300 and the wafer thereon. The 200 can be moved relative to the detecting component (the photographing unit 110, the light source 120, and the mirrors 130A, 130B), and the plurality of wafers 200 can be visually inspected successively.

After the photographing unit 110 photographs the wafer 200, the image information is transmitted to the computer unit 150 for analysis, and the appearance detection result of the wafer 200 is obtained, for example, the defect of the appearance of the wafer 200 is discriminated to be screened for entry. For the wafer 200 of the next process, the screening conditions are not limited in this embodiment. In addition, this embodiment also does not limit the driving method of the mobile unit 170 and its corresponding moving structure with the film 300.

2 is a flow chart of appearance detection in accordance with an embodiment of the present invention. Referring to FIG. 1 and FIG. 2, the appearance detection process of this embodiment will be described in detail below.

First, in step S110, the film 300 and the wafer 200 thereon are placed in the appearance detecting device 100, and the wafer 200 to be detected is placed on the supporting unit 140. As described above, the wafer 200 after the dicing is completed is placed on the supporting unit 140 of the appearance detecting device 100 along with the film 300, that is, the film 300 at the position where the wafer 200 to be tested is located is abutted against the supporting unit 140. On plane 142. Then, since the adhesive film 300 has expandability, in step S120, the support unit 140 can push and expand the adhesive film 300 by the action along the Z axis to increase the gap between the wafer to be tested 200 and the adjacent wafer 200. Space C1. Next, in step S130, the detection space formed by the wafer to be tested 200 to the photographing unit 110, the mirrors 130A, 130B and the light source 120 is moved, wherein the photographing unit 110 corresponds to the front detecting surface 210 of the wafer 200, and the mirrors 130A, 130B Then, the space C1 is moved to correspond to the side faces 220A, 220B of the wafer 200. At this time, the step S140 can drive the photographing unit 110 to directly capture the image of the front view detecting surface 210 of the wafer 200, and indirectly capture the images of the side faces 220A, 220B of the wafer 200 by the mirrors 130A, 130B. Then, the image information captured by the photographing unit 110 is transmitted to the computer unit 150 in step S150 to obtain an appearance detection result of the wafer 200. The motion mode between the wafer to be tested 200 and the photographic unit 110, the mirrors 130A, 130B and the light source 120 is not limited herein. As described above, the wafer 200 to be tested is placed on the carrier (not shown). And moving it, the photographing unit 110, the mirrors 130A, 130B and the light source 120 are substantially in a stationary state. However, in another embodiment, the wafer to be tested 200 may be allowed to stand still to drive the photographing unit 110, the mirrors 130A, 130B and the light source 120, and the same detection purpose can be achieved. Accordingly, any means capable of driving relative motion between the wafer to be tested 200 and the photographing unit 110, the mirrors 130A, 130B, and the light source 120 can be applied to the present invention. Subsequent descriptions of the detection paths have included the different relative motion patterns described above, and are not limited to only one of them.

It should be further noted that, as shown in FIG. 1, the mirrors 130A, 130B of the present embodiment respectively have an angle θ of 30 degrees to 60 degrees with respect to the reference plane S1, wherein the reference plane S1 is parallel to the XY plane, the reference plane S1 is also parallel to the front view detecting surface 210 of the wafer 200 and the support plane 142 of the support unit 140. Furthermore, the user can adjust the angle θ between the mirrors 130A, 130B and the reference plane S1 in the foregoing range as needed.

FIG. 3 is a schematic diagram of an image after being detected by the appearance shown in FIG. 1 for describing a state processed by the computer unit 150. Referring to FIG. 1 to FIG. 3 , in this embodiment, since the appearance detection of the plurality of wafers 200 is required, the computer unit 150 can perform multiple appearance detection results, that is, multiple images FR1, FR2, and FR3. The images are arranged to form a collection of images, wherein each image FR1 (or FR2, FR3) has a different image area T1, L1, R1 (or T2, L2, R2, or T3, L3, R3). For example, in the image FR1, the image area T1 is the appearance image of the front side detection surface 210 of the wafer 200, and the image area R1 is the appearance image of the side surface 220A of the wafer 200, and the image area L1 is the side surface of the wafer 200. Appearance image of 220B. In other words, by the processing of the computer unit 150, the front view detecting surface 210 of the wafer 200 directly or indirectly captured by the photographing unit 110 and the images of the side surfaces 220A and 220B can be simultaneously stored in the single image FR1, and can be It is required to be post-processed to facilitate judgment of the appearance test results obtained. However, this embodiment does not limit the processing manner of the computer unit 150.

It should be noted that, in the foregoing embodiment, the mirrors 130A, 130B are simultaneously disposed on opposite sides of the wafer to be tested 200, and in another embodiment not shown, only the wafer 200 may be required according to requirements. One side is equipped with a mirror.

FIG. 4 is a schematic view showing the detection of the wafer by the appearance detecting device of FIG. 1, wherein the moving mode of the detection can be clearly recognized in a bird's-eye view. Referring to FIG. 2 and FIG. 4, step S140 of the embodiment further includes step S145, driving the film 300 and the wafer 200 thereon or the photographing unit 110 and the mirrors 130A, 130B to generate relative motion, and at least one path is relatively The wafers 200 are subjected to visual inspection.

In detail, the wafers 200 of the present embodiment are arranged in an array manner, so that the film 300 and the wafers 200 thereon are driven by the moving unit 170 to enable the film 300 and the wafer 200 to be produced relative to the photographing unit 110 and the mirror. The relative motion of 130A, 130B (alternatively, as described above, the moving camera unit 110 and the mirrors 130A, 130B can also be changed), and thus the detection paths P1, P2 as shown in Fig. 4 are generated. For example, the wafer 200 has substantially the same detection surface as the front surface and the four side surfaces adjacent thereto, so that the photographing unit 110 can first capture the front side detection surface by the mirrors 130A, 130B and The appearance images of the two sides are detected one by one by a plurality of wafers 200 along the detection path P1. However, the embodiment does not limit the form of the detection path. Similarly, as shown in the lower right corner of FIG. 4, the photographing unit 110 and the mirrors 130A, 130B can also detect the wafer 200 to be tested by the detection path P2, that is, Appropriate changes are made depending on the state of the wafer and the detection requirements.

FIG. 5 is a partial schematic view of an appearance detecting device according to another embodiment of the present invention. Referring to FIG. 5 and referring to FIG. 1, different from the foregoing embodiment, the appearance detecting device of the present embodiment is configured by a plurality of mirrors 130A, 130B, 130C, and 130D and surrounds the wafer 200 to be tested, so that these The mirrors 130A to 130D can respectively correspond to a plurality of side faces of the wafer 200, and the imaging unit 110 (refer to FIG. 1) can simultaneously acquire images of all sides of the wafer 200 by the mirrors 130A to 130D. Similarly, the number and configuration of the mirrors can be appropriately adjusted depending on the shape of the wafer.

6 is a partial schematic view of an appearance detecting device according to another embodiment of the present invention. In the present embodiment, the wafer is divided into a plurality of banks. Only one of the wafers 200A is shown in FIG. 6, and the wafers 200A of the same batch are arranged along the X-axis. Moreover, the wafers 200A of the same batch are pushed up by the support unit 440, and the length of the support unit 440 along the X-axis is equal to the length of the area occupied by the wafer 200A of the same batch on the film 300 along the X-axis.

It should be noted that, in this embodiment, the mirrors 430A and 430B can be moved to the spaces C2 and C3 between the wafers by the support unit 440 by pushing and expanding the adhesive film 300 along the X axis. Yes, the mirrors 430A, 430B of the present embodiment can simultaneously correspond to a plurality of sides of the plurality of wafers 200, that is, the lengths of the same batch of wafers 200A along the X-axis are substantially included in the mirrors 430A, 430B. Each of them is along the length of the X-axis, and the mirrors 430A, 430B respectively have an angle θ with the film 300. According to this, the user can simultaneously detect all the front view detecting faces and the side faces of the same batch of the wafer 200A with a single appearance detecting operation.

In addition, referring to FIG. 6 and referring to FIG. 4, in the detection state of the embodiment shown in FIG. 6, it can also be applied to the detection path shown in FIG. 4, that is, the original plurality of wafers 200 are changed at this time. The plurality of batches of wafers 200A are replaced to represent the plurality of batches of wafers 200A in an array configuration, while the original mirrors 130A, 130B are replaced by mirrors 430A, 430B. In this way, the user can perform image capturing and detecting operations on the plurality of batches of the wafers 200A according to the S-shaped detection path P1 or the (and) detection path P2.

Fig. 7 is a schematic view showing the detection of a wafer by an appearance detecting device according to another embodiment of the present invention. Referring to FIG. 7 and FIG. 4, unlike the foregoing embodiment, the photographing unit 110 and the mirrors 130A and 130B of the present embodiment detect the wafer 200 to be tested with the detection paths P3a and P3b, and detect the path P3a. P3b will form a loop. Fig. 8 is a view showing the detection of a wafer by an appearance detecting device according to another embodiment of the present invention. Referring to FIG. 8 and FIG. 4 and FIG. 7, different from the foregoing embodiment, the photographing unit 110 and the mirrors 130A and 130B of the present embodiment detect the wafer 200 to be tested by the detecting path P4, and the detecting is performed. The path P4 is spiral. Meanwhile, in the embodiment shown in FIG. 7 and FIG. 8, the appearance images of the wafers to be tested 200 are arranged in the same direction, so that the photographing unit 110 and the mirrors 130A, 130B and the wafer to be tested 200 are not detected. The paths P3a, P3b form a shape or the detection path P4 is spiral and a relative rotation of about 90 degrees is generated with reference to the Z axis. In other words, the photographing unit 110 and the mirrors 130A, 130B do not rotate but are fixedly oriented. one direction. Of course, the wafer to be tested 200 shown in FIG. 7 and FIG. 8 can also be replaced with a plurality of batches of wafers 200A as shown in FIG.

In summary, in the above embodiment of the present invention, after the cutting process, the wafer disposed on the film is directly moved to the appearance detecting device, and the supporting unit is expanded by the pushing action to increase the phase. The space between the adjacent wafers allows the mirror to be smoothly moved into the space to correspond to the side of the wafer. According to this, the photographing unit can directly capture the image of the detecting surface of the wafer in front view, and at the same time indirectly capture the image of the side surface of the wafer by the mirror, and the detecting surface and the side surface of the wafer can be completed by a single shooting operation. Also detect the effect.

In addition, the mirror can be appropriately adjusted according to the shape and the number of the wafer to improve the detection efficiency. In one embodiment, the appearance detecting device can surround the plurality of mirrors and correspond to the plurality of sides of the wafer to obtain the same wafer. In the other embodiment, the appearance detecting device corresponds to a plurality of sides of the plurality of wafers by one mirror, so that the photographing unit can obtain the same batch in a single shooting operation. An image of multiple wafers.

Accordingly, the detection process of the above-described embodiment of the present invention can effectively simplify the entire inspection process and achieve the effect of improving the process efficiency as compared with the prior art in which the wafer is first removed from the film and placed on the carrier.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100‧‧‧ appearance inspection device

110‧‧‧Photographic unit

120‧‧‧Light source

130A, 130B, 130C, 130D, 430A, 430B, ‧‧‧ mirrors

140, 440‧‧‧Support unit

142‧‧‧Support plane

150‧‧‧ computer unit

160‧‧‧Control unit

170‧‧‧Mobile unit

200, 200A‧‧‧ wafer

210‧‧‧ Face-to-face inspection surface

220A, 220B‧‧‧ side

300‧‧ ‧ film

C1, C2, C3‧‧‧ space

FR1, FR2, FR3‧‧ images

P1, P2, P3a, P3b, P4‧‧‧ detection path

T1, L1, R1, T2, L2, R2, T3, L3, R3‧‧‧ image area

S1‧‧‧ datum

S110, S120, S130, S140, S145, S150‧‧ steps

Θ‧‧‧ angle

1 is a side view of an appearance detecting device in accordance with an embodiment of the present invention. 2 is a flow chart of appearance detection in accordance with an embodiment of the present invention. FIG. 3 is a schematic diagram of an image after being detected by the appearance shown in FIG. 1. 4 is a schematic view showing the detection of the wafer by the appearance detecting device of FIG. 1. FIG. 5 is a partial schematic view of an appearance detecting device according to another embodiment of the present invention. 6 is a partial schematic view of an appearance detecting device according to another embodiment of the present invention. Fig. 7 is a schematic view showing the detection of a wafer by an appearance detecting device according to another embodiment of the present invention. Fig. 8 is a view showing the detection of a wafer by an appearance detecting device according to another embodiment of the present invention.

100: Appearance detecting device 110: Photographing unit 120: Light source 130A, 130B: Mirror 140: Support unit 142: Supporting plane 150: Computer unit 160: Control unit 170: Mobile unit 200: Wafer 210: Front view detecting faces 220A, 220B : Side 300: film C1: space S1: reference plane θ: angle

Claims (9)

An appearance detecting device is adapted to detect a front view detecting surface of at least one wafer and at least one side adjacent to the front facing detecting surface, the at least one wafer being disposed on a film, the film having expandability, The appearance detecting device includes: at least one mirror corresponding to the at least one side surface of the at least one wafer, wherein the at least one mirror is in the form of a sheet; and a photographing unit for directly capturing the image of the front side detecting surface of the at least one wafer And indirectly capturing an image of the at least one side of the wafer through the at least one mirror; and a computer unit coupled to the photographing unit and analyzing the front view detecting surface of the at least one wafer captured by the photographing unit And the image of the at least one side to obtain an appearance detection result of the at least one wafer; and a supporting unit capable of supporting the at least one wafer by supporting the film, wherein the number of the at least one wafer comprises a plurality of The wafer is divided into a plurality of banks, and the wafers of the same batch are arranged along an axis, and the at least one mirror corresponds to a plurality of sides of the wafers, The image unit directly captures the images of the front view detection surfaces, and simultaneously indirectly images the side surfaces of the wafers through the at least one mirror, wherein the length of the support unit along the axis is equal to the wafers belonging to the same batch a length of the area occupied by the film along the axis, wherein the supporting unit can push and expand the film to increase the number of the wafers of the batch being pushed and another batch adjacent thereto a space between the wafers, And the at least one mirror can be moved into the space to correspond to the sides of the plurality of wafers being pushed. The appearance detecting device of claim 1, wherein the at least one mirror comprises a pair of mirrors, and the pair of mirrors respectively correspond to opposite sides of at least one of the wafers, so that the photographing unit passes the pair An image of the opposite sides of the at least one wafer is taken by the mirror. The appearance detecting device of claim 1, wherein the at least one mirror comprises a plurality of mirrors, and the mirrors surround the at least one wafer respectively corresponding to the plurality of sides of the at least one wafer, so that The photographing unit captures images of the side surfaces of the wafer through the mirrors. The appearance detecting device according to claim 1, wherein the at least one mirror forms an angle of 30 to 60 degrees with the front detecting surface of the at least one wafer. The appearance detecting device according to claim 1, wherein the at least one mirror forms an angle of 30 to 60 degrees with a supporting plane of the supporting unit. The appearance detecting device of claim 1, wherein the supporting unit can push and expand the film to increase a space of the at least one wafer and another wafer adjacent thereto, and The at least one mirror can be moved into the space to correspond to the at least one side of at least one of the wafers. The appearance detecting device according to claim 1, wherein the at least one mirror comprises a pair of mirrors, and the pair of mirrors are respectively located in the same batch The opposite sides of the wafer are such that the photographing unit indirectly images the opposite sides of the wafers of the same batch via the pair of mirrors. The appearance detecting device of claim 1, wherein the batches are arranged in an array, and the image detecting device further comprises: a moving unit for driving the film to make the wafers on the film Moving relative to the camera unit to cause the camera unit and the at least one mirror to capture images of the batch of wafers along an S-shaped path. The appearance detecting device of claim 1, wherein the batches are arranged in an array, and the image detecting device further comprises: a moving unit for driving the film to make the wafers on the film Moving relative to the camera unit to cause the camera unit and the at least one mirror to capture images of the batch of wafers along a path of a shape or a spiral.