TWI611157B - Heat pipe module and heat dissipating device using the same - Google Patents

Abstract

A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first tubular body defines a hollow chamber. A portion of the second tubular body is disposed in the hollow chamber, and an outer wall of the portion of the second tubular body directly contacts the first tubular body.

Description

Heat pipe module and heat sink applying the same

The invention relates to a heat pipe module and a heat dissipating device using the same, in particular to a heat pipe module capable of effectively reducing thermal resistance and a heat dissipating device using the same.

In recent years, CPUs, GPUs, antennas, and batteries used in electronic devices such as notebook computers, tablet terminals, and smart phones have been required to be smaller, lighter, and thinner, and high-performance at the same time. The demand is such that a large amount of heat is emitted from various heating elements mounted on the electronic devices. In order to realize the small size, light weight and thinness of the electronic device body, the heat sink device is also required to have the same function. Generally, for the heat dissipation and cooling of the above electronic device, a heat pipe having a thermal conductivity higher than that of a metal such as copper or aluminum is incorporated, but with the small size, lightness, and thinness of the electronic device, the heat pipe itself is also It is required to be small, light and thin.

The heat pipe is a heat dissipation unit having a simple structure and high efficiency, and thus has been widely used in various heat sinks for heat dissipation of electronic products. Its working principle is to transfer energy by the latent heat of the phase change between the gas and liquid phases of the working medium. In the evaporation section, the working fluid carries a large amount of thermal energy from the heat source by the latent heat of vaporization. The steam fills the originally evacuated inner space of the tube and condenses into a liquid in the condensation section and releases the heat energy. The capillary force provided by the internal capillary structure (wick) flows back to the evaporation section for a phase change cycle, which continuously and efficiently transfers thermal energy from the heat source to the distant place.

Among them, the thin heat pipe is a kind of plate type heat pipe, and its working principle is the same as that of the traditional heat pipe. Because it has a larger conductive surface than the traditional heat pipe, and has a light and high practical value, a large number It is applied to electronic products with large heat dissipation surfaces. On the basis of the application of the thin heat pipe, most of the heat must be transferred to the cooling list by the heat pipe. Yuan (such as heat sink fins or fans, etc.). However, with the space limitation of the thinned electronic device, the number of cooling units is often not set separately with most of the heat sources in the electronic device, resulting in the electronic device not being able to effectively handle its heat dissipation requirements. On the other hand, the farther the distance between the cooling unit and the heat source is, the heat transfer capability is greatly attenuated. The thermal resistance of the heat sink may also reduce the heat transfer efficiency of the heat pipe, so that the heat dissipation performance provided by the back end cooling unit is greatly reduced, and cannot be effectively utilized.

Therefore, how to provide a heat pipe module that can reduce thermal resistance and is applied to multiple heat sources and a heat sink using the same has become one of the important topics.

In view of the above problems, an object of the present invention is to provide a heat pipe module capable of reducing thermal resistance and applied to a plurality of heat sources, and a heat sink using the same.

To achieve the above object, a heat pipe module according to the present invention includes at least one first pipe body and at least one second pipe body. The inner wall of the first tubular body defines a hollow chamber. A portion of the second tubular body is disposed in the hollow chamber, and an outer wall of the portion of the second tubular body directly contacts the first tubular body.

In an embodiment, the outer wall of the second tubular body directly contacts the inner wall of the first tubular body.

In an embodiment, the surface area of the inner wall of the first tubular body is greater than the surface area of the outer wall of the second tubular body.

In an embodiment, the heat pipe module further includes a capillary structure. The capillary structure is disposed on an inner wall of the first pipe body.

In an embodiment, the outer wall of the second tubular body directly contacts the capillary structure.

In an embodiment, the capillary structure is disposed only at a position where the first tubular body is in contact with the second tubular body.

In an embodiment, the heat pipe module further includes an evaporation portion and a condensation portion. The second tube is located at a portion of the evaporation portion and all of the condensation portion.

In an embodiment, the capillary structure is disposed at an end of the inner wall of the first tubular body adjacent to the condensation portion.

In an embodiment, the first tubular body has a support structure. The support structure is disposed between the capillary structure and the second tube.

In an embodiment, the heat pipe module further includes a plurality of second tubes. The second tubes are arranged adjacent to each other within the first tube.

In an embodiment, the first tubular body is a heat pipe or a temperature equalizing plate.

In an embodiment, the second tube body is a heat pipe, a temperature equalizing plate or a metal tube.

To achieve the above object, a heat sink according to the present invention includes a heat pipe module and a heat sink fin set. The heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first tubular body defines a hollow chamber. A portion of the second tubular body is disposed in the hollow chamber, and an outer wall of the portion of the second tubular body directly contacts the first tubular body. The heat sink fin set has a plurality of heat sink fins. The heat dissipation fins are disposed on the second tube body.

In an embodiment, the outer wall of the second tubular body directly contacts the inner wall of the first tubular body.

In an embodiment, the surface area of the inner wall of the first tubular body is greater than the surface area of the outer wall of the second tubular body.

In an embodiment, the heat pipe module further includes a capillary structure. The capillary structure is disposed on an inner wall of the first pipe body.

In an embodiment, the outer wall of the second tubular body directly contacts the capillary structure.

In an embodiment, the capillary structure is disposed only at a position where the first tubular body is in contact with the second tubular body.

In an embodiment, the heat pipe module further includes an evaporation portion and a condensation portion. The second tube is located at a portion of the evaporation portion and all of the condensation portion.

In an embodiment, the capillary structure is disposed at an end of the inner wall of the first tubular body adjacent to the condensation portion.

In an embodiment, the first tubular body has a support structure. The support structure is disposed between the capillary structure and the second tube.

In an embodiment, the heat pipe module further includes a plurality of second tubes. The second tubes are arranged adjacent to each other within the first tube.

In an embodiment, the first tubular body is a heat pipe or a temperature equalizing plate.

In an embodiment, the second tube body is a heat pipe, a temperature equalizing plate or a metal tube.

As described above, the heat pipe module of the present invention and the heat dissipating device using the same are connected through a first pipe body and a second pipe body, so that the heat generated by the heat source can be sequentially first. The tube body is transferred to the second tube body for heat dissipation (cooling), which effectively reduces the thermal resistance generated during heat conduction to improve the efficiency of heat conduction.

1, 1a, 1', 1" ‧ ‧ first pipe

10, 10"‧‧‧ hollow room

11‧‧‧ (first body 1) inner wall

12‧‧‧ (outer body 1) outer wall

2, 2a, 2', 2" ‧ ‧ second tube

22‧‧‧ (of the second tube 2) outer wall

3, 3" ‧ ‧ capillary structure

4, 4b‧‧‧ support structure

40‧‧‧ base

41‧‧‧Top Department

40b‧‧‧Framework

41b‧‧‧Support

A-A, B-B, C-C‧‧‧ section line

C‧‧‧ Condensation Department

E‧‧‧Evaporation Department

H, H', H", H1, H2, H3, H4, H5‧‧‧ heat pipe modules

S‧‧‧heat sink

F‧‧‧Fixed fin set

F1‧‧‧heat fins

1A is a schematic view showing the appearance of a heat pipe module according to a preferred embodiment of the present invention.

FIG. 1B is an exploded perspective view of the heat pipe module shown in FIG. 1A.

1C is a schematic cross-sectional view of the A-A cross-sectional line of the heat pipe module shown in FIG. 1A.

2A is a schematic view showing the appearance of a heat pipe module according to another preferred embodiment of the present invention.

2B is a schematic cross-sectional view of the heat pipe module of FIG. 2A taken along the line B-B.

2C is a schematic cross-sectional view of a heat pipe module according to another preferred embodiment of the present invention.

FIG. 3 is a schematic diagram of the appearance of a heat pipe module according to another preferred embodiment of the present invention.

4A is a schematic view showing the appearance of a heat pipe module according to another preferred embodiment of the present invention.

4B is a schematic cross-sectional view of a C-C cross-sectional view of the heat pipe module shown in FIG. 4A.

FIG. 5A is a schematic diagram of the appearance of a heat pipe module according to another preferred embodiment of the present invention.

FIG. 5B is a schematic diagram of the appearance of a heat pipe module according to another preferred embodiment of the present invention.

6 is a schematic diagram of the appearance of a heat dissipation system in accordance with a preferred embodiment of the present invention.

Hereinafter, a heat pipe module and a heat dissipating device using the same according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.

1A is a schematic view showing the appearance of a heat pipe module according to a preferred embodiment of the present invention, FIG. 1B is an exploded perspective view of the heat pipe module shown in FIG. 1A, and FIG. 1C is a cross-sectional view of the AA cross-sectional line of the heat pipe module shown in FIG. 1A. Referring to FIG. 1A and FIG. 1B, FIG. 1C, in the embodiment, the heat pipe module H has a first pipe body 1, a second pipe body 2, and a capillary structure 3, and the first pipe body 1 The inner wall 11 defines a hollow chamber 10, and the hollow chamber 10 penetrates one end of the first tubular body 1. The capillary structure 3 is disposed on at least a portion of the inner wall 11 of the first tubular body 1, and the present embodiment is illustrated by the example in which the capillary structure 3 is filled around the inner wall 11 of the first tubular body 1.

The arrangement relationship between the above elements will be further explained. Referring also to FIGS. 1A-1C, a portion of the second tubular body 2 is disposed within the hollow chamber 10. In other words, the second tube The body 2 is not entirely disposed in the hollow chamber 10, and in practice, a portion of the second tube 2 is exposed to the first tube 1. The second tube body 2 disposed in the hollow chamber 10 (the first tube body 1) is at least partially in contact with the capillary structure 3, and the capillary structure 3 is disposed on the first tube body 1 and the second tube body 2 between. Of course, in practical applications, the second tube body 2 disposed in the first tube body 1 may also completely contact the capillary structure 3.

Regarding the number of the first pipe body 1 and the second pipe body 2, the heat pipe module H of the present invention is based on at least one first pipe body 1 and at least one second pipe body 2, and the number of both is It is not limited by the present invention to adjust the heat dissipation requirements of the electronic device to be used.

The first tube body 1 and the second tube body 2 may be made of, for example, copper, silver, aluminum, an alloy thereof, or other metal material having good thermal conductivity. Although the embodiment does not limit the shape and size of the first pipe body 1 and the second pipe body 2, depending on the environment, space, heat conductivity and temperature, the surface area of the outer wall 12 of the first pipe body 1 must be The surface area of the outer wall 22 of the second pipe body 2 is larger than that of the heat pipe having a larger surface area and a heat pipe having a smaller surface area.

The method of manufacturing the heat pipe module H of the present embodiment will be described in detail below. The first tube body 1 and the second tube body 2 are elliptical cylindrical or cylindrical hollow tubes before molding, and the first tube body 1 and the second tube body 2 are flattened as shown in FIGS. 1A to 1C. The status after processing. After the flattening process, the capillary structure 3 is then formed in the first tubular body 1. This embodiment does not limit the manner in which the capillary structure 3 is formed. For example, the inner wall 11 of the first pipe body 1 is filled with metal powder, and a sintered body is formed on the inner wall 11 of the first pipe body 1 by sintering. The capillary structure of the form. The formation of the capillary structure 3 of the present embodiment is not limited in the above manner. In practical applications, the capillary structure 3 may be a fiber or a mesh, in addition to the above-described self-forming metal sintered powder. Or a combination thereof, depending on the requirements of the process and heat dissipation.

After the setting of the capillary structure 3 is completed, the second tube body 2 is placed in the first tube body 1. Since the first pipe body 1 and the second pipe body 2 of the embodiment do not need to pass through additional auxiliary tools (for example, clamping members), the second pipe body 2 can be tightly fitted to the capillary structure 3 in the first pipe body 1, Thereby having the convenience of assembly.

When viewed as a whole, the heat pipe module H has an evaporation portion E and a condensation portion C. Wherein, the evaporation portion E and the condensation portion C are respectively close to the first pipe body 1 and the second pipe body 2 The two ends, the regions covered by the evaporation portion E and the condensation portion C shown in FIG. 1A are for illustrative purposes only and are not intended to limit the scope thereof. In the present embodiment, the capillary structure 3 is disposed at one end of the inner wall 11 of the first pipe body 1 near the condensation portion C. The first pipe body 1 is located in all of the evaporation portions E, and the second pipe body 2 is located in the partial evaporation portion E and all the condensation portions C. During the heat dissipation process, the evaporation portion E (the first pipe body 1) is disposed at the heat source, and the heat is transmitted to the second pipe body 2 via the first pipe body 1 so as to continuously circulate to pass through the heat pipe module of the embodiment. H conducts heat to a cooling unit (not shown) configured by the electronic device, such as a heat sink fin or a fan, to achieve a heat dissipation effect.

Through the configuration of the heat pipe module H in the present case, heat pipes (the first pipe body 1 and the second pipe body 2) having different surface areas are formed in series, which can effectively reduce the heat resistance generated during heat conduction to improve the heat transfer efficiency. .

The present invention further provides a heat pipe module H'. The heat pipe module H' of the present embodiment has no capillary structure as compared with the heat pipe module H of the foregoing embodiment. Referring to FIG. 2A and FIG. 2B, in the present embodiment, the heat pipe module H' has substantially the same structure and features as the heat pipe module H of the foregoing embodiment, and the same components and their connection relationship can be referred to the foregoing embodiment. The content of this will not be repeated here. The outer wall of the second pipe body 2' of the heat pipe module H' directly contacts the first pipe body 1', and preferably, the outer wall of the second pipe body 2' directly contacts the inner wall of the first pipe body 1', as well Effectively reduce the thermal resistance generated during heat conduction to improve the efficiency of heat transfer.

In addition, as shown in FIG. 2C, in another embodiment, the heat pipe module H" also has a capillary structure 3", but the second pipe body 2" disposed in the hollow chamber 10" is only partially disposed in the first A tube body 1", and the capillary structure 3" is disposed only between the first tube body 1" and the second tube body 2".

3 is a schematic diagram of the appearance of a heat pipe module according to another embodiment of the present invention. Referring to FIG. 3, the heat pipe module H1 has substantially the same structure and features as the heat pipe module H of the foregoing embodiment, but the heat pipe The module H1 includes two first tubes 1 and a second tube 2. That is, the heat pipe module H1 includes two evaporation portions E for being disposed in the heat source, so that the entire circulation system is suitable for an electronic device having multiple heat sources, such as a central processing unit (CPU) and graphics processing. (Graphics Processing Unit, GPU) esports notebook or thin notebook. Since the space of the electronic device of this type is limited, there is no space for the cooling structure to be disposed at the heat source. Therefore, only the first pipe body 1 (large heat pipe) for heat conduction is disposed at the heat source, and the method can be connected in series. Multiple heat sources with single cooling Units (such as bulky fins, fans, and any technology that can be used for heat dissipation or heat exchange) to reduce the space occupied by the cooling system.

There are other applications for the amount of fit between the first tube and the second tube. 4A is a schematic view showing the appearance of a heat pipe module according to another preferred embodiment of the present invention, and FIG. 4B is a cross-sectional view showing a CC cross-sectional view of the heat pipe module shown in FIG. 4A. Please refer to FIG. 4A and FIG. 4B simultaneously. The heat pipe module H2 has substantially the same structure and features as the heat pipe module H of the foregoing embodiment, but the heat pipe module H2 includes a first pipe body 1a and a plurality of second pipe bodies 2a (this embodiment is three second The tubular body 2a is exemplified), and each of the second tubular bodies 2a is adjacently arranged in the first tubular body 1a and closely fitted to the capillary structure 3. Through the cooperation of a first pipe body 1a and a plurality of second pipe bodies 2a, more heat dissipation channels can be provided to effectively improve the heat dissipation effect of the heat pipe module H2 and the flexibility of the space arrangement.

5A is a schematic view showing the appearance of a heat pipe module according to another embodiment of the present invention. Referring to FIG. 5A, the heat pipe module H3 has substantially the same structure and features as the heat pipe module H of the foregoing embodiment, but the heat pipe. The module H3 further includes a support structure 4. The support structure 4 is disposed in the hollow chamber 10 in close proximity to the capillary structure 3, and the support structure 4 includes a base portion 40 and a plurality of top portions 41 projecting from the side of the base portion 40. The respective top portions 41 are hollow and The other side of the base 40 communicates. The second tube 2 is disposed inside the support structure 4. Through the configuration of the support structure 4, the space of the predetermined hollow chamber 10 can be effectively maintained in the flat forming of the first pipe body 1, and the heat pipe module H3 can be provided with better rigidity. In addition, through the configuration of the support structure 4, the inside of the first pipe body 1 can be cut into individual chambers to accommodate the second pipe body 2, respectively, and the steam and liquid inside the different chambers can be operated separately.

The configuration of the support structure is not limited to the above, and it may also be as shown in FIG. 5B. In this embodiment, the support structure 4b is formed by being stamped and then bent through a plate body (such as a metal plate). The support structure 4b includes a skeleton portion 40b and a support portion 41b provided between the two skeleton portions 40b, and the second tubular body 2 is disposed inside the support structure 4b. Similarly, through the configuration of the support structure 4b, the space of the predetermined hollow chamber 10 can be effectively maintained in the flat forming of the first pipe body 1, and the heat pipe module H4 can be provided with better rigidity.

6 is a schematic diagram of the appearance of a heat dissipation system in accordance with a preferred embodiment of the present invention. Referring to FIG. 6 , the heat sink S includes a heat pipe module H5 and a heat sink fin set F. among them, The heat pipe module H5 has substantially the same structure and features as the heat pipe module H of the foregoing embodiment, and details are not described herein. The heat dissipation fin group F has a plurality of heat dissipation fins F1, and the heat dissipation fins F1 of the embodiment are disposed on the second tube body 2. The plurality of heat dissipation fins F1 of the heat dissipation fin group F are coupled to each other through a heat conduction section, and the heat conduction section of the plurality of heat dissipation fins F1 is formed by the thickness of the heat conduction section being greater than the thickness of the heat dissipation section. A heat transfer path having a large cross-sectional area is formed in the heat dissipation fin group F, which can provide heat absorbed by the heat pipe from the end close to the heat source to the end away from the heat source, that is, the heat can be quickly transmitted to each The heat dissipating section of the fin F1 is heat-exchanged with the outside air through the heat dissipating section, thereby improving heat dissipation.

In summary, the heat pipe module of the present invention and the heat dissipating device using the same are connected through a first pipe body and a second pipe body, so that the heat generated by the heat source can be sequentially ordered by the first pipe body. It is sent to the second pipe for heat dissipation (cooling), which effectively reduces the thermal resistance generated during heat conduction to improve the efficiency of heat conduction.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1‧‧‧First tube

2‧‧‧Second body

A-A‧‧‧ section line

C‧‧‧ Condensation Department

E‧‧‧Evaporation Department

H‧‧‧heat pipe module

Claims (18)

A heat pipe module comprising: at least one first pipe body, an inner wall of the first pipe body defining a hollow cavity; and at least one second pipe body, wherein the second pipe body is disposed in the hollow cavity And a portion of the second tube body located in the hollow chamber directly contacts the inner wall of the first tube body. A heat pipe module comprising: at least one first pipe body, an inner wall of the first pipe body defining a hollow cavity; at least one second pipe body, a part of the second pipe body being disposed in the hollow cavity, and a portion of the second tubular body located in the hollow chamber contacting the inner wall of the first tubular body; and a capillary structure disposed only at a position where the inner wall of the first tubular body is in contact with the second tubular body, The second tubular body is in contact with the first tubular body via the capillary structure. A heat pipe module comprising: at least one first pipe body, an inner wall of the first pipe body defining a hollow chamber; a plurality of second pipe bodies, each of the second pipe body portions being disposed in the hollow chamber, and An outer wall of the second tube located in the hollow chamber contacts an inner wall of the first tube, the second tubes are adjacently arranged in the first tube body; and a capillary structure is disposed at the first An inner wall of the tubular body, the second tubular bodies are in contact with the first tubular body via the capillary structure. The heat pipe module according to any one of claims 1 to 3, wherein a surface area of an inner wall of the first pipe body is larger than a surface area of an outer wall of the second pipe body. The heat pipe module according to any one of claims 1 to 3, further comprising: an evaporation portion and a condensation portion, wherein the second tube body is located at a portion of the evaporation portion and all of the condensation portion. The heat pipe module of claim 5, wherein the capillary structure is disposed at an end of the inner wall of the first pipe body adjacent to the condensation portion. The heat pipe module according to any one of claims 1 to 3, wherein the first pipe body has a support structure disposed between the capillary structure and the second pipe body. The heat pipe module according to any one of claims 1 to 3, wherein the first pipe body is Heat pipe or temperature equalization plate. The heat pipe module according to any one of claims 1 to 3, wherein the second pipe body is a heat pipe, a temperature equalizing plate or a metal pipe. A heat dissipating device comprising: a heat pipe module comprising: at least one first pipe body, an inner wall of the first pipe body defining a hollow chamber; and at least one second pipe body, part of the second pipe body In the hollow chamber, the outer wall of the second tube body directly contacting the inner wall of the first tube body; and a heat dissipation fin group having a plurality of heat dissipation fins, the heat dissipation fins Set on the second tube body. A heat dissipating device comprising: a heat pipe module comprising: at least one first pipe body, an inner wall of the first pipe body defining a hollow chamber; at least one second pipe body, and the second pipe body is disposed at The hollow chamber is located at a portion of the hollow chamber, the outer wall of the second tube contacts the inner wall of the first tube; and a capillary structure is disposed only on the inner wall of the first tube and the second The second tube body is in contact with the first tube body via the capillary structure; and a heat dissipation fin group has a plurality of heat dissipation fins, and the heat dissipation fins are disposed on the second tube body. A heat dissipating device comprising: a heat pipe module comprising: at least one first pipe body, an inner wall of the first pipe body defining a hollow chamber; a plurality of second pipe bodies, each of the second pipe body portions being disposed on The inner wall of the second tube body of the hollow chamber is in contact with the inner wall of the first tube body, the second tube bodies are adjacently arranged in the first tube body; and a capillary structure Provided on the inner wall of the first tube body, the second tube body is in contact with the first tube body via the capillary structure; and a heat dissipation fin group having a plurality of heat dissipation fins, wherein the heat dissipation fins are disposed on The second tubes. The heat sink according to any one of claims 10 to 12, wherein the first tube The surface area of the inner wall of the body is greater than the surface area of the outer wall of the second tube. The heat dissipation device according to any one of claims 10 to 12, wherein the heat pipe module further comprises: an evaporation portion and a condensation portion, wherein the second tube body is located at a portion of the evaporation portion and all of the evaporation portion Condensation section. The heat dissipating device of claim 14, wherein the capillary structure is disposed at an end of the inner wall of the first pipe body adjacent to the condensation portion. The heat dissipating device according to any one of claims 10 to 12, wherein the first tube body has a supporting structure disposed between the capillary structure and the second tube body. The heat dissipating device according to any one of claims 10 to 12, wherein the first tube body is a heat pipe or a temperature equalizing plate. The heat dissipating device according to any one of claims 10 to 12, wherein the second pipe body is a heat pipe, a temperature equalizing plate or a metal pipe.