TWI610068B - Power sensor - Google Patents

Abstract

A force sensor includes a body, a sensing component, an elastic colloid, and a pressing member. The sensing component is disposed on the base and electrically connected to the base. The elastic colloid is disposed on the seat and covers the sensing element. The pressing member is disposed on the elastic colloid and is adapted to be pressed to press the elastic colloid to elastically deform the elastic colloid. The sensing element is adapted to sense an elastic deformation of the elastic colloid to generate a sensing signal.

Description

Power sensor

This invention relates to a sensor and, more particularly, to a force sensor.

Micro-Electro-Mechanical System (MEMS) technology is a design based on miniaturized electromechanical integrated structure. The current common MEMS technology is mainly used in three fields, such as Micro sensors, Micro actuators, and Micro structures. Micro-sensors can change the external environment (such as power). , pressure, sound, speed, etc.) are converted into electrical signals (such as voltage or current, etc.) to achieve environmental sensing functions, such as force sensing, pressure sensing, sound sensing, acceleration sensing, and the like. Micro-sensors are better competitive because they can be fabricated using semiconductor process technology and can be integrated with integrated circuits. Therefore, the microcomputer inductive detector and the sensing device using the microcomputer inductive detector are the development trend of the micro electro mechanical system.

In the case of a microelectromechanical force sensor, the sensing element is used to sense the pressing force applied by the entity, and if the sensing element is exposed and directly withstands the pressing force, the sensing element is easily worn out. Therefore, how to protect the sensing element of the force sensor and maintain its sensing performance is an important issue in the field of micro-electromechanical power sensing.

The present invention provides a force sensor whose sensing element is well protected and has good sensing performance.

The force sensor of the present invention comprises a body, a sensing element, an elastic colloid and a pressing member. The sensing component is disposed on the base and electrically connected to the base. The elastic colloid is disposed on the seat and covers the sensing element. The pressing member is disposed on the elastic colloid and is adapted to be pressed to press the elastic colloid to elastically deform the elastic colloid. The sensing element is adapted to sense an elastic deformation of the elastic colloid to generate a sensing signal.

In an embodiment of the invention, the seat body has a recess, and the sensing component and the elastic colloid are disposed in the recess, and the top of the elastic colloid protrudes beyond the recess, is recessed in the recess or is flush At the open end of the groove.

The force sensor of the present invention comprises a body, a sensing element and an elastic colloid. The seat has a recess. The sensing component is disposed in the recess and electrically connected to the base. The elastic colloid is disposed in the groove and covers the sensing element. The top of the elastic colloid protrudes beyond the groove and is adapted to be subjected to a force to elastically deform the elastic colloid. The sensing element is adapted to sense an elastic deformation of the elastic colloid to generate a sensing signal.

In an embodiment of the invention, the force sensor includes a pressing member, wherein the pressing member is disposed on the elastic colloid and is adapted to be pressed to press the elastic colloid to elastically deform the elastic colloid.

In an embodiment of the invention, the pressing member comprises a cover body, and the width of the cover body is greater than the width of the elastic colloid.

In an embodiment of the invention, the cover body contacts the elastic colloid.

In an embodiment of the invention, the pressing member further includes a bump, the width of the bump is smaller than the width of the elastic colloid, and the bump is disposed between the cover and the elastic colloid and contacts the elastic colloid.

In an embodiment of the invention, the bump is partially embedded in the elastic colloid.

In an embodiment of the invention, the cover body is made of metal, the base body has a grounding end, and the cover body is electrically connected to the grounding end.

In an embodiment of the invention, the cover body is connected to the base body by a conductive adhesive, and the seat body has a conductive line connected between the conductive adhesive and the ground end.

In an embodiment of the invention, the base body includes a processing unit, wherein the processing unit is electrically connected to the sensing element.

In an embodiment of the invention, the material of the elastic colloid comprises a plurality of rubber materials.

In an embodiment of the invention, the force sensor includes at least one bonding wire, wherein the sensing component is connected to the body by a bonding wire, and one of the rubber materials covers at least one end of the bonding wire.

Based on the above, the force sensor of the present invention utilizes an elastic colloid to wrap the sensing element, so that the sensing element is well protected, thereby preventing the sensing element from being exposed and being easily worn out. By the elastically deformable property of the elastic colloid, the pressing force acting on the elastic colloid can be smoothly transmitted to the sensing element along with the deformation of the elastic colloid, so that the sensing element can accurately sense the pressing force. In addition, a pressing member may be disposed on the elastic colloid to further protect the elastic colloid and the sensing component, and the size and shape of the pressing member may be designed according to requirements to effectively receive and transmit the pressing force. Further, the top of the elastic colloid may be designed to protrude beyond the groove of the seat body so that the pressing force can be smoothly transmitted to the elastic colloid.

The above described features and advantages of the invention will be apparent from the following description.

1A is a top plan view of a power sensor in accordance with an embodiment of the present invention. Figure 1B is a cross-sectional view of the force sensor of Figure 1A taken along line I-I. Referring to FIG. 1A and FIG. 1B , the force sensor 100 of the present embodiment is, for example, a micro electromechanical force sensor and includes a body 110 , a sensing component 120 , an elastic colloid 130 , and a plurality of bonding wires 140 . The base 110 includes a bottom portion 112, a plurality of side portions 114, and a processing unit 116. The side portions 114 are coupled to the bottom portion 112 and form a mouth-shaped side wall, and the base body 110 has a recess 110a. The processing unit 116 is, for example, a signal processing chip disposed on the bottom portion 112 and electrically connected to the bottom portion 112 by a partial bonding wire 140.

The sensing component 120 is disposed on the processing unit 116 of the base 110 and located in the recess 110a, and is electrically connected to the processing unit 116 of the base 110 by a partial bonding wire 140. In detail, the sensing component 120 is, for example, a piezoresistive sensor, and the material of the main body is, for example, a crucible and has a deformable portion 122. The deformable portion 122 is provided with a piezoresistive material, and the piezoresistive material is provided. Electrically connected to the corresponding bonding wire 140. The elastic colloid 130 is, for example, silicone or other suitable kind of elastic colloid disposed on the seat 110 and located in the recess 110a and covering the sensing component 120, the processing unit 116 and the bonding wire 140. In the present embodiment, the top of the elastic colloid 130 protrudes beyond the recess 110a. It should be noted that the elastic colloid referred to in the present invention refers to a colloid which is fluid when uncured and which can be elastically deformed by pressing force after being cured for sensing of the sensing element.

FIG. 1C illustrates the elastic colloid of FIG. 1B being pressed. When the user touches and presses the elastic colloid 130, the top of the elastic colloid 130 is adapted to be elastically deformed by the force shown in FIG. 1C (labeled as pressing force F). The sensing element 120 is adapted to sense an elastic deformation of the elastic colloid 130 to generate a sensing signal. The sensing signal from the piezoresistive material on the sensing component 120 can be transferred to the processing unit 116 via the bonding wire 140 and transferred from the processing unit 116 to the socket via the bonding wire 140 after the processing unit 116 performs processing such as conversion or filtering noise. The bottom 112 of the body 110. The base 110 can be disposed on the circuit board of the electronic device, and the bottom portion 112 of the base 110 has, for example, a line structure, and the sensing signal is transmitted to the circuit board of the electronic device via the line structure in the bottom portion 112. The electronic device is, for example, a device having a touch function, and utilizes the power sensing function of the power sensor 100 to determine the touch force of the user. However, the present invention is not limited thereto, and the power sensor 100 can be applied to other kinds of devices.

Under the above configuration, the force sensor 100 utilizes the elastic colloid 130 to wrap the sensing component 120, so that the sensing component 120 is well protected, thereby preventing the sensing component 120 from being exposed and being easily worn out. By the elastically deformable property of the elastic colloid 130, the pressing force acting on the elastic colloid 130 can be smoothly transmitted to the sensing element 120 along with the deformation of the elastic colloid 130, so that the sensing element 120 can accurately press the button The pressure is sensed. Further, as described above, the top of the elastic colloid 130 is designed to protrude beyond the recess 110a of the seat body 110, so that the pressing force can be smoothly transmitted to the elastic colloid 130. However, in other embodiments, the top of the elastic colloid 130 may also be designed to be recessed within the recess 110a or flush with the open end of the recess 110a, which is not limited in the present invention.

2A is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. 2B illustrates the elastic gel of FIG. 2A being pressed. 2A and 2B, the body 210, the recess 210a, the bottom 212, the side portion 214, the processing unit 216, the sensing element 220, the deformable portion 222, the elastic colloid 230, the bonding wire The arrangement and action of the 240 is similar to that of the seat 110, the recess 110a, the bottom 112, the side portion 114, the processing unit 116, the sensing element 120, the deformable portion 122, the elastic colloid 130, and the bonding wire 140 of FIGS. 1A to 1C. Configuration and mode of operation, which will not be described here. The force sensor 200 is different from the force sensor 100 in that the force sensor 200 further includes a pressing member 250 disposed on the elastic colloid 230 and adapted to be pressed by the user's pressing force. The colloid 230 causes the elastic colloid 230 to elastically deform. With this arrangement, the elastic colloid 230 and the sensing component 220 can be further protected by the pressing member 250, and the size and shape of the pressing member 250 can be designed according to requirements to effectively receive and transmit the pressing force.

In the embodiment shown in FIGS. 2A and 2B, the pressing member 250 includes a cover 252 that contacts the elastic colloid 230. The material of the cover 252 is, for example, glass, metal or other suitable material, which is not limited in the present invention. The width of the cover 252 is greater than the width of the elastic colloid 230, so that the cover 252 can completely cover the top of the elastic colloid 230, and it is avoided that the top surface area of the elastic colloid 230 is too small to be pressed. The present invention does not limit the form of the pressing member, and is exemplified as follows.

3A is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. FIG. 3B illustrates the elastic colloid of FIG. 3A being pressed. In the force sensor 300 shown in FIG. 3A and FIG. 3B, the seat body 310, the groove 310a, the bottom portion 312, the side portion 314, the processing unit 316, the sensing element 320, the deformable portion 322, the elastic colloid 330, the bonding wire 340, the pressing member 350, the cover 352 is arranged and operated in a manner similar to the seat 210, the recess 210a, the bottom portion 212, the side portion 214, the processing unit 216, the sensing element 220, the deformable portion 222, and the like. The arrangement and mode of action of the elastic colloid 230, the bonding wire 240, the pressing member 250, and the cover 252 will not be described herein. The force sensor 300 is different from the force sensor 200 in that the pressing member 350 further includes a bump 354 disposed between the cover 352 and the elastic colloid 330 and contacting the elastic colloid 330. The material of the bump 354 is, for example, a plastic, a metal or other suitable material, and the bump 354 and the cover 352 are not integrally formed, for example, but the invention is not limited thereto. The width of the bump 354 is smaller than the width of the elastic colloid 330, so that the pressing force acting on the elastic colloid 330 is concentrated to improve the sensing sensitivity and sensing accuracy of the force sensor 300.

4 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. In the force sensor 400 shown in FIG. 4, the seat body 410, the recess 410a, the bottom portion 412, the side portion 414, the sensing element 420, the deformable portion 422, the elastic colloid 430, the bonding wire 440, the pressing member 450, and the cover The body 452 and the protrusion 454 are arranged and operated in a manner similar to the seat body 310, the groove 310a, the bottom portion 312, the side portion 314, the sensing element 320, the deformable portion 322, the elastic colloid 330, and the bonding wire 340 of FIGS. 3A and 3B. The arrangement and mode of action of the pressing member 350, the cover 352, and the bump 354 are not described herein again. The strength sensor 400 is different from the power sensor 300 in that the cover 452 and the protrusion 454 are made of metal and are integrally formed. The base 410 has a grounding end 410b, and the cover 452 is electrically connected. To ground terminal 410b. Thereby, the cover 452 can shield electromagnetic waves from outside the force sensor 400, and the sensing element 420 is prevented from being interfered by electromagnetic waves, so that it has better electromagnetic compatibility (EMC).

In detail, the cover 452 of the embodiment is connected to the top end of the side portion 414 of the base 410 by a conductive adhesive 452a. The base 410 has a conductive line 410c therein, and the conductive line 410c extends along the side portion 414 to be connected to Between the conductive paste 452a and the ground end 410b, the cover 452 can be electrically connected to the ground end 410b. When the base 410 is disposed on the circuit board of the electronic device, the ground end 410b can be connected to the ground layer of the circuit board to achieve a grounding effect.

The present invention does not limit the manner in which the sensing elements and processing units are configured. For example, in addition to the processing unit 116 being used to carry the sensing element 120 as shown in FIG. 1B, the processing unit may be disposed without the processing unit as shown in FIG. 4, and the sensing element 420 is directly carried by the bottom 412 of the base 410, and The sensing element 420 is directly electrically connected to the bottom 412 of the base 410 by a bonding wire 440. Other configurations of the sensing elements and processing units are illustrated below by way of illustration.

Figure 5 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. In the power sensor 500 shown in FIG. 5, the configuration of the seat body 510, the groove 510a, the bottom portion 512, the side portion 514, the processing unit 516, the sensing element 520, the deformable portion 522, the elastic colloid 530, and the bonding wire 540 The arrangement and function of the seat body 110, the recess 110a, the bottom portion 112, the side portion 114, the processing unit 116, the sensing element 120, the deformable portion 122, the elastic colloid 130, and the bonding wire 140 of FIG. 1A to FIG. 1C are similar to those of FIG. 1A to FIG. The method will not be described here. The power sensor 500 is different from the power sensor 100 in that the sensing element 520 is not disposed on the processing unit 516 , and the sensing element 520 is disposed on the bottom 512 of the base 510 and located on one side of the processing unit 516 .

Figure 6 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. In the power sensor 600 shown in FIG. 6, the arrangement of the seat body 610, the recess 610a, the bottom portion 612, the side portion 614, the processing unit 616, the sensing element 620, the deformable portion 622, and the elastic colloid 630 are similar in function and manner. The arrangement and function of the seat body 510, the recess 510a, the bottom portion 512, the side portion 514, the processing unit 516, the sensing element 520, the deformable portion 522, and the elastic colloid 530 of FIG. 5 are not described herein again. The power sensor 600 is different from the power sensor 500 in that the processing unit 616 and the sensing component 620 are not electrically connected by a bonding wire, and the processing unit 616 and the sensing component 620 are connected by a solder ball 640. The bottom 612 of the body 610. In addition, the solder ball 640 located on the lower side of the sensing element 620 is connected to the piezoresistive material on the upper side of the sensing element 620 by the conductive via 640a penetrating the sensing element 620.

Figure 7 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. In the power sensor 700 shown in FIG. 7, the configuration of the seat body 710, the recess 710a, the bottom portion 712, the side portion 714, the processing unit 716, the sensing element 720, the deformable portion 722, the elastic colloid 730, and the solder ball 740 Similar to the mode of action, the arrangement of the seat 610, the recess 610a, the bottom 612, the side portion 614, the processing unit 616, the sensing element 620, the deformable portion 622, the elastic colloid 630, and the solder ball 640 of FIG. This will not be repeated here. The difference between the force sensor 700 and the force sensor 600 is that the deformable portion 722 of the sensing element 720 is configured to face the bottom 712 of the base 710 such that the sensing element 720 can be soldered without the need for a conductive via. Ball 740 connects the piezoresistive material of sensing element 720.

Figure 8 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. In the power sensor 800 shown in FIG. 8, the base 810, the groove 810a, the bottom 812, the side portion 814, the sensing element 820, the deformable portion 822, the elastic colloid 830, the solder ball 840, and the conductive through hole 840a The arrangement and action mode of the seat body 610, the groove 610a, the bottom portion 612, the side portion 614, the sensing element 620, the deformable portion 622, the elastic colloid 630, the solder ball 640, and the conductive through hole 640a are similar to those of FIG. This will not be repeated here. The power sensor 800 differs from the power sensor 600 in that the power sensor 800 does not have a processing unit.

Figure 9 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. In the power sensor 900 shown in FIG. 9, the arrangement of the seat 910, the recess 910a, the bottom 912, the side portion 914, the sensing element 920, the deformable portion 922, the elastic colloid 930, and the solder ball 940 are similar in function and operation. The arrangement and function of the base 710, the recess 710a, the bottom 712, the side portion 714, the sensing element 720, the deformable portion 722, the elastic colloid 730, and the solder ball 740 of FIG. 7 are not described herein again. The power sensor 900 differs from the power sensor 700 in that the power sensor 900 does not have a processing unit.

The manufacturing process of the power sensor of the present invention will be exemplified below by way of drawings. 10A to 10E are flowcharts showing the manufacture of a power sensor according to an embodiment of the present invention. First, a body 1010 is provided as shown in FIG. 10A. Next, as shown in FIG. 10B, a sensing element 1020 is disposed on the base 1010 such that the sensing element 1020 is located in a recess 1010a of the base 1010. The sensing element 1020 and the body 1010 are connected by at least one bonding wire 1040 as shown in FIG. 10C. As shown in FIG. 10D, the elastic colloid 1030 is filled in the recess 1010a of the base 1010, so that the elastic colloid 1030 covers the sensing component 1020 and the bonding wire 1040. Further, the bumps 1054 may be disposed on the elastic colloid 1030 as shown in FIG. 10E. The arrangement and function of the seat body 1010, the sensing element 1020, the elastic colloid 1030, the bonding wire 1040, and the bump 1054 are similar to the arrangement of the seat body, the sensing component, the elastic colloid, the bonding wire, and the bump of the foregoing embodiment. The mode of action will not be described here. In addition, in the manufacturing flow of FIGS. 10A to 10E, the configuration of the solder balls and the conductive vias instead of the bonding wires may be replaced to form a force sensor similar to the embodiment shown in FIG. 8 or 9.

11A to 11C are flowcharts showing the manufacture of a power sensor according to another embodiment of the present invention. The manufacturing process shown in FIGS. 11A to 11C is different from the manufacturing flow shown in FIGS. 10D to 10E in that a small amount of elastic colloid 1130 is first filled in the groove 1110a of the seat body 1110 to be covered as shown in FIG. 11A. The sensing component 1120 and the bonding wire 1140 are then placed on the elastic colloid 1130 as shown in FIG. 11B, and then further filled with the elastic colloid 1130 to the recess 1110a of the housing 1110 as shown in FIG. 11C to make the convex Block 1154 is partially embedded in elastomeric colloid 1130. The arrangement and function of the seat body 1110, the sensing element 1120, the elastic colloid 1130, the bonding wire 1140, and the bump 1154 are similar to the arrangement of the seat body, the sensing component, the elastic colloid, the bonding wire, and the bump of the foregoing embodiment. The mode of action will not be described here.

12A through 12C are flowcharts showing the manufacture of a power sensor according to another embodiment of the present invention. The manufacturing process shown in FIGS. 12A to 12C is different from the manufacturing flow shown in FIGS. 10D to 10E in that the seat body 1210 provided as shown in FIG. 12A includes only the bottom portion 1212, and then the seat body as shown in FIGS. 12B and 12C. The sensing element 1220 and the bonding wire 1240 are sequentially disposed on the bottom portion 1212 of the 1210, and then the side portion as shown in FIG. 10B is formed on the bottom portion 1212 of the housing 1210, and the manufacturing process of the subsequent filling of the elastic colloid is performed. The arrangement and function of the seat body 1210, the sensing component 1220, and the bonding wire 1240 are similar to those of the seat body, the sensing component, and the bonding wire of the foregoing embodiment, and details are not described herein again.

In all of the above embodiments, the elastic colloid may be made of a single type of glue. However, the invention is not limited thereto. The material of the elastic colloid may include a plurality of rubber materials, that is, the groove of the seat body may be filled with one or more kinds of rubber materials to adjust the elasticity of the elastic colloid according to requirements. In addition, the bonding wire can be protected by a glue material, which will be exemplified by the following figures.

13A to 13B are flowcharts showing the manufacture of a power sensor according to another embodiment of the present invention. The manufacturing process shown in FIGS. 13A to 13B differs from the manufacturing flow shown in FIGS. 10D to 10E in that, after the sensing element 1320 and the bonding wire 1340 are disposed on the housing 1310 as shown in FIG. 13A, the bonding wire 1340 is further disposed. A protective adhesive 1360 is disposed at a junction with the sensing element 1320 and a junction of the bonding wire 1340 and the seat 1310 such that the protective adhesive 1360 covers the end of the bonding wire 1340. Then, the elastic colloid 1330 is filled into the recess 1310a of the seat 1310 as shown in FIG. 13B, so that the protective rubber 1360 can be regarded as a part of the elastic colloid 1330, that is, the elastic colloid includes two kinds of rubber. The arrangement and action mode of the seat body 1310, the sensing component 1320, the elastic colloid 1330, and the bonding wire 1340 are similar to those of the seat body, the sensing component, the elastic colloid, and the bonding wire of the foregoing embodiment, and no longer Narration.

Figure 14 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. The difference between the embodiment shown in FIG. 14 and the embodiment shown in FIG. 13B is that the protective adhesive 1360' covers the other end of the bonding wire 1340 in addition to the end of the bonding wire 1340 to more completely match the bonding wire 1340. Protect.

In summary, the force sensor of the present invention utilizes an elastic colloid to cover the sensing element, so that the sensing element is well protected, thereby preventing the sensing element from being exposed and being easily worn out. By the elastically deformable property of the elastic colloid, the pressing force acting on the elastic colloid can be smoothly transmitted to the sensing element along with the deformation of the elastic colloid, so that the sensing element can accurately sense the pressing force. In addition, a pressing member may be disposed on the elastic colloid to further protect the elastic colloid and the sensing component, and the size and shape of the pressing member may be designed according to requirements to effectively receive and transmit the pressing force. Further, the top of the elastic colloid may be designed to protrude beyond the groove of the seat body so that the pressing force can be smoothly transmitted to the elastic colloid.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

100, 200, 300, 400, 500, 600, 700, 800, 900‧‧‧ power sensors
110, 210, 310, 410, 510, 610, 710, 810, 910, 1010, 1110, 1210, 1310‧‧‧
110a, 210a, 310a, 410a, 510a, 610a, 710a, 810a, 910a, 1010a, 1110a, 1310a ‧ ‧ grooves
112, 212, 312, 412, 512, 612, 712, 812, 912, 1212‧‧‧ bottom
114, 214, 314, 414, 514, 614, 714, 814, 914‧‧‧ side
116, 216, 316, 516, 616, 716‧ ‧ processing units
120, 220, 320, 420, 520, 620, 720, 820, 920, 1020, 1120, 1220, 1320‧‧‧ sensing elements
122, 222, 322, 422, 522, 622, 722, 822, 922‧‧‧ deformable parts
130, 230, 330, 430, 530, 630, 730, 830, 930, 1030, 1130‧‧‧ Elastomeric colloid
140, 240, 340, 440, 540, 1040, 1240, 1340‧‧‧ welding wire
250, 350, 450‧‧‧ press parts
252, 352, 452‧‧ ‧ cover
354, 454, 1054, 1154‧‧ ‧ bumps
410b‧‧‧ Grounding terminal
410c‧‧‧Electrical circuit
452a‧‧‧Conductive adhesive
640, 740, 840, 940‧‧ ‧ solder balls
640a, 840a‧‧‧ conductive through holes
1360, 1360'‧‧‧Protective rubber
F‧‧‧ Press pressure

1A is a top plan view of a power sensor in accordance with an embodiment of the present invention. Figure 1B is a cross-sectional view of the force sensor of Figure 1A taken along line I-I. FIG. 1C illustrates the elastic colloid of FIG. 1B being pressed. 2A is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. 2B illustrates the elastic gel of FIG. 2A being pressed. 3A is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. FIG. 3B illustrates the elastic colloid of FIG. 3A being pressed. 4 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. Figure 5 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. Figure 6 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. Figure 7 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. Figure 8 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. Figure 9 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention. 10A to 10E are flowcharts showing the manufacture of a power sensor according to an embodiment of the present invention. 11A to 11C are flowcharts showing the manufacture of a power sensor according to another embodiment of the present invention. 12A through 12C are flowcharts showing the manufacture of a power sensor according to another embodiment of the present invention. 13A to 13B are flowcharts showing the manufacture of a power sensor according to another embodiment of the present invention. Figure 14 is a cross-sectional view of a power sensor in accordance with another embodiment of the present invention.

100‧‧‧Power Sensor

110‧‧‧ body

110a‧‧‧ Groove

112‧‧‧ bottom

114‧‧‧ side

116‧‧‧Processing unit

120‧‧‧Sensor components

122‧‧‧Deformable Department

130‧‧‧elastic colloid

140‧‧‧welding line

Claims (22)

A force sensor includes: a body; a sensing component disposed on the body and electrically connected to the body; an elastic colloid disposed on the body and covering the sensing component; a pressing member disposed on the elastic colloid and adapted to be pressed to press the elastic colloid to elastically deform the elastic colloid, wherein the sensing component is adapted to sense elastic deformation of the elastic colloid to generate a sensing signal . The force sensor of claim 1, wherein the pressing member comprises a cover having a width greater than a width of the elastic colloid. The force sensor of claim 2, wherein the cover contacts the elastic colloid. The force sensor of claim 2, wherein the pressing member further comprises a protrusion having a width smaller than a width of the elastic colloid, the protrusion being disposed on the cover body and the elastic colloid And contact the elastic colloid. The force sensor of claim 4, wherein the bump is partially embedded in the elastic colloid. The power sensor of claim 2, wherein the cover is made of metal, and the base has a grounding end, and the cover is electrically connected to the ground. The power sensor of claim 6, wherein the cover is connected to the base by a conductive adhesive, the base has a conductive circuit, and the conductive circuit is connected to the conductive adhesive and the ground. Between the ends. The power sensor of claim 1, wherein the body comprises a processing unit, the processing unit being electrically connected to the sensing element. The force sensor of claim 1, wherein the elastic colloid comprises a plurality of glue materials. The force sensor of claim 9, comprising at least one bonding wire, wherein the sensing component is connected to the body by the bonding wire, and one of the rubber materials covers the bonding wire At least one end. The force sensor of claim 1, wherein the seat body has a recess, the sensing element and the elastic colloid are disposed in the recess, and the top of the elastic colloid protrudes from the recess Externally, recessed within the groove or flush with the open end of the groove. A force sensor includes: a body having a recess; a sensing component disposed in the recess and electrically connected to the base; and an elastic colloid disposed in the recess and covered The sensing element, wherein a top of the elastic colloid protrudes beyond the groove and is adapted to be subjected to a force to elastically deform the elastic colloid, and the sensing element is adapted to sense elastic deformation of the elastic colloid to generate a sensing Signal. The force sensor of claim 12, comprising a pressing member, wherein the pressing member is disposed on the elastic colloid and is adapted to be pressed to press the elastic colloid to elastically deform the elastic colloid. The force sensor of claim 13, wherein the pressing member comprises a cover having a width greater than a width of the elastic colloid. The force sensor of claim 14, wherein the cover contacts the elastic colloid. The force sensor of claim 14, wherein the pressing member further comprises a protrusion having a width smaller than a width of the elastic colloid, wherein the protrusion is disposed on the cover body and the elastic colloid And contact the elastic colloid. The force sensor of claim 16, wherein the bump is partially embedded in the elastic colloid. The power sensor of claim 14, wherein the cover is made of metal, and the base has a grounding end, and the cover is electrically connected to the ground. The power sensor of claim 18, wherein the cover is connected to the base by a conductive adhesive, the base has a conductive line, and the conductive line is connected to the conductive adhesive and the ground Between the ends. The power sensor of claim 12, wherein the body comprises a processing unit, the processing unit being electrically connected to the sensing element. The force sensor of claim 12, wherein the material of the elastic colloid comprises a plurality of glue materials. The force sensor of claim 21, comprising at least one bonding wire, wherein the sensing component is connected to the body by the bonding wire, and one of the rubber materials covers the bonding wire At least one end.