TWI610067B - Low-cost pressure sensor manufacturing method and structure thereof - Google Patents

Abstract

This creation provides a low-cost pressure sensor structure and measurement method, using copper, aluminum or its alloy instead of indium tin oxide (ITO), silver, etc. as the material of the conductive layer, and the conductive layer is specially heat treated A copper oxide film or an aluminum oxide film having a thickness of not more than 15 nanometers (nm) is formed on the surface, and the copper oxide film or the aluminum oxide film can provide the effect of an insulating layer. In addition, the creation also changes the stacking method, using the substrate originally used for carrying as a water vapor barrier and protection layer, which can improve the environmental testing ability, eliminate the sealing process and reduce the production cost.

Description

Manufacturing method and structure of low-cost pressure sensor

The invention relates to a method for manufacturing a low-cost pressure sensor and a structure thereof, particularly to a method for manufacturing a pressure sensor using copper, aluminum or an alloy thereof that has undergone special heat treatment as a conductive layer material and reducing the number of structural layers. And its structure.

In today's various consumer electronics markets, portable electronic products such as personal digital assistants (PDAs), mobile phones, notebooks and tablet PCs have been widely used The touch panel is used as an interface tool for data communication.

In recent years, a pressure sensor that can be used to detect the amount of pressure has been favored for providing users with more experience. There are two ways to integrate pressure sensing in current touch display devices. The first is to affix a first pressure sensing electrode under the backlight module of the liquid crystal display panel and a second pressure sensing electrode inside the frame of the backlight module. The amount of stress. Another pressure-sensing electrode structure uses the Vcom electrode of the liquid crystal panel as the first pressure-sensing electrode, and a second pressure-sensing electrode is laminated inside the frame of the backlight module to measure the outside according to the change in distance between the two sensing electrodes. The amount of stress. However, considering the perforation design of the frame mechanism, at the present stage, the middle frame mechanism cannot be designed without perforation. In order to prevent the pressure sensor from being interfered by external signals, a new shielding layer is bound to isolate external signals. At present, the design method of the shielding layer is: directly attach a shielding layer on the pressure sensing electrode of the middle frame or fabricate a shielding layer under the pressure sensing electrode. The material of the shielding layer can be ITO film or screen printed with metallic silver. The conductive layer substrate, however, the manufacturing cost of indium tin oxide (ITO) is relatively high, and the method of using screen-printed silver wires for its front circuit will have a problem of too high manufacturing cost for a large area pressure sensor. , Does not meet the trend of thin and light touch panels. Please refer to FIG. 1, FIG. 2 and FIG. 3. The pressure sensing electrode structure currently arranged on the middle frame includes single side, double side and double film (F / F). Schematic diagram of pressure sensor structure. The touch panel mainly uses the internal pressure sensor to achieve the touch effect. Taking the unilateral pressure sensor 1 as an example, its structure includes: an adhered layer 11, an adhesive layer 12, and a substrate layer 13. , Conductive layer 14, insulating spacer layer 15, induction circuit layer 16, and protective layer 17. Taking the double-layer pressure sensor 1a as an example, its structure sequentially includes: an adhered layer 11a, an adhesive layer 12a, a conductive layer 14a, a substrate layer 13a, an induction circuit layer 16a, and a protective layer 17a. Taking the double film (F / F) pressure sensor 2 as an example, its structure includes: an adhered layer 21, an adhesive layer 22, a substrate layer 23, a conductive layer 24, an adhesive layer 22a, and a substrate layer. 23a, an induction circuit layer 26, and a protective layer 27.

The purpose of this creation is to improve the problem that the manufacturing cost of the touch panel with pressure sensing function mentioned in the prior art is too high. In order to achieve the above purpose, this creation is achieved by the following technical means. Among them, this creation provides a low-cost pressure sensor manufacturing method, including the following steps: a. Provide an adhesive layer, an adhesive, and a conductive Layer, an insulating spacer layer, an induction circuit layer, and a substrate layer. The conductive layer and the induction circuit layer are made of copper or aluminum material. b. Applying the adhesive on the adhered layer to form an adhesive layer. c. A heat treatment is performed on the conductive layer to produce a copper oxide film or an aluminum oxide film on the surface of the conductive layer. d. connecting the conductive layer and the adhesive layer. e. Plating the insulating spacer layer on the conductive layer. f. The induction circuit layer is subjected to a heat treatment to produce a copper oxide film or an aluminum oxide film on the surface layer of the induction circuit layer. g. Paste the induction circuit layer on the insulating spacer layer. h. Connect the substrate layer to the induction circuit layer.

This creation also provides a low-cost pressure sensor structure, including: an adhered layer, an adhesive layer, a conductive layer, an insulating spacer layer, an induction circuit layer, and a substrate layer. The adhesive layer is connected to the adhered layer, the conductive layer is connected to the adhesive layer, the conductive layer is made of copper or aluminum material, and its surface layer has a copper oxide film or an aluminum oxide film. The insulation spacer layer is connected to the conductive layer, the induction circuit layer is connected to the insulation spacer layer, the induction circuit layer is made of copper or aluminum material, and its surface layer has a copper oxide film or an aluminum oxide film. And the substrate layer is connected to the induction circuit layer.

The present invention also provides a method for manufacturing a low-cost pressure sensor, including the following steps: a. Providing an adhered layer, an adhesive, a conductive layer, a first substrate layer, a sensing circuit layer, and a second The substrate layer, the conductive layer and the induction circuit layer are made of copper or aluminum material. b. Applying the adhesive on the adhered layer to form a first adhesive layer. c. A heat treatment is performed on the conductive layer to produce a copper oxide film or an aluminum oxide film on the surface of the conductive layer. d. connecting the conductive layer with the first adhesive layer. e. Connect the first substrate layer and the conductive layer. f. applying the adhesive on the first substrate layer to form a second adhesive layer. g. The induction circuit layer is subjected to a heat treatment to produce a copper oxide film or an aluminum oxide film on the surface layer of the induction circuit layer. h. Connect the sensing circuit layer and the second adhesive layer. i. Connect the second substrate layer and the induction circuit layer.

The creation also provides a low-cost pressure sensor structure, including: an adhered layer, a first adhesive layer, a conductive layer, a first substrate layer, a second adhesive layer, a sensing circuit layer, and A second substrate layer. The first adhesive layer is connected to the adhered layer, the conductive layer is connected to the adhesive layer, the conductive layer is made of copper or aluminum material, and its surface layer has a copper oxide film or an aluminum oxide film. The first substrate layer is connected to the conductive layer, and the second adhesive layer is connected to the first substrate layer. The induction circuit layer is connected to the second adhesive layer. The induction circuit layer is made of copper or aluminum material, and its surface layer has a copper oxide film or an aluminum oxide film. The second substrate layer is connected to the induction circuit layer.

In order to achieve the above-mentioned purpose and effect, the technical means and structure used in this creation, here are some details about the features and functions of the preferred embodiment of this creation. I fully understand it, but it must be noted that these contents are not This constitutes the limitation of the present invention.

Please refer to FIG. 4 and FIG. 5 at the same time, which are flowcharts and structural diagrams of a manufacturing method of the first embodiment of creating a low-cost pressure sensor. The first embodiment of the present invention provides a single-side low-cost pressure sensor 3. The method for manufacturing the low-cost pressure sensor 3 includes the following steps:

Step 110: providing an adhered layer 31, an adhesive, a conductive layer 34, an insulation layer 35, a sensor layer 36, and a substrate层 (substrate) 33. Adhesive layers, adhesives, conductive layers, insulating spacer layers, induction circuit layers, and substrate layers commonly used in pressure sensor manufacturing processes are provided. The adhesive layer 31 may be a middle frame structure of the sensor. The conductive layer 34 and the induction circuit layer 36 are made of a copper or aluminum material, and the substrate layer 33 is made of a non-light-transmitting material, and there are no other added layers. The adhesive is an optically clear adhesive (OCA), an optically clear resin (OCR), or a combination thereof.

Step 120: Apply the adhesive on the adhered layer 31 to form an adhesive layer 32. The adhesive is coated on the adhered layer 31 to form an adhesive layer 32.

Step 130: The conductive layer 34 is subjected to a heat treatment (not shown). Since copper and aluminum metals are susceptible to oxidative reactions with oxygen and form copper oxide or aluminum oxide on the surface, a special heat treatment of the conductive layer 34 can form a copper oxide film or an aluminum oxide film on the surface of the conductive layer 34 The copper oxide film or the aluminum oxide film can protect the copper or aluminum inside from the external gas.

Step 140: Connect the conductive layer 34 and the adhesive layer 32. One side of the conductive layer 34 after the heat treatment is connected to the adhesive layer 32.

Step 150: The insulating spacer layer 35 is plated on the conductive layer 34. The insulating spacer layer 35 is plated on the other side of the conductive layer 34. The insulating spacer layer 35 may be a thin film made of a material such as acrylic and / or epoxy resin.

Step 160: The induction circuit layer 36 is subjected to a heat treatment. By subjecting the induction circuit layer 36 to a special heat treatment, a copper oxide film or an aluminum oxide film can be formed on the surface of the induction circuit layer 36. The copper oxide film or the aluminum oxide film can protect the copper or aluminum inside it Outside gas erosion.

Step 170: Paste the induction circuit layer 36 on the insulating spacer layer 35. The induction circuit layer 36 is plated on the other side of the insulating spacer layer 35.

Step 180: Connect the substrate layer 33 and the induction circuit layer 36. The substrate layer 33 is connected to the induction circuit layer 36 by a plating technique.

Through the above manufacturing method, this creation provides a single-side low-cost pressure sensor structure, including: the adhered layer 31, the adhesive layer 32, the conductive layer 34, the insulating spacer layer 35, the The induction circuit layer 36 and the base material layer 33. From bottom to top, the adhered layer 31, the adhesive layer 32, the conductive layer 34, the insulating spacer layer 35, the inductive circuit layer 36, and the substrate layer 33 have a five-layer structure.

The conductive layer 34 and the induction circuit layer 36 are made of copper or aluminum. The surface layers of the conductive layer 34 and the induction circuit layer 36 have a copper oxide film or an aluminum oxide film, the copper oxide film or an oxide. The thickness of the aluminum film is not more than 15 nanometers (nm). The weight percentage of the copper or aluminum material in the conductive layer 34 is not less than 70%, the thickness of the conductive layer 34 is not more than 0.1 micrometer (µm), the surface impedance per unit area is not more than 15 ohms (Ω), and the surface energy of the coating is not more than 40 Dyne. The weight percentage of the copper or aluminum material in the induction circuit layer 36 is not less than 70%, the thickness of the induction circuit layer 36 is not more than 1 micrometer (µm), the surface impedance per unit area is not more than 50 ohms (Ω), and all light is transmitted. The degree is not more than 10%, and the surface energy of the coating is not more than 40 dyne.

Please refer to FIG. 6 and FIG. 7 at the same time, which are flowcharts and structural diagrams of a manufacturing method of the second embodiment of creating a low-cost pressure sensor. The second embodiment of the present invention provides a dual-film (F / F) low-cost pressure sensor 4. The manufacturing method of the low-cost pressure sensor 4 includes the following steps:

Step 210: Provide an adhered layer 41, an adhesive, a conductive layer 44, a first substrate 43, a sensor layer 46, and a first layer. Two substrate layers 43a. Provided are an adhesive layer, an adhesive, a conductive layer, an insulating spacer layer, an induction circuit layer, and a substrate layer commonly used in a pressure sensor manufacturing process. The adhesive layer 41 may be a middle frame structure of the sensor. The conductive layer 44 and the induction circuit layer 46 are made of a copper or aluminum material, the first base material layer 43 and the second base material layer 43a are made of a non-transparent material, and there are no other added layers. The adhesive is an optically clear adhesive (OCA), an optically clear resin (OCR), or a combination thereof.

Step 220: Apply the adhesive on the adhered layer 41 to form a first adhesive layer 42. The adhesive is coated on the adhered layer 41 to form a first adhesive layer 42.

Step 230: A heat treatment is performed on the conductive layer 44. Since copper and aluminum metals are susceptible to oxidative reaction with oxygen and form copper oxide or aluminum oxide on the surface, a special heat treatment of the conductive layer 44 can form a copper oxide film or an aluminum oxide film on the surface of the conductive layer 44. The copper oxide film or the aluminum oxide film can protect the copper or aluminum inside from the external gas.

Step 240: Connect the conductive layer 44 to the first adhesive layer 42. One side of the conductive layer 44 after the heat treatment is connected to the first adhesive layer 42.

Step 250: Connect the first substrate layer 43 and the conductive layer 44. The first substrate layer 43 and the conductive layer 44 are connected by a plating technique.

Step 260: Apply the adhesive on the first substrate layer 43 to form a second adhesive layer 42a.

Step 270: The induction circuit layer 46 is subjected to the heat treatment. By subjecting the induction circuit layer 46 to a special heat treatment, a copper oxide film or an aluminum oxide film can be formed on the surface of the induction circuit layer 46. The copper oxide film or the aluminum oxide film can protect the copper or aluminum inside it Outside gas erosion.

Step 280: Connect the sensing circuit layer 46 and the second adhesive layer 42a. The heat-treated induction circuit layer 46 is pasted on the other side of the insulating spacer layer 35.

Step 290: Connect the second substrate layer 43a and the induction circuit layer 46. The second substrate layer 43a is connected to the induction circuit layer 46 by a plating technique.

Through the above manufacturing method, the present invention provides a dual-film (F / F) low-cost pressure sensor structure, including: the adhered layer 41, the first adhesive layer 42, the conductive layer 44, and the first substrate. The material layer 43, the second adhesive layer 42a, the induction circuit layer, and the second base material layer 43a. From bottom to top, the adhered layer 41, the first adhesive layer 42, the conductive layer 44, the first substrate layer 43, the second adhesive layer 42a, the induction circuit layer 46, and the first The two base material layers 43a have a total of six layers.

The conductive layer 44 and the induction circuit layer 46 are made of copper or aluminum. The surface layers of the conductive layer 44 and the induction circuit layer 46 include a copper oxide film or an aluminum oxide film, the copper oxide film or an oxide. The thickness of the aluminum film is not more than 15 nanometers (nm). The weight percentage of copper or aluminum material in the conductive layer 44 is not less than 70%, the thickness of the conductive layer 44 is not more than 0.1 micrometer (µm), the surface impedance per unit area is not more than 15 ohms (Ω), and the surface energy of the coating is not more than 40 Dyne. The weight percentage of the copper or aluminum material in the induction circuit layer 46 is not less than 70%, the thickness of the induction circuit layer 46 is not more than 1 micrometer (µm), the surface impedance per unit area is not more than 50 ohms (Ω), and all light is transmitted. The degree is not more than 10%, and the surface energy of the coating is not more than 40 dyne.

Based on the above, it can be seen that this creation reveals a method and structure for manufacturing a low-cost pressure sensor. A base material layer made of a non-transparent material and no other added layers is used to replace the transparent material, which can reduce the material cost. . And it is simplified from a six-layer structure to a five-layer structure during single side stacking, and a seven-layer structure to a six-layer structure during F / F stacking, which can save the sealing process and simplify the overall structure to achieve the whole. The effect of process simplification and cost reduction.

After the above detailed description, it has been fully shown that this creation has a progressive nature for implementation, and it is a new creation that has not been seen before, which fully complies with the requirements of the invention patent, and has filed an application in accordance with the law. However, the above is only a preferred embodiment of the present invention. When it cannot be used to limit the scope of the implementation of the invention, that is, equal changes and modifications made in accordance with the scope of the invention patent should all fall within the scope of the invention patent. .

1,1a, 2,3,4‧‧‧‧ Pressure sensor
11,11a, 21,31,41‧‧‧ Adhesive layer
12,12a, 22,22a, 32,42,42a‧‧‧Adhesive layer
13,13a, 23,23a, 33,43,43a‧‧‧ substrate layer
14,14a, 24,34,44‧‧‧conductive layer
15,35‧‧‧Insulation spacer
16,16a, 26,36,46‧‧‧Inductive circuit layer
17,17a, 27‧‧‧protective layer
110 ~ 180,210 ~ 290‧‧‧step

Fig. 1 is a schematic diagram of a prior art single side pressure sensor. Fig. 2 is a schematic diagram of a prior art double side pressure sensor. Fig. 3 is a prior art double film (F / F) pressure. Schematic diagram of the structure of the sensor; Figure 4 is a flowchart of the manufacturing method of the first embodiment of the low-cost pressure sensor; Figure 5 is a schematic diagram of the structure of the first embodiment of the low-cost pressure sensor; Figure 6 is A flowchart of a method for manufacturing a second embodiment of a low-cost pressure sensor according to the present invention; FIG. 7 is a schematic structural diagram of a second embodiment of creating a low-cost pressure sensor.

110 ~ 180‧‧‧step

Claims (10)

A low-cost pressure sensor manufacturing method includes the following steps: providing an adhered layer, an adhesive, a conductive layer, an insulating spacer layer, a sensing circuit layer, and a substrate layer, the conductive layer and the sensing layer The circuit layer is made of copper or aluminum material; the adhesive is coated on the adhered layer to form an adhesive layer; the conductive layer is subjected to a heat treatment to produce a copper oxide film or a surface layer on the conductive layer. Alumina film; connecting the conductive layer with the adhesive layer; plating the insulating spacer layer on the conductive layer; subjecting the induction circuit layer to a heat treatment to produce a copper oxide film or a surface layer on the induction circuit layer An aluminum oxide film; pasting the induction circuit layer on the insulating spacer layer; and connecting the substrate layer and the induction circuit layer. A low-cost pressure sensor structure includes: an adhered layer; an adhesive layer connected to the adhered layer; a conductive layer connected to the adhesive layer; the conductive layer is made of copper or aluminum material The surface layer has a copper oxide film or an aluminum oxide film; an insulation spacer layer is connected to the conductive layer; an induction circuit layer is connected to the insulation spacer layer, and the induction circuit layer is made of copper or aluminum. The surface layer is made of a copper oxide film or an aluminum oxide film; and a substrate layer is connected to the induction circuit layer. The low-cost pressure sensor structure according to item 2 of the scope of patent application, wherein the thickness of the copper oxide film or an aluminum oxide film is not more than 15 nanometers (nm). The low-cost pressure sensor structure according to item 2 of the scope of patent application, wherein the weight percentage of the copper or aluminum material in the conductive layer is not less than 70%, and the thickness of the conductive layer is not more than 0.1 micrometer (µm). The impedance per unit area is not greater than 15 ohms (Ω), and the surface energy of the coating is not greater than 40 dyne. The low-cost pressure sensor structure according to item 2 of the patent application scope, wherein the weight percentage of the copper or aluminum material in the induction circuit layer is not less than 70%, and the thickness of the induction circuit layer is not more than 1 micrometer (µm). The surface impedance per unit area is not greater than 50 ohms (Ω), the total light transmittance is not greater than 10%, and the surface energy of the coating is not greater than 40 dyne. A method for manufacturing a low-cost pressure sensor includes the following steps: providing an adhered layer, an adhesive, a conductive layer, a first substrate layer, an induction circuit layer, and a second substrate layer; The layer and the induction circuit layer are made of copper or aluminum material; the adhesive is coated on the adhered layer to form a first adhesive layer; the conductive layer is subjected to a heat treatment to produce a surface layer of the conductive layer A copper oxide film or an alumina film; connecting the conductive layer with the first adhesive layer; connecting the first substrate layer with the conductive layer; coating the adhesive on the first substrate Forming a second adhesive layer on the layer; subjecting the induction circuit layer to a heat treatment to produce a copper oxide film or an aluminum oxide film on the surface layer of the induction circuit layer; and inducing the induction circuit layer to the second adhesive layer Connecting; and connecting the second substrate layer and the induction circuit layer. A low-cost pressure sensor structure includes: an adhered layer; a first adhesive layer connected to the adhered layer; a conductive layer connected to the adhesive layer; the conductive layer is copper or aluminum Made of material, the surface layer of which has a copper oxide film or an aluminum oxide film; a first substrate layer connected to the conductive layer; a second adhesive layer connected to the first substrate layer; An induction circuit layer is connected to the second adhesive layer. The induction circuit layer is made of copper or aluminum material, and its surface layer has a copper oxide film or an aluminum oxide film; and a second substrate layer is connected with the second substrate layer. The induction circuit layers are connected. The low-cost pressure sensor structure according to item 7 of the scope of patent application, wherein the thickness of the copper oxide film or an aluminum oxide film is not more than 15 nanometers (nm). The low-cost pressure sensor structure described in item 7 of the scope of the patent application, wherein the weight percentage of the copper or aluminum material in the conductive layer is not less than 70%, and the thickness of the conductive layer is not more than 0.1 micrometer (µm). The impedance per unit area is not greater than 15 ohms (Ω), and the surface energy of the coating is not greater than 40 dyne. The low-cost pressure sensor structure according to item 7 of the scope of patent application, wherein the weight percentage of the copper or aluminum material in the induction circuit layer is not less than 70%, and the thickness of the induction circuit layer is not more than 1 micrometer (µm). The surface impedance per unit area is not greater than 50 ohms (Ω), the total light transmittance is not greater than 10%, and the surface energy of the coating is not greater than 40 dyne.