TWI606917B - Full color 3d printing device - Google Patents
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- 238000007639 printing Methods 0.000 title claims description 43
- 238000006073 displacement reaction Methods 0.000 claims description 62
- 235000012431 wafers Nutrition 0.000 claims description 61
- 239000000843 powder Substances 0.000 claims description 52
- 239000000976 ink Substances 0.000 claims description 41
- 238000000465 moulding Methods 0.000 claims description 38
- 239000002131 composite material Substances 0.000 claims description 37
- 230000007246 mechanism Effects 0.000 claims description 34
- 238000000926 separation method Methods 0.000 claims description 23
- 238000010276 construction Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 32
- 239000010410 layer Substances 0.000 description 22
- 238000010146 3D printing Methods 0.000 description 17
- 239000007787 solid Substances 0.000 description 11
- 238000000110 selective laser sintering Methods 0.000 description 9
- 238000000149 argon plasma sintering Methods 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000011165 3D composite Substances 0.000 description 1
- 238000012356 Product development Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Description
本案係關於一種三維全彩複合列印裝置,尤指一種適用於立體快速成型機之三維全彩複合列印裝置。The present invention relates to a three-dimensional full-color composite printing device, and more particularly to a three-dimensional full-color composite printing device suitable for a three-dimensional rapid prototyping machine.
3D列印(3D Printing)成型技術,亦稱為快速成型(Rapid Prrototyping,RP)技術,因快速成型技術具有自動、直接及快速,可精確地將設計思想轉變為具有一定功能的原型或可製造直接使用的零件或成品,從而可對產品設計進行快速的評估,修改及功能試驗,大大縮短產品的開發週期,因而使得3D列印成型技術廣受青睞。3D Printing molding technology, also known as Rapid Prrototyping (RP) technology, is fast, straightforward and fast, and can accurately transform design ideas into functional prototypes or can be manufactured. Directly used parts or finished products, which can quickly evaluate, modify and test the product design, greatly shortening the product development cycle, thus making 3D printing technology popular.
現今3D列印成型技術正處於蓬勃發展之階段,所採用的快速成型技術也各異,目前業界所採用之快速成型技術主要包含下述幾種技術:膠水噴印固化粉末成型(Color-Jet Printing,CJP,或稱Binder Jetting)技術、熔融沉積成型(Fused Deposition Modeling,FDM)技術、雷射燒結固態粉末成型(Stereo Lithography Apparatus,SLA)技術、紫外光固化液態樹脂成型(Multi-Jet Modeling,MJM)技術、或是雷射燒結固態粉末成型(Selective Laser Sintering,SLS)技術等等,但不以此為限。Today's 3D printing and forming technology is in a booming stage, and the rapid prototyping technology used is also different. The rapid prototyping technology currently used in the industry mainly includes the following technologies: Color-Jet Printing , CJP, or Binder Jetting technology, Fused Deposition Modeling (FDM) technology, Stereo Lithography Apparatus (SLA) technology, UV-curable liquid resin molding (Multi-Jet Modeling, MJM) Technology, or Selective Laser Sintering (SLS) technology, etc., but not limited to this.
然前述該等快速成型技術中,除了膠水噴印固化粉末成型(Color-Jet Printing,CJP,或稱Binder Jetting)技術能產生全彩的3D成型物外,其餘3D列印成型技術均無法能製造全彩的產品,因此對被稱為第三次工業革命的3D列印成型技術而言,是一個極大產品技術之缺失,沒有真正全彩的產品,意味著人類的科技又回到一個色彩表現被限制的時代,對3D列印成型產業而言是一個致命缺失。However, in the above rapid prototyping technology, except for the color-Jet Printing (CJP, or Binder Jetting) technology, which can produce full-color 3D moldings, the other 3D printing and molding technologies cannot be manufactured. Full-color products, therefore, for the 3D printing technology known as the third industrial revolution, is a lack of great product technology, no real full-color products, meaning that human technology returns to a color performance The era of restrictions is a fatal flaw for the 3D printing industry.
此技術瓶頸主要是因為3D列印成型技術是利用基層堆疊技術,即如第1圖所示,當欲製造出3D成型物A時,主要係先透過電腦解析A之型態與結構,將之切分為A’所示之複數個疊層,隨後再透過前述等3D列印成型技術,利用逐層印刷並堆疊成型的方式,將A’所示之疊層以XY之軸向進行印刷,再層層堆疊,使其於Z方向進行堆疊,最後會形成如A所示之半圓形之3D成型物。同樣地,如欲進行第2圖所示之錐形瓶狀之3D成型物B,則同樣將B切分為B’所示之複數個疊層,再進行逐層印刷並堆疊成型,從而製造出錐形瓶狀之3D成型物B。然而,在很多3D列印成型技術之所以無法製成全彩3D產品,主要是在逐層堆疊時,缺乏相對應能產生全彩技術的列印頭。This technical bottleneck is mainly because the 3D printing and forming technology utilizes the base layer stacking technology, that is, as shown in Fig. 1, when the 3D molding A is to be manufactured, the main type is first to analyze the type and structure of the A through the computer. The plurality of laminates are divided into A's, and then the laminates indicated by A' are printed in the axial direction of XY by layer-by-layer printing and stacking by the above-mentioned 3D printing and forming techniques. The layers are stacked again so that they are stacked in the Z direction, and finally a semicircular 3D molding as shown in A is formed. Similarly, if the 3D molding B of the conical flask shape shown in Fig. 2 is to be formed, B is also divided into a plurality of laminations shown by B', and then layer-by-layer printing and stack molding are performed to manufacture. A 3D molding B of a conical shape is obtained. However, in many 3D printing and molding technologies, it is impossible to make full-color 3D products, mainly when stacking layer by layer, lacking a print head corresponding to full-color technology.
舉例來說,習知雷射燒結固態粉末成型(Selective Laser Sintering,SLS)技術主要則是在一個成型槽中,逐層鋪上成型原料粉末,並利用雷射光依分層截面輪廓進行掃描燒結,使成型原料粉末的溫度上升至融化點,以使成型原料粉末黏接成一分層結構,並逐層堆疊成一3D成型物。然而於此SLS技術中,由於固態之成型原料粉末僅具有單一的色彩,且在其逐層堆疊的過程中,亦沒有任何裝置可實施全彩之噴印作業,故此SLS技術所製作出的3D成型物亦僅能維持原有固態成型原料粉末之原色,而無法製造出全彩化的3D成型物。For example, the conventional Laser Sintering (SLS) technology mainly involves forming a raw material powder layer by layer in a molding tank, and scanning and sintering the laser beam according to the layered profile. The temperature of the molding raw material powder is raised to a melting point to bond the molding raw material powder into a layered structure, and stacked in layers to form a 3D molding. However, in this SLS technology, since the solid molding raw material powder has only a single color, and in the process of layer-by-layer stacking, there is no device capable of performing full-color printing, so the 3D produced by the SLS technology. The molded product can only maintain the original color of the original solid molding raw material powder, and cannot produce a full-color 3D molded product.
是以,就目前3D列印成型技術裝置之產業而言,其所面臨的技術瓶頸即為全彩表現問題,因此如何使此致命的先前技術之缺失能被改善,是目前3D列印成型產業上迫切需要去解決的主要課題。Therefore, as far as the industry of 3D printing technology devices is concerned, the technical bottleneck faced by them is the full color performance problem. Therefore, how to make this fatal prior art defect can be improved is the current 3D printing and molding industry. The main subject that is urgently needed to be solved.
本案之主要目的在於提供一種可實施全彩化之3D列印之三維全彩複合列印裝置,應用於 雷射燒結固態粉末成型(SLS)技術以 實施全彩化之3D列印,俾可解決目前眾多3D列印成型技術無法製造出全彩化的技術瓶頸。The main purpose of this case is to provide a 3D full-color composite printing device capable of implementing full-color 3D printing, which is applied to laser sintering solid powder molding (SLS) technology to implement full-color 3D printing, which can be solved. At present, many 3D printing and molding technologies cannot create a technical bottleneck for full color.
為達上述目的,本案之一較廣義實施態樣為提供一種全彩複合列印裝置, 適用一建構槽內容置一粒狀粉末成形的一三維成型物,其包含:複數個殼體,具有至少一分離殼體及一其他殼體,每一該殼體具有至少一個空室,且該至少一分離殼體與該其他殼體分離架構於至少一個位移機構上以進行位移;一光源組件,設置於該至少一分離殼體之該空室中,提供一雷射光源;至少一顏色墨水,每一該顏色墨水分別容設於該其他殼體之該至少一空室中;至少一噴墨晶片,每一該噴墨晶片對應設於該其他殼體之一底面,且每一該噴墨晶片均具有複數個噴孔,連通該至少一顏色墨水,並受該至少一噴墨晶片驅動噴出該至少一顏色墨水;以及一成型托盤,架構於該建構槽中,由一升降底座帶動以進行上下位移;其中,該至少一位移機構帶動該分離殼體位移,使該光源組件照射至該粒狀粉末上,並沿著該三維成型物之一分層截面輪廓進行燒結,以成形一單切層,再由該至少一位移機構帶動該其他殼體位移,使設置於該其他殼體內之該至少一噴墨晶片之該複數個噴孔噴出該至少一顏色墨水至該單切層上,復重覆施作以該光源照射燒結成形該粒狀粉末及噴印該顏色墨水於該單切層上,以構造出該三維成型物之一堆疊層,並反覆構造出複數該堆疊層,最終固化成形一全彩化之三維成型物。In order to achieve the above object, one of the more broad aspects of the present invention provides a full-color composite printing device, which is suitable for constructing a three-dimensional shaped object formed by a granular powder, comprising: a plurality of shells having at least a separate housing and a further housing, each of the housings having at least one empty chamber, and the at least one separate housing is separated from the other housings by at least one displacement mechanism for displacement; a light source assembly is disposed Providing a laser light source in the empty chamber of the at least one separation housing; at least one color ink, each of the color inks being respectively accommodated in the at least one empty chamber of the other housing; at least one inkjet wafer, Each of the inkjet wafers is disposed on a bottom surface of the other housing, and each of the inkjet wafers has a plurality of nozzles connected to the at least one color ink and driven by the at least one inkjet wafer to eject the at least one inkjet wafer. a color ink; and a molding tray, which is arranged in the construction groove and driven by a lifting base for up-and-down displacement; wherein the at least one displacement mechanism drives the separation housing to displace the light The source component is irradiated onto the granular powder and sintered along a layered cross-sectional profile of the three-dimensional shaped article to form a single cut layer, and the at least one displacement mechanism drives the other housing to be displaced. The plurality of nozzles of the at least one ink-jet wafer in the other housing eject the at least one color ink onto the single-cut layer, and the multiple-repetitive coating is applied to illuminate and form the granular powder by the light source and print the color The ink is applied to the single-cut layer to construct a stacked layer of the three-dimensional shaped article, and a plurality of the stacked layers are repeatedly formed to finally form a full-color three-dimensional molded product.
1‧‧‧雷射燒結固態粉末成型機1‧‧‧Laser Sintering Solid Powder Forming Machine
2‧‧‧多功能複合列印裝置2‧‧‧Multifunctional composite printing device
20‧‧‧殼體20‧‧‧shell
20a‧‧‧分離殼體20a‧‧‧Separate housing
20b‧‧‧其他殼體20b‧‧‧Other shells
201、201a、201b、201c‧‧‧空室201, 201a, 201b, 201c‧‧ empty room
21‧‧‧光源組件21‧‧‧Light source components
22‧‧‧顏色墨水22‧‧‧Color ink
23‧‧‧噴墨晶片23‧‧‧Inkjet wafer
231‧‧‧底面231‧‧‧ bottom
24‧‧‧成型托盤24‧‧‧Molding tray
25、25a、25b‧‧‧位移機構25, 25a, 25b‧‧‧ displacement mechanism
3‧‧‧基座3‧‧‧Base
31‧‧‧工作平台31‧‧‧Working platform
32‧‧‧供粉槽32‧‧‧ powder supply tank
33‧‧‧建構槽33‧‧‧ Construction trough
34‧‧‧滾輪34‧‧‧Roller
35a、35b‧‧‧升降底座35a, 35b‧‧‧ lifting base
36‧‧‧粒狀粉末36‧‧‧granular powder
37‧‧‧成型物37‧‧‧Molded goods
A、B‧‧‧3D成型物A, B‧‧3D molding
A’、B’ ‧‧‧3D成型物之分層結構Layered structure of A', B' ‧‧3D moldings
第1圖為習知之3D成型物之堆疊分層示意圖。Figure 1 is a schematic diagram of a stacked layer of a conventional 3D molded article.
第2圖為另一習知之3D成型物之堆疊分層示意圖。Figure 2 is a schematic diagram showing the stacking of another conventional 3D molded article.
第3圖為本發明之三維全彩複合列印裝置應用於雷射燒結固態粉末成型機之較佳實施例示意圖。Fig. 3 is a schematic view showing a preferred embodiment of a three-dimensional full-color composite printing device of the present invention applied to a laser-sintered solid powder molding machine.
第4圖為本發明之三維全彩複合列印裝置之位移機構上架構分離殼體及其他殼體之配置示意圖。FIG. 4 is a schematic view showing the arrangement of the structural separation housing and other housings on the displacement mechanism of the three-dimensional full-color composite printing device of the present invention.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化,其皆不脫離本案的範圍,且其中的說明及圖示在本質上係當作說明之用,而非架構於限制本案。Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not to be construed as a limitation.
請參閱第3圖,為本案之三維全彩複合列印裝置應用於雷射燒結固態粉末成型 (SLA)機之較佳實施例示意圖。於本實施例為例,該雷射燒結固態粉末成型 (SLA)機1包含三維全彩複合列印裝置2及基座3等組件,其中該三維全彩複合列印裝置2包含複數個殼體20、一光源組件21、至少一顏色墨水22、至少一噴墨晶片23及一成型托盤24,於基座3之表面上具有工作平台31,且基座3設置有內嵌式之供粉槽32及建構槽33,供粉槽32係鄰設於建構槽33,其中,三維全彩複合列印裝置2之殼體20、光源組件21、顏色墨水22、噴墨晶片23等構件係對應設置於基座3之工作平台31之上方,惟成型托盤24係設置於建構槽33內,且供粉槽32及建構槽33之底面係由活動式之升降底座35a、35b所構成,其可因應驅動裝置(未圖示)之驅動以進行上下往復式之升降作業,藉以分別將供粉槽32及建構槽33內容設之粒狀粉末36進行上下推送,舉例來說,當欲進行雷射燒結固態粉末成型(SLS)作業前,則藉由升降底座35a之上升作業,以將供粉槽32內之粒狀粉末36推送至略高於工作平台31之高度,其後再由滾輪34於工作平台31上進行水平位移之推送作業,進而可將粒狀粉末36推移至鄰設之建構槽33內,此時,建構槽33之升降底座35b則會略為下降,使多三維全彩複合列印裝置2可對建構槽33內的粒狀粉末36進行後續之雷射燒結固態粉末成型(SLS)作業,如此透過供粉槽32及建構槽33彼此獨立之往復式之升降作業,可有效調控粒狀粉末36之供粉及成型作業。Please refer to FIG. 3, which is a schematic diagram of a preferred embodiment of a three-dimensional full-color composite printing device for a laser sintered solid state powder forming (SLA) machine. For example, the laser sintered solid state powder forming (SLA) machine 1 includes a three-dimensional full color composite printing device 2 and a base 3 and the like, wherein the three-dimensional full color composite printing device 2 includes a plurality of shells. 20, a light source assembly 21, at least one color ink 22, at least one inkjet wafer 23 and a molding tray 24, having a working platform 31 on the surface of the base 3, and the base 3 is provided with an in-line powder supply slot 32 and the construction groove 33, the powder supply tank 32 is adjacent to the construction groove 33, wherein the components of the casing 20, the light source assembly 21, the color ink 22, and the inkjet wafer 23 of the three-dimensional full-color composite printing device 2 are correspondingly arranged. Above the working platform 31 of the base 3, the forming tray 24 is disposed in the construction groove 33, and the bottom surface of the powder supply tank 32 and the construction groove 33 is composed of movable lifting bases 35a, 35b, which can be adapted The drive device (not shown) is driven to perform the vertical and downward reciprocating lifting operation, whereby the granular powder 36 provided in the powder supply tank 32 and the construction tank 33 is pushed up and down, for example, when laser sintering is to be performed. Before the solid powder molding (SLS) operation, it is lifted by the base 35a. The lifting operation is performed to push the granular powder 36 in the powder supply tank 32 to a height slightly higher than the working platform 31, and then the horizontal displacement of the roller 34 is performed on the working platform 31, thereby further granulating the powder. 36 is moved into the adjacent construction groove 33. At this time, the lifting base 35b of the construction groove 33 is slightly lowered, so that the multi-three-dimensional full-color composite printing device 2 can follow the granular powder 36 in the construction groove 33. The laser sintered solid powder molding (SLS) operation can effectively regulate the powder supply and molding operation of the granular powder 36 by the reciprocating lifting operation of the powder supply tank 32 and the construction tank 33 independently.
於一些實施例中,粒狀粉末36係為一複合塑膠粉末、一金屬粉末及一複合金屬粉末之至少其中之一,但不以此為限。In some embodiments, the granulated powder 36 is at least one of a composite plastic powder, a metal powder, and a composite metal powder, but is not limited thereto.
於本實施例中,該三維全彩複合列印裝置2之複數個殼體20係可由但不限由金屬材質、塑膠材質、塑膠包覆金屬材質之至少其中之一種材質所構成,且該複數殼體20可區分為至少一分離殼體20a與其他殼體20b,該至少一分離殼體20a與其他殼體20b係彼此分離地設置,且每一殼體20中包含至少一空室201。In this embodiment, the plurality of housings 20 of the three-dimensional full-color composite printing device 2 may be composed of at least one of a metal material, a plastic material, and a plastic coated metal material, and the plural The housing 20 can be divided into at least one separate housing 20a and other housings 20b. The at least one separate housing 20a and the other housing 20b are disposed separately from each other, and each housing 20 includes at least one empty chamber 201.
以本實施例為例,該複數個殼體20區分為一個分離殼體20a與其他殼體20b,該分離殼體20a具有一空室201a,而該其他殼體20b具有二個空室201b、201c,但分離殼體20a與其他殼體20b之空室201之數量並不以此為限。Taking the embodiment as an example, the plurality of housings 20 are divided into a separate housing 20a and another housing 20b. The separation housing 20a has an empty chamber 201a, and the other housing 20b has two empty chambers 201b, 201c. However, the number of the empty chambers 201 separating the housing 20a from the other housings 20b is not limited thereto.
如第3圖所示,該複數個殼體20係架構於至少一個位移機構25上以進行XY方向之平面位移,但不以此為限,舉例來說,其中該至少一分離殼體20a與該其他殼體20b分離架構於該至少一個位移機構25上,亦即該分離殼體20a及該其他殼體20b係共同架構於同一位移機構25上以進行XY方向之平面位移,然由於該分離殼體20a及該其他殼體20b係為分離地架構於同一該位移機構25上,故其分別於不同的位置上進行XY方向之平面位移;又或者是,於另一實施例中,如第4圖所示,該分離殼體20a架構於一個位移機構25a上以進行XY方向之平面位移,而該其他殼體20b則架構於另一個位移機構25b上以進行XY方向之平面位移,即該分離殼體20a與該其他殼體20b係彼此分離地設置於兩位移機構25a、25b上進行XY方向之平面位移,然其係可依實際施作情形而任施變化,並不以此為限。As shown in FIG. 3, the plurality of housings 20 are configured on the at least one displacement mechanism 25 to perform plane displacement in the XY direction, but not limited thereto, for example, the at least one separation housing 20a and The other housings 20b are separated from the at least one displacement mechanism 25, that is, the separation housing 20a and the other housings 20b are commonly arranged on the same displacement mechanism 25 for plane displacement in the XY direction, but due to the separation The housing 20a and the other housings 20b are separately disposed on the same displacement mechanism 25, so that they are respectively displaced in the XY direction at different positions; or, in another embodiment, as in the first embodiment 4, the separation housing 20a is framed on one displacement mechanism 25a for plane displacement in the XY direction, and the other housing 20b is framed on the other displacement mechanism 25b for plane displacement in the XY direction, that is, The separation housing 20a and the other housings 20b are disposed separately from each other on the two displacement mechanisms 25a, 25b for plane displacement in the XY direction, but the system can be changed according to the actual application situation, and is not limited thereto. .
除此之外,於另一些實施例中,如第3圖所示,該複數個殼體20更可架構於至少一個位移機構25上以進行XYZ三方向之位移,換言之,該複數個殼體20增加了如圖所示之Z方向之位移,且該至少一分離殼體20a與該其他殼體20b係可分離地、共同架構於同一個位移機構25上,以進行XYZ三方向之位移,然此該分離殼體20a及該其他殼體20b係為分離地架構於該位移機構25之不同位置上以進行XYZ三方向之位移,又或者是該分離殼體20a可單獨架構於一個位移機構25a上以進行XYZ三方向之位移(如第4圖所示),而該其他殼體20b亦可單獨架構於另一個位移機構25b上以進行XYZ三方向之位移(如第4圖所示),換句話說,該分離殼體20a及該其他殼體20b可分離地設置於同一位移機構25上,或是可分離地設置於不同之位移機構25a及25b上,其係可依照實際施作情形而任施變化,並不以此為限。In addition, in other embodiments, as shown in FIG. 3, the plurality of housings 20 may be further configured on at least one displacement mechanism 25 for XYZ three-direction displacement, in other words, the plurality of housings. 20 increases the displacement in the Z direction as shown, and the at least one separating housing 20a and the other housing 20b are detachably and jointly arranged on the same displacement mechanism 25 for XYZ three-direction displacement, The separation housing 20a and the other housing 20b are separately disposed at different positions of the displacement mechanism 25 for XYZ three-direction displacement, or the separation housing 20a can be separately constructed in a displacement mechanism. 25a is used for XYZ three-direction displacement (as shown in FIG. 4), and the other housing 20b can also be separately configured on the other displacement mechanism 25b for XYZ three-direction displacement (as shown in FIG. 4). In other words, the separation housing 20a and the other housing 20b can be detachably disposed on the same displacement mechanism 25, or can be detachably disposed on different displacement mechanisms 25a and 25b, which can be implemented according to actual conditions. Changes are not allowed in this case.
以本案實施例為例,三維全彩複合列印裝置2之該光源組件21設置於該分離殼體20a之空室201a中,提供一雷射光源,用以對基座3之建構槽33內之粒狀粉末36照射,並沿著成型物37之 一分層截面輪廓進行燒結,使粒狀粉末36溫度升至融點而固化 。In the embodiment of the present invention, the light source assembly 21 of the three-dimensional full-color composite printing device 2 is disposed in the empty chamber 201a of the separation housing 20a, and provides a laser light source for constructing the groove 33 in the base 3. The granulated powder 36 is irradiated and sintered along a layered cross-sectional profile of the molded article 37, and the temperature of the granulated powder 36 is raised to a melting point to be solidified.
又於本實施例中,三維全彩複合列印裝置2之該至少一顏色墨水22可為黑色墨水或彩色墨水,但不以此為限。每一該顏色墨水22分別容設於該其他殼體20b之該至少一空室201b、201c中。In this embodiment, the at least one color ink 22 of the three-dimensional full-color composite printing device 2 may be black ink or color ink, but is not limited thereto. Each of the color inks 22 is respectively received in the at least one empty chamber 201b, 201c of the other housing 20b.
該至少一噴墨晶片23對應設於該其他殼體20b之一底面231,且每一該噴墨晶片23均具有複數個噴孔(未圖示),連通該至少一顏色墨水22,並受該至少一噴墨晶片23驅動噴出該至少一顏色墨水22;於一些實施例中,該噴墨晶片23係可為但不限為熱汽泡式噴墨晶片、壓電式噴墨晶片及微機電(MEMS)製程製造之至少其中之一種噴墨晶片23。The at least one inkjet wafer 23 is correspondingly disposed on a bottom surface 231 of the other casing 20b, and each of the inkjet wafers 23 has a plurality of orifices (not shown) communicating with the at least one color ink 22 and being subjected to The at least one inkjet wafer 23 drives the ejection of the at least one color ink 22; in some embodiments, the inkjet wafer 23 can be, but is not limited to, a thermal bubble inkjet wafer, a piezoelectric inkjet wafer, and a micro At least one of the inkjet wafers 23 manufactured by electromechanical (MEMS) processes.
又以本案實施例為例,該 其他殼體20b之空室201b內為容置 黑色的顏色墨水22,則其所對應之噴墨晶片23則為具有單一流道之黑色噴墨晶片23,而該 其他殼體20b之另一個空室201c內為容置彩色的 顏色墨水22,其所對應於彩色的顏色墨水22之噴墨晶片23則為具有三流道之彩色噴墨晶片23,但不以此為限。或是於另一些實施例中,該至少一噴墨晶片23係為二個噴墨晶片23,分別對應於空室201b、201c,且該二噴墨晶片23係為具有二流道之雙色噴墨晶片23,但不以此為限。Taking the embodiment of the present invention as an example, in the empty chamber 201b of the other casing 20b, the black color ink 22 is accommodated, and the corresponding inkjet wafer 23 is a black inkjet wafer 23 having a single flow path. The other empty chamber 201c of the other casing 20b is a color ink 22 for accommodating color, and the inkjet wafer 23 corresponding to the color ink 22 is a color inkjet wafer 23 having three flow paths, but not This is limited. In still other embodiments, the at least one inkjet wafer 23 is two inkjet wafers 23 corresponding to the empty chambers 201b, 201c, respectively, and the two inkjet wafers 23 are two-color inkjets having two flow paths. Wafer 23, but not limited thereto.
除此之外,於另一些實施例中,該複數殼體20之該其他殼體 20b 亦可具有四個用以容設四種顏色墨水22之空室201,其中四個容設一種顏色墨水22之每一空室201中,由其所對應之噴墨晶片23之噴孔輸出顏色墨水22,則該對應之噴墨晶片23之數量同樣為四,且其係均為具有單一流道之單色噴墨晶片23。當然,殼體20之該其他殼體 20b 亦可具有六個用以容設六種顏色墨水22之空室201,由其所對應之噴墨晶片23之噴孔輸出顏色墨水22,則該對應之噴墨晶片23之數量同樣為六個,且其係均為具有單一流道之單色噴墨晶片23,甚至,殼體20之該其他殼體 20b 亦可具有七個用以容設七種顏色墨水22之空室201,由其所對應之噴墨晶片23之噴孔輸出顏色墨水22,則該對應之噴墨晶片23之數量同樣為七個,且其係均為具有單一流道之單色噴墨晶片23。由此可見,該其他殼體20b內的空室201、顏色墨水22及噴墨晶片23之數量、設置方式及型態等係可依照實際情形而任施變化,並不以此為限。In addition, in other embodiments, the other housing 20b of the plurality of housings 20 may also have four empty chambers 201 for accommodating four colors of ink 22, four of which accommodate one color ink. In each of the empty chambers 201, the color inks 22 are outputted from the nozzle holes of the corresponding ink-jet wafers 23, and the number of the corresponding ink-jet wafers 23 is also four, and each of them is a single flow path. Color inkjet wafer 23. Of course, the other housing 20b of the housing 20 may also have six empty chambers 201 for accommodating the six color inks 22, and the color inks 22 of the inkjet wafers 23 corresponding thereto output the color inks 22. The number of the inkjet wafers 23 is also six, and they are all monochromatic inkjet wafers 23 having a single flow path. Even the other housings 20b of the housing 20 can have seven for housing seven. The empty chamber 201 of the color ink 22 outputs the color ink 22 from the corresponding orifice of the inkjet wafer 23, and the number of the corresponding inkjet wafers 23 is also seven, and all of them have a single flow path. Monochromatic inkjet wafer 23. It can be seen that the number, arrangement, and type of the empty chamber 201, the color ink 22, and the inkjet wafer 23 in the other housing 20b can be changed according to actual conditions, and is not limited thereto.
以及,如前所述,本案之三維全彩複合列印裝置2之該成型托盤24係架構於建構槽33之升降底座35b上,以隨著升降底座35b之驅動進行上下方向之位移,且於成型托盤24上承載支撐由該光源組件21之光源 照射粒狀粉末36,而固化成形之三維成型物37之單切層。As described above, the molding tray 24 of the three-dimensional full-color composite printing device 2 of the present invention is constructed on the lifting base 35b of the construction groove 33 to be displaced in the up-and-down direction as the lifting base 35b is driven, and The molding tray 24 carries a single cut layer that supports the pulverized powder 36 by the light source of the light source unit 21 to solidify the formed three-dimensional molded product 37.
於本實施例中,本案之三維全彩複合列印裝置2進行全彩化之三維成型程序係為先由位移機構25控制該分離殼體20a以進行XY方向或是XYZ三方向之位移,藉以使該分離殼體20a之位置對應於基座3之建構槽33,並使分離殼體20a內裝設之光源組件21以光源 照射設置於建構槽33中之 該粒狀粉末36,使之於該成型托盤24上欲成型的位置產生固化,復由該位移機構25控制該其他殼體20b進行XY方向或是XYZ三方向之位移,使該其他殼體20b內之該噴墨晶片23之噴孔對應到前述該粒狀粉末36成形固化之位置,並使該噴孔於一預定時間噴出顏色墨水22附著於該燒結成形之粒狀粉末36 上,以成形一三維成型物37之單切層,再透過設置於建構槽33下方之升降底座35b以控制該成型托盤24向下位移至欲成型另一層單切層之高度,復重覆施作以光源組件21照射燒結成形粒狀粉末36 及噴印顏色墨水22於該已成型之單切層上,以構造出三維成型物37之堆疊層,如此反覆上述之光源照射燒結成形粒狀粉末36及噴印顏色墨水22製程,進而構造出複數堆疊層,最終固化成形以一全彩化之三維成型物37。In the present embodiment, the three-dimensional forming process of the full-color three-dimensional composite printing device 2 of the present invention is to first control the separation housing 20a by the displacement mechanism 25 to perform displacement in the XY direction or the XYZ direction. The position of the separation housing 20a corresponds to the construction groove 33 of the base 3, and the light source assembly 21 installed in the separation housing 20a illuminates the granular powder 36 disposed in the construction groove 33 with a light source, so as to be The position of the molding tray 24 to be formed is solidified, and the displacement mechanism 25 controls the other housing 20b to perform displacement in the XY direction or the XYZ direction, so that the inkjet wafer 23 in the other housing 20b is sprayed. The hole corresponds to the position where the granular powder 36 is formed and solidified, and the nozzle is sprayed with the color ink 22 for a predetermined time to adhere to the sintered shaped granular powder 36 to form a single cut layer of the three-dimensional shaped product 37. And passing through the lifting base 35b disposed under the construction groove 33 to control the molding tray 24 to be displaced downward to the height of the other layer of the single layer to be formed, and the compounding operation is performed to irradiate the sintered forming granular powder 36 with the light source assembly 21 and Printing color ink 2 2, on the formed single-cut layer, to construct a stacked layer of three-dimensional shaped articles 37, and thus irradiating the above-mentioned light source to illuminate the sintered shaped granular powder 36 and the printing color ink 22, thereby constructing a plurality of stacked layers, and finally The three-dimensional molded article 37 is solidified and formed into a full color.
綜上所述,本案之三維全彩複合列印裝置,能廣泛應用於雷射燒結固態粉末成型(SLS) 技術,透過位移機構帶動三維全彩複合列印裝置之殼體於XY方向上進行平面位移、或是於XYZ三方向進行位移,以有效地實施全彩化之3D列印,不僅可突破傳統單色之3D成型物之技術瓶頸,增加3D成型物之色彩擬真及藝術性,同時更利於推廣全彩化3D列印技術,並使全彩化3D列印技術更為普及化。In summary, the three-dimensional full-color composite printing device of the present invention can be widely applied to laser sintered solid powder molding (SLS) technology, and the housing of the three-dimensional full-color composite printing device is driven in the XY direction through a displacement mechanism. Displacement, or displacement in the XYZ three directions, to effectively implement the full-color 3D printing, not only can break through the technical bottleneck of the traditional monochrome 3D molding, increase the color simulation and artistry of the 3D molding, and at the same time Conducive to the promotion of full-color 3D printing technology, and make full-color 3D printing technology more popular.
本案得由熟知此技術之人士任施匠思而為諸般修飾,然皆不脫如附申請專利範圍所欲保護者。This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.
1‧‧‧雷射燒結固態粉末成型機 1‧‧‧Laser Sintering Solid Powder Forming Machine
2‧‧‧多功能複合列印裝置 2‧‧‧Multifunctional composite printing device
20‧‧‧殼體 20‧‧‧shell
20a‧‧‧分離殼體 20a‧‧‧Separate housing
20b‧‧‧其他殼體 20b‧‧‧Other shells
201、201a、201b、201c‧‧‧空室 201, 201a, 201b, 201c‧‧ empty room
21‧‧‧光源組件 21‧‧‧Light source components
22‧‧‧顏色墨水 22‧‧‧Color ink
23‧‧‧噴墨晶片 23‧‧‧Inkjet wafer
231‧‧‧底面 231‧‧‧ bottom
24‧‧‧成型托盤 24‧‧‧Molding tray
25、25a、25b‧‧‧位移機構 25, 25a, 25b‧‧‧ displacement mechanism
3‧‧‧基座 3‧‧‧Base
31‧‧‧工作平台 31‧‧‧Working platform
32‧‧‧供粉槽 32‧‧‧ powder supply tank
33‧‧‧建構槽 33‧‧‧ Construction trough
34‧‧‧滾輪 34‧‧‧Roller
35a、35b‧‧‧升降底座 35a, 35b‧‧‧ lifting base
36‧‧‧粒狀粉末 36‧‧‧granular powder
37‧‧‧成型物 37‧‧‧Molded goods
Claims (14)
複數個殼體,具有至少一分離殼體及一其他殼體,每一該殼體具有至少一個空室,且該至少一分離殼體與該其他殼體分離架構於至少一個位移機構上以進行位移;
一光源組件,設置於該至少一分離殼體之該空室中,提供一雷射光源;
至少一顏色墨水,每一該顏色墨水分別容設於該其他殼體之該至少一空室中;
至少一噴墨晶片,每一該噴墨晶片對應設於該其他殼體之一底面,且每一該噴墨晶片均具有複數個噴孔,連通該至少一顏色墨水,並受該至少一噴墨晶片驅動噴出該至少一顏色墨水;以及
一成型托盤,架構於該建構槽中,由一升降底座帶動以進行上下位移;
其中,該至少一位移機構帶動該分離殼體位移,使該光源組件照射至該成型托盤上承載之該粒狀粉末,並沿著該三維成型物之一分層截面輪廓進行燒結,以成形一單切層,再由該至少一位移機構帶動該其他殼體位移,使設置於該其他殼體內之該至少一噴墨晶片之該複數個噴孔噴出該至少一顏色墨水至該單切層上,復重覆施作以該光源照射燒結成形該粒狀粉末及噴印該顏色墨水於該單切層上,以構造出該三維成型物之一堆疊層,並反覆構造出複數該堆疊層,最終固化成形一全彩化之三維成型物。A three-dimensional full-color composite printing device is suitable for constructing a three-dimensional shaped object formed by forming a granular powder, which comprises:
a plurality of housings having at least one separate housing and one other housing, each of the housings having at least one empty chamber, and the at least one separate housing being separated from the other housings by at least one displacement mechanism for performing Displacement
a light source assembly disposed in the empty chamber of the at least one separate housing to provide a laser light source;
At least one color ink, each of the color inks being respectively accommodated in the at least one empty chamber of the other housing;
At least one inkjet wafer, each of the inkjet wafers being disposed on a bottom surface of the other housing, and each of the inkjet wafers has a plurality of nozzles communicating with the at least one color ink and receiving the at least one inkjet The ink wafer is driven to eject the at least one color ink; and a molding tray is arranged in the construction groove, and is driven by a lifting base to perform upward and downward displacement;
Wherein the at least one displacement mechanism drives the separation housing to displace the light source assembly to the granular powder carried on the molding tray, and sinters along a layered cross-sectional profile of the three-dimensional shaped article to form a a single slit layer, and the at least one displacement mechanism drives the other housings to displace the plurality of ink jets disposed in the other housing to eject the at least one color ink onto the single cut layer Applying the light source to sinter the shaped granular powder and printing the color ink on the single cut layer to construct a stacked layer of the three-dimensional shaped article, and repeatedly constructing the plurality of stacked layers, The final solidification forms a full-color three-dimensional molded product.
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| US20080187711A1 (en) * | 2007-01-10 | 2008-08-07 | Z Corporation | Three-Dimensional Printing Material System With Improved Color, Article Performance, and Ease of Use |
| TWI424917B (en) * | 2011-04-11 | 2014-02-01 | Microjet Technology Co Ltd | Control method of three-dimensional make-up machine |
| TWM481136U (en) * | 2014-01-20 | 2014-07-01 | Nexgen Mediatech Inc | Wire dying device for use in three-dimensional printing machine |
| TW201511974A (en) * | 2013-09-23 | 2015-04-01 | Chang Yi Chen | Inkjet method of forming metal pattern and molded interconnect device therefrom |
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2015
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| US4158204A (en) * | 1976-12-30 | 1979-06-12 | International Business Machines Corporation | Time correction system for multi-nozzle ink jet printer |
| US5660621A (en) * | 1995-12-29 | 1997-08-26 | Massachusetts Institute Of Technology | Binder composition for use in three dimensional printing |
| US20080187711A1 (en) * | 2007-01-10 | 2008-08-07 | Z Corporation | Three-Dimensional Printing Material System With Improved Color, Article Performance, and Ease of Use |
| TWI424917B (en) * | 2011-04-11 | 2014-02-01 | Microjet Technology Co Ltd | Control method of three-dimensional make-up machine |
| TW201511974A (en) * | 2013-09-23 | 2015-04-01 | Chang Yi Chen | Inkjet method of forming metal pattern and molded interconnect device therefrom |
| TWM481136U (en) * | 2014-01-20 | 2014-07-01 | Nexgen Mediatech Inc | Wire dying device for use in three-dimensional printing machine |
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| Publication number | Publication date |
|---|---|
| TW201703995A (en) | 2017-02-01 |
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