TWI604538B - Fingerprint identification package structure and manufacturing method thereof - Google Patents

Description

Fingerprint identification package structure and manufacturing method thereof

The present invention relates to a package structure and a method of fabricating the same, and more particularly to a fingerprint identification package structure and a method of fabricating the same.

The fingerprint identification chip package structure can be installed in various electronic products, such as smart phones, mobile phones, tablets, notebook computers, and personal digital assistants (PDAs), etc., to identify the user's fingerprint, and how can The manufacture of a highly sensitive fingerprint identification package structure is an issue to be explored in the art.

The invention provides a manufacturing method of a fingerprint identification package structure, which can manufacture a high sensitivity fingerprint identification package structure.

The invention provides a fingerprint identification package structure with high sensitivity.

A method for manufacturing a fingerprint identification package structure includes: providing a substrate; arranging a plurality of conductive posts to the substrate; and configuring a fingerprint identification chip to the substrate, wherein the fingerprint identification chip includes an active surface away from the substrate and the active surface a plurality of pads; forming an encapsulant on the substrate and encapsulating the fingerprint identification wafer and the periphery of the via posts, wherein the via posts and the pads are exposed to the encapsulant, and the encapsulant comprises a plurality of trenches, the trenches At least in a portion corresponding to the between the conductive posts and the pads; forming a conductive layer onto the encapsulant, wherein the conductive layer fills the trenches and connects the via posts to the pads; removing the conductive layer in these a portion other than the groove to form a plurality of traces embedded in the encapsulant; and a protective layer disposed on the encapsulant.

In an embodiment of the invention, in the step of forming the encapsulant on the substrate, the method further comprises: providing a mold, wherein the mold comprises a stamper surface and a plurality of protrusions protruding from the surface of the stamper; Forming a colloid between the substrate and the mold, the grooves of the encapsulant corresponding to the protrusions of the mold, the conductive posts and the pads are exposed on the bottom surface of the grooves, and the grooves extend from one of the conductive posts to Corresponding pads.

In an embodiment of the invention, the depth of each of the grooves corresponding to the portion of the via post and the pad is greater than the depth corresponding to the portion between the via post and the pad.

In an embodiment of the present invention, in the step of forming the encapsulant on the substrate, the method further includes: providing a mold; forming a package colloid between the substrate and the mold, wherein the encapsulant encapsulates the fingerprint identification wafer and the conductive posts; A portion of the encapsulant is abraded to expose the vias and the pads; and the encapsulant is removed at a portion between the vias and the pads to form the trenches.

In an embodiment of the present invention, in the step of forming the encapsulant on the substrate, the method further includes: providing a mold; forming an encapsulant between the substrate and the mold, wherein the encapsulant encapsulates the fingerprint identification chip and the conductive posts Surrounding, the conductive posts and the pads are exposed to the encapsulant; the encapsulant is removed at a portion between the vias and the pads to form the trenches.

In an embodiment of the invention, in the step of forming the grooves, the method further comprises: forming the grooves on the encapsulant by laser cutting.

In an embodiment of the invention, the conductive layer is disposed on the encapsulant by electroplating, sputtering or coating.

In an embodiment of the invention, in the step of removing portions of the conductive layer, portions of the conductive layer outside the grooves are removed by etching or etching.

A fingerprint identification package structure includes a substrate, a plurality of conductive posts, a fingerprint identification chip, an encapsulant, a plurality of traces, and a protective layer. These via posts are disposed on the substrate. The fingerprint identification chip is disposed on the substrate and includes an active surface away from the substrate and a plurality of pads located on the active surface. The encapsulant is disposed on the substrate and encapsulates the fingerprint identification wafer and the via posts. These traces connect these via posts to these pads, respectively, and embed the encapsulant. The protective layer is disposed on the encapsulant.

In an embodiment of the invention, the encapsulant comprises a plurality of recesses respectively extending from corresponding to the vias to corresponding to the pads, and the traces are located in the recesses.

Based on the above, the method for manufacturing the fingerprint identification package structure of the present invention is provided with a plurality of recesses in a portion corresponding to the conductive posts and the pads on the encapsulant, and is embedded in the recesses of the encapsulant. The package is encapsulated and connected to the plurality of traces of the via post and the pad, and the protective layer is disposed on the encapsulant. The above manufacturing method can make only a pad and a single layer trace between the fingerprint identification chip and the protective layer of the fingerprint identification package structure, and the distance between the active surface of the fingerprint identification wafer and the protection layer can be quite close, which helps to improve the fingerprint. Identify the sensing sensitivity of the package structure.

The above described features and advantages of the invention will be apparent from the following description.

The manufacturing method of the fingerprint identification package structure of the present invention can produce a fingerprint identification package structure in which the active surface of the fingerprint recognition wafer is relatively close to the protective layer, and can have high sensitivity, which will be described below.

FIG. 1 to FIG. 7 are schematic flowcharts showing a method of manufacturing a fingerprint identification package structure according to an embodiment of the invention. The manufacturing method of the fingerprint identification package structure 100 of this embodiment includes the following steps. First, referring to FIG. 1, a substrate 110 is provided. In this embodiment, the substrate 110 can be a circuit board, such as a hard circuit board or a flexible circuit board. Next, a plurality of via posts 120 are disposed to the substrate 110. The material of the via 120 is, for example, copper or an alloy thereof, but is not limited thereto.

Referring to FIG. 2 , a fingerprint identification chip 130 is disposed on the substrate 110 . The fingerprint recognition wafer 130 includes an active surface 132 away from the substrate 110 and a plurality of pads 134 located on the active surface 132 . In this embodiment, each of the pads 134 has a corresponding conductive post 120, that is, the number of pads 134 is the same as the number of the conductive posts 120, and the top surface of the pads 134 is located at the top surface of the conductive posts 120. same plane. Of course, in other embodiments, the number of pads 134 and the number of the conductive posts 120 may also be different, and the top surface of the pads 134 and the top surface of the conductive posts 120 may also be located in different planes. In addition, in the embodiment, the fingerprint identification chip 130 can be fixed on the substrate 110 through a die attach process. When performing the die bonding process, a glue layer (not shown) is first formed on the fingerprint identification chip 130. The back side is then adhered to the substrate 110. The adhesive layer can be an epoxy resin, a silver paste, a die bond film (DAF), a two-stage thermosetting resin, or other suitable material.

Then, an encapsulant 140 is formed on the substrate 110 and encloses the fingerprint identification wafer 130 and the periphery of the via posts 120. In the embodiment, in the step of forming the encapsulant 140 on the substrate 110, the method further includes: providing a mold 10. Please refer to FIG. 3A and FIG. 3B. FIG. 3B is a top view of the mold 10 of FIG. 3A. In the present embodiment, the mold 10 includes a stamper surface 11 and a plurality of projections 12, 14 projecting from the stamper surface 11. As shown in FIG. 3A, the projections 12, 14 have two heights, and the positions of the higher projections 12 correspond to the positions of the conductive posts 120 and the pads 134, and the lower projections 14 The position corresponds to the position between the via posts 120 and the pads 134.

Next, referring to FIG. 4 , an encapsulant 140 is formed between the substrate 110 and the mold 10 . The encapsulant 140 has a plurality of grooves 142 corresponding to the protrusions 12 , 14 of the mold 10 . In the present embodiment, the depth of each of the recesses 142 at the portion corresponding to the via post 120 and the pad 134 is greater than the depth corresponding to the portion between the via post 120 and the pad 134. That is to say, the groove 142 of the encapsulant 140 has two depths, and the groove 142 at the via 120 and the pad 134 has a deep depth, and the depth between the via 120 and the pad 134 is shallow. . As can be seen from FIG. 4, the conductive posts 120 and the pads 134 are exposed on the bottom surfaces of the recesses 142, and the recesses 142 extend from one of the via posts 120 to the corresponding pads 134.

Referring to FIG. 5, a conductive layer 150 is formed on the encapsulant 140, wherein the conductive layer 150 fills the trenches 142 and connects the via posts 120 and the pads 134. In this embodiment, the conductive layer 150 may be disposed on the encapsulant 140 by electroplating, sputtering or coating.

Next, please refer to FIG. 6A and FIG. 6B, which is a bottom view of FIG. 6A. The portions of the conductive layer 150 other than the recesses 142 are removed, leaving only the conductive layer 150 in the recesses 142 to form a plurality of traces 152 embedded in the encapsulant 140. In this embodiment, the conductive layer 150 may be removed by portions of the conductive layer 150 outside of the grooves 142 by means of abrasion, laser ablation or etching.

Finally, referring to FIG. 7 , a protective layer 160 is disposed on the encapsulant 140 to form the fingerprint identification package structure 100 of the embodiment. In this embodiment, the protective layer 160 may be made of a high dielectric constant material such as sapphire, glass, ceramic, quartz, acryl or plastic. On the other hand, the protective layer 160 has a high hardness and thus has scratch resistance. The manner in which the protective layer 160 is disposed on the encapsulant 140 can be fixed by using an adhesive layer (not shown). The adhesive layer is, for example, a B-stage adhesive or a FOW (Film-over-wire) material, which has a low viscosity coefficient and requires a low temperature for curing and is not easily deformed. Of course, the manner in which the protective layer 160 is disposed on the encapsulant 140 and the type of the adhesive layer are not limited thereto.

As shown in FIG. 7 , the fingerprint identification package structure 100 of the present embodiment includes a substrate 110 , a plurality of conductive pillars 120 , a fingerprint identification wafer 130 , an encapsulation 140 , a plurality of traces 152 , and a protective layer 160 . These via posts 120 are disposed on the substrate 110. The fingerprint recognition chip 130 is disposed on the substrate 110 and includes an active surface 132 away from the substrate 110 and a plurality of pads 134 located on the active surface 132 . The encapsulant 140 is disposed on the substrate 110 and encapsulates the fingerprint recognition wafer 130 and the via posts 120. In the present embodiment, the encapsulant 140 includes a plurality of recesses 142 that extend from corresponding to the via posts 120 to correspond to the pads 134, respectively. The traces 152 are located in the recesses 142 to embed the encapsulant 140 and connect the via posts 120 and the pads 134, respectively. The protective layer 160 is disposed on the encapsulant 140.

When the user's finger touches the surface of the protective layer 160, the difference between the concave and convex of the fingerprint of the finger and the active surface 132 of the fingerprint recognition chip 130 causes a change in the capacitance value, wherein the sensed change in the capacitance value can be converted into a fingerprint. Information for identification. The fingerprint identification chip 130 of the fingerprint identification package structure 100 of the present embodiment has only the pads 134 and the single layer traces 152 between the fingerprint layer 130 and the protective layer 160. This allows the distance between the active surface 132 of the fingerprint identification wafer 130 and the protective layer 160 to be Relatively close, it helps to improve the sensing sensitivity of the fingerprint identification package structure 100.

Another method of manufacturing the fingerprint identification package structure 100a will be described below. It is to be noted that, in the following embodiments, the same or similar elements as the previous embodiment are denoted by the same or similar symbols. 8 to FIG. 14 are schematic flowcharts showing a method of manufacturing a fingerprint identification package structure 100 according to another embodiment of the present invention.

In the present embodiment, first, the via post 120 and the fingerprint recognition wafer 130 may be disposed on the substrate 110 as shown in FIGS. 1 to 2 . Next, in the step of forming the encapsulant 140 on the substrate 110, referring to FIG. 8 and FIG. 9, a mold 20 is provided, and an encapsulant 140 is formed between the substrate 110 and the mold 20, wherein the encapsulant 140 encapsulates fingerprint identification. Wafer 130 and these via posts 120. In the present embodiment, the stamper surface of the mold 10 is flat. Referring to FIG. 10, a portion of the encapsulant 140 is removed to expose the via posts 120 and the pads 134.

It should be noted that in other embodiments, when the encapsulant 140 is formed, the encapsulant 140 may also enclose only the fingerprint recognition wafer 130 and the periphery of the vias 120. That is, the mold 10 can contact the via posts 120 and the pads 134 such that the via posts 120 and the pads 134 are exposed to the encapsulant 140 after the encapsulant 140 is formed. Thus, the steps of removing the encapsulant 140 as shown in FIG. 10 to expose the via posts 120 and the pads 134 can be omitted.

Next, referring to FIG. 11, the encapsulant 140 is removed at a portion between the via posts 120 and the pads 134 to form the recesses 144. In the present embodiment, the grooves 144 are located at locations corresponding to the conductive posts 120 and the pads 134. In the step of forming the grooves 144, the grooves 144 may be formed by laser cutting. Of course, the method of forming the grooves 144 is not limited thereto.

Referring to FIG. 12, a conductive layer 150 is formed on the encapsulant 140, wherein the conductive layer 150 fills the trenches 144 and connects the via posts 120 and the pads 134. In the present embodiment, the conductive layer 150 is disposed on the encapsulant 140 by electroplating, sputtering, or coating.

Continuing, referring to FIG. 13, portions of the conductive layer 150 other than the recesses 144 are removed to form a plurality of traces 154 embedded in the encapsulant 140. In the present embodiment, in the step of removing a portion of the conductive layer 150, portions of the conductive layer 150 outside the recesses 144 are removed by etching or etching. It is worth mentioning that if the conductive layer 150 directly forms the trace 154 on the encapsulant 140 in the form of a screen, the steps of FIG. 13 may be omitted.

Finally, referring to FIG. 14, a protective layer 160 is disposed on the encapsulant 140 to form the fingerprint identification package structure 100a of the present embodiment. As can be seen from FIG. 14, in the fingerprint identification package structure 100a of the present embodiment, the pads 134 and the traces 154 are in the same plane, so that the distance between the active surface of the fingerprint recognition wafer 130 and the protective layer 160 is further Proximity helps to improve the sensing sensitivity of the fingerprint identification package structure 100.

In summary, the method for manufacturing the fingerprint identification package structure of the present invention is provided with a plurality of grooves on the encapsulant corresponding to the portions between the conductive posts and the pads, and is formed in the groove of the encapsulant. The plurality of traces are embedded in the encapsulant and connected to the via post and the pad, and then the protective layer is disposed on the encapsulant. The above manufacturing method can make only the pads and the single layer trace between the fingerprint identification chip and the protective layer of the fingerprint identification package structure, and the distance between the fingerprint identification wafer and the protection layer can be quite close, which helps to improve the fingerprint identification package structure. Sensing sensitivity.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10, 20‧‧‧ mold
11‧‧‧Mold surface
12, 14‧‧‧ protruding parts
100, 100a‧‧‧ fingerprint identification package structure
110‧‧‧Substrate
120‧‧‧Connecting column
130‧‧‧Fingerprint Identification Wafer
132‧‧‧Active surface
134‧‧‧ pads
140‧‧‧Package colloid
142, 144‧‧ ‧ groove
150‧‧‧ Conductive layer
152, 154‧‧‧ Trace
160‧‧‧Protective layer

FIG. 1 to FIG. 7 are schematic flowcharts showing a method of manufacturing a fingerprint identification package structure according to an embodiment of the invention. 8 to FIG. 14 are schematic flowcharts showing a method of manufacturing a fingerprint identification package structure according to another embodiment of the present invention.

100‧‧‧Fingerprint identification package structure

110‧‧‧Substrate

120‧‧‧Connecting column

130‧‧‧Fingerprint Identification Wafer

132‧‧‧Active surface

134‧‧‧ pads

140‧‧‧Package colloid

152‧‧‧Wiring

160‧‧‧Protective layer

Claims (10)

A method for manufacturing a fingerprint identification package structure, comprising: providing a substrate; arranging a plurality of conductive posts to the substrate; and configuring a fingerprint identification chip to the substrate, wherein the fingerprint identification chip comprises an active surface away from the substrate and a plurality of pads of the active surface; forming an encapsulant on the substrate and encapsulating the fingerprint identification chip and the periphery of the via posts, wherein the via posts and the pads are exposed to the encapsulant, the encapsulant The recess includes at least a portion corresponding to the portion between the via post and the pads; forming a conductive layer onto the encapsulant, wherein the conductive layer fills the trenches and Connecting the conductive posts and the pads; removing portions of the conductive layer other than the recesses to form a plurality of traces embedded in the encapsulant; and disposing a protective layer on the encapsulant. The method for manufacturing a fingerprint identification package structure according to claim 1, wherein in the step of forming the encapsulant on the substrate, the method further comprises: providing a mold, wherein the mold comprises a stamper surface and a protrusion a plurality of protrusions on the surface of the stamper; and the encapsulant formed between the substrate and the mold, the recesses of the encapsulant corresponding to the protrusions of the mold, the conductive posts and The pads are exposed on the bottom surface of the grooves, and each of the grooves extends from one of the conductive posts to the corresponding pad. The method for manufacturing a fingerprint identification package structure according to claim 2, wherein a depth of each of the grooves corresponding to a portion corresponding to the conductive post and the pad is greater than corresponding to the conductive post and the pad The depth of the part. The manufacturing method of the fingerprint identification package structure of claim 1, wherein the step of forming the encapsulant on the substrate further comprises: providing a mold; forming the package between the substrate and the mold a colloid in which the encapsulating colloid encapsulates the fingerprint disc and the conductive posts; a portion of the encapsulant is removed to expose the via posts and the pads; and the encapsulant is located in the vias A portion between the pads is removed to form the grooves. The manufacturing method of the fingerprint identification package structure of claim 1, wherein the step of forming the encapsulant on the substrate further comprises: providing a mold; forming the package between the substrate and the mold a colloid in which the encapsulant collates the periphery of the fingerprint identification chip and the via posts, and the via posts and the pads are exposed to the encapsulant; the encapsulant is located at the via posts and the pads Portions between the pads are removed to form the grooves. The method for manufacturing a fingerprint identification package structure according to the fourth or fifth aspect of the invention, wherein, in the step of forming the grooves, the method further comprises: forming the concaves by laser cutting on the encapsulant ditch. The method for manufacturing a fingerprint identification package structure according to claim 1, wherein the conductive layer is disposed on the encapsulant by electroplating, sputtering or coating. The method for manufacturing a fingerprint identification package structure according to claim 1, wherein in the step of removing a portion of the conductive layer, the conductive layer is located in the trenches by grinding or etching. The outer part is removed. A fingerprint identification package structure includes: a substrate; a plurality of conductive posts disposed on the substrate; a fingerprint identification chip disposed on the substrate and including an active surface away from the substrate and a plurality of pads on the active surface An encapsulant disposed on the substrate and encapsulating the fingerprint identification chip and the via posts; a plurality of traces respectively connecting the via posts and the pads, and embedding the encapsulant; and a protective layer , disposed on the encapsulant. The manufacturing method of the fingerprint identification package structure of claim 1, wherein the encapsulant comprises a plurality of recesses, and the recesses respectively extend from corresponding to the via posts to correspond to the pads. And the traces are located in the grooves.