TWI601428B - Customization earphone structure and detachable audio-broadcasting module - Google Patents

Description

Customized earphone structure and detachable sound playback module

The invention relates to a headphone structure and a sound playing module thereof, in particular to a customized earphone structure and a detachable sound playing module thereof.

As technology continues to advance, electronic products are moving toward a trend toward lightweight and miniaturization. People can use mini-electronic products such as radios, walkmans, or smart phones whenever and wherever they want. Regardless of the above-mentioned electronic products, in order to allow users to listen to the sound information provided by electronic products without disturbing others, headphones have become an essential accessory for electronic products. In addition, the earphones also provide a better sound transmission for the listener, so that the listener can clearly hear and understand the sound content, unlike the transmission of sound in the air, which may cause unclear conditions, especially during the user's movement, for example It will not be affected in sports, driving, intense activities, or noisy environments.

However, the conventional earphone structure uses a fixed type of earphone unit that cannot be replaced, so that the quality of the sound output cannot be replaced or adjusted according to the user's different use requirements, so that the customization requirement cannot be achieved. Therefore, how to overcome the above-mentioned shortcomings through the improvement of structural design has become one of the important topics to be solved by this undertaking.

The technical problem to be solved by the present invention is to provide a customized earphone structure and a detachable sound playing module thereof for the deficiencies of the prior art.

A detachable sound playing module provided by one embodiment of the present invention, Including: a sound amplification component and a plurality of detachable sound guide components. The sound reinforcement assembly includes a first outer casing, a plurality of first fastening structures disposed on the first outer casing, and a first disposed on the first annular sidewall of the first outer casing The conductive pairing structure, wherein the inside of the first outer casing forms a sound amplification chamber having a predetermined space, and the first outer casing has an assembly groove communicating with the sound amplification chamber. Each of the detachable sound guiding components includes a second outer casing corresponding to the assembly groove, a coaxial dual-frequency sound guiding unit fixed and wrapped inside the second outer casing, a plurality of second fastening structures disposed on the second outer casing and respectively corresponding to the plurality of the first fastening structures, and a second annular side wall disposed on the second outer casing and corresponding to a second conductive pairing structure of the first conductive pairing structure, wherein the coaxial dual-frequency sound guiding unit comprises a woofer diaphragm unit, a tweeter diaphragm unit, and a diaphragm disposed on the woofer A common magnetic circuit assembly is provided between the assembly and the tweeter diaphragm assembly for use with the woofer diaphragm assembly and the tweeter diaphragm assembly, and the second housing has a sound output opening. Wherein one of the plurality of detachable sound guiding components is received in the assembly groove of the sound amplification component, and the plurality of the second fastening structures respectively and the plurality of the first a fastening structure is affixed to each other to detachably position the second outer casing of the detachable sound guiding component in the assembly groove of the sound amplification component, and the second The conductive pairing structure electrically contacts the first conductive pairing structure.

A detachable sound playback module according to another embodiment of the present invention includes: a sound amplification component and a detachable sound guide component. The sound reinforcement assembly includes a first outer casing and a plurality of first fastening structures disposed on the first outer casing, wherein the interior of the first outer casing forms a sound amplifying chamber having a predetermined space And the first outer casing has an assembly groove that communicates with the sound amplification chamber. The detachable sound guiding assembly includes a second outer casing corresponding to the assembly groove, a sound guiding unit fixed and covered inside the second outer casing, and a plurality of disposed at the same Description And a second fastening structure on the second outer casing corresponding to each of the plurality of first fastening structures. The detachable sound guiding component is received in the assembly groove of the sound absorbing component, and the plurality of the second fastening structures are respectively locked with the plurality of the first fastening structures Cooperating to detachably position the second outer casing of the detachable sound guide assembly within the assembly recess of the sound reinforcement assembly.

Further, when the sound guiding unit is a single frequency sound guiding unit, the single frequency sound guiding unit comprises a speaker diaphragm module and a speaker diaphragm module adjacent to the speaker to provide the speaker A magnetic circuit assembly used in a diaphragm assembly.

Further, when the sound guiding unit is a coaxial dual-frequency sound guiding unit, the coaxial dual-frequency sound guiding unit comprises a woofer diaphragm unit, a tweeter diaphragm unit, and a Provided between the woofer diaphragm assembly and the tweeter diaphragm assembly to provide a common magnetic circuit assembly for use with the woofer diaphragm assembly and the tweeter diaphragm assembly.

A customized earphone structure according to still another embodiment of the present invention includes: a headphone skeleton and two detachable sound playing modules. Two detachable sound playing modules are respectively disposed on opposite end portions of the earphone skeleton, wherein each of the detachable sound playing modules comprises: a sound amplification component and a detachable guide Sound component. The sound reinforcement assembly includes a first outer casing, a plurality of first fastening structures disposed on the first outer casing, and a first disposed on the first annular sidewall of the first outer casing The conductive pairing structure, wherein the inside of the first outer casing forms a sound amplification chamber having a predetermined space, and the first outer casing has an assembly groove communicating with the sound amplification chamber. The detachable sound guiding assembly includes a second outer casing corresponding to the assembly groove, a coaxial dual-frequency sound guiding unit fixed and covered inside the second outer casing, and a plurality of a second fastening structure disposed on the second outer casing and corresponding to each of the plurality of first fastening structures, and a second annular side wall disposed on the second outer casing and corresponding to the a second conductive pairing structure of the first conductive pairing structure, wherein the coaxial dual-frequency sound guiding unit comprises a bass a sound diaphragm assembly, a tweeter diaphragm assembly, and a microphone disposed between the woofer diaphragm assembly and the tweeter diaphragm assembly to provide vibration to the woofer diaphragm assembly and the tweeter A common magnetic circuit assembly commonly used with the membrane module, and the second outer casing has a sound output opening. The detachable sound guiding component is received in the assembly groove of the sound absorbing component, and the plurality of the second fastening structures are respectively locked with the plurality of the first fastening structures Cooperating to detachably position the second outer casing of the detachable sound guiding component in the assembly groove of the sound amplification component, and electrically contact the second conductive pairing structure The first conductive pairing structure is described.

The beneficial effects of the present invention may be that the customized earphone structure and the detachable sound playing module provided by the embodiments of the present invention may be provided by the “the sound reinforcement component including a first outer casing and a plurality of a first fastening structure on the first outer casing, and a first conductive pairing structure disposed on the first annular side wall of the first outer casing and the detachable sound guiding component include a second outer casing corresponding to the assembly groove, a coaxial dual-frequency sound guiding unit fixed and covered inside the second outer casing, and a plurality of coaxial outer casings disposed on the second outer casing a second fastening structure corresponding to the plurality of the first fastening structures, and a second conductive pair disposed on the second annular sidewall of the second outer casing and corresponding to the first conductive pairing structure a structure" such that when the detachable sound guiding component is received in the assembly groove of the sound reinforcement component, a plurality of the second fastening structures are respectively associated with the plurality of The two fastening structures are mutually engaged to each other to disassemble the detachable guiding component The second outer housing may be detachably positioned within the recess of the loudspeaker assembly is assembled, and the electrically conductive contact with said second mating structure of the first pair of conductive structures. Therefore, the customized earphone structure and the detachable sound playing module disclosed by the present invention can replace or adjust the sound output according to different usage requirements of the user through the use of the detachable sound guiding component. The quality of this, in order to achieve the requirements of customization.

In order to further understand the features and technical contents of the present invention, please refer to the following The detailed description of the present invention and the accompanying drawings are intended to

Z‧‧‧Customized earphone structure

F‧‧‧Headphone skeleton

F10‧‧‧End

M‧‧‧detachable sound playback module

1‧‧‧Amplifying components

10‧‧‧First outer casing

100‧‧‧ first annular side wall

101‧‧‧Amplifier chamber

102‧‧‧Assembling the groove

11‧‧‧First fastening structure

12‧‧‧First conductive pairing structure

13‧‧‧ alignment groove

2‧‧‧Removable sound guide components

20‧‧‧Second outer casing

200‧‧‧second annular side wall

201‧‧‧Sound output opening

21‧‧‧Coaxial dual-frequency sound guiding unit

211‧‧‧woofer diaphragm assembly

212‧‧‧Telephone diaphragm assembly

213‧‧‧Shared magnetic circuit assembly

21’‧‧‧Single frequency sound guide

211'‧‧‧Speaker diaphragm assembly

213'‧‧‧ Magnetic circuit components

22‧‧‧Second stuck structure

23‧‧‧Second conductive pairing structure

24‧‧‧ alignment rib

1 is a perspective exploded view of a detachable sound playback module of the present invention.

2 is a schematic perspective view of a detachable sound playback module of the present invention.

3 is a functional block diagram of a coaxial dual-frequency sound guiding unit used in the detachable sound guiding component of the detachable sound playing module of the present invention.

4 is a side elevational view of the structure of the customized headset of the present invention.

FIG. 5 is a functional block diagram of a single-frequency sound guiding unit used in the detachable sound guiding component of the detachable sound playing module of the present invention.

The following is a specific embodiment to illustrate the implementation of the "customized earphone structure and its detachable sound playing module" disclosed by the present invention. Those skilled in the art can understand the advantages of the present invention from the contents disclosed in the present specification. And efficacy. The present invention can be implemented or applied in various other specific embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention. In addition, the drawings of the present invention are merely illustrative and are not described in terms of actual dimensions. The following embodiments will further explain the related technical content of the present invention, but the disclosure is not intended to limit the technical scope of the present invention.

Referring to FIG. 1 to FIG. 3, the present invention provides a detachable sound playback module M, which includes: a sound reinforcement component 1 and a plurality of detachable sound guide components 2, wherein only FIG. 1 and FIG. 2 One of the detachable sound guiding components 2 is shown as an example for illustration.

First, as shown in FIG. 1 , the sound reinforcement assembly 1 includes a first outer casing 10 , a plurality of first fastening structures 11 disposed on the first annular sidewall 100 of the first outer casing 10 , and a first A first electrically conductive pairing structure 12 on the first annular sidewall 100 of the outer casing 10. Further, the interior of the first outer casing 10 is formed to have a predetermined The sound amplifying chamber 101 of the space, and the first outer casing 10 has an assembly groove 102 communicating with the sound amplification chamber 101.

Furthermore, as shown in FIGS. 1 and 3, each of the detachable sound guiding members 2 includes a second outer casing 20 corresponding to the assembly recess 102, and is fixed and covered in the interior of the second outer casing 20. The coaxial dual-frequency sound guiding unit 21, the plurality of second fastening structures 22 disposed on the second outer casing 20 and corresponding to the plurality of first fastening structures 11 respectively, and one disposed on the second outer casing 20 On the second annular sidewall 200 and corresponding to the second conductive pairing structure 23 of the first conductive pairing structure 12. Furthermore, the coaxial dual-frequency sound guiding unit 21 includes a woofer diaphragm unit 211, a tweeter diaphragm unit 212, and a woofer diaphragm unit 211 and a tweeter diaphragm unit 212. The shared magnetic circuit assembly 213 is used in common for the woofer diaphragm assembly 211 and the tweeter diaphragm assembly 212, and the second outer casing 20 has a grid-like structure (or any structure may be used without limitation) The sound output opening 201.

Further, as shown in FIG. 1, the sound reinforcement assembly 1 includes a plurality of alignment grooves 13 disposed on the first outer casing 10, and each of the detachable sound guide assemblies 2 includes a plurality of disposed at the second The outer casing 20 corresponds to the alignment ribs 24 of the plurality of alignment grooves 13, respectively. For example, as shown in FIG. 1 , the first fastening structure 11 can be a clamping slot, and the second fastening structure 22 can be a fastening protrusion that is engaged with the clamping slot.

It should be noted that the present invention is not limited to the above examples. For example, the alignment groove 13 and the alignment rib 24 disclosed in FIG. 1 can also be replaced with each other. In other words, the sound reinforcement assembly 1 includes a plurality of alignment ribs 24 disposed on the first outer casing 10, and each of the detachable sound guide assemblies 2 includes a plurality of disposed on the second outer casing 20 and corresponding to each The alignment grooves 13 of the alignment ribs. In addition, the first fastening structure 11 can also be replaced by a fastening protrusion, and the second fastening structure 22 can also be replaced by a fastening slot that is engaged with the fastening protrusion.

Therefore, as shown in FIG. 1 and FIG. 2, when the user accommodates one of the plurality of detachable sound guiding components 2 in the assembly groove 102 of the sound reinforcement component 1 according to different usage requirements. The plurality of second fastening structures 22 are respectively engaged with the plurality of first fastening structures 11 to detachably position the second outer casing 20 of the detachable sound guiding component 2 in the sound reinforcement component 1 . The second conductive pairing structure 23 is electrically connected to the first conductive pairing structure 12. For example, both the first conductive pairing structure 12 and the second conductive pairing structure 23 can use conductive pins that can be paired with each other, but the invention is not limited to the examples described above.

It is worth mentioning that the detachable sound playing module M of the present invention is not limited to use only with a plurality of detachable sound guiding components 2. When the present invention uses only one detachable sound guide assembly 2 for detachable assembly with the sound reinforcement assembly 1, it is also within the scope of the present invention.

Furthermore, as shown in FIG. 2 and FIG. 4, the present invention further provides a customized earphone structure Z (for example, a head-mounted earphone), which comprises: a headphone frame F and two detachable sound playing modules. M, wherein two detachable sound playing modules M are respectively disposed on the opposite end portions F10 of the headphone frame F, and each detachable sound playing module M comprises: a sound amplifying component 1 and one or more A detachable sound guide assembly 2. In other words, the detachable sound playing module M can be used alone or applied to the headphone frame F to form a customized earphone structure Z.

It should be noted that, as shown in FIG. 5, according to different design requirements, the sound guiding unit used in the present invention can also be replaced by the coaxial dual-frequency sound guiding unit 21 disclosed in FIG. 3 into a single-frequency sound guiding unit. 21', wherein the single-frequency sound guiding unit 21' includes a speaker diaphragm module 211' and a proximity speaker diaphragm assembly 211' to provide a magnetic circuit assembly 213' for use with the speaker diaphragm assembly 211'. Therefore, the present invention is applicable to the present invention by using the single-frequency sound guiding unit 21' or the coaxial dual-frequency sound guiding unit 21 as the implementable sound guiding unit of the detachable sound playing module M. Within the scope of protection.

[Effective effect of the embodiment]

In summary, the beneficial effect of the present invention may be that the customized earphone structure Z and the detachable sound playing module M thereof are provided by the embodiment of the present invention, and the sound reinforcement component 1 includes a first outer casing. The body 10, a plurality of first fastening structures 11 disposed on the first outer casing 10, and a first conductive pairing structure 12" and "detachable" disposed on the first annular sidewall 100 of the first outer casing 10. The sound guiding assembly 2 includes a second outer casing 20 corresponding to the assembly groove 102, a coaxial dual-frequency sound guiding unit 21 fixed and covered inside the second outer casing 20, and a plurality of A second fastening structure 22 on the second outer casing 20 corresponding to the plurality of first fastening structures 11 and a second annular side wall 200 disposed on the second outer casing 20 and corresponding to the first conductive matching structure 12 The second conductive pairing structure 23" is designed such that when the detachable sound guiding component 2 is received in the assembly groove 102 of the sound reinforcement component 1, the plurality of second fastening structures 22 are respectively associated with the plurality of A fastening structure 11 is affixed to each other to detachably fix the second outer casing 20 of the detachable sound guiding assembly 2 PA module assembly within the recess 1021, and the second mating structure 23 is electrically conductive contact with the first mating structure 12 is electrically conductive. Therefore, the customized earphone structure Z and the detachable sound playing module M disclosed by the present invention can be replaced or adjusted according to the different use requirements of the user through the use of the detachable sound guiding component 2. The quality of the output, in order to achieve the requirements of customization.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by using the present specification and the contents of the drawings are included in the protection scope of the present invention. .

M‧‧‧detachable sound playback module

1‧‧‧Amplifying components

10‧‧‧First outer casing

100‧‧‧ first annular side wall

101‧‧‧Amplifier chamber

102‧‧‧Assembling the groove

11‧‧‧First fastening structure

12‧‧‧First conductive pairing structure

13‧‧‧ alignment groove

2‧‧‧Removable sound guide components

20‧‧‧Second outer casing

200‧‧‧second annular side wall

201‧‧‧Sound output opening

22‧‧‧Second stuck structure

25‧‧‧Second conductive pairing structure

24‧‧‧ alignment rib

Claims (11)

A detachable sound playing module, comprising: a sound amplification component, the sound reinforcement component comprising a first outer casing, a plurality of first fastening structures disposed on the first outer casing, and a setting a first conductive pairing structure on the first annular side wall of the first outer casing, wherein an inner portion of the first outer casing forms a sound amplifying chamber having a predetermined space, and the first outer casing has An assembly groove connected to the sound amplification chamber; and a plurality of detachable sound guide assemblies, each of the detachable sound guide assemblies including a second outer casing corresponding to the assembly groove, a coaxial dual-frequency sound guiding unit fixed and covered inside the second outer casing, and a plurality of coaxial double-frequency sound guiding cells disposed on the second outer casing and respectively corresponding to the plurality of the first fastening structures a second card structure, and a second conductive pairing structure disposed on the second annular sidewall of the second outer casing and corresponding to the first conductive pairing structure, wherein the coaxial dual-frequency sound guiding unit comprises a woofer diaphragm assembly, a tweeter diaphragm assembly And a shared magnetic circuit assembly disposed between the woofer diaphragm assembly and the tweeter diaphragm assembly for use in conjunction with the woofer diaphragm assembly and the tweeter diaphragm assembly, and The second outer casing has a sound output opening; wherein one of the plurality of the detachable sound guiding components is received in the assembly groove of the sound amplification component, and the plurality of the second The fastening structure is respectively engaged with the plurality of the first fastening structures to detachably position the second outer casing of the detachable sound guiding component in the assembly of the sound amplification component The second conductive pairing structure is electrically contacted with the first conductive pairing structure. The detachable sound playing module of claim 1, wherein the sound amplifying component comprises a plurality of alignment grooves disposed on the first outer casing, and each of the detachable sound guiding components Included on the second outer casing and corresponding to each And a plurality of the alignment ribs of the alignment groove, wherein the first fastening structure is a fastening slot, and the second fastening structure is mutually engaged with the fastening slot Fitted bumps. The detachable sound playing module of claim 1, wherein the sound amplifying component comprises a plurality of alignment ribs disposed on the first outer casing, and each of the detachable sound guiding components a plurality of alignment grooves disposed on the second outer casing and respectively corresponding to the plurality of the alignment ribs, wherein the first fastening structure is a fastening bump, and the second The fastening structure is a clamping chute that is engaged with the fastening protrusions. A detachable sound playing module, comprising: a sound amplification component, the sound reinforcement component comprising a first outer casing, a plurality of first fastening structures disposed on the first outer casing, and a setting a first conductive pairing structure on the first annular side wall of the first outer casing, wherein an inner portion of the first outer casing forms a sound amplifying chamber having a predetermined space, and the first outer casing has An assembly groove communicating with the sound amplification chamber; and a detachable sound guide assembly including a second outer casing corresponding to the assembly groove, a fixed a sound guiding unit coated on the inside of the second outer casing, a plurality of second fastening structures disposed on the second outer casing and respectively corresponding to the plurality of first fastening structures, and a second a second conductive pairing structure disposed on the second annular sidewall of the second outer casing and corresponding to the first conductive pairing structure; wherein the detachable sound guiding component is received in the sound amplification component In the assembly groove, and the plurality of the second fastening structures and the plurality of A first latch structure fastened to each other cooperate to guide the sound to the detachable second shell component removably positioned within the recess of the assembled loudspeaker assembly. The detachable sound playing module of claim 4, wherein the sound guiding unit is a single frequency sound guiding unit, and the single frequency sound guiding unit comprises a speaker diaphragm module And a magnetic circuit assembly adjacent to the speaker diaphragm assembly for use in the speaker diaphragm assembly. The detachable sound playing module of claim 4, wherein the sound guiding unit is a coaxial dual frequency sound guiding unit, and the coaxial dual frequency sound guiding unit comprises a woofer diaphragm module. a tweeter diaphragm assembly, and a microphone disposed between the woofer diaphragm assembly and the tweeter diaphragm assembly for use with the woofer diaphragm assembly and the tweeter diaphragm assembly Share the magnetic circuit assembly. The detachable sound playing module of claim 4, wherein the sound amplifying component comprises a plurality of alignment grooves disposed on the first outer casing, and each of the detachable sound guiding components a plurality of alignment ribs disposed on the second outer casing and respectively corresponding to the plurality of alignment grooves, wherein the first fastening structure is a clamping chute, and the second The fastening structure is a fastening protrusion that is engaged with the clamping groove. The detachable sound playing module of claim 4, wherein the sound reinforcement component comprises a plurality of alignment ribs disposed on the first outer casing, and each of the detachable sound guiding components a plurality of alignment grooves disposed on the second outer casing and respectively corresponding to the plurality of the alignment ribs, wherein the first fastening structure is a fastening bump, and the second The fastening structure is a clamping chute that is engaged with the fastening protrusions. A customized earphone structure, comprising: a headphone skeleton; and two detachable sound playing modules, wherein the two detachable sound playing modules are respectively disposed on opposite opposite ends of the earphone skeleton Each of the detachable sound playback modules includes: a sound reinforcement assembly, the sound reinforcement assembly includes a first outer casing, a plurality of first fastening structures disposed on the first outer casing, And one set in the first a first conductive pairing structure on the first annular side wall of the outer casing, wherein the interior of the first outer casing forms a sound amplifying chamber having a predetermined space, and the first outer casing has a communication with the An assembly groove of the sound reinforcement chamber; and a detachable sound guide assembly, the detachable sound guide assembly including a second outer casing corresponding to the assembly groove, a fixed and covered a coaxial dual-frequency sound guiding unit inside the second outer casing, a plurality of second fastening structures disposed on the second outer casing and corresponding to the plurality of the first fastening structures, and a setting a second conductive pairing structure on the second annular sidewall of the second outer casing and corresponding to the first conductive pairing structure, wherein the coaxial dual-frequency sound guiding unit comprises a woofer diaphragm assembly, a tweeter diaphragm assembly, and a shared magnet disposed between the woofer diaphragm assembly and the tweeter diaphragm assembly for use with the woofer diaphragm assembly and the tweeter diaphragm assembly return An assembly, wherein the second outer casing has a sound output opening; wherein the detachable sound guiding component is received in the assembly groove of the sound reinforcement component, and the plurality of the second fastening The structure is respectively engaged with the plurality of the first fastening structures to detachably position the second outer casing of the detachable sound guiding component in the assembly groove of the sound amplification component And electrically contacting the second conductive pairing structure with the first conductive pairing structure. The customized earphone structure of claim 9, wherein the sound reinforcement component comprises a plurality of alignment grooves disposed on the first outer casing, and each of the detachable sound guide components comprises a plurality of And a pair of ribs disposed on the second outer casing and respectively corresponding to the plurality of alignment grooves, wherein the first fastening structure is a clamping chute, and the second clamping The structure is a card and a locking fit with the clamping chute Reinforced bumps. The customized earphone structure of claim 9, wherein the sound reinforcement component comprises a plurality of alignment ribs disposed on the first outer casing, and each of the detachable sound guide components comprises And a matching groove disposed on the second outer casing and corresponding to each of the plurality of alignment ribs, wherein the first fastening structure is a fastening bump, and the second fastening The structure is a clamping chute that is in abutting engagement with the fastening bump.