TWI600781B - Vapor deposition equipment - Google Patents

Description

Vapor deposition device

The invention relates to a vapor deposition device (referred to as a vapor deposition device, referred to herein as a vapor deposition device), and a plurality of vapor deposition material containers are arranged in the circumferential direction of the rotatable rotary support body. The vapor deposition material storage system accommodates a vapor deposition material in a recessed portion of the top surface opening, guides the specific vapor deposition material storage body to the heating position by the rotation support body, and heats the concave portion of the vapor deposition material storage body. The vapor deposition material is evaporated and vapor-deposited on the surface of the material to be processed through the opening. In particular, when the vapor deposition material contained in the concave portion of the specific vapor deposition material storage body is heated by the beam irradiation, and the vapor deposition material is evaporated, the vapor deposition material which is prevented from being evaporated can be contained in the other vapor deposition material. The evaporation material of the container.

Conventionally, various materials have been formed on the surface of various materials to be processed such as a glass substrate by using a vacuum vapor deposition device.

Therefore, in the vapor deposition apparatus, various vapor deposition materials are housed in the concave portion of the vapor deposition material storage body such as a crucible, and the energy beam such as a plasma gun is used to emit a plasma beam or the like. The top surface of the opening of the vapor deposition material container is irradiated to the vapor deposition material accommodated in the concave portion, and is evaporated The vapor deposition material is vapor-deposited on the surface of the material to be processed to form a film.

Further, in such a vapor deposition apparatus, when different vapor deposition materials are sequentially deposited on the surface of the material to be processed, and different vapor deposition materials are vapor-deposited on the surface of the material to be processed, in order to efficiently front on the surface of the material to be processed Each of the vapor deposition materials is vapor-deposited, and as described in Patent Documents 1 and 2, a plurality of vapor deposition material storage portions for accommodating the vapor deposition material are arranged at intervals in the circumferential direction of the top surface of the rotatable rotating body. The specific vapor deposition material storage portion provided in the rotating body is guided to the energy beam irradiation position, and the energy beam is irradiated onto the vapor deposition material accommodated in the vapor deposition material storage portion to evaporate the vapor deposition material.

However, when the vapor deposition material contained in the vapor deposition material storage portion guided to the energy beam irradiation position is irradiated with the energy beam and the vapor deposition material is evaporated, the vapor deposition material evaporated by the vapor deposition material storage portion is not only The surface of the processing material is also introduced into another vapor deposition material storage portion provided in the rotating body, and there is a problem that the evaporated vapor deposition material is mixed into the vapor deposition material accommodated in the other vapor deposition material storage portion.

Therefore, Patent Document 2 discloses a device in which a protective cover having an opening is provided in a portion facing the vapor deposition material accommodating portion guided to the energy beam irradiation position, and is rotated in such a manner as to cover another vapor deposition material storage portion. The upper portion of the body is disposed at a required interval, and the vapor deposition material evaporated from the vapor deposition material storage portion guided to the energy beam irradiation position is prevented from being mixed into another vapor deposition material storage portion that is not guided to the energy beam irradiation position. Evaporation material.

However, when the protective cover is provided at a required interval above the rotating body, the vapor deposition material evaporated from the vapor deposition material accommodating portion guided to the energy beam irradiation position is introduced into the other steam through the protective cover and the rotating body. In the plating material storage body, it is not possible to sufficiently prevent the evaporated vapor deposition material from being mixed into the vapor deposition material accommodated in the other vapor deposition material storage portion, and the evaporated vapor deposition material adheres to the bottom surface of the protective cover, and rotates the rotating body and steams the other. When the plating material storage portion is guided to the energy beam irradiation position, the vapor deposition material adhered to the bottom surface of the protective cover is dropped into the other vapor deposition material storage portion and mixed with the vapor deposition material contained therein.

Further, in consideration of narrowing the gap between the protective cover and the rotating body, the evaporation material to be evaporated is introduced between the protective cover and the rotating body to introduce another vapor-deposited material container, but the rotating body is rotated and The vapor deposition material storage portion is guided to the position of the energy beam irradiation position, and the narrowing of the gap between the protective cover and the rotating body has a limit, and it is difficult to appropriately prevent the vapor deposition material evaporated by the specific vapor deposition material storage portion from being attached to the protection. The vapor deposition material on the bottom surface of the lid and the evaporation material is mixed with the vapor deposition material accommodated in the other vapor deposition material storage portion between the protective cover and the rotating body.

In particular, when the vapor deposition material storage body that accommodates the vapor deposition material is provided on the top surface of the rotary support, and the vapor deposition material storage system protrudes upward from the rotary support, the protective cover and the protective cover are provided as described above. The gap between the gaps is increased, and it is difficult to sufficiently prevent the vapor deposition material evaporated by the specific vapor deposition material container from being mixed into the vapor deposition material accommodated in the other vapor deposition material storage body.

Advanced technical literature

Patent Document 1: Japanese Unexamined Publication No. Sho 62-110263

Patent Document 2: Japanese Patent Laid-Open Publication No. 2004-256843

An object of the present invention is to provide a vapor deposition device in which a plurality of vapor deposition material storage bodies are disposed in a circumferential direction on a rotatable rotary support, and the vapor deposition material storage system is housed in a concave portion of a top opening. In the vapor deposition material, the specific vapor deposition material storage body is guided to a heating position such as a beam irradiation position by the rotary support, and the vapor deposition material can be irradiated to the vapor deposition material accommodated in the concave portion through the opening of the vapor deposition material storage body. The vapor deposition material is heated, and the vapor deposition material is evaporated and vapor-deposited on the surface of the material to be treated.

In other words, the vapor deposition device of the present invention is characterized in that the vapor deposition material is irradiated onto a vapor deposition material contained in a concave portion of a vapor deposition material storage body that is guided to a heating position such as a beam irradiation position, and is heated and evaporated. When the material is vapor-deposited on the surface of the material to be treated, the evaporation material can be appropriately prevented from being mixed into the vapor deposition material accommodated in the other vapor deposition material storage body.

In the present invention, in order to solve the above-described problems, a plurality of vapor deposition material storage bodies are disposed in a circumferential direction on a rotatable rotary support, and the vapor deposition material storage system accommodates a vapor deposition material in a recessed portion of the top surface opening. The rotary support guides the specific vapor deposition material storage body to a heating position, and heats the vapor deposition material accommodated in the concave portion of the vapor deposition material storage body, and the vapor deposition material is evaporated by the opening and vapor-deposited on the surface of the workpiece. Wherein, the anti-plating member is disposed on the rotating support body so as to cover the top surface of the other vapor-deposited material storage body, and the anti-plating member is provided with an exposure guide The opening top surface of the vapor deposition material storage body to the heating position is at the opening top surface of the vapor deposition material storage body that is guided to the heating position, and is higher than the bottom surface of the plating resist member of the opening of the opening.

When the top surface position of the opening of the vapor deposition material storage body guided to the heating position is higher than the bottom surface of the plating resist member that exposes the opening of the opening portion of the vapor deposition material storage body, the irradiation energy beam is suppressed and steamed. The vapor deposition material evaporated on the top surface of the opening of the plating material storage body is introduced into the bottom surface side of the plating resist member between the vapor deposition material storage body and the opening portion, and prevents evaporation of the vapor deposition material from passing through the bottom surface of the plating resist member. Introduce another vapor deposition material container by rotating the support. In particular, when the top surface of the vapor-deposited material container guided to the heating position is higher than the top surface of the anti-plating member of the opening of the opening, the evaporation of the vapor-deposited material is prevented from passing through the vapor-deposited material. The vapor deposition material that is introduced into the bottom surface side of the plating resist between the opening portion and the evaporation prevention material is introduced into the other vapor deposition material storage body between the bottom surface of the plating resist member and the rotating support.

Here, as described above, the plating support member is disposed on the rotary support body so as to cover the top surface of the other vapor deposition material storage body, and the plating resist member is provided with an opening that exposes the vapor deposition material storage body that is guided to the heating position. And the position of the top surface of the vapor-deposited material receiving body guided to the heating position is higher than the bottom surface of the anti-plating member of the opening of the opening portion, wherein the anti-plating member can be formed to have a difference between the lower portion and the upper portion. The opening is provided in a lower portion of the plating resist member, and the opening exposes the vapor deposition material container guided to the heating position.

Further, in the vapor deposition device, if the anti-plating structure is A separation convex portion is disposed between the member and the rotating support body, and the separation convex portion separates the vapor deposition material storage body guided to the heating position and the adjacent vapor deposition material storage body, so that the separation convex portion is provided The gap between the bottom surface of the plating member and the rotating support is narrower, and the vapor deposition material that is evaporated is introduced into the bottom surface of the plating resist member through the top surface of the opening of the vapor deposition material container through the vapor deposition material container and the opening portion. On the side, the vapor deposition material which further prevents evaporation between the bottom surface of the plating resist member provided with the separation convex portion and the rotary support is also prevented from being introduced into the other vapor deposition material storage body.

Further, in the vapor deposition device, the vapor deposition material of the specific vapor deposition material container guided to the heating position is evaporated, and the vapor deposition material is vapor-deposited on the surface of the material to be processed, and then supported by the rotation support. When the vapor deposition material storage body is guided to the heating position, a lifting device that lifts and lowers at least one of the plating resist member and the rotation support member may be provided.

Then, when the plating resist member is lifted and lowered by the lifting device, the plating preventing member is raised by the lifting device to a position where the bottom surface of the opening of the opening portion does not collide with the top surface of the vapor deposition material storage body, and in this state The rotating support is rotated to guide the next vapor deposition material container to the heating position. Then, after the next vapor deposition material storage body is guided to the heating position, the plating preventing member is lowered by the lifting device, so that the position of the top surface of the opening of the next vapor deposition material storage body is higher than the opening of the opening portion. The bottom surface of the plating resist member.

Further, in the vapor deposition device, when the heat-resistant ring is provided in the opening of the opening portion of the plating resist member, the top surface portion of the heat-resistant ring can be inclined downward by the inner circumference to the outer circumference, thereby suppressing Anti-plating The opening of the opening portion is deformed by heat, and the powder block of the vapor deposition material adhered to the opening of the opening portion is guided to the top surface of the heat-resistant ring along the surface inclined downward from the outer peripheral side to the anti-plating. In the member, when the plating resist member is lifted or lowered, the block of the vapor deposition material adhering to the opening of the opening portion can be prevented from falling on the rotary support or other vapor deposition material storage body.

In the vapor deposition device of the present invention, a plating resist member is disposed on the rotary support so as to cover the top surface of the other vapor deposition material storage body, and the plating resist member is provided with a vapor deposition material that is exposed and guided to the heating position. The opening portion of the body and the top surface of the opening of the vapor deposition material container guided to the heating position are higher than the bottom surface of the plating preventing member of the opening of the opening portion, thereby suppressing the irradiation energy beam and evaporating The vapor deposition material that evaporates from the top surface of the opening of the material storage body is introduced into the bottom surface side of the plating resist member between the vapor deposition material storage body and the opening, and prevents the vapor deposition material from evaporating from adhering to the bottom surface of the plating resist member. Another vapor deposition material container is introduced between the bottom surface of the plating resist member and the rotating support.

As a result, in the vapor deposition device of the present invention, the vapor deposition material accommodated in the concave portion of the vapor deposition material container is irradiated with energy by the opening of the vapor deposition material container guided to the heating position by the rotation of the support. When the vapor deposition material is evaporated and the vapor deposition material is vapor-deposited on the surface of the material to be processed, the vapor deposition material evaporated from the vapor deposition material storage body can be appropriately prevented from being introduced into another vapor deposition material storage body and mixed and stored in another steaming material. The plating material accommodates the vapor deposition material in the body.

1‧‧‧vacuum room

2‧‧‧Rotating device

2a‧‧‧Rotary axis

2b‧‧‧ Sealing members

3‧‧‧Deposition of vapor deposition material

4‧‧‧ lifting device

4a‧‧‧ Lifting rod

4b‧‧‧ Sealing members

5‧‧‧beam beam ejection device

10‧‧‧Rotary support

11‧‧‧ Keep the recess

12‧‧‧Separation of convex parts

13‧‧‧ annular convex

20‧‧‧Anti-plating components

20a‧‧‧The next section

20b‧‧‧The last section

20c‧‧‧ Sidewall

21‧‧‧ openings

22‧‧‧ highlights

23‧‧‧Heat ring

30‧‧‧Clock components

31‧‧‧Installation

32‧‧‧through holes

33‧‧‧Separation of convex parts

34‧‧‧ annular convex

B‧‧‧Bundle

T‧‧‧ evaporation materials

W‧‧‧Processed material

1 is a schematic explanatory view showing a state of a vapor deposition device according to an embodiment of the present invention, which is directed to a vapor deposition material storage body that is guided to a beam irradiation position by a rotation support, and is emitted by the energy beam injection device. The vapor deposition material accommodated in the vapor deposition material storage body is irradiated, and the vapor deposition material is evaporated, and the vapor deposition material is vapor-deposited on the surface of the material to be processed.

Fig. 2 is an exploded perspective view showing the plating resist member, the vapor deposition material container, and the rotation support in the vapor deposition device of the embodiment.

Fig. 3 is a schematic explanatory view of a vapor deposition device of the above-described embodiment, showing a plurality of vapor deposition material storage bodies in which a vapor deposition material is accommodated in a concave portion having a top surface opening, and held in a circumferential direction of a top surface of a rotary support; The state in each of the holding recesses provided at intervals.

Fig. 4 is a schematic explanatory view of the vapor deposition device of the embodiment, in which the vapor deposition material storage body in which the vapor deposition material is accommodated is held in each of the holding recesses provided in the circumferential direction of the rotary support, The top surface of the opening of the vapor deposition material container guided to the energy beam irradiation position is exposed to the opening, and the plating resist member is placed on the rotary support.

In the vapor deposition device of the above-described embodiment, the position of the top surface of the vapor deposition material container guided to the energy beam irradiation position is higher than the top surface of the opening portion of the plating resist member, and the plating resist member is formed. Disposed on the rotating support, in this state, the vapor deposition material contained in the concave portion of the vapor deposition material storage body is irradiated with energy beam, (A) is a partial cross-sectional explanatory view in the radial direction, and (B) is a circumferential direction. Partial section illustration.

Figure 6 is a schematic perspective view of the vapor deposition device of the above embodiment. In a state in which the plating resist member disposed on the rotary support is raised upward, the rotary support of the vapor deposition material storage body is rotated and the other vapor deposition material storage body is guided to the energy beam irradiation position.

Fig. 7 is an exploded perspective view of the vapor deposition device of the above embodiment, showing a state in which a separation convex portion and an annular convex portion are provided on a disk member that can be detachably attached to the rotation support.

FIG. 8 is a partial cross-sectional explanatory view of the vapor deposition device of the embodiment, in which a heat-resistant ring is provided in an opening of the opening of the plating resist member, and the heat-resistant ring top surface portion is inclined downward from the inner circumferential side toward the outer circumferential side. status.

Hereinafter, a vapor deposition device according to an embodiment of the present invention will be specifically described with reference to the drawings. In addition, the vapor deposition device of the present invention is not limited to the embodiments described below, and can be appropriately modified without departing from the scope of the invention.

In the vapor deposition device of this embodiment, as shown in Fig. 1, the rotary shaft 2a of the rotary device 2 is introduced into the vacuum chamber 1 from the bottom of the vacuum chamber 1, and the center portion of the disk-shaped rotary support 10 is maintained at the center. The rotation shaft 2a rotates the rotation support 10 around the rotation shaft 2a. Further, the sealing member 2b is provided so that the outside air does not enter the vacuum chamber 1 from the portion into which the inside of the vacuum chamber 1 is rotated from the rotating shaft 2a of the rotating device 2.

Further, on the top surface of the rotary support 10, as shown in FIGS. 2 and 3, a plurality of (four in the illustrated example) holding recesses 11 are provided in the circumferential direction at a desired interval, and Separating the holding recesses 11 and dividing the top surface of the rotating support 10 into four equal parts, from The separation convex portion 12 composed of a triangular projection is radially provided in the core portion, and the annular convex portion 13 protruding upward is provided along the outer circumference of the top surface of the rotation support 10.

Next, in each of the holding recesses 11 provided on the top surface of the rotary support 10, as shown in FIG. 3, each of the vapor deposition material containers 3 accommodating the vapor deposition material T is held in the recessed portion of the top surface opening, and each vapor deposition is performed. The top surface of the material container 3 is located above the separation protrusion 12.

Further, a flat-plate-shaped anti-plating member 20 is disposed on the rotary support 10 so as to cover the top surface of the other vapor-deposited material container 3, and the anti-plating member 20 is provided with a vapor that is exposed to the irradiation position of the energy beam. The opening 21 of the plating material container 3 is formed.

Further, the plating resist member 20 has a larger outer diameter than the rotary support 10, and covers the outer peripheral side of the rotary support 10 by the side wall portion 20c extending downward along the outer periphery of the plating resist member 20.

Further, at positions on both sides in the diameter direction of the plating resist member 20, protruding pieces 22 respectively protruding in opposite directions from the outer periphery of the plating resist member 20 are provided, and the protruding pieces 22 on the both sides are respectively maintained at the bottom of the vacuum chamber 1 The lifting rod 4a of the lifting device 4 in the vacuum chamber 1 raises and lowers the plating resist member 20 above the rotating support 10 by the lifting rod 4a of the lifting device 4. Further, the sealing member 4b is provided so that the outside air does not enter the vacuum chamber 1 from the portion where the lifting rod 4a of the lifting device 4 is introduced into the vacuum chamber 1.

Here, the plating resist member 20 is formed with a fan-shaped lower portion 20a having the opening portion 21 and a higher portion than the lower portion 20a. He was in the upper section of section 20b.

Next, in the vapor deposition device of the embodiment, as shown in the first embodiment, the energy beam B such as a plasma gun provided on the side of the vacuum chamber 1 emits a beam B of a plasma energy beam or the like. The vapor deposition material T accommodated in the concave portion of the vapor deposition material container 3 guided to the energy beam irradiation position irradiates the energy beam B and evaporates the vapor deposition material T, and vaporizes the evaporated vapor deposition material T in the vacuum chamber 1 The upper surface of the material W to be processed.

In this embodiment, as shown in FIG. 6, the anti-plating member 20 is raised by the elevating rod 4a provided in the elevating device 4, and the rotating device 2 is centered on the rotating shaft 2a. The rotating support body 10 of the vapor deposition material storage body 3 is rotated, and the vapor deposition material storage body 3 containing the vapor deposition material T vapor-deposited to the workpiece W is guided to the energy beam irradiation position, and then is provided by the above-described lifting The lifting rod 4a of the device 4 lowers the plating preventing member 20.

Then, the anti-plating member 20 is lowered, and as shown in FIG. 1, FIG. 4, and FIG. 5(A) and (B), the guide portion is provided in the opening portion 21 of the lower portion 20a of the plating resist member 20. The vapor deposition material container 3 that is guided to the irradiation position of the beam is protruded from the top surface of the vapor deposition material container 3 guided to the energy beam irradiation position, and is higher than the opening provided in the opening portion 21 of the plating resist member 20. The top surface of the anti-plating member 20 is divided into portions for maintaining the vapor deposition material storage body 3 guided to the energy beam irradiation position, and the two separation convex portions 12 radially disposed on the top surface of the rotation support 10 are located at Below the bottom surface of the sector-shaped lower portion 20a of the opening portion 21, the gap between the bottom surface of the lower portion 20a of the plating resist member 20 and the top surface of the rotary support 10 is extremely narrow.

Then, the top surface of the vapor deposition material container 3 thus guided to the energy beam irradiation position protrudes from the top surface of the plating resist member 20 provided in the opening of the opening portion 21 of the plating resist member 20, and will be as described above. The energy beam B is irradiated onto the vapor deposition material T accommodated in the vapor deposition material storage body 3, and the vapor deposition material T accommodated in the vapor deposition material storage body 3 is evaporated.

In this way, the vapor deposition material T which is prevented from evaporating flows from the opening top surface of the vapor deposition material container 3 to the bottom surface side of the plating resist member 20 through the vapor deposition material container 3 and the opening portion 21 of the plating resist member 20, Even if the evaporated vapor deposition material T flows into the bottom surface side of the plating resist member 20, the two separation convex portions 12 are provided on the top surface of the rotary support 10, and the vapor deposition material storage body that is guided and guided to the energy beam irradiation position is divided and arranged. In the portion of the third portion, the gap between the bottom surface of the lower portion 20a of the plating resist member 20 and the top surface of the rotary support 10 is extremely narrow, so that the vapor deposition material T flowing into the bottom surface side of the plating resist member 20 is prevented from passing through the plating resist member 20. The bottom surface of the lower stage portion 20a and the top surface of the rotary support 10 are introduced into the other vapor deposition material storage body 3.

As a result, in the vapor deposition device of the embodiment, when the vapor deposition material T contained in the vapor deposition material container 3 guided to the energy beam irradiation position is evaporated and vapor-deposited on the surface of the workpiece W, it can be appropriately prevented. The vapor deposition material T evaporated by the vapor deposition material storage body 3 is introduced into the other vapor deposition material storage body 3, and is mixed into the vapor deposition material T accommodated in the other vapor deposition material storage body 3.

Further, in the vapor deposition device of the embodiment, since the separation convex portion 12 has a triangular projection shape, even when the plating resist member 20 is lifted and lowered as described above, even if the powder block of the vapor deposition material T falls on the separation convex portion 12 , the The powder block of the vapor deposition material T is rolled onto the rotary support 10 by the separation convex portion 12 without sandwiching the powder block of the vapor deposition material T between the separation convex portion 12 and the bottom surface of the plating resist member 20.

Further, in the embodiment, the top surface of the rotary support 10 itself is provided with the separation convex portion 12 and the annular convex portion 13, but as shown in Fig. 7, the top surface of the rotary support 10 can be detachably mounted. In the disk member 30, a mounting hole portion 31 in which the rotary support 10 is mounted is provided at a central portion of the disk member 30, and a through hole 32 corresponding to the holding recess 11 of the rotary support 10 is provided at the disk member 30. The top surface is provided with a separation convex portion 33 which is formed in a triangular shape by a centrally formed mounting portion 31, and is provided with an annular convex portion 34 which protrudes upward along the outer periphery of the top surface of the circular plate member 30. When the disk member 30 is detachably attached to the top surface of the rotary support 10, even if the vapor deposition material T flows into the bottom surface side of the plating resist member 20 and the vapor deposition material T adheres to the disk member 30, the circle can be made. The plate member 30 is detached from the top surface of the rotary support 10 and is simply exchanged.

Further, in this embodiment, the top surface of the vapor deposition material container 3 guided to the energy beam irradiation position is protruded as described above, and is higher than the top of the plating resist member 20 provided at the opening of the opening portion 21 of the plating resist member 20. In addition, even if the top surface position of the vapor deposition material container 3 guided to the energy beam irradiation position is higher than the bottom surface of the opening portion 21 provided in the opening portion 21 of the plating resist member 20, The vapor deposition material T which is caused to evaporate from the top surface of the opening of the vapor deposition material container 3 passes between the vapor deposition material container 3 and the opening 21 of the plating resist member 20, and flows into the bottom surface side of the plating resist member 20.

Further, in the vapor deposition device of the above embodiment, as in the eighth As shown in the figure, the heat-resistant ring 23 is provided in the opening of the opening portion 21 of the plating resist member 20, and the top surface portion of the heat-resistant ring 23 is inclined downward from the inner peripheral side toward the outer peripheral side, and the heat-resistant ring 23 is used. When the opening of the opening portion 21 of the plating resist member 20 is suppressed from being deformed by heat, even if the vapor deposition material T adhering to the opening of the opening portion 21 is peeled off when the plating resist member 20 is lifted and lowered to form scales, the heat-resistant ring 23 is formed. The top surface portion is guided to the plating resist member 20 along a surface that is inclined downward toward the outer peripheral side, and is prevented from falling into the rotary support 10 or other vapor-deposited material storage body 3.

In the vapor deposition device of the embodiment, the energy beam B is heated by the energy beam emitting device 5 and the vapor deposition material T is heated. However, a heating means (not shown) such as an electric heater may be provided. The vapor deposition material T is heated.

1‧‧‧vacuum room

2‧‧‧Rotating device

2a‧‧‧Rotary axis

2b‧‧‧ Sealing members

3‧‧‧Deposition of vapor deposition material

4‧‧‧ lifting device

4a‧‧‧ Lifting rod

4b‧‧‧ Sealing members

5‧‧‧beam beam ejection device

10‧‧‧Rotary support

12‧‧‧Separation of convex parts

13‧‧‧ annular convex

20‧‧‧Anti-plating components

20a‧‧‧The next section

20b‧‧‧The last section

20c‧‧‧ Sidewall

21‧‧‧ openings

22‧‧‧ highlights

B‧‧‧Bundle

W‧‧‧Processed material

Claims (9)

A vapor deposition device is provided with a plurality of vapor deposition material storage bodies in a circumferential direction on a rotatable rotary support body, wherein the vapor deposition material storage system houses a vapor deposition material in a concave portion of a top surface opening, and the rotary support body And guiding the specific vapor deposition material storage body to the heating position, and heating the vapor deposition material contained in the concave portion of the vapor deposition material storage body, and evaporating the vapor deposition material through the opening and vapor-depositing the surface of the material to be processed, wherein The plating support member is disposed on the rotating support body so as to cover the top surface of the other vapor deposition material storage body, and the plating resist member is provided with an opening portion that exposes the vapor deposition material storage body that is guided to the heating position, and is guided to The position of the opening top surface of the vapor deposition material storage body at the heating position is a bottom surface of the plating resist member which is higher than the opening of the opening portion, and the plating resist member is formed to have a difference between the lower portion and the upper portion, and the opening portion is provided The lower portion of the plating resist member exposes the vapor deposition material container guided to the heating position. A vapor deposition device is provided with a plurality of vapor deposition material storage bodies in a circumferential direction on a rotatable rotary support body, wherein the vapor deposition material storage system houses a vapor deposition material in a concave portion of a top surface opening, and the rotary support body And guiding the specific vapor deposition material storage body to the heating position, and heating the vapor deposition material contained in the concave portion of the vapor deposition material storage body, and evaporating the vapor deposition material through the opening and vapor-depositing the surface of the material to be processed, wherein A plating resist member is disposed on the rotating support body so as to cover the top surface of the other vapor deposition material storage body, and the plating resist member is provided with an opening portion that exposes the vapor deposition material storage body that is guided to the heating position. a position of an opening top surface of the vapor deposition material storage body that is led to the heating position is a bottom surface of the plating resist member that is higher than an opening of the opening portion, and a separation convex portion is provided between the plating resist member and the rotating support body, and the separation convex portion is provided The vapor deposition material storage body guided to the heating position and the other vapor deposition material storage body adjacent thereto are separated. A vapor deposition device is provided with a plurality of vapor deposition material storage bodies in a circumferential direction on a rotatable rotary support body, wherein the vapor deposition material storage system houses a vapor deposition material in a concave portion of a top surface opening, and the rotary support body And guiding the specific vapor deposition material storage body to the heating position, and heating the vapor deposition material contained in the concave portion of the vapor deposition material storage body, and evaporating the vapor deposition material through the opening and vapor-depositing the surface of the material to be processed, wherein The plating support member is disposed on the rotating support body so as to cover the top surface of the other vapor deposition material storage body, and the plating resist member is provided with an opening portion that exposes the vapor deposition material storage body that is guided to the heating position, and is guided to a position of an opening top surface of the vapor deposition material storage body at a heating position is a bottom surface of the plating resist member that is higher than an opening of the opening portion, and a heat-resistant ring is provided at an opening of the opening portion of the plating resist member, and a top surface of the heat-resistant ring It is inclined downward from the inner circumference to the outer circumference. The vapor deposition device according to claim 1 or 3, wherein a separation convex portion is provided between the plating resist member and the rotary support, and the separation convex portion separates the vapor deposition material guided to the heating position. The body and another vapor deposition material container adjacent to each other. The vapor deposition device according to any one of claims 1 to 3, characterized in that the elevating device is provided with the anti-plating member Lifting and lowering with at least one of the rotating supports. The vapor deposition device according to claim 5, wherein the anti-plating member is raised by the lifting device to the bottom surface of the opening of the opening portion by the lifting device, and is not accommodated with the vapor deposition material. The position of the top surface collision and the rotation of the rotating support in this state. The vapor deposition device according to the first or second aspect of the invention, wherein the heat-resistant ring is provided in the opening of the opening portion of the plating resist member, and the top surface portion of the heat-resistant ring is oriented from the inner circumference to the outer circumference. Tilt down. The vapor deposition device according to any one of claims 1 to 3, wherein the vapor deposition material is irradiated to the vapor deposition material when the vapor deposition material contained in the vapor deposition material storage body is heated. The vapor deposition device according to claim 2, wherein the plating resist member has a stepped portion having a lower portion and an upper portion, and the opening portion is provided in a lower portion of the plating resist member, the opening portion The vapor deposition material container guided to the heating position is exposed.