TWI600235B - Filter module structure - Google Patents
Filter module structure Download PDFInfo
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- TWI600235B TWI600235B TW105136774A TW105136774A TWI600235B TW I600235 B TWI600235 B TW I600235B TW 105136774 A TW105136774 A TW 105136774A TW 105136774 A TW105136774 A TW 105136774A TW I600235 B TWI600235 B TW I600235B
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- circuit board
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- wire bonding
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- 238000005476 soldering Methods 0.000 claims description 52
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 230000001681 protective effect Effects 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 14
- 230000006870 function Effects 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005288 electromagnetic effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
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- Filters And Equalizers (AREA)
- Coils Of Transformers For General Uses (AREA)
Description
一種濾波模組結構,尤指一種新型濾波模組結構。A filter module structure, especially a novel filter module structure.
現今電腦科技的快速發展,而桌上型電腦或筆記型電腦已普遍的存在於社會上的各個角落,其電腦發展趨勢亦朝運算功能強、速度快及體積小的方向邁進,由於網路通訊技術也正在迅速蓬勃發展中,並將人們生活、學習、工作與休閒帶入另一有別以往的嶄新境界,讓人們與網路之間的關係更為熱切且密不可分。Nowadays, the rapid development of computer technology, desktop computers or notebook computers have been widely found in every corner of the society, and the development trend of computers is also moving toward the direction of computing power, speed and small size, due to network communication. Technology is also rapidly evolving, bringing people's lives, learning, work and leisure into a new realm that is different from the past, making people's relationship with the Internet more eager and inseparable.
再者,隨著電腦或筆記型電腦發展趨勢,使電腦內部的連接器亦隨之大幅縮小,但連接器於電腦縮小化,即需考慮其電磁效應所產生的信號干擾問題,而一般會影響連接器的雜訊干擾的原因大致上可分為二大部分,其一為來自連接器周圍的電磁波干擾,其二為連接器內部所產生的干擾,且因一般 RJ45 連接器大多被使用於數位通信,便有廠商於網路連接器內部設置有濾波模組來解決上述的缺點,即可將網路連接器所接收的外部網路信號進行濾波的動作,並保留實際有用的信號,以便將網路信號傳輸至外部控制電路介面,再轉換成為串列式資料傳輸信號後,便可在資料處理系統內進行信號處理。Furthermore, with the development trend of computers or notebook computers, the connectors inside the computer have also been greatly reduced. However, when the connector is reduced in size, it is necessary to consider the signal interference caused by its electromagnetic effect, which generally affects. The reason for the noise interference of the connector can be roughly divided into two parts, one is the electromagnetic wave interference from the connector, the other is the interference generated inside the connector, and the RJ45 connector is mostly used for digital digits. In communication, there is a filter module installed in the network connector to solve the above disadvantages, and the external network signal received by the network connector can be filtered, and the actual useful signal is retained, so that After the network signal is transmitted to the external control circuit interface and converted into a serial data transmission signal, the signal processing can be performed in the data processing system.
為了使得RJ45 連接器具有更好的電氣性能,其內均設置有濾波模組。如圖1所示,傳統濾波模組由絕緣本體10′、連接端子20′和濾波線圈30′部件等組成,濾波線圈30′組裝到電路板電氣焊接前,需要先將濾波線圈30′上的金屬引線31′分類纏繞到絕緣本體10′的連接端子20′上,再將金屬引線31′與連接端子20′進行焊接,之後再與電路板進行搭配焊接。然而,上述濾波模組結構佔用空間較大,製作週期較長,結構複雜,生產成本較高。因此,有必要對目前的濾波模組結構進行改進。In order to make the RJ45 connector have better electrical performance, a filter module is provided therein. As shown in FIG. 1 , the conventional filter module is composed of an insulating body 10 ′, a connecting terminal 20 ′ and a filter coil 30 ′ component, and the filter coil 30 ′ is assembled to the circuit board before electrical welding, and the filter coil 30 ′ needs to be first The metal lead 31' is wound and wound onto the connection terminal 20' of the insulative housing 10', and the metal lead 31' is soldered to the connection terminal 20', and then soldered to the circuit board. However, the above filter module has a large occupied structure, a long manufacturing cycle, a complicated structure, and a high production cost. Therefore, it is necessary to improve the structure of the current filter module.
有鑑於此,本發明針對現有技術存在之缺失,其主要目的是提供一種濾波模組結構,其能有效解決現有之濾波模組存在佔用空間較大、製作週期較長、結構複雜、生產成本較高等問題。In view of this, the present invention is directed to the lack of the prior art, and the main purpose thereof is to provide a filter module structure, which can effectively solve the existing filter module has a large occupied space, a long production cycle, a complicated structure, and a relatively high production cost. Higher problems.
為實現上述目的,本發明採用如下之技術方案:In order to achieve the above object, the present invention adopts the following technical solutions:
一種濾波模組結構,包括有絕緣本體、連接端子以及濾波線圈;該絕緣本體上具有線圈容置腔,該線圈容置腔的兩側具有防護隔欄,線圈容置腔的另外兩側具有多個分線柱,相鄰兩分線柱之間形成有喇叭口,該分線柱的底部設置有分線槽,分線槽通過喇叭口連通線圈容置腔內部;該連接端子與絕緣本體結合在一起,連接端子具有引線焊接部和焊腳部,該引線焊接部位於線圈容置腔外,該焊腳部伸出絕緣本體外;該濾波線圈固定於線圈容置腔內,濾波線圈的引線穿過喇叭口和分線槽抵於引線焊接部的表面上並與引線焊接部焊接。A filter module structure comprises an insulating body, a connecting terminal and a filter coil; the insulating body has a coil accommodating cavity, and the two sides of the coil accommodating cavity have a protective barrier, and the other sides of the coil accommodating cavity have more a splitting column, a bell mouth is formed between the adjacent two splitting columns, the bottom of the splitting column is provided with a dividing slot, and the dividing slot communicates with the inside of the coil receiving cavity through the bell mouth; the connecting terminal is combined with the insulating body Together, the connecting terminal has a wire soldering portion and a soldering leg portion, the wire soldering portion is located outside the coil receiving cavity, and the soldering leg portion protrudes out of the insulating body; the filter coil is fixed in the coil receiving cavity, and the lead of the filter coil is The bellows and the branching groove are passed through the surface of the wire bonding portion and welded to the wire bonding portion.
作為一種優選方案,所述引線焊接部水平延伸,該焊腳部垂直向下延伸,進一步包括有電路板,該絕緣本體抵於電路板的表面上,該引線焊接部抵於電路板的表面上,該焊腳部垂直插入電路板的表面焊接電連接。As a preferred solution, the wire bonding portion extends horizontally, and the soldering leg portion extends vertically downwards, further comprising a circuit board, the insulating body is abutted on a surface of the circuit board, and the wire bonding portion is on the surface of the circuit board. The solder fillet is vertically inserted into the surface of the circuit board to solder the electrical connection.
作為一種優選方案,所述引線焊接部傾斜向外側上方折彎延伸,該焊腳部垂直向下延伸,進一步包括有電路板,該絕緣本體抵於電路板的表面上,該焊腳部垂直插入電路板的表面焊接電連接。As a preferred solution, the wire soldering portion is bent obliquely to the upper side, and the soldering leg portion extends vertically downward, further comprising a circuit board, the insulating body is abutted on the surface of the circuit board, and the soldering leg portion is vertically inserted. The surface of the board is soldered electrically.
作為一種優選方案,所述引線焊接部水平延伸,引線焊接部的外端延伸出有插接部,該焊腳部垂直向下延伸,進一步包括有兩電路板,該兩電路板位於絕緣本體的兩外側並與絕緣本體分開,該插接部插入對應的電路板上焊接電連接。As a preferred solution, the wire bonding portion extends horizontally, and the outer end of the wire bonding portion extends with a plug portion extending vertically downward, further comprising two circuit boards located on the insulating body. The two outer sides are separated from the insulating body, and the plug portion is inserted into a corresponding electrical connection on the circuit board.
作為一種優選方案,所述引線焊接部和焊腳部依次一體成型連接並沿絕緣本體的外側壁垂直向下延伸,進一步包括有電路板,該絕緣本體抵於電路板的表面上,該焊腳部垂直插入電路板上焊接電連接。As a preferred solution, the wire bonding portion and the soldering leg portion are integrally integrally connected and extend vertically downward along the outer sidewall of the insulating body, and further include a circuit board, the insulating body is abutted on a surface of the circuit board, the soldering leg The part is vertically inserted into the board for soldering electrical connections.
作為一種優選方案,所述引線焊接部和焊腳部依次一體成型連接,該引線焊接部垂直向下伸出,該焊腳部於引線焊接部的尾端折彎延伸出,且該焊腳部水平延伸,進一步包括有兩電路板,該兩電路板分別抵於絕緣本體的兩外側面上,該焊腳部插入對應的電路板上焊接電連接。In a preferred embodiment, the wire bonding portion and the soldering leg portion are integrally integrally connected, and the wire bonding portion protrudes vertically downward, and the soldering leg portion is bent and extended at a tail end of the wire bonding portion, and the soldering leg portion The horizontal extension further includes two circuit boards respectively abutting the two outer side surfaces of the insulative housing, and the soldering leg portions are inserted into the corresponding circuit board for soldering electrical connection.
作為一種優選方案,所述引線焊接部和焊腳部依次一體成型連接,該引線焊接部垂直向下伸出,該焊腳部於引線焊接部的尾端折彎延伸出,且該焊腳部水平延伸,進一步包括有電路板,該絕緣本體抵於電路板的表面上,該焊腳部抵於電路板的表面上焊接電連接。In a preferred embodiment, the wire bonding portion and the soldering leg portion are integrally integrally connected, and the wire bonding portion protrudes vertically downward, and the soldering leg portion is bent and extended at a tail end of the wire bonding portion, and the soldering leg portion The horizontal extension further includes a circuit board that abuts against a surface of the circuit board that is soldered to the surface of the circuit board.
作為一種優選方案,所述電路板上設置有電子器件,該電子器件位於電路板的表面、底面或側面。As a preferred solution, the circuit board is provided with an electronic device located on a surface, a bottom surface or a side surface of the circuit board.
作為一種優選方案,所述絕緣本體的底部凸設有多個支撐塊。As a preferred solution, a plurality of support blocks are protruded from the bottom of the insulating body.
作為一種優選方案,所述線圈容置腔為多個間隔並排設置,每一線圈容置腔內均固定有一前述濾波線圈。As a preferred solution, the coil accommodating cavity is arranged in a plurality of intervals, and each of the coil accommodating cavities is fixed with the foregoing filter coil.
本發明與現有技術相比具有明顯的優點和有益效果,具體而言,由上述技術方案可知:The present invention has obvious advantages and advantageous effects compared with the prior art. Specifically, it can be known from the above technical solutions:
通過在連接端子上設置有引線焊接部,並將濾波線圈固定在線圈容置腔內,引線通過喇叭口和分線槽引出線圈容置腔並與引線焊接部的表面抵觸焊接電連接,取代了傳統之繞線焊接的方式,使得本產品的結構更加簡單緊湊,節省空間,電氣性能更好,利於實現共用性,並且工藝簡單,可便於採用設備進行自動化生產製作,有效縮短製作週期,降低生產成本,為企業帶來更多的效益。By providing a wire soldering portion on the connecting terminal and fixing the filter coil in the coil accommodating cavity, the lead wire is led out of the coil accommodating cavity through the bell mouth and the branching groove and is in electrical contact with the surface of the wire bonding portion, thereby replacing the soldering electrical connection. The traditional method of wire-wound welding makes the structure of the product simpler and more compact, saves space, has better electrical performance, facilitates sharing, and has simple process. It can be easily automated production using equipment, effectively shortening the production cycle and reducing production. Cost, bring more benefits to the enterprise.
為更清楚地闡述本發明的結構特徵和功效,下面結合附圖與具體實施例來對本發明進行詳細說明。The invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
請參閱第二圖至第六圖所示,其顯示出了本發明之第一較佳實施例的具體結構,包括有絕緣本體10、連接端子20以及濾波線圈30。Referring to the second to sixth figures, a specific structure of the first preferred embodiment of the present invention is shown, including an insulative housing 10, a connection terminal 20, and a filter coil 30.
該絕緣本體10上具有線圈容置腔11,該線圈容置腔11的兩側具有防護隔欄12,線圈容置腔11的另外兩側具有多個分線柱13,相鄰兩分線柱13之間形成有喇叭口14,該分線柱13的底部設置有分線槽15,分線槽15通過喇叭口14連通線圈容置腔11內部,其中該線圈容置腔11用來放置固定濾波線圈30,該防護隔欄12用於保護和固定濾波線圈30,喇叭口14的設計有利於濾波線圈30的引線31通過機構自動分線,分線柱13底部的分線槽15便於放置濾波線圈30上的引線31。The insulative housing 10 has a coil accommodating cavity 11 having a guard rail 12 on both sides thereof, and the other sides of the coil accommodating cavity 11 have a plurality of split posts 13 and adjacent two split posts A bell mouth 14 is formed between the legs 13 . The bottom of the splitter column 13 is provided with a branching slot 15 . The branching slot 15 communicates with the inside of the coil accommodating cavity 11 through the bell mouth 14 , wherein the coil accommodating cavity 11 is used for fixing The filter coil 30 is used to protect and fix the filter coil 30. The design of the bell mouth 14 facilitates the automatic separation of the lead wires 31 of the filter coil 30 through the mechanism, and the splitter slot 15 at the bottom of the splitter column 13 facilitates the filtering. Leads 31 on the coil 30.
該連接端子20與絕緣本體10結合在一起,連接端子20與絕緣本體10可通過IM成型或機台定位的方式結合在一起,連接端子20具有引線焊接部21和焊腳部22,該引線焊接部21位於線圈容置腔11外,該焊腳部22伸出絕緣本體10外。The connection terminal 20 is combined with the insulative housing 10, and the connection terminal 20 and the insulative housing 10 can be combined by IM molding or machine positioning. The connection terminal 20 has a wire bonding portion 21 and a solder leg portion 22, and the lead wire is soldered. The portion 21 is located outside the coil accommodating chamber 11 and extends outside the insulating body 10.
該濾波線圈30固定於線圈容置腔11內,濾波線圈30的引線31穿過喇叭口14和分線槽15抵於引線焊接部21的表面上並與引線焊接部21焊接。The filter coil 30 is fixed in the coil accommodating cavity 11, and the lead wire 31 of the filter coil 30 passes through the bell mouth 14 and the branching groove 15 against the surface of the wire bonding portion 21 and is welded to the wire bonding portion 21.
具體而言,在本實施例中,所述引線焊接部21水平延伸,該焊腳部22垂直向下延伸,進一步包括有電路板40,該絕緣本體10抵於電路板40的表面上,該引線焊接部21抵於電路板40的表面上,該焊腳部22垂直插入電路板40的表面焊接電連接,並且,所述電路板40上設置有電子器件50,該電子器件50位於電路板40的底面,電子器件50可為電阻、電容、電感、放電管(GDT)、高壓保護元件(Surge)或扼流圈(CMC)等等,本發明採用的是扼流圈可達到變壓和濾波的功能,以及,所述絕緣本體10的底部凸設有多個支撐塊16,該支撐塊16抵於電路板40的表面上,以及,所述線圈容置腔11為多個間隔並排設置,每一線圈容置腔11內均固定有一前述濾波線圈30。Specifically, in the embodiment, the wire bonding portion 21 extends horizontally, and the solder leg portion 22 extends vertically downwards, and further includes a circuit board 40 that is abutted on the surface of the circuit board 40. The wire bonding portion 21 is abutted on the surface of the circuit board 40. The soldering leg portion 22 is vertically inserted into the surface of the circuit board 40 for soldering electrical connection, and the circuit board 40 is provided with an electronic device 50 on the circuit board. The bottom surface of the electronic device 50 can be a resistor, a capacitor, an inductor, a discharge tube (GDT), a high voltage protection element (Surge) or a choke coil (CMC), etc., and the present invention uses a choke coil to achieve voltage transformation and a function of filtering, and a plurality of support blocks 16 are protruded from the bottom of the insulative housing 10, the support block 16 is abutted on the surface of the circuit board 40, and the coil receiving cavity 11 is arranged side by side with a plurality of intervals. Each of the coil accommodating chambers 11 is fixed with the aforementioned filter coil 30.
製作時,先成型出連接端子20,如第三圖所示,為連接端子20完成沖壓成型後的具體結構,連接端子20兩端連接有料帶部201,料帶部201的作用是將端子連料卷盤包裝,料帶部201往內延伸出引線焊接部21,引線焊接部21的作用是與濾波線圈30的引線31電氣連接,引線焊接部21往下延伸出焊腳部22,焊腳部22的作用是與產品的電路板40電氣焊接,料帶部201側邊可選擇性設計保護腳202,保護腳202的作用是防止卷盤收料端子變形,料帶部201中間是料橋連接部203,料橋連接部203的作用與絕緣本體10連接,便於自動化卷盤收料,接著,如第二圖所示,將連接端子20與絕緣本體10結合(IM成型或機台定位),然後將濾波線圈30放置在絕緣本體10的線圈容置腔11內,再將濾波線圈30的引線31通過喇叭口14和分線槽15引出線圈容置腔11外並分別與連接端子20的引線焊接部21電氣焊接,最後可增加固定的介質(如膠水等)將濾波線圈30固定在線圈容置腔11內,即完成了本新型濾波模組結構的製作,如第六圖所示,最後根據產品結構實際需求將此結構中多餘的端子部分裁切,並與電路板40電氣連接。At the time of manufacture, the connection terminal 20 is first formed. As shown in the third figure, the specific structure after the stamping is completed for the connection terminal 20, the strip portion 201 is connected to both ends of the connection terminal 20, and the strip portion 201 functions to connect the terminal In the reel packaging, the tape portion 201 extends inwardly from the wire bonding portion 21, and the wire bonding portion 21 functions to electrically connect with the lead 31 of the filter coil 30, and the wire bonding portion 21 extends downwardly to the solder leg portion 22, and the solder fillet The function of the portion 22 is to be electrically welded to the circuit board 40 of the product, and the protection leg 202 can be selectively designed on the side of the tape portion 201. The function of the protection leg 202 is to prevent deformation of the receiving terminal of the reel, and the middle of the tape portion 201 is a bridge. The connection portion 203, the function of the bridge connecting portion 203 is connected to the insulative housing 10 to facilitate the automatic reel receiving, and then, as shown in the second figure, the connecting terminal 20 is combined with the insulative housing 10 (IM molding or machine positioning) Then, the filter coil 30 is placed in the coil accommodating cavity 11 of the insulative housing 10, and the lead wire 31 of the filter coil 30 is led out of the coil accommodating cavity 11 through the bell mouth 14 and the branching slot 15 and respectively connected to the connection terminal 20. The wire bonding portion 21 is electrically welded, After the fixed medium (such as glue) is added, the filter coil 30 is fixed in the coil accommodating cavity 11, and the structure of the novel filter module is completed, as shown in the sixth figure, and finally according to the actual needs of the product structure. The excess terminal portion of this structure is cut and electrically connected to the circuit board 40.
請參閱第七圖所示,其顯示出了本發明之第二較佳實施例的具體結構,本實施例的具體結構與前述第一較佳實施例的具體結構基本相同,其所不同的是:Referring to the seventh embodiment, the specific structure of the second preferred embodiment of the present invention is shown. The specific structure of the present embodiment is basically the same as the specific structure of the first preferred embodiment, and the difference is :
在本實施例中,所述引線焊接部21傾斜向外側上方折彎延伸,以節省電路板40上方的空間。In the embodiment, the wire bonding portion 21 is bent and extended obliquely outward to save space above the circuit board 40.
請參閱第八圖所示,其顯示出了本發明之第三較佳實施例的具體結構,本實施例的具體結構與前述第一較佳實施例的具體結構基本相同,其所不同的是:Referring to the eighth embodiment, the specific structure of the third preferred embodiment of the present invention is shown. The specific structure of the present embodiment is basically the same as the specific structure of the first preferred embodiment, and the difference is :
在本實施例中,所述引線焊接部21水平延伸,引線焊接部21的外端延伸出有插接部23,該焊腳部22垂直向下延伸,進一步包括有兩電路板40,該兩電路板40位於絕緣本體10的兩外側並與絕緣本體10分開,該插接部23插入對應的電路板40上焊接電連接,該電子器件50位於其中一電路板40的內側面,當然該電子器件50亦可放置在電路板40的外側面,或者電路板40的內外側面均放置電子器件50,可根據需要進行設置,不以為限。In this embodiment, the wire bonding portion 21 extends horizontally, and the outer end of the wire bonding portion 21 extends with a plug portion 23 extending vertically downward, further comprising two circuit boards 40, the two The circuit board 40 is located on both outer sides of the insulative housing 10 and is separated from the insulative housing 10. The plug portion 23 is inserted into the corresponding circuit board 40 for soldering electrical connection. The electronic device 50 is located on the inner side of one of the circuit boards 40. The device 50 can also be placed on the outer side of the circuit board 40, or the electronic device 50 can be placed on the inner and outer sides of the circuit board 40, which can be set as needed, not limited.
請參閱第九圖及第十圖所示,其顯示出了本發明之第四較佳實施例的具體結構,本實施例的具體結構與前述第一較佳實施例的具體結構基本相同,其所不同的是:Referring to the ninth and tenth drawings, the specific structure of the fourth preferred embodiment of the present invention is shown. The specific structure of the present embodiment is substantially the same as the specific structure of the first preferred embodiment. The difference is:
在本實施例中,所述引線焊接部21和焊腳部22依次一體成型連接並沿絕緣本體10的外側壁垂直向下延伸,該絕緣本體10抵於電路板40的表面上,該焊腳部22垂直插入電路板40上焊接電連接,並且,所述線圈容置腔11為並排間隔設置的四個,濾波線圈30為四個,四個濾波線圈30嵌入對應的線圈容置腔11內固定,線圈容置腔11可以為一個或多個,其數量不限,可根據實際需要進行設置。In this embodiment, the wire bonding portion 21 and the soldering leg portion 22 are integrally integrally connected and extend vertically downward along the outer sidewall of the insulative housing 10, and the insulative housing 10 abuts against the surface of the circuit board 40. The portion 22 is vertically inserted into the circuit board 40 for soldering electrical connection, and the coil accommodating chamber 11 is four arranged side by side, the filter coils 30 are four, and the four filter coils 30 are embedded in the corresponding coil accommodating chambers 11. The number of the coil accommodating chambers 11 may be one or more, and the number thereof may be set according to actual needs.
請參閱第十一圖所示,其顯示出了本發明之第五較佳實施例的具體結構,本實施例的具體結構與前述第一較佳實施例的具體結構基本相同,其所不同的是:Referring to FIG. 11 , a specific structure of the fifth preferred embodiment of the present invention is shown. The specific structure of the present embodiment is substantially the same as the specific structure of the first preferred embodiment, and is different. Yes:
在本實施例中,所述引線焊接部21和焊腳部22依次一體成型連接,該引線焊接部21垂直向下伸出,該焊腳部22於引線焊接部21的尾端折彎延伸出,且該焊腳部22水平延伸,進一步包括有兩電路板40,該兩電路板40分別抵於絕緣本體10的兩外側面上,該焊腳部22插入對應的電路板40上焊接電連接,使結構更加緊湊、電氣性能更好,並且,所述線圈容置腔11為並排間隔設置的四個,濾波線圈30為四個,四個濾波線圈30嵌入對應的線圈容置腔11內固定,以及,該電子器件50位於其中一電路板40的外側面,當然該電子器件50亦可放置在電路板40的內側面,或者電路板40的內外側面均放置電子器件50,可根據需要進行設置,不以為限。In the present embodiment, the wire bonding portion 21 and the soldering leg portion 22 are integrally integrally connected, and the wire bonding portion 21 extends vertically downward, and the soldering leg portion 22 is bent and extended at the tail end of the wire bonding portion 21. The soldering leg portion 22 extends horizontally, and further includes two circuit boards 40 respectively abutting the outer side surfaces of the insulative housing 10, and the soldering leg portions 22 are inserted into the corresponding circuit board 40 for soldering electrical connection. The structure of the coil accommodating cavity 11 is four at the same time, and the four filter coils 30 are embedded in the corresponding coil accommodating cavity 11 . And the electronic device 50 is located on the outer side of one of the circuit boards 40. Of course, the electronic device 50 can also be placed on the inner side of the circuit board 40, or the electronic device 50 can be placed on the inner and outer sides of the circuit board 40, as needed. Settings are not limited.
請參閱第十二圖所示,其顯示出了本發明之第六較佳實施例的具體結構,本實施例的具體結構與前述第五較佳實施例的具體結構基本相同,其所不同的是:Referring to FIG. 12, it shows a specific structure of a sixth preferred embodiment of the present invention. The specific structure of the present embodiment is substantially the same as the specific structure of the foregoing fifth preferred embodiment, and is different. Yes:
在本實施例中,電路板40為一個,該絕緣本體10抵於該電路板40的表面上,該焊腳部22抵於電路板40的表面上焊接電連接,該電子器件50位於電路板40的表面上。In this embodiment, the circuit board 40 is one, and the insulative housing 10 is abutted on the surface of the circuit board 40. The soldering leg portion 22 is soldered to the surface of the circuit board 40. The electronic device 50 is located on the circuit board. On the surface of 40.
本發明的設計重點在於:通過在連接端子20上設置有引線焊接部21,並將濾波線圈30固定在線圈容置腔11內,引線31通過喇叭口14和分線槽15引出線圈容置腔11並與引線焊接部21的表面抵觸焊接電連接,取代了傳統之繞線焊接的方式,使得本產品的結構更加簡單緊湊、節省空間、電氣性能更好,利於實現共用性,並且工藝簡單,可便於採用設備進行自動化生產製作,有效縮短製作週期,降低生產成本,為企業帶來更多的效益。The design of the present invention is focused on: by providing a wire bonding portion 21 on the connection terminal 20 and fixing the filter coil 30 in the coil accommodating cavity 11, the lead wire 31 leads out of the coil accommodating cavity through the bell mouth 14 and the branching groove 15. 11 and the surface of the wire bonding portion 21 is in contact with the welding electrical connection, instead of the traditional wire-wound welding method, the structure of the product is simpler and more compact, space-saving, electrical performance is better, and the utility is simple, and the process is simple. It can facilitate the automated production and production of equipment, effectively shorten the production cycle, reduce production costs, and bring more benefits to the enterprise.
以上所述,僅是本發明的較佳實施例而已,並非對本發明的技術範圍作任何限制,故凡是依據本發明的技術實質對以上實施例所作的任何細微修改、等同變化與修飾,均仍屬於本發明技術方案的範圍內。The above is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments in accordance with the technical spirit of the present invention are still It is within the scope of the technical solution of the present invention.
10′‧‧‧絕緣本體
20′‧‧‧連接端子
30′‧‧‧濾波線圈
31′‧‧‧金屬引線
10‧‧‧絕緣本體
11‧‧‧線圈容置腔
12‧‧‧防護隔欄
13‧‧‧分線柱
14‧‧‧喇叭口
15‧‧‧分線槽
16‧‧‧支撐塊
20‧‧‧連接端子
21‧‧‧引線焊接部
22‧‧‧焊腳部
23‧‧‧插接部
201‧‧‧料帶部
202‧‧‧保護腳
203‧‧‧料橋連接部
30‧‧‧濾波線圈
31‧‧‧引線
40‧‧‧電路板
50‧‧‧電子器件10'‧‧‧Insulated body
20'‧‧‧Connecting terminal
30'‧‧‧Filter coil
31'‧‧‧Metal lead
10‧‧‧Insulated body
11‧‧‧Cable housing
12‧‧‧ protective barrier
13‧‧ ‧ splitter column
14‧‧‧ bell mouth
15‧‧‧Separation slot
16‧‧‧Support block
20‧‧‧Connecting terminal
21‧‧‧Wire soldering department
22‧‧‧ soldering foot
23‧‧‧ Sockets
201‧‧‧Material Department
202‧‧‧protective feet
203‧‧‧Matbridge connection
30‧‧‧Filter coil
31‧‧‧ lead
40‧‧‧ boards
50‧‧‧Electronic devices
第一圖係傳統之濾波模組之立體圖。 第二圖係本發明之第一較佳實施例製作過程之立體圖。 第三圖係本發明之第一較佳實施例中連接端子未切除料帶部之放大示意圖。 第四圖係本發明之第一較佳實施例中絕緣本體之放大示意圖。 第五圖係本發明之第一較佳實施例中連接端子設置於絕緣本體上之立體圖。 第六圖係本發明之第一較佳實施例製作完成後之放大示意圖。 第七圖係本發明之第二較佳實施例之立體圖。 第八圖係本發明之第三較佳實施例之立體圖。 第九圖係本發明之第四較佳實施例製作過程中之立體圖。 第十圖係本發明之第四較佳實施例製作完成後之立體圖。 第十一圖係本發明之第五較佳實施例之立體圖。 第十二圖係本發明之第六較佳實施例之立體圖。The first picture is a perspective view of a conventional filter module. The second drawing is a perspective view of the manufacturing process of the first preferred embodiment of the present invention. The third drawing is an enlarged schematic view of the uncut strip portion of the connecting terminal in the first preferred embodiment of the present invention. The fourth figure is an enlarged schematic view of the insulative housing in the first preferred embodiment of the present invention. Figure 5 is a perspective view showing the connection terminal provided on the insulative housing in the first preferred embodiment of the present invention. The sixth drawing is an enlarged schematic view of the first preferred embodiment of the present invention after completion of fabrication. Figure 7 is a perspective view of a second preferred embodiment of the present invention. Figure 8 is a perspective view of a third preferred embodiment of the present invention. The ninth drawing is a perspective view of the fourth preferred embodiment of the present invention. The tenth drawing is a perspective view of the fourth preferred embodiment of the present invention after completion. Figure 11 is a perspective view of a fifth preferred embodiment of the present invention. Figure 12 is a perspective view of a sixth preferred embodiment of the present invention.
10‧‧‧絕緣本體 10‧‧‧Insulated body
11‧‧‧線圈容置腔 11‧‧‧Cable housing
12‧‧‧防護隔欄 12‧‧‧ protective barrier
13‧‧‧分線柱 13‧‧ ‧ splitter column
14‧‧‧穿線口 14‧‧‧ threading port
15‧‧‧分線槽 15‧‧‧Separation slot
16‧‧‧支撐塊 16‧‧‧Support block
20‧‧‧連接端子 20‧‧‧Connecting terminal
21‧‧‧引線焊接部 21‧‧‧Wire soldering department
22‧‧‧焊腳部 22‧‧‧ soldering foot
201‧‧‧料帶部 201‧‧‧Material Department
30‧‧‧濾波線圈 30‧‧‧Filter coil
31‧‧‧引線 31‧‧‧ lead
Claims (10)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610287633.4A CN105914540A (en) | 2016-05-04 | 2016-05-04 | Novel filtering module structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TWI600235B true TWI600235B (en) | 2017-09-21 |
| TW201740640A TW201740640A (en) | 2017-11-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105136774A TWI600235B (en) | 2016-05-04 | 2016-11-11 | Filter module structure |
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| Country | Link |
|---|---|
| CN (1) | CN105914540A (en) |
| TW (1) | TWI600235B (en) |
Families Citing this family (2)
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|---|---|---|---|---|
| CN108962589A (en) * | 2017-05-24 | 2018-12-07 | 湧德电子股份有限公司 | Branching device |
| TWI893589B (en) * | 2023-12-29 | 2025-08-11 | 利鴻科技股份有限公司 | Electrical connector structure and pin manufacture method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| TWM354871U (en) * | 2008-12-08 | 2009-04-11 | Ud Electronic Corp | Improvement of signal-filtering module structure |
| US8203853B2 (en) * | 2009-08-26 | 2012-06-19 | U.D. Electronic Corp. | Chip filter and the related supplementary tool |
| CN202474513U (en) * | 2012-01-05 | 2012-10-03 | 涌德电子股份有限公司 | Fixture structure of signal filter module |
| CN103219617B (en) * | 2012-01-19 | 2016-02-17 | 东莞建冠塑胶电子有限公司 | The Welding Structure of signal filtering module |
| CN204012031U (en) * | 2014-07-18 | 2014-12-10 | 东莞建冠塑胶电子有限公司 | Filter coil syndeton |
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2016
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| CN105914540A (en) | 2016-08-31 |
| TW201740640A (en) | 2017-11-16 |
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