TWI698511B - Adhesive composition and adhesive tape - Google Patents
Adhesive composition and adhesive tape Download PDFInfo
- Publication number
- TWI698511B TWI698511B TW104135090A TW104135090A TWI698511B TW I698511 B TWI698511 B TW I698511B TW 104135090 A TW104135090 A TW 104135090A TW 104135090 A TW104135090 A TW 104135090A TW I698511 B TWI698511 B TW I698511B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive tape
- mass
- resistance
- adhesive
- adhesive composition
- Prior art date
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 76
- 239000000853 adhesive Substances 0.000 title claims abstract description 52
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 52
- 239000000203 mixture Substances 0.000 title claims abstract description 45
- 229920006243 acrylic copolymer Polymers 0.000 claims abstract description 41
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 30
- 239000000178 monomer Substances 0.000 claims abstract description 25
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 24
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 14
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 12
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 12
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 7
- 229920000642 polymer Polymers 0.000 claims abstract description 5
- 229920001577 copolymer Polymers 0.000 claims abstract description 3
- 150000002978 peroxides Chemical class 0.000 claims abstract description 3
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 47
- 239000012790 adhesive layer Substances 0.000 claims description 30
- 238000005452 bending Methods 0.000 claims description 14
- 229920005672 polyolefin resin Polymers 0.000 claims description 10
- 239000000470 constituent Substances 0.000 claims description 8
- 229920001225 polyester resin Polymers 0.000 claims description 6
- 239000004645 polyester resin Substances 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 4
- 150000002513 isocyanates Chemical class 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 25
- 239000011347 resin Substances 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- 238000011156 evaluation Methods 0.000 description 19
- 229920000098 polyolefin Polymers 0.000 description 16
- 210000002374 sebum Anatomy 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 229920000515 polycarbonate Polymers 0.000 description 9
- 239000004417 polycarbonate Substances 0.000 description 9
- -1 polyethylene Polymers 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 5
- 229920003020 cross-linked polyethylene Polymers 0.000 description 5
- 239000004703 cross-linked polyethylene Substances 0.000 description 5
- 238000005187 foaming Methods 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920000058 polyacrylate Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 239000005341 toughened glass Substances 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 210000004243 sweat Anatomy 0.000 description 2
- 239000006188 syrup Substances 0.000 description 2
- 235000020357 syrup Nutrition 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- YYGNTYWPHWGJRM-UHFFFAOYSA-N (6E,10E,14E,18E)-2,6,10,15,19,23-hexamethyltetracosa-2,6,10,14,18,22-hexaene Chemical compound CC(C)=CCCC(C)=CCCC(C)=CCCC=C(C)CCC=C(C)CCC=C(C)C YYGNTYWPHWGJRM-UHFFFAOYSA-N 0.000 description 1
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- FEUFEGJTJIHPOF-UHFFFAOYSA-N 2-butyl acrylic acid Chemical compound CCCCC(=C)C(O)=O FEUFEGJTJIHPOF-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LANHEKZGKDEWLK-UHFFFAOYSA-N 2-methylideneheptanoic acid Chemical compound CCCCCC(=C)C(O)=O LANHEKZGKDEWLK-UHFFFAOYSA-N 0.000 description 1
- HEBDGRTWECSNNT-UHFFFAOYSA-N 2-methylidenepentanoic acid Chemical compound CCCC(=C)C(O)=O HEBDGRTWECSNNT-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- NDWUBGAGUCISDV-UHFFFAOYSA-N 4-hydroxybutyl prop-2-enoate Chemical compound OCCCCOC(=O)C=C NDWUBGAGUCISDV-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- OUUQCZGPVNCOIJ-UHFFFAOYSA-M Superoxide Chemical compound [O-][O] OUUQCZGPVNCOIJ-UHFFFAOYSA-M 0.000 description 1
- BHEOSNUKNHRBNM-UHFFFAOYSA-N Tetramethylsqualene Natural products CC(=C)C(C)CCC(=C)C(C)CCC(C)=CCCC=C(C)CCC(C)C(=C)CCC(C)C(C)=C BHEOSNUKNHRBNM-UHFFFAOYSA-N 0.000 description 1
- BAECOWNUKCLBPZ-HIUWNOOHSA-N Triolein Natural products O([C@H](OCC(=O)CCCCCCC/C=C\CCCCCCCC)COC(=O)CCCCCCC/C=C\CCCCCCCC)C(=O)CCCCCCC/C=C\CCCCCCCC BAECOWNUKCLBPZ-HIUWNOOHSA-N 0.000 description 1
- PHYFQTYBJUILEZ-UHFFFAOYSA-N Trioleoylglycerol Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC(OC(=O)CCCCCCCC=CCCCCCCCC)COC(=O)CCCCCCCC=CCCCCCCCC PHYFQTYBJUILEZ-UHFFFAOYSA-N 0.000 description 1
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000012986 chain transfer agent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- PRAKJMSDJKAYCZ-UHFFFAOYSA-N dodecahydrosqualene Natural products CC(C)CCCC(C)CCCC(C)CCCCC(C)CCCC(C)CCCC(C)C PRAKJMSDJKAYCZ-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229940031439 squalene Drugs 0.000 description 1
- TUHBEKDERLKLEC-UHFFFAOYSA-N squalene Natural products CC(=CCCC(=CCCC(=CCCC=C(/C)CCC=C(/C)CC=C(C)C)C)C)C TUHBEKDERLKLEC-UHFFFAOYSA-N 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- PHYFQTYBJUILEZ-IUPFWZBJSA-N triolein Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CCCCCCCC)COC(=O)CCCCCCC\C=C/CCCCCCCC PHYFQTYBJUILEZ-IUPFWZBJSA-N 0.000 description 1
- 229940117972 triolein Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本發明係關於一種耐反彈性、耐負重性、窄邊緣耐濕熱負重性、加工性、耐衝擊性及防水性優異之黏著劑組成物及使用其之黏著帶。 The present invention relates to an adhesive composition with excellent rebound resistance, load resistance, narrow edge wet and heat resistance, processability, impact resistance and water resistance, and an adhesive tape using the same.
智慧型手機、平板終端等可攜式電子機器之顯示畫面一般為將觸控面板與液晶模組組合而成之構造。而且,近年來,顯示畫面之大型化與殼體之薄型化不斷發展。於液晶模組中組入有可撓性印刷電路板(FPC,Flexible Printed Circuits),隨著顯示畫面之大型化及殼體之薄型化,FPC被進一步彎折成銳角,而成為經常被施加較強之反彈力之構造。進而,用於固定殼體與頂面板之耐衝擊性防水雙面黏著帶亦隨著LCD之大畫面化而不斷窄幅化。因此,為了固定殼體-LCD-頂面板,對該黏著帶要求可自內部耐受FPC之反彈力,亦具可耐受來自外部之力之耐衝擊性或防水性等之接著性。於接著性不足之情形時,因較強之內部應力而發生頂面板之剝離、或發生因外部應力而引起之脫落或滲水,從而導致機器之破損。又,於加工適應性方面,若於進行膠帶之窄幅化時,衝壓加工成細長條狀、框狀等時黏著劑較軟,則飛濺之糊劑、糊劑顆粒等會附著至刀而無法順利地裁剪,從而使良率變差。耐反彈性用黏著劑一般使用理論Tg較高之黏著劑,多數情況下於加工性方面並無問 題。又,亦存在藉由添加相對於黏著劑之固形份為10~30%之高軟化點黏著賦予樹脂,而進行耐反彈性之改善之情形。然而,該情形時,耐負重性、耐衝擊性、及防水性較差。 The display screens of portable electronic devices such as smart phones and tablet terminals are generally constructed by combining touch panels and liquid crystal modules. Moreover, in recent years, the enlargement of the display screen and the thinning of the casing have been continuously developed. Flexible printed circuit boards (FPC, Flexible Printed Circuits) are integrated into the liquid crystal module. As the display screen becomes larger and the casing becomes thinner, the FPC is further bent into an acute angle, and it is often applied Structure of strong rebound force. Furthermore, the impact-resistant waterproof double-sided adhesive tape used to fix the housing and the top panel has also been narrowed as the LCD screen becomes larger. Therefore, in order to fix the housing-LCD-top panel, the adhesive tape is required to be able to withstand the rebound force of the FPC from the inside, and also have adhesiveness such as impact resistance or water resistance that can withstand external forces. In the case of insufficient adhesion, peeling of the top panel due to strong internal stress, or peeling or water seepage due to external stress, resulting in damage to the machine. In addition, in terms of processing adaptability, if the tape is narrowed and the adhesive is soft when pressed into elongated strips, frame shapes, etc., splashed paste, paste particles, etc. will adhere to the knife. Cut smoothly, thereby making the yield worse. Adhesives for repulsion resistance generally use adhesives with a higher theoretical Tg. In most cases, there is no problem in terms of processability. question. In addition, there is also a case in which the rebound resistance can be improved by adding a high softening point adhesive imparting resin of 10 to 30% relative to the solid content of the adhesive. However, in this case, load resistance, impact resistance, and water resistance are poor.
由於並不存在此種可耐受內部應力及外部應力之黏著帶,故而對接著方法進行改變。然而,因方法之變化而需要投資新設備,二次加工之困難性或作業性成為問題。 Since there is no such adhesive tape that can withstand internal and external stresses, the bonding method is changed. However, new equipment needs to be invested due to changes in methods, and the difficulty or workability of secondary processing becomes a problem.
於專利文獻1中記載有如下雙面黏著帶,其於發泡體基材之雙面具有黏著劑層,該黏著劑層包含含有具有碳數4~12之(甲基)丙烯酸酯及具有羧基之乙烯系單體作為單體成分之丙烯酸系共聚合體、與聚合松香酯系黏著賦予樹脂之丙烯酸系黏著劑組成物。
於專利文獻2中記載有如下雙面黏著帶,其於包含聚乙烯發泡體之基材之雙面設置有含有丙烯酸系共聚合體與黏著賦予樹脂之黏著劑層。
於專利文獻3中記載有如下雙面黏著帶,其係用於電子機器之構件固定用途者,其特徵在於具備:基材;第1黏著劑層,其設置於上述基材之一面;及第2黏著劑層,其設置於上述基材之另一面;且上述第1黏著劑層及上述第2黏著劑層中之至少一者含有丙烯酸系聚合物、及重量平均分子量為20000以下且單體與上述丙烯酸系聚合物不同之丙烯酸系低聚物。
於專利文獻4中記載有如下黏著劑組成物,其含有:丙烯酸系共聚合體(A),其包含具有碳原子數4~12之烷基之(甲基)丙烯酸烷基酯(A1)50~90質量%、含有羧基之單體(A2)3~20質量%、含有羥基之單體(A3)3~20質量%、及具有碳原子數1~3之烷
基之(甲基)丙烯酸烷基酯(A4)3~15質量%作為構成成分,重量平均分子量為70萬~200萬,理論Tg為-40℃以下,且具有羥基及羧基;及交聯劑(B)。
專利文獻1:日本專利特開2010-260880號公報 Patent Document 1: Japanese Patent Laid-Open No. 2010-260880
專利文獻2:日本專利特開2009-084367號公報 Patent Document 2: Japanese Patent Laid-Open No. 2009-084367
專利文獻3:日本專利特開2013-163781號公報 Patent Document 3: Japanese Patent Laid-Open No. 2013-163781
專利文獻4:國際公開第2014/002203號 Patent Document 4: International Publication No. 2014/002203
隨著近年來之製品之小型化、薄型化、大畫面化,即便為窄幅之黏著帶,亦要求充分之防水性或耐負重性等特性,本發明係鑒於該方面,對上述與黏著帶相關之習知技術進一步改良者。 With the miniaturization, thinning, and large screen of products in recent years, even narrow adhesive tapes require sufficient water resistance or load resistance. In view of this aspect, the present invention is related to the above and the adhesive tape Those who have further improved related conventional technologies.
即,本發明之目的在於提供一種防水性、耐負重性、加工性、耐衝擊性、窄邊緣耐濕熱負重性、耐人工皮脂、耐人工汗油等諸特性優異之黏著劑組成物及使用其之黏著帶。 That is, the object of the present invention is to provide an adhesive composition with excellent properties such as water resistance, load resistance, processability, impact resistance, narrow edge resistance to humidity and heat, resistance to artificial sebum, and artificial perspiration oil, and to use it. The adhesive tape.
本發明係一種黏著劑組成物,其含有:丙烯酸系共聚合體(A),其包含具有碳原子數1~3之烷基之(甲基)丙烯酸烷基酯(A1)10~20質量%、具有碳原子數4~12之烷基之(甲基)丙烯酸烷基酯(A2)50~80質量%、含有羧基之單體(A3)10~15質量%、含有羥基之單體(A4)0.01~0.5質量%、及乙酸乙烯酯(A5)1~5質量%作 為聚合物鏈之構成成分,且使用過氧化物系聚合起始劑而獲得之共聚合體之重量平均分子量為95萬~200萬,理論Tg為-55℃以下;交聯劑(B);矽烷偶合劑(C);及抗氧化劑(D)。 The present invention is an adhesive composition comprising: an acrylic copolymer (A), which contains an alkyl (meth)acrylate (A1) having a carbon number of 1 to 3, 10-20% by mass, Alkyl (meth)acrylate (A2) with a C4-12 alkyl group (A2) 50-80% by mass, carboxyl group-containing monomer (A3) 10-15% by mass, hydroxyl-containing monomer (A4) 0.01~0.5 mass%, and vinyl acetate (A5) 1~5 mass% It is a component of the polymer chain, and the weight average molecular weight of the copolymer obtained by using a peroxide-based polymerization initiator is 950,000 to 2 million, and the theoretical Tg is below -55°C; crosslinking agent (B); silane Coupling agent (C); and antioxidant (D).
又,本發明係一種黏著帶,其係於聚烯烴系樹脂基材之單面或雙面具有由本發明之黏著劑組成物形成之黏著劑層者,且上述聚烯烴系樹脂基材於加工方向(MD,Machine Direction)及橫向方向(TD,Transverse Direction)之彎曲力矩為5gf/cm以上,上述黏著帶於加熱時剪切變形率為150%以下,斷裂力為70N/cm2以上。 In addition, the present invention is an adhesive tape, which is attached to a polyolefin resin substrate on one or both sides with an adhesive layer formed from the adhesive composition of the present invention, and the polyolefin resin substrate is in the processing direction The bending moment of the (MD, Machine Direction) and the transverse direction (TD, Transverse Direction) is 5gf/cm or more, the shear deformation rate of the adhesive tape during heating is 150% or less, and the breaking force is 70N/cm 2 or more.
又,本發明係一種黏著帶,其於聚酯系樹脂基材之單面或雙面具有由本發明之黏著劑組成物形成之黏著劑層。 In addition, the present invention is an adhesive tape having an adhesive layer formed of the adhesive composition of the present invention on one or both sides of a polyester resin substrate.
本發明之黏著劑組成物雖然含有相對較多地作為高Tg單體之具有碳原子數1~3的烷基之(甲基)丙烯酸烷基酯(A1),但於低溫下之耐衝擊性優異,進而耐負重性、窄邊緣耐濕熱負重性、加工性、防水性、耐人工皮脂、耐人工汗油等諸特性亦優異。而且,本發明之單面或雙面黏著帶之上述各特性均優異,故而能夠用於需要此種特性之領域中之各種用途。 Although the adhesive composition of the present invention contains a relatively large number of alkyl (meth)acrylates (A1) with a C1-C3 alkyl group as a high Tg monomer, it has impact resistance at low temperatures It is excellent, and it is also excellent in load resistance, narrow edge wet and heat load resistance, processability, water resistance, artificial sebum resistance, and artificial sweat oil resistance. Moreover, the single-sided or double-sided adhesive tape of the present invention is excellent in each of the above-mentioned characteristics, so it can be used for various applications in fields requiring such characteristics.
1‧‧‧雙面黏著帶 1‧‧‧Double-sided adhesive tape
1a‧‧‧基材 1a‧‧‧Substrate
1b‧‧‧黏著劑層 1b‧‧‧Adhesive layer
2‧‧‧SUS304製鉤 2‧‧‧SUS304 hook
3‧‧‧被黏附體 3‧‧‧Adhesive body
4‧‧‧砝碼 4‧‧‧weight
5‧‧‧聚醯亞胺膜 5‧‧‧Polyimide film
6‧‧‧1.5mm厚聚碳酸酯製鉤 6‧‧‧1.5mm thick polycarbonate hook
7‧‧‧1.9mm厚強化玻璃板 7‧‧‧1.9mm thick tempered glass plate
8‧‧‧2.0mm厚SUS304板 8‧‧‧2.0mm thick SUS304 board
9‧‧‧0.5mm厚SUS304BA板 9‧‧‧0.5mm thick SUS304BA board
10‧‧‧1kgf砝碼 10‧‧‧1kgf weight
11‧‧‧10gf不鏽鋼球 11‧‧‧10gf stainless steel ball
Xi‧‧‧加入樣本長 Xi‧‧‧Add sample length
Xt‧‧‧樣本變形量 Xt‧‧‧Sample deformation
圖1係用以說明實施例之耐負重性之評價方法之示意圖。 FIG. 1 is a schematic diagram for explaining the evaluation method of the load resistance of the embodiment.
圖2係用以說明實施例之窄邊緣低溫耐衝擊性之評價方法之示意圖。 Fig. 2 is a schematic diagram for explaining the evaluation method of the low-temperature impact resistance of the narrow edge of the embodiment.
圖3係用以說明實施例之斷裂力之評價方法之示意圖。 Fig. 3 is a schematic diagram for explaining the evaluation method of the breaking force of the embodiment.
圖4係用以說明實施例之耐反彈性之評價方法之示意圖。 Fig. 4 is a schematic diagram for explaining the evaluation method of the rebound resistance of the embodiment.
圖5係用以說明實施例之耐反彈性之評價方法之示意圖。 Fig. 5 is a schematic diagram for explaining the evaluation method of the rebound resistance of the embodiment.
圖6係用以說明實施例之加熱時剪切變形率之評價方法之示意圖。 Fig. 6 is a schematic diagram for explaining the evaluation method of the shear deformation rate during heating in the embodiment.
圖7係用以說明實施例之窄邊緣耐濕熱負重性之評價方法之示意圖。 FIG. 7 is a schematic diagram for explaining the evaluation method of the wet and heat load resistance of the narrow edge of the embodiment.
圖8係用以說明實施例之落球耐衝擊性之評價方法之示意圖。 Fig. 8 is a schematic diagram for explaining the method of evaluating the impact resistance of the falling ball of the embodiment.
本發明之黏著劑組成物係含有丙烯酸系共聚合體(A)、交聯劑(B)、矽烷偶合劑(C)、及抗氧化劑(D)之組成物。 The adhesive composition of the present invention is a composition containing acrylic copolymer (A), crosslinking agent (B), silane coupling agent (C), and antioxidant (D).
丙烯酸系共聚合體(A)係包含具有碳原子數1~3之烷基之(甲基)丙烯酸烷基酯(A1)、具有碳原子數4~12之烷基之(甲基)丙烯酸烷基酯(A2)、含有羧基之單體(A3)、含有羥基之單體(A4)、及乙酸乙烯酯(A5)作為聚合物鏈之構成成分之丙烯酸系共聚合體。 The acrylic copolymer (A) contains alkyl (meth)acrylate (A1) having an alkyl group with carbon atoms of 1 to 3, and a (meth)acrylic acid alkyl group with an alkyl group of 4 to 12 carbon atoms An acrylic copolymer in which ester (A2), carboxyl group-containing monomer (A3), hydroxyl group-containing monomer (A4), and vinyl acetate (A5) are the constituent components of the polymer chain.
(甲基)丙烯酸烷基酯(A1)係具有碳原子數1~3之烷基之(甲基)丙烯酸烷基酯,係用以提高耐反彈性、耐負重性、加工性、窄邊緣耐濕熱負重性之成分。作為具體例,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯。其中,較佳為(甲基)丙烯酸甲酯。(甲基)丙烯酸烷基酯(A1)之含量於丙烯酸系共聚合體(A)之構成成分(單體單位)100質量%中為10~20質量%,較佳為12~16質量%。該等範圍之下限值於耐反彈性、耐負重性、加工性、窄邊緣耐濕熱負重性等特性方面具有意義。又,上限值於窄邊緣低溫耐衝擊性、防水性等特性方面具有意義。 Alkyl (meth)acrylate (A1) is an alkyl (meth)acrylate with an alkyl group of 1 to 3 carbon atoms, which is used to improve rebound resistance, load resistance, processability, narrow edge resistance The weight-bearing ingredient of damp heat. Specific examples include methyl (meth)acrylate, ethyl (meth)acrylate, and propyl (meth)acrylate. Among them, methyl (meth)acrylate is preferred. The content of the alkyl (meth)acrylate (A1) is 10-20% by mass, preferably 12-16% by mass in 100% by mass of the constituent components (monomer unit) of the acrylic copolymer (A). The lower limit of these ranges is meaningful in terms of characteristics such as rebound resistance, load resistance, processability, and narrow edge wet and heat resistance. In addition, the upper limit is significant in terms of characteristics such as narrow-edge low-temperature impact resistance and water resistance.
(甲基)丙烯酸烷基酯(A2)係具有碳原子數4~12之烷基之(甲基)丙烯酸烷基酯。作為具體例,可列舉:(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸月桂酯。其中,較佳為(甲基)丙烯酸2-乙基己酯。(甲基)丙烯酸烷基酯(A2)之含量於丙烯酸系共聚合體(A)之構成成分(單體單位)100質量%中為50~80質量%,較佳為65~79質量%。 The alkyl (meth)acrylate (A2) is an alkyl (meth)acrylate having an alkyl group having 4 to 12 carbon atoms. Specific examples include: butyl (meth)acrylate, isobutyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, isobutyl (meth)acrylate Octyl ester, isononyl (meth)acrylate, lauryl (meth)acrylate. Among them, 2-ethylhexyl (meth)acrylate is preferred. The content of the alkyl (meth)acrylate (A2) is 50 to 80% by mass, preferably 65 to 79% by mass in 100% by mass of the constituent components (monomer unit) of the acrylic copolymer (A).
含有羧基之單體(A3)係用以提高耐反彈性、耐負重性、加工性、窄邊緣低溫耐衝擊性、防水性之成分。作為具體例,可列舉:丙烯酸、甲基丙烯酸、衣康酸、丁烯酸、馬來酸、富馬酸、2-羧基-1-丁烯、2-羧基-1-戊烯、2-羧基-1-己烯、2-羧基-1-庚烯。含有羧基之單體(A3)之含量於丙烯酸系共聚合體(A)之構成成分(單體單位)100質量%中為10~15質量%,較佳為10~12質量%。該等範圍之下限值於耐反彈性、耐負重性、加工性、窄邊緣耐濕熱負重性、窄邊緣低溫耐衝擊性、防水性等特性方面具有意義。 The carboxyl-containing monomer (A3) is a component used to improve rebound resistance, load resistance, processability, narrow-edge low-temperature impact resistance, and water resistance. Specific examples include acrylic acid, methacrylic acid, itaconic acid, crotonic acid, maleic acid, fumaric acid, 2-carboxy-1-butene, 2-carboxy-1-pentene, 2-carboxyl -1-hexene, 2-carboxy-1-heptene. The content of the carboxyl group-containing monomer (A3) is 10-15% by mass, preferably 10-12% by mass in 100% by mass of the constituent components (monomer unit) of the acrylic copolymer (A). The lower limit of these ranges is meaningful in terms of rebound resistance, load resistance, processability, narrow-edge wet and heat resistance, narrow-edge low-temperature impact resistance, and water resistance.
含有羥基之單體(A4)係用以提高耐反彈性、耐負重性、加工性、窄邊緣低溫耐衝擊性之成分。作為具體例,可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸3-羥基丙酯、(甲基)丙烯酸4-羥基丁酯。含有羥基之單體(A4)之含量於丙烯酸系共聚合體(A)之構成成分(單體單位)100質量%中為0.01~0.5質量%,較佳為0.05~0.15質量%。該等範圍之上限值於抑制黏著帶於加熱、濕熱環境下之經時變化,維持充分之耐反彈性、耐負重性、加工性、窄邊緣低溫耐衝擊性、及防水性等特性方面具有意義。 The hydroxyl-containing monomer (A4) is a component used to improve rebound resistance, load resistance, processability, and low-temperature impact resistance of narrow edges. Specific examples include 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate. The content of the hydroxyl-containing monomer (A4) is 0.01 to 0.5% by mass in 100% by mass of the constituent components (monomer unit) of the acrylic copolymer (A), preferably 0.05 to 0.15% by mass. The upper limit of these ranges suppresses the time-dependent change of the adhesive tape under heating and damp heat, and maintains sufficient rebound resistance, load resistance, processability, narrow edge low temperature impact resistance, and water resistance. significance.
乙酸乙烯酯(A5)係用以提高耐反彈性、耐負重性、加 工性、窄邊緣耐濕熱負重性之成分。乙酸乙烯酯(A5)之含量於丙烯酸系共聚合體(A)之構成成分(單體單位)100質量%中為1~5質量%,較佳為2~4質量%。該等範圍之下限值於耐反彈性、耐負重性、加工性、窄邊緣耐濕熱負重性等特性方面具有意義。又,上限值於耐負重性、窄邊緣耐濕熱負重性、窄邊緣低溫耐衝擊性等特性方面具有意義。 Vinyl acetate (A5) is used to improve rebound resistance, load resistance, and add Workability, narrow-edge, heat-resistant and heavy-duty components. The content of vinyl acetate (A5) is 1 to 5% by mass, preferably 2 to 4% by mass in 100% by mass of the constituent components (monomer unit) of the acrylic copolymer (A). The lower limit of these ranges is meaningful in terms of characteristics such as rebound resistance, load resistance, processability, and narrow edge wet and heat resistance. In addition, the upper limit value is significant in terms of characteristics such as load resistance, narrow-edge wet and heat resistance, and narrow-edge low-temperature impact resistance.
丙烯酸系共聚合體(A)係藉由使至少以上所說明之成分(A1)~(A5)共聚合而獲得。聚合方法並無特別限定,就聚合物設計容易之方面而言,較佳為自由基溶液聚合。又,亦可先製備包含丙烯酸系共聚合體(A)及其單體之丙烯酸系漿液,並於該丙烯酸系漿液中調配交聯劑(B)與追加之光聚合起始劑而使其聚合。於製造丙烯酸系共聚合體(A)時,亦可於不損及本發明之效果之範圍內,使成分(A1)~(A5)以外之單體共聚合。 The acrylic copolymer (A) is obtained by copolymerizing at least the components (A1) to (A5) described above. The polymerization method is not particularly limited. In terms of ease of polymer design, radical solution polymerization is preferred. In addition, an acrylic syrup containing the acrylic copolymer (A) and its monomers may be prepared first, and the crosslinking agent (B) and an additional photopolymerization initiator may be blended and polymerized in the acrylic syrup. When producing the acrylic copolymer (A), it is also possible to copolymerize monomers other than the components (A1) to (A5) within a range that does not impair the effects of the present invention.
丙烯酸系共聚合體(A)之重量平均分子量為95萬~200萬,較佳為100~150萬。該等範圍之下限值於耐負重性、窄邊緣耐濕熱負重性、及加工性等特性方面具有意義。又,上限值於黏著劑組成物之塗佈性等特性方面具有意義。該重量平均分子量係藉由凝膠滲透層析(GPC,Gel Permeation Chromatography)法而測定之值。丙烯酸系共聚合體(A)之理論Tg為-55℃以下,較佳為-55~-75℃。該理論Tg係根據FOX之式而算出之值。 The weight average molecular weight of the acrylic copolymer (A) is 950,000 to 2 million, preferably 1 to 1.5 million. The lower limit of these ranges is meaningful in terms of load resistance, narrow edge wet and heat load resistance, and processability. In addition, the upper limit has significance in terms of the coating properties of the adhesive composition. The weight average molecular weight is a value measured by Gel Permeation Chromatography (GPC). The theoretical Tg of the acrylic copolymer (A) is -55°C or less, preferably -55 to -75°C. The theoretical Tg is a value calculated according to the formula of FOX.
於本發明中,使用以上所說明之丙烯酸系共聚合體(A)作為樹脂成分,但亦可於不損及本發明之效果之範圍內,併用其他種類之添加劑成分。但是,較佳為不含黏著賦予樹脂。其原因在於:若併用黏著賦予樹脂,則黏著劑中之低分子量成分增加,而 使耐負重性、耐人工皮脂性、窄邊緣耐濕熱負重性等特性降低。 In the present invention, the above-described acrylic copolymer (A) is used as the resin component, but other types of additive components may be used in combination with a range that does not impair the effects of the present invention. However, it is preferable not to contain an adhesion-imparting resin. The reason is that if the adhesive imparting resin is used together, the low molecular weight components in the adhesive increase, and Reduce the load-bearing resistance, artificial sebum resistance, and narrow-edge resistance to humidity and heat.
本發明所使用之交聯劑(B)係用以與丙烯酸系共聚合體(A)反應以形成交聯構造而調配之化合物。尤佳為可與丙烯酸系共聚合體(A)之羧基及/或羥基反應之化合物。進而就防水性、耐負重性、加工性、窄邊緣低溫耐衝擊性、窄邊緣耐濕熱負重性、耐人工皮脂、耐人工汗油等特性方面而言,較佳為異氰酸酯系交聯劑。作為異氰酸酯系交聯劑之具體例,可列舉:甲苯二異氰酸酯、二甲苯二異氰酸酯、六亞甲基二異氰酸酯、異佛爾酮二異氰酸酯及其等之改質預聚物。其等可併用兩種以上。交聯劑(B)之調配量相對於丙烯酸系共聚合體(A)100質量份較佳為0.02~1質量份,更佳為0.3~0.6質量份。 The crosslinking agent (B) used in the present invention is a compound formulated to react with the acrylic copolymer (A) to form a crosslinked structure. Particularly preferred is a compound that can react with the carboxyl group and/or hydroxyl group of the acrylic copolymer (A). Furthermore, in terms of water resistance, load resistance, processability, narrow-edge low-temperature impact resistance, narrow-edge wet and heat load resistance, artificial sebum resistance, and artificial sweat oil resistance, an isocyanate-based crosslinking agent is preferred. Specific examples of the isocyanate-based crosslinking agent include toluene diisocyanate, xylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, and modified prepolymers thereof. Two or more of these can be used in combination. The blending amount of the crosslinking agent (B) is preferably 0.02 to 1 part by mass, more preferably 0.3 to 0.6 part by mass relative to 100 parts by mass of the acrylic copolymer (A).
矽烷偶合劑(C)係用以提高耐反彈性、窄邊緣耐濕熱負重性之成分。尤佳為含有環氧丙基之矽烷偶合劑。作為具體例,可列舉:2-(3,4-環氧環己基)乙基三甲氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、3-環氧丙氧基丙基甲基二乙氧基矽烷、3-環氧丙氧基丙基三乙氧基矽烷、異氰尿酸三-(三甲氧基矽烷基丙基)酯。其等可併用兩種以上。矽烷偶合劑(C)之調配量相對於丙烯酸系共聚合體(A)100質量份較佳為0.01~0.5質量份,更佳為0.02~0.5質量份,尤佳為0.05~0.3質量份。 Silane coupling agent (C) is a component used to improve rebound resistance and narrow edge resistance to humidity and heat. Particularly preferred is a silane coupling agent containing glycidyl groups. Specific examples include: 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyl Diethoxysilane, 3-glycidoxypropyl triethoxysilane, tris-(trimethoxysilylpropyl) isocyanurate. Two or more of these can be used in combination. The compounding amount of the silane coupling agent (C) is preferably 0.01 to 0.5 parts by mass, more preferably 0.02 to 0.5 parts by mass, and particularly preferably 0.05 to 0.3 parts by mass relative to 100 parts by mass of the acrylic copolymer (A).
抗氧化劑(D)係用以提高耐反彈性、窄邊緣耐濕熱負重性之成分。尤佳為受阻酚系抗氧化劑。抗氧化劑(D)之調配量相對於丙烯酸系共聚合體(A)100質量份較佳為0.02~1.0質量份,更佳為0.07~0.7質量份。 Antioxidant (D) is a component used to improve rebound resistance and narrow edge resistance to humidity and heat. Particularly preferred is a hindered phenol antioxidant. The compounding amount of the antioxidant (D) is preferably 0.02 to 1.0 parts by mass, and more preferably 0.07 to 0.7 parts by mass relative to 100 parts by mass of the acrylic copolymer (A).
本發明之黏著劑組成物亦可進而含有遮光性填料或 顏料。作為遮光性填料之具體例,可列舉:碳黑、奈米碳管、黑色無機填料。作為顏料之具體例,可列舉:碳黑、苯胺黑、乙炔黑、科琴黑。 The adhesive composition of the present invention may further contain light-shielding filler or pigment. Specific examples of light-shielding fillers include carbon black, carbon nanotubes, and black inorganic fillers. Specific examples of pigments include carbon black, aniline black, acetylene black, and Ketjen black.
本發明之聚烯烴基材黏著帶於聚烯烴系樹脂基材之單面或雙面具有由本發明之黏著劑組成物形成之黏著劑層。黏著劑層之厚度較佳為5~100μm,更佳為10~80μm。黏著劑層亦可僅形成於基材之單面,但較佳為形成於雙面而製成雙面黏著帶。 The polyolefin substrate adhesive tape of the present invention has an adhesive layer formed of the adhesive composition of the present invention on one or both sides of the polyolefin resin substrate. The thickness of the adhesive layer is preferably 5 to 100 μm, more preferably 10 to 80 μm. The adhesive layer can also be formed only on one side of the substrate, but it is preferably formed on both sides to make a double-sided adhesive tape.
黏著劑層可藉由使本發明之黏著劑組成物發生交聯反應而形成。例如可將黏著劑組成物塗佈至基材上,藉由加熱使其發生交聯反應而於基材上形成黏著劑層。又,亦可將黏著劑組成物塗佈至脫模紙或其他膜上,藉由加熱使其發生交聯反應而形成黏著劑層,並將該黏著劑層貼合至基材之單面或雙面。於塗佈黏著劑組成物時,例如可使用輥式塗佈機、模嘴塗佈機、模唇塗佈機等塗佈裝置。於塗佈後進行加熱之情形時,亦可與利用加熱之交聯反應同時來去除黏著劑組成物中之溶劑。 The adhesive layer can be formed by cross-linking the adhesive composition of the present invention. For example, the adhesive composition can be coated on a substrate, and a cross-linking reaction can occur by heating to form an adhesive layer on the substrate. In addition, the adhesive composition can also be coated on release paper or other films, cross-linked by heating to form an adhesive layer, and the adhesive layer can be attached to a single side of the substrate or Double-sided. When applying the adhesive composition, for example, a coating device such as a roll coater, a die nozzle coater, and a die lip coater can be used. In the case of heating after coating, the solvent in the adhesive composition can also be removed simultaneously with the cross-linking reaction by heating.
聚烯烴系樹脂基材尤佳為包含聚烯烴系樹脂發泡體。作為聚烯烴系樹脂之具體例,可列舉聚乙烯或聚丙烯。 The polyolefin-based resin base material particularly preferably includes a polyolefin-based resin foam. As a specific example of polyolefin resin, polyethylene or polypropylene can be mentioned.
聚烯烴系樹脂基材之厚度較佳為0.05~2.0mm。 The thickness of the polyolefin-based resin substrate is preferably 0.05 to 2.0 mm.
聚烯烴系樹脂基材於MD方向(長度方向)及TD方向(寬度方向)之彎曲力矩為5gf/cm以上,較佳為7gf/cm以上。藉由基材具有此種彎曲力矩,則黏著帶不會變形,而表現出優異之窄邊緣加工性,進而亦表現出優異之窄邊緣耐濕熱負重性。 The bending moment of the polyolefin resin substrate in the MD direction (length direction) and TD direction (width direction) is 5 gf/cm or more, preferably 7 gf/cm or more. With the base material having such a bending moment, the adhesive tape will not be deformed, and exhibits excellent narrow-edge processability, which in turn also exhibits excellent narrow-edge resistance to heat and humidity.
黏著帶於加熱時之剪切變形率為150%以下,較佳為130%以下。黏著帶藉由具有此種加熱時之剪切變形率而不易變形,且表現出優異之耐衝擊性、耐負重性、及窄邊緣耐濕熱負重性。 The shear deformation rate of the adhesive tape when heated is 150% or less, preferably 130% or less. The adhesive tape is not easily deformed by having such a shear deformation rate when heated, and exhibits excellent impact resistance, load resistance, and narrow edge wet heat resistance.
黏著帶之斷裂力為70N/cm2以上,較佳為90N/cm2以上。黏著帶藉由具有此種斷裂力而表現出優異之耐衝擊性、耐負重性、及窄邊緣耐濕熱負重性。 The breaking force of the adhesive tape is 70 N/cm 2 or more, preferably 90 N/cm 2 or more. The adhesive tape exhibits excellent impact resistance, load resistance, and narrow edge wet and heat resistance by having such breaking force.
本發明之聚酯基材黏著帶於聚酯系樹脂基材之單面或雙面具有由本發明之黏著劑組成物形成之黏著劑層。黏著劑層之形成方法係與上述所說明之聚烯烴基材黏著帶之情形相同。聚酯系樹脂基材可為晶質、非晶狀或發泡性中之任一種。 The polyester substrate adhesive tape of the present invention has an adhesive layer formed of the adhesive composition of the present invention on one or both sides of the polyester resin substrate. The method of forming the adhesive layer is the same as that of the polyolefin substrate adhesive tape described above. The polyester resin base material may be any of crystalline, amorphous, or foamable.
聚酯系樹脂基材通常係以樹脂膜之形態而使用。其厚度為0.002~0.05mm,較佳為0.006~0.038mm。作為聚酯系樹脂之具體例,可列舉聚對苯二甲酸乙二酯。 The polyester resin substrate is usually used in the form of a resin film. Its thickness is 0.002~0.05mm, preferably 0.006~0.038mm. As a specific example of the polyester resin, polyethylene terephthalate can be cited.
以下,舉出實施例及比較例更詳細地說明本發明。於以下之記載中,「份」意指質量份,「%」意指質量%。 Hereinafter, the present invention will be explained in more detail with examples and comparative examples. In the following description, "parts" means parts by mass, and "%" means parts by mass.
向具備攪拌機、溫度計、回流冷凝器、及氮氣導入管之反應裝置中,加入表1所示之量(%)之成分(A1)~(A5)、乙酸乙酯、作為鏈轉移劑之正十二烷硫醇、及作為過氧化物系自由基聚合起始劑之月桂基過氧化物0.1份。對反應裝置內封入氮氣,並一面於氮氣氣流 下以68℃、3小時之條件一面攪拌,其後,以78℃、3小時使其發生聚合反應。其後,冷卻至室溫,添加乙酸乙酯。藉此,獲得固形份濃度30%之丙烯酸系共聚合體(A)。 To a reaction device equipped with a stirrer, a thermometer, a reflux condenser, and a nitrogen introduction tube, add the components (A1)~(A5) shown in Table 1 in the amount (%), ethyl acetate, and positive ten as a chain transfer agent. Dialkyl mercaptan, and 0.1 part of lauryl peroxide as a peroxide radical polymerization initiator. Seal the reaction device with nitrogen and place it in the nitrogen flow The mixture was stirred at 68°C for 3 hours, and thereafter, polymerization reaction was performed at 78°C for 3 hours. After that, it was cooled to room temperature, and ethyl acetate was added. In this way, an acrylic copolymer (A) with a solid content concentration of 30% was obtained.
將各丙烯酸系共聚合體之重量平均分子量(Mw)及理論Tg示於表1。該重量平均分子量(Mw)係藉由GPC法,於以下之測定裝置及條件下,測定丙烯酸系共聚合體之標準聚苯乙烯換算之分子量所得之值。 Table 1 shows the weight average molecular weight (Mw) and theoretical Tg of each acrylic copolymer. The weight average molecular weight (Mw) is a value obtained by measuring the molecular weight of the acrylic copolymer in terms of standard polystyrene by the GPC method under the following measuring equipment and conditions.
.裝置:LC-2000系列(日本分光股份有限公司製造) . Device: LC-2000 series (manufactured by JASCO Corporation)
.管柱:Shodex KF-806M×2根、Shodex KF-802×1根 . Column: Shodex KF-806M×2, Shodex KF-802×1
.洗提液:四氫呋喃(THF) . Eluent: Tetrahydrofuran (THF)
.流速:1.0mL/min . Flow rate: 1.0mL/min
.管柱溫度:40℃ . Column temperature: 40℃
.注入量:100μL . Injection volume: 100μL
.檢測器:折射率計(RI,Refractive Index) . Detector: Refractive Index (RI, Refractive Index)
.測定樣本:使丙烯酸系聚合物溶解於THF,製作丙烯酸系聚合物之濃度為0.5重量%之溶液,藉由利用過濾器來過濾去除污物後所得者。 . Measurement sample: Dissolve the acrylic polymer in THF to prepare a solution with a concentration of 0.5% by weight of the acrylic polymer, and filter to remove dirt by using a filter.
理論Tg係根據FOX之式而算出之值。 The theoretical Tg is a value calculated according to the formula of FOX.
如表2所示,對在製造例1~20中獲得之丙烯酸系共聚合體(A)之固形份100份,加入交聯劑(B)、矽烷偶合劑(C)、抗氧化劑(D)並混合,而製備黏著劑組成物。 As shown in Table 2, to 100 parts of the solid content of the acrylic copolymer (A) obtained in Production Examples 1-20, the crosslinking agent (B), the silane coupling agent (C), and the antioxidant (D) were added and combined Mix to prepare an adhesive composition.
以使乾燥後之厚度成為0.075mm之方式將該黏著劑組成物塗佈至經聚矽氧處理之脫模紙上。繼而,於110℃下將溶劑去除、乾燥,並且使之發生交聯反應而形成黏著劑層。將該黏著劑層貼合至彎曲力矩為12gf/cm之0.15mm厚之聚烯烴系發泡樹脂基材(電子束交聯聚乙烯發泡樹脂、發泡倍率1.8~2倍)之雙面。然後於40℃下固化3天,而獲得聚烯烴系發泡樹脂基材雙面黏著帶。 The adhesive composition was coated on a release paper treated with silicone so that the thickness after drying became 0.075 mm. Then, the solvent is removed and dried at 110° C., and cross-linking reaction occurs to form an adhesive layer. The adhesive layer was bonded to both sides of a 0.15mm thick polyolefin-based foamed resin substrate (e-beam cross-linked polyethylene foamed resin, foaming ratio 1.8~2 times) with a bending moment of 12gf/cm. Then, it was cured at 40°C for 3 days to obtain a polyolefin-based foamed resin substrate double-sided adhesive tape.
將實施例1之黏著劑組成物貼合至彎曲力矩為6.0gf/cm之0.1mm厚之聚烯烴系發泡樹脂基材(電子束交聯聚乙烯發泡樹脂、發泡倍率1.5~2.2倍)之雙面。然後於40℃下固化3天,而獲得聚烯烴系發泡樹脂基材雙面黏著帶。 The adhesive composition of Example 1 was bonded to a 0.1mm thick polyolefin-based foamed resin substrate with a bending moment of 6.0gf/cm (e-beam cross-linked polyethylene foamed resin, foaming ratio 1.5~2.2 times ) Of both sides. Then, it was cured at 40°C for 3 days to obtain a polyolefin-based foamed resin substrate double-sided adhesive tape.
將實施例1之黏著劑組成物貼合至彎曲力矩為14.0gf/cm之0.2mm厚之聚烯烴系發泡樹脂基材(電子束交聯聚乙烯發泡樹脂、發泡倍率2.5~3.5倍)之雙面。然後於40℃下固化3天,而獲得聚烯烴系發泡樹脂基材雙面黏著帶。 The adhesive composition of Example 1 was laminated to a 0.2mm thick polyolefin-based foamed resin substrate with a bending moment of 14.0gf/cm (e-beam cross-linked polyethylene foamed resin, foaming ratio 2.5~3.5 times ) Of both sides. Then, it was cured at 40°C for 3 days to obtain a polyolefin-based foamed resin substrate double-sided adhesive tape.
將實施例1之黏著劑組成物貼合至彎曲力矩為1.0gf/cm之0.15mm厚之聚烯烴系發泡樹脂基材(電子束交聯聚乙烯發泡樹脂、發泡倍率3倍)之雙面。然後於40℃下固化3天,而獲得聚烯烴系發泡樹脂基材雙面黏著帶。
The adhesive composition of Example 1 was bonded to a 0.15mm thick polyolefin-based foamed resin substrate (e-beam cross-linked polyethylene foamed resin, foaming
將實施例1之黏著劑組成物貼合至彎曲力矩為2.5gf/cm之0.15mm厚之聚烯烴系發泡樹脂基材(電子束交聯聚乙烯發泡樹脂、發泡倍率2.5倍)之雙面。然後於40℃下固化3天,而獲得聚烯烴系發泡樹脂基材雙面黏著帶。 The adhesive composition of Example 1 was bonded to a 0.15mm thick polyolefin-based foamed resin substrate (e-beam cross-linked polyethylene foamed resin, foaming ratio 2.5 times) with a bending moment of 2.5 gf/cm Double-sided. Then, it was cured at 40°C for 3 days to obtain a polyolefin-based foamed resin substrate double-sided adhesive tape.
相對在製造例1中獲得之丙烯酸系共聚合體(A)之固形份100份,加入交聯劑(B1)0.45份、矽烷偶合劑(C1)0.15份、抗氧化劑(D1)0.07份並混合,而製備黏著劑組成物。 With respect to 100 parts of the solid content of the acrylic copolymer (A) obtained in Production Example 1, 0.45 parts of crosslinking agent (B1), 0.15 parts of silane coupling agent (C1), and 0.07 parts of antioxidant (D1) were added and mixed, And prepare the adhesive composition.
以使乾燥後之厚度成為0.019mm之方式將該黏著劑組成物塗佈至經聚矽氧處理之脫模紙上。繼而,於100℃下將溶劑去除、乾燥,並且使之發生交聯反應,而形成黏著劑層。將該黏著劑層貼合至0.012mm厚之雙軸延伸聚酯膜(聚對苯二甲酸乙二酯膜)之雙面。然後於40℃下固化3天,而獲得聚酯系膜基材雙面黏著帶。 The adhesive composition was coated on a release paper treated with silicone so that the thickness after drying became 0.019 mm. Then, the solvent is removed and dried at 100° C., and a cross-linking reaction occurs to form an adhesive layer. The adhesive layer was bonded to both sides of a 0.012 mm thick biaxially stretched polyester film (polyethylene terephthalate film). Then, it was cured at 40°C for 3 days to obtain a polyester film substrate double-sided adhesive tape.
除了使用於製造例19中獲得之丙烯酸系共聚合體(A)以外,以與實施例22同樣之方式製備黏著劑組成物,而獲得聚酯系膜基材雙面黏著帶。 Except for using the acrylic copolymer (A) obtained in Production Example 19, an adhesive composition was prepared in the same manner as in Example 22 to obtain a polyester-based film substrate double-sided adhesive tape.
表1中之縮寫如下所述。 The abbreviations in Table 1 are as follows.
「MA」:丙烯酸甲酯 "MA": methyl acrylate
「2-EHA」:丙烯酸2-乙基己酯 "2-EHA": 2-ethylhexyl acrylate
「BA」:丙烯酸正丁酯 "BA": n-butyl acrylate
「AA」:丙烯酸 "AA": Acrylic
「4-HBA」:丙烯酸4-羥基丁酯 "4-HBA": 4-hydroxybutyl acrylate
「Vac」:乙酸乙烯酯 "Vac": Vinyl acetate
表2中之縮寫如下所述。 The abbreviations in Table 2 are as follows.
「B1」:異氰酸酯系交聯劑(Nippon Polyurethane公司製造,商品名Coronate L-45E) "B1": Isocyanate-based crosslinking agent (manufactured by Nippon Polyurethane, trade name Corona L-45E)
「C1」:矽烷偶合劑(信越化學工業公司製造,商品名KBM-403) "C1": Silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-403)
「C2」:矽烷偶合劑(信越化學工業公司製造,商品名KBM-402) "C2": Silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM-402)
「C3」:矽烷偶合劑(信越化學工業公司製造,商品名KBE-403) "C3": Silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBE-403)
「C4」:矽烷偶合劑(信越化學工業公司製造,商品名KBE-402) "C4": Silane coupling agent (manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBE-402)
「D1」:抗氧化劑(BASF公司製造,商品名Irganox 1010) "D1": Antioxidant (manufactured by BASF, trade name Irganox 1010)
利用以下之方法,評價於實施例1~21、比較例1~10、及參考例1~2中獲得之聚烯烴系發泡樹脂基材雙面黏著帶。將結果示於表3~6。 The following methods were used to evaluate the polyolefin-based foamed resin substrate double-sided adhesive tapes obtained in Examples 1 to 21, Comparative Examples 1 to 10, and Reference Examples 1 to 2. The results are shown in Tables 3-6.
將雙面黏著帶裁剪成寬度1mm且63mm×118mm之框狀,剝離一脫模紙並貼合至2.0mm厚之玻璃板,進而剝離另一脫模紙並貼合2.0mm厚之玻璃板。使用高壓釜,於23℃下,對該樣本進行1分鐘之加壓處理(0.5MPa)。然後,基於JIS IPX7(防水標準),將該樣本暫時浸沒至水中,並根據以下之基準評價防水性。又,與上述同樣地製作樣本,基於JIS IPX8(防水標準),將其沈沒至水深10cm之水下,使用高壓釜,於23℃、0.5MPa下進行1小時之加壓處理,並根據以下之基準評價防水性。 Cut the double-sided adhesive tape into a frame with a width of 1mm and a width of 63mm×118mm, peel off a release paper and attach it to a 2.0mm thick glass plate, then peel off another release paper and attach a 2.0mm thick glass plate. Using an autoclave, the sample was pressurized (0.5 MPa) at 23°C for 1 minute. Then, based on JIS IPX7 (waterproof standard), the sample was temporarily immersed in water, and the waterproofness was evaluated according to the following criteria. In addition, the sample was made in the same manner as above, and based on JIS IPX8 (waterproof standard), it was submerged under water with a depth of 10cm, and an autoclave was used to perform pressurization treatment at 23°C and 0.5MPa for 1 hour, and according to the following The benchmark evaluates water resistance.
「○」:水未滲入至框內。 "○": Water has not penetrated into the frame.
「×」:水滲入至框內。 "×": Water penetrates into the frame.
將雙面黏著帶裁剪成寬度1mm且63mm×118mm之框狀,剝 離一脫模紙並貼合至2.0mm厚之玻璃板,進而剝離另一脫模紙並貼合2.0mm厚之玻璃板。使用高壓釜,於23℃、0.5MPa下對該樣本進行1分鐘之加壓處理。然後,將該樣本浸漬至人工皮脂(三油酸甘油酯33.3%、油酸20.0%、角鯊烯13.3%、八-十二烷酸十四烷基酯(myristyl octadodecylate)33.4%)或人工指脂(林純藥工業股份有限公司製造)中72小時。取出樣本,於85℃、85%RH之環境下靜置24小時,其後於普通環境下放置24小時。目視觀察該樣本,並根據以下之基準評價耐人工皮脂性、耐人工指脂性。 Cut the double-sided adhesive tape into a frame with a width of 1mm and a width of 63mm×118mm, and peel off Separate a release paper and attach it to a 2.0mm thick glass plate, then peel off another release paper and attach a 2.0mm thick glass plate. Using an autoclave, the sample was pressurized at 23° C. and 0.5 MPa for 1 minute. Then, the sample was immersed in artificial sebum (33.3% triolein, 20.0% oleic acid, 13.3% squalene, 33.4% myristyl octadodecylate) or artificial sebum. Lipid (manufactured by Lin Chun Yao Industrial Co., Ltd.) in 72 hours. Take out the sample and let it stand for 24 hours in an environment of 85°C and 85%RH, and then place it in a normal environment for 24 hours. The sample was visually observed, and the artificial sebum resistance and artificial finger grease resistance were evaluated according to the following criteria.
「○」:人工皮脂液、人工指脂液未滲入至框內。 "○": Artificial sebum liquid and artificial finger fat liquid have not penetrated into the frame.
「×」:人工皮脂液、人工指脂液滲入至框內。 "×": Artificial sebum and artificial finger fat penetrate into the frame.
將基材裁剪成寬度38mm、長度50mm之細長條狀,基於JIS P 8125,使用東洋精機製作所公司製造之TABER剛度試驗機,將10g之砝碼安裝至擺錘,讀出彎曲速度3°/sec、彎曲角度15°時之刻度,將其設為測定值。繼而,將該測定值代入至以下之計算式,算出MD方向及TD方向之彎曲力矩(M)。 The base material is cut into a thin strip with a width of 38mm and a length of 50mm. Based on JIS P 8125, using a TABER stiffness tester manufactured by Toyo Seiki Seisakusho, install a 10g weight on the pendulum and read the bending speed of 3°/sec. , The scale when the bending angle is 15°, set it as the measured value. Then, this measured value is substituted into the following calculation formula, and the bending moment (M) in MD direction and TD direction is calculated.
M=38.0nk/w M=38.0nk/w
M:彎曲力矩(gf/cm) M: bending moment (gf/cm)
n:刻度之讀數(於10g之砝碼之時為1) n: the reading of the scale (1 when the weight is 10g)
k:平均每一刻度之力矩(gf/cm) k: average torque per scale (gf/cm)
w:試片之寬度 w: width of test piece
將雙面黏著帶裁剪成25mm×25mm之尺寸,剝離一脫模紙。然後,如圖1所示,對SUS304製鉤2貼合雙面黏著帶1(基材1a、黏著層1b),繼而剝離另一脫模紙並貼合至被黏附體3。作為該被黏附體3,係使用SUS304、聚碳酸酯板、丙烯酸板、電鍍鋅(EGI,Electro-Galvanized)鋼板、鋁鋅矽熱鍍(Galvalume)鋼板、玻璃板。然後對SUS304製鉤2施加700gf之負重(砝碼4),於85℃下保持24小時,並根據以下之基準評價耐負重性。
Cut the double-sided adhesive tape into a size of 25mm×25mm, and peel off a release paper. Then, as shown in FIG. 1, the double-sided adhesive tape 1 (base material 1a,
「○」:鉤2於24小時內未落下。
"○":
「X」:鉤2於60分鐘以內落下。
"X":
將雙面黏著帶以5mm×125mm之尺寸細切成10條,維持該狀態(即,細切後所得之各黏著帶維持細切時之鄰接狀態),於65℃、80%RH環境下放置1天。其後,針對每1條,沿180°方向將脫模紙一併剝離,以目視確認與鄰接之部分之黏連,並根據以下之基準評價加工性。
Cut the double-sided adhesive tape into 10 strips with a size of 5mm×125mm, maintain this state (that is, each adhesive tape obtained after the fine cutting maintains the adjacent state when it is finely cut), and place it at 65°C and 80
「○」:幾乎無與鄰接部分之黏連,於不會剝離鄰接部分之情況下可成功剝離。 "○": There is almost no adhesion to the adjacent part, and it can be successfully peeled without peeling the adjacent part.
「×」:於鄰接部分有明顯之黏連,鄰接部分被同時剝離。 "×": There is obvious adhesion on the adjacent part, and the adjacent part is peeled off at the same time.
將雙面黏著帶裁剪成寬度0.6mm且63mm×118mm之框狀,剝離一脫模紙並貼合至被黏附體3(1.5mm厚之聚碳酸酯板),進而剝離另一脫模紙並貼合至被黏附體7(1.9mm厚之強化玻璃板)。如
圖2所示,以使重量成為160gf之方式,利用2.0mm厚之SUS304板8調整該貼合而成之構件後,固化60分鐘。使該樣本於-20℃之環境下,自1.5M之高度沿剪切方向自由落下,並根據以下之基準評價耐衝擊性。
Cut the double-sided adhesive tape into a frame with a width of 0.6mm and 63mm×118mm, peel off a release paper and attach it to the adherend 3 (a 1.5mm thick polycarbonate board), then peel off another release paper and Attach it to the adherend 7 (1.9mm thick tempered glass plate). Such as
As shown in Fig. 2, after adjusting the laminated member with a 2.0 mm
「○」:於落下20次後,無接著部分之剝離及基材之層間破壞。 "○": After 20 drops, there is no peeling of the adhesive part and interlayer failure of the substrate.
「×」:於落下20次後,有接著部分之剝離及基材之層間破壞。 "×": After 20 drops, there was peeling of the subsequent part and interlayer failure of the substrate.
將雙面黏著帶裁剪成25mm×25mm之尺寸,剝離一脫模紙。然後,如圖3所示,對SUS304製鉤2貼合雙面黏著帶1(基材1a、黏著層1b),繼而剝離另一脫模紙並貼合至被黏附體3(2.0mm厚之SUS304BA板),於23℃、50%RH之環境下固化60分鐘。然後,以300mm/min之速度將SUS304製鉤2朝上方拉伸,並測定發泡體破裂時之強度[N/cm2]。
Cut the double-sided adhesive tape into a size of 25mm×25mm, and peel off a release paper. Then, as shown in Figure 3, the double-sided adhesive tape 1 (base material 1a,
將裁剪成1mm×20mm之雙面黏著帶1之一脫模紙剝離,如圖4所示般貼附至厚度125μm且20mm×60mm之聚醯亞胺膜5之一端,於23℃、50%RH之環境下固化60分鐘。其後,將聚醯亞胺膜5如圖5所示般彎折,而將黏著帶1貼合至被黏附體3(1.5mm厚之聚碳酸酯板),於85℃、85%RH之環境下放置72小時,以目視確認接著部分之剝離,並根據以下之基準評價耐反彈性。
Peel off one of the release paper of the double-sided
「○」:於72小時後無接著部分之剝離。 "○": There is no peeling of the adhesive part after 72 hours.
「×」:於72小時後有接著部分之剝離。 "×": After 72 hours, there was peeling of the subsequent part.
將雙面黏著帶裁剪成25mm×25mm之尺寸,並剝離一脫模紙。然後,如圖6所示,對厚度0.5mm、寬度30mm、長度100mm之SUS304BA板9貼合雙面黏著帶1(基材1a、黏著層1b),繼而剝離另一脫模紙,並貼合至相同尺寸之SUS304BA板9,於23℃、50%RH之環境下固化60分鐘。繼而,於其下端懸吊1kgf之砝碼10,於120℃下加熱30分鐘,於135℃下加熱30分鐘,利用放大鏡目視測定其變形量,根據下述式算出加熱時剪切變形率(△Sr)。
Cut the double-sided adhesive tape into a size of 25mm×25mm, and peel off a release paper. Then, as shown in Figure 6, the double-sided adhesive tape 1 (base material 1a,
△Sr=(Xi+Xt)/Xi×100 △Sr=(Xi+Xt)/Xi×100
△Sr:加熱時剪切變形率(%) △Sr: Shear deformation rate during heating (%)
Xi:加入樣本長(mm)=25(mm) Xi: Add sample length (mm)=25(mm)
Xt:樣本變形量(mm) Xt: sample deformation (mm)
將雙面黏著帶裁剪成寬度為0.5mm、0.6mm、0.8mm、1.0mm且63mm×118mm之框狀並剝離一脫模紙。然後,如圖7所示,對1.5mm厚之聚碳酸酯製鉤6貼合雙面黏著帶1,繼而剝離另一脫模紙並貼合至被黏附體3(2.0mm厚之玻璃板),於23℃、50%RH之環境下固化60分鐘。然後,對玻璃製鉤6施加200gf之負重(砝碼4),於40℃、90%RH之環境下保持24小時,並根據以下之基準評價耐負重性。
Cut the double-sided adhesive tape into a frame with a width of 0.5mm, 0.6mm, 0.8mm, 1.0mm and 63mm×118mm, and peel off a release paper. Then, as shown in FIG. 7, the double-sided
「○」:鉤6於24小時內未落下。
"○":
「×」:鉤6於60分鐘以內落下。
"×":
由表3~6之評價結果表明,於使用本發明之黏著劑組成物之實施例1~21中,所有特性均優異。 The evaluation results in Tables 3 to 6 show that in Examples 1 to 21 using the adhesive composition of the present invention, all characteristics are excellent.
另一方面,於使用不含成分(A5)之丙烯酸系共聚合體13之比較例1、使用不含成分(A1)之丙烯酸系共聚合體14之比較 例2、使用成分(A1)之量過少之丙烯酸系共聚合體15之比較例3、使用成分(A5)之量過多而Tg過高之丙烯酸系共聚合體16之比較例4、使用Mw過低之丙烯酸系共聚合體17及18之比較例5及6、使用成分(A3)之量過少之丙烯酸系共聚合體19之比較例7、使用成分(A4)之量過多之丙烯酸系共聚合體20之比較例8、使用不含成分(C)之組成物之比較例9、使用不含成分(D)之組成物之比較例10中,任一特性均較差。 On the other hand, in Comparative Example 1 using the acrylic copolymer 13 without the component (A5), comparison with the acrylic copolymer 14 without the component (A1) Example 2, Comparative Example 3 of Acrylic Copolymer 15 with too little amount of component (A1), Comparative Example 4 of Acrylic Copolymer 16 with too high Tg and too much amount of component (A5), Using too low Mw Comparative Examples 5 and 6 of Acrylic Copolymers 17 and 18, Comparative Example 7 of Acrylic Copolymer 19 with too little amount of component (A3), Comparative Example of Acrylic Copolymer 20 with too much amount of component (A4) 8. In Comparative Example 9 using a composition not containing the component (C), and Comparative Example 10 using a composition not containing the component (D), any characteristics are inferior.
又,實施例1~21係製造本發明之黏著帶之例,故而所有特性均優異。另一方面,參考例1及2雖然使用本發明之黏著劑組成物,但基材與本發明之黏著帶之基材不同,故而任一特性均較差。 In addition, since Examples 1 to 21 are examples of manufacturing the adhesive tape of the present invention, all characteristics are excellent. On the other hand, although Reference Examples 1 and 2 use the adhesive composition of the present invention, the base material is different from the base material of the adhesive tape of the present invention, and therefore, either characteristic is inferior.
利用以下之方法,評價於實施例22及比較例11中獲得之聚酯系膜基材雙面黏著帶。將結果示於表7~8。 The polyester film substrate double-sided adhesive tape obtained in Example 22 and Comparative Example 11 was evaluated by the following method. The results are shown in Tables 7-8.
再者,評價試驗A與評價試驗B之評價項目、樣本尺寸、試驗條件不同之原因在於:聚烯烴系發泡樹脂基材黏著帶與聚酯系膜基材雙面黏著帶之用途及要求性能相互稍有不同。聚烯烴系發泡樹脂基材黏著帶係用於固定較佳為具有發泡彈性之基材之部位、例如殼體與頂面板,而要求對應於其尺寸之窄幅化,並且亦要求防水性或接著性。另一方面,聚酯系膜基材雙面黏著帶係用於固定例如LCD面板與背光單元,而要求對應於其尺寸之窄幅化,並且其接著性需要能夠耐受經常施加之FPC的反彈力或落下時之衝擊。於接著性不足之情形時,發生LCD面板與背光單元之剝離, 從而發生漏光。 Furthermore, the reasons for the difference in the evaluation items, sample size, and test conditions of the evaluation test A and evaluation test B are: the use and required performance of the polyolefin-based foamed resin substrate adhesive tape and the polyester-based film substrate double-sided adhesive tape They are slightly different from each other. Polyolefin-based foamed resin substrate adhesive tapes are used to fix parts that are preferably foamed elastic substrates, such as housings and top panels, and require narrowing corresponding to their dimensions and also require water resistance. Or adherence. On the other hand, polyester-based film substrate double-sided adhesive tape is used to fix LCD panels and backlight units, for example, and requires a narrower size corresponding to its size, and its adhesion needs to be able to withstand the rebound of the frequently applied FPC Force or impact when falling. In the case of insufficient adhesion, peeling of the LCD panel and the backlight unit occurs, As a result, light leakage occurs.
將雙面黏著帶之尺寸裁剪成寬度1mm且45mm×65mm之框狀,將JIS IPX8(防水標準)之條件變更為23℃、0.2MPa、30分鐘之加壓處理,除此以外,利用與<評價試驗A>之防水性相同之方法進行試驗,並根據以下之基準評價防水性。 The size of the double-sided adhesive tape is cut into a frame with a width of 1mm and 45mm×65mm, and the JIS IPX8 (waterproof standard) conditions are changed to 23℃, 0.2MPa, 30 minutes of pressure treatment. In addition, use and< The water resistance of the evaluation test A> is tested in the same way, and the water resistance is evaluated according to the following criteria.
「○」:水未滲入至框內。 "○": Water has not penetrated into the frame.
「×」:水滲入至框內。 "×": Water penetrates into the frame.
將雙面黏著帶之尺寸裁剪成寬度1mm且45mm×65mm之框狀,浸漬於人工皮脂或人工指脂24小時後,將樣本於85℃、85%RH之環境下靜置72小時,除此以外,利用與<評價試驗A>之耐人工皮脂性、耐人工指脂性相同之方法進行試驗,並根據以下之基準評價耐人工皮脂性、耐人工指脂性。 Cut the size of the double-sided adhesive tape into a frame with a width of 1mm and 45mm×65mm. After immersing it in artificial sebum or artificial finger grease for 24 hours, place the sample at 85℃ and 85%RH for 72 hours. Otherwise, use the same method as the artificial sebum resistance and artificial finger fat resistance in <Evaluation Test A>, and evaluate the artificial sebum resistance and artificial finger fat resistance according to the following criteria.
「○」:人工皮脂液、人工指脂液未滲入至框內。 "○": Artificial sebum liquid and artificial finger fat liquid have not penetrated into the frame.
「×」:人工皮脂液、人工指脂液滲入至框內。 "×": Artificial sebum and artificial finger fat penetrate into the frame.
將雙面黏著帶以1mm×125mm之尺寸細切成10條,除此以外,利用與<評價試驗A>之加工性相同之方法進行試驗,並根據以下之基準評價加工性。 The double-sided adhesive tape was finely cut into 10 strips with a size of 1mm×125mm. Except for this, the same method as the processability of <Evaluation Test A> was used to test, and the processability was evaluated according to the following criteria.
「○」:幾乎無與鄰接部分之黏連,於不會剝離鄰接部分之情況 下可成功剝離。 "○": There is almost no adhesion to the adjacent part, and the adjacent part will not be peeled off The next can be successfully peeled off.
「×」:於鄰接部分有明顯之黏連,鄰接部分被同時剝離。 "×": There is obvious adhesion on the adjacent part, and the adjacent part is peeled off at the same time.
將雙面黏著帶以1mm×50mm之尺寸裁剪成2條並剝離一脫模紙。然後,如圖8所示,以65mm之間隔平行地貼合至被黏附體3(1.5mm厚之聚碳酸酯板),進而剝離另一脫模紙並貼合至被黏附體7(1.9mm厚之強化玻璃板)。將該貼合而成之構件於85℃、85%RH之環境下靜置72小時,其後於23℃、50%RH下放置1小時。於該樣本之被黏附體3(1.5mm厚之聚碳酸酯板)側,自0.5M之高度使10gf之不鏽鋼球11自由落下而施加衝擊,並根據以下之基準評價落球耐衝擊性。
Cut the double-sided adhesive tape into 2 strips with a size of 1mm×50mm and peel off a release paper. Then, as shown in Figure 8, the adherend 3 (1.5mm thick polycarbonate board) was attached in parallel at 65mm intervals, and then another release paper was peeled off and attached to the adherend 7 (1.9mm Thick tempered glass plate). The laminated member was allowed to stand at 85°C and 85%RH for 72 hours, and then at 23°C and 50%RH for 1 hour. On the adherend 3 (polycarbonate plate of 1.5 mm thick) side of the sample, a 10 gf
「○」:無因衝擊而引起之構件之剝離。 "○": No peeling of components caused by impact.
「×」:有因衝擊而引起之構件之剝離。 "×": There is peeling of components caused by impact.
於上述落球耐衝擊性中,於23℃、50%RH下放置1小時後,進而於-20℃環境下放置1小時。然後,於-20℃環境下,於該樣本之被黏附體3(1.5mm厚之聚碳酸酯板)側,自0.3M之高度使10gf之不鏽鋼球自由落下而施加衝擊,並根據以下之基準評價低溫落球耐衝擊性。 In the above-mentioned impact resistance of falling balls, after leaving it at 23°C and 50%RH for 1 hour, it is then left at -20°C for 1 hour. Then, in an environment of -20°C, on the side of the adherend 3 (1.5mm thick polycarbonate plate) of the sample, a 10gf stainless steel ball is freely dropped from a height of 0.3M and an impact is applied according to the following standards Evaluate the impact resistance of the low temperature drop ball.
「○」:無因衝擊而引起之構件之剝離。 "○": No peeling of components caused by impact.
「×」:有因衝擊而引起之構件之剝離。 "×": There is peeling of components caused by impact.
將裁剪成1mm×10mm之雙面黏著帶1之一脫模紙剝離,如圖4所示般貼附至厚度75μm且10mm×30mm之聚醯亞胺膜5之一端,於23℃、50%RH之環境下固化60分鐘。其後,將聚醯亞胺膜5以圖5所示之形狀,以使回折部分(於圖5中記為20mm之部分)成為4mm之方式彎折,而將黏著帶1貼合至被黏附體3(1.5mm厚之聚碳酸酯板),於85℃之環境下放置72小時,以目視確認接著部分之剝離,並根據以下之基準評價耐反彈性。
Peel off one of the release papers of the double-sided
「○」:於72小時後,無接著部分之剝離。 "○": After 72 hours, there is no peeling of the adhesive part.
「×」:於72小時後,有接著部分之剝離。 "×": After 72 hours, there was peeling of the subsequent part.
將雙面黏著帶之尺寸裁剪成寬度1mm且45mm×65mm之框狀,施加200gf之負重(砝碼4),將試驗環境設為85℃、24小時,除此以外,利用與<評價試驗A>之窄邊緣耐濕熱負重性相同之方法進行試驗,並根據以下之基準評價窄邊緣耐負重性。 Cut the size of the double-sided adhesive tape into a frame with a width of 1mm and 45mm×65mm, apply a load of 200gf (weight 4), and set the test environment to 85°C for 24 hours. In addition to this, use and <evaluation test A > The narrow edge is tested in the same way as the heat and humidity resistance of the narrow edge, and the narrow edge is evaluated according to the following criteria.
「○」:鉤6於24小時內未落下。
"○":
「×」:鉤6於60分鐘以內落下。
"×":
將雙面黏著帶之尺寸裁剪成寬度1mm且45mm×65mm之框狀,施加50gf之負重(砝碼4),將試驗環境設為85℃、85%RH、24小時,除此以外,利用與<評價試驗A>之窄邊緣耐濕熱負重性相同之方法進行試驗,並根據以下之基準評價窄邊緣耐濕熱負重 性。 Cut the size of the double-sided adhesive tape into a frame with a width of 1mm and 45mm×65mm, apply a load of 50gf (weight 4), set the test environment to 85°C, 85%RH, and 24 hours. <Evaluation Test A> The narrow-edge damp and heat resistance is the same as the test method, and the narrow-edge damp and heat resistance is evaluated according to the following criteria Sex.
「○」:鉤6於24小時內未落下。
"○":
「×」:鉤6於60分鐘以內落下。
"×":
由表7~8之評價結果表明,於使用本發明之黏著劑組成物之實施例22中,所有特性均優異。另一方面,於使用成分(A3)之量過少之丙烯酸系共聚合體19之比較例11中,各特性較差。 The evaluation results in Tables 7 to 8 show that in Example 22 using the adhesive composition of the present invention, all characteristics are excellent. On the other hand, in Comparative Example 11 using the acrylic copolymer 19 in which the amount of the component (A3) was too small, each characteristic was poor.
1‧‧‧雙面黏著帶 1‧‧‧Double-sided adhesive tape
1a‧‧‧基材 1a‧‧‧Substrate
1b‧‧‧黏著劑層 1b‧‧‧Adhesive layer
2‧‧‧SUS304製鉤 2‧‧‧SUS304 hook
3‧‧‧被黏附體 3‧‧‧Adhesive body
4‧‧‧砝碼 4‧‧‧weight
Claims (7)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2014/081012 WO2016084123A1 (en) | 2014-11-25 | 2014-11-25 | Adhesive agent composition and adhesive tape |
| WOPCT/JP2014/081012 | 2014-11-25 |
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| TW201623522A TW201623522A (en) | 2016-07-01 |
| TWI698511B true TWI698511B (en) | 2020-07-11 |
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| JP (1) | JP6307175B2 (en) |
| KR (1) | KR102316411B1 (en) |
| CN (1) | CN107001889B (en) |
| TW (1) | TWI698511B (en) |
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| WO2019131165A1 (en) * | 2017-12-25 | 2019-07-04 | Dic株式会社 | Pressure-sensitive adhesive tape and article |
| WO2019131166A1 (en) * | 2017-12-25 | 2019-07-04 | Dic株式会社 | Pressure-sensitive adhesive tape and article |
| CN112262192A (en) * | 2018-06-28 | 2021-01-22 | Dic株式会社 | Adhesive tape and article |
| JP7472307B2 (en) * | 2020-10-30 | 2024-04-22 | 株式会社寺岡製作所 | Adhesive tape |
| KR102888740B1 (en) | 2021-03-31 | 2025-11-19 | 가부시키가이샤 데라오카 세이사쿠쇼 | Adhesive composition and adhesive tape |
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| CN102348734A (en) * | 2009-02-20 | 2012-02-08 | 德莎欧洲公司 | Pressure-sensitive adhesive mass |
| TW201311857A (en) * | 2011-09-09 | 2013-03-16 | Toyo Ink Sc Holdings Co Ltd | Optical adhesive, optical adhesive sheet and laminate body |
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| JPS4889234A (en) * | 1972-02-29 | 1973-11-21 | ||
| JP4249442B2 (en) * | 2001-11-15 | 2009-04-02 | コニシ株式会社 | Double-sided adhesive tape |
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| KR101202532B1 (en) * | 2008-01-04 | 2012-11-16 | 주식회사 엘지화학 | Acrylic pressure-sensitive adhesive composition |
| KR20090084367A (en) | 2008-02-01 | 2009-08-05 | 전신구 | Filter device and fuel supply device |
| JP5556987B2 (en) | 2009-04-09 | 2014-07-23 | Dic株式会社 | Double-sided adhesive tape |
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| KR101411010B1 (en) * | 2011-06-03 | 2014-06-23 | 제일모직주식회사 | Adhesive composition and surface protection film using the same |
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| CN102348734A (en) * | 2009-02-20 | 2012-02-08 | 德莎欧洲公司 | Pressure-sensitive adhesive mass |
| TW201311857A (en) * | 2011-09-09 | 2013-03-16 | Toyo Ink Sc Holdings Co Ltd | Optical adhesive, optical adhesive sheet and laminate body |
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| KR102316411B1 (en) | 2021-10-21 |
| JP6307175B2 (en) | 2018-04-04 |
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| KR20170092517A (en) | 2017-08-11 |
| JPWO2016084123A1 (en) | 2017-06-01 |
| TW201623522A (en) | 2016-07-01 |
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| CN107001889A (en) | 2017-08-01 |
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