TWI696683B - 半導體加工用膠帶 - Google Patents

半導體加工用膠帶 Download PDF

Info

Publication number: TWI696683B
Authority: TW; Taiwan
Prior art keywords: adhesive layer; tape; metal layer; adhesive; semiconductor wafer
Prior art date: 2015-12-25

Application number

TW105142786A

Other languages

English (en)

Chinese (zh)

Other versions

TW201722711A (zh

Inventor

青山真沙美

佐野透

Original Assignee

日商古河電氣工業股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-12-25

Filing date

2016-12-22

Publication date

2020-06-21

2016-12-22 Application filed by 日商古河電氣工業股份有限公司 filed Critical 日商古河電氣工業股份有限公司

2017-07-01 Publication of TW201722711A publication Critical patent/TW201722711A/zh

2020-06-21 Application granted granted Critical

2020-06-21 Publication of TWI696683B publication Critical patent/TWI696683B/zh

Images

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/28—Metal sheet
- H10W40/10—
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Adhesives Or Adhesive Processes (AREA)
Dicing (AREA)
Engineering & Computer Science (AREA)
Adhesive Tapes (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Physics & Mathematics (AREA)
Materials Engineering (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

TW105142786A 2015-12-25 2016-12-22 半導體加工用膠帶 TWI696683B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2015-255313		2015-12-25
JP2015255313		2015-12-25

Publications (2)

Publication Number	Publication Date
TW201722711A TW201722711A (zh)	2017-07-01
TWI696683B true TWI696683B (zh)	2020-06-21

Family

ID=59089994

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW105142786A TWI696683B (zh)	2015-12-25	2016-12-22	半導體加工用膠帶

Country Status (7)

Country	Link
JP (1)	JP6800167B2 (fr)
KR (1)	KR102513252B1 (fr)
CN (1)	CN107960133B (fr)
MY (1)	MY192250A (fr)
SG (1)	SG11201708735SA (fr)
TW (1)	TWI696683B (fr)
WO (1)	WO2017110203A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI649398B (zh) *	2017-09-11	2019-02-01	達邁科技股份有限公司	熱硬化型黏著組成物以及黏著片
US10947417B2 (en)	2017-09-29	2021-03-16	Taimide Tech. Inc.	Thermal-curable adhesive composition and adhesive sheet
JP7154809B2 (ja) *	2018-04-20	2022-10-18	株式会社ディスコ	ウエーハの加工方法
JP7111562B2 (ja) *	2018-08-31	2022-08-02	株式会社ディスコ	加工方法
US20200198414A1 (en) *	2018-12-19	2020-06-25	The Goodyear Tire & Rubber Company	Method and apparatus for forming a composite tread with microchimneys
US11541691B2 (en)	2018-12-19	2023-01-03	The Goodyear Tire & Rubber Company	Composite tread with targeted stiffness gradient and method of making
US11993110B2 (en)	2018-12-19	2024-05-28	The Goodyear Tire & Rubber Company	Reinforced tread and method of forming
JP7258421B2 (ja) *	2019-02-15	2023-04-17	株式会社ディスコ	ウェーハの加工方法
JP7321639B2 (ja) *	2019-02-15	2023-08-07	株式会社ディスコ	ウェーハの加工方法
JP7379829B2 (ja) *	2019-02-21	2023-11-15	味の素株式会社	プリント配線板の製造方法
CN114097073B (zh) *	2019-11-28	2025-12-23	积水化学工业株式会社	半导体装置的制造方法及半导体加工用层叠体
TWI710288B (zh) *	2020-01-22	2020-11-11	頎邦科技股份有限公司	電路板的散熱片貼合方法及其貼合裝置
TWI887672B (zh) *	2023-06-06	2025-06-21	萬潤科技股份有限公司	貼合方法、貼合模組、貼合裝置及貼合設備

Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2008235716A (ja) *	2007-03-22	2008-10-02	Furukawa Electric Co Ltd:The	半導体デバイス加工用粘着テープ
TW201213487A (en) *	2010-07-29	2012-04-01	Nitto Denko Corp	Film for flip chip type semiconductor back surface and its use

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH1167699A (ja) *	1997-08-13	1999-03-09	Texas Instr Japan Ltd	半導体装置の製造方法
JP4865312B2 (ja)	2005-12-05	2012-02-01	古河電気工業株式会社	チップ用保護膜形成用シート
JP2007235022A (ja)	2006-03-03	2007-09-13	Mitsui Chemicals Inc	接着フィルム
JP4849993B2 (ja) *	2006-08-14	2012-01-11	日東電工株式会社	粘着シート、その製造方法および積層セラミックシートの切断方法
JP5534690B2 (ja) *	2009-03-23	2014-07-02	古河電気工業株式会社	ダイシングテープ
JP5681374B2 (ja) *	2010-04-19	2015-03-04	日東電工株式会社	ダイシングテープ一体型半導体裏面用フィルム

2016
- 2016-10-05 WO PCT/JP2016/079627 patent/WO2017110203A1/fr not_active Ceased
- 2016-10-05 JP JP2017557751A patent/JP6800167B2/ja active Active
- 2016-10-05 MY MYPI2017001596A patent/MY192250A/en unknown
- 2016-10-05 CN CN201680025557.8A patent/CN107960133B/zh active Active
- 2016-10-05 KR KR1020177031446A patent/KR102513252B1/ko active Active
- 2016-10-05 SG SG11201708735SA patent/SG11201708735SA/en unknown
- 2016-12-22 TW TW105142786A patent/TWI696683B/zh active

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2008235716A (ja) *	2007-03-22	2008-10-02	Furukawa Electric Co Ltd:The	半導体デバイス加工用粘着テープ
TW201213487A (en) *	2010-07-29	2012-04-01	Nitto Denko Corp	Film for flip chip type semiconductor back surface and its use

Also Published As

Publication number	Publication date
TW201722711A (zh)	2017-07-01
MY192250A (en)	2022-08-11
KR102513252B1 (ko)	2023-03-24
CN107960133B (zh)	2021-10-26
KR20180098125A (ko)	2018-09-03
JPWO2017110203A1 (ja)	2018-10-18
JP6800167B2 (ja)	2020-12-16
SG11201708735SA (en)	2018-07-30
WO2017110203A1 (fr)	2017-06-29
CN107960133A (zh)	2018-04-24

Publication	Publication Date	Title
TWI696683B (zh)	2020-06-21	半導體加工用膠帶
KR102165006B1 (ko)	2020-10-13	전자 디바이스 패키지용 테이프
TWI689570B (zh)	2020-04-01	黏晶薄膜、附有切割片之黏晶薄膜、半導體裝置、及半導體裝置之製造方法
CN109041575B (zh)	2021-02-12	电子器件封装用带
TWI643930B (zh)	2018-12-11	電子裝置封裝用膠帶
TWI648369B (zh)	2019-01-21	切晶黏晶膜、半導體裝置之製造方法及半導體裝置
JP6852030B2 (ja)	2021-03-31	電子デバイスパッケージ用テープ
CN108779374A (zh)	2018-11-09	电子器件封装用带
CN104726032A (zh)	2015-06-24	粘接薄膜、切割/芯片接合薄膜、半导体装置的制造方法以及半导体装置
KR20180129789A (ko)	2018-12-05	전자 디바이스 패키지용 테이프
CN107614641A (zh)	2018-01-19	半导体加工用带
KR102593593B1 (ko)	2023-10-25	전자 디바이스 패키지용 테이프
JP6655576B2 (ja)	2020-02-26	電子デバイスパッケージ用テープ
JP2021185610A (ja)	2021-12-09	電子デバイスパッケージ用テープ
JP7112997B2 (ja)	2022-08-04	電子デバイスパッケージ用テープ