TWI693509B - Thermal insulation structure - Google Patents

Abstract

A thermal insulation structure includes a base plate and a thermal insulation component. The thermal insulation component is disposed on the base plate. The thermal insulation component is made of aerogel. The thermal conductivity of the base plate is larger than the thermal conductivity of the thermal insulation component.

Description

Insulation structure

The invention relates to a heat insulation structure, especially a heat insulation structure using aerogel material.

With the development of science and technology, the performance of electronic devices such as notebook computers or mobile phones is increasing, and the heat generated by these electronic devices is also relatively improved. In this case, some manufacturers use a heat dissipation structure with high thermal conductivity on the electronic device. Contacting the heat dissipation structure with the heat source inside the electronic device helps avoid excessive heat concentration, thereby improving the heat dissipation effect.

However, although the heat dissipation structure can dissipate heat inside the electronic device, the heat will be thermally conducted to the housing of the electronic device through the heat dissipation structure. When the user touches the electronic device, he may feel an excessively high temperature, which makes the user's operating experience poor.

The present invention is to provide a heat insulation structure, so as to solve the problem that the heat dissipation structure cannot effectively slow down the heat conduction to the surface of the heat dissipation structure away from the heat source.

The heat insulation structure disclosed in an embodiment of the present invention includes a substrate and a heat insulation member. The heat insulator is provided on the substrate. The material of the insulation is aerogel. The thermal conductivity of the substrate is greater than the thermal conductivity of the thermal insulation.

According to the heat insulation structure disclosed in the above embodiment, the substrate can be used for heat dissipation; in addition, since the thermal conductivity of the aerogel material is much lower than the thermal conductivity of the substrate, it can be Thermal insulation made of aerogel. In this way, the heat insulation structure can achieve the effect of effectively dissipating heat on one surface and effectively insulating the other surface.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention.

10a, 10b, 10c, 10d, 10e: thermal insulation structure

100a, 100b, 100c, 100d, 100e: substrate

200a, 200b, 200c, 200d: heat insulation

210d, 210e: sheet monomer

220d, 220e: connector

300b, 300c: side panel

400c, 400d, 400e: cover

S: accommodating space

T: thickness

FIG. 1 is a three-dimensional schematic diagram of a heat insulation structure according to an embodiment of the invention.

FIG. 2 is a schematic side sectional view of the heat insulation structure of FIG. 1.

FIG. 3 is an exploded perspective view of a heat insulation structure according to another embodiment of the invention.

4 is a schematic side sectional view of the heat insulation structure of FIG. 3.

FIG. 5 is an exploded perspective view of a heat insulation structure according to yet another embodiment of the present invention.

FIG. 6 is a schematic side sectional view of the heat insulation structure of FIG. 5.

7 is an exploded perspective view of a heat insulation structure according to yet another embodiment of the present invention.

FIG. 8 is a schematic side sectional view of the heat insulation structure of FIG. 7.

9 is an exploded perspective view of a heat insulation structure according to yet another embodiment of the present invention.

FIG. 10 is a schematic side sectional view of the heat insulation structure of FIG. 9.

The following will describe one embodiment of the present invention. Please refer to FIG. 1 to FIG. 2 first. FIG. 1 is a schematic perspective view of a heat insulation structure 10a according to an embodiment of the invention. FIG. 2 is a schematic side sectional view of the heat insulation structure 10a of FIG. 1.

The heat insulation structure 10a of this embodiment is applied to electronic devices, for example. Insulation structure 10a includes a substrate 100a and a heat insulating member 200a. The heat insulating material 200a is provided on the substrate 100a in a bonded manner, for example. The thermal conductivity of the substrate 100a is greater than the thermal conductivity of the heat insulator 200a. The material of the substrate 100a is, for example, a metal with high thermal conductivity such as copper or aluminum. The material of the heat insulator 200a is aerogel with low thermal conductivity.

Specifically, in this embodiment and some embodiments of the present invention, the thickness T of the substrate 100a is, for example, 0.5 mm, but not limited thereto. In other embodiments, the thickness of the substrate is, for example, 0.4 mm, 0.3 mm, 0.2 mm, and 0.1 mm. In this embodiment and some embodiments of the present invention, the material of the substrate 100a is, for example, a thermal conductivity greater than 200 W/m. The metal of Kelvin (W/mK) and the material of heat insulation 200a have a thermal conductivity of approximately 0.02 W/m. Kelvin aerogel. The thermal conductivity of the substrate 100a is much greater than the thermal conductivity of the heat insulator 200a, and the substrate 100a and the heat insulator 200a can be used as a thermal conductor and a thermal insulator, respectively.

In this way, the heat insulating structure 10a can be applied to, for example, an electronic device (not shown). The substrate 100a is in contact with a heat source (not shown) inside the electronic device. The high thermal conductivity of the substrate 100a is used to remove heat from the heat source so that the heat can be evenly distributed on the substrate 100a, which helps avoid excessive heat concentration. It can prevent the performance of the electronic device from decreasing or prevent the electronic device from being damaged. Furthermore, the heat insulating material 200a made of aerogel is provided on the substrate 100a as a solid thermal insulator, for example, facing the outside of the electronic device, which can effectively reduce the heat conduction through the heat to the outer surface of the electronic device. In addition, the aerogel has a plurality of holes (not shown in the figure) inside the structure, and air does not easily flow in these holes, so the heat insulating member 200a can also effectively reduce the heat convection through the heat to the outer surface of the electronic device. Then, carbon as a heat radiation insulating material can also be incorporated into the heat insulating member 200a, which can effectively reduce the heat radiation through the heat to the outer surface of the electronic device. In summary, the heat insulation 200a can effectively reduce the heat Through heat conduction, heat convection or heat radiation to the outer surface of the electronic device, thereby avoiding the user from feeling excessively high temperature when touching the electronic device.

Then please refer to FIGS. 3 to 4. FIG. 3 is an exploded perspective view of the heat insulation structure 10b according to another embodiment of the present invention. FIG. 4 is a schematic side sectional view of the thermal insulation structure 10b of FIG. 3. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the present invention, the heat insulating structure 10b may further include a side plate 300b. The side plate 300b is disposed on the substrate 100b. The side plate 300b is, for example, an annular structure, and the side plate 300b and the substrate 100b together surround an accommodating space S, in which the heat insulating member 200b is located in the accommodating space S. The invention is not limited to the number or structure of the side plates 300b. In some embodiments, the number of side plates may be two and are relatively disposed on one side of the substrate, and the two side plates and the substrate also surround the accommodating space together. In this embodiment and some embodiments of the present invention, the accommodating space S surrounded by the base plate 100b and the side plate 300b is available for the aerogel to be placed in the form of powder or gel first, followed by baking, for example The process of converting the aerogel into a solid form. In this way, the heat insulating member 200b is fixed in the accommodating space S without being provided on the substrate 100b by, for example, laminating.

Then please refer to FIG. 5 to FIG. 6. FIG. 5 is an exploded perspective view of a thermal insulation structure 10c according to yet another embodiment of the present invention. FIG. 6 is a schematic side sectional view of the thermal insulation structure 10c of FIG. 5. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the present invention, the heat insulating structure 10c may further include a cover plate 400c. The cover plate 400c is disposed on the side of the side plate 300c away from the substrate 100c. Cover plate 400c, side plate 300c and substrate The accommodating space S is surrounded by 100c. The cover plate 400c can maintain the heat insulating member 200c in the accommodating space S, and prevent the heat insulating member 200c from being exposed and peeling away from the side away from the substrate 100c. Besides, the accommodating space S may be a closed space, for example. In this way, the accommodating space S can be evacuated so that some air that may be present in the accommodating space S does not negatively affect the thermal conductivity of the heat insulation member 200c, thereby ensuring the heat insulation effect of the heat insulation structure 10c.

Furthermore, in this embodiment and some embodiments of the present invention, the thermal conductivity of the substrate 100c may be different from the thermal conductivity of the side plate 300c or the thermal conductivity of the cover plate 400c. Specifically, the thermal conductivity of the substrate 100c is greater than the thermal conductivity of the side plate 300c and greater than the thermal conductivity of the cover plate 400c. In this way, when the substrate 100c contacts the heat source of the electronic device, heat can be prevented from being transmitted to the outer surface of the electronic device through the side plate 300c and the cover plate 400c, but it is not limited thereto. In some embodiments, the thermal conductivity of the substrate is equal to the thermal conductivity of the side plate and is greater than the thermal conductivity of the cover plate. Or in some other embodiments, the thermal conductivity of the cover plate is greater than the thermal conductivity of the side plate and greater than the thermal conductivity of the substrate; in this case, the cover plate contacts the heat source of the electronic device, and the substrate is oriented The outer side of the electronic device enables the cover plate to distribute the heat of the heat source evenly without conducting to the outer surface of the electronic device.

Then please refer to FIG. 7 to FIG. 8. FIG. 7 is an exploded perspective view of a thermal insulation structure 10d according to yet another embodiment of the present invention. FIG. 8 is a schematic side sectional view of the thermal insulation structure 10d of FIG. 7. The following only describes the differences between another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the present invention, the heat insulating member 200d may further include a plurality of sheet-like monomers 210d and a connecting member 220d. The sheet-like single body 210d is provided on the connector 220d. The sheet-like monomers 210d are connected to each other through a connecting member 220d.

Specifically, the sheet-like monomer 210d is disposed on one side of the connecting member 220d; the connecting member 220d contacts, for example, the side of the substrate 100d close to the cover plate 400d, and the sheet-like monomers 210d respectively protrude toward the cover plate 400d at the same distance On one side of the connecting member 220d and, for example, in contact with the cover plate 400d close to the side of the substrate 100d. In this way, the heat insulation member 200d can save the material of the heat insulation member 200d without filling the accommodating space S, and also provides support to the substrate 100d and the cover plate 400d, but not limited thereto. In some embodiments, the cover plate may be contacted by the connecting member close to one side of the substrate, and the substrate may be contacted by the sheet-like monomer close to one side of the cover plate. Or in some other embodiments, the sheet-like monomers may protrude from the connecting member at different distances and also provide support to the substrate or the cover plate. In this embodiment and some embodiments of the present invention, similarly, the accommodating space S may be evacuated to prevent the air between the sheet-like monomers 210d from negatively affecting the thermal conductivity of the heat insulating member 200d.

Then please refer to FIG. 9 to FIG. 10. FIG. 9 is an exploded perspective view of the thermal insulation structure 10e according to yet another embodiment of the present invention. FIG. 10 is a schematic side sectional view of the heat insulation structure 10e of FIG. 9. The following only describes the differences between still another embodiment of the present invention and some of the foregoing embodiments, and the remaining similarities will be omitted. In this embodiment and some embodiments of the present invention, the sheet-like monomer 210e is disposed on opposite sides of the connecting member 220e; the sheet-like monomer 210e protrudes out of the connecting member toward the substrate 100e or the cover plate 400e at the same distance, respectively The opposite sides of 220e and, for example, contact the substrate 100e or the cover plate 400e. In this way, the protrusion amount of the sheet-like monomer 210e relative to the connecting member 220e is shortened, so that the sheet-like monomer 210e has sufficient support for the substrate 100e and the cover plate 400e. Similarly, the accommodating space S can also be evacuated to prevent the air between the sheet-like monomers 210e from affecting the thermal conductivity of the heat insulating member 200e.

According to the heat insulation structure of the above embodiment, the heat of the substrate is used to take the heat away from the heat source and the heat can be evenly distributed on the substrate; in addition, the heat insulator is a solid thermal insulator and is provided on the substrate. It can effectively slow down the heat through heat conduction, heat convection or heat radiation to a surface of the heat insulating member far away from the substrate, thereby preventing the user from feeling excessively high temperature when contacting the surface.

In some embodiments, the thermal insulation structure may further include a side panel. The accommodating space surrounded by the base plate and the side plates can be used to place the aerogel in a powder or gel form first, and then convert the aerogel into a solid form through a process such as baking. In this way, the heat insulating member is fixed in the accommodating space and does not need to be disposed on the substrate in a manner such as lamination.

In some embodiments, the thermal insulation structure may further include a cover plate. The cover plate can maintain the heat insulating member in the accommodating space, and prevent the heat insulating member from being exposed and peeling away from the side away from the substrate. In addition, the accommodating space can be evacuated so that some air that may be present in the accommodating space does not negatively affect the thermal conductivity of the thermal insulation, thereby ensuring the thermal insulation effect of the thermal insulation structure.

In some embodiments, the thermal conductivity of the base plate is greater than the thermal conductivity of the side plate and greater than the thermal conductivity of the cover plate. In this way, when the substrate contacts the heat source, heat can be prevented from being transmitted to the surface of the cover plate away from the substrate through the side plate and the cover plate.

In some embodiments, the heat insulating member may further include a plurality of sheet-like monomers and a connecting member, and the sheet-like monomers respectively protrude from the side of the connecting member toward the cover plate at the same distance. In this way, the heat insulation member can save the material of the heat insulation member without filling the accommodating space, and also provides support for the base plate and the cover plate.

In some embodiments, the sheet-like monomers protrude from opposite sides of the connecting member toward the substrate or the cover plate at the same distance. In this way, the protrusion of the sheet-like monomer relative to the connecting member The amount is shortened, so that the sheet-like monomer has sufficient support for the substrate and the cover plate.

Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be subject to the scope defined in the patent application scope attached to this specification.

10a: thermal insulation structure

100a: substrate

200a: heat insulation

Claims (7)

A heat insulation structure, comprising: a base plate; and a heat insulation piece, which is arranged on the base plate, the material of the heat insulation piece is aerogel, the heat insulation piece comprises a plurality of sheet-like monomers and a connection The sheet-shaped monomers are disposed on opposite sides of the connecting member, and the sheet-shaped monomers are connected to each other through the connecting member; wherein, the thermal conductivity of the substrate is greater than the thermal conductivity of the heat insulating member. The heat insulation structure as described in item 1 of the patent application scope further includes a side plate disposed on the base plate. The side plate and the base plate together surround an accommodation space, and the heat insulation member is located in the accommodation space. The thermal insulation structure as described in Item 2 of the patent application scope further includes a cover plate, the cover plate is disposed on a side of the side plate away from the base plate, the cover plate, the side plate and the base plate surround the accommodating space together . The thermal insulation structure as described in item 3 of the patent application scope, wherein the thermal conductivity of the base plate is different from the thermal conductivity of the cover plate or the thermal conductivity of the side plate. The heat insulation structure as described in item 1 of the patent application scope, wherein the sheet-shaped monomers protrude from the connecting member at the same distance. The heat insulation structure as described in item 1 of the patent application scope, wherein the material of the substrate is metal. The thermal insulation structure as described in item 1 of the patent application scope, wherein a thickness of the substrate is substantially less than 0.5 mm.

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