TWI691240B - Method for manufacturing integrated circuit board and conductive film circuit - Google Patents

Abstract

The integrated circuit board of the present invention has an insulating carrier board, at least one side of the insulating carrier board is provided with a conductive film circuit, and at least one layer of stacked circuit is covered in a part of the conductive film circuit; and, through bidirectional partial etching For conductive film circuits or stacked circuits built on an insulating carrier board, the circuit thickness can be relatively greater than the circuit spacing, which helps to integrate low-power control circuits and high-power electronic components on the same circuit board, and The high-power electronic components can also reduce the distance between the electrical pins, and reduce the overall structural cost through the effect of integration.

Description

Method for manufacturing integrated circuit board and conductive film circuit

The invention relates to an integrated circuit board, in particular to an integrated circuit board with fine lines with high precision and high lines with high current lines, and a method for manufacturing a conductive film circuit related thereto.

Ceramic copper clad laminate is an important component of high-voltage high-power IGBT modules. It has the characteristics of high thermal conductivity, high electrical insulation, high mechanical strength and low expansion of ceramics. It also has the high conductivity of oxygen-free copper and excellent welding performance. And can etch various circuit patterns like PCB circuit board.

A method for selective metallization on a ceramic substrate is known, which uses direct bonded copper (DBC) technology to sinter the ceramic layer to a metal layer such as a copper layer at high temperature. After sintering, the The bonding force between the ceramic layer and the copper layer is strong and the reliability is high.

However, between the large-area ceramic layer interface and the large-area copper layer interface, it is easy to have the problems of internal stress and hole rate of the interface, which in turn produces material defects commonly known as shell patterns, and it can only use unidirectional etching to form circuits. Therefore, the minimum line distance can only be equal to the line height, which also limits the characteristics of integrating different power components.

The present invention is to provide an integrated circuit board that integrates a low-current circuit with a relatively low thickness and a large-current circuit with a relatively high thickness on the same side of an insulating carrier board, and a method for manufacturing a conductive film circuit related thereto, for its main purpose By.

The integrated circuit board of the present invention has an insulating carrier board. At least one side of the insulating carrier board is provided with a conductive film circuit, and at least one layer of stacked circuits is covered in a part of the conductive film circuit.

According to the above technical features, the integrated circuit board is provided with a conductive film circuit on both sides of the insulating carrier board, at least one through hole is provided on the insulating carrier board, and the at least one through hole is filled for use Conducting members that electrically connect the conductive film lines on both sides of the insulating carrier board and increase the amount of circulating current.

According to the above technical feature, the integrated circuit board is provided with a layer of stacked circuits on the conductive film circuit, and a bonding layer made of conductive material is provided between the conductive film circuit and the stacked circuit.

According to the above technical features, the integrated circuit board is provided with a plurality of stacked circuits on the conductive film circuit, a conductive layer is provided between the conductive film circuit and the plurality of stacked circuits, and between each of the stacked circuits The bonding layer composed of materials achieves secondary buffering through the bonding layer between stacked lines to reduce the shell effect and the stress problem of bonding with heterogeneous materials.

According to the above technical features, the integrated circuit board is covered with a plating layer on the exposed portions of the conductive film circuit and each of the stacked circuits.

Each of the bonding layer systems can be selected from one of solder, flux, and plating film or a combination thereof.

The stacked circuit on the upper layer of the conductive film circuit has at least one first bridge block connected between adjacent blocks to which the conductive film circuit belongs.

The stacked circuit on the upper layer of the conductive film circuit has at least one first bridging block connected between adjacent blocks to which the conductive film circuit belongs; and, the stacked circuit on the upper layer of the at least one stacked circuit has at least one span The second bridge block is connected between adjacent blocks to which the lower layer stacked circuit belongs.

The method for manufacturing a conductive film circuit of the present invention includes the following steps: (a) constructing a first etching structure, providing a temporary carrier board, and covering the board surface of the temporary carrier board with a conductive film, by which The surface of the conductive film that is not in contact with the temporary carrier is used as the first etched surface; (b) The first line etching, the non-circuit pattern part of the first etched surface of the conductive film is removed to the preset by etching Depth; (c) build a second etching structure to provide an insulating carrier board, the first etching surface of the conductive film that completed the first line etching is in contact with the insulating carrier board, the conductive film together with the temporary The fixed carrier is fixed on the insulating carrier; (d) A second etching surface is generated. After the conductive film is fixed on the insulating carrier, the temporary carrier above the conductive film is removed, so that The surface of the conductive film that was originally in contact with the temporary carrier board is exposed as a second circuit etching surface; (e) The second circuit etching, corresponding to the second etching surface of the conductive film and the first etching surface by etching If the non-circuit pattern part is completely removed, a conductive film circuit with a circuit thickness relatively greater than the circuit spacing can be constructed on the insulating carrier.

The temporary carrier board may be a quartz glass or ceramic carrier board.

The conductive film can be a copper foil.

The insulating carrier board may be a ceramic carrier board.

The present invention is mainly used in the design of a conductive film circuit on one side of the insulating carrier board, and a part of the conductive film circuit is covered with at least one layer of stacked circuit design, which can integrate a low-power control circuit and a high-power electronic component in the same The circuit board and the high-power electronic components can also reduce the distance between the electrical pins, and the overall structure cost is reduced by the effect of integration; in particular, the bidirectional fractional etching method is used to effectively solve the problem of traditional circuits using unidirectional etching The minimum line distance can only be equal to the limit of line height, as well as effectively solve the problems of internal stress and hole rate of the joint, to avoid the material defects commonly known as shell patterns.

The present invention mainly provides an integrated circuit board with fine lines and high current lines with high accuracy, and a method for manufacturing a conductive film circuit related thereto. As shown in FIG. 1, the integrated circuit board of the present invention has a The insulating carrier 10 is provided with a conductive film circuit 12 on at least one side of the insulating carrier 10, and at least one layer of stacked circuits 20 is covered on a part of the conductive film circuit 12.

Accordingly, the integrated circuit board can be formed on the same surface of the insulating carrier board 10 with a low-thickness circuit composed of a conductive film line 12 and a higher thickness composed of a conductive film line 12 combined with a stacked line 20 The high-current circuit can integrate low-power control circuits and high-power electronic components on the same circuit board, and enable high-power electronic components to also reduce the distance between electrical pins, reducing the overall structure through the effect of integration cost.

In the implementation of the integrated circuit board of the present invention, the prefabricated stacked circuit 20 can be formed into a bonding layer 22 bonded to the conductive film circuit 12 using solder, flux, or a bonding plating film on the stacked circuit 20. The layer 22 joins the conductive film circuit 12 and the stacked circuit 20, and the same method can be used, as shown in FIG. 2, to stack the stacked circuit 20 above the second layer by the bonding layer 22 between the stacked circuits 20 Secondary buffering to reduce the effect of shell pattern and the stress of joining with heterogeneous materials.

Furthermore, the stacked circuit 20 above the conductive film circuit 12 has at least one first bridge block 211 (as shown in FIG. 6) connected between adjacent blocks to which the conductive film circuit 12 belongs; In an implementation mode in which an integrated circuit board is stacked with second or more stacked circuits 20, the stacked circuit 20 on the upper layer of at least one of the stacked circuits 20 may also have at least one cross-connected adjacent area to which the lower stacked circuit 20 belongs The second bridge block 212 between the blocks (as shown in FIG. 6), at least through the circuit design of the first bridge block 211 (or the first bridge block 211 and the second bridge block 212), the original one The entire circuit layer is divided into a plurality of three-dimensionally stacked connected block circuit layers, thereby guiding the expansion stress to the height direction and using the bending of the bridge block to buffer the horizontal stress, so as to be more active and reliable The method reduces the shell effect and the stress problem with the heterogeneous material. It is worth mentioning that by guiding the stress to the height direction, the stress problem between the carrier board and the carrier element can be effectively improved and the reliability of the carrier element and the circuit can be improved. degree.

Even a method such as electroplating or chemical plating can be further used to coat a film layer 30 on the exposed portions of the conductive film circuit 12 and each of the stacked circuits 20, and the addition of the film layer 30 can reduce the line spacing and protect the stacked circuits The purpose of 20.

Of course, in the implementation of the integrated circuit board of the present invention, a plurality of pre-fabricated stacked circuits 20 may be stacked and bonded to a predetermined thickness using solder, flux, or each of the stacked circuits 20 covered with a bonding coating. Then, a plurality of stacked circuits 20 that have been bonded in advance are overlaid on the conductive film circuit 12; of course, each of the bonding layers 22 can be selected from one of solder, flux, and plating film, or a combination thereof.

As shown in FIG. 3, when the integrated circuit board of the present invention is implemented, the overall integrated circuit board can also be provided with a conductive film circuit 12 on both sides of the insulating carrier board 10 according to the circuit design requirements. 10 is provided with at least one through hole 11, and corresponding to different current densities is filled in the at least one through hole 11 for electrically connecting the conductive film circuit 12 used to form the surface of the insulating carrier 10 and increasing the amount of circulating current The conductive member 13 achieves the purpose of arranging large current lines on both sides of the insulating carrier 10.

The integrated circuit board of the present invention can further make the circuit thickness of the conductive film circuit 12 or the stacked circuit 20 relatively larger than that of the circuit by using the bidirectional fractional etching method for the conductive film circuit 12 or the stacked circuit 20 on the insulating carrier 10 The pitch, even the thickness of the line can be twice the pitch of the line. Under the condition of the same line thickness, a line design with a smaller line pitch can be realized. Furthermore, the conductive film line on the insulating carrier 10 of the integrated circuit board of the present invention 12. Can be coated circuit or copper foil circuit.

Please also refer to Figure 4 and Figure 5 together, the conductive film circuit manufacturing method of the present invention includes the following steps:

(a) Build the first etching structure to provide a temporary carrier 40, a conductive film 12A is coated on the surface of the temporary carrier 40, and the conductive film 12A does not interact with the temporary carrier 40 One surface of the contact is used as the first etched surface; in implementation, the temporary carrier 40 can be a quartz glass or ceramic carrier; the conductive film 12A can be a copper foil.

(b) For the first circuit etching, the non-circuit pattern portion of the first etched surface of the conductive film 12A is removed to a predetermined depth by etching.

(c) Build a second etching structure to provide an insulating carrier 10, and connect the conductive film 12A together with the first etched surface of the conductive film 12A that completed the first line etching in contact with the insulating carrier 10 The temporary carrier 40 is fixed on the insulating carrier 10; in implementation, the insulating carrier 10 may be a ceramic carrier.

(d) A second etched surface is created. After the conductive film 12A is actually fixed on the insulating carrier 10, the temporary carrier 40 above the conductive film 12A is removed, so that the conductive film 12A is originally One surface contacted by the sex carrier 40 is exposed as the second circuit etching surface.

(e) The second circuit etching, the non-circuit pattern portion corresponding to the second etched surface of the conductive film 12A and the first etched surface of the conductive film 12A is completely removed by etching, that is, the insulating carrier 10 A conductive film circuit 12 with a circuit thickness relatively greater than the circuit spacing is constructed thereon.

Since the present invention constructs a conductive film line 12 with a line thickness relatively greater than the line spacing on the insulating carrier 10 by bidirectional fractional etching, it not only effectively solves the problem that the minimum line distance of traditional lines using unidirectional etching can only be equal to the line height limit.

In particular, when the conductive film 12A that has completed the first etching is fixed to the insulating carrier 10, the area of the conductive film 12A and the insulating carrier 10 is much smaller than the area of the conductive film 12A that has not been etched or the coated circuit Instead, it can effectively solve the problems of internal stress and joint hole rate generated by direct bonded copper (DBC) technology, and avoid the material defects commonly known as shell patterns.

The above-mentioned embodiments are only to illustrate the technical ideas and features of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, but cannot limit the patent scope of the present invention, That is to say, any equivalent changes or modifications made in accordance with the spirit disclosed by the present invention should still be covered by the patent scope of the present invention.

10: Insulated carrier board

11: through hole

12A: conductive film

12: Conductive film circuit

13: conductive parts

20: Stacked line

211: The first bridge block

212: The second bridge block

22: junction layer

30: coating

40: Temporary carrier board

Figure 1 is a cross-sectional view of the structure of an integrated circuit board according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of an integrated circuit board structure according to a second embodiment of the invention. FIG. 3 is a cross-sectional view of an integrated circuit board structure according to a third embodiment of the invention. FIG. 4 is a manufacturing flowchart of the conductive film circuit of the present invention. FIG. 5 is a schematic diagram of the forming state of each step of the conductive film circuit of the present invention in the manufacturing process. FIG. 6 is a cross-sectional view of an integrated circuit board structure according to a fourth embodiment of the invention.

10: Insulated carrier board

12: Conductive film circuit

20: Stacked line

22: junction layer

30: coating

Claims (11)

An integrated circuit board has an insulating carrier (10), at least one side of the insulating carrier (10) is provided with a conductive film circuit (12), and at least a portion of the conductive film circuit (12) is covered with at least A stacked circuit (20) of one layer, the stacked circuit (20) of the upper layer of the conductive film circuit (12) has at least one first bridge block (a bridge) connected between adjacent blocks to which the conductive film circuit (12) belongs ( 211). The integrated circuit board according to claim 1, wherein the integrated circuit board is provided with the conductive film circuit (12) on both sides of the insulating carrier board (10), and is provided on the insulating carrier board (10) There is at least one through hole (11), and the at least one through hole (11) is filled with a conductive film line (12) for forming the surface of the insulating carrier (10) for electrical connection and increasing the amount of circulating current Conductive parts (13). The integrated circuit board according to claim 1, wherein the integrated circuit board is provided with a layer of stacked circuits (20) on the conductive film circuit (12), and between the conductive film circuit (12) and the stacked circuit ( 20) There is a bonding layer (22) made of conductive material. The integrated circuit board according to claim 1, wherein the integrated circuit board is provided with a plurality of stacked circuits (20) on the conductive film circuit (12), and the conductive film circuit (12) and the plurality of layers A bonding layer (22) made of conductive material is provided between the stacked circuits (20) and between the stacked circuits (20). The integrated circuit board according to any one of claims 1 to 4, wherein the integrated circuit board is covered with a coating layer on the exposed portions of the conductive film circuit (12) and each of the stacked circuits (20) ( 30). The integrated circuit board according to claim 3 or 4, wherein each of the bonding layers (22) can be selected as one of solder, flux, plating film, or a combination thereof. An integrated circuit board has an insulating carrier (10), at least one side of the insulating carrier (10) is provided with a conductive film circuit (12), and at least a portion of the conductive film circuit (12) is covered with at least One layer of stacked circuit (20), the integrated circuit board is provided with a plurality of layered stacked circuits (20) on the conductive film circuit (12), the conductive film circuit (12) and the plurality of layered stacked circuits (20) And each of the stacked circuits (20) are respectively provided with a bonding layer (22) made of a conductive material, the integrated circuit board is stacked with a stacked circuit (20) above the second layer, the conductive film circuit ( 12) The upper stacked circuit (20) has at least one first bridge block (211) connected between adjacent blocks to which the conductive film circuit (12) belongs; and, the at least one stacked circuit (20) ) The upper layer stacking line (20) has at least one second bridge block (212) that is connected between adjacent blocks to which the lower layer stacking line (20) belongs. A method for manufacturing a conductive film circuit includes the following steps: (a) constructing a first etching structure, providing a temporary carrier board (40), and covering a conductive surface on the temporary carrier board (40) Film (12A), the surface of the conductive film (12A) that is not in contact with the temporary carrier (40) is used as the first etched surface; (b) the first line etching, the conductive film (12A) is etched ) Remove the non-circuit pattern part of the first etched surface to a preset depth; (c) build a second etched structure to provide an insulating carrier (10) to complete the first circuit etched conductive film (12A) ) The first etched surface is in contact with the insulating carrier (10), the conductive film (12A) and the temporary carrier (40) are fixed on the insulating carrier (10); (d) A second etched surface is created. After the conductive film (12A) is indeed fixed on the insulating carrier (10), the temporary carrier (40) above the conductive film (12A) is removed, so that A surface of the conductive film (12A) originally in contact with the temporary carrier (40) is exposed as a second circuit etching surface; (e) a second circuit etching, the second etching of the conductive film (12A) by etching When the non-circuit pattern portion corresponding to the first etched surface is completely removed, a conductive film circuit (12) with a circuit thickness relatively greater than the circuit spacing can be constructed on the insulating carrier (10). The method for manufacturing a conductive film circuit according to claim 8, wherein the temporary carrier (40) is a quartz glass or ceramic carrier. The method for manufacturing a conductive film circuit according to claim 8, wherein the conductive film (12A) is copper foil. The method for manufacturing a conductive film circuit according to claim 8, wherein the insulating carrier (10) is a ceramic carrier.

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