TWI689400B - Resin molding device and method for manufacturing resin molded product - Google Patents

Abstract

The present invention provides a resin molding apparatus that can perform resin molding with a simple structure. The resin molding apparatus includes a molding die (1000) and a mold closing part (220), characterized in that the molding die (1000) includes one die (100) and another die (200), one die (100) and another die ( 200) opposite to each other, the other mold (200) is mounted on the mold closing portion (220) on the opposite side of the surface opposite to the one mold (100), and the other mold (200) is provided with a resin material accommodating portion (212) and a plunger (213), the plunger (213) can move relative to the resin material accommodating portion (212) in the opening and closing direction of the mold (1000), by moving the mold closing portion (220) to the mold closing direction of the mold (1000) It can be moved to close the mold, push the plunger (213) in the direction of one mold (100), and use the plunger (213) to be accommodated in the resin material accommodating portion (212) The resin material in is extruded to the mold surface of the forming die (1000).

Description

Resin molding device and method for manufacturing resin molded product

The invention relates to a resin molding device and a method of manufacturing a resin molded product.

As a method of manufacturing a resin molded product, for example, compression molding, transfer molding, or the like can be used. In addition, a resin molding apparatus corresponding to various manufacturing methods of resin molded products can be used.

In a resin molding apparatus for transfer molding, for example, a transfer drive mechanism is provided in a press (molding mold), the resin is poured into a tank, the plunger is moved using the transfer drive mechanism, and the resin is injected (Patent Document 1).

[Prior Technical Literature]

[Patent Literature]

Patent Document 1: Japanese Patent Laid-Open No. 05-084765.

However, at the same time, since the resin molding device such as Patent Document 1 attaches the plunger to a transmission driving mechanism different from the mold closing mechanism of the molding die, it has a problem of complicated structure.

Therefore, an object of the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can perform resin molding with a simple structure.

In order to achieve the above object, the resin molding apparatus of the present invention includes a molding die and a mold closing part, characterized in that the molding die includes one mold and another mold, and the one mold and the other mold are opposed to each other. The other mold is mounted on the closed mold portion on the side opposite to the surface opposite to the one mold, and the other mold includes a resin material accommodating portion and a plunger, the plunger being opposed to the resin material The accommodating part can move in the opening and closing direction of the molding die, and by moving the mold closing part in the closing direction of the molding die, the column can be closed while the molding die is closed The plug is pushed in the direction of the one mold, and the plunger is used to extrude the resin material contained in the resin material accommodating portion onto the mold surface of the molding die.

The method for manufacturing a resin molded product of the present invention includes: a resin material accommodating step, accommodating a resin material in a resin material accommodating portion of a mold; and a mold closing step, which closes the mold, characterized in that in the mold closing step At the same time the mold is closed, the resin material contained in the resin material accommodating portion is extruded onto the mold surface of the mold.

According to the present invention, it is possible to provide a resin molding apparatus and a method of manufacturing a resin molded product that can perform resin molding with a simple structure.

1‧‧‧ substrate

1b‧‧‧Resin molded product (packaged substrate)

20‧‧‧cured resin

20a‧‧‧Board (resin material)

20b‧‧‧Melted resin (fluid resin)

20d‧‧‧Residual resin (useless resin part)

100‧‧‧ Upper mold (one mold)

110‧‧‧Up model cavity block

111‧‧‧ Cavity

111B‧‧‧Lower model cavity

112‧‧‧flow channel (resin flow channel)

113‧‧‧Remnant Department (Residual Resin Storage Department)

113B‧‧‧Remaining parts (residual resin storage part)

114‧‧‧Adjustment member (board height adjustment member)

115‧‧‧Elastic member for adjusting member

120‧‧‧ Upper mold base block

200‧‧‧ Lower mold (another mold)

210‧‧‧Lower model cavity block

210B‧‧‧Lower mold base block

211‧‧‧Board mounting section

212‧‧‧Can (resin material storage)

213‧‧‧ Plunger

213a‧‧‧Convex

214‧‧‧ring (ring member)

215‧‧‧Flange

216‧‧‧Remaining resin separation member

217‧‧‧Elastic member for remaining resin separation member

218‧‧‧Through hole (residual resin leakage hole)

220‧‧‧Closed Mold Department

221‧‧‧Cage A block (Cage block)

222‧‧‧B block (retainer block)

223‧‧‧Lower die mounting block (forming die mounting member)

224‧‧‧Elastic member

228‧‧‧Hydraulic mechanism

230‧‧‧Cage

231‧‧‧Cage A block (Cage block)

232‧‧‧B block (retainer block)

233‧‧‧Discharge board mounting block

234‧‧‧Elastic member

235‧‧‧Discharge plate

236‧‧‧Exhaust rod

300‧‧‧Unloader

301‧‧‧Suction pad

302‧‧‧ Resin molded product holding member (packaged substrate holding member)

400‧‧‧Middle mold

411‧‧‧Board mounting section

412‧‧‧Intermediate model cavity

413‧‧‧Intermediate mold resin material containing part (intermediate mold resin channel)

1000‧‧‧Forming die

1100‧‧‧Fixed pressure plate (1st pressure plate)

1110‧‧‧Fixed pressure plate

1111‧‧‧ Heater

1120‧‧‧movable pressure plate

1200‧‧‧ movable platen (second platen)

1210‧‧‧movable pressure plate

1211‧‧‧ Heater

1212‧‧‧Heating platform

1220‧‧‧movable pressure plate

A1‧‧‧ Arrow indicating the direction in which the unloader 300 enters

B1‧‧‧ Arrow indicating the direction in which the suction pad 301 descends

C1~C2‧‧‧arrow indicating the rising direction of suction pad 301

D1‧‧‧ arrow indicating the exit direction of the unloader 300

E1~E2‧‧‧arrow indicating the moving direction of the mold 1000

F1~F4‧‧‧arrow indicating the upward direction of movable platen 1220

G1~G3‧‧‧arrow indicating the downward direction of movable platen 1220

H1‧‧‧ Arrow indicating the direction in which the unloader 300 enters

I1‧‧‧arrow indicating the downward direction of the resin molded product holding member 302

J1‧‧‧ Arrow indicating the direction of the suction pad 301 descending

K1~K2‧‧‧arrows indicating the rising direction of suction pad 301

L1‧‧‧ arrow indicating the exit direction of the unloader 300

M1‧‧‧arrow indicating the exit direction of the mold 1000

X1~X3‧‧‧arrow indicating the upward direction of movable platen 1200

Y1~Y3‧‧‧arrow indicating the downward direction of movable platen 1200

S1‧‧‧Heating section

S2‧‧‧Resin molding section

S3‧‧‧Curing section

S4‧‧‧Discharge section

FIG. 1 is a cross-sectional view schematically showing the structure of the resin molding apparatus of Embodiment 1. FIG.

2 is a cross-sectional view schematically showing one step of a method of manufacturing a resin molded product using the resin molding device of FIG. 1.

FIG. 3 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

4 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 5 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 6 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

7 is a cross-sectional view schematically showing another step of the method for manufacturing the same resin molded product as FIG. 2.

FIG. 8 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

9 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 10 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 11 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 12 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 13 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 2.

FIG. 14 is a cross-sectional view schematically showing another step of the method for manufacturing the same resin molded product as FIG. 2.

15A is a cross-sectional view schematically showing one step of a method of manufacturing a resin molded product using a modification of the resin molding apparatus of FIG. 1.

15B is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 15A.

FIG. 15C is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 15A.

FIG. 16(a) is a cross-sectional view schematically showing another modified example using the resin molding apparatus of FIG. Fig. 16(b) and Fig. (c) are diagrams each schematically showing a part of the resin molding apparatus of Fig. 16(a).

17 is a schematic diagram of the outline of the resin molding apparatus of Example 2 and a method of manufacturing a resin molded product using the same.

FIGS. 18( a) to (e) schematically show a cross-sectional view of a part of the resin molding apparatus and the method of manufacturing the resin molded article of FIG. 17.

FIGS. 19( a) to (h) are step cross-sectional views schematically showing another part of the resin molding apparatus and the method of manufacturing the resin molded article of FIG. 17.

(A) to (f) of FIG. 20 are step cross-sectional views schematically showing another part of the resin molding apparatus and the method of manufacturing the resin molded product of FIG. 17.

21 is a cross-sectional view schematically showing a modified example of the mold of the resin molding apparatus of Example 1 and Example 2. FIG.

22 is a cross-sectional view schematically showing one step of a method of manufacturing a resin molded product using the molding die of FIG. 21.

23 is a cross-sectional view schematically showing another step of the method of manufacturing the resin molded product using the molding die of FIG. 21.

24 is a cross-sectional view schematically showing another step of the method of manufacturing the resin molded product using the mold of FIG. 21.

25 is a cross-sectional view schematically showing another modified example of the mold of the resin molding apparatus of Example 1 and Example 2. FIG.

26 is a cross-sectional view schematically showing another modified example of the mold of the resin molding apparatus of Example 1 and Example 2. FIG.

FIG. 27 is a plan view of the molding die of FIG. 26. FIG.

FIGS. 28( a) and (b) are step cross-sectional views schematically showing an outline of a method of manufacturing a resin molded product using the molding dies of FIGS. 26 and 27.

29 is a cross-sectional view schematically showing one step of the method for manufacturing the resin molded article of Example 2. FIG.

FIG. 30 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 31 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

Fig. 32 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as Fig. 29.

FIG. 33 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 34 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 35 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 36 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 37 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 38 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 39 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 40 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 41 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 42 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

FIG. 43 is a cross-sectional view schematically showing another step of the method of manufacturing the same resin molded product as FIG. 29.

Next, the present invention will be described in detail with further examples. However, the present invention is not limited by the following description.

In the resin molding apparatus of the present invention, for example, the mold closing portion may include a plunger pushing member, an elastic member, and a molding die mounting member, and in the case of the other mold, the surface opposite to the one mold The molding die mounting member is mounted on the opposite side of the molding die, the elastic member is disposed on the opposite side of the molding die mounting member from the surface opposite to the other mold, and elastically supports the molding die mounting member. The plunger pushing member can move relatively in the opening and closing direction of the molding die relative to the molding die by expansion and contraction of the elastic member, and Moving in the mold closing direction, while closing the mold, the plunger pushing member can push the plunger in the direction of the one mold, and the plunger can The resin material accommodated in the resin material accommodating portion is extruded onto the mold surface of the molding die.

In the resin molding device of the present invention, for example, the plunger pushing member may be a holder block, and the holder block may hold the molding die mounting member.

In the resin molding device of the present invention, for example, the one mold may include a cavity, an adjustment member, and an elastic member for an adjustment member that elastically supports the adjustment member. The expansion and contraction of the elastic member can move in the opening and closing direction of the molding die, and the movement of the adjustment member can adjust the resin pressure in the cavity.

In the resin molding apparatus of the present invention, for example, the one mold may further include a surplus resin accommodating portion, the surplus resin accommodating portion communicates with the cavity, and is not accommodated in the mold when the mold is closed. At least a portion of the remaining resin in the cavity.

In the resin molding apparatus of the present invention, for example, at least a part of the adjustment member may be disposed in the remaining resin accommodating portion, and the capacity of the remaining resin accommodating portion may be adjusted by movement of the adjustment member, and The resin pressure in the cavity can be adjusted.

The resin molding apparatus of the present invention may further include, for example, a first pressure plate and a second pressure plate, the one mold is mounted on the first pressure plate, and the mold closing portion is mounted on the second pressure plate .

In the resin molding apparatus of the present invention, for example, the molding die may further include an intermediate mold, the intermediate mold is installed between the one mold and the other mold, and the intermediate mold includes the intermediate mold resin. Material accommodating part and intermediate mold resin channel.

In the resin molding apparatus of the present invention, for example, the molding die may include a cavity, an excess resin accommodating portion, and an excess resin separating member. The excess resin accommodating portion communicates with the cavity and accommodates when the mold is closed. At least a portion of the remaining resin that is not contained in the cavity, after the resin in the cavity and the remaining resin are cured, the remaining resin separating member is relative to the one mold and the other One or both of the molds rise or fall relatively, and separate the resin cured in the cavity and the remaining resin cured in the remaining resin accommodating portion.

As for the resin molding device of the present invention, for example, the resin molding device may be a device that molds a substrate, and when the one mold and the other mold are closed, the remaining amount of the substrate The end on the resin accommodating portion side is sandwiched between the mold surface of the other mold and the end of the remaining resin separating member.

In the resin molding apparatus of the present invention, for example, the other mold may include a through hole that penetrates from the resin material accommodating portion to the opposite side of the surface opposite to the one mold to mold the resin Thereafter, the residual resin in the resin material accommodating portion can be discharged from the through hole.

As for the resin molding device of the present invention, for example, the resin molding device includes a temperature rising section, a resin molding section, a curing section, and a discharge section, and the molding die can be installed and removed with respect to each section, and can Moving between the stages, the temperature rising stage raises the temperature of the molding die, the resin molding stage includes the mold closing part, and performs resin molding, and the curing stage cures the resin in the molding die, The discharge section releases the resin molded product from the molding die.

The method for manufacturing a resin molded product of the present invention can use, for example, the resin molding device of the present invention, in the mold closing step, by moving the mold closing portion in the mold closing direction of the mold, the While closing the forming die, push the plunger toward the direction of the one die, and extrude the resin material contained in the resin material accommodating portion to the die surface of the forming die with the plunger on.

The method for manufacturing a resin molded product of the present invention can include, for example, the resin molding device of the present invention includes a temperature rising section, a resin molding section, a curing section, and a discharge section, and the molding die can be attached to and detached from each of the sections. It can move between the stages, the temperature rising stage raises the temperature of the molding die, the resin molding stage includes the mold closing part to perform resin molding, and the curing stage cures the resin in the molding die , The discharging section releases the resin molded product from the molding die, the resin molding method further includes a temperature rising step of the molding die, and the temperature rising of the molding die in the temperature rising section; a resin curing step, Curing the resin in the molding die in the curing section; and a demolding step in which the resin molded product is demolded from the molding die in the discharge section, the resin material accommodating step and the mold closing step are located at This is done in the resin molding section.

In the present invention, the resin molded product is not particularly limited, and may be, for example, a resin molded product that molds only resin, or a resin molded product that encapsulates a component such as a wafer with resin. In the present invention, the resin molded product may be, for example, an electronic component.

In the present invention, "resin molding" or "resin encapsulation" means, for example, a state where the resin is cured (hardened).

In the present invention, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, thermosetting resins such as epoxy resin and silicone resin, or thermoplastic resins. Also, it may be a composite material partially containing a thermosetting resin or a thermoplastic resin. In the present invention, examples of the form of the resin material before molding include pellet resin, fluid resin, sheet resin, plate resin, and powder resin. In the present invention, the fluid resin is not particularly limited as long as it has fluidity, and examples thereof include liquid resins and molten resins. In the present invention, the liquid resin means, for example, a resin that is liquid or has fluidity at the tank temperature. In the present invention, the molten resin refers to, for example, a resin that is melted into a liquid state or has a fluid state. The form of the resin may be other forms as long as it can supply the cavity, can, etc. of the molding die.

In addition, in general, "electronic parts" include the case of the wafer before resin encapsulation and the case of the state where the wafer is resin encapsulated. However, in the present invention, in the case of "electronic parts" only, unless otherwise specified, then This shows an electronic component (the finished electronic component) in which the wafer is resin-encapsulated. In the present invention, “wafer” refers to a wafer before resin encapsulation, and specifically, for example, an integrated circuit (IC), a semiconductor wafer, a semiconductor element for power control, and the like. In the present invention, the wafer before resin encapsulation is called a "wafer" for convenience in order to distinguish it from the electronic components after resin encapsulation. However, the “wafer” of the present invention is not particularly limited as long as it is a wafer before resin encapsulation, and may not be in a wafer shape.

In the present invention, "flip-chip" refers to an integrated circuit (IC) wafer having bump-shaped bump electrodes called pads on electrodes (pads) on the surface portion of the integrated circuit (IC) wafer, or This kind of wafer morphology. The wafer can be mounted downward (face down) on a wiring portion such as a printed circuit board. The flip chip can be used, for example, as a wafer for wireless bonding or as one of mounting methods.

In the present invention, for example, one or both surfaces of the substrate may be resin-molded to produce a resin-molded product. Further, for example, a resin molded product can be manufactured by resin-encapsulating (resin molding) components (for example, wafers or flip-chips) mounted on one or both surfaces of the substrate. In the present invention, the substrate (also referred to as an interposer) is not particularly limited, and may be, for example, a lead frame, a wiring substrate, a wafer, a ceramic substrate, or the like. The substrate may be, for example, as described above, a mounting substrate on which wafers are mounted on one or both surfaces. The method of mounting the wafer is not particularly limited, but examples include wire bonding and flip chip bonding. In the present invention, for example, by encapsulating one surface or both surfaces of the mounting substrate with a resin, an electronic component in which the wafer is resin-encapsulated can be manufactured. In addition, the use of the resin-encapsulated substrate by the resin encapsulation device of the present invention is not particularly limited, but examples include high-frequency module substrates for mobile communication terminals, module substrates for power control, and substrates for machine control.

Also, in the present invention, "installation" includes "mounting" or "fixing". Further, in the present invention, "mounting" includes "fixing".

Hereinafter, specific embodiments of the present invention will be described based on the drawings. For convenience of explanation, the drawings are schematically described by appropriately omitting, exaggerating, etc.

[Example 1]

In this embodiment, an example of a resin molding apparatus of the present invention and an example of a method of manufacturing a resin molded product using the same will be described.

The cross-sectional view of FIG. 1 schematically shows the structure of the resin molding apparatus of this embodiment. As shown in the figure, this resin molding apparatus has a molding die 1000 and a mold closing part 220 as main components. The mold 1000 includes an upper mold (one mold) 100 and a lower mold (the other mold) 200. The upper mold 100 and the lower mold 200 are opposed to each other.

The upper mold 100 includes an upper mold cavity block 110 and an upper mold base block 120. As for the upper mold cavity block 110, the upper mold base block 120 is fixed to the surface on the opposite side of the mold surface (the surface on the side opposite to the lower mold 200). On the mold surface of the upper mold cavity block 110 (the surface on the side opposite to the lower mold 200), a cavity 111, a flow channel 112 (resin flow path), and a residual part (residual resin storage part) 113 are provided. The cavity 111 is plural. The cavity 111 adjacent to each other communicates with each other through the flow channel 112. The residual material portion 113 is provided at each of both ends of the upper mold cavity block 110. Each residual material portion 113 communicates with the adjacent cavity 111 via the flow channel 112. Then, as will be described later, the remnant 113 can accommodate at least a portion of the remaining resin that was not contained in the cavity 111 when the mold was closed. In addition, the upper mold 100 further includes an adjustment member (plate height adjustment member) 114 and an adjustment member elastic member 115 that elastically supports the adjustment member 114. As for the adjustment member 114, a part of it is arranged inside the residual part 113, and at the same time, the adjustment member elastic member 115 is fixed to the upper die base 120. The adjustment member 114 can move in the opening and closing direction of the mold 1000 by the expansion and contraction of the adjustment member elastic member 115. Then, the resin pressure in the cavity 111 can be adjusted by adjusting the volume of the residual part 113 by the movement of the adjustment member 114.

The resin material (board) contained in the tank 212 usually has a deviation in height (weight). Therefore, the amount of resin supplied to the cavity 111 and the residual part 113 will be different every time it is molded. Therefore, in order to adjust the volume and injection pressure (resin pressure) of the portion where the resin material is injected (cavity 111 and residual portion 113) during resin molding, as described above, the adjustment member (plate height adjustment member) 114 is moved. In addition, the residual material portion 113 may have a structure that communicates with the residual material portion (the left and right residual material portions 113 are directly connected). In this way, by connecting the residual material portion 113, it is possible to suppress the variation in the injection pressure (injection speed) of the local resin material due to the difference in the height of the resin material (plate).

The mold cavity block 210 below the lower mold 200 is the main component. The lower mold cavity block 210 includes a substrate mounting portion 211. The substrate mounting portion 211 is provided at a position of the mold surface (surface on the side opposite to the upper mold 100) of the lower mold cavity block 210 opposite to the cavity 111 of the upper mold 100. In addition, the lower mold 200 further includes a can (resin material accommodating portion) 212 and a plunger 213. The can 212 is provided at a position of the mold surface of the lower mold cavity block 210 opposite to the residual part 113 of the upper mold 100. The plunger 213 penetrates from the inside of the tank 212 to the opposite side of the mold surface of the lower mold cavity block 210. The plunger 213 can move in the opening and closing direction of the mold 1000 (upper mold 100 and lower mold 200) relative to the tank 212.

In addition, in FIG. 1, the plunger 213 further includes a ring (annular member) 214 and a flange portion 215. The ring 214 is provided on a part (two places in the figure) of the position where the outer periphery of the plunger 213 contacts the lower mold cavity block 210. More specifically, a groove is provided at two places on the outer periphery of the plunger 213, and a ring 214 is mounted on the groove, and the plunger 213 is held vertical by two fulcrums of the ring 214. The flange portion 215 is provided at the lower end of the plunger 213.

As shown in FIG. 1, by supporting the plunger 213 with the ring 214, the wear of the plunger 213 itself can be suppressed, and the wear can be dealt with by replacing the ring 214. The ring 214 is not particularly limited, and for example, fluororesins such as polytetrafluoroethylene, engineering plastics, etc. can be used. In addition, the constituent material of the plunger 213 is not particularly limited. For example, a super-hard steel alloy that is not easily worn can be used as the constituent material of the plunger 213. However, since the ring 214 can support and suppress abrasion, steel can be used as the material of the plunger 213 instead of the super-steel alloy. In the case where the super steel alloy constituting the plunger 213 contains cobalt, the cleaning sheet may chemically react with cobalt to cause corrosion of the plunger 213. However, if steel containing no cobalt is used as the constituent material of the plunger 213, the corrosion of the plunger 213 caused by such a cleaning sheet can be suppressed or prevented. In addition, if steel is used instead of the super steel alloy, the cost of the plunger 213 itself can be reduced.

The mold closing part 220 includes a holder A block 221, a holder B block 222, a lower mold mounting block (molding mold mounting member) 223, and an elastic member 224. The holder A block 221 and the holder B block 222 constitute a holder block. The elastic member 224 is arranged on the side opposite to the surface of the lower mold mounting block 223 opposite to the upper mold 100. The lower mold mounting block 223 is elastically supported on the upper surface of the holder B block 222 by an elastic member 224. The lower portion of the lower die mounting block 223 constitutes a flange portion protruding from the peripheral edge portion. The holder A block 221 is fixed to the peripheral portion of the upper surface of the holder B block 222. In addition, the outer surface of the flange portion of the lower mold mounting block 223 and the outer peripheral portion of the upper surface and the outer surface of the elastic member 224 are surrounded by the holder A block 221. In this way, the lower mold mounting block 223 and the elastic member 224 are held by the holder blocks (holder A block 221 and holder B block 222). The portion other than the flange portion of the lower mold mounting block 223 protrudes from the upper surface of the holder A block 221. As for the lower mold 200, a lower mold mounting block (molding mold mounting member) 223 as a part of the mold closing portion 220 is mounted on the side opposite to the surface opposed to the upper mold 100. Then, as will be described later, by moving the mold closing portion 220 in the mold closing direction of the mold 1000 (the upper mold 100 and the lower mold 200), the mold 1000 is closed, and the plunger 213 is moved toward the upper mold 100 at the same time. Push in the direction and extrude the resin material contained in the resin material accommodating portion 212 onto the mold surface of the mold 1000 through the plunger 213. As described later, when the mold is closed, since the retainer A block 221 is used to push the plunger 213, the retainer A block 221 corresponds to the "plunger push-in member".

In addition, the resin molding apparatus of FIG. 1 further includes a fixed platen (first platen) 1100 and a movable platen (second platen) 1200. The upper mold 100 is mounted on the lower surface of the fixed platen 1100, and the mold closing portion 220 is mounted on the lower surface of the holder B block 222, and is mounted on the upper surface of the movable platen 1200.

The manufacturing method of the resin molded product using the resin molding apparatus of FIG. 1 can be performed as shown in FIGS. 2-14, for example. Hereinafter, it will be explained specifically.

First, as shown in FIG. 2, while supplying (mounting) the substrate 1 to the substrate mounting portion 211 of the lower mold 200, the plate (resin material) 20 a is supplied to the tank 212. At this time, the lower mold 200 and the upper mold 100 are heated by a heater (not shown) in advance. In addition, the plate 20a is not particularly limited, and may be a thermoplastic resin or a thermosetting resin. However, for example, a thermosetting resin such as epoxy resin and silicone resin can be used.

Next, as shown in FIGS. 3 to 6, mold closing and resin molding are performed.

First, as shown in FIG. 3, the movable platen 1200 is raised in the direction of arrow X1. Thereby, the mold closing part 220 and the lower mold 200 and the movable platen 1200 are raised together, and as shown in the figure, the mold surface of the lower mold 200 and the mold surface of the upper mold 100 are brought into contact. At this time, the plate 20a melts due to the heat of the lower mold 200, and as shown in the figure, becomes a molten resin (fluid resin) 20b.

Next, as shown in FIG. 4, the movable platen 1200 is further raised in the direction of arrow X2. Thereby, the mold closing part 220 and the lower mold 200 are raised together with the movable platen 1200, and as shown in the figure, the plunger 213 and the holder A block (holder block) 221 are brought into contact.

Next, as shown in FIG. 5, the movable platen 1200 is further raised in the direction of arrow X3. At this time, as shown in the figure, as the elastic member 224 contracts, the lower mold mounting block 223 and the lower mold 200 maintain their original positions, and the holder blocks (holder A block 221 and holder B block 222) rise. Thereby, as shown in the figure, the plunger 213 is pushed (pushed into) the tank 212 using the holder A block (holder block) 221, and the molten resin 20b is filled into the residual portion 113, the runner 112, and the cavity 111.

Thereafter, as shown in FIG. 6, the heat of the upper mold 100 and the lower mold 200 is used to cure the residual resin 113, the flow channel 112, and the fluid resin 20 b in the cavity 111 into a cured resin. In FIG. 6, the symbol 20 represents the cured resin in the flow channel 112 and the cavity 111 (hereinafter simply referred to as “cured resin”), and the symbol 20d represents the cured resin in the residual portion 113 (hereinafter referred to as “surplus resin”) Or "Useless resin part"). Thereby, one surface of the substrate 1 is resin-molded by the cured resin 20 to form a resin molded product (packaged substrate) 1b. Then, after the fluid resin 20b is cured into the cured resin 20 and the remaining resin (unwanted resin portion) 20d, as shown in FIG. 6, the movable platen 1200 is lowered in the direction of arrow Y1. At this time, as shown in the figure, the upward force exerted on the elastic member 224 is released, and the elastic member 224 extends again. As a result, the lower mold mounting block 223 and the lower mold 200 are kept in place, and the holder blocks (holder A block 221 and holder B block 222) are lowered.

Next, as shown in FIGS. 7 to 14, the resin molded product 1b is demolded (removed from the mold) and unloaded (transported to the outside of the mold).

First, as shown in FIG. 7, the movable platen 1200 is further lowered in the direction of arrow Y2. Thus, as shown in the figure, the mold closing section 220 and the lower mold 200 and the movable platen are lowered together, and the upper mold 100 and the lower mold 200 are opened. As a result, as shown in the figure, the resin molded product 1 b (substrate 1 and cured resin 20) and the remaining resin 20 d are lowered together with the lower mold 200 and released from the upper mold 100. In addition, for example, the restoring force (elongation force) of the adjusting member elastic member 115 can press the remaining resin 20 d of the adjusting member 114 to release the resin molded product 1 b and the remaining resin 20 d from the upper mold 100.

Thereafter, as shown in FIG. 8, by further lowering the movable platen 1200 in the direction of arrow Y3, the lower mold 200 is further lowered. In this state, as shown in FIGS. 9 and 10, the unloader 300 is moved in the direction of arrow A1 (from the outside of the molding die 1000 toward the direction between the upper die 100 and the lower die 200 ), and the unloader 300 is made Enter between the upper mold 100 and the lower mold 200. As shown in the figure, the unloader 300 includes a suction pad 301 for adsorbing the cured resin 20 and the remaining resin 20d.

Next, as shown in FIG. 11, the suction pad 301 is lowered in the direction of arrow B1, and the cured resin 20 of the resin molded product (packaged substrate) 1b and the remaining resin (useless resin portion) 20d connected to the cured resin 20 are adsorbed .

Further, as shown in FIG. 12, the state in which the suction pad 301 adsorbs the resin molded product 1 b and the remaining resin 20 d rises in the direction of arrow C1. Thereby, as shown in the figure, the resin molded product 1 b and the remaining resin 20 d are released from the mold surface of the lower mold 200. At this time, when the remaining resin 20d and the plunger 213 are not separated, the plunger 213 and the remaining resin 20d rise together. However, as shown in the figure, since the flange portion 215 of the plunger 213 is caught on the lower mold cavity block 210, the plunger 213 cannot rise above a predetermined height. Then, as shown in FIG. 13, if the remaining resin 20d and the suction pad 301 are further raised in the direction of arrow C2, the remaining resin 20d and the plunger 213 are separated.

Then, as shown in FIG. 14, the unloader 300 is moved in the direction of the arrow D1 (toward the outside of the mold 1000) together with the resin molded product 1 b and the remaining resin 20 d, and is withdrawn from the mold 1000. Thereafter, the resin molded product 1b and the remaining resin 20d are separated from the unloader 300, and the remaining resin 20d is separated from the resin molded product 1b (not shown). In this way, the resin molded product 1b can be manufactured.

In the above, FIGS. 1-14 has shown the example of the resin molding apparatus of this invention, and the resin molding method using the same. However, the resin molding apparatus and resin molding method of the present invention are not limited to the examples of FIGS. 1 to 14 and various modifications are possible. For example, like the resin molding apparatus shown in FIGS. 15A to 15C, a hydraulic mechanism 228 may be provided instead of the elastic member 224. The resin molding device of FIGS. 15A to 15C is the same as the resin molding device of FIGS. 1 to 14 except that the mold closing section 220 includes a hydraulic mechanism 228 instead of the elastic member 224. The manufacturing method of the resin molded product using this resin molding apparatus can be performed like FIG. 2-14, for example. 15A is a state diagram in which the substrate 1 and the plate (resin material) 20a are supplied to the lower mold 200, which corresponds to the step of FIG. 2. 15B is a state diagram in which the plate 20a is melted into molten resin (fluid resin) 20b, and the movable platen 1200, the mold closing portion 220, and the lower mold 200 are raised to bring the lower mold 200 and the upper mold 100 into contact. FIG. 15B corresponds to the step of FIG. 3. 15C is a diagram showing a state where molten resin (fluid resin) is injected into the cavity 111, the flow channel 112, and the residual portion 113 using the plunger 213, which corresponds to the step of FIG. 5.

In addition, for example, in the molding die 1000 of the resin molding device of FIGS. 1 to 14, the lower die 200 may have a structure shown in (a) to (c) of FIG. 16, for example. FIG. 16( a) shows the structure of the lower mold 200 together with the mold closing part 220 and the movable platen 1200. The lower mold 200 of FIG. 16( a) is the same as the lower mold 200 of FIGS. 1 to 14 except that the lower mold cavity block 210 includes a through hole (residual resin leak hole) 218. As shown in the figure, the through hole 218 communicates with the tank 212 and passes from the tank 212 to the side opposite to the surface of the lower mold cavity block 210 and the upper mold 100. With this structure, after the resin is molded, the residual resin in the tank 212 can be dropped from the through hole 218 and discharged.

16(b) is a partially enlarged view of the plunger 213 and the through-hole (residual resin leakage hole) 218 of FIG. 16(a). As shown in the figure, a plurality of through holes 218 are arranged so as to surround the plunger 213. By providing the through hole 218 only around the portion of the plunger 213, the upper end portion (flange-shaped portion) of the plunger 213 is caught in the portion where the through hole 218 is not provided, and the plunger 213 cannot be dropped.

16(c) is a schematic diagram showing a modification of the plunger 213. The figure only shows the lower part of the plunger 213 in an enlarged manner. In FIGS. 1 to 14, as shown in the left side of (c) of FIG. 16, an example in which the lower end of the plunger 213 (the portion that contacts the holder A block 221) is flat is shown. However, the plunger 213 can be reduced as much as possible by the convex portion 213a having a rounded lower end as shown in the right side of (c) of FIG. 16 (for example, only at approximately one point on the front end of the convex portion 213a) and The area of the contact portion of the holder A block 221. In this way, for example, the dependence on the flatness (flatness) of the upper surface of the holder A block 221 and the lower surface of the plunger 213 can be reduced, so that the plunger 213 can rise straighter in the direction of gravity.

According to the resin molding apparatus of the present invention, for example, the structure of the resin molding apparatus for transfer molding can be simplified. Specifically, for example, as shown in the embodiment, the plunger is moved up and down by the clamping force of the press (mold closing part) to perform resin injection. In this way, since the mold closing mechanism doubles as a transmission driving mechanism (a mechanism for injecting a resin material into the mold surface of the molding die), resin molding can be performed without providing a transmission driving mechanism other than the mold closing mechanism, so the resin can be simplified The structure of the molding device.

[Example 2]

Next, other embodiments of the present invention will be described.

In this embodiment, an example in which the resin molding apparatus includes a temperature rising section, a resin molding section, a curing section, and a discharge section will be described.

The schematic diagram of FIG. 17 shows the outline of the resin molding apparatus of this embodiment and the manufacturing method of the resin molded article using the same. As shown in the figure, the resin molding apparatus includes a temperature rising section S1, a resin molding section S2, a curing section S3, and a discharge section S4. The molding die 1000 can be installed and removed with respect to each segment of S1 to S4, and can be moved between each segment of S1 to S4. The temperature rising section S1 raises the temperature of the mold 1000. The resin molding section S2 includes a molding die 1000 and a mold closing part, and performs resin molding. The curing section S3 cures the resin in the mold 1000. The discharge section S4 releases the resin molded product 1b from the molding die 1000. The molding die 1000 is not particularly limited, but may be the same as the molding die 1000 of the resin molding device of Example 1 (FIGS. 1 to 16 ), for example. In addition, the mold closing portion is not particularly limited, but it may be the same as the mold closing portion 220 of the resin molding apparatus of Example 1 (FIGS. 1 to 16 ), for example.

When the method for manufacturing a resin molded product is implemented, for example, as shown in FIG. 17, the molding die 1000 may be looped between the stages S1 to S4. Specifically, for example, as shown in the figure, the molding die 1000 is moved in the order of the temperature rising section S1, the resin molding section S2, the curing section S3, and the discharge section S4 to manufacture the resin molded article 1b. Then, after recovering the resin molded product 1b in the discharge section S4, the mold 1000 is returned to the temperature-increasing section S1, and the manufacturing method of the resin molded product is implemented again. The mechanism and method for moving (transporting) the molding die 1000 are not particularly limited. For example, the molding die 1000 can be transported using a known technique such as a robot arm or a turntable.

In the aforementioned first embodiment, one stage of the resin molding apparatus has all the functions of the temperature rising stage, the resin molding stage, the curing stage, and the discharge stage. That is, in Example 1, as shown in FIGS. 2 to 14, the resin molding section having the molding die 1000 and the mold closing portion has the function of a temperature rising section for raising the temperature of the molding die 1000, and the resin in the molding die 1000 The function of the cured curing section and the function of the discharge section that releases the resin molded product 1b from the mold 1000.

In this regard, as in the present embodiment, by providing the resin molding device with a segment different from the resin molding segment and giving a different function to the resin molding segment, for example, the following effects can be obtained. For example, by releasing the resin molded product from the molding die in the discharge stage different from the molding stage, it is not necessary to provide a discharge mechanism (such as a pin, a discharge rod, etc.) in the mold. That is, the structure of the molding die can be simplified. And, for example, by heating the molding die and curing the resin in a curing section different from the molding section, during this period, additional resin molding can be performed in the molding section. In this way, since there is no need to wait until the resin is cured in the molding section, the operation efficiency of the molding section is improved, and therefore it is possible to shorten the molding cycle.

In addition, in the curing section, for example, the molding die can be heated and heated, and the resin in the molding die can be cured at this temperature. In this case, the curing section has the same function as the heating section to raise the temperature of the mold. Therefore, in this case, the temperature-raising section may double as the curing section.

The manufacturing method of the resin molded product using the resin molding apparatus shown in the schematic diagram of FIG. 17 can specifically be performed as shown in FIGS. 18-20, for example.

First, as shown in the step cross-sectional views of (a) to (d) of FIG. 18, the molding die is heated in the temperature rising section. As shown in the figure, the temperature rising section includes a fixed platen 1110 and a movable platen 1210. The fixed platen 1110 includes a heater 1111, and the movable platen 1210 includes a heater 1211. The heater 1111 and the heater 1211 are not particularly limited, but may be, for example, a cartridge heater or the like. The movable platen 1210 is arranged below the fixed platen 1110, and the molding die 1000 can be held between the fixed platen 1110 and the movable platen 1210.

First, as shown in (a) of FIG. 18, a mold 1000 is prepared. The molding die 1000 may be the same as the molding die 1000 of Example 1 (FIGS. 1-14). In addition, in FIGS. 19 and 20 described later, the same molding die 1000 can also be used. On the other hand, the heater 1111 and the heater 1211 are used to raise the temperature of the fixed platen 1110 and the movable platen 1210 in advance. Next, as shown in FIG. 18( b ), the molding die 1000 is transferred to a temperature rising section that has been heated up in advance, and placed and fixed on the movable platen 1210. The method of fixing the molding die 1000 to the movable platen 1210 is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used. Next, as shown in (c) of FIG. 18, the movable platen 1210 is raised, and the mold 1000 is sandwiched (clamped) between the fixed platen 1110 and the movable platen 1210 and the mold 1000 is heated. After the temperature rise of the molding die is completed, as shown in FIG. 18(d), the movable platen 1210 is lowered. After that, the molding die 1000 is taken out from the temperature-increasing section and transported to the molding section.

First, for example, instead of the structures of (a) to (d) of FIG. 18, the temperature-increasing section may have the structure of (e) of FIG. 18. As shown in FIG. 18(e), the temperature-increasing section is the same as the temperature-increasing section shown in FIGS. 18(a) to (d), except that the fixed platen 1110 and the heater 1111 are not provided and the temperature-increasing table 1212 is provided instead of the movable platen 1210. the same. The temperature raising table 1212 and the movable platen 1210 are also provided with heaters 1211. In this case, instead of the steps of (b) to (d) of FIG. 18, as shown in (e) of FIG. 18, the molding die 1000 is placed and fixed on the temperature raising table 1212 that is heated in advance by the heater 1211. Then, after raising the temperature of the molding die 1000, it is taken out from the temperature rising section and transported to the molding section.

Next, as shown in the step cross-sectional views of (a) to (h) of FIG. 19, resin molding is performed in the resin molding section. In (a) to (h) of FIG. 19, the same members as in Example 1 (FIGS. 1 to 14) are indicated by the same symbols. As shown in (a) to (h) of FIG. 19, the resin molding section includes a mold closing portion 220, a fixed platen (first platen) 1100 and a movable platen (second platen) 1200. The mold closing part 220, the fixed platen 1100, and the movable platen 1200 may be the same as those in Embodiment 1 (FIGS. 1-14). Further, for example, the mold closing part 220, the fixed platen 1100, the movable platen 1200, and the like can be provided with a heater (for example, a cartridge heater) in the same manner as the temperature rising stage, and the forming mold 1000 can be heated.

First, as shown in FIG. 19( a ), the mold 1000 is transferred from the temperature rising section to the resin molding section and placed on the mold closing section 220.

Next, as shown in (b) of FIG. 19, the movable platen 1200 is raised and the upper mold 100 is brought into contact with the fixed platen 1100. In this state, while the upper mold 100 is fixed to the fixed platen 1100, the lower mold 200 is fixed to the mold closing portion 220. At this time, the method of fixing the upper mold 100 and the lower mold 200 is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used.

Next, as shown in (c) of FIG. 19, the substrate and the board (resin material) are supplied to the lower mold 200. This step may be the same as FIG. 2, for example.

Next, the plate (resin material) is melted into molten resin (fluid resin). Thereafter, as shown in (d) of FIG. 19, while closing the mold by raising the mold closing portion 220, the plunger of the lower mold 200 is pushed (raised), and the molten metal is supplied to the mold surface of the mold 1000 Resin (fluid resin). This step may be the same as in FIGS. 3 to 5, for example.

Next, as shown in (e) to (h) of FIG. 19, the mold is opened and the mold 1000 is taken out. In these steps, unlike FIGS. 6 to 14 of Example 1, curing of the molten resin (fluid resin), demolding of the resin molded product, and transportation of the resin molded product to the outside of the mold are not performed. This is because the curing of the molten resin (fluid resin) is performed in a curing section described later, and the mold release of the resin molded product and the transportation of the resin molded product to the outside of the mold are performed in the discharge section described later.

First, as shown in (e) of FIG. 19, the movable platen 1200 is lowered together with the mold closing part 220 and the mold 1000. Thus, as shown in the figure, the upper mold 100 is separated from the fixed platen 1100.

Next, as shown in (f) of FIG. 19, the movable platen 1200 is further lowered together with the mold closing part 220 and the mold 1000.

After that, as shown in (g) to (h) of FIG. 19, the molding die 1000 is moved outside the molding section and transported into the curing section (not shown).

Thereafter, the molding die 1000 is heated and heated in a curing section (not shown), and the fluid resin in the molding die 1000 is cured. Thus, a resin molded product is manufactured. In addition, the curing section may have the same structure as the temperature increasing section shown in (a) to (e) of FIG. 18, for example. Further, for example, the temperature-increasing section shown in (a) to (e) of FIG. 18 may also serve as the curing section. The step of curing the flowable resin in the mold 1000 through the curing section is not particularly limited. For example, except that the flowable resin is filled in the mold 1000, the same steps as (a) to (e) of FIG. 18 can be performed. A step of.

After that, as shown in the step cross-sectional views of (a) to (f) of FIG. 20, the resin molded product is released from the mold 1000 in the discharge section. As shown in the figure, the discharge section includes a holder 230, a movable platen 1120, and a movable platen 1220. Both the movable platen 1120 and the movable platen 1220 can move up and down. The movable platen 1120 can fix the upper mold 100 on the lower surface thereof. The movable platen 1220 can mount and fix the holder 230 on its upper surface. The holder 230 includes a holder A block 231, a holder B block 232, a discharge plate mounting block 233, an elastic member 234, a discharge plate 235, and a discharge lever 236. The cage A block 231, the cage B block 232, the discharge plate mounting block 233, and the elastic member 234 respectively have the cage A block 221 and the cage B block of the mold closing portion 220 of the first embodiment (FIGS. 1 to 14). 222. The lower die placing block (forming die mounting member) 223 and the elastic member 224 have the same structure. The discharge plate 235 is fixed to the upper surface of the discharge plate mounting block 233. The discharge plate 235 includes a discharge lever 236, and the upper surface of the discharge plate 235 can contact the entire lower surface of the lower mold 200. The discharge lever 236 is arranged at a position corresponding to the plunger of the lower mold 200 and can move up and down within the discharge plate 235. As described later, by raising the holder A block 231, a part of the discharge rod 236 can be pushed out from the upper surface of the discharge plate 235. Then, in this way, a part of the plunger of the lower mold 200 can be squeezed out of the upper surface of the lower mold 200 using the discharge rod 236, and the remaining resin after curing can be separated from the resin molded product.

The mold release step of the resin molded product shown in (a) to (f) of FIG. 20 can be performed as follows.

First, as shown in (a) of FIG. 20, the molding die 1000 is placed and fixed on the discharge plate 235. The fixing method is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used. At this time, for example, the mold release can be assisted by applying vibration, heat (linear expansion due to temperature increase), or the like to the mold 1000.

Next, as shown in FIG. 20( b ), the movable platen 1220 is raised together with the holder 230 and the molding die 1000 to fix the upper mold 100 to the lower surface of the movable platen 1120. The fixing method is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used.

Next, as shown in FIG. 20( c ), while moving the movable platen 1120 and the upper mold 100 together, the movable platen 1220 is lowered together with the holder 230 and the lower mold 200. Thus, the upper mold 100 and the lower mold 200 can be opened. In this state, as shown in the figure, the unloader 300 is introduced between the upper mold 100 and the lower mold 200. As shown in the figure, the unloader 300 and the unloader 300 of FIGS. 9 to 14 of the first embodiment also include a suction pad 301 for adsorbing the cured resin 20 and the remaining resin 20d. Furthermore, as shown in the figure, the unloader 300 shown in FIG. 20 includes a packaged substrate holding member (resin molded product holding member) 302.

Next, as shown in FIG. 20( d ), while moving the movable platen 1120 and the upper mold 100 together, the movable platen 1220 is raised together with the holder 230 and the lower mold 200. Thus, as shown in the figure, the upper die 100 and the lower die 200 are used to clamp and fix the unloader. Further, as shown in the figure, the resin molded product holding member 302 is lowered in the direction of the arrow I1, and the resin molded product (packaged substrate) 1b is held. As shown in the figure, the resin molded product holding member 302 holds the resin molded product 1b by pressing a portion of the cured resin 20 cured in the flow channel 112 from above. In addition, for example, instead of a portion of the cured resin 20 that is cured in the flow channel 112, a portion of the cured portion held in the cavity 111 that is pressed by the resin molded product holding member 302 from above may be used. Further, the movable platen 1220 can be raised together with the holder 230 and the lower mold 200. At this time, as shown in the figure, a part of the discharge rod 236 is pushed out from the upper surface of the discharge plate 235 by the rise of the holder A block 231. As a result, a part of the plunger of the lower die 200 is squeezed out of the upper surface of the lower die 200 by the discharge rod 236, and the remaining resin after curing is separated from the resin molded product as shown in the figure.

Thereafter, as shown in (e) of FIG. 20, the suction pad 301 of the unloader 300 is used to suck the resin molded product (packaged substrate) and the remaining resin separated from the resin molded product. Thereafter, the unloader 300 is transported out of the discharge section together with the resin molded product and the remaining resin (not shown). These steps can be performed according to FIGS. 11 to 14 of Embodiment 1, for example.

Further, as shown in (f) of FIG. 20, the molding die 1000 is separated from the movable platen 1120. After that, the molding die 1000 is separated from the holder 230 and transported out of the discharge section. For this molding die 1000, for example, it can be transported to the temperature rising section of FIG. 18 again, and the method of manufacturing the resin molded article described in FIGS. 18 to 20 can be performed again.

In addition, in the present invention, the structure of the mold of the resin molding apparatus is not limited to the mold 1000 shown in FIGS. 1 to 20. Figures 21 to 28 show several modifications of the mold.

The cross-sectional view of FIG. 21 schematically shows a modification of the molding die. As shown in the figure, the molding die 1000 includes the remaining resin separation member (remaining resin separation block) 216, the remaining resin separation member elastic member 217, and the lower die base block 210B except the lower die 200, and does not include the ring 214 Other than that, it is the same as the molding die 1000 shown in FIGS. 1-20. In this figure, the lower mold cavity block 210 is fixed to the upper surface of the lower mold base block 210B. The plunger 213 penetrates the lower die base block 210B. The remaining resin separating member 216 is arranged so as to surround the outer periphery and the lower surface of the tank 212, and is elastically supported on the lower mold base 210B by the remaining resin separating member elastic member 217. The remaining resin separating member 216 can be moved up and down by expansion and contraction of the remaining resin separating member elastic member 217. The plunger 213 penetrates the remaining resin separating member 216 and the elastic member 217 for the remaining resin separating member. The remaining resin separating member 216 is arranged directly below the residual material portion (remaining resin accommodating portion) 113, and the remaining resin inside the residual material portion 113 can be pressed by the residual resin separating member 216. As shown in the figure, a protruding portion that protrudes in the horizontal direction is formed on the substrate-side end of the upper part of the remaining resin separating member 216. As a result, when the upper mold 100 and the lower mold 200 are closed, the end portion of the substrate remaining portion (residual resin storage portion) 113 side is sandwiched between the mold surface of the lower mold 200 and the end portion of the remaining resin separation member 216 hold.

The manufacturing method of the resin molded product using the molding die 1000 of FIG. 21 can be performed similarly to FIGS. 1-14, for example. In the case of the molding die 1000 of FIG. 21, the cured resin of the resin molded product and the remaining resin in the residual part 113 can be separated by performing mold opening after the curing of the resin. The outline of a method of manufacturing a resin molded product using the mold 1000 of FIG. 21 can be specifically shown as a cross-sectional view of steps in FIGS. 22 to 24, for example. First, as shown in FIG. 22, the substrate 1 is supplied (mounted) to the substrate mounting portion 211 of the lower mold 200 while the plate (resin material) 20 a is supplied to the tank 212. Next, the mold is heated and closed in the same manner as in FIGS. 2 to 5. Thus, as shown in FIG. 23, the plunger 213 is pushed into the tank 212 in a state where the mold surface of the lower mold 200 and the mold surface of the upper mold 100 are in contact (closed mold). In this way, as shown in FIG. 23, the molten resin 20 b obtained by melting the resin material 20 a is filled into the residual portion 113, the flow channel 112, and the cavity 111. Thereafter, as in FIGS. 6 to 8, after the resin in the cavity 111 and the remaining resin in the residual portion 113 are cured, the mold is released by mold opening. When the mold is released by this mold opening, as shown in FIG. 24, with the resin molded product 1b fixed to the lower mold 200, the remaining resin separating member 216 is opposed by the extension of the remaining resin separating member elastic member 217 The lower die 200 rises. Thereby, since the remaining resin 20d cured in the residual portion 113 is pushed up by the residual resin separating member 216, as shown in the figure, the resin 20 cured in the cavity 111 and the cured resin 20 in the residual portion 113 can be separated The remaining resin is 20d.

The cross-sectional view of FIG. 25 schematically shows another embodiment of the molding die. As shown in the figure, the upper die 100 does not include the residual part 113 for the forming die 1000. In addition, a residue portion 113B communicating with the flow path 112 of the upper mold 100 is formed on the upper portion of the tank 212 of the lower mold 200. Furthermore, the lower surface of the substrate mounting portion 211 of the lower mold 200 and the position of the cavity 111 corresponding to the upper mold are concave, and a lower mold cavity 111B is formed. Except for these and the absence of the ring 214, the molding die 1000 of FIG. 25 is the same as the molding die 1000 shown in FIGS. 1 to 20.

The manufacturing method of the resin molded product using the molding die 1000 of FIG. 25 can be performed similarly to FIGS. 1-14, for example. The molding die 1000 of FIG. 25 can, for example, use a perforated substrate to inject the fluid resin injected into the cavity 111 of the upper mold into the lower mold cavity 111B from the hole of the substrate.

The cross-sectional view of FIG. 26 schematically shows still another modification of the molding die. As shown in the figure, the mold 1000 is provided with an intermediate mold 400 between the upper mold 100 and the lower mold 200. The intermediate mold 400 is provided with an intermediate mold resin material accommodating portion 413 at a position right above the tank (resin material accommodating portion) 212. The intermediate mold resin material accommodating portion 413 can accommodate the resin material (plate) 20a while communicating with the residual material portion 113 when the mold is closed, and can inject molten (fluidized) resin material (fluid resin) into the residual material portion 113 . That is, the intermediate mold resin material accommodating portion 413 also serves as an intermediate mold resin passage. In addition, the lower mold 200 of FIG. 26 does not include the substrate mounting portion 211. Instead, in FIG. 26, the intermediate mold 400 includes a substrate mounting portion 411 on the surface opposite to the upper mold 100. The lower surface of the substrate mounting portion 411 of the intermediate mold 400 and the position corresponding to the cavity 111 of the upper mold are concave, and an intermediate mold cavity 412 is formed. The molding die 1000 of FIG. 26 is the same as the molding die 1000 of FIGS. 1 to 20 except that the sum ring 214 is not provided.

In addition, FIG. 27 is a plan view of the upper mold cavity block 110 and the intermediate mold 400 of FIG. 26 viewed from the mold surface side. As described above, the position of the intermediate mold resin material accommodating portion (intermediate mold resin passage) 413 corresponds to the residual portion 113 of the upper mold cavity block 110, and the position of the intermediate mold cavity 412 and the cavity 111 of the upper mold cavity block 110 respectively.

The manufacturing method of the resin molding apparatus using the molding die 1000 of FIG. 26 can be performed similarly to FIGS. 1-14, for example. The outline is shown in the step cross-sectional views of (a) to (b) of FIG. 28. FIG. 28(a) shows the state in which the plate 20a is housed in the tank 212. From this state, after the substrate is further mounted on the substrate mounting portion 411 of the intermediate mold, the plate 20a is melted (fluidized) as in FIGS. 3 to 5 and then the mold is closed, and then injected into the residual portion 113 and the flow path. 112 and cavity 111. Furthermore, in the case of the mold 1000 shown in FIG. 26, for example, by using a perforated substrate, the fluid resin injected into the cavity 111 of the upper mold can be injected into the intermediate mold cavity 412 from the hole of the substrate. After that, if the fluid resin is cured, as shown in FIG. 28( b ), the fluid resin will become the cured resin 20 and the remaining resin (useless resin portion) 20 d. Other steps can be performed in the same manner as in FIGS. 1 to 14 as described above.

In addition, the mold 1000 of FIGS. 21 to 28 can be further deformed arbitrarily. For example, although the ring 214 is omitted in FIGS. 21 to 28, the ring 214 may be provided in the same manner as in FIGS. 1 to 20. In addition, as shown in FIGS. 16(a) to (c), for example, the lower mold may have a through hole (residual resin leak hole) 218, and the lower end of the plunger 213 (the portion that contacts the holder A block 221) may have shape. Further, in the present invention, the molding die is not limited to the structure of the molding die 1000 of FIGS. 1 to 28, and any molding die can be used. For example, although the forming mold 1000 of FIGS. 1 to 28 shows an example in which the substrate 1 is provided (mounted) on the substrate mounting portion 211 of the lower mold 200, the present invention is not limited thereto, and may be provided on the upper mold Substrate. Moreover, for example, in the molding die 1000 of FIGS. 1 to 24, only the upper die has the cavity 111, and in the molding die of FIGS. 25 to 28, both the upper die and the lower die have cavity, but the present invention is not limited to this. Only the lower mold may have a cavity.

Next, another example of the step of demolding the resin molded product from the molding die 1000 in the discharge section will be performed using FIGS. 29 to 43 Instructions. In FIGS. 29 to 43, the same symbols as those in (a) to (f) of FIG. 20 are indicated by the same symbols. In addition, the discharge stage shown in FIGS. 29 to 43 includes a fixed platen 1100 instead of the movable platen 1120.

First, as shown in FIG. 29, the mold 1000 holding the resin molded product 1b and the remaining resin 20d after the resin molding is transferred to the discharge stage. Specifically, first, as shown in the figure, the molding die 1000 is transported (moved) in the direction of the arrow E1 (direction from the outside of the discharge section toward the inside), and is located between the fixed platen 1100 and the holder 230. Thereafter, the molding die 1000 is moved in the direction of arrow E2 (downward), and is placed and fixed on the discharge plate 235. The fixing method is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used. At this time, for example, the mold release can be assisted by applying vibration, heat (linear expansion due to temperature increase), or the like to the mold 1000.

Next, as shown in FIG. 30, the movable platen 1220 is raised together with the holder 230 and the forming mold 1000 in the direction of arrow F1, and the upper mold 100 is fixed to the lower surface of the fixed platen 1100. The fixing method is not particularly limited, and for example, an electrostatic chuck, a mechanical chuck, or the like can be used.

Next, as shown in FIG. 31, the movable platen 1220 is lowered together with the holder 230 and the lower mold 200 in the direction of arrow G1. Thus, the upper mold 100 and the lower mold 200 are opened. As a result, as shown in the figure, the resin molded product 1 b (cured resin 20) and the remaining resin (useless resin portion) 20 d are held on the upper surface of the lower mold 200 as they are, and are released from the mold surface of the upper mold 100.

Next, in a state where the upper mold 100 and the lower mold 200 are opened as shown in FIG. 31, as shown in FIG. 32, the unloader 300 is directed in the direction of arrow H1 (from the outside of the forming mold 1000 toward the inside) Direction) to carry (move). Thus, as shown in FIG. 33, the unloader 300 is introduced between the upper mold 100 and the lower mold 200. This unloader 300 is the same as the unloader 300 of FIGS. 9 to 14 of Embodiment 1, and includes a suction pad 301 for adsorbing the cured resin 20 and the remaining resin 20d. Furthermore, the unloader 300 shown in FIGS. 32 and 33 includes a packaged substrate holding member (resin molded article holding member) 302 as shown in the figure.

Next, as shown in FIG. 34, the movable platen 1220 is raised in the direction of arrow F2 together with the holder 230 and the lower mold 200. Thus, as shown in the figure, the unloader is clamped and fixed (clamped) using the upper mold 100 and the lower mold 200.

Next, as shown in FIG. 35, the resin molded product holding member 302 is lowered in the direction of the arrow I1, and the resin molded product (packaged substrate) 1b is held. As shown in the figure, the resin molded product holding member 302 holds the resin molded product 1b by pressing a portion of the cured resin 20 that is cured in the flow channel 112 from above. In addition, for example, a portion of the cured resin 20 that is cured in the flow channel 112 may be replaced with a resin molded product holding member 302 that presses the cured portion of the cavity 111 from above.

Next, as shown in FIG. 36, the movable platen 1220 and the holder block (holder A block 231 and holder B block 232) are raised in the direction of arrow F3. At this time, as shown in the figure, a part of the discharge rod 236 is pushed out from the upper surface of the discharge plate 235 by the rise of the holder A block 231. As a result, a part of the plunger 213 of the lower die 200 is squeezed out of the upper surface of the lower die 200 by the discharge rod 236, and as shown in the figure, the remaining cured resin 20d is separated from the resin molded product 1b.

Next, as shown in FIG. 37, the movable platen 1220 is lowered together with the holder 230 and the lower mold 200 in the direction of arrow G2. As a result, the gripping of the unloader 300 is released.

Next, as shown in FIG. 38, the suction pad 301 of the unloader 300 is lowered in the direction of arrow J1. As a result, as shown in the drawing, the suction pad 301 is brought into contact with the portion cured in the cavity 111 of the cured resin 20 and the remaining resin 20d separated from the resin molded product 1b and sucked.

Next, as shown in FIG. 39, the suction pad 301 is raised in the direction of arrow K1. Then, as shown in FIG. 40, the suction pad 301 is further raised in the direction of arrow K2. As a result, as shown in the figure, the resin molded product 1 b and the remaining resin 20 d adsorbed on the suction pad 301 are separated from the lower mold 200.

Thereafter, as shown in FIG. 41, the unloader 300, the resin molded product 1b, and the remaining resin 20d are moved (transported) in the direction of the arrow L1 (direction from the discharge section toward the outside), and are withdrawn outside the discharge section .

After that, as shown in FIG. 42, the movable platen 1220 is raised together with the holder 230 and the lower mold 200 in the direction of arrow F4, and the mold 1000 is closed. Then, in this state, the fixing of the fixing platen 1100 and the molding die 1000 is released.

Furthermore, as shown in FIG. 43, the movable platen 1220, the holder 230, and the mold 1000 are lowered together in the direction of arrow G3, and the mold 1000 is separated from the fixed platen 1100. After that, the mold 1000 is separated from the holder 230, and moved (transported) in the direction of the arrow M1 (direction from the discharge section toward the outside), and is withdrawn outside the discharge section. For example, this molding die 1000 can be transported into the temperature rising section again, and the method of manufacturing the resin molded article can be performed again.

In addition, in the present embodiment, an example of the resin molding apparatus provided with each of the temperature rising section, the resin molding section, the curing section, and the discharge section has been mainly described. However, the present invention is not limited to this. For example, the resin molding apparatus of the present invention may include a plurality of at least one functional stage among a temperature rising stage, a resin molding stage, a curing stage, and a discharge stage. In this way, for example, the manufacturing efficiency of the resin molded product can be improved. In addition, for example, a specific one segment may have two or more functions in each segment. For example, in Example 1, as described above, one stage of the resin molding apparatus has all four functions of the temperature rising stage, the resin molding stage, the curing stage, and the discharge stage. In addition, the resin molding apparatus of the present invention is not limited to this. For example, a specific one stage may have two or three functions among the four stages, and a stage different from the specific one stage may have other functions. For example, as described above, the same stage can have the functions of both the temperature raising stage and the curing stage.

Further, the present invention is not limited by the above-mentioned embodiments, and can be arbitrarily and appropriately combined, changed, or selected for use as needed without departing from the gist of the present invention.

This application claims priority based on Japanese application Japanese Patent Application No. 2017-155867 filed on August 10, 2017, and all of its disclosure is incorporated in this specification.

100‧‧‧ Upper mold (one mold)

110‧‧‧Up model cavity block

111‧‧‧ Cavity

112‧‧‧flow channel (resin flow channel)

113‧‧‧Remnant Department (Residual Resin Storage Department)

114‧‧‧Adjustment member (board height adjustment member)

115‧‧‧Elastic member for adjusting member

120‧‧‧ Upper mold base block

200‧‧‧ Lower mold (another mold)

210‧‧‧Lower model cavity block

211‧‧‧Board mounting section

212‧‧‧Can (resin material storage)

213‧‧‧ Plunger

214‧‧‧ring (ring member)

215‧‧‧Flange

220‧‧‧Closed Mold Department

221‧‧‧Cage A block (Cage block)

222‧‧‧B block (retainer block)

223‧‧‧Lower die mounting block (forming die mounting member)

224‧‧‧Elastic member

1000‧‧‧Forming die

1100‧‧‧Fixed pressure plate (1st pressure plate)

1200‧‧‧ movable platen (second platen)

Claims (11)

A resin molding apparatus includes a molding die and a mold closing part, wherein the molding die includes one mold and another mold, the one mold and the other mold are opposed to each other, and the other mold is on a surface opposite to the one mold On the opposite side, mounted on the mold closing portion, the other mold includes a resin material accommodating portion and a plunger, and the plunger can move in the opening and closing direction of the mold relative to the resin material accommodating portion, and the mold closing portion Including the plunger pushing member, the elastic member, and the molding die mounting member, with respect to the other mold, the molding die mounting member is installed on the side opposite to the one mold facing surface, and the elastic member is disposed in the molding The mold mounting member is on the opposite side of the opposing surface of the other mold, and elastically supports the molding die mounting member, and the plunger pushing member can be formed in the molding relative to the molding die by expansion and contraction of the elastic member The mold is moved in the opening and closing direction, and by moving the mold closing portion in the mold closing direction of the molding die, the plunger pushing member can be used to move the plunger toward the one while the mold is closed. The direction of the mold is pushed in, and the resin material accommodated in the resin material accommodating portion is extruded to the mold surface of the molding die using the plunger. The resin molding device according to claim 1, wherein the plunger pushing member is a holder block, and the holder block can hold the molding die mounting member. A resin molding apparatus includes a molding die and a mold closing part, wherein the molding die includes one mold and another mold, the one mold and the other mold are opposed to each other, and the other mold is on a surface opposite to the one mold On the opposite side, mounted on the mold closing part, the other mold is provided with a resin material accommodating part and a plunger, the plunger is movable relative to the resin material accommodating part in the opening and closing direction of the molding die, and the one mold is provided with The cavity, the adjustment member, the elastic member for the adjustment member elastically supporting the adjustment member, and the remaining resin accommodating portion, the adjustment member can be moved in the opening and closing direction of the mold by expansion and contraction of the elastic member for the adjustment member The movement of the adjustment member can adjust the resin pressure in the cavity, the remaining resin accommodating portion communicates with the cavity, and accommodates at least a portion of the remaining resin that is not contained in the cavity when the mold is closed, the adjustment member At least a part of it is arranged in the remaining resin accommodating part, the capacity of the remaining resin accommodating part can be adjusted by the movement of the adjustment member, and the resin pressure in the cavity can be adjusted, By moving the mold closing part in the mold closing direction of the molding die, the plunger can be pushed in the direction of the one mold while the mold is closed, and the plunger can be used to accommodate the The resin material of the resin material accommodating portion is extruded to the mold surface of the mold. A resin molding apparatus includes a molding die and a mold closing part, wherein the molding die includes one mold and another mold, the one mold and the other mold are opposed to each other, and the other mold is on a surface opposite to the one mold On the opposite side, mounted on the mold closing portion, the other mold includes a resin material accommodating portion and a plunger, and the plunger can be moved in the opening and closing direction of the molding die relative to the resin material accommodating portion. The mold closing portion moves in the mold closing direction of the molding die, and can close the mold, push the plunger in the direction of the one mold, and use the plunger to accommodate the resin material The resin material of the part is extruded onto the surface of the mold of the molding die, the molding die is provided with a cavity, a surplus resin accommodating portion, and a surplus resin separation member. At least a part of the remaining resin in the cavity, after the resin in the cavity and the remaining resin are cured, borrow The resin remaining in the cavity and the resin remaining in the portion remaining in the resin-retaining portion are separated by the relative resin separating member rising or falling relative to one or both of the one mold and the other mold. The resin molding device according to claim 4, wherein the resin molding device is a device that molds the substrate, and when the one mold and the other mold are closed, the end of the substrate on the side of the remaining resin containing portion The portion is sandwiched between the mold surface of the aforementioned another mold and the end of the aforementioned remaining resin separating member. A resin molding apparatus includes a molding die and a mold closing part, wherein the molding die includes one mold and another mold, the one mold and the other mold are opposed to each other, and the other mold is on a surface opposite to the one mold On the opposite side, mounted on the mold closing portion, the other mold includes a resin material accommodating portion and a plunger, and the plunger can be moved in the opening and closing direction of the molding die relative to the resin material accommodating portion. The mold closing portion moves in the mold closing direction of the molding die, and can close the mold, push the plunger in the direction of the one mold, and use the plunger to accommodate the resin material Part of the resin material is extruded onto the surface of the mold of the molding die, and the other mold has a through hole, The through hole penetrates from the resin material accommodating portion to the side opposite to the surface opposite to the one mold, and after resin molding, residual resin in the resin material accommodating portion can be discharged from the through hole. The resin molding apparatus according to any one of claims 1 to 6, further comprising a first pressure plate and a second pressure plate, the one mold is mounted on the first pressure plate, and the mold closing portion is mounted on the second pressure plate . The resin molding apparatus according to any one of claims 1 to 6, wherein the molding mold further includes an intermediate mold, the intermediate mold is disposed between the one mold and the other mold, and the intermediate mold includes the intermediate mold resin Material accommodating part and intermediate mold resin channel. The resin molding apparatus according to any one of claims 1 to 6, wherein the resin molding apparatus includes a temperature-increasing section, a resin molding section, a curing section, and a discharge section, and the molding die can be attached to and detached from each of the sections. And can move between the various stages, the temperature rising stage raises the temperature of the molding die, the resin molding stage includes the mold closing part, and performs resin molding, The curing section cures the resin in the mold, and the discharge section releases the resin molded product from the mold. A method for manufacturing a resin molded product, which uses the resin molding device described in any one of claims 1 to 6, and includes the following steps: a resin material accommodating step, accommodating the resin material in the resin material accommodating portion of the molding die; And the mold closing step, the molding die is closed, wherein, in the mold closing step, by moving the mold closing part in the mold closing direction of the molding die, while closing the molding die, the The plunger is pushed in the direction of the one mold, and the plunger is used to extrude the resin material accommodated in the resin material accommodating portion to the mold surface of the molding die. The method for manufacturing a resin molded product as recited in claim 10, wherein the resin molding device is the resin molding device as recited in claim 9, and the method for manufacturing the resin molded product further comprises: a mold raising temperature step In the step, the molding die is heated; in the resin curing step, the resin in the molding die is cured in the curing section; and in the demolding step, the resin molded product is demolded from the molding die in the discharge section, and the resin material The accommodating step and the aforementioned mold closing step are performed in the aforementioned resin molding section.

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