TWI688820B - Impurity removal assembly of light-transmitting thin film on mask glass substrate - Google Patents
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- 239000012535 impurity Substances 0.000 title claims abstract description 109
- 239000000758 substrate Substances 0.000 title claims abstract description 37
- 239000011521 glass Substances 0.000 title claims abstract description 36
- 239000010409 thin film Substances 0.000 title claims abstract description 5
- 239000010408 film Substances 0.000 claims abstract description 115
- 239000002245 particle Substances 0.000 claims abstract description 86
- 230000007246 mechanism Effects 0.000 claims abstract description 78
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 10
- 239000000523 sample Substances 0.000 claims description 81
- 238000001514 detection method Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000010191 image analysis Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- Preparing Plates And Mask In Photomechanical Process (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
一種光罩玻璃基板上之透光薄膜雜質去除組件,係用於光罩的雜質移除,該光罩包含一玻璃基板、位於該玻璃基板上方的一鋁框架及位於該鋁框架上方的一透光薄膜(pellicle)用於承接上方的雜質粒子;該透光薄膜雜質去除組件包含一主控機構;一透光薄膜高度偵測器電連接該主控機構,用於偵測整體透光薄膜的高度分布;一第一攝影機電連接該主控機構,用於尋找該透光薄膜上的雜質粒子的幾何位置,其應用影像的方式決定該雜質粒子相對於該透光薄膜的分布;一第二攝影機電連接該主控機構,用於決定該透光薄膜上的雜質粒子的高度,其應用影像聚焦的方式決定該雜質粒子相對於該透光薄膜的高度;其中該透光薄膜高度偵測器、該第一攝影機、該第二攝影機將所偵測的訊號傳回到該主控機構,由該主控機構紀錄數值並構成該雜質粒子在該透光薄膜上的三維影像。 A light-transmitting thin film impurity removal assembly on a reticle glass substrate is used to remove impurities from the reticle. The reticle includes a glass substrate, an aluminum frame located above the glass substrate, and a transparent window located above the aluminum frame A light film (pellicle) is used to receive the impurity particles above; the light-transmitting film impurity removal component includes a main control mechanism; a light-transmitting film height detector is electrically connected to the main control mechanism for detecting the overall light-transmitting film Highly distributed; a first photographic electromechanical device connected to the main control mechanism is used to find the geometric position of the impurity particles on the light-transmitting film, and its image is used to determine the distribution of the impurity particles relative to the light-transmitting film; a second The electromechanical camera is connected to the main control mechanism and used to determine the height of the impurity particles on the light-transmitting film. It uses the image focusing method to determine the height of the impurity particles relative to the light-transmitting film; wherein the light-transmitting film height detector The first camera and the second camera transmit the detected signal back to the main control mechanism, and the main control mechanism records the value and forms a three-dimensional image of the impurity particles on the light-transmitting film.
Description
本發明係有關於光罩之雜質移除機構,尤其是一種光罩玻璃基板上之透光薄膜雜質去除組件。 The invention relates to an impurity removal mechanism of a photomask, in particular to a light-transmitting film impurity removal component on a glass substrate of a photomask.
一般光罩包含一玻璃基板,在玻璃基板的上方形成一鋁框架,然後在該鋁框架的上方安裝一透光薄膜(pellicle),其為金屬材質形成的高透明薄膜可令光線通過。該透光薄膜的主要目的在於承接上方的雜質粒子,使得該雜質粒子不會掉到該玻璃基板的上方。因此當照射光線聚焦在玻璃基板上方時不會受到該雜質粒子的影響而影響成像的品質。此為習知技術所採用的方式。 Generally, a photomask includes a glass substrate, an aluminum frame is formed above the glass substrate, and then a transparent film (pellicle) is installed above the aluminum frame, which is a highly transparent film formed of a metal material to allow light to pass through. The main purpose of the light-transmitting film is to receive the impurity particles above, so that the impurity particles will not fall above the glass substrate. Therefore, when the irradiation light is focused on the glass substrate, it will not be affected by the impurity particles and affect the quality of imaging. This is the method adopted by the conventional technology.
惟此一方式仍然使得雜質粒子有可能落在該透光薄膜的上方,所以也會影響經過的光束的聚焦能力。尤其是現在半導體的製程的元件尺寸越來越小,所以焦距的解析度也必須越來越高,所以原來在透光薄膜上的雜質粒子在超高的解析度下也有可能影響到照射光束的聚焦能力,因此有必要提出更進一步的方式改進此種缺陷,以增加照射光束的聚焦能力。 However, this method still makes it possible for impurity particles to fall on the transparent film, so it will also affect the focusing ability of the passing beam. In particular, the element size of semiconductor manufacturing processes is getting smaller and smaller, so the resolution of the focal length must also be higher and higher, so the original impurity particles on the light-transmitting film may also affect the irradiation beam at ultra-high resolution Focusing ability, it is necessary to propose a further way to improve this defect, in order to increase the focusing ability of the irradiation beam.
目前所能想到的方式即是將該雜質粒子從該透光薄膜上移除,惟此一技術相當困難,在習知的技術領域中並無法達到有效的移除以提高整體的解析能力。 The currently conceivable way is to remove the impurity particles from the light-transmitting film. However, this technique is quite difficult, and it cannot be effectively removed in the conventional technical field to improve the overall analytical ability.
故本案希望提出一種嶄新的光罩玻璃基板上之透光薄膜雜質去除組件,以解決上述先前技術上的缺陷。 Therefore, the present case hopes to propose a brand-new light-transmitting film impurity removal device on a mask glass substrate to solve the above-mentioned defects in the prior art.
所以本發明的目的係為解決上述習知技術上的問題,本發明中提出一種光罩玻璃基板上之透光薄膜雜質去除組件,係應用雷射偵測器,其可以選擇適當的雷射光束而不會穿透該透光薄膜,因此可以偵測出整個透光薄膜的高度,此為習知技術中所無法克服者。再者應用兩個數位成像攝影機分別求出透光薄膜上雜質粒子的座標點跟高度,再應用探針移除該雜質粒子,整體上為現有技術可以達成者。而且有效的增加了光罩上照射光線的聚焦能力,對於現今半導體的製程要求元件的尺寸越來越小的趨勢,本案有效的提升了整個影像品質,而增加了精確度,因此整體上可以提升半導體製造能力 Therefore, the purpose of the present invention is to solve the above-mentioned conventional technical problems. In the present invention, a light-transmitting film impurity removal device on a mask glass substrate is proposed, which uses a laser detector, which can select an appropriate laser beam It does not penetrate the light-transmitting film, so the height of the entire light-transmitting film can be detected, which is insurmountable in the conventional technology. Furthermore, two digital imaging cameras are used to obtain the coordinate points and heights of the impurity particles on the light-transmitting film, and then the probe is used to remove the impurity particles, which can be achieved in the prior art as a whole. Moreover, it effectively increases the focusing ability of the light irradiated on the reticle. For the current semiconductor manufacturing process, the size of the component is getting smaller and smaller. This case effectively improves the entire image quality and increases the accuracy, so it can be improved overall. Semiconductor manufacturing capabilities
為了達成上述之目的本發明中提出一種光罩玻璃基板上之透光薄膜雜質去除組件,係應用於光罩的雜質移除,其中該光罩包含一玻璃基板,在該玻璃基板的上方形成一鋁框架,其中在該鋁框架的上方安裝一透光薄膜(pellicle),其為金屬材質形成的高透明薄膜可令光線通過;該透光薄膜用於承接上方的雜質粒子,使得該雜質粒子不會掉到該玻璃基板的上方;其中該透光薄膜雜質去除組件包含一主控機構,用於控制所有機構的操作;一透光薄膜高度偵測器,電連接該主控機構,係用於偵測整體透光薄膜的高度分布;一第一攝影機,電連接該主控機構,係用於尋找出該透光薄膜上的雜質粒子的幾何位置,其應用影像的方式決定該雜質粒子相對於該透光薄膜的分布;一第二攝影機,電連接該主控機構,係用於決定該透光薄膜上的雜質粒子的高度,其應用影像聚焦的方式決定該雜質粒子相對於該透光薄膜的高度;其中該透光薄膜高度偵測器、該第一攝影機、該第二攝影機將所偵測的訊號傳回到該主控機構,由該主控機構紀錄數值並構成該雜質粒子在該透光薄膜上的三維影像。 In order to achieve the above object, the present invention proposes a light-transmitting thin film impurity removal device on a mask glass substrate, which is applied to the impurity removal of a mask, wherein the mask includes a glass substrate, and a glass substrate is formed above the glass substrate An aluminum frame, in which a light-transmissive film (pellicle) is installed above the aluminum frame, which is a highly transparent film formed of a metal material to allow light to pass through; the light-transmitting film is used to receive the impurity particles above, so that the impurity particles are not Will fall above the glass substrate; where the light-transmitting film impurity removal component includes a main control mechanism for controlling the operation of all mechanisms; a light-transmitting film height detector, electrically connected to the main control mechanism, is used for Detecting the height distribution of the overall light-transmitting film; a first camera, electrically connected to the main control mechanism, is used to find the geometric position of the impurity particles on the light-transmitting film, and the way of applying the image determines the relative particle size The distribution of the light-transmitting film; a second camera, electrically connected to the main control mechanism, is used to determine the height of the impurity particles on the light-transmitting film, which uses image focusing to determine the impurity particles relative to the light-transmitting film Height; wherein the light-transmitting film height detector, the first camera, and the second camera transmit the detected signal back to the main control mechanism, and the main control mechanism records the value and constitutes the impurity particles in the Three-dimensional image on the transparent film.
由下文的說明可更進一步瞭解本發明的特徵及其優點,閱讀時並請參考附圖。 The features and advantages of the present invention can be further understood from the following description. Please refer to the drawings when reading.
1:光罩 1: Mask
2:主控機構 2: main control agency
10:玻璃基板 10: Glass substrate
20:鋁框架 20: Aluminum frame
30:透光薄膜 30: Transparent film
40:雜質粒子 40: Impurity particles
50:透光薄膜高度偵測器 50: Translucent film height detector
51:雷射偵測器 51: Laser detector
60:第一攝影機 60: The first camera
70:第二攝影機 70: Second camera
80:探針 80: Probe
81:黏著劑 81: Adhesive
85:探針夾持機構 85: Probe clamping mechanism
90:探針偏移偵測機構 90: Probe shift detection mechanism
91:水平校正攝影機 91: Level correction camera
92:垂直校正攝影機 92: Vertical correction camera
圖1顯示本案之光罩示意圖。 Figure 1 shows the schematic of the photomask in this case.
圖2顯示本案之光罩之元件分解示意圖。 Figure 2 shows an exploded view of the components of the photomask in this case.
圖3顯示本案之透光薄膜高度偵測器之操作示意圖。 Figure 3 shows the operation diagram of the light-transmitting film height detector in this case.
圖4顯示本案之透光薄膜高度差及雜質粒子尺寸之示意圖。 FIG. 4 shows a schematic diagram of the height difference of the light-transmitting film and the size of impurity particles in this case.
圖5顯示本案之第一攝影機之操作示意圖。 Figure 5 shows a schematic diagram of the operation of the first camera in this case.
圖6顯示本案之第二攝影機之操作示意圖。 Figure 6 shows a schematic diagram of the operation of the second camera in this case.
圖7顯示本案之探針去除雜質粒子之操作示意圖。 7 shows a schematic diagram of the operation of the probe for removing impurity particles in this case.
圖8顯示本案之水平校正攝影機之操作示意圖。 Figure 8 shows the operation diagram of the level correction camera in this case.
圖9顯示本案之垂直校正攝影機之操作示意圖。 Figure 9 shows the operation diagram of the vertical correction camera in this case.
圖10顯示本案之主要元件架構方塊圖。 Figure 10 shows a block diagram of the main components of this case.
茲謹就本案的結構組成,及所能產生的功效與優點,配合圖式,舉本案之一較佳實施例詳細說明如下。 With regard to the structure and composition of the case, as well as the effects and advantages it can produce, in conjunction with the drawings, a preferred embodiment of the case is described in detail below.
請參考圖1至圖10所示,顯示本發明之光罩玻璃基板上之透光薄膜雜質去除組件,係應用於光罩1的雜質移除,如圖1及圖2所示,其中該光罩1包含一玻璃基板10,在該玻璃基板10的上方形成一鋁框架20,然後在該鋁框架20的上方安裝一透光薄膜(pellicle)30,其為金屬材質形成的高透明薄膜可令光線通
過。該透光薄膜30用於承接上方的雜質粒子40,使得該雜質粒子40不會掉到該玻璃基板10的上方。本案之透光薄膜雜質去除組件包含下列元件:一主控機構2,用於控制本案所有機構的操作;一透光薄膜高度偵測器50電連接該主控機構2,係用於偵測整體透光薄膜30的高度分布。在本案中該透光薄膜高度偵測器50係選用一雷射偵測器51,該雷射偵測器51係用以沿著一定的座標掃描該透光薄膜30,如圖3所示,該雷射偵測器51所發射的雷射可以聚焦在該透光薄膜30上,並經由反射而測出整體的路徑長度,以及得到對應偵測點之該透光薄膜30的高度。應用該雷射偵測器51沿著該透光薄膜30在既定的路線上來回掃描,即可建立該透光薄膜30的整體平面的高度分布。
Please refer to FIG. 1 to FIG. 10, which shows that the light-transmitting film impurity removal device on the mask glass substrate of the present invention is applied to the impurity removal of the
該透光薄膜30為極高透明的材料,所以一般的光束均會通過該透光薄膜30,所以應用一般的光束並無法求出該透光薄膜30的高度分布。本案應用雷射偵測器,並選擇適當的雷射,可以找出適合該透光薄膜30反射的光束,所以可以偵測該透光薄膜30的整體平面的高度分布。
The light-transmitting
一般透光薄膜整體的分布並不是平面,而會有高度的落差,如圖4所示,例如透光薄膜的高度差是5μm,而在透光薄膜上的雜質粒子可能也是5μm,所以透光薄膜的高度差會很大的影響整個雜質粒子在透光薄膜上所形成的幾何高度,所以有必要清楚的定出透光薄膜的高度分布。 Generally, the overall distribution of the light-transmitting film is not flat, but there will be a height drop. As shown in Figure 4, for example, the height difference of the light-transmitting film is 5 μm, and the impurity particles on the light-transmitting film may also be 5 μm, so the light is transparent The height difference of the film will greatly affect the geometric height of the entire impurity particles formed on the light-transmitting film, so it is necessary to clearly determine the height distribution of the light-transmitting film.
本案係應用成像攝影及聚焦的方式得出在該透光薄膜30上沉積之雜質粒子40的位置點及高度。所以本案中應用兩個數位成像攝影機取得上述數據。
In this case, the position and height of the
一第一攝影機60電連接該主控機構2,係用於尋找出該透光薄膜30上的雜質粒子40的幾何位置,其應用影像的方式決定該雜質粒子40相對於該透光薄膜30的分布。其中該第一攝影機60可以是CCD或CMOS攝影機。如圖5所示,其中該第一攝影機60用以沿著該透光薄膜30在既定的路線上來回掃描,而建立該透光薄膜30的整體平面的影像。並經由影像分析找出該雜質粒子40在該透光薄膜30上的位置。其主要是因為該透光薄膜30的影像為均質而且高度的透光,所以是相當淺的顏色,因此在該透光薄膜30上的該雜質粒子40可以很輕易的利用影像分析的方式決定該雜質粒子40的座標點。
A
一第二攝影機70電連接該主控機構2,係用於決定該透光薄膜30上的雜質粒子40的高度,其應用影像聚焦的方式決定該雜質粒子40相對於該透光薄膜30的高度。其中該第二攝影機70可以是CCD或CMOS攝影機。該第二攝影機70根據由該第一攝影機60所得到之該雜質粒子40的座標點,而決定每一個雜質粒子40的高度。其方式為將該第二攝影機70依據該雜質粒子40的座標點而移動到一對應的雜質粒子40處(如圖6所示),然後調整該第二攝影機70的高度以擷取反射光線的聚焦,並從該雜質粒子40表面反射光的情況可決定該雜質粒子40的高度,當反射光的散射範圍最小時,此時所量測的高度即為該雜質粒子40的高度。
A
如圖10所示,其中該透光薄膜高度偵測器50、該第一攝影機60、該第二攝影機70將所偵測的訊號傳回到該主控機構2,由該主控機構2紀錄數值並構成該雜質粒子40在該透光薄膜30上的三維影像。
As shown in FIG. 10, the light-transmitting
一探針80連接該主控機構2,該探針80的下方附有黏著劑81,可經由該主控機構2的導引而移到該雜質粒子40的上方然後向下移動,應用其黏著劑81將該雜質粒子40移除。
A
如圖7所示,其中移除該雜質粒子40的方式為經由該主控機構2的導引而將該探針80移到由該第一攝影機60所測得的雜質粒子40的座標處,然後將在該座標處由該雷射偵測器51所測得之該透光薄膜30的高度加上該雜質粒子40的高度即可以得到整體的高度,然後依據所得到之整體高度下移該探針80至該高度所決定的距離即可使得該探針80下方的黏著劑81碰觸到該雜質粒子40的上方,並經由該黏著劑81將該雜質粒子40移除。應用此一程序逐一移動該探針80而將該透光薄膜30上所有的雜質粒子40全數移除。所以可以使得光罩1上方所入射的光線有效的照射到在該透光薄膜30下方的玻璃基板10,而不會影響到照射時的品質。
As shown in FIG. 7, the method of removing the
其中該探針80係經由一探針夾持機構85所夾持,該探針夾持機構85經由該主控機構2的導引而將該探針80移到該雜質粒子40的上方然後向下移動,應用其黏著劑81將該雜質粒子40移除。
The
其中當該探針夾持機構85夾持該探針80時,可能會使得該探針80產生歪斜,而令該探針80的位置產生偏移,因此有必要對該探針80的位置進行校正。
When the
本案尚包含一探針偏移偵測機構90電連接該主控機構2,係用於偵測該探針80在該探針夾持機構85上的夾持位置之偏移量,並依據該偏移量對該探針80的位置進行校正。
The case also includes a probe offset detection mechanism 90 electrically connected to the main control mechanism 2, which is used to detect the offset of the holding position of the
該探針偏移偵測機構90包含一水平校正攝影機91,係用於對該探針80做水平偏移之偵測及校正,其方式為該主控機構2控制該探針夾持機構85移動到該水平校正攝影機91下方(如圖8所示),由該水平校正攝影機91攝入該探針80的水平平面影像並回傳到該主控機構2,由該主控機構2依據該水平平面影像中
該探針80的水平座標與預先設定的該探針80的水平座標比對,而得到該探針80的水平偏移量。
The probe offset detection mechanism 90 includes a
且該探針偏移偵測機構90尚包含一垂直校正攝影機92,係用於對該探針80做垂直偏移之偵測及校正,其方式為該主控機構2控制該探針夾持機構85移動到該垂直校正攝影機92前方(如圖9所示),由該垂直校正攝影機92攝入該探針80的垂直平面影像並回傳到該主控機構2,由該主控機構2依據該垂直平面影像中該探針80的垂直座標與預先設定的該探針80的垂直座標比對,而得到該探針80的垂直偏移量。
And the probe offset detection mechanism 90 still includes a
該主控機構2依據所偵測到的該探針80的水平偏移量及垂直偏移量對該探針80的水平及垂直位置進行校正,使得該探針80可以準確移動到該雜質粒子40的位置以移除該雜質粒子40。
The main control mechanism 2 corrects the horizontal and vertical positions of the
本案上述的該主控機構2、該透光薄膜高度偵測器50、該第一攝影機60、該第二攝影機70、該探針夾持機構85及該探針偏移偵測機構90,係可以安裝在一機台(圖中未顯示)上,並由該機台所設計的移動機構,而在偵測時將上述各元件依照所既定的行程移動到設定的位置,此機台為習知技術中所熟知者,並不具新穎性,因此在此不贅述其細節。
In this case, the main control mechanism 2, the transparent
應用本發明的方式,由於本案應用雷射偵測器,其可以選擇適當的雷射光束而不會穿透該透光薄膜,因此可以偵測出整個透光薄膜的高度,此為習知技術中所無法克服者。再者應用兩個數位成像攝影機分別求出透光薄膜上雜質粒子的座標點跟高度,再應用探針移除該雜質粒子,整體上為現有技術可以達成者。而且有效的增加了光罩上照射光線的聚焦能力,對於現今半導體 的製程要求元件的尺寸越來越小的趨勢,本案有效的提升了整個影像品質,而增加了精確度,因此整體上可以提升半導體製造能力。 According to the method of the present invention, since a laser detector is used in this case, it can select an appropriate laser beam without penetrating the transparent film, so it can detect the height of the entire transparent film, which is a conventional technology The insurmountable. Furthermore, two digital imaging cameras are used to obtain the coordinate points and heights of the impurity particles on the light-transmitting film, and then the probe is used to remove the impurity particles, which can be achieved in the prior art as a whole. And it effectively increases the focusing ability of the light irradiated on the photomask. The manufacturing process requires the trend of smaller and smaller component sizes. In this case, the entire image quality is effectively improved, and the accuracy is increased, so the overall semiconductor manufacturing capability can be improved.
綜上所述,本案人性化之體貼設計,相當符合實際需求。其具體改進現有缺失,相較於習知技術明顯具有突破性之進步優點,確實具有功效之增進,且非易於達成。本案未曾公開或揭露於國內與國外之文獻與市場上,已符合專利法規定。 In summary, the humanized and considerate design of this case is quite in line with actual needs. Compared with the conventional technology, the specific improvement of the existing deficiency is obviously a breakthrough progress advantage, it does have an improvement in efficacy, and it is not easy to achieve. This case has not been disclosed or disclosed in domestic and foreign documents and markets, and has complied with the provisions of the Patent Law.
上列詳細說明係針對本發明之一可行實施例之具體說明,惟該實施例並非用以限制本發明之專利範圍,凡未脫離本發明技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。 The above detailed description is a specific description of a feasible embodiment of the present invention, but this embodiment is not intended to limit the patent scope of the present invention, and any equivalent implementation or change without departing from the technical spirit of the present invention should be included in The patent scope of this case.
2‧‧‧主控機構 2‧‧‧Master control organization
50‧‧‧透光薄膜高度偵測器 50‧‧‧Transparent film height detector
60‧‧‧第一攝影機 60‧‧‧ First camera
70‧‧‧第二攝影機 70‧‧‧Second camera
80‧‧‧探針 80‧‧‧probe
85‧‧‧探針夾持機構 85‧‧‧Probe clamping mechanism
90‧‧‧探針偏移偵測機構 90‧‧‧Probe offset detection mechanism
91‧‧‧水平校正攝影機 91‧‧‧level correction camera
92‧‧‧垂直校正攝影機 92‧‧‧Vertical camera
Claims (11)
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| WO2005036623A1 (en) * | 2003-10-08 | 2005-04-21 | Zao Nikon Co., Ltd. | Substrate transporting apparatus and method, exposure apparatus and method, and device producing method |
| US8530991B2 (en) * | 2007-04-18 | 2013-09-10 | Invisage Technologies, Inc. | Materials, systems and methods for optoelectronic devices |
| EP2508903B1 (en) * | 2011-03-15 | 2016-05-11 | Ebara Corporation | Inspection device using secondary charged particle detection |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2005036623A1 (en) * | 2003-10-08 | 2005-04-21 | Zao Nikon Co., Ltd. | Substrate transporting apparatus and method, exposure apparatus and method, and device producing method |
| US8530991B2 (en) * | 2007-04-18 | 2013-09-10 | Invisage Technologies, Inc. | Materials, systems and methods for optoelectronic devices |
| EP2508903B1 (en) * | 2011-03-15 | 2016-05-11 | Ebara Corporation | Inspection device using secondary charged particle detection |
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