TWI688329B - Clustered heat dissipation device and chassis thereof - Google Patents

Abstract

A cluster heat dissipation device and chassis thereof. The cluster heat dissipation device includes a heat absorbing manifold, a plurality of cold plate, and a plurality of tubes. The heat absorption manifold has a water inlet chamber and a water outlet chamber. The water inlet chamber includes at least one first water inlet and a plurality of first water outlets. The water outlet chamber includes a plurality of second water inlets and at least one second water outlet. The absorbing manifold is in thermal contact with a first heat source. A plurality of pipes connect the cold plate to the first water outlet, and connect the cold plate and the second water inlet.

Description

Cluster type heat dissipation device and case

The invention relates to a heat dissipation device, in particular to a cluster type heat dissipation device applied to a case for heat dissipation.

In a large heat dissipation system, the function of the manifold is to send or collect coolant, but it is not responsible for heat absorption or heat dissipation. For example, the function of the cold water manifold is to receive the coolant and send it to each heat absorption head. The water manifold is the condensing device or cooling device that collects the heated coolant and transfers it to the outside. However, since the manifold itself also occupies a certain space, if it can be used as a heat sink or other components, it is bound to improve the heat dissipation performance while maintaining or even reducing the size of the entire heat dissipation system.

In view of the lack of improvement of the above large heat dissipation system, this case proposes a cluster type heat dissipation device, which is particularly suitable for servers installed in cabinets or other electronic devices or equipment with multiple heat sources at the same time, which can be used to absorb or take away at the same time. The heat energy generated by the operation of each heat source, in particular, the heat absorbing manifold in the cluster type heat dissipation device proposed by the present invention itself has the functions of both the manifold and the heat absorbing head, and thus can improve the overall heat dissipation performance.

The invention provides a cluster type heat dissipation device, including a heat absorption manifold, a plurality of heat absorption heads and a plurality of pipelines, wherein the heat absorption manifold has a water inlet cavity and a water outlet cavity, and the water inlet cavity includes at least a first water inlet And a plurality of first water outlets. The water outlet cavity includes a plurality of second water inlets and at least one second water outlet. The heat absorption manifold system is in thermal contact with a first heat source. A plurality of pipelines connect the heat absorbing head and the first water outlet, and connect the heat absorbing head and the second water inlet.

In one embodiment, the heat absorbing head is in thermal contact with a second heat source.

In an embodiment, the first heat source and the second heat source may be different heating elements, or may be different heating parts of the same heating element.

In an embodiment, the water inlet cavity and the water outlet cavity may be arranged up and down or left and right.

In an embodiment, the heat absorption head may be a single cavity or a plurality of cavity structures.

In one embodiment, the material of the heat-absorbing manifold can be selected from one of the following materials: silver, copper, gold, aluminum, iron, alloy containing one of the foregoing metals, and graphite.

In an embodiment, when the cluster type heat dissipation device performs the heat dissipation function, a coolant is introduced into the internal pipeline.

In one embodiment, the first water inlet is connected to a cooling fluid supply line, receives the cooled cooling fluid, and transmits to the plurality of heat absorbing heads through the plurality of first water outlets.

In an embodiment, the second water outlet is connected to a cooling fluid discharge pipe, and transfers the heated cooling fluid to a corresponding external condensing device or a heat exchange device for cooling.

In one embodiment, it further includes a quick connector to connect the first water outlet and the pipeline, or connect the second water inlet and the pipeline.

In one embodiment, the quick connector includes an outer sleeve joint, an inner sleeve joint, and an elastic ring body. The jacket takeover includes an outer tube body and a flared portion. The inner sleeve connecting pipe includes an inner pipe body and a cover body, and the cover body includes an inlet portion and an accommodating portion. When the outer sleeve joint and the inner sleeve joint are combined together, the flared part is sleeved by the elastic ring body and is engaged in the accommodating part.

In an embodiment, a ring groove is formed on the outer edge of the inner tube body, and a washer is sleeved on the ring groove.

The invention provides a case including an electronic device, a plurality of heat-absorbing heads, and a heat-absorbing manifold. The electronic device has at least three heat sources. The plurality of heat absorbing heads are in thermal contact with at least two of the at least three heat sources. The heat absorption manifold is connected to a cooling liquid supply line and a cooling liquid discharge line, for distributing a cooling liquid to a plurality of heat absorbing heads, and collecting the cooling liquid flowing through the plurality of heat absorbing heads and warming up to the cooling liquid discharge pipe Road; wherein, the heat-absorbing manifold system is in thermal contact with one of the at least three heat sources.

In one embodiment, the heat source refers to a single heating element or different heating parts in the heating element.

In one embodiment, the heat absorption manifold has a water inlet cavity and a water outlet cavity, the water inlet cavity is connected with the coolant supply line, and the water outlet cavity is connected with the coolant discharge line

In one embodiment, the water inlet cavity is in thermal contact with one of at least three heat sources.

In one embodiment, the outlet chamber is in thermal contact with one of at least three heat sources.

In an embodiment, the water inlet chamber and the plurality of heat-absorbing heads are connected together by a quick connector and a pipeline.

In one embodiment, the outlet chamber and the plurality of heat-absorbing heads are connected together by a quick connector and a pipeline.

In one embodiment, the material of the heat-absorbing manifold may be selected from one of the following materials: silver, copper, gold, aluminum, iron, an alloy containing one of the foregoing metals, and graphite.

1: cluster heat sink

11: Endothermic manifold

12: Inlet chamber

121: First-person spout

122: The first water outlet

13: Outlet cavity

131: Second water inlet

132: Second water outlet

14: Coolant supply line

15: Coolant drain line

16: endothermic head

16A: cavity

16B: cavity

17: endothermic head

18A: pipeline

18B: piping

19A: piping

19B: Piping

19C: Piping

2: Electronic device

2A: heat source

2B: heat source

3: Quick connector

31: Jacket takes over

311: outer tube

311A: Shrink part

311B: Flaring

311C: Inner edge

32: inner sleeve takeover

321: inner tube

321A: Ring groove

321B: outer edge

322: cover

322A: Entrance

322B: accommodating part

33: Washer

34: Elastic ring body

4: Chassis

FIG. 1 is a three-dimensional schematic diagram of the cluster heat dissipation device according to the first embodiment of the present invention.

FIG. 2 is a three-dimensional exploded schematic view of the cluster heat dissipation device according to the first embodiment of the present invention.

FIG. 3A is a schematic cross-sectional view of the heat-absorbing manifold in the cluster heat dissipation device taken along section line 3-3 in FIG. 1.

FIG. 3B is a schematic cross-sectional view of another embodiment of the heat-absorbing manifold in the cluster heat dissipation device

FIG. 4 is a schematic cross-sectional view of the heat absorbing head in the cluster heat dissipation device taken along the section line 4-4 in FIG. 1.

FIG. 5 is a three-dimensional schematic diagram of the cluster heat dissipation device according to the second embodiment of the present invention.

FIG. 6 is a schematic cross-sectional view of the heat-absorbing head in the cluster heat dissipation device taken along the section line 6-6 in FIG. 5.

FIG. 7 is a three-dimensional schematic diagram of a cluster heat dissipation device according to a third embodiment of the present invention.

8A and 8B are a three-dimensional schematic body and a three-dimensional disassembly diagram of a quick connector in a cluster heat dissipation device according to a third embodiment of the present invention.

8C to 8E are schematic cross-sectional views of the assembly process of the quick connector in the cluster heat dissipation device according to the third embodiment of the present invention.

Please also refer to FIGS. 1-4, according to an embodiment of the present invention, a cluster heat sink 1 is provided. The cluster type heat dissipation device 1 includes a heat absorption manifold 11, a plurality of heat absorption heads 16 (or cold plate), pipes 18A, 18B, and a cooling liquid (not shown). The heat absorption manifold 11 includes a water inlet cavity 12 and a water outlet cavity 13. The water inlet cavity 12 includes at least one first water inlet 121 and a plurality of first water outlets 122, and the water outlet cavity 13 includes a plurality of second water inlets 131 and At least one second water outlet 132. The first water inlet 121 of the water inlet chamber 12 of the heat absorption manifold 11 is connected to a cooling fluid supply line 14 and receives a lower temperature (cooled) cooling fluid (not shown) and passes through the first water outlet 122 And transfer to each heat-absorbing head 16. The second water outlet 132 of the water outlet chamber 13 of the heat absorption manifold 11 is connected to a cooling fluid discharge pipe 15 and collects heat energy absorbed in the heat absorption heads 16 through the second water inlets 131 and thus the temperature rises (heated) After passing the cooling liquid, it is transferred to the corresponding external condensing device or heat exchange device (not shown) for cooling. When the cooling liquid is cooled down, it will return to the water inlet chamber 12 of the heat absorption manifold 11 via the cooling liquid supply line 14.

Each heat absorbing head 16 is in thermal contact with the heat source 2A of the electronic device 2 so that the coolant flowing through the heat absorbing head 16 can be heated or undergo phase change to take away heat energy. The heat absorbing manifold 11 provided in this embodiment, except In addition to the functions of traditional manifold shunt and collection, it also has the function of heat absorption. The material of the heat absorption manifold 11 can be selected from metals, alloys or non-metals such as graphite with good thermal conductivity. In this way, as shown in FIG. 3, it can make thermal contact with the heat source 2B of the electronic device 2 to absorb it The generated thermal energy is transferred to the cooling liquid. In this embodiment, the thermal contact includes directly attaching to the heat source 2A or 2B, or there is a thermal paste, adhesive, solder between the two Or intermediate media such as thermal blocks. In addition, the heat source 2A or 2B may refer to a separate heating element or different heating parts of the same heating element, the invention is not limited, as long as the heat absorption manifold 11 can directly make thermal contact with the heat source to absorb or take away The generated thermal energy is sufficient.

The application target of the cluster heat dissipation device 1 of the present invention is an electronic device 2 with multiple heat sources. The electronic device 2 may be a desktop host, servers, small computers, medium computers, large computers or even supercomputers. The internal components such as CPU, GPU or memory module are prone to generate heat energy during operation and have a need for heat dissipation. In addition, since the cluster heat dissipation device 1 of the present invention has a heat absorption manifold 11, this manifold will be connected to the coolant supply line 14 or the coolant discharge line 15, so it is also very suitable for application in the cabinet type ( Rack) heat dissipation system (not shown in the figure), the cluster type heat dissipation device 1 is installed on the electronic device 2 in the chassis 4 of each layer. 4 when the cluster-type heat dissipation device 1 is paired with the electronic device 2, of course, the present invention is not limited to this application.

In the cluster type heat dissipation device 1 provided in this embodiment, the heat absorption manifold 11 cooperates with a plurality of heat absorption heads 16, and each heat absorption head 16 may be connected in series or extended with other heat absorption heads 17 as needed or configured. The number of heat-absorbing heads 16 shown in Figs. 1-4 is four, but the number is only for illustrating the present invention, the actual number is not less than 2, and the heat-absorbing head 16 is extended or connected in series The number of heat absorbing heads 17 is not limited, and can even be deleted.

In the cluster-type heat dissipation device 1 provided in this embodiment, the water inlet chamber 12 and the water outlet chamber 13 of the heat absorption manifold 11 are vertically separated as shown in FIG. 3A, and the water outlet chamber 13 is in thermal contact with the heat source 2B. According to other embodiments of the present invention, the positions of the water inlet chamber 12 and the water outlet chamber 13 can also be interchanged, with the water inlet chamber 12 at the lower layer and the water outlet chamber 13 at the upper layer, so that the water inlet chamber 12 makes thermal contact with the heat source 2B. Of course, the water inlet chamber 12 and the water outlet chamber 13 are not limited to be separated up and down, in other implementations In the example, it can also be separated left and right as shown in FIG. 3B. At this time, the inlet chamber 12 or the outlet chamber 13 can be selected to make thermal contact with the heat source 2B, or both the inlet chamber 12 and the outlet chamber 13 are in contact with The corresponding heat source 2B makes thermal contact.

In the cluster-type heat dissipation device 1 provided in this embodiment, the heat absorption manifold 11 is a one-piece structure, that is, the water inlet chamber 12 and the water outlet chamber 13 are formed inside at the same time, but in other embodiments according to the present invention, The water inlet chamber 12 or the water outlet chamber 13 can also be provided separately to prevent the higher temperature of the water outlet chamber 13 from affecting the coolant of the water inlet chamber 12. In this case, the water inlet chamber 12 or the water outlet chamber 13 can also be used Choose to make thermal contact with the heat source 2B to bring out the effect of removing heat energy.

In the cluster type heat dissipation device 1 provided in this embodiment, a plurality of heat absorbing heads 16 (or 17) and the heat absorbing manifold 11 are connected together by a pipe 18, for example, the pipe 18A is used to connect the heat absorbing manifold 11 into The first water outlet 122 of the water chamber 12 and the heat absorption head 16, and the pipe 18B is used to connect the heat absorption head 16 (or 17) to the second water inlet 131 of the water outlet chamber 13 of the heat absorption manifold 11.

In the cluster-type heat dissipation device 1 provided in this embodiment, after the cooling liquid enters the water intake chamber 12 of the heat absorption manifold 11, it is first transferred to the heat absorption head 16, and after the cooling liquid heats up, it is returned to the outlet water of the heat absorption manifold 11 Cavity 13, and the coolant will reabsorb the heat energy of the heat source 2B under the water cavity 13 to generate a second (or third) temperature rise. This arrangement is because the heat source 2A has a higher temperature than the heat source 2B, or When the heat source 2A can generate more heat energy than the heat source 2B, the arrangement made when the heat is preferentially removed is more needed. Conversely, if the heat source 2B has a higher temperature than the heat source 2A, or the heat source 2B generates more heat energy than the heat source 2A, the present invention can also be arranged in other embodiments to incorporate the intake cavity of the heat-absorbing manifold 11 12 and the water outlet chamber 13 are interchanged. For example, the water inlet chamber 12 is in the lower layer and the water outlet chamber 13 is in the upper layer. At this time, the cooling liquid will advance to the water inlet chamber 12 of the heat absorption manifold 11 to absorb the heat energy generated by the heat source 2B below. The first temperature rise, and then transferred to the heat absorbing head 16 to absorb the heat source 2A After the heat, the temperature is increased a second time before finally returning to the water outlet chamber 13 above the heat absorption manifold 11. It can be seen that the present invention can elastically adjust the structural configuration relationship between the water inlet chamber 12 and the water outlet chamber 13 of the heat absorption manifold 11 according to different heat removal requirements.

Please also refer to the three-dimensional schematic diagram of the cluster type heat dissipation device shown in FIG. 1 and the cross-sectional schematic diagram of the heat absorption head 16 shown in FIG. 4, in this embodiment, the heat absorption head 16 matched with the heat absorption manifold 11 is a single cavity According to the design, after the coolant is transferred from the heat absorbing manifold 11 through the pipeline 18A, it will move in a single direction inside the heat absorbing head 16, and then it will be transferred back to the heat absorbing manifold 11 through the pipeline 18B. However, in other embodiments of the present invention, the heat absorbing manifold 11 can be used with a heat absorbing head having dual chambers or even more chambers.

Please refer to the perspective schematic diagram of the cluster heat dissipation device provided in the second embodiment of the present invention shown in FIG. 5 and the cross-sectional schematic diagram of the heat absorption head shown in FIG. 6. The cluster heat dissipation device provided in this embodiment is similar to the cluster heat dissipation device provided in the previous embodiment in terms of the structure and operation principle of the heat absorption manifold 11, the coolant supply line 14 and the coolant discharge line 15 The same, so I won’t go into details. The difference between the two is that the heat-absorbing head 16 provided with the heat-absorbing manifold 11 in this embodiment is a dual-chamber design. As shown in FIG. 6, the heat-absorbing head 16 includes a cavity 16A With 16B. In this embodiment, after the cooling fluid flows out of the heat absorption manifold 11, it will enter the cavity 16A through the pipeline 19A, absorb part of the heat energy of the lower heat source 2A, and then pass to the next same heat absorption head 16 to absorb the same Part of the heat energy generated by the heat source 2A, and finally the pipeline 19B will be turned back between the different chambers of the heat absorbing head 16, allowing the cooling liquid to return to the cavity 16B of each heat absorbing head 16 to absorb the heat energy of other parts of the heat source 2A below, and finally Then it passes back to the heat-absorbing manifold 11 via the pipeline 19C. The advantage of matching with this kind of multi-chamber heat-absorbing head is that the heat-absorbing heads 16 can absorb heat energy more evenly, and the heat-absorbing head at the end of the pipeline will not be given due to the order of arrangement because the temperature of the inlet water is too high. Cannot be effective Play a role.

As can be understood from the above description, in the cluster type heat dissipation device provided by the present invention, the heat absorption manifold can work with a heat absorption head having a single cavity or a plurality of cavities, the same type of heat absorption head can be selected, or it can be mixed and matched The present invention is not limited to different types of heat absorbing heads. The heat absorption manifold itself can choose to make thermal contact with the heat source by the water inlet cavity or the water outlet cavity alone, or it can simultaneously make the water inlet cavity and the water outlet cavity contact with the heat, and the water inlet cavity and the water outlet cavity can be structurally Connected together, separated by a distance or separated.

In the cluster type heat dissipation device provided by the present invention, the material of the heat absorption manifold may be selected from metals with good thermal conductivity, such as silver, copper, gold, aluminum, iron, etc., or alloys containing the above metals, or other thermal conductivity Preferred non-metals such as graphite are not limited by the present invention.

Please refer to FIG. 7, which is a three-dimensional schematic diagram of a cluster heat dissipation device according to a third embodiment of the present invention. The cluster heat dissipation device provided in this embodiment is substantially the same in structure and operating principle as the cluster heat dissipation device provided in the foregoing first embodiment, and its greatest feature is that it is located in the inlet cavity 12 of the heat absorption manifold 11 Between the first water outlet 122 and the pipe 18A, or between the second water inlet 131 of the water outlet cavity 13 of the heat absorption manifold 11 and the pipe 18B, a quick connector 3 is added as needed to facilitate the cluster heat sink 1 Assembly or repair.

Please refer to FIGS. 8A to 8E for the structure and assembly method of the quick connector 3 at the same time. FIGS. 8A and 8B are a three-dimensional schematic body and a three-dimensional disassembly diagram of the quick connector 3, and FIGS. 8C to 8E are The assembly process of the quick coupling is shown in a sectional view. The quick connector 3 is mainly composed of an outer sleeve tube 31 and an inner sleeve tube 32. The outer tube tube 31 includes an outer tube body 311, and a flared portion 311A and a flared portion 311B can be formed at both ends of the outer tube body The flared portion 311A can be used to connect the pipeline 18A or the pipeline 18B. The inner sleeve connecting pipe 32 includes an inner pipe body 321 and A cover body 322, wherein the outer edge 321B of the inner tube body 321 is formed with at least one ring groove 321A in a direction close to the outer tube body, and a gasket 33, such as an O-ring, is mounted on the ring groove 321A. The cover 322 is disposed on the outer edge 321B of the inner tube 321 in a direction closer to the manifold 11 (a direction away from the outer tube 311). In addition, an elastic ring body 34, such as a spring ring, is disposed between the cover body 322 and the inner tube body 321. The cover body 322 and the inner tube body 321 may be an integrally formed one-piece structure, or may be composed of two different components by means of sleeve clamping, pressing or welding, etc. The present invention is not limited .

Please refer to FIGS. 8C to 8E at the same time. In the process of butt assembly of the outer sleeve 31 and the inner sleeve 32 of the quick connector 3, the inner edge 311C of the outer tube body 311 and the outer edge 321B of the inner tube body 321 are in size and There is a corresponding relationship in shape, so they can be nested together along the axial direction. In addition, since the quick connector 3 is provided with the ring groove 321A and the gasket 33 on the outer edge 321B of the inner tube body 321, during the process of sleeve coupling of the outer sleeve tube 31 and the inner sleeve tube 32, the inner edge 311C of the outer tube body 311 will Extruded to the gasket 33 sleeved outside the ring groove 321A, and after the gasket 33 is deformed by compression, the gap between the inner edge 311C of the outer tube body 311 and the ring groove 321A is completely filled to prevent the leakage of coolant .

Continuing to refer to FIGS. 8C to 8E, in order to prevent both the outer sleeve 31 and the inner sleeve 32 from separating in the axial direction after assembly, the quick connector 3 is provided with a cover on the outer edge of the inner tube 321 322, at the same time, a flared portion 311B is provided on the outer sleeve 31 correspondingly. The cover 322 has an inlet portion 322A and an accommodating portion 322B. From a cross-sectional view, the accommodating portion 322B extends inward from the inlet portion 322A and has an arc space with a narrow outer width and an inner wide width. Then the elastic ring body 34 is provided. When the flared portion 311B of the outer sleeve 31 passes through the inlet portion 322A of the cover 322 as shown in FIG. 8D, the flared portion 311B will press against the elastic ring body 34 and follow the curved space The elastic ring body 34 is enlarged. When the flared part 311B of the outer sleeve 31 continues to pass forward through the elastic ring body 34, the elastic ring body 34 will be sleeved outside the flared part 311B and shrink inward along the shape of the flared part 311B. Finally, it is engaged between the inlet portion 322A and the flared portion 311B. In this way, since the entrance portion 322A of the cover body 322 has been closed by the elastic ring body 34, the flared portion 311B of the outer sleeve take-up 31 can be firmly engaged in the accommodating portion 322B. Even if there is an external force, the outer sleeve The flared portion 311B of the connecting pipe 31 cannot be detached from the cover body 322, so that the outer sleeve connecting pipe 31 and the inner sleeve connecting pipe 32 can be prevented from separating in the axial direction. In the future, if the outer tube 31 and the inner tube 32 are to be separated, a tubular tool can be used to extend into the gap between the flared part 311B and the elastic ring body 34 and stretch the elastic ring body 34 to make the outer tube take over After the 31 and the inner sleeve joint 32 are released from the engaged state, they can be separated in the opposite direction during assembly.

When the cluster type heat dissipation device 1 provided by the present invention is operated to perform the heat dissipation function, the internal pipeline will introduce or be injected with cooling fluid, and the cooling fluid flows through the internal pipelines such as the heat absorption manifold, pipeline and heat absorption head During the process, it can be kept in a liquid state at all times, or it can also be converted into steam to take away heat energy. If you choose a coolant that can perform liquid-gas conversion, you can choose a low-boiling electronic engineering fluid, such as 3M Fluorinert FC-72 (boiling point is 56℃), 3M Novec Fluids 7000 (boiling point 34℃), or 3M Novec Fluids 7100 (Boiling point 61°C), etc., due to its low boiling point, it is easy to convert to gaseous state after heating up, and it takes away a lot of heat energy during the expansion and pressurization process.

The cluster heat dissipation device provided by the present invention is mainly responsible for absorbing the heat energy generated by the heat source, and then transferring the heated cooling fluid outward. After the cooling fluid is cooled down, it is transferred back to the cluster heat dissipation device to absorb the heat source again. The heat energy generated is endlessly circulating. Therefore, the cluster type heat dissipation device can be selected with the condensation device, the cooling device, and the control system (such as CDU coolant distribution control) Unit Coolant Distribution Unit (CDU), pump, and piping are combined to form a large-scale heat dissipation system, such as a cabinet-type heat dissipation system.

The above are only specific embodiments of the present invention and are not intended to limit the present invention. Therefore, other equivalent changes or modifications made without departing from the spirit disclosed by the present invention should be included in the inventive concept of the present case.

1: cluster heat sink

11: Endothermic manifold

121: The first water inlet

122: The first water outlet

131: Second water inlet

132: Second water outlet

14: Coolant supply line

15: Coolant drain line

16: endothermic head

17: endothermic head

18A: pipeline

18B: piping

2: Electronic device

4: Chassis

Claims (18)

A cluster type heat dissipation device includes: a heat-absorbing manifold having a water inlet cavity and a water outlet cavity, the water inlet cavity includes at least a first water inlet and a plurality of first water outlets, the water outlet cavity includes a plurality of second A water inlet and at least one second water outlet; a plurality of heat-absorbing heads; and a plurality of pipes connecting the heat-absorbing head and the first water-outlet, and connecting the heat-absorbing head and the second water-inlet; wherein the heat-absorbing manifold is The material may be selected from one of the following materials: silver, copper, gold, aluminum, iron, an alloy containing one of the foregoing metals, and graphite, and the heat-absorbing manifold is in thermal contact with a first heat source. According to the cluster heat dissipation device of claim 1, the heat absorbing head is in thermal contact with a second heat source. According to the cluster heat dissipation device of item 2 of the patent application range, the first heat source and the second heat source may be different heating elements or different heating parts of the same heating element. According to the cluster heat dissipation device of item 1 of the patent application scope, wherein the water inlet cavity and the water outlet cavity may be arranged up and down or left and right. According to the cluster-type heat dissipation device of item 1 of the patent application range, the heat absorbing head may be a single cavity or a plurality of cavity structures. According to the cluster-type heat dissipation device of item 1 of the patent application scope, wherein when the cluster-type heat dissipation device performs the heat dissipation function, a coolant is introduced into the internal pipeline. According to the cluster heat dissipation device of claim 6, the first water inlet is connected to a coolant supply line, receives the cooled coolant, and passes through the plurality of first water outlets Transfer to the plurality of heat-absorbing heads. According to the cluster heat dissipation device of claim 6, the second water outlet is connected to a cooling fluid discharge line, and the heated cooling fluid is transferred to a corresponding external condensing device or a heat exchange device To cool down. The cluster type heat dissipation device according to item 1 of the patent application scope further includes a quick connector to connect the first water outlet and the pipeline, or connect the second water inlet and the pipeline. According to the cluster heat dissipation device of claim 9 of the patent application scope, the quick connector includes: an outer sleeve takeover, the outer sleeve takeover includes an outer tube body and a flared portion; an inner sleeve takeover, the inner sleeve takeover includes an inner tube body And a cover body, which includes an inlet portion and an accommodating portion; and an elastic ring body; wherein when the outer sleeve takes over the inner sleeve takeover, the flared part is caught by the elastic ring body And it is locked in the accommodating part. According to the cluster heat dissipation device of claim 10, a ring groove is formed on the outer edge of the inner tube body, and a gasket is provided on the ring groove. A case includes: an electronic device having at least three heat sources; a plurality of heat-absorbing heads in thermal contact with at least two of the at least three heat sources; and a heat-absorbing manifold connected to a coolant supply line and a A coolant discharge line for distributing a coolant to the plurality of heat-absorbing heads and collecting the coolant flowing through the heat-absorbing heads to increase the temperature to the coolant discharge line; wherein, the heat-absorbing manifold The material can be selected from one of the following materials: silver, copper, gold, aluminum, iron, bag An alloy containing one of the foregoing metals and graphite, and the heat-absorbing manifold system is in thermal contact with one of the at least three heat sources. According to the chassis of item 12 of the patent application scope, the heat source refers to a separate heating element or different heating parts in the heating element. According to the chassis of item 12 of the patent application scope, the heat absorption manifold has an inlet cavity and an outlet cavity, the inlet cavity is connected with the coolant supply line, the outlet cavity is connected with the coolant outlet tube Roads are connected together. According to the cabinet of item 14 of the patent application scope, the water inlet cavity is in thermal contact with one of the at least three heat sources. According to the enclosure of item 14 of the patent application scope, the outlet chamber is in thermal contact with one of the at least three heat sources. According to the chassis of claim 14 of the patent application scope, the water inlet chamber and the plurality of heat-absorbing heads are connected together by a quick connector and a pipeline. According to the chassis of item 14 of the patent application scope, the water outlet cavity and the plurality of heat absorbing heads are connected together by a quick connector and a pipeline.

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