TWI685780B - Cover glass of touch panel, touch panel, and manufacturing method thereof - Google Patents

Abstract

A touch panel includes a visible region and a peripheral region disposed by at least one side of the visible region. The touch panel further includes a first substrate, a first decoration layer, a non-conductive layer, a trace, and a touch device. The first decoration layer is disposed on a surface of the first substrate and in the peripheral region. The non-conductive layer is disposed on the surface of the first substrate and in the peripheral region, the first decoration layer and the non-conductive layer are disposed on the same horizontal plane, and the non-conductive layer includes a transparent non-conductive material or a fluorescent material. The trace is disposed in the peripheral region, and the touch device is disposed in the visible region, and the trace is electrically connected to the touch device.

Description

Cover plate of touch panel, touch panel and manufacturing method thereof

The invention relates to a cover plate of a touch panel, a touch panel and a manufacturing method thereof, in particular to a cover plate of a touch panel with a marking pattern in a peripheral area, a touch panel and a manufacturing method thereof.

In the conventional touch panel, the logo pattern (LOGO) located in the surrounding area is usually made of metal materials, so that the logo pattern and the traces also located in the surrounding area will produce electromagnetic interference (EMI), which affects the signal. Transmission quality. Therefore, the installation position of the logo pattern needs to be staggered from the position of the trace in the vertical projection direction to reduce the influence of electromagnetic interference, so that the width of the surrounding area cannot be effectively reduced.

One of the main objects of the present invention is to provide a cover plate for a touch panel, a touch panel and a manufacturing method thereof, which can avoid the electromagnetic interference caused by the marking patterns and wiring in the surrounding area, and can further reduce the width of the surrounding area.

To achieve the above objective, an embodiment of the present invention provides a touch panel having a visible area and a surrounding area on at least one side of the visible area, and the touch panel includes a first substrate and a first A decorative layer, a non-conductive layer, a trace, and a touch element. The first decoration layer is disposed on one surface of the first substrate and disposed in the surrounding area. The non-conductive layer is disposed on the surface of the first substrate and in the surrounding area, wherein the first decorative layer and the non-conductive layer are disposed on the same horizontal plane, and the non-conductive layer includes a transparent non-conductive material or a fluorescent material. The wiring is arranged in the surrounding area, and the touch element is arranged in the visible area, wherein the trace is electrically connected to the touch element.

To achieve the above objective, an embodiment of the present invention provides a method for manufacturing a touch panel, which includes the following steps. A first substrate is provided, wherein the first substrate defines a visible area and a surrounding area is located on at least one side of the visible area. A non-conductive layer is formed on one surface of the first substrate in the surrounding area, wherein the non-conductive layer includes a transparent non-conductive material or a fluorescent material. A first decorative layer is formed on the surface of the first substrate in the surrounding area, wherein the first decorative layer and the non-conductive layer are disposed on the same horizontal plane. A trace is formed on the first substrate in the surrounding area or corresponding to the surrounding area of the first substrate on a second substrate. A touch element is formed on the first substrate in the visible area or the visible area corresponding to the first substrate on the second substrate, wherein the trace is electrically connected to the touch element.

To achieve the above object, an embodiment of the present invention provides a cover plate for a touch panel, which has a visible area and a surrounding area on at least one side of the visible area, and the cover plate includes a substrate, a decorative layer, and a Non-conductive layer. The decorative layer is provided on one surface of the substrate and in the surrounding area. The non-conductive layer is arranged on the surface of the substrate and in the surrounding area, wherein the decorative layer and the non-conductive layer are arranged on the same horizontal plane, and the non-conductive layer includes transparent non-conductive material or fluorescent material.

10‧‧‧Touch panel

102‧‧‧The first substrate

104, 204, 1081, 1101, 1062‧‧‧surface

106‧‧‧Non-conductive layer

1061, 1083‧‧‧ opening

108‧‧‧The first decorative layer

1082, 112, 114‧‧‧Bevel

110‧‧‧Second decorative layer

20‧‧‧Cover

202‧‧‧Second substrate

302‧‧‧ Adhesive layer

304‧‧‧Protective layer

BR‧‧‧Bridge

HP‧‧‧horizontal

IN‧‧‧Insulation

R1‧‧‧Viewable area

R2‧‧‧ Surrounding area

S102, S104, S106, S108, S110

TD‧‧‧Touch element

TE1‧‧‧First sensing electrode

TE2‧‧‧Second sensing electrode

TR‧‧‧Trace

V‧‧‧Vertical projection direction

W1‧‧‧First width

W2‧‧‧second width

W3‧‧‧third width

X‧‧‧horizontal

FIG. 1 is a flowchart of steps of the method for manufacturing a touch panel of the present invention.

FIGS. 2 to 5 are schematic diagrams of the manufacturing method of the cover plate and the touch panel according to the first embodiment of the present invention.

6 to 8 are schematic diagrams of the manufacturing method of the cover plate and the touch panel according to the second embodiment of the present invention.

FIG. 9 is a schematic cross-sectional view of a touch panel according to a third embodiment of the invention.

FIG. 10 is a schematic cross-sectional view of a touch panel according to a fourth embodiment of the invention.

FIG. 11 is a schematic cross-sectional view of a touch panel according to a fifth embodiment of the invention.

In order for those skilled in the art who are familiar with the present disclosure to understand the present disclosure, the touch panel of the present invention will be described in detail below with reference to the accompanying drawings. In order to make it easy for the reader to understand and the simplicity of the drawings, the multiple drawings in this disclosure only depict a part of the touch panel or cover plate, and the specific elements in the drawings are not drawn according to the actual scale. In addition, the number and size of each element in the drawings are only for illustration, not for limiting the scope of the present disclosure. The detailed quantity, size, ratio or position of each component can be adjusted according to the design requirements. It is worth mentioning that the technical features in different embodiments of the present disclosure can be combined, replaced, and matched with each other to combine another embodiment.

Please refer to Figure 1 to Figure 5. FIG. 1 is a flowchart of steps of the method for manufacturing a touch panel of the present invention, and FIGS. 2 to 5 are schematic diagrams of a method for manufacturing a cover plate and a touch panel of the first embodiment of the present invention. First, perform step S102 in FIG. 1 and refer to FIG. 2 to provide a first substrate 102, wherein the first substrate 102 defines a visible area R1 and a surrounding area R2 located on at least one side of the visible area R1. For example, when viewing a surface 104 of the first substrate 102 in a top-view direction, the surrounding area R2 may surround the visible area R1, but not limited thereto. The first substrate 102 may include a hard or flexible transparent substrate, such as a glass substrate, a plastic substrate, a glass diaphragm, a plastic diaphragm, a light-transmitting cover plate, or other suitable materials and/or Functional substrate. Next, perform step S104 in FIG. 1 and refer to FIG. 2 to form a non-conductive layer 106 on the surface 104 of the first substrate 102 in the surrounding area R2. The non-conductive layer 106 in this embodiment may be used as a logo pattern, which may have a color or a graphic, for example, so that the user can recognize the logo pattern. The non-conductive layer 106 may have a pattern through a patterning process. For example, the non-conductive layer 106 may have openings 1061, and the number of the openings 1061 is not limited to that shown in the figure. In addition, the non-conductive layer 106 may not have the opening 1061. In some embodiments, the non-conductive layer 106 can be formed by a screen printing process. In some embodiments, a non-conductive material may be formed on the surface 104 first, and then the non-conductive layer 106 may be formed through a lithography and etching process. However, the method for forming the non-conductive layer 106 is not limited to the above method, and various types of manufacturing methods such as plating and coating may be included in the process of forming the non-conductive layer 106 and/or the non-conductive material.

The non-conductive layer 106 may include a non-conductive material. In this embodiment, the non-conductive layer 106 may include a transparent non-conductive material or a fluorescent material. The transparent non-conductive material may include a transparent non-conductive high refractive index material, a transparent non-conductive medium refractive index material, and/or a transparent non-conductive low refractive index material, but not limited thereto. For example, the refractive index of the transparent non-conductive high refractive index material may be greater than 2, for example, which may include, for example, Nb ₂ O ₅ , TiO ₂ , Ti ₃ O ₅ , Ti ₂ O ₃ , TiO, Ta ₂ O ₅ , ZrO ₂ , CeO ₂ , ZnS, ZnSe, other suitable transparent non-conductive high refractive index materials, or a combination thereof. The refractive index of the transparent non-conductive medium refractive index material may be, for example, greater than or equal to 1.6 and less than or equal to 2, which may include, for example, Al ₂ O ₃ , HfO ₂ , MgO, Y ₂ O ₃ , CeF ₃ , LaF ₃ , other suitable Transparent non-conductive medium refractive index material or a combination thereof. The refractive index of the transparent non-conductive low refractive index material may be, for example, less than 1.6, which may include, for example, MgF ₂ , SiO ₂ , YF ₃ , BaF ₂ , AlF ₃ , Na ₃ AlF ₆ , Na ₅ Al ₃ F ₁₄ , other suitable transparent Non-conductive low refractive index material or a combination thereof. For example, the non-conductive layer 106 may include a stacked structure in which a plurality of material layers are stacked on each other, these material layers may include different refractive indexes, and may be selected from various transparent non-conductive high refractive index materials, transparent non-conductive Medium refractive index materials and/or transparent non-conductive low refractive index materials. Through the stacking of material layers with different refractive indexes, the non-conductive layer 106 can show different colors (such as red, green, etc.).

On the other hand, the fluorescent material may include, for example, Zn ₂ GeO ₄ : Mn ²⁺ , SrAl ₂ O ₄ : Eu ²⁺ , Dy ³⁺ , Zn ₂ SiO ₄ : Mn ²⁺ , ZnS: Mn ²⁺ , other suitable Fluorescent materials or combinations thereof. Fluorescent materials can be irradiated with incident light of a specific wavelength (usually short wavelength), and then emit outgoing light (wavelength is often greater than the wavelength of incident light, such as the visible light band), by which, by selecting different fluorescent materials The conductive layer 106 causes the non-conductive layer 106 to exhibit different colors.

Next, perform step S106 in FIG. 1 and refer to FIG. 3 to form a first decoration layer 108 on the surface 104 of the first substrate 102 in the surrounding area R2. In this embodiment, the non-conductive layer 106 and the first decoration layer 108 may directly contact the surface 104 of the first substrate 102, but it is not limited thereto, and other film layers may be provided between the non-conductive layer 106 and the first substrate 102 Sometimes between the first decoration layer 108 and the first substrate 102. In the manufacturing method of this embodiment, the non-conductive layer 106 is formed before the first decoration layer 108 is formed, but it is not limited thereto. The non-conductive layer 106 of this embodiment may have an opening 1061, and the thickness of the first decorative layer 108 to be formed later may be greater than the thickness of the non-conductive layer 106, and the first decorative layer 108 may fill the opening 1061 and be in a vertical projection direction V上盖 non-conductive layer 106. Therefore, the non-conductive layer 106 is disposed between the first substrate 102 and the first decoration layer 108 in the vertical projection direction V. The vertical projection direction V may be, for example, a direction perpendicular to the surface 104 of the first substrate 102, but is not limited thereto. In addition, the first decoration layer 108 of this embodiment may have a surface 1081 and a slope 1082 connected thereto. The surface 1081 may be substantially parallel to the surface 104, and the slope 1082 may be disposed near the boundary between the surrounding area R2 and the viewing area R1. For example, the material of the first decoration layer 108 in this embodiment may be ink (such as non-photosensitive resin), but not limited thereto. The material of the first decorative layer 108 may also include photosensitive resin (such as colored photoresist), ceramics, organic materials, a mixture of organic materials and inorganic materials, or organic-inorganic hybrid compounds, which may be a single-layer structure or a multi-layer stacked structure, to It is used to block the undesirable components or light in the touch panel. The method for manufacturing the first decorative layer 108 may include various types of manufacturing methods such as coating, coating, screen printing, and patterning processes (such as lithography and etching processes).

In this embodiment, a cover 20 of a touch panel can be formed through steps S102 to S106. It is additionally added that the method of manufacturing the cover 20 is not limited to the above steps (S102 to S106), and other steps may be performed before, after, or between any of the steps. In addition, some steps may be performed simultaneously, or in a different order than above. In this way, the cover 20 of the touch panel of this embodiment has a visible area R1 and a surrounding area R2 located on at least one side of the visible area R1, and the cover 20 includes a substrate (such as the first substrate 102) and a decoration Layers (such as the first decorative layer 108) and a non-conductive layer 106. The first decoration layer 108 is disposed on the surface 104 of the first substrate 102 and disposed in the surrounding area R2. The non-conductive layer 106 is disposed on the surface 104 of the first substrate 102 and in the surrounding area R2, and the non-conductive layer 106 includes a transparent non-conductive material or a fluorescent material. As shown in FIG. 3, the first decoration layer 108 and the non-conductive layer 106 are disposed on the same horizontal plane HP, where the horizontal plane HP is substantially parallel to the surface 104 of the first substrate 102 and may be a short distance from the surface 104 (e.g. less than The thickness of the non-conductive layer 106). In other words, the first decoration layer 108 and the non-conductive layer 106 can be found in the cross section of the cover plate 20 cut at the horizontal plane HP.

Next, as shown in FIG. 1, step S108 is performed to form a trace on the first substrate in the surrounding area or on a second substrate corresponding to the surrounding area of the first substrate, and step S110 is performed in the visible area A touch element is formed on the first substrate or the visible area corresponding to the first substrate on the second substrate, wherein the trace is electrically connected to the touch element. As shown in FIG. 4, step S108 in this embodiment corresponds to the surrounding area R2 of the first substrate 102 to form one or more traces TR on a second substrate 202, and step S110 in this embodiment corresponds to the first The visible region R1 of the substrate 102 forms a touch element TD on the second substrate 202. The second substrate 202 in FIG. 4 may also have a visible area R1 and a surrounding area R2, and may correspond to the visible area R1 and the surrounding area R2 of the first substrate 102. The second substrate 202 may be the same material as the first substrate 102 described above, but not limited thereto. In some embodiments, the second substrate 202 may be a film instead of a substrate or a carrier. As also shown in FIG. 4, the trace TR and the touch element TD can be formed directly on the second substrate, for example On one surface 204 of the board 202, but not limited to this, other film layers may be disposed between the trace TR and the second substrate 202 or between the touch element TD and the second substrate 202. In addition, for example, a transparent conductive material layer may be formed on the surface 204 of the second substrate 202. The transparent conductive material layer may include a plurality of first sensing electrodes TE1 and a plurality of second sensing electrodes TE2 (FIG. 4 One of them), the first sensing electrodes TE1 may form a plurality of first sensing series and the second sensing electrodes TE2 may form a plurality of second sensing series, and the first sensing The series and the second sensing series may extend alternately on the surface 204, but not limited thereto. The first sensing electrode TE1 may be separated from the second sensing electrode TE2 and electrically isolated. The transparent conductive material in this embodiment may be, for example, transparent conductive oxide (TCO), but not limited thereto. In some embodiments, the sensing electrode may be formed of, for example, nano metal thin wires, a grid-like metal layer, or other non-transparent conductive materials, or may be formed of transparent conductive metal oxides and non-transparent conductive materials ( For example, a grid-like metal) is formed by overlapping, and is not limited to being formed of a transparent conductive material or a non-transparent conductive material alone.

In addition, the touch element TD of this embodiment may include a plurality of bridge lines BR and an insulating layer IN, two adjacent first sensing electrodes TE1 may be electrically connected through a bridge line BR, and the material of the bridge line BR may include Transparent conductive materials (such as TCO) or non-transparent conductive materials (such as metal), but not limited to this. The insulating layer IN may be disposed between the bridge line BR and the second sensing electrode TE2, where the insulating layer IN may include an insulating material to electrically isolate the bridge line BR from the second sensing electrode TE2. The touch element TD of this embodiment may include, for example, an electrode structure such as a bridge type (for example, SITO design) or a double-layer type (for example, DITO design).

On the other hand, the touch element TD can be electrically connected to one or more traces TR. For example, each first sensing series and each second sensing series may be electrically connected to a trace TR, respectively. As shown in FIG. 4, one of the traces TR is connected to one of the first sensing electrodes TE1, so that the signal of the first sense electrode TE1 can be transmitted to an external circuit or other electronic components through the trace TR for further processing. Traces TR materials may include non-transparent conductive materials such as silver, aluminum, copper, magnesium, molybdenum, chromium, titanium, composite layers of the above materials or alloys of the above materials, or include indium tin oxide, indium zinc oxide or aluminum zinc oxide And other transparent conductive materials, but not limited to this. In this embodiment, the trace TR and the bridge line BR can be formed together using the same material, for example, the trace TR is formed together when the bridge line BR is formed. In some embodiments, the trace TR and the first sensing electrode TE1 and/or the second touch sensing electrode TE2 may also be formed of the same material, for example, when forming the first sensing electrode TE1 and/or the second The two touch sensing electrodes TE2 form a trace TR together. In addition, the trace TR may also include materials such as conductive particles, nano carbon tubes, nano metal wires (such as nano silver wires), graphene or silicon. The methods for manufacturing each element and/or trace TR in the touch element TD may include various types of manufacturing methods such as coating, coating, screen printing, and patterning processes (such as photolithography and etching processes).

In addition, as shown in FIG. 5, the first substrate 102 and the second substrate 202 may be bonded. In this embodiment, the first substrate 102 and the second substrate 202 are bonded through an adhesive layer 302, wherein the bonding method is to set the surface 204 of the second substrate 202 to face the surface 104 of the first substrate 102 and pass through the adhesive layer 302 is engaged, but not limited to this. In other words, the adhesive layer 302 is disposed between the second substrate 202 and the first substrate 102. The adhesive layer 302 may include transparent adhesive materials such as optical adhesive (OCA). In addition, the touch element TD on the second substrate 202 is attached to the visible region R1 of the first substrate 102, the trace TR on the second substrate 202 is attached to the surrounding region R2 of the first substrate 102, and the trace TR is The non-conductive layer 106 overlaps in the vertical projection direction V. Thereby, a touch panel 10 can be formed through steps S102 to S110 and referring to FIGS. 1 to 5. However, the method of manufacturing the touch panel 10 is not limited to the above steps (S102 to S110), and other steps may be performed before, after, or between any of the steps. In addition, some steps may be performed simultaneously, or in a different order than above.

In short, the touch panel 10 of this embodiment has a visible area R1 and a surrounding area R2 located on at least one side of the visible area R1. The visible area R1 and the surrounding area R2 of the touch panel 10 described herein may be Correct It should be in the visible region R1 and the surrounding region R2 of the first substrate 102 and/or the second substrate 202 described above. The touch panel 10 includes a first substrate 102, a first decoration layer 108, a non-conductive layer 106, a trace TR, and a touch element TD. The first decoration layer 108 is disposed on the surface 104 of the first substrate 102 and disposed in the surrounding area R2. The non-conductive layer 106 is disposed on the surface 104 of the first substrate 102 and in the surrounding area R2, wherein the first decorative layer 108 and the non-conductive layer 106 are disposed on the same horizontal plane HP, and the non-conductive layer 106 includes a transparent non-conductive material Or fluorescent materials. The trace TR is disposed in the surrounding area R2, the trace TR and the non-conductive layer 106 overlap in the vertical projection direction V perpendicular to the first substrate 102, and the touch element TD is disposed in the viewing area R1, where the trace TR and The touch element TD is electrically connected.

In addition, as shown in FIG. 5, the first substrate 102 and the second substrate 202 of this embodiment may both be glass substrates, so the touch panel 10 may be, for example, GG (glass-glass) type, but not limited to this . For example, in some embodiments, the first substrate 102 may be a glass substrate, and the second substrate 202 may be, for example, a film instead of a glass substrate or a rigid carrier board. Such a touch panel may, for example, GF (glass-material layer) type. In some embodiments, the first substrate 102 may be a glass substrate, the first sensing series and corresponding traces may be disposed on a material layer, and the second sensing series and corresponding traces may be It is disposed on another material layer, and the three are bonded to each other. Such a touch panel may be, for example, GFF (glass-material layer-material layer) type.

In this embodiment, since the non-conductive layer 106 is a non-conductive material, even if the trace TR and the non-conductive layer 106 are overlapped in the vertical projection direction V, the problem of electromagnetic interference (EMI) can be avoided In addition, the width of the surrounding area R2 can be further reduced to achieve a narrow bezel design.

The following will describe the remaining embodiments of the present invention, and to simplify the description, the following The description mainly focuses on the differences between the remaining embodiments and the above-mentioned embodiments, without repeating the similarities. In addition, the same elements in the remaining embodiments of the present invention as in the above-mentioned embodiments are marked with the same reference numerals to facilitate comparison between the embodiments.

Please refer to FIG. 6 to FIG. 8, which are schematic diagrams of the manufacturing method of the cover plate and the touch panel according to the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that the first decoration layer 108 is formed before the non-conductive layer 106 is formed in this embodiment. As shown in FIG. 6, the first decoration layer 108 is first formed on the first substrate 102 On the surface 104, the first decorative layer 108 has one or more openings 1083, and the graphics of these openings 1083 can correspond to the graphics of the marking pattern. Next, as shown in FIG. 7, after the first decoration layer 108 is formed, a non-conductive layer 106 is formed. The non-conductive layer 106 may fill the opening 1083 and cover the first decoration layer 108 in the vertical projection direction V. Therefore, the first decoration layer 108 is disposed between the first substrate 102 and the non-conductive layer 106 in the vertical projection direction V. The non-conductive layer 106 filled in the opening 1083 can be used as a marking pattern, and allows the user to observe the graphics and color of the marking pattern. Therefore, in this embodiment, the first decorative layer 108 and the non-conductive layer 106 are disposed on the same horizontal plane HP, that is, the first decorative layer 108 can be found at the same time in the cross section of the cover plate 20 cut with the horizontal plane HP与NON-conductive layer 106.

In addition, the manufacturing method of this embodiment may optionally include forming a second decoration layer 110 on the non-conductive layer 106, and the second decoration layer 110 may cover the non-conductive layer 106. In this embodiment, the non-conductive layer 106 may be disposed between the second decorative layer 110 and the first decorative layer 108, or other film layers may be disposed between the non-conductive layer 106 and the second decorative layer 110. The second decoration layer 110 of this embodiment can be used to increase the color saturation of the first decoration layer 108 or the non-conductive layer 106, but is not limited thereto. In addition, in a horizontal direction X, the first decorative layer 108 has a first width W1, the non-conductive layer 106 has a second width W2, and the second decorative layer 110 has a third width W3. In this embodiment, the first width W1 may be greater than the second width W2, and the second width W2 may be greater than the third width W3, and near the boundary between the surrounding area R2 and the viewing area R1, the first device A slope 112 may be formed on the sides of the decoration layer 108, the non-conductive layer 106, and the second decoration layer 110, but it is not limited thereto. In this embodiment, the horizontal direction X may be perpendicular to the vertical projection direction V, but it is not limited thereto.

Next, as shown in FIG. 8, similar to the above FIG. 5 and related descriptions, the cover plate 20 formed in FIG. 7 is bonded to the second substrate 202 through the adhesive layer 302, where the touch is formed on the second substrate 202 Component TD and trace TR. In this embodiment, the second decoration layer 110 is disposed between the non-conductive layer 106 and the trace TR, and the trace TR and the non-conductive layer 106 overlap in the vertical projection direction V.

Please refer to FIG. 9, which illustrates a schematic cross-sectional view of a touch panel according to a third embodiment of the present invention. The difference between this embodiment and the first embodiment is that the touch panel 10 of this embodiment may be, for example, a one glass solution (OGS) touch panel, in which the touch element TD and the trace TR are both disposed at On the first substrate 102. As shown in FIG. 9, after the structure of FIG. 3 is fabricated in this embodiment, step S108 is performed to form a trace TR on the first substrate 102 in the surrounding region R2, and S110 is performed in the visible region R1. The touch element TD is formed on the first substrate 102. In this embodiment, the trace TR is formed on the first decoration layer 108, for example, it directly contacts the surface 1081 of the first decoration layer 108, but it is not limited thereto. On the other hand, the touch element TD may directly contact the surface 104 of the first substrate 102, but not limited thereto. In other words, other film layers may also be provided between the first decoration layer 108 and the trace TR or between the first substrate 102 and the touch element TD. For another example, as shown in FIG. 9, one of the first sensing electrodes TE1 may extend from the visible area R1 to the surrounding area R2, and extend to the inclined surface 1082 of the first decoration layer 108 and a part of the surface 1081 to One of the traces TR is in contact, so that the trace TR is electrically connected to the touch element TD, but the method is not limited to this. In addition, the manufacturing method of the touch panel 10 of this embodiment further includes forming a protective layer 304 on the first substrate 102, wherein the protective layer 304 covers the touch element TD, the trace TR, the first decoration layer 108 and the non-conductive layer 106 That is, the touch element TD, the trace TR, the first decoration layer 108 and the non-conductive layer 106 are disposed between the first substrate 102 and the protective layer 304. The protective layer 304 may include a transparent insulating material, but not as limit.

Please refer to FIG. 10, which illustrates a schematic cross-sectional view of a touch panel according to a fourth embodiment of the present invention. The difference between this embodiment and the second embodiment is that the touch panel 10 of this embodiment can be, for example, a one glass solution (OGS) touch panel, in which the touch element TD and the trace TR are both disposed at On the first substrate 102. As shown in FIG. 10, after the structure of FIG. 7 is fabricated in this embodiment, step S108 and step S110 are performed to form a touch element TD and a trace TR on the first substrate 102, and another on the first substrate 102 The protective layer 304 is formed thereon in a manner similar to the third embodiment. However, unlike the third embodiment, the wiring TR of this embodiment is formed on the second decoration layer 110 so that the second decoration layer 110 is disposed between the non-conductive layer 106 and the wiring TR, and the wiring TR For example, it may directly contact the surface 1101 of the second decoration layer 110, but not limited thereto. In addition, near the boundary between the surrounding area R2 and the visible area R1, a slope 112 may be formed on the sides of the first decoration layer 108, the non-conductive layer 106, and the second decoration layer 110, and one of the first sensing electrodes TE1 may be visible from The region R1 extends to the surrounding region R2, and extends to the inclined surface 112 and part of the surface 1101 to contact one of the traces TR to electrically connect the trace TR to the touch element TD, but the method is not limited to this.

Please refer to FIG. 11, which illustrates a schematic cross-sectional view of a touch panel according to a fifth embodiment of the present invention. The difference between this embodiment and the fourth embodiment is that the touch panel 10 of this embodiment does not include a second decoration layer. As shown in FIG. 11, the trace TR of this embodiment is formed on the non-conductive layer 106, and the trace TR may directly contact the surface 1062 of the non-conductive layer 106, but not limited thereto. In addition, near the boundary between the surrounding area R2 and the visible area R1, a slope 114 may be formed on the sides of the first decoration layer 108 and the non-conductive layer 106, and one of the first sensing electrodes TE1 may extend from the visible area R1 to the surrounding area R2 extends to the inclined surface 114 and part of the surface 1062 to contact one of the traces TR to electrically connect the trace TR to the touch element TD, but the method is not limited to this.

In summary, according to the cover plate of the touch panel of the present invention, the touch panel and the manufacturing method thereof, non-conductive materials (such as transparent non-conductive materials or fluorescent materials) are used to form a logo pattern in the surrounding area. Through the manufacturing method of the present invention, a non-conductive layer and at least one decorative layer are provided in the surrounding area of the cover plate or touch panel, and the decorative layer and the non-conductive layer are arranged on the same horizontal plane, that is, cut out in a horizontal plane A decorative layer and a non-conductive layer can be found in the cross section at the same time. On the other hand, since the marking pattern is a non-conductive material, even if the wiring and the marking pattern are overlapped in the vertical projection direction, the problem of electromagnetic interference (EMI) can be avoided. In addition, Further reduce the width of the surrounding area to achieve a narrow border design. The concept of the present invention can be applied to cover plates or other types of touch panels such as OGS, GG, GF, and GFF.

The above are only the preferred embodiments of the present invention, and all changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the present invention.

10‧‧‧Touch panel

102‧‧‧The first substrate

104, 204‧‧‧surface

106‧‧‧Non-conductive layer

1061‧‧‧ opening

108‧‧‧The first decorative layer

1082‧‧‧Bevel

20‧‧‧Cover

202‧‧‧Second substrate

302‧‧‧ Adhesive layer

BR‧‧‧Bridge

HP‧‧‧horizontal

IN‧‧‧Insulation

R1‧‧‧Viewable area

R2‧‧‧ Surrounding area

TD‧‧‧Touch element

TE1‧‧‧First sensing electrode

TE2‧‧‧Second sensing electrode

TR‧‧‧Trace

V‧‧‧Vertical projection direction

X‧‧‧horizontal

Claims (13)

A touch panel has a visible area and a surrounding area located on at least one side of the visible area, and the touch panel includes: a first substrate; a first decorative layer disposed on a surface of the first substrate And disposed in the surrounding area; a non-conductive layer is disposed on the surface of the first substrate and in the surrounding area, wherein the first decorative layer and the non-conductive layer are disposed on the same horizontal plane, and the non-conductive The layer includes a transparent non-conductive material or a fluorescent material; a trace is provided in the surrounding area; and a touch element is provided in the viewing area, wherein the trace is electrically connected to the touch element, wherein the non-conductive The conductive layer is disposed between the first substrate and the first decoration layer in a vertical projection direction. The touch panel of claim 1, wherein the trace and the non-conductive layer overlap in the vertical projection direction perpendicular to the first substrate. The touch panel according to claim 1, wherein the touch element is disposed on the first substrate, and the trace is disposed on the first decoration layer. The touch panel according to claim 1, wherein the touch panel further comprises: a protective layer, wherein the touch element, the trace, the first decoration layer and the non-conductive layer are disposed on the first substrate and the Between protective layers. The touch panel as described in claim 1, further including: A second substrate, wherein the trace and the touch element are disposed on the second substrate; and an adhesive layer is disposed between the second substrate and the first substrate. A method for manufacturing a touch panel, comprising: providing a first substrate, wherein the first substrate defines a visible area and a surrounding area on at least one side of the visible area; one of the first substrates in the surrounding area A non-conductive layer is formed on the surface, wherein the non-conductive layer includes a transparent non-conductive material or a fluorescent material; a first decorative layer is formed on the surface of the first substrate in the surrounding area, wherein the first decorative layer and The non-conductive layer is disposed on the same horizontal plane; a trace is formed on the first substrate in the surrounding area or the surrounding area corresponding to the first substrate on a second substrate; and the first in the visible area A touch element is formed on the substrate or the viewable area corresponding to the first substrate on the second substrate, wherein the trace is electrically connected to the touch element, and the non-contact element is formed before the first decoration layer is formed A conductive layer, the non-conductive layer has an opening, the first decorative layer formed subsequently fills the opening, and the non-conductive layer is disposed between the first substrate and the first decorative layer in a vertical projection direction. The method for manufacturing a touch panel according to claim 6, wherein the trace and the non-conductive layer overlap in the vertical projection direction perpendicular to the first substrate. The method for manufacturing a touch panel according to claim 6, wherein the trace is formed on the first decoration layer. The method for manufacturing a touch panel according to claim 6, wherein the trace and the touch element are formed on the first substrate, and the manufacturing method further includes: forming a protective layer on the first substrate, wherein The protective layer covers the touch element, the trace, the first decoration layer and the non-conductive layer. The method for manufacturing a touch panel according to claim 6, wherein the trace and the touch element are formed on a surface of the second substrate, and the manufacturing method further includes: using a bonding layer to apply the first substrate Bonded to the second substrate, wherein the surface of the second substrate is disposed facing the surface of the first substrate. A cover plate of a touch panel has a visible area and a surrounding area on at least one side of the visible area, and the cover plate includes: a substrate; a decorative layer disposed on a surface of the substrate and on the surface The surrounding area; and a non-conductive layer disposed on the surface of the substrate and in the surrounding area, wherein the decorative layer and the non-conductive layer are disposed on the same horizontal plane, and the non-conductive layer includes a transparent non-conductive material or Fluorescent material, wherein the non-conductive layer is disposed between the first substrate and the first decoration layer in a vertical projection direction. A touch panel has a visible area and a surrounding area located on at least one side of the visible area, and the touch panel includes: a first substrate; a first decorative layer disposed on a surface of the first substrate And set in the surrounding area; A non-conductive layer is disposed on the surface of the first substrate and in the surrounding area, wherein the first decorative layer and the non-conductive layer are disposed on the same horizontal plane, and the non-conductive layer includes a transparent non-conductive material or fluorescent Optical material, wherein the first decorative layer is disposed between the first substrate and the non-conductive layer in a vertical projection direction; a trace is disposed in the surrounding area; and a touch element is disposed in the visible area , Wherein the trace is electrically connected to the touch element; and a second decoration layer is disposed between the non-conductive layer and the trace. A method for manufacturing a touch panel, comprising: providing a first substrate, wherein the first substrate defines a visible area and a surrounding area on at least one side of the visible area; one of the first substrates in the surrounding area A non-conductive layer is formed on the surface, wherein the non-conductive layer includes a transparent non-conductive material or a fluorescent material; a first decorative layer is formed on the surface of the first substrate in the surrounding area, wherein the first decorative layer and The non-conductive layer is arranged on the same horizontal plane, wherein the first decorative layer is formed before the non-conductive layer is formed, the first decorative layer has an opening, the non-conductive layer formed subsequently fills the opening, and the first decorative layer Disposed between the first substrate and the non-conductive layer in a vertical projection direction; forming a trace on the second substrate in the surrounding area or on the second substrate corresponding to the surrounding area of the first substrate A touch element is formed on the first substrate in the viewable area or the viewable area corresponding to the first substrate on the second substrate, wherein the trace is electrically connected to the touch element; and in the non- A second decorative layer is formed on the conductive layer, wherein the second decorative layer is disposed between the non-conductive layer and the trace.

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