TWI685422B - Heat dissipation label with high contrast color difference forming identification mark - Google Patents
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- TWI685422B TWI685422B TW108103701A TW108103701A TWI685422B TW I685422 B TWI685422 B TW I685422B TW 108103701 A TW108103701 A TW 108103701A TW 108103701 A TW108103701 A TW 108103701A TW I685422 B TWI685422 B TW I685422B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F2003/0257—Multilayer
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Abstract
一種具有高對比色差形成識別標示的散熱標籤,包含有一導熱基板、一顯亮層以及一對比層。該導熱基板由一金屬層及一包覆在該金屬層表面的導熱層所組成。該顯亮層覆蓋在該導熱基板的其中一表面上,由一第一絕緣層及一位於該第一絕緣層上的識別層所組成。該對比層覆蓋在該顯亮層上,由一位在該識別層上且呈透明狀的第二絕緣層及一位於該第二絕緣層上的遮蔽層所組成。其中,該遮蔽層可局部的在該第二絕緣層上被去除以形成一識別標示,使該識別層暴露在該識別標示中並與該遮蔽層之間形成該高對比色差。 A heat dissipation label with high contrast chromatic aberration forming an identification mark includes a thermally conductive substrate, a bright layer and a contrast layer. The heat conductive substrate is composed of a metal layer and a heat conductive layer covering the surface of the metal layer. The bright layer covers one surface of the thermally conductive substrate, and is composed of a first insulating layer and an identification layer on the first insulating layer. The contrast layer covers the bright layer and is composed of a transparent second insulating layer on the identification layer and a shielding layer on the second insulating layer. Wherein, the shielding layer can be partially removed on the second insulating layer to form an identification mark, so that the identification layer is exposed in the identification mark and forms the high contrast color difference with the shielding layer.
Description
本發明是有關一種散熱標籤,特別是指一種能夠形成有一識別標示,並使該識別標示具有高對比色差的散熱標籤。 The invention relates to a heat dissipation label, in particular to a heat dissipation label capable of forming an identification mark and making the identification mark have a high contrast color difference.
均溫片,為一導熱部件,用來作為高溫零組件的導熱,諸如在晶片組(chipset)、北橋(NB)、南橋(SB)、繪圖晶片(VGA chip)等零組件上會大量地使用均溫片來做為熱的傳導。 The temperature equalizing chip is a thermally conductive component used for heat conduction of high temperature components, such as chipset, north bridge (NB), south bridge (SB), graphics chip (VGA chip) and other components The temperature equalizing sheet is used for heat conduction.
由於高溫零組件在運作時會產生極高的溫度,因此透過該均溫片貼合於該高溫零組件上,可以有效地將該高溫零組件因高溫所產生的熱能透過該均溫片擴大散熱面積,以確保該高溫零組件不會因為過熱而影響效能或是損壞。因此在CPU散熱模組、主機板、數據機、LED散熱模組、平板電腦、筆記型電腦或是智慧型手機等等產品上,該均溫片為業界使用相當廣泛的導熱材料。 Since the high temperature component will generate extremely high temperature during operation, the temperature equalizing piece is attached to the high temperature component, and the heat energy generated by the high temperature component due to high temperature can be effectively expanded through the temperature equalizing piece to expand heat dissipation Area to ensure that the high temperature components will not affect performance or be damaged due to overheating. Therefore, in the CPU cooling module, motherboard, modem, LED cooling module, tablet computer, notebook computer or smart phone and other products, the temperature equalizer is a widely used thermal conductive material in the industry.
然而,傳統的該均溫片主要都是由高導熱的材料所製成,諸如金屬(如銅材)或是具有高導熱係數的矽膠等材料所製成,而當該均溫片應用於前述該些產品上時,往往無法直接在該均溫片上呈現如LOGO等具有識別意義的識別標示,而需要透過印刷(包含油墨印刷或是轉印)等方式將具有識別意義的識別標示印製於該均溫片的表層上,以達到識別標示的效果。 However, the conventional temperature equalizer is mainly made of materials with high thermal conductivity, such as metal (such as copper) or silicon rubber with high thermal conductivity, and when the temperature equalizer is applied to the aforementioned When these products are used, it is often impossible to directly display identification marks such as LOGO on the temperature-averaged film, and it is necessary to print the identification marks with identification meaning by printing (including ink printing or transfer). On the surface layer of the temperature-equalizing film, the effect of identifying and marking is achieved.
但,由於該均溫片經常應用於高溫環境,因此在使用一段時間後,往往容易造成油墨的熔解剝離,使該識別標示漸漸退化,最終更無法有效達到識別的效果。 However, since the temperature equalizing sheet is often used in a high-temperature environment, it is often easy to cause melting and peeling of the ink after a period of use, so that the identification mark gradually degrades, and ultimately the identification effect cannot be effectively achieved.
為此,本案申請人曾提出一種複合結構,編列中華民國公告第M569691號新型專利,其提供一種具有高對比色差形成識別標示的複合結構,該複合結構包含有一基材、一複合層以及一遮蔽層,該複合層可局部或全部的覆蓋在該基材的其中一表面上,且是由一易於識別顏色的材料所構成。該遮蔽層覆蓋在該複合層上,該遮蔽可局部的在該複合層上去除以形成一識別標示,使該複合層暴露在該識別標示中,並使該遮蔽層與該複合層具有一高對比的色差。 For this reason, the applicant of this case once proposed a composite structure, which was compiled with the new patent No. M569691 published by the Republic of China, which provides a composite structure with high contrast color difference to form an identification mark. The composite structure includes a substrate, a composite layer and a shield Layer, the composite layer can partially or completely cover one surface of the substrate, and is composed of a material that is easy to recognize the color. The shielding layer covers the composite layer, the shielding can be partially removed on the composite layer to form an identification mark, expose the composite layer to the identification mark, and make the shielding layer and the composite layer have a high Contrast color difference.
前述第M569691號專利,確實以改善既有均溫片無法有效進行識別標示的問題。然,本案申請人致力於該項技術的研究與開發,更提出本發明,以提供一種除了兼具散熱及辨識效果,同時能有效屏蔽電磁功效的散熱標籤。 The aforementioned Patent No. M569691 is indeed to improve the problem that the existing temperature equalizing film cannot be effectively identified and marked. However, the applicant in this case is committed to the research and development of this technology, and further proposes the present invention to provide a heat dissipation label that can effectively shield electromagnetic effects in addition to heat dissipation and identification effects.
本發明的主要目的,在於提供一種散熱標籤,特別是指一種在該散熱標籤上可局部的形成一具有高對比色差的識別標示,使該散熱標籤應用在SSD(固態硬碟)、CPU散熱模組、主機板、數據機、LED散熱模組、平板電腦、筆記型電腦或是智慧型手機等產品上時,無須再透過印刷方式印製識別標示,而令該識別標示能直接形成於該散熱標籤。 The main purpose of the present invention is to provide a heat dissipation label, in particular, an identification mark with high contrast color difference can be locally formed on the heat dissipation label, so that the heat dissipation label is applied to SSD (Solid State Drive), CPU heat dissipation model No need to print the identification mark by printing on the product such as the group, motherboard, modem, LED cooling module, tablet computer, notebook computer or smart phone, so that the identification mark can be directly formed on the cooling label.
為達上述目的,本發明一種具有高對比色差形成識別標示的散熱標籤,包含有一導熱基板、一顯亮層以及一對比層。該導熱基板由一 金屬層及一包覆在該金屬層表面的導熱層所組成。該顯亮層覆蓋在該導熱基板的其中一表面上,該顯亮層由一位在該導熱層上的第一絕緣層及一位於該第一絕緣層上的識別層所組成,且該識別層具有一第一顏色。該對比層覆蓋在該顯亮層上,該對比層由一位在該識別層上且呈透明狀的第二絕緣層及一位於該第二絕緣層上的遮蔽層所組成,且該絕緣層具有一與該第一顏色形成有高對比色差的第二顏色,其中該遮蔽層可局部的在該第二絕緣層上被去除以形成一識別標示,使該識別層暴露在該識別標示中並與該遮蔽層之間形成該高對比色差。 In order to achieve the above object, the present invention provides a heat dissipation label with high contrast color difference to form an identification mark, which includes a thermally conductive substrate, a bright layer and a contrast layer. The thermally conductive substrate consists of a The metal layer is composed of a heat conductive layer covering the surface of the metal layer. The bright layer covers one surface of the thermally conductive substrate, the bright layer is composed of a first insulating layer on the thermal conductive layer and an identification layer on the first insulating layer, and the identification The layer has a first color. The contrast layer covers the bright layer. The contrast layer is composed of a transparent second insulating layer on the identification layer and a shielding layer on the second insulating layer, and the insulating layer Having a second color with a high contrast color difference formed from the first color, wherein the masking layer may be partially removed on the second insulating layer to form an identification mark, so that the identification layer is exposed to the identification mark and The high-contrast color difference is formed with the shielding layer.
在一實施例中,該散熱標籤進一步更包含有一導熱背膠,該導熱背膠貼附在該導熱基板與該顯亮層相對的另一表面上。 In one embodiment, the heat dissipation label further includes a thermally conductive adhesive, which is attached to the other surface of the thermally conductive substrate opposite to the bright layer.
在一實施例中,該散熱標籤進一步更包含有一連接層,該連接層位在該導熱背膠的另一表面上並與該導熱基板相對。 In one embodiment, the heat dissipation label further includes a connection layer, which is located on the other surface of the thermally conductive adhesive and opposite to the thermally conductive substrate.
在一實施例中,該導熱背膠為一雙面膠。 In one embodiment, the thermally conductive adhesive is a double-sided adhesive.
在一實施例中,該金屬層是由一具有高導熱係數的金屬材料所製成,且該導熱層是以濺鍍的方式鍍敷在該金屬層上。 In one embodiment, the metal layer is made of a metal material with a high thermal conductivity, and the thermally conductive layer is plated on the metal layer by sputtering.
在一實施例中,該導熱層是由一石墨材料所形成。 In one embodiment, the thermally conductive layer is formed of a graphite material.
在一實施例中,該第一絕緣層與該第二絕緣層分別是由一PET(聚對苯二甲酸乙二醇)材料所形成。 In one embodiment, the first insulating layer and the second insulating layer are respectively formed of a PET (polyethylene terephthalate) material.
在一實施例中,,該識別層以電鍍方式鍍敷在該第一絕緣層上,該遮蔽層以電鍍方式鍍敷在該第二絕緣層上。 In one embodiment, the identification layer is electroplated on the first insulating layer, and the shielding layer is electroplated on the second insulating layer.
在一實施例中,該識別標示是利用雷射雕刻方式在該第二絕緣層上去除局部的該遮蔽層所形成。 In one embodiment, the identification mark is formed by removing part of the shielding layer on the second insulating layer by laser engraving.
在一實施例中,該散熱標籤進一步更包含有一印刷層,該印 刷層位在該遮蔽層上,並與該識別標示彼此相互間隔。 In one embodiment, the heat dissipation label further includes a printed layer, the printed The brush layer is located on the shielding layer and is spaced apart from the identification mark.
本發明具有高對比色差形成識別標示的散熱標籤,相較於習知技術具有下列的優點: The invention has a heat dissipation label with high contrast color difference to form an identification mark, which has the following advantages compared to the conventional technology:
1.該散熱標籤上可直接形成具有高對比色差的識別標示,使該散熱標籤兼具散熱及識別效果。 1. An identification mark with high contrast color difference can be directly formed on the heat dissipation label, so that the heat dissipation label has both heat dissipation and recognition effects.
2.當應用在電子產品上時,能夠透過該第一絕緣層與該第二絕緣層形成雙重的屏蔽效果,除了具有散熱的效果外,同時兼具屏蔽電磁的功效。 2. When applied to electronic products, it can form a double shielding effect through the first insulating layer and the second insulating layer. In addition to the heat dissipation effect, it also has the electromagnetic shielding effect.
3.可將複數該散熱標籤同時配置在該連結層上,且該連結層可做成捲帶式或是片狀式,以便於後續的安裝作業。 3. A plurality of the heat dissipation labels can be arranged on the connection layer at the same time, and the connection layer can be made into a tape or sheet type to facilitate subsequent installation operations.
10‧‧‧散熱標籤 10‧‧‧ Thermal label
20‧‧‧導熱基板 20‧‧‧ Thermally conductive substrate
21‧‧‧金屬層 21‧‧‧Metal layer
22‧‧‧導熱層 22‧‧‧thermal conductive layer
30‧‧‧顯亮層 30‧‧‧Highlight layer
31‧‧‧第一絕緣層 31‧‧‧First insulation layer
32‧‧‧識別層 32‧‧‧Identification layer
40‧‧‧對比層 40‧‧‧ contrast layer
41‧‧‧第二絕緣層 41‧‧‧Second insulation layer
42‧‧‧遮蔽層 42‧‧‧Occlusion layer
43‧‧‧識別標示 43‧‧‧Identification mark
50‧‧‧印刷層 50‧‧‧Printed layer
60‧‧‧連接層 60‧‧‧ connection layer
61‧‧‧導熱背膠 61‧‧‧thermal adhesive
圖1為本發明的立體示意圖。 FIG. 1 is a perspective schematic view of the present invention.
圖2為本發明的第一分解示意圖。 FIG. 2 is a first exploded schematic diagram of the present invention.
圖3為本發明的第二分解示意圖。 3 is a second exploded schematic diagram of the present invention.
圖4為本發明的剖面示意圖。 4 is a schematic cross-sectional view of the present invention.
圖5為本發明的使用狀態平面圖。 5 is a plan view of the use state of the present invention.
圖6為本發明的使用狀態立體圖。 6 is a perspective view of the present invention in use.
圖7為本發明另一實施態樣的分解示意圖。 7 is an exploded schematic view of another embodiment of the present invention.
有關本發明的詳細說明及技術內容,現就配合圖式說明如 下: The detailed description and technical content of the present invention will now under:
如圖1及圖4所示,本發明是一種具有高對比色差形成識別標示的散熱標籤,該散熱標籤10包含有一導熱基板20、一顯亮層30以及一對比層40。
As shown in FIGS. 1 and 4, the present invention is a heat dissipation label with high contrast chromatic aberration to form an identification mark. The
該導熱基板20包含有一金屬層21及一導熱層22,該金屬層21是由一高導熱係數的金屬材料所製成(如銅)。該導熱層22則是由熱傳導係數較好的石墨材料所形成(如石墨稀),且該導熱層22是利用濺鍍的方式鍍敷在該金屬層21的表面上,以包覆該金屬層21,能夠使該導熱層22與該金屬層21相互接合的表面之間具有更為良好的鏈結,而令該導熱基板20獲得較好的熱傳導效果。
The thermally
該顯亮層30包含有一第一絕緣層31以及一識別層32。該第一絕緣層31是由一具有絕緣特性的材料所組成,如PET(聚對苯二甲酸乙二醇)材料。該識別層32則是以電鍍的方式鍍敷在該第一絕緣層31上,且該識別層32具有一第一顏色。該顯亮層30是位在該導熱基板20的其中一表面上,也就是說該第一絕緣層31位在該導熱層22上,而該識別層32通過該第一絕緣層31與該導熱層22彼此相對。
The
該對比層40包含有一第二絕緣層41以及一遮蔽層42。該第二絕緣層41是由一具有絕緣特性的材料所組成,如PET(聚對苯二甲酸乙二醇)材料,且該第二絕緣層41呈一透明狀。該遮蔽層42則是以電鍍的方式直接鍍敷在該第二絕緣層41,且該遮蔽層42上具有一第二顏色,該遮蔽層42的顏色與該識別層32的顏色具有高對比色差,如該識別層32的該第一顏色是紅色、黃色、綠色、金色或銀色等高亮度的顏色,而該遮蔽層42的該第二
顏色是由深色(如墨色)或是白色等顏色呈現,以令該識別層32與該遮蔽層42之間形成該高對比色差。而該對比層40是披覆在該顯亮層30上,也就是說該第二絕緣層41位在識別層32上,該遮蔽層42則是通過該第二絕緣層41而與該識別層32相對。換言之,該識別層32會被夾持在該第一絕緣層31與該第二絕緣層41之間,如此一來可以確保該識別層32不會輕易地受到外力的碰撞而在該第一絕緣層31與該第二絕緣層41之間造成剝離的現象。
The
如圖3至圖6所示,該遮蔽層42進一步的可以在該第二絕緣層41上被局部的去除,去除該遮蔽層42的方式是採用雷射雕刻的方式進行,其主要是利用雷射光打在該遮蔽層42上,以將該遮蔽層42被雷射光打到的區域給去除,而使得該遮蔽層上42被局部去除的區域在該第二絕緣層41上形成一識別標示43。利用該雷射雕刻的方式所形成的該識別標示43,具有微型化的效果,目前該雷射雕刻技術最小線徑可達到0.1mm,如此一來不但可以應用在微小化的產品上,亦可將該識別標示43做各種不同的複雜的造型變化,該識別標示43可以做為LOGO、QR CODE或是產品型號等。
As shown in FIGS. 3 to 6, the
當該識別標示43被成型在該遮蔽層42上時,由於該識別層32的與該遮蔽層42之間具有該高對比色差,因此能夠使該識別層32的該第一顏色通過該識別標示43被顯示在該遮蔽層42上。再者,由於該識別層32是通過該第二絕緣層41而被顯露在該識別標示43內,因而顯露在該識別標示43內的該識別層32會受到該第二絕緣層41的保護,能夠有效的防止該識別層32的剝離,而保持該識別標示43的完整性。
When the
此外,本發明的該散熱標籤10,進一步亦可在該遮蔽層42未被去除的區域上,利用印刷的方式在該對比層上形成有一印刷層50,該
印刷層50可用來印製條碼等內容。如此一來,能夠令該遮蔽層42上除了通過該識別標示43外,同時能夠利用該印刷層50一同呈現更多的資訊,使該散熱標籤10上能夠揭露的產品資訊更為完整。
In addition, the
當該散熱標籤10被應用SSD(固態硬碟)、CPU散熱模組、主機板、數據機、LED散熱模組、平板電腦、筆記型電腦或是智慧型手機等產品上時,能夠通過該導熱基板20迅速的將該些產品運作時所產生出的熱能進行導引,以有效達到降溫的效果,同時能夠通過該識別標示43更為完整的揭露產品資訊,同時能夠通過該第一絕緣層31與該第二絕緣層41進行雙重電磁屏蔽的效果,令該散熱標籤10的適用性更為廣泛。
When the
最後,如圖4及圖7所示,該散熱標籤10進一步可以預先貼附在一連接層60上,該連接層60可以圖式中所示製作成片狀式外,亦可作為捲帶式,以將複數該散熱標籤10同時的貼附在該連接層60上,以便後續能夠應用在上述該些產品上。當該散熱標籤10預先貼附在該連接層60上時,主要是先利用一導熱背膠61,貼附在該導熱基板20相對於該顯亮層30的另一表面上,而該導熱背膠61為一雙面膠的態樣,因此能利用該導熱背膠61將該散熱標籤貼附在該連接層60上,進而令複數該散熱標籤10間隔的貼附在該連接層60上,以便於該散熱標籤10後續的安裝作業。
Finally, as shown in FIGS. 4 and 7, the
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述僅為本發明的較佳實施方式,自不能以此限制本案的申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所做之等校修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, so a patent application was filed in accordance with the law. However, the above is only a preferred embodiment of the present invention, and it cannot be used to limit the scope of patent application in this case. Anyone who is familiar with the skills of this case with the aid of other modifications or changes made in accordance with the spirit of the present invention should be covered by the following patent applications.
20‧‧‧導熱基板 20‧‧‧ Thermally conductive substrate
32‧‧‧識別層 32‧‧‧Identification layer
42‧‧‧遮蔽層 42‧‧‧Occlusion layer
43‧‧‧識別標示 43‧‧‧Identification mark
50‧‧‧印刷層 50‧‧‧Printed layer
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108103701A TWI685422B (en) | 2019-01-29 | 2019-01-29 | Heat dissipation label with high contrast color difference forming identification mark |
| CN201911069579.6A CN111491485B (en) | 2019-01-29 | 2019-11-04 | Heat dissipation label with high contrast colour difference forms discernment and marks |
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| Application Number | Priority Date | Filing Date | Title |
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| TW108103701A TWI685422B (en) | 2019-01-29 | 2019-01-29 | Heat dissipation label with high contrast color difference forming identification mark |
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| TWI685422B true TWI685422B (en) | 2020-02-21 |
| TW202028007A TW202028007A (en) | 2020-08-01 |
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| JP2022147620A (en) | 2021-03-23 | 2022-10-06 | キオクシア株式会社 | Memory system and label component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM538240U (en) * | 2016-05-19 | 2017-03-11 | Jian-Hao Chen | Heat dissipation sheet for integrated circuit |
| TWM569691U (en) * | 2017-06-22 | 2018-11-11 | 兆科科技有限公司 | Composite structure with high contrast color difference forming identification label |
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| JP4451534B2 (en) * | 2000-03-13 | 2010-04-14 | イビデン株式会社 | Laminated wiring board and manufacturing method thereof |
| TWI433389B (en) * | 2010-04-22 | 2014-04-01 | Taiwan Lamination Ind Inc | Packaging bag with radio frequency identification capability and its manufacturing method |
| KR101483850B1 (en) * | 2013-03-29 | 2015-01-16 | 삼성전기주식회사 | Board and manufacturing method thereof |
| KR101354577B1 (en) * | 2013-09-11 | 2014-01-22 | 박세두 | Method for manufacturing brand logo and trademark label using synthetic resins |
| CN203779968U (en) * | 2014-03-17 | 2014-08-20 | 艾美材料科技有限公司 | Layered structure of uniform temperature electromagnetic shielding material |
| CN105517423B (en) * | 2016-01-25 | 2018-06-19 | 衡山县佳诚新材料有限公司 | A kind of high heat conduction graphene heat radiating metal foil |
| CN106530948A (en) * | 2016-12-07 | 2017-03-22 | 北京华胜天成科技股份有限公司 | Cabinet equipment label |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM538240U (en) * | 2016-05-19 | 2017-03-11 | Jian-Hao Chen | Heat dissipation sheet for integrated circuit |
| TWM569691U (en) * | 2017-06-22 | 2018-11-11 | 兆科科技有限公司 | Composite structure with high contrast color difference forming identification label |
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| TW202028007A (en) | 2020-08-01 |
| CN111491485A (en) | 2020-08-04 |
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