TWI685144B - Surface-mount signal transceiver module with multi-signal feed-in - Google Patents

Abstract

A surface-mount signal transceiver module with multi-signal feed-in includes an antenna unit, a circuit board and a signal-integrating component. A radiation layer is arranged on a substrate front face of the antenna unit. A ground layer is arranged on a substrate back face. A first-feed-in line and a second-feed-in line are arranged on a substrate side face. A first-ground face arranged on a circuit-board front face is connected to the ground layer. A first contact and a second contact of the circuit board are connected to the first-feed-in line and the second-feed-in line respectively, and electrically connected to a fixing-connecting area of a circuit-board back face. The signal-integrating component is electrically connected to the fixing-connecting area, and connected to the first-feed-in line and the second-feed-in line through the first contact and the second contact respectively, to integrate signals sent through the first-feed-in line and the second-feed-in line.

Description

Multi-signal feed-in surface-adhered signal transceiver module

The invention relates to an antenna structure, in particular to a surface-adhered signal transceiver module capable of increasing the bandwidth of multiple signals.

It is known that the current pin antennas generally include a base body of ceramic material, the surface of the base body has a radiating metal sheet, the bottom surface of the base body has a grounding metal sheet, the base body, the radiating metal sheet and the grounding metal sheet are opened A perforation is provided to provide a T-shaped signal feed-through body to form a flat antenna structure that can be assembled on the motherboard. Another type of surface-adhesive PATCH is the surface-adhesive PATCH that is currently published. The antenna also has a base of ceramic material. The surface of the base has a radiating metal sheet. The bottom of the base has a grounding metal sheet. The base There is a feed line on the side of the feed line. One end of the feed line extends from the surface to form a coupling connection with the radiating metal sheet, and the other end extends from the bottom surface, but is not electrically connected to the ground metal sheet.

Since there is only one signal feed of the two types of flat antennas mentioned above, the receiving bandwidth of the flat antenna is narrow, so the receiving signal bandwidth is limited.

Therefore, the main purpose of the present invention is to solve the traditional shortcomings. In the present invention, two signal feeder lines are added to a single dielectric constant material antenna unit to form a circular polarized antenna with multiple signal feeds, and the antenna can be increased. bandwidth.

In order to achieve the above purpose, the present invention provides a multi-signal feed surface-adhered signal transceiver module, including: an antenna unit, a circuit board and a signal integration element. The antenna The unit has a base with a radiating layer on the front and a ground layer on the back; and a first feed line and a second feed line on the side of the base, the first feed line and the first One end of the two feeder lines respectively extends from the front surface to form a coupled electrical connection with the radiation layer, and the other end extends from the back surface of the base body without being electrically connected to the ground layer. The circuit board has a front surface and a back surface, the front surface has a first ground plane and a first contact and a second contact, the first ground plane is electrically connected to the ground layer, the first contact And the second contact are electrically connected to the first feed line and the second feed line, respectively; in addition, the first contact and the second contact pass through the fixed area of the circuit board and the back respectively Electrical connection. The signal integration element is electrically connected to the fixed area, so that the signal integration element is electrically connected to the first feed line and the second feed line through the first contact and the second contact, respectively. Wherein, the first feed line and the second feed line are arranged on the front, side and back of the base in a mutually perpendicular state, and are integrated by the signal integration element to be transmitted by the first feed line and the second feed line Signal.

In one embodiment of the present invention, the area of the radiation layer is smaller than the front surface of the substrate.

In an embodiment of the invention, the ground layer and the back surface have the same area.

In an embodiment of the invention, the first ground plane is cross-shaped.

In an embodiment of the invention, four sides of the first ground plane are adjacent to four second ground planes, and the second ground plane is electrically connected to the ground layer.

In an embodiment of the invention, the first contact and the second contact are each located between the two second ground planes.

In one embodiment of the present invention, the first contact and the second contact are arranged on the front surface of the circuit board in a mutually perpendicular state.

In one embodiment of the present invention, the signal integration element is electrically connected to a cable connector through the circuit board.

In one embodiment of the invention, the substrate is a ceramic material.

In order to achieve the above purpose, the present invention also provides a multi-signal feed-in surface-adhered signal transceiver module, including: an antenna unit, a metal housing, a circuit board and two conductive elements. The antenna unit has a base with a radiating layer on the front and a ground layer on the back; and a first feed line and a second feed line on the side of the base, the first feed line and One end of the second feed line respectively extends from the front surface to form a coupled electrical connection with the radiating layer, and the other end extends from the back surface of the base body without being electrically connected to the ground layer. The metal shell has a platform, the surface of the platform is electrically connected to the ground layer, a plurality of support pieces extending perpendicular to the platform are extended on the side of the platform, and each of the support pieces extends with a joint; In addition, the platform has two openings. The circuit board has two signal feeding points on the front side, the circuit board has a plurality of notches on the sides, the notches correspond to a ground part on the back of the circuit board, and the joint parts pass through The notches are electrically connected to the ground parts; at least one conductive part is provided on the back surface of the circuit board. The two conductive elements are electrically contacted between the first feed line and the second feed line and the two signal feed points of the circuit board. Wherein, the first feed line and the second feed line are provided on the front, side and back of the base body in a state perpendicular to each other, and the two openings are provided perpendicular to each other on the metal casing to make the two conductive elements The two openings are electrically contacted or electrically connected with the two signal feeding points of the circuit board.

In one embodiment of the present invention, the area of the radiation layer is smaller than the front surface of the substrate.

In an embodiment of the invention, the ground layer and the back surface have the same area.

In one embodiment of the present invention, electronic components are electrically connected to the front of the circuit board.

In one embodiment of the invention, the electronic component is composed of filters and amplifiers electrically connected.

In an embodiment of the invention, the electronic component is composed of a receiver module, a filter, and an amplifier electrically connected.

In one embodiment of the present invention, the joint portion is electrically connected to the ground portion by bending or directly passing through the concave portion of the circuit board.

In one embodiment of the present invention, the two conductive elements are made of metal material to make a line segment, a column, an elastic sheet or a spring.

In one embodiment of the invention, the conductive portion electrically connects the circuit board to the motherboard of an electronic device.

In one embodiment of the invention, the substrate is a ceramic material.

To achieve the above purpose, the present invention further provides a multi-signal feeding surface-adhesive signal transceiving module, which is surface-adhered to the circuit board, and includes: an antenna unit having a base on the front of the base It has a radiating layer and a ground layer on the back; another side has a first feed line and a second feed line on the side of the base body, one end of the first feed line and the second feed line extend on the front and The radiation layer forms a coupling electrical connection, and the other end extends on the back surface of the base body and is not electrically connected to the ground layer. Wherein, the first feed line and the second feed line are provided on the front, side and back of the base body in a state perpendicular to each other.

In one embodiment of the present invention, the area of the radiation layer is smaller than the front surface of the substrate.

In an embodiment of the invention, the ground layer and the back surface have the same area.

In one embodiment of the invention, the substrate is a ceramic material.

10‧‧‧Signal transceiver module

1‧‧‧ Antenna unit

11‧‧‧Matrix

12‧‧‧radiation layer

13‧‧‧Ground layer

14‧‧‧First feed line

15‧‧‧Second feed line

2‧‧‧ circuit board

21‧‧‧Front

22‧‧‧Back

23‧‧‧First ground plane

24‧‧‧Second ground plane

25‧‧‧First contact

26‧‧‧second contact

27‧‧‧Fixed area

3‧‧‧Signal integration component

4‧‧‧Metal shell

41‧‧‧Platform

42‧‧‧Supporting piece

43‧‧‧Joint

44‧‧‧ opening

5‧‧‧ circuit board

51‧‧‧Signal feed point

52‧‧‧Notch

53‧‧‧Ground

54‧‧‧Conducting Department

55‧‧‧filter

56‧‧‧Amplifier

57‧‧‧Receiver module

6‧‧‧Conductive element

7‧‧‧Electronic device

71‧‧‧Motherboard

8‧‧‧Cable connector

FIG. 1 is a schematic diagram of a signal transmitting and receiving module of the first embodiment of the present invention; FIG. 2 is an exploded schematic diagram of the signal transmitting and receiving module of the first embodiment of the present invention; FIG. 3 is a circuit board of FIG. 1 4 is a schematic diagram of the internal circuit of the signal integration element of the first embodiment of the invention; FIG. 5 is a schematic diagram of an equivalent circuit block of the signal transmission and receiving module of the first embodiment of the invention; FIG. 6, FIG. 7 is an exploded schematic diagram of the signal transceiver module of the second embodiment of the present invention; FIG. 7 is an exploded schematic diagram of the signal transceiver module of the second embodiment of the present invention; FIG. 8 is another exploded schematic view of the signal transceiving module of the second embodiment of the present invention; FIG. 9 is a schematic circuit block diagram of the signal transceiving module of the second embodiment of the present invention; FIG. 10 is the present invention FIG. 11 is a schematic diagram of another circuit block diagram of the signal transceiving module of the second embodiment; FIG. 11 is a schematic diagram of the connection of the signal transceiving module of the second embodiment of the present invention and the motherboard of the electronic device; FIG. 12 is the first of the present invention. A schematic side view of the connection between the signal transceiver module of the second embodiment and the motherboard of the electronic device.

The technical content and detailed description of the present invention are described below in conjunction with the drawings:

Please refer to FIGS. 1, 2, and 3, which are the assembly and disassembly of the signal transmitting and receiving module according to the first embodiment of the present invention and the back schematic view of the circuit board in FIG. As shown in the figure: the multi-signal feeding signal receiving and transmitting module 10 of the present invention includes: an antenna unit 1, a circuit board 2 and a signal integration element 3.

The antenna unit 1 has a base body 11 of ceramic material. The front surface of the base body 11 has a radiating layer 12. The area of the radiating layer 12 is smaller than the front surface of the base body 11. The back surface of the base body 11 has a ground layer 13. The ground layer 13 has the same area as the back surface. In addition, there are a first feed line 14 and a second feed line 15 on the side of the base 11, one end of the first feed line 14 and the second feed line 15 respectively extend on the front of the base 11 and the other end extend on the On the back surface of the base 11, the first feed line 14 and the second feed line 15 extend on the front surface to form a coupling electrical connection with the radiating layer 12, and the first feed extends on the back surface of the base 11 The incoming line 14 and the second feed line 15 are not electrically connected to the ground layer 13 on the back of the base 11. Wherein, the first feeding line 14 and the second feeding line 15 are provided on the front, side and back of the base 11 in a state perpendicular to each other.

The circuit board 2 has a front surface 21 and a back surface 22, and the front surface 21 has a cross-shaped first ground plane 23, four sides of the first ground plane 23 are adjacent to four second ground planes 24, The first ground plane 23 and the second ground plane 24 are electrically connected to the ground layer 13. There is a first contact 25 and a second contact 26 between the two second ground planes 24 respectively, the first contact 25 and the second contact 26 are respectively connected to the first feed line 14 and the The second feed line 15 is electrically connected. Wherein, the first contact 25 and the second contact 26 are arranged on the front surface 21 of the circuit board 2 in a mutually perpendicular state. In addition, the first contact 25 and the second contact 26 are electrically connected through the fixed area 27 of the circuit board 2 and the back surface 22 of the circuit board 2 respectively, and the fixed area 27 is electrically connected through the circuit board 2 The cable connector 8 is electrically connected.

The signal integration element 3 is electrically connected to the fixed area 27 so that the signal integration element 3 integrates the signal transmitted by the first feed line 14 and the second feed line 15 through the circuit board 2.

The antenna unit 1 is adhered to the circuit board 2 by means of surface adhesion technology, and the signal is transmitted to the signal integration element 3 on the circuit board 2 in a multi-signal feeding mode after integration processing and output to achieve multiple The signal is fed into the surface-adhered signal transceiver module 10.

Please refer to FIGS. 4 and 5, which are schematic diagrams of the internal circuit of the signal integration element of the first embodiment of the invention and the equivalent circuit block diagram of the signal transmission and reception module of the first embodiment; at the same time, refer to FIGS. 1-3. As shown in the figure: the signal transmitting and receiving module 10 of this creation is formed after the antenna unit 1 is electrically connected to the circuit board 2 and the signal integration element 3 is electrically connected to the fixed area 27 of the circuit board 2 The equivalent circuit of FIG. 4 is electrically connected by the first feed line 14 and the second feed line 15 via the circuit board 2 and the first pin 31 and the second pin 32 of the signal integration element (Hybrid) 3 , To form the frequency band used by GPS (such as 1575.42MHz). According to different requirements, the third pin 33 and the fourth pin 34 of the signal integration element 3 can be changed to the output of the two signal sources integrated into one signal source, and one of the pin positions (the third pin 33 or The fourth pin 34) output is used to control the antenna structural characteristics.

Please refer to FIGS. 6, 7 and 8, which are schematic diagrams of the combination and decomposition of the signal transceiving module according to the second embodiment of the present invention and another perspective. As shown in the figure: the second embodiment of the present invention differs from the first embodiment in that it has a metal casing 4, a circuit board 5 and two conductive elements 6.

The metal casing 4 has a platform 41 on the surface of which is electrically connected to the ground layer 13. A plurality of support plates 42 perpendicular to the platform 41 extend on the sides of the platform 41. Each of the supporting pieces 42 extends with a joint portion 43. The joint portions 43 are electrically connected to the ground portion 53 by bending or directly passing through the concave portion 52 of the circuit board 5. In addition, the platform 41 has two openings 44 for the two conductive elements 6 to electrically contact or electrically connect with the circuit board 5. The two openings 44 are perpendicular to each other on the metal shell 4.

The circuit board 5 is connected to electronic components (not shown in the figure) on the front side, and has two signal feeding points 51 at the same time. The two signal feeding points 51 make the two conductive elements 6 electrically contact or electrically To connect the signal to the filter (not shown) and amplifier (not shown), or receiver module (not shown), filter (not shown), amplifier ( (Not shown) in the circuit to form an active antenna signal transceiver module. In addition, each side of the circuit board 3 has a notch 52, the notches 52 correspond to a ground portion 53 corresponding to the back of the circuit board 5, and the joint portions 43 on the supporting pieces 42 The notches 52 bent or directly passing through the circuit board 5 are electrically connected to the ground portions 53. In addition, there is at least one conductive portion 54 on the back of the circuit board 5. The conductive portion 54 is for electrically connecting the circuit board 5 to the motherboard of the electronic device (shown in the figure).

The two conductive elements 6 are made of any one of wire segments, pillars, springs or springs made of metal materials, and electrically contact the first feed line 14 and the second feed line 15 on the back of the base 11 with the circuit board 5 between the two signal feeding points 51 to serve as two conductive elements 6 for signal feeding.

Please refer to FIGS. 9 and 10, which are schematic diagrams of the circuit block and another circuit block of the signal transceiving module according to the second embodiment of the invention. As shown in the figure: the circuit board 5 of the present invention has an electronic component circuit of a conventional circuit. The circuit includes: a filter 55 and an amplifier 56. The filter 55 is used to filter out the noise contained in the signal. The filtered signal is amplified by the amplifier 56 and transmitted to the motherboard of the electronic device to form an active antenna signal transceiver module. Or a circuit board 5 is additionally provided with a receiver module 57 (such as a GPS system circuit) and the filter 55 and the amplifier 56 are made on the same circuit board 5, the filter 55 is used to filter out the signal The entrained noise is amplified by the amplifier 56 after the filtered signal is transmitted to the receiver module 57. After the receiver module 57 processes the signal, the signal is transmitted to the motherboard of the electronic device (not shown) To form an active antenna signal transceiver module, so that the electronic device can display the relevant images or data of the satellite positioning system.

Please refer to FIGS. 11 and 12, which are schematic diagrams of the connection and the connection side view of the signal transceiving module of the second embodiment of the present invention and the motherboard of the electronic device. As shown in the figure: the metal shell 4 is electrically connected to the ground layer 13 on the back of the base 11, and the joint 43 on the support piece 42 is connected to the recess 52 of the circuit board 5 and electrically connected to the ground 53 Sexual connection. At the same time, the first feeding line 14 and the second feeding line 15 of the base 11 are electrically contacted or electrically connected to the two conductive elements 6 between the two signal feeding points 51 of the circuit board 5.

After the signal transceiver module 10 is assembled, the conductive portion 54 on the back of the circuit board 5 is electrically connected to the motherboard 71 of the electronic device 7, so that the signal transceiver module 10 is electrically connected to the surface of the motherboard 71 on.

Due to the redesign of the signal transceiving module 10, the entire structure of the signal transceiving module 10 is more simplified and thinner, so that the signal transceiving module 10 forms a circular polarization with multiple signal feeds Antenna, and can increase the antenna bandwidth.

However, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of patent protection of the present invention, so any equivalent changes in the description or drawings of the present invention are included in the rights of the present invention in the same way. Within the scope of protection, Chen Ming.

10‧‧‧Signal transceiver module

1‧‧‧ Antenna unit

12‧‧‧radiation layer

13‧‧‧Ground layer

14‧‧‧First feed line

15‧‧‧Second feed line

2‧‧‧ circuit board

21‧‧‧Front

22‧‧‧Back

23‧‧‧First ground plane

24‧‧‧Second ground plane

25‧‧‧First contact

26‧‧‧second contact

3‧‧‧Signal integration component

8‧‧‧Cable connector

Claims (15)

A multi-signal feed-in surface-adhered signal transceiver module includes: an antenna unit having a base body of ceramic material on the front surface of the base body with a radiation layer and a ground layer on the back surface; The side has a first feed line and a second feed line, one end of the first feed line and the second feed line respectively extend from the front to form a coupling electrical connection with the radiation layer, and the other end extends from the back of the base Is not electrically connected to the ground layer; a circuit board has a front side and a back side, the front side has a first ground plane and a first contact and a second contact, the first ground plane Electrically connected to the ground layer, the first contact and the second contact are electrically connected to the first feed line and the second feed line, respectively; in addition, the first contact and the second contact are respectively The circuit board is electrically connected to the fixed area on the back; the first ground plane is cross-shaped, and four sides of the first ground plane are adjacent to the four second ground planes. The ground layer is electrically connected, the first contact and the second contact are each located between the two second ground planes, and the first contact and the second contact are provided on the circuit board in a state perpendicular to each other On the front of the; a signal integration element is electrically connected to the fixed area, so that the signal integration element through the first contact and the second contact with the first feed line and the second feed line Electrical connection; wherein, the first feed line and the second feed line are arranged on the front, side and back of the base body in a mutually perpendicular state, and the first feed line and the second feed line are integrated by the signal integration element The signal transmitted by the feed line. The signal transceiver module as described in item 1 of the patent application, wherein the area of the radiation layer is smaller than the front surface of the substrate. The signal transceiver module as described in item 1 of the patent application scope, wherein the ground layer and the back surface have the same area. The signal transceiving module as described in item 1 of the patent application scope, wherein the signal integration element is electrically connected to a cable connector through the circuit board. A multi-signal feed-in surface-adhered signal transceiving module includes: an antenna unit with a base on the front of the base having a radiating layer and a ground on the back; and on the side of the base A first feed line and a second feed line, one end of the first feed line and the second feed line respectively extend from the front surface to form a coupling electrical connection with the radiating layer, and the other end extends on the back surface of the substrate Not electrically connected to the ground layer; a metal case with a platform on it, the surface of the platform is electrically connected to the ground layer, and a plurality of support pieces extending perpendicular to the platform are extended on the side of the platform , Each of the support pieces extends with a joint; another has two openings on the platform; a circuit board is provided with two signal feeding points on the front, the circuit board has a plurality of notches on the sides, the notches Corresponding to the back side of the circuit board, there is a ground part, the joint parts are electrically connected to the ground parts through the notches; on the back side of the circuit board, there are at least one conductive part; two conductive elements, Electrically contacting between the first feed line and the second feed line and the two signal feed points of the circuit board; wherein, the first feed line and the second feed line are provided in the state perpendicular to each other The front surface, the side surface and the back surface of the base body, and the two openings are arranged perpendicular to each other on the metal casing, so that the two conductive elements are in electrical contact or electrical contact with the two signal feeding points of the circuit board through the two openings Sexual connection. The signal transceiver module as described in item 5 of the patent application, wherein the area of the radiation layer is smaller than the front surface of the substrate. The signal transceiver module as described in item 5 of the patent application scope, wherein the ground layer and the back surface have the same area. The signal transceiving module as described in item 5 of the patent application scope, wherein the front surface of the circuit board is electrically connected with electronic parts. The signal transceiving module as described in item 8 of the patent application scope, wherein the electronic component is composed of filters and amplifiers electrically connected. The signal transceiver module as described in item 8 of the patent application scope, wherein the electronic component is composed of a receiver module, a filter, and an amplifier electrically connected. The signal transceiving module as described in item 5 of the patent application scope, wherein the joint portion is electrically connected to the ground portion by bending or directly passing through the concave portion of the circuit board. The signal transceiving module as described in item 5 of the patent application scope, wherein the two conductive elements are made of metal materials and are made of wire segments, columns, springs or springs. The signal transceiving module as described in item 5 of the patent application range, wherein the conductive portion electrically connects the circuit board to the motherboard of an electronic device. The signal transceiver module as described in item 5 of the patent application scope, wherein the substrate is a ceramic material. A multi-signal feed-in surface-adhered signal transceiving module, which is surface-adhered to a circuit board, includes: an antenna unit having a substrate of ceramic material on the front, a radiation layer on the front and a back on the back A ground layer, the area of the radiation layer is smaller than the front surface of the base body, the ground layer and the back surface are the same area; on the side of the base body there is a first feed line and a second feed line, the first feed line And one end of the second feed line respectively extends on the front surface to form a coupling electrical connection with the radiation layer, and the other end extends on the back surface of the base body without being electrically connected with the ground layer; wherein, the first feed line and The second feed line is provided on the front, side and back of the base body in a mutually perpendicular state.

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