TWI674415B - Detecting device and method thereof - Google Patents
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- 230000007547 defect Effects 0.000 claims description 5
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- 239000010408 film Substances 0.000 description 3
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- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
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Abstract
一種檢測裝置及方法。檢測裝置包括:第一線圈,此第一線圈於待測物的上方產生第一磁場;第三線圈,此第三線圈於此待測物的下方產生第三磁場;第二線圈,此第二線圈產生第二磁場;第四線圈,此第四線圈接收該第二磁場,感應為電壓,此電壓經由放大電路,驅動該第三線圈,其中該第一磁場與該第三磁場產生之電流為同向。 A detection device and method. The detection device includes: a first coil, which generates a first magnetic field above the object to be measured; a third coil, which generates a third magnetic field below the object to be measured; a second coil, which is the second The coil generates a second magnetic field; the fourth coil receives the second magnetic field and induces a voltage, and the voltage drives the third coil through the amplifying circuit, wherein the current generated by the first magnetic field and the third magnetic field is In the same direction.
Description
本揭露是有關於一種檢測裝置及方法。 The disclosure relates to a detection device and method.
利用捲對捲(Roll to Roll,R2R)製程來製作電子產品的技術越來越蓬勃,例如:軟性印刷電路板、導電薄膜、…等。其中,導電薄膜會塗佈或印刷在基板上,且導電薄膜之片電阻的特性(例:均勻性、導電率、導磁率、厚度)與缺陷將直接影響到後續電子產品的優劣表現,因此必須針對塗佈所形成之導電薄膜的片電阻進行量測。 The roll-to-roll (R2R) process is used to make electronic products more and more vigorous, such as: flexible printed circuit boards, conductive films, etc. Among them, the conductive film will be coated or printed on the substrate, and the characteristics of the sheet resistance of the conductive film (such as uniformity, conductivity, magnetic permeability, thickness) and defects will directly affect the pros and cons of the subsequent electronic products, so it must be The sheet resistance of the conductive thin film formed by the coating is measured.
非接觸式量測裝置須在不破壞待測樣品的情況下,檢測出待測樣品的特性與缺陷。非接觸式檢測裝置的感應方式,有一種是利用渦電流(eddy current)原理來進行感測。現有使用單邊渦電流探頭的檢測方式,易受待測物的位移(例:非靜態)影響,且當用於大尺寸樣品檢測時,探頭的連線需配合大尺寸機構限制,而過長導線亦因動態機台的扯動或振動,易 造成量測誤差問題,例如:電阻數值或導磁率有誤差。 The non-contact measurement device must detect the characteristics and defects of the test sample without damaging the test sample. One of the sensing methods of the non-contact detection device is to use the eddy current principle for sensing. Existing detection methods using unilateral eddy current probes are easily affected by the displacement of the object to be measured (e.g. non-static), and when used for detection of large-sized samples, the connection of the probe must be limited by the large-sized mechanism, and it is too long The wires are also easy to be pulled or vibrated by the dynamic machine. Causes measurement error problems, such as errors in resistance values or permeability.
本揭露係有關於一種檢測裝置及方法。 The disclosure relates to a detection device and method.
根據本揭露一實施例,提出一檢測裝置。此檢測裝置包括:第一線圈,此第一線圈於待測物的上方產生第一磁場;第三線圈,此第三線圈於此待測物的下方產生第三磁場;第二線圈,此第二線圈產生第二磁場;第四線圈,此第四線圈接收該第二磁場,感應為電壓,此電壓經由放大電路,驅動該第三線圈,其中該第一磁場與該第三磁場產生之電流為同向。 According to an embodiment of the disclosure, a detection device is proposed. The detection device includes: a first coil, which generates a first magnetic field above the object to be tested; a third coil, which generates a third magnetic field below the object to be measured; a second coil, which The two coils generate a second magnetic field; the fourth coil receives the second magnetic field and induces a voltage, and the voltage drives the third coil through the amplifying circuit, wherein the first magnetic field and the current generated by the third magnetic field For the same direction.
根據本揭露一實施例,提出另一檢測裝置。此檢測裝置包括:第一線圈組,此第一線圈組經由主電路,於待測物的上方產生主磁場;第二線圈組,此第二線圈組經由副電路,於此待測物的下方產生副磁場,其中該主磁場與該副磁場產生之電流同向。 According to an embodiment of the present disclosure, another detection device is proposed. The detection device includes: a first coil group, which generates a main magnetic field above a test object via a main circuit; a second coil group, which passes through a secondary circuit, below the test object via a secondary circuit A secondary magnetic field is generated, wherein the main magnetic field is in the same direction as the current generated by the secondary magnetic field.
根據本揭露一實施例,另提出一檢測方法。此檢測方法包括以下步驟:提供第一交流電流,經由主電路透過一第一線圈組,於待測物的上方產生主磁場;提供第二交流電流,經由副電路透過第二線圈組,於此待測物的下方產生副磁場,其中該主磁場與該副磁場產生之電流同向。 According to an embodiment of the present disclosure, another detection method is proposed. The detection method includes the following steps: providing a first alternating current through a first coil group through a main circuit to generate a main magnetic field above the object to be measured; providing a second alternating current passing through a second coil group through a secondary circuit; A secondary magnetic field is generated below the object to be measured, and the main magnetic field is in the same direction as the current generated by the secondary magnetic field.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉若干實施範例,並配合所附圖式,作詳細說明如下: In order to have a better understanding of the above and other aspects of the present invention, a number of implementation examples are given below, and in conjunction with the accompanying drawings, the detailed description is as follows:
1‧‧‧檢測裝置 1‧‧‧detection device
101‧‧‧鐵心 101‧‧‧ Iron core
102‧‧‧非導電基板 102‧‧‧non-conductive substrate
103‧‧‧待測物 103‧‧‧DUT
L1‧‧‧第一組線圈之上線圈 L1‧‧‧ Coil above the first coil
L3‧‧‧第一組線圈之下線圈 L3‧‧‧Coil under the first coil
L2‧‧‧第二組線圈之上線圈 L2‧‧‧ Coil on the second set of coils
L4‧‧‧第二組線圈之下線圈 L4‧‧‧The coil under the second group of coils
Q1、Q2、Q3‧‧‧放大器 Q1, Q2, Q3 ‧‧‧ amplifier
I1、I3‧‧‧電流 I1, I3‧‧‧ current
104‧‧‧交流至直流轉換器 104‧‧‧AC to DC Converter
105‧‧‧誤差增幅器 105‧‧‧ Error Amplifier
106‧‧‧振幅電壓調制器 106‧‧‧Amplitude Voltage Modulator
107‧‧‧放大器 107‧‧‧ amplifier
108‧‧‧電流感測器 108‧‧‧Current sensor
K‧‧‧基準電壓 K‧‧‧ reference voltage
201‧‧‧電流放大器 201‧‧‧Current Amplifier
202‧‧‧電壓增益調整器 202‧‧‧Voltage Gain Adjuster
203‧‧‧電壓放大器 203‧‧‧Voltage Amplifier
301‧‧‧主電路 301‧‧‧main circuit
302‧‧‧副電路 302‧‧‧Sub-circuit
第1圖繪示本揭露檢測裝置之一實施範例的方塊示意圖。 FIG. 1 is a block diagram of an embodiment of the detection device of the disclosure.
第2圖繪示本揭露檢測裝置之一實施範例的線路示意圖。 FIG. 2 is a schematic circuit diagram of an embodiment of the detection device of the disclosure.
第3圖繪示本揭露檢測方法之一實施範例的流程圖。 FIG. 3 is a flowchart illustrating an implementation example of the disclosure detection method.
第4圖繪示本揭露檢測方法之一實施範例的磁位模擬圖。 FIG. 4 is a magnetic position simulation diagram of an embodiment of the detection method of the disclosure.
本揭露之一實施範例使用兩組上下線圈,第一組上下線圈產生上下對稱磁場降低振動之影響,第二組上下線圈作為訊號磁耦合,以降低線圈上下串接線路過長受干擾之影響。本揭露之線圈可是電感、電路板繞線或是線圈等效電感L,但不以此些為限。 One embodiment of the disclosure uses two sets of upper and lower coils. The first set of upper and lower coils generate a symmetrical magnetic field to reduce the influence of vibration, and the second set of upper and lower coils are used as a signal magnetic coupling to reduce the influence of excessively long serial lines on the coils. The coil disclosed in this disclosure may be an inductor, a circuit board winding, or a coil equivalent inductance L, but it is not limited to these.
請參照第1圖,其繪示本揭露檢測裝置1之一實施範例方塊圖之示意圖。其中,待測物103(例:導電樣品,可為薄膜)塗佈或印刷於非導電基板102之上。此檢測裝置1包含兩組上下線圈,第一組上下線圈分別為L1、L3,第一組上下線圈L1、L3係為平形;第二組上下線圈分別為L2、L4,第二組上下線圈L2、L4係為平形。其中,第一組上線圈L1與第 二組上線圈L2可形成第一線圈組,第一組下線圈L3與第二組下線圈L4可形成第二線圈組。檢測裝置1之探頭(包括線圈L1、L3及L2、L4)與待測物103為非接觸式,不會破壞待測物103。 Please refer to FIG. 1, which is a schematic diagram illustrating a block diagram of an implementation example of the detection device 1 of the present disclosure. Among them, the object to be measured 103 (eg, a conductive sample, which may be a thin film) is coated or printed on the non-conductive substrate 102. This detection device 1 includes two sets of upper and lower coils, the first group of upper and lower coils are L1 and L3, the first group of upper and lower coils L1 and L3 are flat; the second group of upper and lower coils are L2 and L4, and the second group of upper and lower coils L2 The L4 series is flat. Among them, the first coil L1 and the first coil The upper coil L2 of the two groups may form a first coil group, and the lower coil L3 of the first group and the lower coil L4 of the second group may form a second coil group. The probes (including the coils L1, L3, L2, and L4) of the detection device 1 and the test object 103 are non-contact and will not damage the test object 103.
第一組上線圈L1於待測物103上方藉由一交流電產生主磁場,第一組下線圈L3於待測物103的下方藉由一交流電產生副磁場,藉由主磁場與副磁場於上下線圈間產生一均勻磁場,此均勻磁場之磁力線與待測物103垂直,且此均勻磁場為一交變磁場,可抵銷檢測時待測物103因振動而產生之量測誤差。此主磁場與副磁場為對稱。在一實施範例中,L1、L2、L3、以及L4線圈之鐵心係為片狀或柱狀;在一實施範例中,L1、L2、L3、以及L4線圈分別可為橫向繞線;在一實施範例中,L1、L2、L3、以及L4線圈分別可為複數個。 The upper coil L1 of the first group generates a main magnetic field by an alternating current above the DUT 103, and the lower coil L3 of the first group generates a secondary magnetic field by an AC current below the DUT 103, and the main magnetic field and the secondary magnetic field are above and below the A uniform magnetic field is generated between the coils. The magnetic field lines of the uniform magnetic field are perpendicular to the object to be measured 103, and the uniform magnetic field is an alternating magnetic field, which can offset the measurement error caused by the object 103 due to vibration during detection. This primary magnetic field is symmetrical to the secondary magnetic field. In one embodiment, the cores of the L1, L2, L3, and L4 coils are sheet or columnar. In one embodiment, the L1, L2, L3, and L4 coils may be laterally wound. In the example, the L1, L2, L3, and L4 coils may be plural.
第1圖中,交流至直流轉換器104、誤差增幅器105、振幅電壓調制器106與放大器107形成一主電路301,為本揭露之一實施範例。第一組上線圈L1與第二組上線圈L2經放大器107形成正回授,放大器107可由兩功率放大器所組成,相互反饋而形成正回授自振盪,兩功率放大器可參考第2圖之Q1與Q2,在一實施範例中,係為成對所組成,第2圖繪示本揭露檢測裝置之一實施範例線路圖之示意圖。其中,Q1與Q2不受限於僅NMOS或PMOS,只要可形成正回授自振盪之放大器均可。在一實施範例中,Q1與Q2為電流放大器; 在另一實施範例中,Q1與Q2為功率放大器,但並不以此些為限。 In FIG. 1, the AC-to-DC converter 104, the error amplifier 105, the amplitude voltage modulator 106, and the amplifier 107 form a main circuit 301, which is an exemplary embodiment of the disclosure. The upper coil L1 of the first group and the upper coil L2 of the second group form a positive feedback through the amplifier 107. The amplifier 107 may be composed of two power amplifiers, which feedback each other to form a positive feedback self-oscillation. The two power amplifiers can refer to Q1 in Fig. 2 And Q2, in an implementation example, are formed in pairs. FIG. 2 is a schematic diagram of a circuit diagram of an implementation example of the detection device of the disclosure. Among them, Q1 and Q2 are not limited to only NMOS or PMOS, as long as they can form an amplifier with positive feedback self-oscillation. In an implementation example, Q1 and Q2 are current amplifiers; In another embodiment, Q1 and Q2 are power amplifiers, but not limited to these.
第1圖中,電流放大器201、電壓增益調整器202與電壓放大器203形成一副電路302,副電路302為一放大電路,為本揭露之一實施範例。在一實施範例中,電壓放大器203可為多級放大器。放大器107輸出電流驅動線圈L1、L2經由放大器107產生一交變磁場,第二組上線圈L2產生一第二磁場,由第二組下線圈L4接收此磁場後,感應一電壓(即,感應電壓);此感應電壓經電壓放大器203及電壓增益調整器202放大電壓後,輸出訊號至電流放大器201,電流放大器201驅動電流I3流入第一組下線圈L3,且電流放大器201同時驅動電流I1流入第一組上線圈L1,I1與I3電流為同方向(即分別同為順時針方向流入線圈L1與L3;或電流同為逆時針方向流入線圈L1與L3)。請參考第4圖。 In FIG. 1, the current amplifier 201, the voltage gain adjuster 202, and the voltage amplifier 203 form a sub-circuit 302. The sub-circuit 302 is an amplifying circuit, which is an exemplary embodiment of the disclosure. In one embodiment, the voltage amplifier 203 may be a multi-stage amplifier. The output current of the amplifier 107 drives the coils L1 and L2 to generate an alternating magnetic field through the amplifier 107. A second magnetic field is generated by the upper coil L2 of the second group. After receiving this magnetic field by the lower coil L4 of the second group, a voltage (i.e., the induced voltage) is induced. ); This induced voltage is amplified by the voltage amplifier 203 and the voltage gain adjuster 202 to output a signal to the current amplifier 201. The current amplifier 201 drives the current I3 into the first lower coil L3, and the current amplifier 201 simultaneously drives the current I1 into the first A set of upper coils L1, I1 and I3 currents are in the same direction (that is, they are also clockwise flowing into coils L1 and L3; or currents are also flowing in counterclockwise directions into coils L1 and L3). Please refer to Figure 4.
當第一組上下線圈L1、L3間之交變磁場(亦可為均勻磁場)通過待測物103時,待測物103將感應出一渦電流;且渦電流的大小和待測物103的特性相關,待測物103的特性,例如:均勻度、導電率、導磁率、厚度與缺陷等有關。此外,待測物103所感應出的渦電流會輻射出一二次磁場,以抵抗第一組上下線圈L1、L3所產生之交變磁場(亦即一次磁場)的變化,故而產生渦電流之變化。而待測物103二次磁場的變化,將轉換為第一組上線圈L1之交流電流變化值,此變化值 由與L1、L2串接之電流感測器108轉換為檢測訊號輸出。 When the alternating magnetic field (also a uniform magnetic field) between the upper and lower coils L1 and L3 of the first group passes through the test object 103, the test object 103 will induce an eddy current; and the magnitude of the eddy current is the same as that of the test object 103. The characteristics are related. The characteristics of the DUT 103, such as: uniformity, electrical conductivity, magnetic permeability, thickness, and defects are related. In addition, the eddy current induced by the test object 103 will radiate a secondary magnetic field to resist the change of the alternating magnetic field (that is, the primary magnetic field) generated by the first set of upper and lower coils L1 and L3, so the eddy current will be generated. Variety. The change of the secondary magnetic field of the DUT 103 will be converted into the AC current change value of the coil L1 on the first group, and this change value The current sensor 108 connected in series with L1 and L2 is converted into a detection signal output.
渦電流變化為一交流訊號,在一實施範例中,此交流訊號經由放大器107輸出送至交流至直流轉換器104轉為直流訊號,於誤差增幅器105將輸入基準電壓K及交流至直流轉換器104輸出之直流訊號相減後,透過振幅電壓調制器106傳回放大器107形成負回授;自放大器107輸出、經交流至直流轉換器104、進入誤差增幅器105、再透過振幅電壓調制器106所形成之負回授,為一閉迴電路;此閉迴電路控制第一組上下線圈L1、L3線圈振盪電壓振幅於定值,基準電壓K之大小左右此定值之大小,K為一定值,且K可配合待測物而決定。當此負回授回路達穩態時,第一組上線圈L1之交流電壓振幅為一定值。 The eddy current changes into an AC signal. In one embodiment, this AC signal is sent to the AC-to-DC converter 104 through the output of the amplifier 107 and converted to a DC signal. The error amplifier 105 converts the input reference voltage K and the AC-to-DC converter After the DC signal output from 104 is subtracted, it is transmitted back to the amplifier 107 through the amplitude voltage modulator 106 to form a negative feedback; the output from the amplifier 107, passed through the AC to DC converter 104, enters the error amplifier 105, and then passes through the amplitude voltage modulator 106. The formed negative feedback is a closed-loop circuit; this closed-loop circuit controls the amplitude of the oscillation voltage of the first group of upper and lower coils L1 and L3 to a fixed value, and the magnitude of the reference voltage K is about this fixed value, K is a certain value , And K can be determined according to the test object. When the negative feedback loop reaches a steady state, the AC voltage amplitude of the coil L1 on the first group is a certain value.
第2圖為本揭露檢測裝置之一實施例之線路示意圖,第一組上線圈L1與第二組上線圈L2(即第一線圈組)經兩放大器Q1、Q2形成正回授自振盪;功率放大器(即第1圖之107)輸出電流驅動第一組上線圈L1與第二組上線圈L2產生一交變磁場,第二組上線圈L2產生磁場由第二組下線圈L4接收磁訊號後轉為感應電壓,此感應電壓經放大電路,(例:放大器Q3放大,即第1圖之201與203)驅動第一組下線圈L3與第一組上線圈L1產生同方向電流,放大器Q3之輸出端電流可使位於待測物103的上下方之上下線圈產生交流電流變化;待測物103所感應出的渦電流會輻射出二次磁場,以抵 抗第一組上下線圈L1、L3所產生之交變磁場的變化,功率放大器Q1之輸出送至交流至直流轉換器104轉為直流訊號,誤差增幅器105將基準電壓K與交流至直流轉換器104輸出之直流訊號差值相減後,透過振幅電壓調制器106輸出至放大器Q1成負回授之閉迴路;此閉迴路控制線圈L1振盪電壓振幅控制於定值,於此負回授回路達穩態時,第一組上線圈L1交流電壓振幅為一定值,而待測物103二次磁場的變化,將轉換為第一組上線圈L1之交流電流變化值,此變化值由電流感測器108轉換為檢出訊號。在一實施範例中,Q3為電流放大器;在另一實施範例中,Q3為功率放大器;再一實施範例中,Q3為電壓放大器;但並不以此些為限。 FIG. 2 is a schematic circuit diagram of an embodiment of the detection device. The first coil L1 and the second coil L2 (ie, the first coil group) form positive feedback self-oscillation through two amplifiers Q1 and Q2; power The output current of the amplifier (ie, 107 in the first figure) drives the upper coil L1 of the first group and the upper coil L2 of the second group to generate an alternating magnetic field. It is converted into induced voltage. This induced voltage is amplified by the amplifying circuit (for example: amplifier Q3 is amplified, that is, 201 and 203 in the first figure). The output current can cause an alternating current change in the coils above and below the DUT 103; the eddy current induced by the DUT 103 will radiate a secondary magnetic field to resist Resistance to the change of the alternating magnetic field generated by the first set of upper and lower coils L1 and L3. The output of the power amplifier Q1 is sent to the AC-to-DC converter 104 and converted to a DC signal. The error amplifier 105 converts the reference voltage K and the AC-to-DC converter. After the difference of the DC signal output from 104 is subtracted, it is output to the amplifier Q1 through the amplitude-voltage modulator 106 to form a closed loop of negative feedback; the closed-loop control coil L1 oscillates the amplitude of the oscillation voltage at a fixed value, and the negative feedback loop reaches In steady state, the AC voltage amplitude of the coil L1 on the first group is a certain value, and the change of the secondary magnetic field of the object to be measured 103 will be converted into the AC current variation value of the coil L1 on the first group. This change value is detected by the current sensing The converter 108 converts into a detection signal. In one embodiment, Q3 is a current amplifier; in another embodiment, Q3 is a power amplifier; in another embodiment, Q3 is a voltage amplifier; however, it is not limited to these.
根據本揭露另提出一檢測方法。第3圖為此檢測方法之一實施範例流程圖之示意圖。參考第3圖,在步驟402中,經由主電路301提供第一交流電流,透過第一線圈組L1、L2於待測物的上方產生主磁場,主磁場生成電流I1;在步驟404中,經由副電路302提供第二交流電流,透過第二線圈組L3、L4於待測物的下方產生副磁場,副磁場生成電流I2;在步驟406中,主磁場與副磁場產生之電流I1與I2同向(即分別同為順時針方向流入線圈L1與L3;或電流同為逆時針方向流入線圈L1與L3)。請參考第4圖。 According to the disclosure, another detection method is proposed. FIG. 3 is a schematic flowchart of an exemplary implementation of the detection method. Referring to FIG. 3, in step 402, a first alternating current is provided through the main circuit 301, and a main magnetic field is generated above the object to be measured through the first coil groups L1 and L2, and the main magnetic field generates a current I1; in step 404, The secondary circuit 302 provides a second alternating current, and generates a secondary magnetic field under the object to be measured through the second coil groups L3 and L4, and the secondary magnetic field generates a current I2. In step 406, the currents I1 and I2 generated by the primary magnetic field and the secondary magnetic field are the same. (Ie, the same flows into the coils L1 and L3 in the clockwise direction, respectively; or the current flows into the coils L1 and L3 in the counterclockwise direction, respectively). Please refer to Figure 4.
本發明揭露之檢測方法之一實施範例中,主磁場與副磁場產生一均勻磁場,通過待測物103,均勻磁場之磁力線垂 直於待測物103。該第一線圈組經由一放大器藉反饋方式形成正回授,產生第一磁場。第一線圈組與第二線圈組經由放大器107驅動產生交變磁場。放大器107之輸出轉為直流訊號後,與基準電壓K相減經由振幅電壓調制器106傳回放大器107,形成負回授。負回授控制第一線圈組之振盪電壓之振幅為定值,此定值係由基準電壓K所決定。第一線圈組之交變磁場通過待測物103時,待測物103將感應渦電流,渦電流將產生一二次磁場。二次磁場抵抗交變磁場,使渦電流產生變化。渦電流產生之變化,經由電流感測器108轉換為一檢測訊號。 In one embodiment of the detection method disclosed in the present invention, the main magnetic field and the auxiliary magnetic field generate a uniform magnetic field, and the magnetic field lines of the uniform magnetic field pass through the object 103 to be measured. Straight to the test object 103. The first coil group forms a positive feedback through a feedback method through an amplifier to generate a first magnetic field. The first coil group and the second coil group are driven to generate an alternating magnetic field through the amplifier 107. After the output of the amplifier 107 is converted into a DC signal, it is subtracted from the reference voltage K and transmitted back to the amplifier 107 via the amplitude voltage modulator 106 to form a negative feedback. The negative feedback controls the amplitude of the oscillating voltage of the first coil group to a fixed value, which is determined by the reference voltage K. When the alternating magnetic field of the first coil group passes through the test object 103, the test object 103 will induce an eddy current, and the eddy current will generate a secondary magnetic field. The secondary magnetic field resists the alternating magnetic field and changes the eddy current. The change generated by the eddy current is converted into a detection signal by the current sensor 108.
本揭露之一實施範例,藉由位於待測物之雙側非接觸式渦電流探頭,主電路301提供交流電,透過第一組上下線圈產生一磁場,感應之電流與主電路301中之放大器構成正回授,產生自振盪電路,並經由主電路301中之負回授控制電壓振幅,可以減低線圈線路因振動所產生之量測誤差影響:第二組上下線圈感應磁場而產生之電壓訊號,經由副電路302放大後,回饋給第一組上下線圈,作為訊號磁耦合補償之用,此主電路301與副電路302所產生之磁場,感應之電流方向相同。主電路301與副電路302形成分離式電路,分離式電路間的訊號藉由交流磁場進行傳遞,降低上下探頭於安裝時需繞過待測物,所造成接線過長之雜訊干擾。 An embodiment of the present disclosure uses a non-contact eddy current probe located on the object under test. The main circuit 301 provides alternating current, and a magnetic field is generated through the first set of upper and lower coils. The induced current and the amplifier in the main circuit 301 constitute Positive feedback is generated from the oscillating circuit, and the negative feedback control voltage amplitude in the main circuit 301 can reduce the influence of the measurement error caused by the vibration of the coil line: the voltage signal generated by the second set of upper and lower coil induced magnetic fields, After being amplified by the sub-circuit 302, it is fed back to the first set of upper and lower coils for signal magnetic coupling compensation. The magnetic field generated by the main circuit 301 and the sub-circuit 302 has the same direction of induced current. The main circuit 301 and the sub-circuit 302 form a separate circuit. The signals between the separate circuits are transmitted by the AC magnetic field, which reduces the noise interference caused by the excessively long wiring when the upper and lower probes need to bypass the object under test during installation.
本揭露之技術內容及技術特點已揭示如上,然其並非用以限定本發明。然而本揭露所屬技術領域中具有通需知識者應瞭解,在不背離後附申請專利範圍所界定之本揭露精神和範圍內,本揭露之教示及揭示可作種種之替換、更動及修飾。例如,上文揭示之許多裝置或結構或方法步驟可以不同之方法實施或以其他結構取代,或者採用上述二種方式之組合。 The technical content and technical features of this disclosure have been disclosed above, but they are not intended to limit the present invention. However, those with general knowledge in the technical field to which this disclosure belongs should understand that without departing from the spirit and scope of this disclosure as defined by the scope of the attached patent application, the teachings and disclosures of this disclosure can be substituted, changed and modified. For example, many of the devices or structures or method steps disclosed above can be implemented in different methods or replaced with other structures, or a combination of the two methods described above.
本案之權利範圍並不侷限於上文揭示之特定實施例的裝置、方法或步驟。本揭露所屬技術領域中具有通常知識者應暸解,基於本揭露教示及揭示機台、裝置、方法或步驟,無論現在已存在或日後開發者,其與本案實施例揭示者係以實質相同的方式執行實質相同的功能,而達到實質相同的結果,亦可使用於本揭露。因此,以下之申請專利範圍係用以涵蓋用以此類機台、裝置、方法或步驟。 The scope of the rights in this case is not limited to the devices, methods or steps of the specific embodiments disclosed above. Those with ordinary knowledge in the technical field to which this disclosure belongs should understand that based on the teaching and disclosure of this disclosure and the disclosure of the machine, device, method or steps, whether existing or future developers, it is substantially the same as the disclosure of the embodiment of this case. Performing substantially the same functions and achieving substantially the same results can also be used in this disclosure. Therefore, the scope of patent application below is intended to cover such machines, devices, methods or steps.
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