TWI674475B - Dust detection mechanism - Google Patents
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- TWI674475B TWI674475B TW104134641A TW104134641A TWI674475B TW I674475 B TWI674475 B TW I674475B TW 104134641 A TW104134641 A TW 104134641A TW 104134641 A TW104134641 A TW 104134641A TW I674475 B TWI674475 B TW I674475B
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- 238000001514 detection method Methods 0.000 title claims abstract description 66
- 239000000428 dust Substances 0.000 title claims abstract description 55
- 230000003287 optical effect Effects 0.000 claims abstract description 36
- 238000003825 pressing Methods 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 238000009966 trimming Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 7
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 208000003464 asthenopia Diseases 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
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Abstract
本發明涉及一種微塵檢測機構,尤指一種供檢測透光件如光罩之表面的微塵檢測機構,其係於一機體上設有一光學影像模組,且機體上設有一可供承載待檢之光罩的載台模組,該載台模組位於光學影像模組下方、且可相對線性位移,本發明之特色在於機體於光學影像模組周緣設有至少二個相對等距、且等角之光源模組,該等光源結構具有一可調整光源射出角度之雷射發光件,使該等雷射發光件發出之光源能距焦於光學影像模組之檢測範圍內,且該等雷射光源組之光源接近或等於待檢光罩之表面,藉此,可提供有效之光源,以避免光源穿透透光件而產生影像干擾,且可供有效辦視微塵的大小,能提升其檢測的效率與準確率,減少不必要的誤判狀況,進一步可提高晶圓後續加工的良率。 The invention relates to a micro-dust detection mechanism, in particular to a micro-dust detection mechanism for detecting the surface of a light-transmitting member such as a photomask. The body is provided with an optical image module on a body, and the body is provided with a body for inspection. A stage module of a photomask, which is located below the optical image module and can be relatively linearly displaced. The invention is characterized in that the body is provided with at least two relatively equidistant and equiangular angles on the periphery of the optical image module. Light source module, the light source structures have a laser light emitting element capable of adjusting the light emitting angle, so that the light source emitted by these laser light emitting elements can be focused within the detection range of the optical image module, and the laser light The light source of the light source group is close to or equal to the surface of the photomask to be inspected, thereby providing an effective light source to avoid image interference caused by the light source penetrating through the light-transmitting member, and can effectively handle the size of the dust and improve its detection. Efficiency and accuracy, reduce unnecessary misjudgment, and further improve the yield of subsequent wafer processing.
Description
本發明係隸屬一種透光件表面之檢測技術領域,具體而言係一種可減少透光件兩側表面影像相互干擾之微塵檢測機構,藉以能快速、且準確判斷微塵大小。 The invention belongs to the technical field of detecting the surface of a light-transmitting member, and more particularly, it is a dust detection mechanism that can reduce the mutual interference of the images on the surfaces of both sides of the light-transmitting member, so that the size of the dust can be quickly and accurately determined.
按,在現今半導體的製程中,係以微影(Photolithography)與蝕刻製程(Etching Process)來完成晶圓表面圖案的製作,其中用以供微影製程使用的光罩(Mask)具有不可或缺的關鍵地位。光罩係一繪有特定圖案之透光玻璃片,其中包含一具圖形(Pattern)之圖案區,供利用一光源,將圖案區上的圖形轉移至晶圓上的光阻,再經過蝕刻製程於晶圓表面完成圖案。而光罩為了保護圖案區上的圖形,圖案區的上方通常會設有一圖罩護膜(Pellicle),用來避免圖案區上的圖形遭受刮傷、污染或破壞。 According to the current semiconductor manufacturing process, the photolithography and etching process are used to complete the wafer surface pattern production. The mask used for the lithography process has an indispensable feature. Key position. The photomask is a light-transmitting glass sheet with a specific pattern painted, which includes a patterned pattern area for transferring a pattern on the patterned area to a photoresist on a wafer using a light source, and then subjected to an etching process. Complete the pattern on the wafer surface. In order to protect the graphics on the pattern area, a mask film (Pellicle) is usually arranged above the pattern area to prevent the graphics on the pattern area from being scratched, polluted or damaged.
然而,光罩污染是一直存在發生的問題,在操作波長等於或小於248奈米長的光微影製程中,高解析度光罩特別容易受到污染。這些污染包含附著於光罩表面的微粒、結晶、又或霧化等現象,以這類受到污染的光罩應用於黃光微影製程中,其會直接影響光罩上的圖形,進一步會造成晶圓製造積體電路的良率降低。雖然清洗光罩表面可以解決前述的微塵污染問題,但過 多的清洗次數不僅會減少光罩的使用壽命,也會增加其清洗成本,更重要的是會拉長作業等待時間,而需要準確更多的光罩、又或影響晶圓的產出。 However, mask contamination has always been a problem. In a photolithography process with an operating wavelength equal to or less than 248 nanometers, high-resolution photomasks are particularly vulnerable to contamination. These pollutions include particles, crystals, or fogging that are attached to the surface of the photomask. The use of such contaminated photomasks in the yellow light lithography process will directly affect the graphics on the photomask and further cause wafers. The yield of manufacturing integrated circuits is reduced. Although cleaning the surface of the photomask can solve the aforementioned problem of dust pollution, A large number of cleanings will not only reduce the service life of the photomask, but also increase its cleaning cost. More importantly, it will lengthen the waiting time of the operation, and require more accurate photomasks, or affect the output of the wafer.
因此,一般對於會針對不同的光罩設定污染的容許標準,並於光罩進入製程或儲存時進行檢測,當污染未超過容許標準時即不進行清洗,反之當超出容許標準時即進行清洗。傳統的檢測方式以人工目檢為主,但由於費時、且易因檢查人員的主觀判斷、長時間作業、或眼睛疲勞等因素,而產生誤判。目前業界也開發有不同的光罩檢測設備,供自動化檢出污染。 Therefore, pollution tolerance standards are generally set for different photomasks and tested when the photomask enters the process or storage. If the pollution does not exceed the allowable standard, it will not be cleaned, otherwise it will be cleaned. The traditional detection method is mainly manual visual inspection, but due to time consuming, and easily due to the subjective judgment of inspectors, long-term work, or eye fatigue, and other factors, misjudgment. At present, the industry has also developed different photomask detection equipment for automatic detection of pollution.
現有的光罩檢測設備係使用光學模組【影像感測器,CCD元件、又或CMOS元件】掃描整個光罩表面,藉此檢測光罩上的污染或沉澱物,但由於一般光學模組的光源來自光罩上方或下方,再加上光罩係由透光玻璃片所製成,如此會造成下方表面圖形干擾,無法有效檢出上方表面的微塵,故目前光學模組之原理基礎係利用光束(例如:激光束或電子束)之點狀小範圍的光學掃描技術。然而,現有光學掃描系統的費用是相當昂貴,且光罩通常是由非常平坦的透光石英片或是透光玻璃片所構成的,於進行光學掃描時會有難以聚焦,以及因疊影誤判微塵大小的狀況,因此其檢測掃描速度很慢,同時受到前述疊影誤判的影響,其檢出的微塵尺寸一般僅能達到50um*50um,對於更小的微塵檢出能力受限相當的限制,其逐漸無法滿足現有積體電路線徑越來越小的微塵檢出需求。 Existing photomask detection equipment uses an optical module [image sensor, CCD element, or CMOS element] to scan the entire photomask surface to detect contamination or sediment on the photomask. The light source comes from above or below the reticle, plus the reticle is made of a transparent glass sheet. This will cause graphic interference on the lower surface and cannot effectively detect fine dust on the upper surface. Therefore, the principle of the current optical module is based on the use of Optical scanning technology in the form of a small spot of a light beam (such as a laser beam or an electron beam). However, the cost of the existing optical scanning system is quite expensive, and the photomask is usually composed of a very flat transparent quartz plate or a transparent glass plate, which makes it difficult to focus during optical scanning and misjudgment due to ghosting. Due to the size of the dust particles, its detection and scanning speed is very slow, and at the same time it is affected by the aforementioned misjudgement. The size of the detected dust particles can only reach 50um * 50um, which limits the detection capacity of smaller dust particles. It gradually fails to meet the requirements for the detection of dust particles with smaller and smaller wire diameters of existing integrated circuits.
再者,由於其係以光束掃描為主,不僅掃描速度慢,且難以組成完整的光罩表面,如此即難以讓檢測設備記住微 塵位置,而無法提供操作人員於檢測後進行以定位直接將光學模組移至微塵上方進行人工判讀,也無法做為後續生產異常的原因判斷依據。 Furthermore, because it is based on beam scanning, it is not only slow to scan, but also difficult to form a complete photomask surface. The position of the dust cannot be provided for the operator to perform the positioning directly after the detection to move the optical module directly above the dust for manual interpretation, nor can it be used as a basis for determining the cause of subsequent production abnormalities.
換言之,以現有的檢查方法或設備而言,不僅易誤判微塵大小、且檢出速度慢,同時檢出能力受限,也不易進行後續人員或異常判讀,影響到整體半導體製程的時間與良率,如何解決前述問題,係業界的重要課題。 In other words, with the existing inspection methods or equipment, it is not only easy to misjudge the size of the dust, and the detection speed is slow. At the same time, the detection capacity is limited. How to solve the aforementioned problems is an important issue for the industry.
有鑑於此,本發明人乃針對前述現有透光之光罩於微塵檢查時所面臨的問題深入探討,並藉由本發明人多年從事相關開發的經驗,而積極尋求解決之道,經不斷努力之研究與發展,終於成功的創作出一種微塵檢測機構,藉以克服現有者難以快速檢出大小及位置所造成的困擾與不便。 In view of this, the present inventor has made in-depth discussions on the problems faced by the aforementioned existing light-transmitting reticle during dust inspection, and actively seeks a solution through the inventor's years of experience in related development, with continuous efforts Research and development have finally succeeded in creating a dust detection mechanism to overcome the difficulties and inconveniences caused by the difficulty of rapid detection of size and location by existing people.
因此,本發明之主要目的係在提供一種可以有效檢出微塵尺寸及位置之微塵檢測機構,藉以能減少誤判,且供後續判讀處理,從而提高後續晶圓加工的效率與良率。 Therefore, the main object of the present invention is to provide a dust detection mechanism that can effectively detect the size and position of dust, thereby reducing misjudgments and providing subsequent interpretation processing, thereby improving the efficiency and yield of subsequent wafer processing.
又,本發明之次一主要目的係在提供一種可以提高檢出能力之微塵檢測機構,其能有效檢出尺寸更小的微塵,以滿足半導體更微細製程的需求。 In addition, a second main object of the present invention is to provide a dust detection mechanism capable of improving the detection capability, which can effectively detect smaller dust particles to meet the requirements of finer semiconductor manufacturing processes.
再者,本發明之另一主要目的係在提供一種可以快速掃描之微塵檢測機構,其能完整、且迅速檢查光罩表面,提高光罩檢查的效率與頻率。 Furthermore, another main object of the present invention is to provide a dust detection mechanism capable of rapid scanning, which can complete and quickly inspect the surface of the photomask, thereby improving the efficiency and frequency of photomask inspection.
為此,本發明主要係透過下列的技術手段,來具體實現上述的各項目的與效能,至少包含有: 一機體,其具有一移動軸;一載台模組,其係滑設於機體之移動軸,該載台模組可供承載待測之透光件沿機體的移動軸線性位移;一光學影像模組,其係設於機體上,供可相對載台模組產生線性位移,又該光學影像模組係由至少一具線性掃描功能之影像感測元件所組成,該等影像感測元件之線性掃描延伸軸與載台模組之移動軸呈垂直交錯;以及至少二光源模組,其係分設於機體之移動軸兩側中的至少一側,該等光源模組分別具有一雷射發光件,且該等微調模組之雷射發光件的光源射出點與待測透光件之移動軸及光學影像模組之檢測延伸軸的交錯點呈等距、且等高,又該等雷射發光件的光源射出點與待測透光件檢測表面的夾角角度為0至6度。 To this end, the present invention mainly implements the above-mentioned objects and effects through the following technical means, including at least: A machine body having a moving axis; a stage module slidingly arranged on the movement axis of the machine body; the stage module is capable of carrying the linear displacement of the light-transmitting member to be measured along the movement axis of the machine body; an optical image The module is arranged on the body for linear displacement with respect to the stage module, and the optical image module is composed of at least one image sensing element with a linear scanning function. The linear scanning extension axis and the movement axis of the stage module are vertically staggered; and at least two light source modules are separately arranged on at least one of two sides of the movement axis of the body, and the light source modules each have a laser Light emitting parts, and the light emitting points of the laser light emitting parts of these fine-tuning modules are equidistant and equal in height to the staggered points of the moving axis of the light transmitting part to be measured and the detection extension axis of the optical image module. The included angle between the light emitting point of the laser light emitting element and the detection surface of the light transmitting element to be measured is 0 to 6 degrees.
藉此,透過前述技術手段的具體實現,使本發明之微塵檢測機構可利用由線性影像感光元件構成之光學影像處理模組,快速掃描光罩的表面,且透過斜設之導光單元導光板的作用,使光源之光線可斜射於光學影像處理模組掃描處,而提高其聚焦效果,從而提高污染物的辨識率,故能有效增進其檢查效率與準確率,減少不必要的人力及誤判狀況,進一步可提高晶圓後續加工的良率,並可提高其工作效率,而能增加其附加價值,並能提高其經濟效益。 Therefore, through the specific implementation of the aforementioned technical means, the dust detection mechanism of the present invention can use an optical image processing module composed of a linear image photosensitive element to quickly scan the surface of the photomask and pass through the light guide plate of the oblique light guide unit. The function of the light source can make the light from the light source obliquely be scanned at the scanning position of the optical image processing module, thereby improving its focusing effect, thereby improving the recognition rate of pollutants, so it can effectively improve its inspection efficiency and accuracy, reduce unnecessary manpower and misjudgment. The condition can further improve the yield of subsequent wafer processing, and improve its work efficiency, increase its added value, and improve its economic benefits.
為使 貴審查委員能進一步了解本發明的構成、特徵及其他目的,以下乃舉本發明之若干較佳實施例,並配合圖式詳細說明如后,供讓熟悉該項技術領域者能夠具體實施。 In order to make your reviewers better understand the composition, features, and other objectives of the present invention, the following are examples of the preferred embodiments of the present invention, and are described in detail with the drawings, so that those who are familiar with the technical field can implement it. .
(10)‧‧‧機體 (10) ‧‧‧Body
(15)‧‧‧線性滑軌 (15) ‧‧‧Linear slide
(20)‧‧‧載台模組 (20) ‧‧‧Carrier Module
(21)‧‧‧升降機構 (21) ‧‧‧Lifting mechanism
(22)‧‧‧基板 (22) ‧‧‧Substrate
(23)‧‧‧座體 (23) ‧‧‧Body
(230)‧‧‧斜導面 (230) ‧‧‧Oblique Guide
(24)‧‧‧導引件 (24) ‧‧‧Guide
(25)‧‧‧承體 (25) ‧‧‧Body
(250)‧‧‧斜導面 (250) ‧‧‧Slope Guide
(26)‧‧‧導引件 (26) ‧‧‧Guide
(27)‧‧‧立板 (27) ‧‧‧Stand
(28)‧‧‧導引件 (28) ‧‧‧Guide
(29)‧‧‧驅動件 (29) ‧‧‧Driver
(30)‧‧‧定位機構 (30) ‧‧‧Positioning agency
(31)‧‧‧底板 (31) ‧‧‧Floor
(32)‧‧‧固定件 (32) ‧‧‧Fixed parts
(320)‧‧‧撐塊 (320) ‧‧‧Support block
(33)‧‧‧調整件 (33) ‧‧‧Adjustment
(34)‧‧‧平台 (34) ‧‧‧Platform
(35)‧‧‧推壓件 (35) ‧‧‧Pushing piece
(36)‧‧‧氣壓伸缸 (36) ‧‧‧Pneumatic Stretching Cylinder
(37)‧‧‧桿座 (37) ‧‧‧Bar seat
(38)‧‧‧抵柱 (38) ‧‧‧arrive
(39)‧‧‧高度檢測元件 (39) ‧‧‧height detection element
(40)‧‧‧光學影像模組 (40) ‧‧‧Optical Image Module
(41)‧‧‧影像感測元件 (41) ‧‧‧Image sensor
(50)‧‧‧光源模組 (50) ‧‧‧Light source module
(51)‧‧‧雷射發光件 (51) ‧‧‧Laser Light
(55)‧‧‧微調模組 (55) ‧‧‧Fine-tuning module
(80)‧‧‧待測透光件 (80) ‧‧‧Transmitting piece to be tested
(X)‧‧‧移動軸 (X) ‧‧‧Move axis
(Y)‧‧‧檢測延伸軸 (Y) ‧‧‧Detect extension axis
(P)‧‧‧交錯點 (P) ‧‧‧ stagger
第一圖:係應用本發明微塵檢測機構之設備的俯視平面示意圖。 The first figure is a schematic plan view of a device to which the dust detection mechanism of the present invention is applied.
第二圖:本發明微塵檢測機構的俯視平面示意圖,供說明各組件於俯視之相對關係。 Second figure: A schematic plan view of the dust detection mechanism of the present invention, for illustrating the relative relationship of each component in a top view.
第三圖:本發明微塵檢測機構的側視平面示意圖,供說明各組件於側面之相對關係。 Third figure: A schematic side plan view of the dust detection mechanism of the present invention for explaining the relative relationship of each component on the side.
第四圖:本發明微塵檢測機構中載台模組的外觀示意圖。 FIG. 4 is a schematic diagram of the appearance of a stage module in the dust detection mechanism of the present invention.
第五圖:本發明微塵檢測機構中載台模組之升降機構的分解示意圖,供說明其構成態樣。 Fifth figure: The exploded schematic diagram of the lifting mechanism of the stage module in the dust detection mechanism of the present invention, for explaining its configuration.
第六圖:本發明微塵檢測機構中載台模組之定位機構的外觀示意圖,供說明其構成態樣。 FIG. 6 is a schematic diagram of an external appearance of a positioning mechanism of a stage module in the dust detection mechanism of the present invention, for explaining its configuration.
本發明係一種微塵檢測機構,隨附圖例示本發明之具體實施例及其構件中,所有關於前與後、左與右、頂部與底部、上部與下部、以及水平與垂直的參考,僅用於方便進行描述,並非限制本發明,亦非將其構件限制於任何位置或空間方向。圖式與說明書中所指定的尺寸,當可在不離開本發明之申請專利範圍內,根據本發明之具體實施例的設計與需求而進行變化。 The present invention is a dust detection mechanism. The accompanying drawings illustrate specific embodiments of the present invention and its components. All references to front and back, left and right, top and bottom, upper and lower, and horizontal and vertical are used only. For convenience of description, the present invention is not limited, and its components are not limited to any position or spatial direction. The dimensions specified in the drawings and the description can be changed according to the design and requirements of the specific embodiments of the present invention without departing from the scope of the patent application of the present invention.
而本發明係一種供檢測如半導體光罩之透光件表面的微塵檢測機構,係如第一、二及三圖所顯示者,其係於一機體(10)上設有一供承載待測透光件(80)之載台模組(20),且機體(10)於載台模組(20)上方設有一供檢測待測透光件(80) 之光學影像模組(40),該光學影像模組(40)與載台模組(20)可相對線性位移,又機體(10)於對應待測透光件(80)周緣設有至少兩組光源可聚焦於光學影像模組(40)檢測位置之光源模組(50)所組成;其中所述之機體(10)係由系列金屬骨材及板材所構成,供本發明其他各模組如載台模組(20)、光學影像模組(40)及相關電控、氣壓等零件組設,且機體(10)上並設有一供載台模組(20)於光學影像模組(40)下方相對線性位移之線性滑軌(15),該線性滑軌(15)之移動軸被定義為X軸;又所述之載台模組(20)係如第四圖所示,其具有一可帶動待測透光件(80)上、下位移之升降機構(21),且載台模組(20)另具有一可供待測透光件(80)迅速定位於檢測位置之定位機構(30),該定位機構(30)並可設於升降機構(21)頂面,又如第五圖所示,該升降機構(21)具有一可滑設於機體(10)線性滑軌(15)之基板(22),供被利用伺服馬達及導螺桿以相對光學影像模組(40)線性位移,且基板(22)上滑設有一具斜導面(230)之座體(23),該座體(23)與基板(22)相對表面間設有一包含導軌與導座之導引件(24),使座體(23)可相對基板(22)線性位移,又座體(23)之斜導面(230)上滑設有一具相對斜導面(250)之承體(25),再者座體(23)與承體(25)之相對斜導面(230、250)間設有一包含導軌與導座之導引件(26),另基板(22)於承體(25)異於座體(23)一端固設有一立板(27),該立板(27)與承體(25)端面間設有一包含導軌與導座之立狀導引件(28),使承體(25)僅能上下 位移,再者基板(22)於座體(23)異於承體(25)的一端設有一包含伺服馬達及導螺桿之驅動件(29),供作動座體(23)相對承體(25)前、後位移,且令承體(25)可利用斜導面(230、250)沿立板(27)導引件(28)產生升降作用;而載台模組(20)之定位機構(30)具有一供鎖設於升降機構(21)頂面之底板(31),如第六圖所示,且底板(31)於對應待測透光件(80)之角落分設有一固定件(32),且各固定件(32)分別設有一供頂撐該待測透光件(80)各角落之撐塊(320),該撐塊(320)可以選自聚醚醚酮【PEEK】材質,使該待測透光件(80)可水平置放於定位機構(30)上,又撐塊(320)與固定件(32)間可進一步設有一能調節高度之調整組(33),供用於選擇性調整待測透光件(80)對應角落之高度,以確保待測透光件(80)表面之水平度,又定位機構(30)之底板(31)頂面於固定件(32)所圍空間內設有一平台(34),該平台(34)於對應待測透光件(80)各邊緣處分設有一供選擇性貼抵待測透光件(80)邊緣之推壓件(35),該等推壓件(35)係於平台(34)上設有一氣壓伸缸(36),且該氣壓伸缸(36)之伸桿上設有一桿座(37),該桿座(37)上分設有一至少兩同一軸線之抵柱(38),供受氣壓伸缸(36)作用而選擇性貼抵待測透光件(80),用以當所有推壓件(35)同步內收時,可利用各該推壓件(35)之抵柱(38)同步推壓待測透光件(80),使不同待測透光件(80)均能定位於同一檢測位置,提高檢出的精準度,再者該定位機構(30)上設有至少一可檢知待測透光件(80)厚度之高度檢測元件(39),該高度檢測元件(39)並與前述升降機構(21)之驅 動件(29)形成電氣連接,供配合待測透光件(80)厚度調節升降機構(21)之承體(25)頂升高度;再者,如第二、三圖所示,該光學影像模組(40)具有自動拍照功能,且該光學影像模組(40)可以由至少一呈線性掃描之影像感測元件(41)【其可以選自CCD元件、又或CMOS元件】所組成,且該等影像感測元件(41)之線性掃描延伸軸被定義為Y軸,且該線性掃描延伸軸(Y)與載台模組(20)之移動軸(X)呈垂直交錯狀,其被定義為交錯點(P),又本發明係以兩併排之影像感測元件(41)為主要實施例,供一次性檢測如光罩之待測透光件(80)的寬度、又或兩側平行的表面【如光罩之護膜兩側表面】,使待測透光件(80)於水平面僅需相對該光學影像模組(40)單軸位移,以提升檢測速度及準確性,且該光學影像模組(40)之影像感測元件(41)與待測透光件(80)之檢測表面的焦距高度(H1)為280mm~320mm,以檢測半導體之光罩為例,其最佳焦距高度(H1)為293mm~305mm;至於所述之該等光源模組(50)分別具有一雷射發光件(51),該雷射發光件(51)可以選自波長600nm~700nm之雷射二極體,如紅光雷射二極體,該雷射發光件(51)係透過一微調模組(55)分設於機體(10)上對應待測透光件(80)移動軸(X)的兩側,該微調模組(55)可以是具有可調整X軸、Y軸、Z軸及各軸旋轉角度的調整功能,且該等微調模組(55)之雷射發光件(51)的光源射出點與待測透光件(80)之移動軸(X)及光學影像模組(40)之檢測延伸軸(Y)的交錯點(P)呈等距、且等高的方式設置,本發明係以檢測光罩為例,其係使用四組光 源模組(50)為主要實施例,且該等光源模組(50)之雷射發光件(51)的光源射出點與交錯點(P)的X軸向距離(L2)為300mm~320mm,而該等光源模組(50)之雷射發光件(51)的光源射出點與交錯點(P)的Y軸向距離(L1)為120mm~130mm,兩者之相對夾角約為【20度至25度】,又該等光源模組(50)之雷射發光件(51)的光源射出點與待測透光件(80)檢測表面的高度(H2)為3mm~33mm【兩者之相對夾角夾角約為0.5度至6度】,本發明之最佳實施例為該等光源模組(50)之雷射發光件(51)的光源射出點與交錯點(P)的X軸向距離(L2)為307mm~311mm,而該等光源模組(50)之雷射發光件(51)的光源射出點與交錯點(P)的Y軸向距離(L1)為123mm~127mm,又該等光源模組(50)之雷射發光件(51)的光源射出點與待測透光件(80)檢測表面的高度(H2)為距離為3mm~13mm【兩者之相對夾角夾角約為0.5度至3度】;藉此,透過不同方向之光源,使待測透光件(80)表面之微塵能被有效顯影,且可減少因週邊陰影所產生的誤判,使光學影像模組(40)可準確檢出微塵的大小及位置,且進一步可使更小的微塵,依據實測可檢出10um*10um的微塵,大幅提升其檢出能力,進而組構成一能迅速、且準確檢出之微塵檢測機構者。 The present invention is a micro-dust detection mechanism for detecting the surface of a light-transmitting member such as a semiconductor photomask, as shown in the first, second and third figures, and is provided on a body (10) for carrying a to-be-tested The stage module (20) of the light piece (80), and the body (10) is provided above the stage module (20) with a light transmitting piece (80) for testing Optical image module (40), the optical image module (40) and the stage module (20) can be relatively linearly displaced, and the body (10) is provided with at least two peripheral edges corresponding to the light-transmitting member (80) to be measured The light source group can be focused on the light source module (50) of the optical image module (40), and the body (10) is composed of a series of metal bones and plates for other modules of the present invention. For example, the stage module (20), optical image module (40) and related electrical control, air pressure and other parts are assembled, and the body (10) is provided with a stage module (20) for the optical image module ( 40) The linear slide rail (15) with relative linear displacement below, the moving axis of the linear slide rail (15) is defined as the X axis; the stage module (20) is also shown in the fourth figure, It has a lifting mechanism (21) that can move the light-transmitting member (80) up and down, and the stage module (20) also has a light-transmitting member (80) that can be quickly positioned at the detection position. Positioning mechanism (30). The positioning mechanism (30) can be set on the top surface of the lifting mechanism (21). As shown in the fifth figure, the lifting mechanism (21) has a linear sliding mechanism that can be slidably disposed on the body (10). The base plate (22) of the rail (15) for the benefit A servo motor and a lead screw are used to linearly move relative to the optical image module (40), and a base body (23) with an inclined guide surface (230) is slid on the base plate (22). The base body (23) and the base plate (23) 22) A guide member (24) including a guide rail and a guide seat is provided between the opposite surfaces, so that the seat body (23) can be linearly displaced relative to the base plate (22), and the inclined guide surface (230) of the seat body (23) slides up A bearing body (25) with a relatively inclined guide surface (250) is provided, and a guide including a guide rail and a guide seat is provided between the seat (23) and the opposite inclined guide surfaces (230, 250) of the bearing body (25). The lead piece (26), and the base plate (22) is fixed on the end of the support body (25) different from the base body (23) with a vertical plate (27). A vertical plate (27) is provided between the end plate and the end surface of the support body (25). A vertical guide (28) including a guide rail and a guide seat, so that the support body (25) can only move up and down Displacement, and the base plate (22) is provided at one end of the base body (23) different from the base body (25) with a driving member (29) including a servo motor and a lead screw for actuating the base body (23) relative to the base body (25) ) Forward and backward displacement, and the supporting body (25) can use the inclined guide surface (230, 250) to generate a lifting effect along the guide plate (27) of the vertical plate (27); and the positioning mechanism of the carrier module (20) (30) There is a bottom plate (31) for locking on the top surface of the lifting mechanism (21), as shown in the sixth figure, and the bottom plate (31) is provided with a fixing at the corner corresponding to the light-transmitting member (80) to be tested Piece (32), and each fixing piece (32) is provided with a supporting block (320) for supporting the corners of the light-transmitting member (80) to be tested, the supporting block (320) can be selected from polyetheretherketone [ PEEK] material, so that the light-transmitting member (80) to be tested can be horizontally placed on the positioning mechanism (30), and a height-adjusting group (an adjustable group can be further provided between the supporting block (320) and the fixing member (32) ( 33) for selectively adjusting the height of the corresponding corner of the light-transmitting member (80) to be measured to ensure the level of the surface of the light-transmitting member (80) to be measured, and positioning the top surface of the bottom plate (31) of the mechanism (30) on A platform (34) is provided in the space surrounded by the fixing member (32), and the platform (34) corresponds to the test Each edge of the light piece (80) is provided with a pressing piece (35) for selectively abutting against the edge of the light-transmitting piece (80) to be tested. The pressing pieces (35) are provided with a pressure on the platform (34). An extension cylinder (36), and a rod seat (37) is arranged on the extension rod of the pneumatic extension cylinder (36), and at least two abutment columns (38) on the same axis are provided on the rod seat (37) for receiving air pressure The extension cylinder (36) functions to selectively abut against the light-transmitting member (80) to be tested. When all the pressing members (35) are retracted synchronously, the pressing columns (38) of each of the pressing members (35) can be used. ) Simultaneously push the light-transmitting member (80) to be tested, so that different light-transmitting members (80) can be positioned at the same detection position to improve the detection accuracy, and the positioning mechanism (30) is provided with at least A height detecting element (39) capable of detecting the thickness of the light-transmitting member (80) to be measured, and the height detecting element (39) is coupled with the driving mechanism of the aforementioned lifting mechanism (21). The moving part (29) forms an electrical connection for matching the height of the carrier (25) of the lifting mechanism (21) with the thickness adjustment of the transparent member (80) to be measured; further, as shown in the second and third figures, the optical The image module (40) has an automatic photographing function, and the optical image module (40) can be composed of at least one image sensing element (41) that is linearly scanned [which can be selected from a CCD element or a CMOS element] And the linear scanning extension axis of the image sensing elements (41) is defined as the Y axis, and the linear scanning extension axis (Y) and the movement axis (X) of the stage module (20) are vertically staggered, It is defined as the interlaced point (P). The present invention uses two side-by-side image sensing elements (41) as the main embodiment for one-time detection of the width, Or parallel surfaces on both sides [such as the two surfaces of the protective film of the photomask], so that the light-transmitting member (80) to be measured needs to be displaced uniaxially relative to the optical image module (40) in the horizontal plane to improve the detection speed and accuracy And the focal height (H1) of the image sensing element (41) of the optical image module (40) and the detection surface of the light-transmitting member (80) to be tested is 280mm ~ 320mm, As an example, the light mask of the body has an optimal focal length (H1) of 293 mm to 305 mm; as for the light source modules (50), each of the light source modules (50) has a laser light emitting element (51), and the laser light emitting element (51) ) Can be selected from a laser diode with a wavelength of 600nm ~ 700nm, such as a red laser diode, the laser light emitting part (51) is correspondingly arranged on the body (10) through a trimming module (55) Both sides of the moving axis (X) of the light-transmitting member (80) to be measured can be adjusted by the fine-tuning module (55), and the fine-tuning module (55) can adjust the X-axis, Y-axis, Z-axis, and the rotation angle of each axis. The staggered point of the light emitting point of the laser light emitting part (51) of the module (55) and the moving axis (X) of the light transmitting member (80) to be measured and the detection extension axis (Y) of the optical image module (40) (P) It is arranged in an equidistant and equal height manner. The present invention uses a detection mask as an example. It uses four groups of light. The source module (50) is the main embodiment, and the X-axis distance (L2) between the light source emission point and the staggered point (P) of the laser light emitting parts (51) of the light source modules (50) is 300 mm to 320 mm And the Y-axis distance (L1) between the light emitting point and the staggered point (P) of the laser light emitting part (51) of these light source modules (50) is 120mm ~ 130mm, and the relative angle between the two is about [20 Degrees to 25 degrees], and the light emitting point (51) of the light emitting module (50) of the light source module (50) and the height (H2) of the testing surface of the light transmitting member (80) are 3 mm to 33 mm [both Relative angle included angle is about 0.5 degrees to 6 degrees], the preferred embodiment of the present invention is the X-axis of the light source emission point and the staggered point (P) of the laser light emitting parts (51) of the light source modules (50) The distance (L2) is 307mm ~ 311mm, and the Y-axis distance (L1) between the light source emission point and the staggered point (P) of the laser light emitting part (51) of these light source modules (50) is 123mm ~ 127mm, And the height (H2) between the light emitting point of the laser light emitting part (51) of the light source module (50) and the detection surface of the light transmitting part (80) to be measured is a distance of 3mm ~ 13mm [the relative angle between the two About 0.5 degrees to 3 degrees]; through this, through the light source in different directions, so that (80) The dust on the surface can be effectively developed, and the misjudgment caused by the surrounding shadows can be reduced, so that the optical image module (40) can accurately detect the size and position of the dust, and further can make smaller dust, according to The actual measurement can detect 10um * 10um dust, which greatly enhances its detection ability, and then forms a dust detection mechanism that can detect quickly and accurately.
而本發明於進行待測透光件(80)檢測作業之實際操作時,則係如第一、二及三圖所示,以半導體光罩為例,其係令待測透光件(80)之光罩置於載台模組(20)之定位機構(30)撐塊(320)上【如第四、六圖所示】,並利用推壓件(35)之氣 壓伸缸(36)收回抵柱(38),使每次檢測之待測透光件(80)均可平置定位於載台模組(20)的同一位置,且定位機構(30)上的高度檢測元件(39)可同步檢知待測透光件(80)之厚度,並透過升降機構(21)之驅動件(29)將待測透光件(80)頂升至對應的檢測高度【如第四、五圖所示】,並同步開啟光學影像模組(40)之影像感測元件(41)與光源模組(50)之各該雷射發光件(51);當載台模組(20)承載待測透光件(80)沿機體(10)移動軸(X)位移、且經過光學影像模組(40)之影像感測元件(41)的線性陣列感測線時,由於周圍各該光源模組(50)之雷射發光件(51)係以等距、等角方式投射光源,使待測透光件(80)表面上的微塵可被四周的光源顯影,且可利用來自四周的光源,減少微塵因光源使週邊產生陰影所造成尺寸的誤判,讓光學影像模組(40)之影像感測元件(41)可準確檢出各該微塵的大小及位置,且進一步可使更小的微塵,依據實測可檢出10um*10um的微塵,大幅提升其檢出能力。 When the present invention performs the actual operation of the testing of the light-transmitting member (80), as shown in the first, second and third figures, taking the semiconductor photomask as an example, it makes the light-transmitting member (80) to be tested The photomask is placed on the supporting mechanism (30) of the positioning mechanism (30) of the stage module (20) [as shown in the fourth and sixth figures], and the gas of the pressing member (35) is used The extension cylinder (36) retracts the abutment post (38), so that the light-transmitting member (80) to be tested can be positioned in the same position on the stage module (20) in a horizontal position, and the positioning mechanism (30) The height detection element (39) can simultaneously detect the thickness of the light-transmitting member (80) to be measured, and lift the light-transmitting member (80) to the corresponding detection through the driving member (29) of the lifting mechanism (21). Height [as shown in the fourth and fifth figures], and simultaneously turn on each of the laser light emitting element (51) of the image sensing element (41) of the optical image module (40) and the light source module (50); The stage module (20) carries a linear array sensing line of the light-transmitting member (80) to be measured along the movement axis (X) of the body (10) and passes through the image sensing element (41) of the optical image module (40) Since the laser light emitting elements (51) of the surrounding light source modules (50) project the light sources in an equidistant and equiangular manner, the dust on the surface of the light transmitting member (80) to be measured can be developed by the surrounding light sources. In addition, the light source from the surroundings can be used to reduce the misjudgment of the size of the dust caused by the shadow caused by the light source, so that the image sensing element (41) of the optical image module (40) can accurately detect the size and position of each dust. And one Make less dust, dust can be detected based on the measured 10um * 10um, significantly increasing its detection capability.
經由上述的說明,本發明利用系列等距、等角設置之至少二光源模組(50),使待測透光件(80)表面之微塵能被有效的打光,且透過光學影像模組(40)之線性掃描功能的影像感測元件(41)能快速、且有效檢出的微塵大小及位置,藉以能減少誤判,且供後續判讀處理,且能有效檢出尺寸更小的微塵,以滿足半導體更微細製程的需求,同時可以組成完整的光罩表面,讓檢測設備記住微塵的尺寸與位置,以供操作人員於檢測後,進行微塵的定位,且配合光學影像模組(40)可拍照之功能 自動拍照存檔,與清洗前後做比較,以便判斷清洗效果,並可方便之後進行人工檢視、判讀及記錄,並可做為後續生產異常的原因判斷依據,大幅增進其實用性。 Through the above description, the present invention utilizes a series of equidistant and equiangular at least two light source modules (50), so that the dust on the surface of the light-transmitting member (80) to be measured can be effectively lighted and transmitted through the optical image module The image sensing element (41) of the linear scanning function of (40) can quickly and effectively detect the size and position of dust, thereby reducing misjudgments, and for subsequent interpretation processing, and can effectively detect smaller dust particles. In order to meet the requirements of the finer semiconductor manufacturing process, a complete photomask surface can be formed to allow the detection equipment to remember the size and position of the dust, so that the operator can locate the dust after inspection, and cooperate with the optical imaging module (40 ) Available functions Automatic photo archiving, compared with before and after cleaning, in order to judge the cleaning effect, and can be convenient for manual inspection, interpretation and recording later, and can be used as the basis for determining the cause of subsequent production abnormalities, greatly improving its practicality.
綜上所述,可以理解到本發明為一創意極佳之發明,除了有效解決習式者所面臨的問題,更大幅增進功效,且在相同的技術領域中未見相同或近似的產品創作或公開使用,同時具有功效的增進,故本發明已符合發明專利有關「新穎性」與「進步性」的要件,乃依法提出發明專利之申請。 In summary, it can be understood that the present invention is a very creative invention. In addition to effectively solving the problems faced by practitioners, it greatly enhances the efficacy, and has not seen the same or similar product creation or product creation in the same technical field. It is used publicly and has the enhancement of efficacy. Therefore, the present invention has met the requirements of "novelty" and "progressiveness" of the invention patent, and is an application for an invention patent in accordance with the law.
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Citations (6)
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|---|---|---|---|---|
| US20030203650A1 (en) * | 2002-04-26 | 2003-10-30 | Robbins Michael D. | Method and apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates |
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| TW200912291A (en) * | 2007-09-14 | 2009-03-16 | Foxconn Advanced Tech Inc | Optical inspection system |
| TW201502500A (en) * | 2013-07-05 | 2015-01-16 | Machvision Inc | Illumination system for use in optical inspection, illumination system-based inspection system, and illumination system-based inspection method |
| CN104634789A (en) * | 2014-04-24 | 2015-05-20 | 东旭集团有限公司 | System and method for performing foreign matter inspection on upper surface of ultrathin glass substrate |
| TWM545929U (en) * | 2015-10-22 | 2017-07-21 | Stek Co Ltd | Micro-dust detection mechanism |
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|---|---|---|---|---|
| US20030203650A1 (en) * | 2002-04-26 | 2003-10-30 | Robbins Michael D. | Method and apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates |
| US20070115463A1 (en) * | 2005-11-21 | 2007-05-24 | Dureiko Richard D | Oblique transmission illumination inspection system and method for inspecting a glass sheet |
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