TWI674054B - Manufacturing method of housing of electronic device - Google Patents
Manufacturing method of housing of electronic device Download PDFInfo
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- TWI674054B TWI674054B TW107135862A TW107135862A TWI674054B TW I674054 B TWI674054 B TW I674054B TW 107135862 A TW107135862 A TW 107135862A TW 107135862 A TW107135862 A TW 107135862A TW I674054 B TWI674054 B TW I674054B
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Abstract
本案揭露一種電子裝置殼體的製造方法，包含以下步驟。於板件上的表面形成轉印圖層。於轉印圖層形成切口，切口延伸至表面之部分。對板件進行沖壓，並於板件及轉印圖層上對應切口位置進行折彎，進而產生形變部，形變部包含部分板件及部分轉印圖層。移除形變部。藉此，能製造具有邊框效果的一體式電子裝置殼體。This case discloses a method for manufacturing an electronic device casing, which includes the following steps. A transfer layer is formed on the surface of the board. A cut is formed in the transfer layer, and the cut extends to a part of the surface. The plate is punched and bent at the corresponding cutout positions on the plate and the transfer layer, thereby generating a deformation part, which includes a part of the plate and a part of the transfer layer. Remove the deformed part. Thereby, an integrated electronic device case having a frame effect can be manufactured.
Description
本案與轉印製造方法有關，特別是應用於電子裝置殼體的製造方法。This case relates to a transfer manufacturing method, and is particularly applied to a manufacturing method of an electronic device casing.
隨著電子產品的使用需求增加，使用者對於電子產品的需求已由基本的效能延伸到外在的美觀訴求，而電子產品的外在美觀訴求也越趨朝向精品級的精緻度。因而，可以產出精緻化圖形的奈米轉印微影技術也越來越普遍地運用於電子產品的製造上。With the increase in the use of electronic products, the user's demand for electronic products has extended from basic efficiency to external aesthetic appeal, and the external aesthetic appeal of electronic products is increasingly moving towards high-quality products. Therefore, nano transfer lithography technology, which can produce refined graphics, is increasingly used in the manufacture of electronic products.
奈米轉印微影技術是透過轉印將奈米級圖形成形於基材上。在轉印過程中，壓力、角度都攸關轉印出的圖形品質。而為維持轉印圖形品質，多數製造商會捨棄具有曲面、弧度或轉角的產品，而僅將奈米轉印微影技術運用於全平面的產品上。如此一來，可運用奈米轉印微影技術的產品種類將大幅被限制。Nano transfer lithography technology forms nano-level graphics on a substrate through transfer. During the transfer process, the pressure and angle are related to the quality of the transferred image. In order to maintain the quality of the transfer pattern, most manufacturers will abandon products with curved surfaces, radians or corners, and only use nano transfer lithography technology on all-flat products. In this way, the types of products that can use nano transfer lithography technology will be greatly restricted.
本案揭示一種電子裝置殼體的製造方法，包含以下步驟。於板件上的表面形成轉印圖層。於轉印圖層形成切口，切口延伸至表面的部分。對板件進行沖壓，並於板件及轉印圖層上對應切口位置進行折彎，進而產生形變部，形變部包含部分板件及部分轉印圖層。移除形變部。The present application discloses a method for manufacturing an electronic device casing, which includes the following steps. A transfer layer is formed on the surface of the board. A cut is formed in the transfer layer, and the cut extends to the surface. The plate is punched and bent at the corresponding cutout positions on the plate and the transfer layer, thereby generating a deformation part, which includes a part of the plate and a part of the transfer layer. Remove the deformed part.
藉此，可以製造具有邊框效果的一體式電子裝置殼體。Thereby, an integrated electronic device case having a frame effect can be manufactured.
請配合參閱圖1，其為本發明電子裝置殼體的製造方法之一實施例的步驟流程圖。本發明電子裝置殼體的製造方法係能製造具有邊框效果的一體式電子裝置殼體。Please refer to FIG. 1 for a flowchart of steps of an embodiment of a method for manufacturing an electronic device casing according to the present invention. The manufacturing method of the electronic device casing of the present invention is capable of manufacturing an integrated electronic device casing with a frame effect.
具體地，參閱圖1，在一實施例中，電子裝置殼體可以但不限於是手機殼體、平板電腦殼體或筆記型電腦殼體。在一實施例中，電子裝置殼體由金屬材質製成，以下以電子裝置殼體為鋁材質、鋁合金材質為例進行說明。Specifically, referring to FIG. 1, in an embodiment, the electronic device casing may be, but is not limited to, a mobile phone casing, a tablet computer casing, or a notebook computer casing. In an embodiment, the electronic device casing is made of a metal material, and the electronic device casing is made of an aluminum material and an aluminum alloy material as an example for description.
請參閱圖1與圖2，首先於板件10上的表面11形成一轉印圖層20(步驟S01)。於此，板件10為金屬材質之平板。在一具體實施例中，板件10為鋁材質之平板。Referring to FIG. 1 and FIG. 2, a transfer layer 20 is first formed on the surface 11 on the board 10 (step S01). Here, the plate 10 is a flat plate made of metal. In a specific embodiment, the plate 10 is a flat plate made of aluminum.
於一實施例中，在板件10的表面11上形成轉印圖層20的方式可以是透過奈米轉印微影技術(Nano-imprint Lithography, NIL)。於此，奈米轉印微影技術不限於熱壓式成形奈米轉印(Hot embossing Nano-imprint lithography, HE-NIL)或是紫外光硬化成形奈米轉印(UV-curing Nano-imprint lithography, UV-NIL)。In one embodiment, the method for forming the transfer layer 20 on the surface 11 of the plate 10 may be through nano-imprint Lithography (NIL). Here, nano-imprint lithography technology is not limited to hot-embossing nano-imprint lithography (HE-NIL) or UV-curing nano-imprint lithography , UV-NIL).
於一實施例中，透過熱壓式成形奈米轉印形成轉印圖層20，轉印圖層20的材質可以是熱塑性高分子材料，例如聚甲基丙烯酸甲酯(Poly methyl methacrylate, PMMA)。於此實施例中，在板件10上塗佈加熱至玻璃轉換溫度(Glass transition temperature, Tg)以上的聚甲基丙烯酸甲酯，之後將具有結構圖形的模仁壓印於聚甲基丙烯酸甲酯上，使模仁上的結構圖形轉印至聚甲基丙烯酸甲酯，待降溫後移開模仁，於聚甲基丙烯酸甲酯上即形成具有圖形的轉印圖層20。於此，模仁壓印於聚甲基丙烯酸甲酯上的方式不限於垂直式熱壓或是滾輪式熱壓。In one embodiment, the transfer layer 20 is formed by hot-pressing nano transfer printing. The material of the transfer layer 20 may be a thermoplastic polymer material, such as polymethyl methacrylate (PMMA). In this embodiment, polymethyl methacrylate heated to a glass transition temperature (Tg) or higher is coated on the plate 10, and then a mold core having a structural pattern is imprinted on the polymethyl methacrylate On the ester, the structural pattern on the mold kernel is transferred to polymethyl methacrylate. After the temperature is lowered, the mold kernel is removed, and a pattern transfer layer 20 is formed on the polymethyl methacrylate. Here, the method of embossing the mold core on the polymethyl methacrylate is not limited to vertical hot pressing or roller hot pressing.
於一實施例中，透過紫外光硬化成形奈米轉印，轉印圖層20的材質為低黏度、具光固性之高分子材料。在此實施例中，在板件10上塗佈低黏度、具光固性之高分子材料，將具有透光性及高硬度特性且具有結構圖形的模仁(例如石英材質的模仁)下壓至轉印圖層20上，接著照射紫外光，使光固化材料產生聚合反應而固化，即可形成具有圖形的轉印圖層20。In one embodiment, the nano-printing is formed by UV curing, and the material of the transfer layer 20 is a low-viscosity, photo-curable polymer material. In this embodiment, a low-viscosity, light-curable polymer material is coated on the plate 10, and a mold core (for example, a quartz mold core) having a light transmission and high hardness characteristics and a structural pattern is applied. Pressing onto the transfer layer 20 and then irradiating ultraviolet light causes the photo-curable material to undergo a polymerization reaction and cure, thereby forming a transfer layer 20 having a pattern.
於一實施例中，轉印圖層20可以是僅形成於板件10的局部表面11，例如根據電子裝置殼體的外型來決定轉印圖層20的形成範圍。於一實施例中，電子裝置殼體之外輪廓具有轉折90度的形變部C，轉印圖層20可僅形成於形變部C圍繞的範圍內之表面11。In an embodiment, the transfer layer 20 may be formed on only a part of the surface 11 of the board 10. For example, the formation range of the transfer layer 20 is determined according to the shape of the casing of the electronic device. In an embodiment, the outer contour of the casing of the electronic device has a deformed portion C turned 90 degrees, and the transfer layer 20 may be formed only on the surface 11 within a range surrounded by the deformed portion C.
繼續參閱圖1、圖3及圖4。在板件10上形成轉印圖層20後，於轉印圖層20表面11的另一面形成切口21，且切口21延伸至表面11之部分(步驟S02)。於一實施例中，切口21可根據電子裝置殼體的成品形狀或尺寸，形成於板件10上的特定位置。於一實施例中，板件10上的特定位置為電子裝置殼體的轉折位置。Continue to refer to FIG. 1, FIG. 3 and FIG. 4. After the transfer layer 20 is formed on the plate 10, a cut 21 is formed on the other side of the surface 11 of the transfer layer 20, and the cut 21 extends to a portion of the surface 11 (step S02). In one embodiment, the cutout 21 may be formed at a specific position on the board 10 according to the finished shape or size of the electronic device casing. In one embodiment, the specific position on the plate 10 is a turning position of the electronic device casing.
於一實施例中，切口21是由轉印圖層20延伸至板件10的表面11而不貫穿板件10。於一實施例中，於轉印圖層20上形成切口21的方式可以但不限於是透過刀模加工或雷射雕刻加工。In one embodiment, the cutout 21 extends from the transfer layer 20 to the surface 11 of the board 10 without penetrating the board 10. In an embodiment, the method for forming the cutout 21 in the transfer layer 20 may be, but is not limited to, a die cutting process or a laser engraving process.
接著參閱圖1、圖3，在轉印圖層20上形成切口21之後，對板件10進行沖壓並於板件10及轉印圖層20上對應切口21位置進行折彎，進而產生形變部C，形變部C包含部分板件10及部分轉印圖層20(步驟S03)。於此，透過沖壓加工及折彎的方式對板件10進行加工以成形為預設的電子裝置殼體的形狀。在一具體實施例中，當電子裝置殼體的正面投影外觀形狀為矩形時，形變部C是沿著板件10的外輪廓形成，且形變部C包含板件10的局部及轉印圖層20的局部。Next, referring to FIG. 1 and FIG. 3, after the cutout 21 is formed on the transfer layer 20, the plate 10 is punched and bent at the positions corresponding to the cutout 21 on the plate 10 and the transfer layer 20 to generate a deformation portion C. The deformed portion C includes a part of the plate 10 and a part of the transfer layer 20 (step S03). Here, the plate 10 is processed to form a predetermined shape of the electronic device casing by means of stamping and bending. In a specific embodiment, when the front projection appearance shape of the electronic device casing is rectangular, the deformation portion C is formed along the outer contour of the plate 10, and the deformation portion C includes a part of the plate 10 and the transfer layer 20 Part of it.
由於在轉印圖層20上已將切口21形成於電子裝置殼體的轉折位置，且在沖壓加工時使用之成形模具M會配合對應電子裝置殼體之形狀，如此一來，當板件10進行沖壓使板件10對應成形模具M塑形時，電子裝置殼體轉折位置將因切口21的存在，切口21附近之材料強度將因此降低，使得具有切口21的板件10能更輕易地對應成型模具M成形。Since the cutout 21 has been formed in the turning position of the electronic device casing on the transfer layer 20, and the forming mold M used in the stamping process will match the shape of the corresponding electronic device casing. When the sheet metal 10 is formed by pressing to form the forming mold M, the turning position of the housing of the electronic device will be due to the presence of the cutout 21, and the strength of the material near the cutout 21 will be reduced, so that the plate 10 with the cutout 21 can more easily be formed The mold M is formed.
進一步地，於一實施例中，在板件10進行沖壓及折彎而產生的形變部C可使板件10產生90度彎折，而轉印圖層20則同時隨板件10產生彎折。在此，90度的形變部C不限於是直角形狀或圓弧形狀。以形變部C為圓弧形狀來說，形變部C兩端的法線夾角為90度。於一實施例中，切口21的較佳位置是位於形變部C的兩端中間的位置。Further, in an embodiment, the deformation part C generated by punching and bending the plate 10 can cause the plate 10 to be bent at 90 degrees, and the transfer layer 20 is also bent along with the plate 10 at the same time. Here, the 90-degree deformation portion C is not limited to a rectangular shape or an arc shape. Taking the deformation portion C as an arc shape, the angle between the normals at both ends of the deformation portion C is 90 degrees. In one embodiment, the preferred position of the cutout 21 is a position located between the two ends of the deformed portion C.
一般而言，板件10根據材質不同各具有特定的延展率，當形變部C的延展程度大於板件10本身的延展率時，板件10將因此產生破壞而裂損。進一步地，在形變部C的中間位置是板件10產生最大延展程度的位置，因此，當板件10因延展過度而開始產生破壞時，將由形變部C的中間位置及周遭開始產生破壞。此外，通常轉印圖層20在成形固化後的延展率小於板件10的延展率，因此，轉印圖層20對應板件10的形變部C位置也因此容易產生裂損。Generally speaking, the plate 10 has a specific elongation rate according to different materials. When the degree of extension of the deformation portion C is greater than the elongation rate of the plate 10 itself, the plate 10 will be damaged and cracked due to this. Further, the middle position of the deformed portion C is the position where the plate 10 has the largest degree of extension. Therefore, when the plate 10 starts to break due to excessive extension, the middle position of the deformed portion C and the surrounding area will begin to cause damage. In addition, the elongation of the transfer layer 20 after forming and curing is generally smaller than the elongation of the plate 10. Therefore, the position of the deformed portion C of the transfer layer 20 corresponding to the plate 10 is also prone to cracking.
而在本案中，由於切口21形成於形變部C的中間位置。因此，板件10以及轉印圖層20的延展範圍在切口21處被中斷，使得板件10及轉印圖層20的裂損範圍得以被中止，避免板件10及轉印圖層20的裂損範圍持續且無法預期地延伸。在此，由於切口21是設置在板件10及轉印圖層20的延展程度最大的位置，且越靠近形變部C兩端位置的延展程度已大幅減小。因此，在切口21形成於形變部C的中間位置的實施例中，可以控制板件10及轉印圖層20的裂損範圍不超出形變部C。In this case, the cutout 21 is formed at the middle position of the deformed portion C. Therefore, the extension range of the plate 10 and the transfer layer 20 is interrupted at the cutout 21, so that the damage range of the plate 10 and the transfer layer 20 can be stopped, and the damage range of the plate 10 and the transfer layer 20 is avoided. Continuous and unpredictable. Here, since the cutout 21 is provided at the position where the degree of extension of the plate 10 and the transfer layer 20 is the largest, and the degree of extension closer to the ends of the deformation portion C has been greatly reduced. Therefore, in the embodiment where the cutout 21 is formed at the middle position of the deformed portion C, it is possible to control the damage range of the plate 10 and the transfer layer 20 not to exceed the deformed portion C.
接著，再請進一步地參閱圖1並配合參閱圖5，在板件10進行沖壓及折彎並產生形變部C之後，接著移除形變部C(步驟S04)。具體地，在板件10產生形變部C之後，板件10的形變部C兩端分別連接於第一平面部111與第二平面部112，且第一平面部111的延伸方向與第二平面部112的延伸方向垂直。在此，移除形變部C是移除會產生裂損的形變部C。進一步地，當形變部C上僅有局部裂損時，也可以是僅移除產生裂損的局部的形變部C。Next, referring to FIG. 1 and referring to FIG. 5, after the plate 10 is punched and bent to generate the deformed portion C, the deformed portion C is then removed (step S04). Specifically, after the deformed portion C of the plate 10 is generated, both ends of the deformed portion C of the plate 10 are connected to the first flat portion 111 and the second flat portion 112, respectively, and the extending direction of the first flat portion 111 and the second flat The extending direction of the portion 112 is perpendicular. Here, the removal of the deformed portion C is the removal of the deformed portion C that may cause cracks. Further, when there is only a local crack in the deformed portion C, only the local deformed portion C where the crack is generated may be removed.
於一實施例中，移除形變部C的方式可以透過電腦數值控制(Computer Numerical Control；CNC)工具機來移除。在一具體實施例中，移除形變部C的方式可以但不限於是透過電腦數值控制工具機以高光切削的加工方式來移除形變部C。高光切削的加工方式是透過精雕機的鑽石刀以高速旋轉（一般轉速為20000轉/每分鐘）的方式進行切削。透過高光切削的加工方式使板件10及轉印圖層20在對應形變部C位置的局部被移除，並且在移除形變部C之後顯現出板件10的金屬原色。而高光切削的高速加工方式則得以使顯露於外的板件10產生局部的高亮效果。In one embodiment, the method of removing the deformed portion C can be removed by a computer numerical control (CNC) machine tool. In a specific embodiment, the method of removing the deformed portion C may be, but is not limited to, a process of removing the deformed portion C by a high-gloss cutting process through a computer numerical control machine tool. The processing method of high-gloss cutting is to cut through the diamond knife of the engraving machine at a high speed (generally rotating speed is 20,000 revolutions per minute). Part of the plate 10 and the transfer layer 20 at the positions corresponding to the deformed portion C are removed by the processing method of high-gloss cutting, and the metallic original color of the plate 10 appears after the deformed portion C is removed. The high-speed machining method of the high-gloss cutting can make the plate 10 exposed to the outside produce a local highlighting effect.
於一實施例中，形變部C形成於板件10的整個外輪廓，而在移除形變部C之後，高光切削的加工方式使得板件10的外輪廓形成局部的高光效果。此局部高光效果可與轉印圖層20的顏色、圖樣產生反差而展現出類似邊框的視覺效果。於一實施例中，移除形變部C的方式並不限於透過高光切削的加工方式移除，也可以是透過一般的銑削、研磨或雷射雕刻的方式來移除形變部C。In an embodiment, the deformed portion C is formed on the entire outer contour of the plate 10, and after the deformed portion C is removed, the processing method of the high-gloss cutting makes the outer contour of the plate 10 form a local highlight effect. This local highlight effect can be contrasted with the color and pattern of the transfer layer 20 and exhibit a visual effect similar to a border. In an embodiment, the method of removing the deformed portion C is not limited to the processing method of high-gloss cutting, and the deformed portion C may also be removed by a general milling, grinding, or laser engraving method.
進一步地，在板件10的材質為鋁或鋁合金的實施例中，由於鋁材質的活性高，因而，板件10在未被轉印圖層20覆蓋的部份以及經過移除形變部C而顯露出的部份將容易產生氧化，但由於鋁材質產生的氧化物極緻密而能隔絕空氣以防止表面氧化物內部的金屬產生進一步地氧化。因此，即使板件10在移除形變部C之後暴露於大氣也可以具有基本的抗氧化效果。Further, in the embodiment in which the material of the plate 10 is aluminum or an aluminum alloy, the aluminum material is highly active. Therefore, the portion of the plate 10 is not covered by the transfer layer 20 and the deformation portion C is removed. The exposed part will easily be oxidized, but because the oxide produced by aluminum material is extremely dense, it can block the air to prevent further oxidation of the metal inside the surface oxide. Therefore, even if the plate 10 is exposed to the atmosphere after the deformation portion C is removed, it can have a basic antioxidant effect.
而為確保直接曝露於空氣中的板件10之美觀性、機械性能、抗氧化及耐磨耗特性，則可以更進一步地進行表面處理。於一實施例中，對板件10進行表面處理的部分是板件10上轉印圖層20以外的部分，以及移除形變部C之後直接顯露於大氣的板件10部分。In order to ensure the aesthetics, mechanical properties, oxidation resistance and abrasion resistance of the panel 10 directly exposed to the air, surface treatment can be further performed. In one embodiment, the surface-treated portion of the plate 10 is a portion other than the transfer layer 20 on the plate 10 and a portion of the plate 10 that is directly exposed to the atmosphere after the deformation portion C is removed.
進一步地，對板件10進行的表面處理可以但不限於是陽極處理、粉體塗裝、電著塗裝、噴砂或拉絲。此外，對板件10進行的表面處理較佳為能產生防護層P的防氧化處理，如圖6所示。Further, the surface treatment performed on the plate 10 may be, but is not limited to, anodizing, powder coating, electrocoating, sandblasting, or wire drawing. In addition, the surface treatment of the plate 10 is preferably an oxidation prevention treatment capable of generating the protective layer P, as shown in FIG. 6.
於一實施例中，陽極處理主要是透過電化學的方式控制氧化層的生成，增加板件10表面之抗氧化性、機械性質、耐腐蝕性。並且可以透過不同的電解液或合金來進行上色或提高耐磨性。於一實施例中，陽極處理不限於是硬質陽極處理、複合陽極處理或雙色陽極處理。In one embodiment, the anodic treatment mainly controls the formation of an oxide layer through an electrochemical method to increase the oxidation resistance, mechanical properties, and corrosion resistance of the surface of the plate 10. And can be colored or improved wear resistance through different electrolytes or alloys. In one embodiment, the anodizing is not limited to a hard anodizing, a composite anodizing, or a two-color anodizing.
於一實施例中，粉體塗裝主要是透過粉墨噴塗設備將粉墨塗料噴塗到板件10的表面，並在靜電作用下，使粉末塗料均勻地吸附於板件10，接著再經過高溫烘烤以形成覆蓋在板件10表面的防護層P，藉以在板件10的表面形成各種顏色並防止板件的氧化。In one embodiment, the powder coating is mainly by spraying the powder ink coating on the surface of the plate 10 through the powder ink spraying equipment, and the powder coating is uniformly adsorbed on the plate 10 under the action of static electricity, and then subjected to high temperature. Baking is performed to form a protective layer P covering the surface of the board 10, thereby forming various colors on the surface of the board 10 and preventing the board from being oxidized.
於一實施例中，電著塗裝主要是將電著塗料添加於水中並在電流通過時沉澱於板件10，藉以形成均勻且非水溶性的防護層P，藉以提高板件10的耐蝕性、抗氧化性。In one embodiment, the electrotexture coating is mainly adding electrotexture coating to water and settling on the plate 10 when the current passes, thereby forming a uniform and water-insoluble protective layer P, thereby improving the corrosion resistance of the plate 10 , Antioxidant.
於一實施例中，噴砂方式主要是採用高速的壓縮空氣為動力將微細的不鏽鋼砂朝向板件10的表面撞擊，使板件10表面附著微細的不鏽鋼砂以形成防護層P，並藉此使板件10的表面可以呈現不同的表面粗糙度。於此，在對板件10進行的表面處理為噴砂的實施例中，也可以在經過噴砂後再進行陽極處理，也就是可以進行複合式的表面處理。In one embodiment, the sand blasting method mainly uses high-speed compressed air as a force to impinge fine stainless steel sand toward the surface of the plate 10, so that the fine stainless steel sand adheres to the surface of the plate 10 to form a protective layer P, and thereby uses the The surface of the plate 10 may exhibit different surface roughness. Here, in the embodiment where the surface treatment of the plate 10 is sandblasting, the anode treatment may be performed after the sandblasting, that is, the composite surface treatment may be performed.
於一實施例中，拉絲方式主要是利用砂帶研磨板件10，使板件10表面形成線紋，藉以使得板件10表面呈現不同的美觀效果。於此，對板件10進行的表面處理可以是包含拉絲以及陽極處理的複合式表面處理。In one embodiment, the drawing method mainly uses abrasive belts to grind the plate 10 to form a line on the surface of the plate 10, so that the surface of the plate 10 exhibits different aesthetic effects. Here, the surface treatment performed on the plate member 10 may be a composite surface treatment including wire drawing and anodization.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之修改與變化。因此，只要這些修改與變化是在後附之申請專利範圍及與其同等之範圍內，本發明也將涵蓋這些修改與變化。Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and changes without departing from the spirit and scope of the present invention. Therefore, as long as these modifications and changes are within the scope of the attached patent application and the scope equivalent thereto, the present invention will also cover these modifications and changes.
10‧‧‧板件10‧‧‧ Plate
11‧‧‧表面11‧‧‧ surface
111‧‧‧第一平面部111‧‧‧First plane
112‧‧‧第二平面部112‧‧‧Second Plane Department
20‧‧‧轉印圖層20‧‧‧ transfer layer
21‧‧‧切口21‧‧‧ incision
C‧‧‧形變部C‧‧‧Deformation Department
M‧‧‧成形模具M‧‧‧Forming mold
P‧‧‧防護層P‧‧‧ protective layer
S01~S04‧‧‧步驟S01 ~ S04‧‧‧step
圖1為本發明一實施例的步驟流程圖。 圖2為本發明形成轉印圖層的示意圖。 圖3為本發明形成切口的示意圖。 圖4為圖3中圈選處4的局部放大圖。 圖5為本發明方法中形成形變部的示意圖。 圖6為本發明方法中形成防護層的示意圖。FIG. 1 is a flowchart of steps according to an embodiment of the present invention. FIG. 2 is a schematic diagram of forming a transfer layer according to the present invention. FIG. 3 is a schematic view of forming a cut in the present invention. FIG. 4 is a partially enlarged view of a circled portion 4 in FIG. 3. FIG. 5 is a schematic diagram of forming a deformed portion in the method of the present invention. FIG. 6 is a schematic diagram of forming a protective layer in the method of the present invention.
Claims (8)
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| TW107135862A TWI674054B (en) | 2018-10-11 | 2018-10-11 | Manufacturing method of housing of electronic device |
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| TW107135862A TWI674054B (en) | 2018-10-11 | 2018-10-11 | Manufacturing method of housing of electronic device |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201309399A (en) * | 2011-08-17 | 2013-03-01 | Jiin Ming Industry Co Ltd | Method of producing decorative board formed by progressive stamping formation |
| CN206077897U (en) * | 2016-09-28 | 2017-04-05 | 东莞劲胜精密组件股份有限公司 | A 3C electronic product shell, metal blank and 3C electronic product |
| US20170205541A1 (en) * | 2016-01-18 | 2017-07-20 | Corning Incorporated | Enclosures having an improved tactile surface |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201309399A (en) * | 2011-08-17 | 2013-03-01 | Jiin Ming Industry Co Ltd | Method of producing decorative board formed by progressive stamping formation |
| US20170205541A1 (en) * | 2016-01-18 | 2017-07-20 | Corning Incorporated | Enclosures having an improved tactile surface |
| CN206077897U (en) * | 2016-09-28 | 2017-04-05 | 东莞劲胜精密组件股份有限公司 | A 3C electronic product shell, metal blank and 3C electronic product |
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