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TWI673111B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

Info

Publication number
TWI673111B
TWI673111B TW107123497A TW107123497A TWI673111B TW I673111 B TWI673111 B TW I673111B TW 107123497 A TW107123497 A TW 107123497A TW 107123497 A TW107123497 A TW 107123497A TW I673111 B TWI673111 B TW I673111B
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
holding portion
processing apparatus
holding
Prior art date
Application number
TW107123497A
Other languages
English (en)
Chinese (zh)
Other versions
TW201912254A (zh
Inventor
Eiji UMEDA
梅田栄次
Takayuki GOHARA
郷原隆行
Original Assignee
SCREEN Holdings Co., Ltd.
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SCREEN Holdings Co., Ltd., 日商斯庫林集團股份有限公司 filed Critical SCREEN Holdings Co., Ltd.
Publication of TW201912254A publication Critical patent/TW201912254A/zh
Application granted granted Critical
Publication of TWI673111B publication Critical patent/TWI673111B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • H10P52/00—

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW107123497A 2017-08-24 2018-07-06 基板處理裝置 TWI673111B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017161444A JP6982432B2 (ja) 2017-08-24 2017-08-24 基板処理装置
JP2017-161444 2017-08-24

Publications (2)

Publication Number Publication Date
TW201912254A TW201912254A (zh) 2019-04-01
TWI673111B true TWI673111B (zh) 2019-10-01

Family

ID=65440036

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107123497A TWI673111B (zh) 2017-08-24 2018-07-06 基板處理裝置

Country Status (3)

Country Link
JP (1) JP6982432B2 (ja)
TW (1) TWI673111B (ja)
WO (1) WO2019039068A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI747580B (zh) * 2020-10-28 2021-11-21 辛耘企業股份有限公司 晶圓蝕刻裝置
KR102588826B1 (ko) * 2021-09-01 2023-10-12 동아대학교 산학협력단 무전해 니켈 도금장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103165495A (zh) * 2011-12-19 2013-06-19 大日本网屏制造株式会社 基板保持旋转装置、基板处理装置以及基板处理方法
JP2015115456A (ja) * 2013-12-11 2015-06-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2015213105A (ja) * 2014-05-01 2015-11-26 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体
TWI569350B (zh) * 2014-03-28 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6672023B2 (ja) * 2016-03-08 2020-03-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103165495A (zh) * 2011-12-19 2013-06-19 大日本网屏制造株式会社 基板保持旋转装置、基板处理装置以及基板处理方法
CN103165495B (zh) 2011-12-19 2016-04-20 斯克林集团公司 基板保持旋转装置、基板处理装置以及基板处理方法
JP2015115456A (ja) * 2013-12-11 2015-06-22 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
TWI569350B (zh) * 2014-03-28 2017-02-01 斯克林集團公司 基板處理裝置及基板處理方法
JP2015213105A (ja) * 2014-05-01 2015-11-26 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに基板処理プログラムを記録したコンピュータ読み取り可能な記録媒体

Also Published As

Publication number Publication date
WO2019039068A1 (ja) 2019-02-28
JP2019039038A (ja) 2019-03-14
TW201912254A (zh) 2019-04-01
JP6982432B2 (ja) 2021-12-17

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