TWI672091B - Heat dissipation device and cooling system - Google Patents
Heat dissipation device and cooling system Download PDFInfo
- Publication number
- TWI672091B TWI672091B TW106140492A TW106140492A TWI672091B TW I672091 B TWI672091 B TW I672091B TW 106140492 A TW106140492 A TW 106140492A TW 106140492 A TW106140492 A TW 106140492A TW I672091 B TWI672091 B TW I672091B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- piston
- storage tank
- cover
- rotating shaft
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一種散熱器包含散熱底座、罩蓋、活塞機構及轉動機構。散熱底座具有熱接觸面。罩蓋設置於散熱底座,以令散熱底座與罩蓋共同圍繞出儲液槽,罩蓋具有液體入口及液體出口,液體入口及液體出口連通儲液槽。活塞機構包含缸體及活塞體,缸體具有容置槽,缸體裝設於罩蓋,且容置槽連通儲液槽,活塞體可活動地位於容置槽。轉動機構包含轉動軸及葉輪,轉動軸可轉動地位於儲液槽,並樞接於活塞體,葉輪固定於轉動軸,並對應於液體入口。其中,當液體自液體入口流入儲液槽時,流入之液體會推動葉輪,並透過轉動軸帶動活塞體相對缸體反復移動。A radiator includes a heat dissipation base, a cover, a piston mechanism and a rotation mechanism. The cooling base has a thermal contact surface. The cover is arranged on the heat dissipation base, so that the heat dissipation base and the cover jointly surround the liquid storage tank. The cover has a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet communicate with the liquid storage tank. The piston mechanism includes a cylinder body and a piston body. The cylinder body has an accommodating groove. The cylinder body is installed on the cover. The accommodating groove communicates with the liquid storage groove. The piston body is movably located in the accommodating groove. The rotating mechanism includes a rotating shaft and an impeller. The rotating shaft is rotatably located in the liquid storage tank and is pivotally connected to the piston body. The impeller is fixed to the rotating shaft and corresponds to the liquid inlet. Among them, when the liquid flows from the liquid inlet into the liquid storage tank, the inflowing liquid will push the impeller, and the piston body will be repeatedly moved relative to the cylinder through the rotating shaft.
Description
本發明係關於一種散熱器及冷卻系統,特別是一種具有活塞機構的散熱器及冷卻系統。 The invention relates to a radiator and a cooling system, in particular to a radiator and a cooling system with a piston mechanism.
散熱裝置與電子裝置的發展息息相關。由於電子裝置在運作時,電子元件會產生大量的熱能,如果這些熱能不能有效地排除而累積在電子裝置內部的電子元件上,電子元件便有可能因為不斷升高的溫度而失效或當機。因此,廠商常透過液冷系統將電子裝置內部的溫度降低,以維持電子裝置正常的運作。 The heat sink is closely related to the development of electronic devices. Since electronic components generate a large amount of thermal energy when the electronic device is in operation, if these thermal energy cannot be effectively eliminated and accumulated on the electronic components inside the electronic device, the electronic component may fail or crash due to the rising temperature. Therefore, manufacturers often reduce the temperature inside the electronic device through a liquid cooling system to maintain the normal operation of the electronic device.
然而,目前市面上各廠商所設計的液冷系統在形式上皆大同小異,故對於液冷系統的散熱效率的提升因液體系統本身所存在的限制而難以改善,例如電子元件的熱量難以迅速被冷卻液吸收,或是吸熱後的冷卻液難以迅速排出的問題。此外,廠商目前所生產的液冷系統在外觀的視覺上顯得略微單調。 However, at present, the liquid cooling systems designed by various manufacturers in the market are very similar in form, so the improvement of the heat dissipation efficiency of the liquid cooling system is difficult to improve due to the limitations of the liquid system itself. For example, the heat of electronic components is difficult to be quickly cooled. Liquid absorption, or the problem that the cooling liquid after heat absorption cannot be quickly discharged. In addition, the liquid cooling system currently produced by the manufacturer appears slightly monotonous in appearance.
本發明在於提供一種散熱器及冷卻系統,藉以解決先前技術中液體於液冷系統的散熱效率難以提升及液冷系統外觀單調的問題。 The invention is to provide a radiator and a cooling system, so as to solve the problems that the heat dissipation efficiency of a liquid in a liquid cooling system in the prior art is difficult to improve and the appearance of the liquid cooling system is monotonous.
本發明之一實施例所揭露之一種散熱器,適於熱接觸熱源。散熱器包含散熱底座、罩蓋、活塞機構及轉動機構。散熱底座具有 熱接觸面,熱接觸面用以供熱源熱接觸。罩蓋設置於散熱底座,以令散熱底座與罩蓋共同圍繞出儲液槽,罩蓋具有液體入口及液體出口,液體入口及液體出口連通儲液槽。活塞機構包含缸體及活塞體,缸體具有容置槽,缸體裝設於罩蓋,且容置槽連通儲液槽,活塞體可活動地位於容置槽。轉動機構包含轉動軸及葉輪,轉動軸可轉動地位於儲液槽,並樞接於活塞體,葉輪固定於轉動軸,並對應於液體入口。其中,當液體自液體入口流入儲液槽時,流入之液體會推動葉輪,並透過轉動軸帶動活塞體相對缸體反復移動。 A heat sink disclosed in an embodiment of the present invention is suitable for thermal contact with a heat source. The radiator includes a heat dissipation base, a cover, a piston mechanism and a rotating mechanism. The cooling base has Thermal contact surface. The thermal contact surface is used for thermal contact of a heat source. The cover is arranged on the heat dissipation base, so that the heat dissipation base and the cover jointly surround the liquid storage tank. The cover has a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet communicate with the liquid storage tank. The piston mechanism includes a cylinder body and a piston body. The cylinder body has an accommodating groove. The cylinder body is installed on the cover. The accommodating groove communicates with the liquid storage groove. The piston body is movably located in the accommodating groove. The rotating mechanism includes a rotating shaft and an impeller. The rotating shaft is rotatably located in the liquid storage tank and is pivotally connected to the piston body. The impeller is fixed to the rotating shaft and corresponds to the liquid inlet. Among them, when the liquid flows from the liquid inlet into the liquid storage tank, the inflowing liquid will push the impeller, and the piston body will be repeatedly moved relative to the cylinder through the rotating shaft.
本發明之另一實施例所揭露之一種冷卻系統包含一水泵、二流管、至少一水冷排及一散熱器。水泵具有一入水口及一出水口。二流管之一端分別連接於水泵之入水口及出水口。至少一水冷排設置於二流管之一。散熱器包含一散熱底座、一罩蓋、至少一活塞機構及一轉動機構。罩蓋設置於散熱底座,以令散熱底座與罩蓋間形成一儲液槽,罩蓋具有一液體入口及一液體出口,液體入口及液體出口連通儲液槽,且二流管之另一端分別連接於液體入口及液體出口。至少一活塞機構包含一缸體及一活塞體,缸體具有一容置槽,缸體裝設於罩蓋,且容置槽連通儲液槽,活塞體可活動地位於容置槽。轉動機構包含一轉動軸及一葉輪,轉動軸可轉動地位於儲液槽,並樞接於活塞體,葉輪固定於轉動軸,並對應於液體入口。其中,當水泵驅使一液體自液體入口流入儲液槽時,流入之液體會推動葉輪,並透過轉動軸帶動活塞體相對缸體反復移動。 A cooling system disclosed in another embodiment of the present invention includes a water pump, a two-flow pipe, at least one water cooling row, and a radiator. The water pump has a water inlet and a water outlet. One end of the second-flow pipe is respectively connected to the water inlet and the water outlet of the water pump. At least one water-cooled row is disposed in one of the second-flow pipes. The radiator includes a heat dissipation base, a cover, at least a piston mechanism and a rotating mechanism. The cover is arranged on the heat dissipation base, so that a liquid storage tank is formed between the heat dissipation base and the cover. The cover has a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet communicate with the liquid storage tank, and the other ends of the two-flow tubes are connected respectively For liquid inlet and liquid outlet. At least one piston mechanism includes a cylinder body and a piston body. The cylinder body has an accommodating groove, the cylinder body is installed on the cover, and the accommodating groove communicates with the liquid storage groove. The piston body is movably located in the accommodating groove. The rotating mechanism includes a rotating shaft and an impeller. The rotating shaft is rotatably located in the liquid storage tank and is pivotally connected to the piston body. The impeller is fixed to the rotating shaft and corresponds to the liquid inlet. Wherein, when the water pump drives a liquid from the liquid inlet into the liquid storage tank, the inflowing liquid will push the impeller and cause the piston body to repeatedly move relative to the cylinder through the rotating shaft.
根據上述實施例所揭露的散熱器及冷卻系統,因液體自液體入口流入儲液槽時,流入之液體會推動葉輪,並透過轉動軸帶動活塞 體相對缸體反復移動,藉此可藉由轉動的葉輪及往復運動的活塞,加速液體吸收熱源所散發的熱量,以及有效地排出吸熱後的液體,使得冷卻系統的散熱效率得更進一步提升。 According to the radiator and cooling system disclosed in the above embodiment, when liquid flows from the liquid inlet into the liquid storage tank, the inflowing liquid will push the impeller and drive the piston through the rotating shaft. The body is repeatedly moved relative to the cylinder body, so that the liquid can absorb the heat emitted by the heat source and effectively discharge the heat-absorbing liquid through the rotating impeller and the reciprocating piston, so that the heat dissipation efficiency of the cooling system can be further improved.
以上關於本發明內容的說明及以下實施方式的說明係用以示範與解釋本發明的原理,並且提供本發明的專利申請範圍更進一步的解釋。 The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the scope of the patent application of the present invention.
10‧‧‧冷卻系統 10‧‧‧ cooling system
11‧‧‧熱源 11‧‧‧ heat source
12‧‧‧液體 12‧‧‧ liquid
100‧‧‧水泵 100‧‧‧Water pump
110‧‧‧入水口 110‧‧‧Inlet
120‧‧‧出水口 120‧‧‧ Outlet
200‧‧‧流管 200‧‧‧flow tube
300‧‧‧水冷排 300‧‧‧Water-cooled drain
400‧‧‧散熱器 400‧‧‧ Radiator
410‧‧‧散熱底座 410‧‧‧cooling base
411‧‧‧容置槽體 411‧‧‧ receiving tank
412‧‧‧散熱鰭片 412‧‧‧Cooling Fin
4111‧‧‧容置空間 4111‧‧‧accommodation space
4112‧‧‧液流口 4112‧‧‧fluid
4121‧‧‧鰭片部 4121‧‧‧ Fin Section
4122‧‧‧板部 4122‧‧‧Bobe
4123‧‧‧熱接觸面 4123‧‧‧ Thermal contact surface
420‧‧‧罩蓋 420‧‧‧ Cover
421‧‧‧液體入口 421‧‧‧Liquid inlet
422‧‧‧液體出口 422‧‧‧Liquid outlet
430‧‧‧分隔板 430‧‧‧ divider
440‧‧‧活塞機構 440‧‧‧Piston mechanism
441‧‧‧第一活塞機構 441‧‧‧first piston mechanism
4411、4421‧‧‧缸體 4411, 4421‧‧‧ cylinder
4412、4422‧‧‧活塞體 4412, 4422‧‧‧Piston bodies
4411a、4421a‧‧‧容置槽 4411a, 4421a‧‧‧ Receiving trough
442‧‧‧第二活塞機構 442‧‧‧Second piston mechanism
450‧‧‧轉動機構 450‧‧‧Rotating mechanism
451‧‧‧轉動軸 451‧‧‧Rotating shaft
452‧‧‧葉輪 452‧‧‧ Impeller
453‧‧‧連桿 453‧‧‧ connecting rod
460‧‧‧儲液槽 460‧‧‧ liquid storage tank
461‧‧‧子空間 461‧‧‧Subspace
P1、P2、P3、P4、P5、P6、C‧‧‧中心軸線 P1, P2, P3, P4, P5, P6, C‧‧‧ central axis
N‧‧‧法線 N‧‧‧normal
θ 1、θ 2、θ 3、θ 4、θ 5、θ 6‧‧‧銳角 θ 1, θ 2, θ 3, θ 4, θ 5, θ 6‧‧‧ acute angle
R1、R2、R3、R4‧‧‧樞接軸線 R1, R2, R3, R4‧‧‧ pivot axis
D1、D2‧‧‧方向 D1, D2‧‧‧ direction
圖1為根據本發明第一實施例所揭露的冷卻系統的正視圖。 FIG. 1 is a front view of a cooling system according to a first embodiment of the present invention.
圖2為圖1的散熱器的立體圖。 FIG. 2 is a perspective view of the heat sink of FIG. 1.
圖3為圖2的俯視圖。 FIG. 3 is a top view of FIG. 2.
圖4為圖2的前視圖。 FIG. 4 is a front view of FIG. 2.
圖5為圖2的第二活塞機構為最低點的剖視示意圖。 FIG. 5 is a schematic cross-sectional view of the second piston mechanism of FIG. 2 as the lowest point.
圖6為圖2的第二活塞機構為最高點的剖視示意圖。 FIG. 6 is a schematic cross-sectional view of the second piston mechanism of FIG. 2 as the highest point.
請參閱圖1至圖4。圖1為根據本發明第一實施例所揭露的冷卻系統的正視圖。圖2為圖1的散熱器的立體圖。圖3為圖2的俯視圖。圖4為圖2的前視圖。 See Figures 1 to 4. FIG. 1 is a front view of a cooling system according to a first embodiment of the present invention. FIG. 2 is a perspective view of the heat sink of FIG. 1. FIG. 3 is a top view of FIG. 2. FIG. 4 is a front view of FIG. 2.
本實施例之冷卻系統10包含一水泵100、二流管200、二水冷排300及一散熱器400。 The cooling system 10 of this embodiment includes a water pump 100, a second flow pipe 200, two water cooling plats 300, and a radiator 400.
水泵100具有一入水口110及一出水口120。二流管200之一端分別連接於水泵100之入水口110及出水口120,且二水冷排 300分別設置於二流管200。 The water pump 100 has a water inlet 110 and a water outlet 120. One end of the second-flow pipe 200 is respectively connected to the water inlet 110 and the water outlet 120 of the water pump 100, and the two water-cooling drains 300 are respectively disposed on the second-flow tube 200.
在本實施例中,水冷排300的數量為二的設置,並非用以限定本發明。在其他實施例中,水冷排的數量可調整為一個或是大於二個。 In this embodiment, the number of the water-cooled drains 300 is two, which is not intended to limit the present invention. In other embodiments, the number of water-cooled rows can be adjusted to one or more than two.
由圖2所示,散熱器400適於熱接觸一熱源11。散熱器400包含一散熱底座410、一罩蓋420、一分隔板430、一活塞機構440及一轉動機構450。 As shown in FIG. 2, the heat sink 400 is adapted to thermally contact a heat source 11. The heat sink 400 includes a heat dissipation base 410, a cover 420, a partition plate 430, a piston mechanism 440, and a rotation mechanism 450.
散熱底座410包含一容置槽體411及一散熱鰭片412。容置槽體411具有一容置空間4111及三個液流口4112,且容置空間4111連通三個液流口4112。散熱鰭片412包含相連的一鰭片部4121及一板部4122。板部4122封閉容置空間4111而令鰭片部4121位於容置空間4111內。板部4122遠離鰭片部4121之一側具有一熱接觸面4123。在本實施例中,散熱鰭片412的板部4122為銅板搭配鋁塊的設置,用以供熱源11熱接觸。 The heat dissipation base 410 includes a receiving groove body 411 and a heat dissipation fin 412. The accommodating tank body 411 has an accommodating space 4111 and three liquid flow ports 4112, and the accommodating space 4111 communicates with the three liquid flow ports 4112. The heat dissipation fin 412 includes a fin portion 4121 and a plate portion 4122 connected to each other. The plate portion 4122 closes the accommodation space 4111 so that the fin portion 4121 is located in the accommodation space 4111. The plate portion 4122 has a thermal contact surface 4123 on one side remote from the fin portion 4121. In this embodiment, the plate portion 4122 of the heat dissipation fin 412 is a copper plate and an aluminum block, and is used for thermal contact of the heat source 11.
在圖2中,罩蓋420為無法透視的蓋體,但不以此為限。在其他實施例中,部分罩蓋的板體可為透視板,且罩體的材質可採用壓克力的質料。針對罩蓋為可透視的蓋體,後續將詳細說明。 In FIG. 2, the cover 420 is a cover that cannot be seen through, but is not limited thereto. In other embodiments, the plate body of the cover may be a see-through plate, and the material of the cover body may be an acrylic material. The cover is a cover body that can be seen through, which will be described in detail later.
罩蓋420設置於散熱底座410的容置槽體411,以令容置槽體411與罩蓋420共同圍繞出一儲液槽460,罩蓋420具有一液體入口421及一液體出口422。分隔板430位於儲液槽460而將儲液槽460分成兩子空間461。兩子空間461分別連通於液體入口421與液體出口422,且其中兩個液流口4112位於其中一子空間461,另一液流口4112 位於另一子空間461,容置槽體411的容置空間4111透過三個液流口4112分別連通二子空間461。二流管200之另一端分別連接於液體入口421及液體出口422。液體入口421之中心軸線P1與液體出口422之中心軸線P2皆與熱接觸面4123之法線N夾一銳角θ 1、θ 2,且此二銳角θ 1、θ 2的角度相等。 The cover 420 is disposed in the accommodating groove 411 of the heat dissipation base 410 so that the accommodating groove 411 and the cover 420 surround a liquid storage tank 460 together. The cover 420 has a liquid inlet 421 and a liquid outlet 422. The partition plate 430 is located in the liquid storage tank 460 and divides the liquid storage tank 460 into two subspaces 461. The two subspaces 461 communicate with the liquid inlet 421 and the liquid outlet 422, respectively, and two of the liquid flow ports 4112 are located in one of the subspaces 461 and the other liquid flow port 4112. Located in the other subspace 461, the accommodating spaces 4111 of the accommodating tank 411 communicate with the two subspaces 461 through the three liquid flow ports 4112, respectively. The other ends of the second-flow tube 200 are connected to the liquid inlet 421 and the liquid outlet 422, respectively. The central axis P1 of the liquid inlet 421 and the central axis P2 of the liquid outlet 422 are at an acute angle θ1, θ2 with the normal line N of the thermal contact surface 4123, and the angles of the two acute angles θ1, θ2 are equal.
在本實施例中,液流口4112的數量為三,以及三個液流口4112的其中二個位於一子空間461,另一液流口4112位於另一子空間461的設置,並非用以限定本發明。在其他實施例中,液流口位於二子空間的數量可依據廠商的設計而調整數量。 In this embodiment, the number of the liquid flow ports 4112 is three, and two of the three liquid flow ports 4112 are located in one subspace 461, and the other liquid flow port 4112 is located in the other subspace 461. The invention is limited. In other embodiments, the number of liquid flow ports in the second subspace can be adjusted according to the design of the manufacturer.
此外,液體入口421之中心軸線P1與熱接觸面4123之法線N所夾的銳角θ 1之角度等於液體出口422之中心軸線P2與熱接觸面4123之法線N所夾的銳角θ 2之角度,但並不以此為限。在其他實施例中,液體入口之中心軸線與熱接觸面之法線所夾的銳角可大於或小於液體出口之中心軸線與熱接觸面之法線所夾的銳角之角度。 In addition, the acute angle θ 1 between the central axis P1 of the liquid inlet 421 and the normal line N of the thermal contact surface 4123 is equal to the acute angle θ 2 between the central axis P2 of the liquid outlet 422 and the normal line N of the thermal contact surface 4123. Angle, but not limited to this. In other embodiments, the acute angle between the central axis of the liquid inlet and the normal line of the thermal contact surface may be greater or smaller than the acute angle between the central axis of the liquid outlet and the normal line of the thermal contact surface.
本實施例的冷卻系統10的循環是透過水泵100驅使液體從水泵100的出水口120流出,且透過其中一流管200送往水冷排300而使得液體冷卻後,再送至罩蓋420的液體入口421,並沿方向D1令液體進入其中一子空間461。液體進入其中一子空間461後會流過二液流口4112而進入容置槽體411的容置空間4111,以令冷卻後的液體吸取散熱鰭片412從熱源11吸收的熱能。液體吸取熱量後再經由連通於另一子空間461的液流口4112流出且自液體出口422排出罩蓋420而進入另一流管200。此時,吸收熱量的液體經由另一流管200的輸送而 抵達另一水冷排300,以令吸收熱量的液體降溫,接著再將冷卻後的液體輸送回水泵100,以完成一個冷卻循環。 The circulation of the cooling system 10 of this embodiment is to drive the liquid out of the water outlet 120 of the water pump 100 through the water pump 100, and send the liquid to the water-cooled drain 300 through the primary pipe 200 to cool the liquid, and then send it to the liquid inlet 421 of the cover 420. And in the direction D1, the liquid enters one of the subspaces 461. After the liquid enters one of the sub-spaces 461, it will flow through the two-liquid flow port 4112 and enter the accommodating space 4111 of the accommodating tank 411, so that the cooled liquid can absorb the heat energy absorbed by the heat dissipation fins 412 from the heat source 11. The liquid absorbs heat and then flows out through the liquid flow port 4112 communicating with the other subspace 461 and exits the cover 420 from the liquid outlet 422 to enter the other flow tube 200. At this time, the heat-absorbing liquid is transported via another flow tube 200 Arrive at another water-cooled row 300 to cool the heat-absorbing liquid, and then send the cooled liquid back to the water pump 100 to complete a cooling cycle.
請再參閱圖1至圖4,活塞機構440包含二個第一活塞機構441及二個第二活塞機構442。二個第一活塞機構441分別與液體入口421沿一直線排列,二個第二活塞機構442分別與液體出口422沿一直線排列。每個第一活塞機構441及每個第二活塞機構442各包含一缸體4411、4421及一活塞體4412、4422。本實施例之缸體4411、4421為無法透視的構造,且每個第一活塞機構441及每個第二活塞機構442的缸體4411、4421具有一容置槽4411a、4421a,缸體4411、4421裝設於罩蓋420,且容置槽4411a、4421a連通儲液槽460的其中一子空間461。每個缸體4411、4421之中心軸線P3、P4、P5、P6與熱接觸面4123之法線N夾一銳角θ 3、θ 4、θ 5、θ 6。活塞體4412、4422可活動地位於容置槽4411a、4421a。 Please refer to FIGS. 1 to 4 again, the piston mechanism 440 includes two first piston mechanisms 441 and two second piston mechanisms 442. The two first piston mechanisms 441 are aligned in line with the liquid inlet 421, and the two second piston mechanisms 442 are aligned in line with the liquid outlet 422, respectively. Each of the first piston mechanism 441 and each of the second piston mechanism 442 includes a cylinder body 4411, 4421, and a piston body 4412, 4422. The cylinder bodies 4411 and 4421 of this embodiment have a structure that cannot be seen through, and the cylinder bodies 4411 and 4421 of each of the first piston mechanism 441 and each of the second piston mechanism 442 have a receiving groove 4411a and 4421a. 4421 is installed on the cover 420, and the accommodating grooves 4411a and 4421a communicate with one of the subspaces 461 of the liquid storage tank 460. The central axis P3, P4, P5, P6 of each cylinder body 4411, 4421 and the normal line N of the thermal contact surface 4123 form an acute angle θ3, θ4, θ5, θ6. The piston bodies 4412 and 4422 are movably located in the receiving grooves 4411a and 4421a.
在本實施例中,每個缸體4411、4421的中心軸線P3、P4、P5、P6與熱接觸面4123之法線N所夾的銳角θ 3、θ 4、θ 5、θ 6之角度皆相等,並且等於液體入口421及液體出口422之中心軸線P1、P2與熱接觸面4123之法線N所夾的銳角θ 1、θ 2之角度。 In this embodiment, the acute angles θ 3, θ 4, θ 5, and θ 6 between the central axes P3, P4, P5, and P6 of each cylinder block 4411, 4421 and the normal line N of the thermal contact surface 4123 are all Equal and equal to the angle between the acute angles θ 1 and θ 2 between the central axes P1 and P2 of the liquid inlet 421 and the liquid outlet 422 and the normal N of the thermal contact surface 4123.
每個缸體4411、4421的中心軸線P3、P4、P5、P6與熱接觸面4123的法線N所夾的銳角θ 3、θ 4、θ 5、θ 6皆等於液體入口421及液體出口422之中心軸線P1、P2與熱接觸面4123之法線N所夾的銳角θ 1、θ 2,但並不以此為限。在其他實施例中,每個缸體的中心軸線與熱接處面的法線所夾的銳角分別可大於或小於液體入口之中 心軸線與熱接觸面之法線所夾的銳角。 The acute angle θ3, θ4, θ5, θ6 between the central axis P3, P4, P5, P6 of each cylinder block 4411, and the normal line N of the thermal contact surface 4123 is equal to the liquid inlet 421 and the liquid outlet 422 The acute angles θ 1 and θ 2 between the central axis P1, P2 and the normal N of the thermal contact surface 4123 are not limited thereto. In other embodiments, the acute angle between the central axis of each cylinder body and the normal line of the hot junction surface may be greater than or less than that in the liquid inlet, respectively. The acute angle between the axis of the mandrel and the normal of the thermal contact surface.
此外,缸體4411、4421之中心軸線P3、P4、P5、P6與熱接觸面4123之法線N夾銳角θ 3、θ 4、θ 5、θ 6的設置,即如一般常見的V形引擎中的的缸體的設置形式,但並不以此為限。在其他實施例中,缸體之中心軸線可平行於熱接觸面之法線,即如一般常見的直列式引擎中的缸體的設置形式。或者,缸體之中心軸線可垂直於熱接觸面之法線,即如一般常見的水平對臥式引擎中的缸體的設置形式。 In addition, the central axis P3, P4, P5, P6 of the cylinder blocks 4411, 4421 and the normal N between the thermal contact surface 4123, the acute angle θ3, θ4, θ5, θ6 are set, that is, the V-shaped engine as common The arrangement of the cylinder body is not limited to this. In other embodiments, the central axis of the cylinder block may be parallel to the normal line of the thermal contact surface, that is, the arrangement form of the cylinder block in a common inline engine. Alternatively, the central axis of the cylinder block may be perpendicular to the normal line of the thermal contact surface, that is, a horizontally arranged form of the cylinder block in a horizontal engine as is generally common.
在本實施例的冷卻系統10,因具有活塞機構440的設置,故冷卻系統10可搭配引擎的聲音,使得冷卻系統10的運轉有如引擎運轉的樣態,而可增加冷卻系統10的聲音效果。 In the cooling system 10 of this embodiment, since the piston mechanism 440 is provided, the cooling system 10 can be matched with the sound of the engine, so that the operation of the cooling system 10 is like the engine, and the sound effect of the cooling system 10 can be increased.
轉動機構450包含一轉動軸451、一葉輪452及四連桿453。在本實施例中的轉動軸451例如但不限為引擎中常見的凸輪軸,轉動軸451可轉動地位於儲液槽460,並與每個活塞體4412、4422樞接。葉輪452固定於轉動軸451,並對應於液體入口421。每個連桿453之相對兩端分別樞接於轉動軸451與活塞體4412、4422,且每個連桿453和轉動軸451樞接之樞接軸線R1、R2、R3、R4與轉動軸451之中心軸線C非共軸。 The rotating mechanism 450 includes a rotating shaft 451, an impeller 452, and four connecting rods 453. The rotating shaft 451 in this embodiment is, for example, but not limited to, a cam shaft commonly used in engines. The rotating shaft 451 is rotatably located in the liquid storage tank 460 and is pivotally connected to each of the piston bodies 4412 and 4422. The impeller 452 is fixed to the rotation shaft 451 and corresponds to the liquid inlet 421. The opposite ends of each link 453 are pivotally connected to the rotation shaft 451 and the piston body 4412, 4422, respectively, and the pivot axis R1, R2, R3, R4 and the rotation shaft 451 are pivotally connected to each link 453 and the rotation shaft 451 The center axis C is not coaxial.
請一併參閱圖2、圖5及圖6。圖5為圖2的第二活塞機構為最低點的剖視示意圖。圖6為圖2的第二活塞機構為最高點的剖視示意圖。 Please refer to FIG. 2, FIG. 5 and FIG. 6 together. FIG. 5 is a schematic cross-sectional view of the second piston mechanism of FIG. 2 as the lowest point. FIG. 6 is a schematic cross-sectional view of the second piston mechanism of FIG. 2 as the highest point.
當液體12自液體入口421流入儲液槽460時,流入之液體12會推動葉輪452,並透過轉動軸451帶動活塞體4412、4422相 對缸體4411、4421反復移動。如圖5及圖6所示,以本實施例的其中一第二活塞機構442來詳細說明,在前述的冷卻循環中,當液體12自液體入口421進入其中一子空間461的階段時,液體12會推動葉輪452沿方向D2轉動,使得葉輪452帶動轉動軸451同動。因連桿453和轉動軸451樞接之樞接軸線R2與轉動軸451之中心軸線C非共軸,使得當轉動軸451轉動時,連桿453樞接於轉動軸451之樞接處會隨著轉動軸451轉動,而令樞接處與熱接觸面4123的距離來回增減。即連桿453會因轉動軸451轉動而相對熱接觸面4123上下的往復運動,使得樞接於連桿453另一端的活塞體4422相對缸體4421往復的移動而形成如圖5及圖6所示之活塞體4422相對缸體4421靠近或遠離的狀態。 When the liquid 12 flows into the liquid storage tank 460 from the liquid inlet 421, the inflowing liquid 12 will push the impeller 452 and drive the piston body 4412, 4422 phase through the rotating shaft 451. The cylinders 4411 and 4421 are repeatedly moved. As shown in FIG. 5 and FIG. 6, one of the second piston mechanisms 442 in this embodiment is used to describe in detail. In the aforementioned cooling cycle, when the liquid 12 enters one of the subspaces 461 from the liquid inlet 421, the liquid 12 will push the impeller 452 to rotate in the direction D2, so that the impeller 452 drives the rotation shaft 451 to move together. Because the pivot axis R2 pivoted by the connecting rod 453 and the rotating shaft 451 is not coaxial with the central axis C of the rotating shaft 451, when the rotating shaft 451 rotates, the pivot of the connecting rod 453 to the rotating shaft 451 will follow As the rotating shaft 451 rotates, the distance between the pivot joint and the thermal contact surface 4123 increases and decreases. That is, the connecting rod 453 will reciprocate up and down relative to the thermal contact surface 4123 due to the rotation of the rotation shaft 451, so that the piston body 4422 pivotally connected to the other end of the connecting rod 453 reciprocates with respect to the cylinder body 4421 as shown in Figs. 5 and 6 The piston body 4422 is shown in a state close to or away from the cylinder body 4421.
本實施例的冷卻系統10中,透過轉動的葉輪452,以及葉輪452所帶動的多個活塞體4412、4422往復運動的設置,可令儲液槽460內的液體12流動,使得液體12均勻地吸收散熱鰭片4121的熱量,進而達到更佳的冷卻效果。 In the cooling system 10 of this embodiment, through the rotation of the impeller 452 and the reciprocating arrangement of the multiple piston bodies 4412 and 4422 driven by the impeller 452, the liquid 12 in the liquid storage tank 460 can be caused to flow, so that the liquid 12 is uniform. Absorbs the heat of the heat dissipation fins 4121, thereby achieving a better cooling effect.
舉例來說,在電子裝置於滿載運作,以及多個活塞體4412、4422於往復運動的情況下,所偵測到的電子裝置的CPU最高溫度為攝氏82度。相反地,在電子裝置於滿載運作下,若停止多個活塞體4412、4422往復運動,則所偵測到的電子裝置的CPU的最高溫度為攝氏90度。由此可知,轉動的葉輪452與往復運動的多個活塞體4412、4422可有效地幫助散熱。 For example, when the electronic device is operating at full load and a plurality of piston bodies 4412, 4422 are reciprocating, the detected maximum temperature of the CPU of the electronic device is 82 degrees Celsius. Conversely, when the electronic device is operating at full load, if the plurality of piston bodies 4412, 4422 are stopped to reciprocate, the maximum temperature of the detected CPU of the electronic device is 90 degrees Celsius. It can be seen that the rotating impeller 452 and the plurality of piston bodies 4412 and 4422 that reciprocate can effectively help to dissipate heat.
此外,透過自液體入口421流入的冷液體12帶動葉輪452轉動,有助於將冷液體12灌入二液流口4112內,使得冷液體12可迅 速地進入容置空間4111內吸取散熱鰭片4121的熱量,以令散熱的效率提升。另外,轉動的葉輪452帶動多個活塞體4412、4422往復運動的設置,可幫助吸熱後的液體12迅速排出子空間461,使得冷卻系統10的散熱效率可再進一步提升。 In addition, the impeller 452 is driven to rotate by the cold liquid 12 flowing from the liquid inlet 421, which helps to fill the cold liquid 12 into the second liquid flow port 4112, so that the cold liquid 12 can be quickly moved. Quickly enter the accommodating space 4111 to absorb the heat of the heat dissipation fins 4121, so as to improve the efficiency of heat dissipation. In addition, the rotating impeller 452 drives a plurality of piston bodies 4412, 4422 to be set to reciprocate, which can help the heat-absorbing liquid 12 quickly exit the subspace 461, so that the cooling efficiency of the cooling system 10 can be further improved.
再者,可藉由活塞體4412、4422反復移動的速度判斷液體12流經液體入口421的流量之外,亦可判斷冷卻系統10的運作是否正常。 In addition, the flow rate of the liquid 12 flowing through the liquid inlet 421 can be judged by the speed at which the piston body 4412, 4422 repeatedly moves, and whether the operation of the cooling system 10 is normal.
在本實施例中,裝有活塞機構440的罩蓋420為設置散熱底座410的設置,並非用以限定本發明。在其他實施例中,裝有活塞機構的罩蓋可與散熱底座分離,並自成為具有活塞機構的殼體,且透過出水管與入水管分別連接具有活塞機構的殼體及散熱底座,並與水泵及水冷排形成一水冷迴路。如此一來,具有活塞結構的殼體可不受空間之限制,而可將具有活塞機構的殼體設置於電子裝置多餘空間之處,並可增加活塞的數量。 In this embodiment, the cover 420 equipped with the piston mechanism 440 is provided with a heat dissipation base 410, and is not intended to limit the present invention. In other embodiments, the cover equipped with the piston mechanism can be separated from the heat dissipation base, and becomes a housing with the piston mechanism, and the housing with the piston mechanism and the heat dissipation base are connected through the water outlet pipe and the water inlet pipe respectively, and The water pump and water-cooled drain form a water-cooled circuit. In this way, the housing with the piston structure can be not limited by the space, but the housing with the piston mechanism can be disposed in an excess space of the electronic device, and the number of pistons can be increased.
在本實施例中,罩蓋420與每個缸體4411、4421皆為非透視的構造,但並不以此為限。在其他實施例中,罩體與缸體可改設為可透視的構造。如此一來,使用者可從冷卻系統的外觀上觀察出位於儲液槽內的液體量是否足夠,以及判斷葉輪的轉動是否正常,使得使用者從冷卻系統的外觀上即可判斷冷卻系統的運作情形。此外,可透視的缸體可幫助使用者直接觀察缸體內部活塞的往復運動狀況,藉此亦可得知冷卻系統的運作情形。 In this embodiment, the cover 420 and each of the cylinders 4411 and 4421 are non-perspective structures, but not limited thereto. In other embodiments, the cover body and the cylinder body can be changed to a see-through structure. In this way, the user can observe from the appearance of the cooling system whether the amount of liquid in the liquid storage tank is sufficient and determine whether the rotation of the impeller is normal, so that the user can judge the operation of the cooling system from the appearance of the cooling system. situation. In addition, the see-through cylinder body can help users directly observe the reciprocating movement of the piston inside the cylinder body, so as to know the operation of the cooling system.
另外,位於冷卻系統內部的液體可採用受熱後可變色的液 體,即液體在不同的溫度之下具有不同的顏色,並搭配可透視的罩蓋即可判斷位於儲液槽及容置空間的液體溫度。此外,透過可透視的罩蓋可讓不同溫度下的液體顏色顯露於外,如此可達到美化冷卻系統外觀的效果。 In addition, the liquid inside the cooling system can be a liquid that can change color when heated The body, that is, the liquid has different colors at different temperatures, and with a cover that can see through, can judge the temperature of the liquid located in the liquid storage tank and the accommodating space. In addition, through the transparent cover, the liquid color at different temperatures can be exposed to the outside, which can beautify the appearance of the cooling system.
根據上述實施例所揭露的主機板組件,透過轉動的葉輪,以及葉輪所帶動的多個活塞體往復運動的設置,可令儲液槽內的液體流動,使得液體均勻地吸收散熱鰭片的熱量,進而達到更佳的冷卻效果。 According to the motherboard assembly disclosed in the above embodiment, the rotating impeller and the reciprocating arrangement of the multiple piston bodies driven by the impeller can make the liquid in the liquid storage tank flow, so that the liquid can evenly absorb the heat of the radiating fins. To achieve better cooling effect.
此外,因液體自液體入口流入儲液槽時會推動葉輪,並帶動多個活塞體相對缸體往復運動,使得冷卻系統將冷液體灌入容置空間吸熱,以及將吸熱後的液體排出的速度加快。如此一來,冷卻系統在散熱的效率更可進一步提升。 In addition, because the liquid flows from the liquid inlet into the liquid storage tank, the impeller is pushed, and multiple piston bodies are reciprocated relative to the cylinder, so that the cooling system fills the cold liquid into the accommodation space to absorb heat, and the speed at which the heat-absorbing liquid is discharged. accelerate. In this way, the cooling system's efficiency in heat dissipation can be further improved.
此外,在部分實施例中,因冷卻系統中的罩體及缸體為可透視的構造,使得使用者得以判斷冷卻系統內部的運作情形是否正常。 In addition, in some embodiments, because the cover and the cylinder in the cooling system have a see-through structure, the user can determine whether the internal operation of the cooling system is normal.
再者,藉由可透視的罩體及缸體再搭配可隨溫度變化而改變顏色的液體,以令冷卻系統在外觀上有別以往的設計而具有更佳的視覺效果。另外,上述實施例的冷卻系統不僅在外觀上美化,因冷卻系統具有活塞結構的設置,故可搭配引擎的聲音,使得冷卻系統更具有聲光效果。 In addition, the see-through cover and cylinder are matched with liquids that can change color with temperature changes, so that the cooling system is different from the previous design in appearance and has better visual effects. In addition, the cooling system of the above embodiment is not only beautified in appearance, because the cooling system has a piston structure arrangement, it can be matched with the sound of the engine, so that the cooling system has more acousto-optic effects.
雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定本發明,任何熟習相像技藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the present invention is disclosed in the foregoing preferred embodiments as above, it is not intended to limit the present invention. Any person skilled in similar arts can make some changes and retouch without departing from the spirit and scope of the present invention. The scope of patent protection of an invention shall be determined by the scope of patent application attached to this specification.
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106140492A TWI672091B (en) | 2017-11-22 | 2017-11-22 | Heat dissipation device and cooling system |
| CN201810008636.9A CN109819626B (en) | 2017-11-22 | 2018-01-04 | Radiator and cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106140492A TWI672091B (en) | 2017-11-22 | 2017-11-22 | Heat dissipation device and cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201927118A TW201927118A (en) | 2019-07-01 |
| TWI672091B true TWI672091B (en) | 2019-09-11 |
Family
ID=66601371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106140492A TWI672091B (en) | 2017-11-22 | 2017-11-22 | Heat dissipation device and cooling system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109819626B (en) |
| TW (1) | TWI672091B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312741B (en) * | 2020-10-28 | 2021-09-21 | 深圳市研派科技有限公司 | Liquid cooling heat absorption block easy to expand and connect |
| TWI785409B (en) * | 2020-10-30 | 2022-12-01 | 大陸商深圳昂湃技術有限公司 | Easily expanded liquid-cooled heat sink |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200724018A (en) * | 2005-12-12 | 2007-06-16 | Shyh-Tzong Liao | Heat dissipation system of electronic device |
| US20080151499A1 (en) * | 2006-12-26 | 2008-06-26 | Quanta Computer Inc. | Electronic device and heat dissipation module thereof |
| JP2010093557A (en) * | 2008-10-08 | 2010-04-22 | Nec Corp | Heat dissipation structure and portable terminal device |
| TW201120392A (en) * | 2009-12-14 | 2011-06-16 | Hon Hai Prec Ind Co Ltd | Water-cooled heat sink |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT230426B (en) * | 1961-11-14 | 1963-12-10 | Voith Getriebe Kg | Flow brake with a device for limiting the braking power |
| US4628990A (en) * | 1984-08-17 | 1986-12-16 | Nec Corporation | Cooling equipment for an integrated circuit chip |
| CN1039285A (en) * | 1988-07-02 | 1990-01-31 | 黎智 | Dual-cylinder magnetic pump |
| JP2006039663A (en) * | 2004-07-22 | 2006-02-09 | Hitachi Ltd | Liquid circulation system and liquid cooling system using the same |
| JP5148079B2 (en) * | 2006-07-25 | 2013-02-20 | 富士通株式会社 | Heat exchanger for liquid cooling unit, liquid cooling unit and electronic equipment |
| CN101153607B (en) * | 2006-09-30 | 2010-11-10 | 宝宁科技股份有限公司 | Water pump device of heat dissipation system |
| CN102056457B (en) * | 2009-10-30 | 2014-01-22 | 鸿富锦精密工业(深圳)有限公司 | Water-cooling type radiating device |
| CN102156522B (en) * | 2011-05-09 | 2013-03-27 | 昆山特酷电脑科技有限公司 | Radiation device for computer integrated machine |
| CN202251230U (en) * | 2011-09-08 | 2012-05-30 | 江阴市长龄机械制造有限公司 | Heat dissipation structure of hydraulic cylinder |
| CN202417738U (en) * | 2012-01-18 | 2012-09-05 | 吴育林 | LED (light emitting diode) radiator adopting heat machine for dissipating heat |
| CN202811383U (en) * | 2012-06-11 | 2013-03-20 | 保锐科技股份有限公司 | Flat liquid cooling pump |
| TWI598561B (en) * | 2013-09-06 | 2017-09-11 | 微星科技股份有限公司 | Liquid cooling module and electronic device using the same |
| CN204392741U (en) * | 2015-01-04 | 2015-06-10 | 华北电力大学(保定) | A kind of memory alloy driven water-filled radiator |
| CN106155241A (en) * | 2015-04-03 | 2016-11-23 | 深圳市万景华科技有限公司 | Heat abstractor |
| CN204858945U (en) * | 2015-07-25 | 2015-12-09 | 石狮市酷瑞电气有限责任公司 | Quick water cooling plant of converter |
| CN107305059A (en) * | 2016-04-20 | 2017-10-31 | 姜志凌 | A kind of air-conditioning of the method energy-conservation of utilization heat energy converting machine recovering condensing heat |
| CN205789940U (en) * | 2016-05-24 | 2016-12-07 | 冠鼎科技有限公司 | Liquid-cooled heat sink |
| CN206024364U (en) * | 2016-05-27 | 2017-03-15 | 奇鋐科技股份有限公司 | water cooling device |
| CN106762509B (en) * | 2017-02-07 | 2019-01-01 | 筱净(上海)生物科技有限公司 | Liquid pump and liquid jettison system |
| CN107171212A (en) * | 2017-07-13 | 2017-09-15 | 国网山东省电力公司平原县供电公司 | A kind of distributed board outdoor |
-
2017
- 2017-11-22 TW TW106140492A patent/TWI672091B/en active
-
2018
- 2018-01-04 CN CN201810008636.9A patent/CN109819626B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200724018A (en) * | 2005-12-12 | 2007-06-16 | Shyh-Tzong Liao | Heat dissipation system of electronic device |
| US20080151499A1 (en) * | 2006-12-26 | 2008-06-26 | Quanta Computer Inc. | Electronic device and heat dissipation module thereof |
| JP2010093557A (en) * | 2008-10-08 | 2010-04-22 | Nec Corp | Heat dissipation structure and portable terminal device |
| TW201120392A (en) * | 2009-12-14 | 2011-06-16 | Hon Hai Prec Ind Co Ltd | Water-cooled heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201927118A (en) | 2019-07-01 |
| CN109819626A (en) | 2019-05-28 |
| CN109819626B (en) | 2023-03-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI438388B (en) | Liquid cooled heat sink | |
| US9818671B2 (en) | Liquid-cooled heat sink for electronic devices | |
| US20200117253A1 (en) | Cooling apparatus for electronic components | |
| CN107148194B (en) | Water-cooling heat dissipation device | |
| KR101070842B1 (en) | Heat-dissipating device and electronic apparatus having the same | |
| US7299861B2 (en) | Water-cooling heat exchanger and heat-dissipating device for the same | |
| CN102056459A (en) | Liquid-cooling heat radiating device | |
| TWI673466B (en) | Liquid cooled heat dissipation device | |
| WO2017036282A1 (en) | Air cooling semiconductor refrigerating device for circulation cooling system | |
| US20180308786A1 (en) | Liquid-Cooled Heat Sink | |
| TWI672091B (en) | Heat dissipation device and cooling system | |
| TWI772092B (en) | Immersion cooling system | |
| TWI694325B (en) | Liquid cooling sink | |
| TW202144726A (en) | Vapor chamber structure | |
| TWI548976B (en) | Cyclic cooling module | |
| TWM562420U (en) | Heat dissipation module containing one-piece double pump liquid cooling configuration | |
| CN202284783U (en) | Radiating device for heat pipe | |
| US7934540B2 (en) | Integrated liquid cooling unit for computers | |
| CN110444521B (en) | water block | |
| JP3068892U (en) | CPU heat dissipation device | |
| TW202340666A (en) | Heat dissipation device | |
| TW201518915A (en) | Heat dissipating assembly and electronic device using the same | |
| KR20100056715A (en) | Heat Pipe Heat Sink | |
| CN101668405A (en) | Water cooling head | |
| CN105810805B (en) | A kind of liquid cooling heat radiator |