TWI669501B - Residual stress detecting device and detecting method thereof - Google Patents
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Abstract
本發明提供一種殘留應力檢測裝置及其檢驗方法,應用於針對曲面且有鍍膜的檢測件進行表面殘留應力之檢測計算,其結構包括:檢測件載具,用以固定檢測件,使檢測件上的待檢測點維持在最高點;X射線產生源,固定或沿一路徑向待檢測點照射X射線;檢測元件,包括移動機構,移動機構使所述檢測元件沿著在與X射線的入射方向正交的方向上延伸的路徑移動,使檢測元件在衍射X射線的位置接收檢測衍射X射線的強度;以及應力計算模組,其基於檢測元件檢測出的衍射X射線的強度峰值得到應變數值,並以演算式計算檢測件的殘留應力值。 The invention provides a residual stress detecting device and a testing method thereof, which are applied to the detection and calculation of surface residual stress for a curved surface and a coated detecting member, and the structure comprises: a detecting member carrier for fixing the detecting member to make the detecting member The point to be detected is maintained at the highest point; the X-ray generating source fixes or irradiates the X-ray to the point to be detected along a path; the detecting element includes a moving mechanism that causes the detecting element to follow the incident direction with the X-ray a path extending in an orthogonal direction, such that the detecting element receives the intensity of the detected diffracted X-ray at a position of the diffracted X-ray; and a stress calculation module that obtains a strain value based on the intensity peak of the diffracted X-ray detected by the detecting element, The residual stress value of the test piece is calculated by a calculation formula.
Description
本發明係關於殘留應力檢測裝置及其檢測方法;更詳而言之,係一種曲面鍍膜的殘留應力檢測裝置及其檢測方法。 The present invention relates to a residual stress detecting device and a detecting method thereof; more specifically, it relates to a residual stress detecting device for a curved coating and a detecting method thereof.
隨著加工產業、鍍膜技術、模具產業快速發展且朝高值化、高精度與功能性方向發展,因此於鍍膜壽命分析逐漸受到重視。殘留應力即為壽命分析重要指標之一,但因載具為多曲面幾何形狀,受形狀影響容易造成量測誤差與數值失真等問題。 With the rapid development of the processing industry, coating technology and mold industry, and the development of high value, high precision and functionality, the analysis of coating life has been paid more and more attention. Residual stress is one of the important indicators of life analysis. However, because the carrier is a multi-surface geometry, it is easy to cause measurement error and numerical distortion due to the shape.
而在殘留應力檢測方面分為接觸式與非破壞檢測,常用的接觸式殘留應力量測以盲孔法為主,但以鍍膜厚度為微米等級,盲孔法已不適用。因此鍍膜殘留應力量測逐漸以非破壞量測為主,而非破壞殘留應力量測則以X光繞射法為主流,且非破壞量測更能於任何製程與各使用階段進行量測,方便進行全面性掌控。但因為採用非接觸式量測,故工件載具、材料性質、幾何形狀、殘留應力計算參數皆會對量測數據造成影響。 In the detection of residual stress, it is divided into contact and non-destructive testing. The commonly used contact residual stress measurement is mainly blind hole method, but the thickness of the coating is micron, and the blind hole method is not applicable. Therefore, the residual stress measurement of the coating is gradually measured by non-destructive measurement, while the non-destructive residual stress measurement is dominated by the X-ray diffraction method, and the non-destructive measurement can be measured in any process and each stage of use. Convenient for comprehensive control. However, because of the non-contact measurement, the workpiece carrier, material properties, geometry, and residual stress calculation parameters all affect the measurement data.
殘留應力為判斷製程品質與材料使用壽命之重要依據,因工件使用形態,而逐漸以非破壞檢測為主,其中以X- Ray繞射法為主流。目前X-Ray繞射法殘留應力量測原理皆以材料晶格受應力影響產生變形,搭配不同量測參數並以擬合法進行殘留應力運算。因此分為兩種量測方式:sin2 Ψ與cos α,sin2 Ψ量測參數包含旋轉角(ψ)、傾斜角(Ψ)等多種變數,適合小型試片與實驗室貴型設備;cos α以繞射環為變數且光源與偵測器皆為同一側,故適用大形工件與現場量測,但上述方法皆有以下缺點:1.殘留應力量測皆以平面形態為主,不適用於曲面;2.運算模式採用線性擬合法,曲面所造成的影響皆會造成量測數據失真。 Residual stress is an important basis for judging process quality and material service life. Due to the use of workpieces, non-destructive testing is the mainstay, with X-Ray diffraction as the mainstream. At present, the principle of residual stress measurement by X-Ray diffraction method is based on the influence of stress on the material lattice, and the residual stress calculation is performed by fitting method with different measurement parameters. Therefore, it is divided into two measurement methods: sin 2 Ψ and cos α, sin 2 Ψ measurement parameters include rotation angle (ψ), tilt angle (Ψ) and other variables, suitable for small test pieces and laboratory expensive equipment; cos α is a variable of the diffraction ring and the light source and the detector are all on the same side, so it is suitable for large-sized workpieces and on-site measurement, but the above methods have the following disadvantages: 1. The residual stress measurement is mainly in the form of plane, not Applicable to the surface; 2. The calculation mode adopts the linear fitting method, and the influence caused by the surface will cause the measurement data to be distorted.
本發明所欲解決的問題係在提出一殘留應力檢測裝置及一演算式,可適用於曲面形狀之鍍膜的殘留應力檢測,以解決現有檢測技術無法精準量化曲面鍍膜殘留應力值的問題。 The problem to be solved by the present invention is to propose a residual stress detecting device and a calculation formula, which can be applied to the residual stress detection of a curved surface coating to solve the problem that the existing detection technology cannot accurately quantify the residual stress value of the curved coating.
為解決上述問題,本發明係揭露一種殘留應力檢測裝置,應用於針對一曲面且有鍍膜的檢測件進行表面殘留應力之檢測計算,其結構包括:一檢測件載具,用以固定該檢測件,使該檢測件上的一待檢測點維持在最高點;一X射線產生源,固定或沿一路徑向該待檢測點照射X射線;一檢測元件,包括一移動機構,該移動機構使所述檢測元件沿著在與該X射線的入射方向正交的方向上延伸的路徑移動,使該檢測元件在衍射X射線的位置接收檢測該衍射X射線的強度;以及一應力計算模組,其基於該檢測元件檢測出的衍射X射線的強度峰值得到一應變數值,並以一演算式計算該檢測件的殘留應力 值。 In order to solve the above problems, the present invention discloses a residual stress detecting device for detecting and calculating surface residual stress for a curved surface and a coated detecting member, the structure comprising: a detecting member carrier for fixing the detecting member Having a point to be detected on the detecting member at a highest point; an X-ray generating source fixed or illuminating the X-ray to the point to be detected along a path; a detecting element including a moving mechanism, the moving mechanism The detecting element moves along a path extending in a direction orthogonal to an incident direction of the X-ray, so that the detecting element receives the intensity of detecting the X-ray at a position of the diffracted X-ray; and a stress calculation module A strain value is obtained based on the intensity peak of the diffracted X-ray detected by the detecting element, and the residual stress of the detecting member is calculated by a calculation formula value.
一種應用如上所述之殘留應力檢測裝置進行的殘留應力檢測方法,其步驟包括:將該檢測件固定於該檢測件載具,並將待檢測點調整至最高點;將該X射線產生源照射向該待檢測點;移動該檢測元件於與該X射線的入射方向正交的方向上延伸的路徑,並接收檢測該衍射X射線的強度得到一應變數值;以及透過該應力計算模組以該應變數值計算出該待檢測點的殘留應力值。 A residual stress detecting method using the residual stress detecting device as described above, the method comprising: fixing the detecting member to the detecting member carrier, and adjusting a point to be detected to a highest point; irradiating the X-ray generating source Moving to the point to be detected; moving the detecting element in a path extending in a direction orthogonal to the incident direction of the X-ray, and receiving the intensity of the detected X-ray to obtain a strain value; and transmitting the stress calculation module to The strain value calculates the residual stress value of the point to be detected.
在上述之實施例中,該演算式為:
在上述的演算式中,σ f為鍍膜殘留應力,Ef為鍍膜楊氏係數,εXRD為本發明所述殘留應力檢測裝置得到之該應變數值,Es為基材楊氏係數,hs為基材厚度,hf為鍍膜厚度,k為待檢測點的曲率且x為待檢測點的深度位置。 In the above calculation formula, σ f is the residual stress of the coating, Ef is the Young's modulus of the coating, ε XRD is the strain value obtained by the residual stress detecting device of the present invention, Es is the Young's modulus of the substrate, and hs is the substrate. The thickness, hf is the thickness of the coating, k is the curvature of the point to be detected and x is the depth position of the point to be detected.
在一實施例中,該檢測載具更包括一轉動機構,該轉動機構可使該檢測載具進行轉動以變化該檢測件接收X射線的入射方向。 In one embodiment, the detecting carrier further includes a rotating mechanism that causes the detecting carrier to rotate to change an incident direction in which the detecting member receives X-rays.
在一實施例中,該檢測載具設置有一檢測件固定結構。 In an embodiment, the detecting carrier is provided with a detecting member fixing structure.
在上述之實施例中,該檢測固定結構為一固定槽以及一鎖固結構,將該檢測件鎖固於該固定槽中。 In the above embodiment, the detecting and fixing structure is a fixing groove and a locking structure, and the detecting member is locked in the fixing groove.
在上述實施例中,該檢測件固定結構更包括一水平高度調整結構。 In the above embodiment, the detecting member fixing structure further includes a level adjusting structure.
在一實施例中,該水平高度調整結構為頂出形態,設置於該固定槽底部,透過頂出該檢測件端處的位置將待檢測點調整到最高點。 In an embodiment, the horizontal height adjusting structure is an ejector shape, which is disposed at the bottom of the fixing groove, and adjusts the point to be detected to the highest point by ejecting the position at the end of the detecting member.
本發明之主要特點在於:1.本發明可適用於曲面鍍膜件的殘留應力值檢測;2.利用本發明所提出的應力計算模組與檢測件載具,亦可整合於現今使用的X射線產生儀器,不需增加大量成本;3.將待檢測點調整至最高點可降低檢測誤差、減少曲面影響因子,有效掌握幾何特性,突破待檢測點於曲面形狀偏移造成的檢測誤差。 The main features of the present invention are as follows: 1. The present invention is applicable to the detection of residual stress values of curved coated parts; 2. The stress calculation module and the test piece carrier proposed by the present invention can also be integrated into X-rays used today. The instrument is generated without increasing the cost; 3. Adjusting the point to be detected to the highest point can reduce the detection error, reduce the surface influence factor, effectively grasp the geometric characteristics, and break the detection error caused by the shape of the surface to be detected.
接下來便結合圖式和具體實施例對本發明作進一步說明,以使本領域的技術人員可以更輕易理解本發明並加以實施運用。 The present invention will be further described in conjunction with the drawings and specific embodiments, so that those skilled in the art can understand the invention and practice.
1‧‧‧殘留應力檢測裝置 1‧‧‧Residual stress detecting device
10‧‧‧檢測件 10‧‧‧Test pieces
100‧‧‧基材層 100‧‧‧ substrate layer
101‧‧‧鍍膜層 101‧‧‧ coating layer
11‧‧‧X射線產生源 11‧‧‧X-ray generation source
110‧‧‧X射線 110‧‧‧X-ray
12‧‧‧檢測元件 12‧‧‧Detection components
120‧‧‧衍射X射線 120‧‧‧Diffraction X-ray
13‧‧‧檢測件載具 13‧‧‧Test piece carrier
130‧‧‧檢測件固定結構 130‧‧‧Detector fixed structure
1301‧‧‧固定槽 1301‧‧‧fixed slot
1302‧‧‧鎖固結構 1302‧‧‧Locking structure
1303‧‧‧水平高度調整結構 1303‧‧‧Horizontal height adjustment structure
14‧‧‧應力計算模組 14‧‧‧stress calculation module
P‧‧‧路徑 P‧‧‧ Path
hs‧‧‧基材厚度 h s ‧‧‧Substrate thickness
hf‧‧‧鍍膜厚度 h f ‧‧‧coating thickness
T‧‧‧待檢測點 T‧‧‧ point to be tested
ε‧‧‧應變數值 Ε‧‧‧ strain value
S1‧‧‧殘留應力檢測方法 S1‧‧‧Residual stress detection method
S11~S14‧‧‧步驟 S11~S14‧‧‧Steps
圖1A為本發明所述殘留應力檢測裝置之結構示意圖;圖1B為本發明所述殘留應力檢測裝置之檢測方式示意圖;圖1C為本發明所述之曲面鍍膜檢測件結構示意圖;圖2A為本發明一實施例之檢測件載具示意圖;圖2B為本發明另一實施例之檢測件載具示意圖;圖3為本發明所述殘留應力檢測方法之流程圖。 1A is a schematic structural view of a residual stress detecting device according to the present invention; FIG. 1B is a schematic view showing a detecting method of a residual stress detecting device according to the present invention; FIG. 1C is a schematic structural view of a curved coating detecting member according to the present invention; FIG. 2B is a schematic view of a detecting member carrier according to another embodiment of the present invention; and FIG. 3 is a flow chart of a residual stress detecting method according to the present invention.
本發明揭露一種殘留應力檢測裝置1,如圖1A至圖1C所示,係應用於針對一曲面且有鍍膜的檢測件10進行表面殘留應力之檢測計算,其結構包括:一檢測件載具13,用以 固定該檢測件10,使該檢測件10上的一待檢測點T維持在最高點;一X射線產生源11,固定或沿一路徑P向該待檢測點T照射X射線110;一檢測元件12,包括一移動機構,該移動機構使所述檢測元件12能朝向與該X射線110的入射方向正交的方向沿該路徑P移動,換言之,路徑P同時與該X射線110的入射方向及衍射X射線120的射出方向正交,使該檢測元件12在衍射X射線120的位置接收檢測該衍射X射線120的強度;以及一應力計算模組14,其基於該檢測元件12檢測出的衍射X射線120的強度峰值得到一應變數值ε,並以一演算式計算該檢測件10的殘留應力值。 The invention discloses a residual stress detecting device 1 , as shown in FIG. 1A to FIG. 1C , which is applied to the detection and calculation of surface residual stress for a curved surface and coated detecting member 10 , and the structure thereof comprises: a detecting member carrier 13 . For Fixing the detecting member 10 such that a point T to be detected on the detecting member 10 is maintained at the highest point; an X-ray generating source 11 is fixed or irradiated along the path P with the X-ray 110 to the point T to be detected; 12, comprising a moving mechanism for moving the detecting element 12 along the path P in a direction orthogonal to an incident direction of the X-ray 110, in other words, the path P is simultaneously incident with the X-ray 110 and The emission direction of the diffracted X-rays 120 is orthogonal, such that the detecting element 12 receives the intensity of the diffracted X-ray 120 at the position of the diffracted X-ray 120; and a stress calculation module 14 based on the diffraction detected by the detecting element 12. The intensity peak of the X-ray 120 is obtained by a strain value ε, and the residual stress value of the detecting member 10 is calculated by a calculation formula.
如圖1B所示,本發明所述之殘留應力檢測裝置進行的殘留應力檢測方法,其步驟包括:將該檢測件10固定於該檢測件載具13,並將待檢測點T調整至最高點;將該X射線110產生源11照射向該待檢測點T;如圖1A所示,沿路徑P移動該檢測元件12使該檢測元件12能朝向與該X射線110的入射方向正交的方向,並接收檢測該衍射X射線120的強度得到一應變數值ε;以及透過如圖1A所示之應力計算模組14以該應變數值ε計算出該待檢測點T的殘留應力值。 As shown in FIG. 1B, the method for detecting residual stress by the residual stress detecting device according to the present invention includes the steps of: fixing the detecting member 10 to the detecting member carrier 13 and adjusting the point T to be detected to the highest point. The X-ray 110 generating source 11 is irradiated toward the point T to be detected; as shown in FIG. 1A, the detecting element 12 is moved along the path P so that the detecting element 12 can be oriented in a direction orthogonal to the incident direction of the X-ray 110. And receiving the intensity of the diffracted X-ray 120 to obtain a strain value ε; and calculating the residual stress value of the point T to be detected by the stress calculation module 14 as shown in FIG. 1A.
在上述的實施例中,該演算式為:
其中σf為鍍膜殘留應力,Ef為鍍膜楊氏係數,εXRD為本發明所述殘留應力檢測裝置得到之該應變數值,Es為基材楊氏係數,hs為基材厚度,hf為鍍膜厚度,k為待檢測點 T的曲率,且x為待檢測點T的深度位置。 Where σ f is the residual stress of the coating, E f is the Young's modulus of the coating, ε XRD is the strain value obtained by the residual stress detecting device of the present invention, E s is the Young's modulus of the substrate, and h s is the thickness of the substrate, h f is the coating thickness, k is the curvature of the point T to be detected, and x is the depth position of the point T to be detected.
在圖1B之實施例中,該檢測載具13設置有一檢測件固定結構130,並且,該檢測固定結構130為一固定槽1301以及一鎖固結構1302,將該檢測件10鎖固於該固定槽1301中。 In the embodiment of FIG. 1B, the detecting device 13 is provided with a detecting member fixing structure 130, and the detecting fixing structure 130 is a fixing groove 1301 and a locking structure 1302, and the detecting member 10 is locked to the fixing member. In the slot 1301.
在一實施例中,該檢測載具13更包括一轉動機構,該轉動機構可使該檢測載具13進行轉動以變化該檢測件10接收X射線110的入射方向。 In one embodiment, the detecting carrier 13 further includes a rotating mechanism that causes the detecting carrier 13 to rotate to change the incident direction of the detecting member 10 to receive the X-rays 110.
在上述的一實施例中,所述轉動機構可為二維的360度轉動。 In an embodiment described above, the rotating mechanism can be a two-dimensional 360 degree rotation.
在上述的一實施例中,所述轉動機構可為三維的360度轉動。 In an embodiment described above, the rotating mechanism can be a three-dimensional 360 degree rotation.
藉由上述的殘留應力檢測裝置,當X射線110照射在檢測件10的待檢測點T上時,該檢測元件12可接收到衍射X射線120之強度,並取得一強度峰值進而得到該待檢測點T的一應變數值ε。 With the residual stress detecting device described above, when the X-ray 110 is irradiated on the to-be-detected point T of the detecting member 10, the detecting element 12 can receive the intensity of the diffracted X-ray 120 and obtain an intensity peak to obtain the to-be-detected. A strain value ε at point T.
如圖1C所示,該經鍍膜的具有曲面之檢測件10依其結構可分為基材層100以及鍍膜層101,並且各自具有一基材厚度hs以及一鍍膜厚度hf,當透過本發明所述之檢測裝置及檢測方法取得該待檢測點T之應變數值ε後,即可代入演算式:中計算出殘留應力值σf。 As shown in FIG. 1C, the coated curved detecting member 10 can be divided into a substrate layer 100 and a plating layer 101 according to its structure, and each has a substrate thickness h s and a coating thickness h f . After the detection device and the detection method of the invention obtain the strain value ε of the point T to be detected, the calculation formula can be substituted: The residual stress value σ f is calculated.
該演算式中的σf為鍍膜殘留應力,Ef為鍍膜楊氏係數,εXRD為本發明所述殘留應力檢測裝置得到之該應變數 值,Es為基材楊氏係數,hs為基材厚度,hf為鍍膜厚度,k為曲率,x為待檢測點T的深度位置。 σ f in the calculation formula is the residual stress of the coating, E f is the Young's modulus of the coating, ε XRD is the strain value obtained by the residual stress detecting device of the present invention, E s is the Young's modulus of the substrate, and h s is the basis. The thickness of the material, h f is the thickness of the coating, k is the curvature, and x is the depth position of the point T to be detected.
續請參閱圖2A及圖2B,圖2A及圖2B係為本發明所述檢測件載具13之不同實施例示意圖。 2A and 2B, FIG. 2A and FIG. 2B are schematic views of different embodiments of the detecting member carrier 13 of the present invention.
如圖2A所示,本發明所述之檢測件載具13設置有一檢測件固定結構130,其中,該檢測固定結構130為一固定槽1301以及一鎖固結構1302,將該檢測件10鎖固於該固定槽1301中,以保持待檢測點T可如圖1B所示維持在最高點的位置,將待檢測點T維持於最高點可降低檢測誤差、減少曲面影響因子,有效掌握幾何特性,突破待檢測點於曲面形狀偏移造成的檢測誤差。 As shown in FIG. 2A, the detecting member carrier 13 of the present invention is provided with a detecting member fixing structure 130. The detecting fixing structure 130 is a fixing groove 1301 and a locking structure 1302, and the detecting member 10 is locked. In the fixing groove 1301, the point T to be detected can be maintained at the highest point as shown in FIG. 1B, and the point T to be detected is maintained at the highest point to reduce the detection error, reduce the surface influence factor, and effectively grasp the geometric characteristics. Break through the detection error caused by the offset of the shape of the surface to be detected.
如圖2B所示,本發明所述之檢測件載具13設置有一檢測件固定結構130,其中,該檢測固定結構130為一固定槽1301、一鎖固結構1302以及一水平高度調整結構1303,該水平高度調整結構1303為頂出形態,設置於該固定槽1301底部,該水平高度調整結構1303透過頂出該檢測件10端處的位置將待檢測點T調整到最高點,進而降低檢測誤差、減少曲面影響因子,有效掌握幾何特性,突破待檢測點於曲面形狀偏移造成的檢測誤差。 As shown in FIG. 2B, the detecting member carrier 13 of the present invention is provided with a detecting member fixing structure 130. The detecting fixing structure 130 is a fixing groove 1301, a locking structure 1302 and a level adjusting structure 1303. The height adjustment structure 1303 is in an ejector form, and is disposed at the bottom of the fixing slot 1301. The level adjustment structure 1303 adjusts the point T to be detected to the highest point by ejecting the position at the end of the detecting member 10, thereby reducing the detection error. Reduce the influence factor of the surface, effectively grasp the geometric characteristics, and break the detection error caused by the offset of the shape of the surface to be detected.
續請參閱圖3,圖3為應用如上所述之殘留應力檢測裝置1進行的殘留應力檢測方法S1,其步驟包括:步驟S11:將該檢測件固定於該檢測件載具,並將待檢測點調整至最高點;步驟S12:將該X射線產生源照射向該待檢測點; 步驟S13:移動該檢測元件,使該檢測元件能朝向與該X射線的入射方向正交的方向,接收並檢測該衍射X射線的強度得到一應變數值;以及步驟S14:透過該應力計算模組以該應變數值計算出該待檢測點的殘留應力值。 Continuing to refer to FIG. 3, FIG. 3 is a residual stress detecting method S1 applied by the residual stress detecting device 1 as described above, the steps of which include: Step S11: fixing the detecting member to the detecting member carrier, and to be detected Adjusting the point to the highest point; step S12: illuminating the X-ray generating source to the point to be detected; Step S13: moving the detecting component to enable the detecting component to receive and detect the intensity of the diffracted X-ray in a direction orthogonal to the incident direction of the X-ray to obtain a strain value; and Step S14: transmitting the stress calculating module The residual stress value of the point to be detected is calculated from the strain value.
在一實施例中,該檢測載具可轉動變化該檢測件接收X射線的入射方向,以檢測到該待檢測點於不同角度所衍射之X射線強度,進而取得該待檢測點準確之應變數值。 In an embodiment, the detecting carrier is rotatably changed to receive the incident direction of the X-ray to detect the X-ray intensity diffracted by the point to be detected at different angles, thereby obtaining an accurate strain value of the point to be detected. .
經上述方法取得之應變數值帶入以下演算式:
該演算式中的σf為鍍膜殘留應力,Ef為鍍膜楊氏係數,εXRD為本發明所述殘留應力檢測裝置得到之該應變數值,Es為基材楊氏係數,hs為基材厚度,hf為鍍膜厚度,k為待檢測點的曲率且x為待檢測點的深度位置。 σ f in the calculation formula is the residual stress of the coating, E f is the Young's modulus of the coating, ε XRD is the strain value obtained by the residual stress detecting device of the present invention, E s is the Young's modulus of the substrate, and h s is the basis. The thickness of the material, h f is the thickness of the coating, k is the curvature of the point to be detected and x is the depth position of the point to be detected.
經本發明所述之殘留應力檢測裝置及其檢測方法具有以下特點:1.本發明突破習知殘留應力檢測僅適用於平面檢測件的問題,可適用於曲面鍍膜件的殘留應力值檢測;2.利用本發明所提出的應力計算模組與檢測件載具,亦可整合於現今使用的X射線產生儀器,不需增加大量成本;3.將待檢測點調整至最高點可降低檢測誤差、減少曲面影響因子,有效掌握幾何特性,突破待檢測點於曲面形狀偏移造成的檢測誤差。 The residual stress detecting device and the detecting method thereof according to the present invention have the following characteristics: 1. The present invention breaks through the problem that the residual stress detecting is only applicable to the planar detecting member, and can be applied to the residual stress value detection of the curved coated member; The stress calculation module and the detection component carrier proposed by the invention can also be integrated into the X-ray generation instrument used today, without increasing the cost; 3. Adjusting the point to be detected to the highest point can reduce the detection error and reduce The surface influence factor effectively grasps the geometric characteristics and breaks the detection error caused by the offset of the shape to be detected.
綜上所述,乃僅記載本發明為呈現解決問題所採 用的技術手段之實施方式或實施例而已,並非用來限定本發明專利實施之範圍。即凡與本發明專利申請範圍文義相符,或依本發明專利申請範圍所做的均等變化與修飾,皆為本發明之專利範圍所涵蓋。 In summary, it is only stated that the present invention is used to solve the problem. The embodiments or examples of the technical means are not intended to limit the scope of the practice of the invention. That is, the equivalent changes and modifications made to the scope of the patent application of the present invention, or the scope of the patent application of the present invention, are covered by the scope of the invention.
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| CN114659687A (en) * | 2020-12-23 | 2022-06-24 | 财团法人金属工业研究发展中心 | Method for measuring residual stress of curved surface block material |
| US11543310B2 (en) | 2020-12-18 | 2023-01-03 | Metal Industries Research & Development Centre | Method for measuring residual stress of curved-surface bulk material |
| US12209926B2 (en) | 2020-12-18 | 2025-01-28 | Metal Industries Research & Development Centre | Residual stress measurement method of curved surface block |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201221926A (en) * | 2010-11-16 | 2012-06-01 | Univ Feng Chia | Measurement method for thin film residual stress |
| JP2015072171A (en) * | 2013-10-02 | 2015-04-16 | 三菱重工業株式会社 | X-ray stress measurement method and x-ray stress measurement apparatus |
| CN207798544U (en) * | 2018-01-05 | 2018-08-31 | 北京科技大学 | A kind of test sample device that membrane stress gradient develops in situ |
-
2018
- 2018-12-04 TW TW107143473A patent/TWI669501B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201221926A (en) * | 2010-11-16 | 2012-06-01 | Univ Feng Chia | Measurement method for thin film residual stress |
| JP2015072171A (en) * | 2013-10-02 | 2015-04-16 | 三菱重工業株式会社 | X-ray stress measurement method and x-ray stress measurement apparatus |
| CN207798544U (en) * | 2018-01-05 | 2018-08-31 | 北京科技大学 | A kind of test sample device that membrane stress gradient develops in situ |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11543310B2 (en) | 2020-12-18 | 2023-01-03 | Metal Industries Research & Development Centre | Method for measuring residual stress of curved-surface bulk material |
| US12209926B2 (en) | 2020-12-18 | 2025-01-28 | Metal Industries Research & Development Centre | Residual stress measurement method of curved surface block |
| CN114659687A (en) * | 2020-12-23 | 2022-06-24 | 财团法人金属工业研究发展中心 | Method for measuring residual stress of curved surface block material |
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