TWI669278B - Cutting method for laminating substrates - Google Patents
Cutting method for laminating substrates Download PDFInfo
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- TWI669278B TWI669278B TW104108449A TW104108449A TWI669278B TW I669278 B TWI669278 B TW I669278B TW 104108449 A TW104108449 A TW 104108449A TW 104108449 A TW104108449 A TW 104108449A TW I669278 B TWI669278 B TW I669278B
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- Prior art keywords
- glass portion
- sealing
- lower glass
- upper glass
- bonded substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 55
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000010030 laminating Methods 0.000 title 1
- 239000011521 glass Substances 0.000 claims abstract description 98
- 238000007789 sealing Methods 0.000 claims abstract description 51
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 30
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
本發明之貼合基板之分斷方法，能夠在液晶基板分斷時使基板不要的端材部最大限度地成為較小，且能獲得滑順的分斷面。 According to the cutting method of the bonded substrate of the present invention, when the liquid crystal substrate is cut, an unnecessary end material portion of the substrate can be made as small as possible, and a smooth cut surface can be obtained.
其包含有以下階段：利用刻劃輪(60)對密封部(8)上的上部玻璃部(11a)或下部玻璃部(11b)進行刻劃而形成刻劃線(CL)；對在從該刻劃線(CL)位置起隔著間隔而隔離之位置所形成的密封部(8)照射雷射而進行刻劃；以及，利用刻劃輪(60)對未形成有該刻劃線(CL)的殘留的玻璃部進行刻劃。 It includes the following stages: using a scoring wheel (60) to score the upper glass portion (11a) or the lower glass portion (11b) on the sealing portion (8) to form a score line (CL); A seal portion (8) formed at a position separated from the scribe line (CL) by a space is irradiated with laser to perform scribe; and a scribe line (60) is used to scribe without forming the scribe line (CL). ) The remaining glass portion is scored.
Description
本發明是關於一種貼合基板之分斷方法，詳細而言，是關於一種不僅能夠使基板不要的端材部最大限度地成為較小，也能夠獲得滑順分斷面的貼合基板之分斷方法。 The present invention relates to a method for cutting a bonded substrate, and in particular, it relates to a type of a bonded substrate that can not only make the end portion of the substrate unnecessary to a minimum, but also obtain a smooth cutting surface.断 方法。 Off method.
一般而言，習知以往在去除液晶基板不要的端材部時，僅利用刻劃輪。 Generally, it has been conventionally known that only the scoring wheel is used when removing an unnecessary end material portion of a liquid crystal substrate.
具體而言，一般的液晶基板，在上部玻璃部與下部玻璃部間填充液晶層後，以液晶層不往外部露液的方式利用密封層圍繞液晶層之框部分而將其密封。 Specifically, a general liquid crystal substrate is filled with a liquid crystal layer between an upper glass portion and a lower glass portion, and is sealed with a sealing layer surrounding a frame portion of the liquid crystal layer so that the liquid crystal layer does not expose liquid to the outside.
亦即，成為使密封層附著在上部玻璃部與下部玻璃部相互對向的面，並以液晶層不往外部流出的方式密封的構造。 That is, it has a structure in which a sealing layer is adhered to the surfaces of the upper glass portion and the lower glass portion facing each other, and is sealed so that the liquid crystal layer does not flow out.
此外，為了提高密封性，而使密封層寬度較寬地形成在基板平面的延伸方向。 In addition, in order to improve the sealing property, the width of the sealing layer is formed in a wide direction in the plane of the substrate.
如此般，在以往習知技術中，由於在液晶基板之框部分包含具有較寬寬度的密封層，因此存在有如下的實際情形：以較大的邊框(額緣)(bezel)尺寸的狀態使用、或者切除密封層之外周部分以使邊框變小。 As such, in the conventional art, since the frame portion of the liquid crystal substrate includes a sealing layer having a relatively wide width, there is a practical situation in which it is used in a state of a large bezel size. Or, cut off the outer periphery of the sealing layer to make the frame smaller.
然而，最近亦存在有將液晶基板相互地連結成平面而使用的情形，且在該情形，存在有於影像具體顯現時在密封層外周部分彼此之連 結部位影像不滑順的問題點。 However, recently, there have been cases where the liquid crystal substrates are connected to each other to form a flat surface, and in this case, there is a connection between the sealing layer outer peripheral portions when the image is specifically displayed. The problem is that the image of the knot is not smooth.
為了解決如此般之問題點，而為了最大限度地切取液晶基板之密封層寬度，於是利用刻劃輪以較深地侵入至液晶基板之密封層的方式進行分斷。 In order to solve such a problem, and in order to cut the width of the sealing layer of the liquid crystal substrate to the maximum extent, the scoring wheel is used to cut into the sealing layer of the liquid crystal substrate in a deeper manner.
然而，在利用刻劃輪對液晶基板之密封層進行刻劃時，因密封層所具有的物性，而產生了刻劃輪一邊進行刻劃一邊失去直進性、無法沿刻劃預定線進行移動等而往其他方向行進，從而使基板變不佳的問題點。 However, when the sealing layer of a liquid crystal substrate is scored by a scoring wheel, due to the physical properties of the sealing layer, the scoring wheel loses straightness while scoring and cannot move along the scribe line. The problem is that the substrate is not good because it is traveling in other directions.
此外，在利用習知的刻劃輪方式中，實際情形為：難以進行侵入至位於上部玻璃部與下部玻璃部間的密封層般的刻劃，且在刻劃輪之刻劃作業完成後密封層尚未被分斷而仍殘留著，亦產生玻璃未完全分離的問題點。 In addition, in the conventional scribing wheel method, the actual situation is that it is difficult to make a scratch that penetrates into the sealing layer between the upper glass portion and the lower glass portion, and is sealed after the scribing operation of the scribing wheel is completed. The layer has not been separated but still remains, which also causes the problem that the glass is not completely separated.
此外，在最近，將多個液晶基板以平面並以框相互地抵接以使大型影像具體顯現而販售的影像裝置變多，從而為了使能具體顯現影像的液晶層以外的部分、例如密封層為最小的研究廣為試行。 In addition, recently, a large number of imaging devices have been sold in which a large number of liquid crystal substrates are brought into contact with each other in a plane and a frame, so that portions other than the liquid crystal layer that can specifically display the images, for example, are sealed. The smallest layer of research is widely piloted.
本發明是為了解決如上述般之問題點而創造出，其目的在於提供一種在利用雷射對液晶基板等貼合基板進行刻劃時，不僅能夠使基板不要的端材部最大限度地成為較小，而且亦能夠獲得滑順分斷面的貼合基板之分斷方法。 The present invention was created to solve the problems as described above, and an object thereof is to provide a method for scoring a bonded substrate such as a liquid crystal substrate by using a laser, which can not only make the end portion of the substrate unnecessary to a relatively large extent. It is also small, and it is also possible to obtain a method for cutting a bonded substrate with a smooth cutting surface.
為了解決上述課題，本發明之一實施形態之貼合基板之分斷方法，係對形成在貼合基板(10)之上部玻璃部(11a)與下部玻璃部(11b)間的密封部(8)上進行分斷，其特徵在於包含以下階段：利用刻劃輪(60)對該密封部 (8)上的上部玻璃部(11a)或下部玻璃部(11b)進行刻劃而在上部玻璃部(11a)或下部玻璃部(11b)形成刻劃線(CL)；對在從形成於該上部玻璃部(11a)或下部玻璃部(11b)的該刻劃線(CL)位置起隔著間隔而隔離之位置所形成的密封部(8)照射雷射而對該密封部(8)進行刻劃；以及，在對該密封部(8)進行刻劃的階段後，利用刻劃輪(60)對未形成有該刻劃線(CL)的殘留的玻璃部進行刻劃。 In order to solve the above problems, a method for cutting a bonded substrate according to an embodiment of the present invention is to seal a sealing portion (8) formed between an upper glass portion (11a) and a lower glass portion (11b) of the bonded substrate (10). ), Which is characterized in that it includes the following steps: the seal portion is scribed by a scoring wheel (60). (8) The upper glass portion (11a) or the lower glass portion (11b) is scribed to form a score line (CL) on the upper glass portion (11a) or the lower glass portion (11b); The sealing portion (8) formed at the position of the scribe line (CL) of the upper glass portion (11a) or the lower glass portion (11b) at a position separated by a gap is irradiated with laser light to the sealing portion (8). Scratching; and after the step of scoring the sealing portion (8), the scoring wheel (60) is used to scribe the remaining glass portion where the scribe line (CL) is not formed.
此外，根據本發明之其他實施形態的貼合基板(10)之分斷方法，係對形成在貼合基板(10)之上部玻璃部(11a)與下部玻璃部(11b)間的密封部(8)上進行分斷，其特徵在於包含以下階段：利用刻劃輪(60)對該密封部(8)上的上部玻璃部(11a)及下部玻璃部(11b)進行刻劃而在上部玻璃部(11a)及下部玻璃部(11b)形成刻劃線(CL)；以及，對從形成於該上部玻璃部(11a)及下部玻璃部(11b)的該刻劃線(CL)之位置起隔著間隔而隔離之位置所形成的密封部(8)照射雷射而對該密封部(8)進行刻劃。 In addition, according to a method for cutting a bonded substrate (10) according to another embodiment of the present invention, a sealing portion (11) formed between an upper glass portion (11a) and a lower glass portion (11b) of the bonded substrate (10) is used. 8) The cutting is performed on the upper glass part (11a) and the lower glass part (11b) on the sealing part (8) by using a scoring wheel (60). Part (11a) and the lower glass part (11b) form a score line (CL); and from the position of the score line (CL) formed on the upper glass part (11a) and the lower glass part (11b) A seal portion (8) formed at a spaced apart position is irradiated with a laser to score the seal portion (8).
此外，亦可為：在該上部玻璃部(11a)與下部玻璃部(11b)間，形成有外周部分由該密封部(8)密封的液晶部(50)；以該液晶部(50)為基準，對較該刻劃線(CL)更遠位置的該密封部(8)照射雷射而對該密封部(8)進行刻劃。 In addition, a liquid crystal portion (50) whose outer peripheral portion is sealed by the sealing portion (8) may be formed between the upper glass portion (11a) and the lower glass portion (11b); and the liquid crystal portion (50) is As a reference, the sealing portion (8) located farther from the scribe line (CL) is irradiated with laser to score the sealing portion (8).
此外，亦可為：以該刻劃線(CL)到達該密封部(8)的方式進行刻劃。 Alternatively, the scribe may be performed so that the scribe line (CL) reaches the seal portion (8).
在該情形，亦可為：在利用該刻劃輪(60)對該上部玻璃部(11a)或下部玻璃部(11b)進行刻劃後，利用裂斷滾筒或裂斷桿對已刻劃的上部玻璃部(11a)或下部玻璃部(11b)進行裂斷。 In this case, after scoring the upper glass portion (11a) or the lower glass portion (11b) by the scoring wheel (60), the scoring roller or scoring rod is used to scribe the The upper glass portion (11a) or the lower glass portion (11b) is broken.
根據本發明，具有如下之效果：藉由在以雷射對貼合基板之 密封部進行刻劃時所產生的氣泡不往貼合基板之液晶層側流入，而能夠防止液晶層被汙染、成為不良品等。 According to the present invention, the following effects can be obtained: The bubbles generated during the scoring of the sealing portion do not flow into the liquid crystal layer side of the bonded substrate, but can prevent the liquid crystal layer from being contaminated and defective.
此外，還具有以下效果：能夠良好地形成貼合基板之分斷面，並且能夠使貼合基板之分離性提高。 In addition, there is also an effect that a divided surface of the bonded substrate can be formed satisfactorily, and the separability of the bonded substrate can be improved.
8‧‧‧密封部 8‧‧‧Sealing Department
10‧‧‧貼合基板 10‧‧‧ Laminated substrate
11a‧‧‧上部玻璃部 11a‧‧‧Upper glass section
11b‧‧‧下部玻璃部 11b‧‧‧Lower glass section
50‧‧‧液晶部 50‧‧‧ LCD
60‧‧‧刻劃輪 60‧‧‧ Scribing Wheel
CL‧‧‧刻劃線 CL‧‧‧ Engraved
圖1，係表示在貼合基板之密封部上形成刻劃線的圖式。 FIG. 1 is a view showing a scribe line formed on a sealing portion of a bonded substrate.
圖2，係從貼合基板之側剖面觀察的概略圖。 FIG. 2 is a schematic view when viewed from a side cross-section of a bonded substrate.
圖3，係表示利用刻劃輪對貼合基板進行刻劃之作業狀態的圖式。 FIG. 3 is a view showing an operation state of the bonded substrate by a scribe wheel.
圖4，係表示關於貼合基板之刻劃方法的其他實施例的圖式。 FIG. 4 is a view showing another embodiment of a scribe method for a bonded substrate.
圖5，係表示對貼合基板之刻劃線上照射雷射時氣泡之浸透現象的放大顯微照片。 FIG. 5 is an enlarged photomicrograph showing the phenomenon of bubble penetration when a laser is irradiated on a scribe line of a bonded substrate.
圖6，係表示對貼合基板之刻劃線之外側位置照射雷射時氣泡之浸透現象的放大顯微照片。 FIG. 6 is an enlarged photomicrograph showing the phenomenon of bubble penetration when a laser is irradiated to a position outside the scribe line of the bonded substrate.
參照所附圖式具體地說明本發明之一實施形態之貼合基板之分斷方法。 A method for cutting a bonded substrate according to an embodiment of the present invention will be specifically described with reference to the attached drawings.
如圖1及圖2所示，本實施形態之貼合基板10，包含上部玻璃部11a及下部玻璃部11b，且在該等上部玻璃部11a與下部玻璃部11b間形成有液晶部50。而且，以液晶部50不往貼合基板10之外部漏液的方式將液晶部50外周以密封部8密封。 As shown in FIGS. 1 and 2, the bonded substrate 10 according to this embodiment includes an upper glass portion 11 a and a lower glass portion 11 b, and a liquid crystal portion 50 is formed between the upper glass portion 11 a and the lower glass portion 11 b. In addition, the outer periphery of the liquid crystal portion 50 is sealed by the sealing portion 8 so that the liquid crystal portion 50 does not leak to the outside of the bonding substrate 10.
在貼合基板10之框部，存在不要的部分即端材部5。在相 當於如此般之端材部5的上部玻璃部11a及下部玻璃部11b之框部間亦包含有密封部8。 The frame portion of the bonded substrate 10 has an end portion 5 which is an unnecessary portion. In phase A seal portion 8 is also included between the frame portions of the upper glass portion 11a and the lower glass portion 11b of the end material portion 5 in this manner.
如此般之端材部5，為了使通過貼合基板10具體顯現之影像品質提高而較佳為使其尺寸最小化，且有必要分斷去除端材部5。 Such an end material portion 5 is preferably minimized in size in order to improve the image quality of the specific appearance of the bonded substrate 10, and it is necessary to cut off and remove the end material portion 5.
在本實施形態之貼合基板之刻劃方法中，首先，於貼合基板10上利用刻劃輪60一次性地在上部玻璃部11a或下部玻璃部11b形成刻劃線CL(圖1中以虛線所示之箭頭部分)。於圖2中，圖示有在下部玻璃部11b形成有刻劃線CL的樣態以作參考。 In the method of scoring a bonded substrate in this embodiment, first, a scribe line CL is formed on the bonded substrate 10 on the upper glass portion 11a or the lower glass portion 11b by a scoring wheel 60 (shown in FIG. 1 by (Arrow part shown by dotted line). In FIG. 2, a state in which a score line CL is formed in the lower glass portion 11 b is shown for reference.
而且，在上部玻璃部11a或下部玻璃部11b形成刻劃線CL時，以刻劃輪60侵入至密封部8之區域的方式形成刻劃線CL。在與此不同之方法中，如圖3所示，亦可為利用刻劃輪60以侵入至上部玻璃部11a或下部玻璃部11b厚度一部分之方式形成刻劃線，之後利用裂斷滾筒70等裂斷器具往厚度方向按壓形成有該刻劃線之玻璃部，而在上部玻璃部11a或下部玻璃部11b形成從該玻璃部表面到達形成有密封部8之面的刻劃線CL。 When the scribe line CL is formed in the upper glass portion 11 a or the lower glass portion 11 b, the scribe line CL is formed so that the scribe wheel 60 penetrates into the region of the seal portion 8. In a different method, as shown in FIG. 3, a scribe line may be formed by using the scoring wheel 60 so as to penetrate into the upper glass portion 11a or a portion of the thickness of the lower glass portion 11b, and then use a breaking roller 70 or the like. The breaking device presses the glass portion on which the scribe line is formed in the thickness direction, and a scribe line CL is formed on the upper glass portion 11 a or the lower glass portion 11 b from the surface of the glass portion to the surface where the seal portion 8 is formed.
如上述般，若在上部玻璃部11a或下部玻璃部11b形成刻劃線CL，則對位於從刻劃線CL往外側(貼合基板10之框側)隔離既定間隔之位置的密封部8(參照圖1中以實線所示之箭頭部分)照射雷射而對密封部8進行刻劃。 As described above, when the scribe lines CL are formed in the upper glass portion 11a or the lower glass portion 11b, the sealing portion 8 (which is located at a predetermined interval from the scribe lines CL to the outside (the side of the frame on which the substrate 10 is bonded) is separated from each other ( Referring to an arrow portion shown by a solid line in FIG. 1), a laser is irradiated to score the sealing portion 8.
此時，一旦藉由雷射刻劃密封部8則產生氣泡，且所產生的氣泡，在上部玻璃部11a及下部玻璃部11b之間往密封部8之寬度方向即液晶部50及端材部5側傳播。 At this time, once the seal portion 8 is scored by laser, bubbles are generated, and the generated bubbles move between the upper glass portion 11 a and the lower glass portion 11 b in the width direction of the seal portion 8, that is, the liquid crystal portion 50 and the end material portion. 5 side spread.
往端材部5側傳播的氣泡，經由端材部5而往貼合基板10 外排出。 The air bubbles propagating toward the end material portion 5 are bonded to the substrate 10 through the end material portion 5 Outside drained.
而且，往與端材部5相反方向的液晶部50側傳播的氣泡，到達形成有刻劃線CL的部位。此時氣泡沿圖2之放大圖所圖示之箭頭方向，從密封部8被往形成於下部玻璃部11b的刻劃線CL之間隙誘導並往外排出。亦即，由於通過形成在貼合基板10上的刻劃線CL擠壓出氣泡，因此氣泡不再往形成液晶部50的位置前進。 Then, the air bubbles propagating to the liquid crystal portion 50 side opposite to the end material portion 5 reach the portion where the score line CL is formed. At this time, the air bubbles are induced from the sealing portion 8 toward the gap of the scribed line CL formed in the lower glass portion 11 b in the direction of the arrow shown in the enlarged view of FIG. 2 and are discharged outward. That is, since bubbles are squeezed out by the scribe line CL formed on the bonding substrate 10, the bubbles no longer advance to the position where the liquid crystal portion 50 is formed.
參照圖5，在使雷射照射於與刻劃線CL同一線上的密封部8的情形時，可確認在密封部8上所產生的氣泡越過刻劃線CL而壓入至液晶部50。 Referring to FIG. 5, when a laser is irradiated to the seal portion 8 on the same line as the scribe line CL, it can be confirmed that bubbles generated in the seal portion 8 are pushed into the liquid crystal portion 50 over the scribe line CL.
相對於此，參照圖6，在上部玻璃部11a或下部玻璃部11b上之任一方形成刻劃線CL，對位於從該刻劃線CL起隔著間隔而隔離的位置之密封部8照射雷射的情形時，可確認在密封部8產生的氣泡不會越過刻劃線CL並滯留。藉此，能夠確認在密封部8所產生的氣泡，在往液晶部50側傳播的途中被往刻劃線CL之間隙外誘導並排出。 On the other hand, referring to FIG. 6, a score line CL is formed on either the upper glass portion 11 a or the lower glass portion 11 b, and the sealing portion 8 located at a position separated from the score line CL by a space is irradiated with lightning. In the case of ejection, it can be confirmed that bubbles generated in the sealing portion 8 do not stay over the score line CL. Accordingly, it was confirmed that the air bubbles generated in the sealing portion 8 were induced and discharged outside the gap of the scribe line CL on the way to the liquid crystal portion 50 side.
因此，從防止氣泡侵透液晶部50的觀點來看，在對貼合基板10之密封部8上照射雷射時，較佳為：對從上部玻璃部11a或下部玻璃部11b之刻劃線CL起往端材部5側隔著間隔而隔離之位置的密封部8照射雷射。 Therefore, from the viewpoint of preventing bubbles from penetrating the liquid crystal portion 50, when irradiating the sealing portion 8 of the bonded substrate 10 with a laser, it is preferable to scribe the lines from the upper glass portion 11a or the lower glass portion 11b. From CL, a laser is irradiated to the sealing portion 8 at a position separated by a gap from the end material portion 5 side.
而且，在經過對密封部8照射雷射以進行刻劃的階段後，利用刻劃輪60對上部玻璃部11a或下部玻璃部11b中未被刻劃而附著殘留的玻璃部進行刻劃。藉此，能夠容易且漂亮地從貼合基板10去除不要的端材部5及密封部8。 Then, after the stage where the sealing portion 8 is irradiated with laser light for scoring, the scoring wheel 60 is used to scoring the glass portion which is not scribed and remains attached to the upper glass portion 11 a or the lower glass portion 11 b. This makes it possible to easily and beautifully remove the unnecessary end material portion 5 and the sealing portion 8 from the bonding substrate 10.
另一方面，在本實施形態中，雖已說明了僅對上部玻璃部11a或下部玻璃部11b中任某一方先形成刻劃線CL後，對密封部8照射雷射並使氣泡往形成有刻劃線CL的間隙誘導並排出的技術內容，但並不限定於此。 On the other hand, in the present embodiment, it has been described that only the upper glass portion 11a or the lower glass portion 11b is formed with the scribe line CL first, and then the sealing portion 8 is irradiated with a laser to cause bubbles to form. The technical content of induction and discharge of the gap of the scribe line CL is not limited thereto.
亦即，根據本發明之其他實施形態，亦可為：利用刻劃輪60在上部玻璃部11a及下部玻璃部11b兩方形成刻劃線CL後，對密封部8照射雷射並將氣泡往形成於兩方玻璃部的刻劃線CL誘導(參照圖4)。 That is, according to another embodiment of the present invention, after the scribe line CL is formed on both the upper glass portion 11a and the lower glass portion 11b by the scoring wheel 60, the sealing portion 8 is irradiated with laser light and the bubbles are directed toward The scribe lines CL formed on both glass portions are induced (see FIG. 4).
具體而言，在上部玻璃部11a及下部玻璃部11b兩方形成刻劃線CL，之後，如上述之實施形態般當利用雷射20照射密封部8而進行刻劃時，在密封部8產生的氣泡，如圖4所示般能夠一邊沿著形成在上部玻璃部11a及下部玻璃部11b的刻劃線CL誘導而一邊使其往外部排出。 Specifically, a scribe line CL is formed on both the upper glass portion 11a and the lower glass portion 11b. After the scribe is irradiated with the laser 20 by irradiating the seal 8 as in the aforementioned embodiment, the seal 8 is generated in the seal 8. As shown in FIG. 4, the air bubbles can be discharged to the outside while being induced along the scribe lines CL formed on the upper glass portion 11a and the lower glass portion 11b.
在本發明之上述實施形態中，藉由在玻璃上預先形成有刻劃線CL，從而即使在照射雷射而對密封部8進行刻劃時產生氣泡，該氣泡亦沿玻璃部之刻劃線CL自然地被往外部誘導而排出，因此能夠以被分斷的密封部之面具有漂亮的面之方式進行分斷。 In the above-mentioned embodiment of the present invention, the scribe line CL is formed in advance on the glass, so that even if bubbles are generated when the sealing portion 8 is scribed by irradiating a laser, the bubbles are scribed along the glass portion. CL is naturally induced to be discharged to the outside, and therefore it can be cut such that the surface of the sealed portion to be cut has a beautiful surface.
此外，在本發明之上述實施形態中，利用刻劃輪在玻璃部預先形成有刻劃線CL後，對密封部8照射雷射20而能夠去除接合基板之端材部5，且能夠使邊框(額緣)部分等減少到最小限度。 Further, in the above-mentioned embodiment of the present invention, after the scribe line CL is formed in advance on the glass portion by the scoring wheel, the sealing portion 8 is irradiated with the laser 20 to remove the end material portion 5 of the bonded substrate, and the frame can be made. The (frontal) portion is minimized.
Claims (5)
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| ??10-2014-0078290 | 2014-06-25 | ||
| KR20140078290 | 2014-06-25 | ||
| KR1020140106717A KR101614379B1 (en) | 2014-06-25 | 2014-08-18 | Method for cutting of bonded substrate |
| ??10-2014-0106717 | 2014-08-18 |
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| JP6638400B2 (en) * | 2016-01-05 | 2020-01-29 | 三星ダイヤモンド工業株式会社 | Substrate cutting method |
| KR102633196B1 (en) * | 2016-12-01 | 2024-02-05 | 주식회사 탑 엔지니어링 | Scribing apparatus and scribing method |
| CN111566058A (en) * | 2017-12-27 | 2020-08-21 | 三星钻石工业股份有限公司 | Scribing method and scribing apparatus |
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| KR20050052168A (en) * | 2003-11-29 | 2005-06-02 | 엘지.필립스 엘시디 주식회사 | Method of cutting liquid crystal display panel |
| TW201132479A (en) * | 2010-02-09 | 2011-10-01 | Mitsuboshi Diamond Ind Co Ltd | Substrate breaking device |
| KR20120067207A (en) * | 2010-12-15 | 2012-06-25 | 엘지디스플레이 주식회사 | Cutting method for liquid crystal display panel |
| TW201343576A (en) * | 2012-02-23 | 2013-11-01 | Mitsuboshi Diamond Ind Co Ltd | Scribing device of brittle material substrate |
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| KR100218580B1 (en) | 1996-07-09 | 1999-09-01 | 구자홍 | High density large screen lcd manufacture method |
| JP2002287107A (en) * | 2001-03-28 | 2002-10-03 | Hitachi Ltd | Liquid crystal display device and manufacturing method thereof |
| JP2003002676A (en) * | 2001-06-19 | 2003-01-08 | Seiko Epson Corp | Substrate dividing method and liquid crystal device manufacturing method |
| JP2009210658A (en) * | 2008-02-29 | 2009-09-17 | Citizen Finetech Miyota Co Ltd | Manufacturing method of liquid crystal display element |
| JP5070341B2 (en) * | 2008-09-12 | 2012-11-14 | シャープ株式会社 | Manufacturing method of display panel |
| JP5481167B2 (en) * | 2009-11-12 | 2014-04-23 | 浜松ホトニクス株式会社 | Glass welding method |
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| KR20050052168A (en) * | 2003-11-29 | 2005-06-02 | 엘지.필립스 엘시디 주식회사 | Method of cutting liquid crystal display panel |
| TW201132479A (en) * | 2010-02-09 | 2011-10-01 | Mitsuboshi Diamond Ind Co Ltd | Substrate breaking device |
| KR20120067207A (en) * | 2010-12-15 | 2012-06-25 | 엘지디스플레이 주식회사 | Cutting method for liquid crystal display panel |
| TW201343576A (en) * | 2012-02-23 | 2013-11-01 | Mitsuboshi Diamond Ind Co Ltd | Scribing device of brittle material substrate |
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| JP6536098B2 (en) | 2019-07-03 |
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