TWI667362B - Sputtering target - Google Patents

Abstract

The sputtering target includes a back plate, a sputtering plate, and a fixing member. The back plate includes a first plate surface and a second plate surface opposite to each other, and includes perforations extending from the first plate surface to the second plate surface. The fixing member is located in the perforation and penetrates the surface of the first plate into the sputtering plate.

Description

Sputtering target

The present invention relates to a target structure, and more particularly to a sputtering target used in a sputtering process.

At present, sputtering is one of the methods used for the main deposition coating technology. Sputtering technology generally forms a plasma in a sputtering chamber. The plasma performs ion bombardment on a metal target, causing the metal atoms of the target to strike out, and the gas molecules are emitted to reach the desired deposition. After the gas molecules are sputtered by adhesion, adsorption, surface migration, nucleation, etc. on the substrate, a metal film with metal atoms is finally formed on the substrate. Sputtering technology is widely used in the fields of industrial production and scientific research. However, the joint design of different components of a general sputtering target is complicated, and therefore it is time-consuming to assemble and less flexible to use.

The present invention relates to a sputtering target.

According to a first aspect of the present invention, a sputtering target is provided, which includes a back plate, a sputtering plate, and a fixing member. The back plate includes a first plate surface and a second plate surface opposite to each other, and includes perforations extending from the first plate surface to the second plate surface. The fixing member is located in the perforation and penetrates the surface of the first plate into the sputtering plate.

In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are described in detail below in conjunction with the accompanying drawings:

In the following, some examples are used for illustration. It should be noted that this disclosure does not show all possible embodiments, and other implementations not proposed in this disclosure may also be applicable. Moreover, the dimensional proportions in the drawings are not drawn according to the actual products. Therefore, the contents of the description and the drawings are only used to describe the embodiments, and not used to limit the scope of the disclosure. In addition, the descriptions in the embodiments, such as the detailed structure, process steps, and application of materials, are for illustration purposes only, and are not intended to limit the scope of the disclosure to be protected. The details of the steps and structures of the embodiments can be changed and modified according to the needs of the actual application process without departing from the spirit and scope of the present disclosure. The following uses the same / similar symbols to indicate the same / similar components for explanation.

1 to 4A illustrate a method for manufacturing a sputtering target 402 according to an embodiment concept. FIG. 1 shows a perspective perspective view of the sputtering plate 104. FIG. 2 shows a perspective perspective view of the back plate 206. FIG. 3 is a schematic diagram of joining the sputtering plate 104 and the back plate 206 by using the fixing member 308. FIG. 4A shows a cross-sectional view of the sputtering target 402.

Please refer to FIG. 1, FIG. 3, and FIG. 4A. The sputtering plate 104 includes opposite sputtering surfaces 110 and a back surface 112. The sputtering surface 110 is a surface facing the substrate to be deposited when the sputtering target 402 is placed in the sputtering chamber. The sputtering plate 104 may include a sputtering region 114 and an edge region 116. The sputtering region 114 may have a rectangular plate shape, and the edge region 116 may surround four sides of the sputtering region 114 and may have a rectangular ring shape. The sputtering region 114 has a thickness T1 that is greater than a thickness T2 of the edge region 116. In one embodiment, the sputtering region 114 may correspond to the sputtering target material 402 in the region of the region where the consumption rate is relatively high when the process is performed. The edge region 116 is a region that is not substantially consumed. Therefore, the sputtering region 114 The larger thickness of the shot region 114 indicates that it can provide a larger amount of sputtering consumption, and can make the sputtering target 402 have a longer service life.

The sputtering region 114 may include a recess 118A, which is recessed from the back surface 112 toward the inside of the sputtering plate 104 along the thickness direction of the sputtering plate 104 to have a depth D1. The depth D1 of the recess 118A is smaller than the thickness T1 of the sputtering region 114, and the depth D1 is smaller than the thickness T2 of the edge region 116. The edge region 116 may include a recess 118B, which is recessed from the back surface 112 toward the inside of the sputtering plate 104 along the thickness direction of the sputtering plate 104 to have a depth D2. The depth D2 may be smaller than the thickness T2. In one embodiment, D1> D2. In another embodiment, D1 = D2. In yet another embodiment, D1 <D2.

Referring to FIG. 2, FIG. 3 and FIG. 4A, the back plate 206 includes a first plate surface 220 and a second plate surface 222 opposite to each other. The back plate 206 may include perforations 224A and 224B, both extending from the first plate surface 220 to the second plate surface 222 along the thickness direction of the back plate 206.

Referring to FIG. 3, the back surface 112 of the sputtering plate 104 faces the first plate surface 220 of the back plate 206, and the holes 118A and 118B of the sputtering plate 104 are aligned with the through holes 224A and the holes of the back plate 206 224B. The fixing member 308 is arranged from the second plate surface 222 of the back plate 206 into the through holes 224A and 224B of the back plate 206 and the recesses 118A and 118B of the sputtering plate 104, and the fixing plate 308 is used to join the back plate 206 and the sputtering plate 104. As shown in FIG. 4A, a sputtering target 402 is formed.

Please refer to FIG. 3 and FIG. 4A. In one embodiment, the fixing member 308 includes a screw, a plug, a metallic adhesive, and the like. In one embodiment, the perforations 224A, 224B and the recesses 118A, 118B can be formed by drilling to have a threaded side surface of the corresponding screw, and the fixing member 308 can lock the back plate 206 and the sputtering plate 104 by a screw mechanism. The method of joining the plate 206 and the sputtering plate 104 is simple and fast. You can use a screwdriver to screw the screws in and out of the holes 224A, 224B and the recesses 118A, 118B arbitrarily. Therefore, the configuration is more flexible and the manufacturing process is simpler than the traditional welding of the entire metal layer. In addition, since commercially available screws can be used, the joining cost is also low.

In another embodiment, as shown in FIG. 4B, the sputtering target 502, the sputtering region 114 having a thickness greater than that of the edge region 116 can provide a larger locking depth for the fixing member 308, and strengthen the back plate 206 and the sputtering The locking effect between the shooting plates 104. The portion of the sputtering region 114 corresponding to the cavity 118A has a thickness t greater than 0, where T1 = t + D1. At a fixed thickness T1, a larger thickness t indicates that a larger amount of target sputtering can be provided.

The material of the sputtering plate 104 may depend on the material of the thin film to be deposited on the substrate. The materials of the back plate 206 and the sputtering plate 104 may be the same or different. In one embodiment, the material of the sputtering plate 104 is aluminum, and can be integrally formed to form the sputtering region 114 and the edge region 116 at the same time, and the material of the back plate 206 is copper. In another embodiment, the materials of the sputtering plate 104 and the back plate 206 are aluminum or copper.

The fixing member 308 can be formed of a material that can affect the magnetic field, and the position of the fixing member 308 in the sputtering target 402 can be adjusted according to the required magnetic field distribution design. The fixing member 308 may also be formed of a material that does not affect the magnetic field. The material of the fixing member 308 may be the same or different from the back plate 206 / sputter plate 104. The material of the fixing member 308 may include, for example, stainless steel, iron, or the like.

The concept of the present invention is not limited to the sputtering target material 402 shown in the figure, and the sputtering target material can also be appropriately designed.

In one embodiment, a U-shaped water channel (not shown) may be disposed in the back plate 206 to provide cooling and heat dissipation effects, and the perforations 224A and 224B are configured to avoid the water channel.

In one embodiment, the back plate 206 and the sputtering plate 104 can be locked to each other only by using the fixing member 308, but an adhesive layer (not shown) can be optionally configured, for example, including a soft solder for more firm adhesion The back plate 206 and the sputtering plate 104.

The arrangement position of the fixing member 308 can be appropriately adjusted according to requirements. In one embodiment, for example, the sputtering target 602 shown in FIG. 4C, the fixing member 308 may be disposed only in the edge region 116, and the sputtering member 114 is not provided with the fixing member 308, so All thicknesses T1 of the region 114 can be supplied with sputtering, which can increase the service life of the sputtering target.

In an embodiment, the thickness distribution of the sputtering plate and the back plate can be appropriately adjusted according to the actual sputtering consumption distribution of the sputtering target in the sputtering chamber. For example, the part with a faster consumption rate can be designed to have a relatively large Thickness, or designed into other shapes, such as circular (circular plate shape, ring shape, and so on), triangle, square, etc.

In summary, although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the attached patent application.

104‧‧‧Sputtered Plate

110‧‧‧Sputtered surface

112‧‧‧back surface

114‧‧‧Sputtering area

116‧‧‧Marginal zone

118A, 118B ‧ ‧ pits

206‧‧‧Back

220‧‧‧ surface of the first board

222‧‧‧Second plate surface

224A, 224B‧‧‧Perforated

308‧‧‧Fixed parts

402, 502, 602‧‧‧‧ sputtering targets

D1, D2‧‧‧ depth

t, T1, T2‧‧‧thickness

Figure 1 shows a perspective perspective view of a sputtering plate. Figure 2 shows a perspective perspective view of the back plate. FIG. 3 is a schematic view showing that the sputter plate and the back plate are joined by a fixing member. FIG. 4A is a cross-sectional view of a sputtering target according to an embodiment. FIG. 4B is a cross-sectional view of a sputtering target according to another embodiment. FIG. 4C is a cross-sectional view of a sputtering target according to still another embodiment.

Claims (11)

A sputtering target includes: a back plate including: a first plate surface and a second plate surface opposite to each other; and a perforation extending from the first plate surface to the second plate surface; a sputtering plate; And a fixing member, located in the perforation, and penetrating out of the first plate surface into the sputtering plate. The sputtering target according to item 1 of the scope of the patent application, wherein the back plate includes a plurality of the perforations, and the sputtering target includes a plurality of the fixing members, which respectively correspond to the perforations. The sputtering target according to item 1 of the patent application scope, wherein the fixing member and the perforation extend along a thickness direction of the back plate. The sputtering target according to item 1 of the scope of patent application, wherein the fixing member is located in the perforation and penetrates both the first plate surface and the second plate surface. The sputtering target according to item 1 of the patent application scope, wherein the sputtering plate includes an opposite sputtering surface and a back surface, and the fixing member crosses the back surface but does not reach the sputtering surface. The sputtering target according to item 1 of the patent application scope, wherein the sputtering plate includes an adjacent sputtering region and an edge region, and the thickness of the sputtering region is larger than the edge region, and the fixing member penetrates into The marginal area. The sputtering target according to item 6 of the patent application scope, wherein the fixing member penetrates the sputtering region, and the fixing member penetrates the sputtering region to a depth smaller than the thickness of the edge region. The sputtering target according to item 1 of the scope of patent application, wherein the fixing member includes a screw, a plug, and a metallic adhesive. The sputtering target according to item 1 of the patent application scope, wherein the material of the sputtering plate includes aluminum, and the material of the back plate includes copper. The sputtering target according to item 6 of the application, wherein the sputtering region and the edge region are integrally formed. The sputtering target according to item 6 of the patent application scope, wherein the fixing member does not penetrate into the sputtering area.