TWI666701B - Processing liquid supply device, substrate processing device, and processing liquid supply method - Google Patents

Abstract

The processing liquid supply device supplies a processing liquid to a processing unit that processes a substrate. The processing liquid supply device includes: a storage tank for storing the processing liquid; a circulation flow path for circulating the processing liquid in the storage tank; a supply flow path for supplying the processing liquid from the circulation flow path to the processing unit; The processing liquid supplied to the processing unit is returned to the circulation flow path; and the temperature adjustment unit adjusts the temperature of the processing liquid circulating in the circulation flow path.

Description

   Processing liquid supply device, substrate processing device, and processing liquid supply method   

The present invention relates to a processing liquid supply device that supplies a processing liquid to a processing unit that processes a substrate, a substrate processing device including the processing liquid supply device, and a processing liquid supply method using the processing liquid supply device and the substrate processing device. Substrates to be processed include, for example, FPD (Flat Panel Display) substrates including semiconductor wafers, substrates for liquid crystal display devices, organic EL (Electroluminescence) display devices, substrates for optical disks, and disks Substrates such as substrates, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

In the substrate processing using a single wafer processing type substrate processing apparatus that processes substrates piece by piece, for example, a processing unit that supplies a processing liquid such as a chemical solution stored in a tank to a processing substrate. In order to reduce the uneven processing of each substrate, the temperature of the processing liquid supplied to the processing unit needs to be adjusted. Therefore, the following patent document 1 proposes a substrate processing apparatus including a chemical solution supply path for supplying the chemical solution sent from the chemical solution tank to the processing unit, and a heater interposed in the chemical solution supply path. In the substrate processing performed by the substrate processing apparatus, a processing liquid whose temperature has been adjusted by a heater can be supplied to the substrate. The substrate processing apparatus is configured such that the chemical solution supplied from the chemical solution supply path to the processing unit is recovered to the chemical solution tank via the chemical solution recovery path.

[Prior technical literature]

(Patent Literature)

Patent Document 1: Japanese Patent Laid-Open No. 2006-269668

It is to be noted that, in a case where the substrate processing has passed for a long time, the processing liquid tank that has been supplied with the processing liquid to the processing unit may be replaced with another processing liquid tank. At this time, the supply of the processing liquid to the processing unit is interrupted.

The substrate processing apparatus of Patent Document 1 is provided with a chemical solution circulation path, which is connected to the chemical solution supply path and circulates the chemical solution in the chemical solution tank. Therefore, when the chemical liquid tank is replaced and the supply of the chemical liquid to the substrate is stopped, the chemical liquid supply path, the chemical liquid circulation path, and the chemical liquid in the chemical liquid tank can be circulated. By heating the circulating chemical liquid with a heater, the temperature of the chemical liquid supply path, the chemical liquid circulation path, and the chemical liquid in the chemical liquid tank can be adjusted.

On the other hand, while the supply of the processing liquid to the processing unit is interrupted, the chemical liquid is not supplied to the chemical liquid recovery path. Therefore, the medicinal solution in the medicinal solution recovery path does not return to the medicinal solution tank but is accumulated in the medicinal solution recovery path. The processing liquid that has been accumulated in the chemical liquid recovery path is cooled in the chemical liquid recovery path.

When the supply of the medicinal solution to the processing unit is restarted, the medicinal solution that has been cooled in the medicinal solution recovery path is squeezed out by the medicinal solution newly entering the medicinal solution recovery path and returned to the medicinal solution tank. Since the medicinal solution whose temperature in the medicinal solution recovery path has decreased has returned to the medicinal solution tank, the medicinal solution in the medicinal solution tank is cooled. Therefore, the temperature of the chemical solution supplied to the processing unit is reduced. Then, the cooled chemical solution is supplied to the substrate through the chemical solution supply path. At this time, the chemical solution may be supplied to the substrate before being sufficiently heated by the heater.

Therefore, it is an object of the present invention to provide a process capable of suppressing a change in the temperature of the processing liquid supplied to the processing unit when the supply of the processing liquid to the processing unit is restarted even when the supply of the processing liquid to the processing unit is interrupted. A liquid supply device, a substrate processing device, and a processing liquid supply method.

An embodiment of the present invention provides a processing liquid supply device that supplies a processing liquid to a processing unit that processes a substrate. And the processing liquid supply device includes: a storage tank for storing the processing liquid; a circulation flow path for circulating the processing liquid in the storage tank; a supply flow path for supplying the processing liquid from the circulation flow path to the processing unit; a return flow path, Returning the processing liquid that has been supplied to the processing unit to the circulation flow path; and a temperature adjustment unit that adjusts the temperature of the processing liquid circulating in the circulation flow path.

According to this configuration, the processing liquid in the storage tank is circulated through the circulation flow path. The temperature of the treatment liquid circulating in the circulation flow path is adjusted by a temperature adjustment unit. Therefore, the supply channel can supply the processing liquid whose temperature has been appropriately adjusted to the processing unit.

The processing liquid supplied to the processing unit is returned to the circulation flow path through the return flow path. The circulation flow path includes, for example, a branch portion connected to the return flow path, an upstream flow path connected to the branch portion from the upstream side of the circulation flow path, and a downstream flow path connected to the branch portion from the downstream side of the circulation flow path. The upstream side of the circulation flow path means the upstream side of the direction in which the treatment liquid flows through the circulation flow path. The downstream side of the circulation flow path means the downstream side in the direction in which the treatment liquid flows through the circulation flow path.

The processing liquid that has been supplied to the processing unit is returned to the storage tank through the return flow path, the branch portion, and the downstream flow path. Therefore, compared with the configuration in which the processing liquid in the return flow path is directly returned to the storage tank, the distance that the processing liquid flows through the return flow path can be set shorter.

Therefore, when the supply of the processing liquid to the processing unit is interrupted, the amount of the processing liquid remaining in the return flow path can be reduced. Thereby, it is possible to prevent the processing liquid in the return flow path from being cooled when the processing liquid that has been cooled in the return flow path is returned to the storage tank when the supply of the processing liquid to the processing unit is resumed. As a result, even when the supply of the processing liquid to the processing unit is interrupted, a change in the temperature of the processing liquid supplied to the processing unit when the supply of the processing liquid to the processing unit is restarted can be suppressed.

In one embodiment of the present invention, the distance that the processing liquid flows through the aforementioned return flow path is shorter than the distance that the processing liquid flows through the aforementioned downstream flow path. Therefore, when the supply of the processing liquid to the processing unit is interrupted, the amount of the processing liquid remaining in the return flow path can be further reduced. This can further suppress a change in the temperature of the processing liquid supplied to the processing unit when the supply of the processing liquid to the processing unit is restarted.

In one embodiment of the present invention, the circulation flow path includes a circulation groove provided in the branch portion, and the circulation groove includes a top portion connected to the upstream flow path and the return flow path, and a bottom portion connected to the downstream flow path.

According to this configuration, the upstream flow path and the return flow path are connected to the top of the circulation groove provided in the branch portion. Therefore, the processing liquid supplied to the circulation tank from the upstream flow path and the return flow path easily moves to the bottom in the circulation tank. Therefore, the processing liquid supplied to the circulation tank from the upstream flow path and the return flow path can easily flow in the downstream flow path connected to the bottom. Thereby, the circulation flow path can smoothly circulate the processing liquid.

When the processing liquid is supplied into the circulation tank, the processing liquid in the circulation tank is accumulated at the bottom. Therefore, a space is easily provided between the liquid level and the top of the processing liquid in the circulation tank. Therefore, it is possible to prevent the processing liquid in the circulation tank from flowing backward to the return flow path because the processing liquid in the circulation tank reaches the top.

In an embodiment of the present invention, the processing liquid supply device further includes a downstream valve for opening and closing the downstream flow path; and a valve opening and closing unit that maintains the state of closing the downstream valve until the amount of the processing liquid in the circulation tank reaches Up to the reference amount, the downstream valve is opened when the amount of the processing liquid in the circulation tank reaches the reference amount.

According to this configuration, the downstream valve is kept closed until the amount of the processing liquid in the circulation tank reaches the reference amount. The downstream valve is opened when the amount of processing liquid in the circulation tank reaches the reference amount. Therefore, the treatment liquid in the circulation tank can be prevented from reaching the top of the circulation tank. Therefore, it is possible to effectively prevent the processing liquid in the circulation tank from flowing backward to the return flow path.

In one embodiment of the present invention, a plurality of the processing units are provided, and the processing liquid that has been supplied from the supply flow path to each of the plurality of processing units is supplied to the circulation in common through the return flow path. groove.

According to this configuration, the processing liquid that has been supplied from the supply flow path to each of the plurality of processing units is supplied to the circulation tank in common through the return flow path. Specifically, the supply flow path supplies processing liquid to each processing unit in the processing unit, and the return flow path guides the processing liquid from each processing unit to the circulation tank. Therefore, it is not necessary to provide a circulation tank for each processing unit.

In one embodiment of the present invention, the branch portion is disposed below a processing chamber provided in the processing unit and configured to receive the substrate. Therefore, the processing liquid in the return flow path easily flows toward the circulation flow path. Therefore, when the supply of the processing liquid to the processing unit is interrupted, the amount of the processing liquid remaining in the return flow path can be further reduced. This can further suppress a change in the temperature of the processing liquid supplied to the processing unit when the supply of the processing liquid to the processing unit is restarted.

In one embodiment of the present invention, the branch portion is accommodated in the flow path box disposed adjacent to the processing chamber together with the return flow path. Therefore, the distance between the processing chamber and the circulation tank can be reduced. Furthermore, the return flow path can be set shorter.

In one embodiment of the present invention, a plurality of the storage tanks are provided; the processing liquid supply device further includes: an upstream switching unit that stores the storage tanks that supply a processing liquid supply source to the branch or the processing unit in the plurality of storage tanks; And the downstream switching unit switches the storage tank of the supply target among the plurality of storage tanks so that the storage tank of the supply target and the storage tank of the supply source are the same tank, and The storage tank of the supply target is supplied with a processing liquid from the branch portion.

According to this configuration, the storage tank of the supply target is switched among a plurality of storage tanks so that the storage tank of the supply source and the storage tank of the supply target are the same tank. Therefore, the processing liquid in each storage tank can be circulated through the circulation flow path without changing the amount of the processing liquid in each storage tank. Therefore, before starting the circulation of the processing liquid using the circulation flow path, the necessary amount of the processing liquid supplied to the processing unit can be set for each storage tank. This makes it easy to manage the amount of the processing liquid in the storage tank.

According to another embodiment of the present invention, a substrate processing apparatus including the processing liquid supply device and the processing unit is provided. With this configuration, the same effects as described above can be achieved.

Another embodiment of the present invention provides a processing liquid supply method, which supplies a processing liquid to a processing unit for processing a substrate using the processing liquid, and includes a circulation step of circulating the processing liquid in a storage tank storing the processing liquid in a circulation flow path. A supply step of supplying a processing liquid to the processing unit from the circulation flow path, and a return step of returning the processing liquid that has been supplied to the processing unit in the supply step to the circulation flow path.

According to this method, in the circulation step, the treatment liquid in the storage tank is circulated through the circulation flow path. In the temperature adjustment step, the temperature of the processing liquid circulating in the circulation flow path is adjusted. Therefore, in the supplying step, the processing liquid whose temperature has been appropriately adjusted can be supplied from the circulation flow path to the processing unit.

In the returning step, the processing liquid that has been supplied to the processing unit is returned to the circulation flow path, and then returned to the storage tank. Therefore, compared with the configuration in which the processing liquid that has been supplied to the processing unit is directly returned to the storage tank, the distance that the processing liquid flows until it returns to the circulation flow path can be set shorter.

Therefore, when the supply of the processing liquid to the processing unit is interrupted, the amount of the processing liquid remaining in the portion between the processing unit and the circulation flow path can be reduced. Thereby, it is possible to suppress cooling of the processing liquid in the storage tank due to the processing liquid cooled in this part being returned to the storage tank when the supply of the processing liquid to the processing unit is resumed. As a result, even when the supply of the processing liquid to the processing unit is interrupted, a change in the temperature of the processing liquid supplied to the processing unit when the supply of the processing liquid to the processing unit is restarted can be suppressed.

According to another embodiment of the present invention, in the circulation step, the processing liquid is sequentially connected to a branch portion through which the processing liquid that has been supplied to the processing unit is returned through the return flow path, and is connected to the upstream side of the circulation flow path The upstream flow path of the branch part and the downstream flow path connected to the branch part from the downstream side of the circulation flow path flow. Therefore, in the return step, the processing liquid that has been supplied to the processing unit is returned to the storage tank through the return flow path, the branch portion, and the downstream flow path. Therefore, compared with the configuration in which the processing liquid in the return flow path is directly returned to the storage tank, the distance that the processing liquid flows through the return flow path can be set shorter.

According to another embodiment of the present invention, the distance that the processing liquid flows through the return flow path in the return step is shorter than the distance that the processing liquid flows through the downstream flow path in the circulation step. Therefore, when the supply of the processing liquid to the processing unit is interrupted, the amount of the processing liquid remaining in the return flow path can be further reduced. This can further suppress a change in the temperature of the processing liquid supplied to the processing unit when the supply of the processing liquid to the processing unit is restarted.

According to another embodiment of the present invention, the circulation flow path includes a circulation groove provided in the branch portion; the circulation groove includes a top connected to the upstream flow path and the return flow path, and a bottom connected to the downstream flow path. .

According to this method, an upstream flow path and a return flow path are connected to the top of a circulation groove provided in the branch portion. Therefore, the processing liquid supplied to the circulation tank from the upstream flow path and the return flow path easily moves to the bottom in the circulation tank. Therefore, the processing liquid supplied to the circulation tank from the upstream flow path and the return flow path can easily flow in the downstream flow path connected to the bottom. Thereby, the circulation flow path can smoothly circulate the processing liquid.

According to another embodiment of the present invention, the substrate processing method further includes a valve opening and closing step, and the valve opening and closing step maintains a state in which a downstream valve that opens and closes the downstream flow path is closed until the amount of the processing liquid in the circulation tank reaches a reference amount. When the amount of the processing liquid in the circulation tank reaches a reference amount, the downstream valve is opened.

According to this method, the downstream valve is kept closed until the amount of the processing liquid in the circulation tank reaches the reference amount. The downstream valve is opened when the amount of processing liquid in the circulation tank reaches the reference amount. Therefore, the treatment liquid in the circulation tank can be prevented from reaching the top of the circulation tank. Therefore, it is possible to effectively prevent the processing liquid in the circulation tank from flowing backward to the return flow path.

According to another embodiment of the present invention, the supplying step includes a step of supplying a processing liquid to each of the plurality of processing units from the circulation flow path, and the returning step includes supplying each of the processes to the plurality of processing units. The processing liquid of the unit is supplied to the circulation tank in common through the return flow path.

According to this method, the processing liquid that has been supplied from the circulation flow path to each of the plurality of processing units is supplied to the circulation tank in common through the return flow path. Specifically, the processing liquid is supplied to each processing unit from the circulation flow path, and the processing liquid is guided to the circulation tank from each processing unit from the return flow path. Therefore, it is not necessary to provide a circulation tank for each processing unit.

According to another embodiment of the present invention, the branch portion is disposed below a processing chamber provided in the processing unit and containing the substrate. Therefore, the processing liquid in the return flow path easily flows toward the circulation flow path. Therefore, when the supply of the processing liquid to the processing unit is interrupted, the amount of the processing liquid remaining in the return flow path can be further reduced. This can further suppress a change in the temperature of the processing liquid supplied to the processing unit when the supply of the processing liquid to the processing unit is restarted.

According to another embodiment of the present invention, the branch portion is stored in a flow path box disposed adjacent to the processing chamber together with the return flow path. Therefore, the distance between the processing chamber and the circulation tank can be reduced. Furthermore, the return flow path can be set shorter.

According to another embodiment of the present invention, the substrate processing method further includes a switching step. The switching step is to switch the storage tank of the supply source and the storage tank of the supply target in a plurality of storage tanks, so that the aforementioned The storage tank is the same tank as the storage tank of the supply target, and the storage tank of the supply source supplies the processing liquid to the branch portion or the processing unit, and the storage tank of the supply target is covered by the branch portion. Supply the processing liquid.

According to this method, the storage tank of the supply target is switched among a plurality of storage tanks so that the storage tank of the supply source and the storage tank of the supply target are the same tank. Therefore, the processing liquid in each storage tank can be circulated through the circulation flow path without changing the amount of the processing liquid in each storage tank. Therefore, before starting the circulation of the processing liquid using the circulation flow path, the necessary amount of the processing liquid supplied to the processing unit can be set for each storage tank. This makes it easy to manage the amount of the processing liquid in the storage tank.

The above-mentioned or further other objects, features, and effects in the present invention will be known with reference to the accompanying drawings and the description of the embodiments described below.

1, 1P, 1Q‧‧‧‧ substrate processing equipment

2, 2A‧‧‧ processing unit

3, 3P, 3Q‧‧‧‧ treatment liquid supply device

4‧‧‧ rotating chuck

5‧‧‧ treatment liquid nozzle

6‧‧‧ Cup

7‧‧‧ treatment chamber

8‧‧‧flow box

10‧‧‧ chuck pin

11‧‧‧ rotating base

12‧‧‧ substrate rotation unit

13‧‧‧ Electric motor

14‧‧‧Controller

14A‧‧‧Processor

14B‧‧‧Memory

20‧‧‧Storage tank

20A‧‧‧First storage tank

20B‧‧‧Second Storage Tank

20C‧‧‧Third Storage Tank

21‧‧‧Circular flow path

22, 22A‧‧‧ Supply flow path

23, 23A‧‧‧ Return flow path

24‧‧‧Supply valve

25‧‧‧ new liquid tank

26‧‧‧New liquid flow path

26A‧‧‧First new liquid flow path

26B‧‧‧Second new liquid flow path

26C‧‧‧The third new liquid flow path

27‧‧‧new liquid pump

28‧‧‧ new fluid valve

29A‧‧‧The first new liquid switching valve

29B‧‧‧Second new fluid switching valve

29C‧‧‧Third new liquid switching valve

30‧‧‧ Branch

31‧‧‧Circulation tank

31a‧‧‧Top

31b‧‧‧ bottom

32‧‧‧ level sensor

40‧‧‧ upstream flow path

40A‧‧‧First upstream flow path

40B‧‧‧Second upstream flow path

40C‧‧‧The third upstream flow path

41‧‧‧upstream pump

41A‧‧‧First upstream pump

41B‧‧‧Second upstream pump

41C‧‧‧The third upstream pump

42‧‧‧Circulation heater

42A‧‧‧First cycle heater

42B‧‧‧Second circulation heater

42C‧‧‧Third circulation heater

43‧‧‧ Filter

43A‧‧‧first filter

43B‧‧‧Second filter

43C‧‧‧Third filter

44‧‧‧upstream valve

45A‧‧‧The first upstream switching valve

45B‧‧‧Second upstream switching valve

45C‧‧‧The third upstream switching valve

50‧‧‧ downstream flow path

50A‧‧‧First downstream flow path

50B‧‧‧Second downstream flow path

50C‧‧‧The third downstream flow path

50a, 50b ‧‧‧ connecting part

51‧‧‧downstream pump

52‧‧‧downstream valve

53‧‧‧downstream switching valve

53A‧‧‧First downstream switching valve

53B‧‧‧Second downstream switching valve

53C‧‧‧Third downstream switching valve

60‧‧‧Supply flow path

60A‧‧‧The first supply flow path

60B‧‧‧Second Supply Channel

61A‧‧‧The first supply pump

61B‧‧‧Second Supply Pump

62A‧‧‧The first supply heater

62B‧‧‧Second Supply Heater

63A‧‧‧First Supply Filter

63B‧‧‧Second Supply Filter

64A‧‧‧The first supply valve

64B‧‧‧Second Supply Valve

70‧‧‧ Recovery flow path

70A‧‧‧The first recovery flow path

70B‧‧‧Second recovery flow path

71A‧‧‧The first recovery valve

71B‧‧‧Second Recovery Valve

A‧‧‧Circulation direction

A1‧‧‧axis of rotation

D1, D2, D21, D22, D23‧‧‧ distance

H1, L1‧‧‧ first reference height

H2, L2‧‧‧ second base height

From t1 to t8‧‧‧

W‧‧‧ substrate

FIG. 1 is a schematic diagram showing a configuration of a substrate processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a block diagram for explaining the electrical configuration of the main part of the aforementioned substrate processing apparatus.

FIG. 3A is a schematic diagram illustrating an example of substrate processing performed by the aforementioned substrate processing apparatus.

FIG. 3B is a schematic diagram illustrating an example of substrate processing performed by the aforementioned substrate processing apparatus.

FIG. 4A is a schematic view showing a state of a circulation tank in substrate processing.

FIG. 4B is a schematic view showing a state of a circulating tank in substrate processing.

FIG. 4C is a schematic view showing the condition of a circulating tank in substrate processing.

FIG. 5 is a schematic diagram showing a configuration of a substrate processing apparatus according to a second embodiment of the present invention.

FIG. 6 is a timing chart for explaining an example of substrate processing performed by the substrate processing apparatus of the second embodiment.

FIG. 7A is a schematic diagram for explaining an example of substrate processing performed by the substrate processing apparatus according to the second embodiment.

FIG. 7B is a schematic diagram for explaining an example of substrate processing performed by the substrate processing apparatus according to the second embodiment.

7C is a schematic diagram for explaining an example of substrate processing performed by the substrate processing apparatus according to the second embodiment.

7D is a schematic diagram for explaining an example of substrate processing performed by the substrate processing apparatus according to the second embodiment.

7E is a schematic diagram for explaining an example of substrate processing performed by the substrate processing apparatus according to the second embodiment.

7F is a schematic diagram for explaining an example of substrate processing performed by the substrate processing apparatus according to the second embodiment.

FIG. 8 is a schematic diagram showing a configuration of a substrate processing apparatus according to a third embodiment of the present invention.

FIG. 9 is a timing chart for explaining an example of supplying a processing liquid to a processing unit provided in the substrate processing apparatus of the third embodiment.

FIG. 10A is a schematic diagram for explaining an example of substrate processing performed by the substrate processing apparatus according to the third embodiment.

FIG. 10B is a schematic diagram illustrating an example of substrate processing performed by the substrate processing apparatus according to the third embodiment.

10C is a schematic diagram for explaining an example of substrate processing performed by the substrate processing apparatus according to the third embodiment.

10D is a schematic diagram for explaining an example of substrate processing performed by the substrate processing apparatus according to the third embodiment.

FIG. 10E is a schematic diagram for explaining an example of substrate processing performed by the substrate processing apparatus according to the third embodiment.

(First Embodiment)

FIG. 1 is a schematic diagram showing the configuration of a substrate processing apparatus 1 according to a first embodiment of the present invention. The substrate processing apparatus 1 includes a processing unit 2 that processes a substrate W with a processing liquid, and a processing liquid supply apparatus 3 that supplies a processing liquid to the processing unit 2. Examples of the treatment liquid include a chemical liquid such as a phosphoric acid aqueous solution or a cleaning liquid such as pure water (DIW: Deionized Water).

As the chemical solution other than the phosphoric acid aqueous solution, for example, buffered hydrofluoric acid (BHF), difluoric acid (DHF), hydrofluoric acid (hydrogen fluoride water: HF), hydrochloric acid, sulfuric acid, nitric acid, acetic acid, oxalic acid, or ammonia water or the like Of mixed solution. As the mixed solution, for example, a mixed solution of sulfuric acid and hydrogen peroxide (SPM), a mixed solution of ammonia and hydrogen peroxide (SC1), or a mixed solution of hydrochloric acid and hydrogen peroxide (SC2) can be used.

As the cleaning liquid other than DIW, carbonated water, electrolytic ion water, ozone water, hydrochloric acid water with a diluted concentration (for example, about 10 ppm to 100 ppm), reduced water (hydrogen water), and the like can be used.

The processing unit 2 includes a rotary chuck 4 that rotates the substrate W about a vertical rotation axis A1 passing through a central portion of the substrate W, a processing liquid nozzle 5 that supplies a processing liquid to the upper surface (the main surface above) of the substrate W, and surrounds The cup 6 of the chuck 4 is rotated. The cup portion 6 has an annular groove opened upward.

The processing unit 2 further includes a processing chamber 7 accommodating the rotary chuck 4, the processing liquid nozzle 5, and the cup portion 6. An entrance (not shown) is formed in the processing chamber 7 and is used to carry the substrate W into or out of the processing chamber 7. The processing chamber 7 includes a door blocking unit (not shown) that opens and closes the doorway. The substrate W is housed in the processing chamber 7 through the entrance / exit. The substrate W that has been accommodated in the processing chamber 7 is held on the spin chuck 4.

The rotating chuck 4 includes a plurality of chuck pins 10, a rotating base 11, and a substrate rotating unit 12. The rotating base 11 has a disc shape along a horizontal direction. A plurality of chuck pins 10 are arranged on the peripheral edge portion of the upper surface of the rotating base 11 at intervals in the circumferential direction. The substrate W is held substantially horizontally by a plurality of chuck pins 10. The substrate rotating unit 12 includes a rotating shaft coupled to the center of the lower surface of the rotating base 11 and an electric motor that applies a rotating force to the rotating shaft. This rotation axis extends in the vertical direction along the rotation axis A1. The substrate rotation unit 12 rotates the rotation base 11 to rotate the substrate W about the rotation axis A1.

The processing liquid supply device 3 includes a storage tank 20 that stores the processing liquid, a circulation flow path 21 that circulates the processing liquid in the storage tank 20, a supply flow path 22 that supplies the processing liquid from the circulation flow path 21 to the processing unit 2, and a The processing liquid supplied to the processing unit 2 is returned to the return flow path 23 of the circulation flow path 21.

The circulation flow path 21 includes a branch part 30 connected to the return flow path 23, an upstream flow path 40 connected to the branch part 30 from the upstream side of the circulation flow path 21, and a downstream connection to the branch part 30 from the downstream side of the circulation flow path 21. Flow path 50. The upstream side of the circulation flow path 21 means the upstream side in the direction (circulation direction A) in which the processing liquid flows through the circulation flow path 21. The downstream side of the circulation flow path 21 means the downstream side of the circulation direction A. The upstream flow path 40 and the downstream flow path 50 are each formed of a pipe, for example.

The circulation flow path 21 further includes a circulation groove 31 provided in the branch portion 30. The circulation groove 31 includes a top portion 31 a forming an upper end portion of the circulation groove 31 and a bottom portion 31 b forming a lower end portion of the circulation groove 31. The circulation tank 31 can accumulate the processing liquid in the inside from below. The circulation tank 31 is provided with a liquid level sensor 32 that detects the height of the liquid surface of the processing liquid in the circulation tank 31.

An upstream end portion of the upstream flow path 40 is connected to the storage tank 20. A downstream end portion of the upstream flow path 40 is connected to a top portion 31 a of the circulation tank 31. An upstream end portion of the downstream flow path 50 is connected to a bottom portion 31 b of the circulation tank 31. The downstream end of the downstream flow path 50 is connected to the storage tank 20.

The processing liquid supply device 3 includes an upstream pump 41 that sends the processing liquid in the upstream flow path 40 to the downstream side, a circulation heater 42 for heating the processing liquid in the upstream flow path 40, and a processing in the upstream flow path 40 A filter 43 for filtering the liquid, and an upstream valve 44 that opens and closes the upstream flow path 40. The upstream pump 41, the circulation heater 42, the filter 43, and the upstream valve 44 are sequentially provided in the upstream flow path 40 from the upstream side.

The processing liquid supply device 3 includes a downstream pump 51 that sends the processing liquid in the downstream flow path 50 to the downstream side, and a downstream valve 52 that opens and closes the downstream flow path 50. The downstream pump 51 and the downstream valve 52 are sequentially disposed in the downstream flow path 50 from the upstream side.

The supply flow path 22 is formed by a pipe, for example. The upstream end of the supply flow path 22 is connected to the upstream flow path 40 between the filter 43 and the upstream valve 44. A downstream end portion of the supply flow path 22 is connected to the processing liquid nozzle 5. The processing liquid supply device 3 further includes a supply valve 24 interposed in the supply flow path 22 to open and close the supply flow path 22.

The return flow path 23 is formed by a pipe, for example. An upstream end portion of the return flow path 23 is connected to the bottom of the cup portion 6. A downstream end portion of the return flow path 23 is connected to the top portion 31 a of the circulation tank 31. The length of the return flow path 23 is shorter than the length of the downstream flow path 50.

The processing unit 2 includes a flow path box 8 accommodating at least the return flow path 23 and the branch portion 30 (circulation tank 31). In the present embodiment, in addition to the return flow path 23 and the branch portion 30 (circulation tank 31), the flow path box 8 also contains a supply valve 24 and a downstream pump 51. The flow path box 8 houses a part of the supply flow path 22, the upstream flow path 40, and the downstream flow path 50. The flow path box 8 is disposed adjacent to the processing chamber 7. The branch portion 30 (the circulation tank 31) is located in the flow path box 8 and is located below the processing chamber 7.

The processing liquid supply device 3 includes a new liquid tank 25 that stores unused (unused) processing liquid during substrate processing, a new liquid flow path 26 connected to the new liquid tank 25 and the storage tank 20, and a new liquid flow interposed therebetween The new liquid pump 27 and the new liquid valve 28 of the road 26.

FIG. 2 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a controller 14 that controls the substrate processing apparatus 1. The controller 14 includes a microcomputer, and controls a control target provided in the substrate processing apparatus 1 according to a predetermined program. More specifically, the controller 14 includes a processor (CPU (Central Processing Unit)) 14A and a memory 14B that stores programs. The controller 14 is configured to execute various controls for substrate processing by the processor 14A executing a program. The controller 14 controls operations of the electric motor 13, the circulation heater 42, the pumps 27, 41, 51, the valves 24, 28, 44, 52, and the liquid level sensor 32.

3A and 3B are schematic diagrams for explaining an example of substrate processing performed by the substrate processing apparatus 1. The substrate processing performed by the substrate processing apparatus 1 is mainly realized by the controller 14 executing a program. Before the substrate processing is started, the valves 24, 28, 44, 52 are all closed.

Referring to FIG. 3A, in the substrate processing, first, the unprocessed substrate W is held on the spin chuck 4. Then, a circulation step of circulating the treatment liquid in the storage tank 20 through the circulation flow path 21 is performed. Specifically, the upstream valve 44 is opened. On the other hand, the supply valve 24 is maintained in a closed state. Then, the upstream pump 41 sucks the processing liquid in the storage tank 20. Thereby, the processing liquid is supplied from the storage tank 20 to the upstream flow path 40. Then, the circulation heater 42 heats the processing liquid in the upstream flow path 40. The treatment liquid flowing through the upstream flow path 40 is filtered by a filter 43. Thereby, precipitates and the like are removed from the processing liquid flowing through the upstream flow path 40. The processing liquid flowing through the upstream flow path 40 is supplied to the circulation tank 31 on the downstream side from the upstream flow path 40.

Then, in a state where the downstream valve 52 is opened, the downstream pump 51 sucks the processing liquid in the circulation tank 31. Thereby, the processing liquid is supplied to the downstream flow path 50 from the circulation tank 31. The treatment liquid flowing through the downstream flow path 50 is sent to the storage tank 20. In this way, the processing liquid that has been sent from the storage tank 20 to the upstream flow path 40 returns to the storage tank 20 through the downstream flow path 50. That is, the processing liquid in the storage tank 20 is circulated through the circulation flow path 21. The circulation of the processing liquid in the storage tank 20 through the circulation flow path 21 is referred to as a liquid circulation. When the liquid is circulated, the circulation heater 42 is used to heat the treatment liquid in the upstream flow path 40 to adjust the temperature of the treatment liquid in the circulation flow path 21 (temperature adjustment step). The circulation heater 42 functions as a temperature adjustment unit that adjusts the temperature of the processing liquid in the circulation flow path 21.

Referring to FIG. 3B, after the temperature adjustment step is started, a supply step of supplying the processing liquid from the circulation flow path 21 to the processing unit 2 is performed. Specifically, the supply valve 24 is opened. On the other hand, the upstream valve 44 is closed. Thereby, the processing liquid flowing through the upstream flow path 40 is supplied to the processing liquid nozzle 5 through the supply flow path 22. The processing liquid supplied to the processing liquid nozzle 5 is discharged toward the upper surface of the substrate W held on the spin chuck 4.

Before the supply of the processing liquid to the upper surface of the substrate W is started, the rotation of the substrate W about the rotation axis A1 is started by the spin chuck 4. The processing liquid that has contacted the upper surface of the substrate W is spread over the entire upper surface of the substrate W due to the centrifugal force. Thereby, the upper surface of the substrate W is processed with the processing liquid. In this manner, the supply of the processing liquid from the storage tank 20 to the processing unit 2 is referred to as a liquid supply.

The processing liquid on the upper surface of the substrate W is scattered outside the substrate W due to the centrifugal force. The processing liquid which has scattered outside the substrate W is caught by the cup portion 6. The processing liquid that has been caught by the cup portion 6 flows through the return flow path 23 and returns from the return flow path 23 to the circulation tank 31. In this way, the processing liquid that has been supplied to the processing unit 2 in the supply step is returned to the circulation flow path 21 (return step).

In a state where the downstream valve 52 is opened, the downstream pump 51 sucks the processing liquid in the circulation tank 31. Thereby, the processing liquid in the circulation tank 31 is transported to the storage tank 20 through the downstream flow path 50. In this way, the processing liquid that has been supplied to the processing unit 2 is returned to the storage tank 20. The transfer of the processing liquid from the processing unit 2 to the storage tank 20 is referred to as liquid recovery.

As described above, the length of the return flow path 23 is shorter than the length of the downstream flow path 50. Therefore, the distance D1 in which the processing liquid flows through the return flow path 23 is smaller than the distance D2 in which the processing liquid flows through the downstream flow path 50.

Unlike the present embodiment, the upstream valve 44 may be opened in the supplying step and the returning step. In this case, the loop step is performed in parallel with the supply step and the return step.

Here, in the monolithic substrate processing apparatus 1, it is impossible to recover all the processing liquids used in the processing of the substrate W. Therefore, the height of the liquid surface in the storage tank 20 gradually decreases. If the liquid level of the processing liquid in the storage tank 20 is lower than a predetermined height, the new liquid valve 28 is opened and the new liquid pump 27 is operated, whereby the storage tank 20 can be accessed from the new liquid tank 25 through the new liquid flow path 26. Supply the processing liquid. Thereby, the amount of the processing liquid in the processing liquid supply device 3 can be maintained at a predetermined amount or more. It is also possible to adjust the concentration of the processing liquid in the storage tank 20 by supplying a new processing liquid using the new liquid tank 25.

4A to 4C are schematic views showing a state of the circulation tank 31 in the substrate processing.

In the substrate processing, the downstream valve 52 is opened and closed according to the amount of the processing liquid in the circulation tank 31. In this embodiment, the amount of the processing liquid in the circulation tank 31 is determined based on the height of the liquid level of the processing liquid in the circulation tank 31.

Specifically, referring to FIG. 4A, if the liquid level sensor 32 (refer to FIG. 1) detects that the height of the liquid level of the processing liquid in the circulation tank 31 is lower than the predetermined first reference height L1, the controller 14 is turned off. Descending valve 52. In this state, the processing liquid is supplied to the circulation tank 31 from the upstream flow path 40 or the return flow path 23, whereby the liquid level of the processing liquid in the circulation tank 31 rises. 4A to 4C show examples in which the processing liquid is supplied to the circulation tank 31 from the upstream flow path 40.

As shown in FIG. 4B, if the liquid level sensor 32 (refer to FIG. 1) detects that the height of the liquid level of the processing liquid in the circulation tank 31 reaches the first reference height L1, the controller 14 opens the downstream valve 52. Thereby, the processing liquid in the circulation tank 31 is transported to the downstream flow path 50, and the liquid level of the processing liquid in the circulation tank 31 is lower than the first reference height L1.

Then, as shown in FIG. 4C, if the liquid level sensor 32 detects that the height of the liquid level of the processing liquid in the circulation tank 31 is lower than the second reference height L2, the controller 14 closes the downstream valve 52 again. The second reference height L2 is set at a position lower than the first reference height L1. Thereby, since the processing liquid is accumulated in the circulation tank 31, the liquid level of the processing liquid in the circulation tank 31 rises again.

In this way, the controller 14 functions as a valve opening and closing unit, which maintains the state of closing the downstream valve 52 until the amount of the processing liquid in the circulation tank 31 reaches the reference amount (the first reference height L1), in the circulation tank 31 The downstream valve 52 is opened when the amount of the processing liquid therein reaches the reference amount (the first reference height L1).

According to the first embodiment, in the circulation step, the processing liquid in the storage tank 20 is circulated through the circulation flow path 21. In the temperature adjustment step, the temperature of the processing liquid circulating in the circulation flow path 21 is adjusted by the circulation heater 42. Therefore, in the supply step, the supply flow path 22 can supply the processing liquid whose temperature has been appropriately adjusted from the circulation flow path 21 to the processing unit 2.

In the returning step, the processing liquid that has been supplied to the processing unit 2 is returned to the circulation flow path 21 through the return flow path 23. The circulation flow path 21 includes, for example, a branch part 30 connected to the return flow path 23, an upstream flow path 40 connected to the branch part from the upstream side of the circulation flow path 21, and a branch part 30 connected to the downstream side from the circulation flow path 21 Downstream flow path 50.

The processing liquid supplied to the processing unit 2 is returned to the storage tank 20 through the return flow path 23, the branch portion 30, and the downstream flow path 50. Therefore, compared with the configuration in which the processing liquid in the return flow path 23 is directly returned to the storage tank 20, the distance D1 through which the processing liquid flows in the return flow path 23 can be set shorter.

Therefore, when the supply of the processing liquid to the processing unit 2 is interrupted due to the replacement of the storage tank 20 or the like, the amount of the processing liquid remaining in the return flow path 23 can be reduced. This can prevent the processing liquid in the storage tank 20 from being cooled when the processing liquid that has been cooled in the return flow path 23 when the supply of the processing liquid to the processing unit 2 is restarted, is cooled. As a result, even when the supply of the processing liquid to the processing unit 2 is interrupted, a change in the temperature of the processing liquid supplied to the processing unit 2 when the supply of the processing liquid to the processing unit 2 is resumed can be suppressed.

According to the first embodiment, the distance D1 through which the processing liquid flows through the return flow path 23 is shorter than the distance D2 through which the processing liquid flows through the downstream flow path 50. Therefore, when the supply of the processing liquid to the processing unit 2 has been interrupted, the amount of the processing liquid remaining in the return flow path 23 can be further reduced. This can further suppress a change in the temperature of the processing liquid supplied to the processing unit 2 when the supply of the processing liquid to the processing unit 2 is resumed.

According to the first embodiment, the upstream flow path 40 and the return flow path 23 are connected to the top portion 31 a of the circulation groove 31 provided in the branch portion 30. Therefore, the processing liquid that has been supplied to the circulation tank 31 from the upstream flow path 40 and the return flow path 23 easily moves at the bottom portion 31 b in the circulation tank 31. Therefore, the processing liquid supplied to the circulation tank 31 from the upstream flow path 40 and the return flow path 23 flows easily in the downstream flow path 50 connected to the bottom 31b. Thereby, the circulation flow path 21 can smoothly circulate the processing liquid.

When the processing liquid is supplied into the circulation tank 31, the liquid level of the processing liquid in the circulation tank 31 rises from the bottom 31b side toward the top 31a side. Therefore, it is easy to provide a space between the return flow path 23 and the liquid surface of the processing liquid. Therefore, the processing liquid in the circulation tank 31 is prevented from flowing back to the return flow path 23 because the processing liquid in the circulation tank 31 reaches the top portion 31 a.

According to the first embodiment, the downstream valve 52 is kept closed until the amount of the processing liquid in the circulation tank 31 reaches a reference amount (first reference height L1). The downstream valve 52 is opened when the amount of the processing liquid in the circulation tank 31 reaches the reference amount (the first reference height L1) (the valve opening and closing step). Therefore, the processing liquid in the circulation tank 31 can be prevented from reaching the top portion 31 a of the circulation tank 31. Therefore, it is possible to effectively prevent the processing liquid in the circulation tank 31 from flowing back to the return flow path 23.

According to the first embodiment, the circulation tank 31 is disposed below the processing chamber 7 that houses the substrate W. Therefore, the processing liquid in the return flow path 23 connected to the cup portion 6 disposed in the processing chamber 7 and the circulation groove 31 included in the circulation flow path 21 easily flows toward the circulation flow path 21. Therefore, when the supply of the processing liquid to the processing unit 2 has been interrupted, the amount of the processing liquid remaining in the return flow path 23 can be further reduced. This can further suppress a change in the temperature of the processing liquid supplied to the processing unit 2 when the supply of the processing liquid to the processing unit 2 is resumed.

According to the first embodiment, the return flow path 23 and the circulation tank 31 are accommodated in a flow path box 8 disposed adjacent to the processing chamber 7. Therefore, the distance between the processing chamber 7 and the circulation tank 31 can be reduced. Furthermore, the return flow path 23 (the distance D1 through which the processing liquid flows through the return flow path 23) can be set shorter.

FIG. 5 is a schematic diagram showing a configuration of a substrate processing apparatus 1P according to a second embodiment of the present invention. In FIG. 5, the same reference numerals are attached to the same components as explained so far, and the description is omitted (the same applies to FIGS. 6 and 7A to 7F described later).

The main difference between the substrate processing apparatus 1P and the substrate processing apparatus 1 of the first embodiment is that the processing liquid supply apparatus 3P includes a plurality of storage tanks 20. The plurality of storage tanks 20 include a first storage tank 20A, a second storage tank 20B, and a third storage tank 20C. The configuration of each member provided in the substrate processing apparatus 1P is different from the configuration of each member provided in the substrate processing apparatus 1 of the first embodiment in the points described below.

The circulation flow path 21 of the second embodiment can circulate the processing liquid in each of the storage tanks 20A to 20C.

The upstream flow path 40 of the second embodiment includes a first upstream flow path 40A, a second upstream flow path 40B, and a third upstream flow path 40C.

An upstream end portion of the first upstream flow path 40A is connected to the first storage tank 20A. A downstream end portion of the first upstream flow path 40A is connected to a top portion 31 a of the circulation tank 31.

The processing liquid supply device 3P includes a first upstream pump 41A that sends the processing liquid in the first upstream flow path 40A to the downstream side, and a first circulation heater 42A that heats the processing liquid in the first upstream flow path 40A. And a first filter 43A that filters the processing liquid in the first upstream flow path 40A. The processing liquid supply device 3P includes a first upstream switching valve 45A that switches whether or not the processing liquid is supplied from the first storage tank 20A to the circulation tank 31 and the processing unit 2, and an upstream valve 44 that can open and close the upstream flow path 40. The first upstream pump 41A, the first circulation heater 42A, the first filter 43A, the first upstream switching valve 45A, and the upstream valve 44 are sequentially arranged from the upstream side and are interposed in the first upstream flow path 40A.

An upstream end portion of the second upstream flow path 40B is connected to the second storage tank 20B. The downstream end of the second upstream flow path 40B is connected to the first upstream flow path 40A between the first upstream switching valve 45A and the upstream valve 44.

The processing liquid supply device 3P further includes a second upstream pump 41B that sends the processing liquid in the second upstream flow path 40B to the downstream side, and a second circulation heater 42B that heats the processing liquid in the second upstream flow path 40B. And a second filter 43B that filters the processing liquid in the second upstream flow path 40B. The processing liquid supply device 3P further includes a second upstream switching valve 45B that switches whether or not the processing liquid is supplied from the second storage tank 20B to the circulation tank 31 and the processing unit 2. The second upstream pump 41B, the second circulation heater 42B, the second filter 43B, and the second upstream switching valve 45B are sequentially arranged from the upstream side and are interposed in the second upstream flow path 40B.

An upstream end portion of the third upstream flow path 40C is connected to the third storage tank 20C. The downstream end portion of the third upstream flow path 40C is connected to the second upstream flow path 40B at a downstream side from the second upstream switching valve 45B.

The processing liquid supply device 3P includes a third upstream pump 41C that sends the processing liquid in the third upstream flow path 40C to the downstream side, and a third circulation heater 42C that heats the processing liquid in the third upstream flow path 40C. And a third filter 43C that filters the processing liquid in the third upstream flow path 40C. The processing liquid supply device 3P includes a third upstream switching valve 45C that switches whether or not the processing liquid is supplied from the third storage tank 20C to the circulation tank 31 and the processing unit 2. The third upstream pump 41C, the third circulation heater 42C, the third filter 43C, and the third upstream switching valve 45C are sequentially arranged from the upstream side and interposed in the third upstream flow path 40C.

The downstream flow path 50 includes a first downstream flow path 50A, a second downstream flow path 50B, and a third downstream flow path 50C.

An upstream end portion of the first downstream flow path 50A is connected to a bottom portion 31 b of the circulation tank 31. The downstream end of the first downstream flow path 50A is connected to the first storage tank 20A. The processing liquid supply device 3P includes a downstream pump 51, a downstream valve 52, and a first downstream switching valve 53A that switches whether or not the processing liquid is supplied to the first storage tank 20A. The downstream pump 51 and the first downstream switching valve 53A are arranged in order from the upstream side and are interposed in the first downstream flow path 50A.

An upstream end portion of the second downstream flow path 50B is connected to the first downstream flow path 50A between the downstream valve 52 and the first downstream switching valve 53A. A downstream end portion of the second downstream flow path 50B is connected to the second storage tank 20B. The processing liquid supply device 3P includes a second downstream switching valve 53B that is interposed in the second downstream flow path 50B and switches whether or not the processing liquid is supplied to the second storage tank 20B.

An upstream end portion of the third downstream flow path 50C is connected to the second downstream flow path 50B at an upstream side from the second downstream switching valve 53B. The downstream end of the third downstream flow path 50C is connected to the third storage tank 20C. The processing liquid supply device 3P includes a third downstream switching valve 53C which is interposed in the third downstream flow path 50C and switches whether or not the processing liquid is supplied to the third storage tank 20C.

The length of the return flow path 23 is shorter than the length of the first downstream flow path 50A. The length of the return flow path 23 is shorter than the sum of the length from the upstream end of the first downstream flow path 50A to the connection portion 50a of the first downstream flow path 50A and the second downstream flow path 50B; and The length of the second downstream flow path 50B. The length of the return flow path 23 is shorter than the sum of the following three: the length from the upstream end of the first downstream flow path 50A to the connecting portion 50a; from the upstream end of the second downstream flow path 50B to the second downstream flow The length of the connecting portion 50b of the path 50B and the third downstream flow path 50C; and the third downstream flow path 50C.

The upstream end of the supply flow path 22 of the processing liquid supply device 3P is connected to the first upstream flow path 40A between the upstream valve 44 and the connection portions of the first upstream flow path 40A and the second upstream flow path 40B.

The new liquid flow path 26 of the processing liquid supply device 3P includes a first new liquid flow path 26A, a second new liquid flow path 26B, and a third new liquid flow path 26C.

The first new liquid flow path 26A is connected to the new liquid tank 25 and the first storage tank 20A. The first new liquid flow path 26A is provided with a first new liquid switching valve 29A and a new liquid pump 27 for switching whether or not the processing liquid is supplied from the new liquid tank 25 to the first storage tank 20A. The fresh liquid pump 27 is disposed upstream of the first fresh liquid switching valve 29A.

The second new liquid flow path 26B branches from the first new liquid flow path 26A between the first new liquid switching valve 29A and the new liquid pump 27 and is connected to the second storage tank 20B. A second new liquid switching valve 29B is provided in the second new liquid flow path 26B to switch whether or not the processing liquid is supplied from the new liquid tank 25 to the second storage tank 20B.

The third new liquid flow path 26C branches from the first new liquid flow path 26A between the first new liquid switching valve 29A and the new liquid pump 27 and is connected to the third storage tank 20C. A third new liquid switching valve 29C is provided in the third new liquid flow path 26C to switch whether or not the processing liquid is supplied from the new liquid tank 25 to the third storage tank 20C.

FIG. 6 is a timing chart for explaining an example of substrate processing performed by the substrate processing apparatus 1P. 7A to 7F are schematic diagrams for explaining an example of substrate processing performed by the substrate processing apparatus 1P. 7A to 7F show operations of the substrate processing apparatus 1P from time t1 to time t8 in FIG. 6.

In the substrate processing performed by the substrate processing apparatus 1P, the storage tank 20A to 20C that supplies the processing liquid to the circulation tank 31 is referred to as a supply source storage tank. In the substrate processing performed by the substrate processing apparatus 1P, the storage tank 20A to the storage tank 20C to which the processing liquid is supplied from the circulation tank 31 is referred to as a supply target storage tank.

Before the substrate processing is started, the first reference height H1 and the second reference height H2 are set in each of the storage tanks 20A to 20C. The first reference height H1 is set near the top of the storage tank 20A to 20C, and the second reference height H2 is set lower than the first reference height H1 and set near the bottom of the storage tank 20A to 20C. The height of the liquid level of the processing liquid in each of the storage tanks 20A to 20C is detected by, for example, a liquid level sensor (not shown).

Before the substrate processing is started, the liquid level of each of the first storage tank 20A and the third storage tank 20C is maintained at the first reference height H1. The liquid level of the processing liquid in the second storage tank 20B is maintained at the second reference height H2. Before starting the substrate processing, all the valves 24, 29A to 29C, 44, 45A to 45C, 52, 53A to 53C shown in FIG. 5 are closed.

Referring to FIG. 7A, first, an unprocessed substrate W is held on the spin chuck 4. Then, the first circulation step of circulating the treatment liquid in the first storage tank 20A through the circulation flow path 21 is performed.

Specifically, at time t1 in Fig. 6, the upstream valve 44, the first upstream switching valve 45A, and the first downstream switching valve 53A are opened. Then, the first upstream pump 41A starts suction of the processing liquid in the first storage tank 20A. Thereby, the processing liquid is supplied from the first storage tank 20A to the first upstream flow path 40A. Then, the first circulation heater 42A starts heating of the processing liquid in the first upstream flow path 40A. The treatment liquid flowing through the first upstream flow path 40A is filtered by the first filter 43A. Thereby, precipitates and the like are removed from the processing liquid flowing through the first upstream flow path 40A. The processing liquid flowing through the first upstream flow path 40A is supplied to the circulation tank 31 on the downstream side in the circulation direction A from the first upstream flow path 40A.

Then, at time t1 in FIG. 6, similarly to the substrate processing in the first embodiment, opening and closing control of the downstream valve 52 corresponding to the amount of the processing liquid in the circulation tank 31 is started (see FIGS. 4A to 4C). FIG. 7A shows a state where the downstream valve 52 is opened. The opening and closing control of the downstream valve 52 by the controller 14 is continuously performed from time t1 to time t8.

In a state where the downstream valve 52 has been opened, the downstream pump 51 sucks the processing liquid in the circulation tank 31, thereby supplying the processing liquid from the circulation tank 31 to the first downstream flow path 50A. The processing liquid flowing through the first downstream flow path 50A is supplied to the first storage tank 20A on the downstream side from the first downstream flow path 50A. In the first circulation step, when the first downstream switching valve 53A is opened, the distance D21 through which the processing liquid flows through the downstream flow path 50 is greater than the distance D1 through which the processing liquid flows through the return flow path 23.

In this way, the processing liquid that has been sent from the first storage tank 20A to the first upstream flow path 40A returns to the first storage tank 20A from the first downstream flow path 50A. That is, in the first storage tank 20A, liquid is circulated through the circulation flow path 21. In the first cycle step, the first storage tank 20A is a supply source storage tank and also a supply target storage tank.

Then, referring to FIG. 7B, a second circulation step of circulating the processing liquid in the second storage tank 20B through the circulation flow path 21 is performed. Specifically, at time t2 in FIG. 6, the second upstream switching valve 45B and the second downstream switching valve 53B are opened. On the other hand, the first upstream switching valve 45A and the first downstream switching valve 53A are closed.

Then, the second upstream pump 41B starts to suck the processing liquid in the second storage tank 20B. Thereby, the processing liquid is supplied from the second storage tank 20B to the second upstream flow path 40B. Then, the second circulation heater 42B starts heating of the processing liquid in the second upstream flow path 40B. The treatment liquid flowing through the second upstream flow path 40B is filtered by the second filter 43B. Thereby, precipitates and the like are removed from the processing liquid flowing through the second upstream flow path 40B. The processing liquid flowing through the second upstream flow path 40B is supplied to the circulation tank 31 on the downstream side in the circulation direction A from the second upstream flow path 40B.

When the downstream valve 52 has been opened, the downstream pump 51 sucks the processing liquid in the circulation tank 31, thereby supplying the processing liquid from the circulation tank 31 to the downstream flow path 50.

In detail, the processing liquid that has been supplied from the circulation tank 31 to the downstream flow path 50 flows through the first downstream flow path 50A from the circulation tank 31 to the connection portion 50a, and then flows through the second downstream flow path Within 50B. The processing liquid flowing through the second downstream flow path 50B is supplied to the second storage tank 20B. In the second circulation step, when the second downstream switching valve 53B is opened, the distance D22 through which the processing liquid flows through the downstream flow path 50 is greater than the distance D1 through which the processing liquid flows through the return flow path 23.

In this way, the processing liquid that has been sent from the second storage tank 20B to the second upstream flow path 40B returns to the second storage tank 20B from the second downstream flow path 50B. In the second storage tank 20B, liquid is circulated through the circulation flow path 21. In the second cycle step, the second storage tank 20B is a supply source storage tank and also a supply target storage tank.

Then, referring to FIG. 7C, a third cycle step of circulating the processing liquid in the third storage tank 20C through the circulation flow path 21 is performed. Specifically, at time t3 in FIG. 6, the third upstream switching valve 45C and the third downstream switching valve 53C are opened. On the other hand, the second upstream switching valve 45B and the second downstream switching valve 53B are closed.

Then, the third upstream pump 41C starts suction of the processing liquid in the third storage tank 20C. Thereby, the processing liquid is supplied from the third storage tank 20C to the third upstream flow path 40C. Then, the third circulation heater 42C starts heating the processing liquid in the third upstream flow path 40C. The treatment liquid flowing through the third upstream flow path 40C is filtered by a third filter 43C. Thereby, precipitates and the like are removed from the processing liquid flowing through the third upstream flow path 40C. The processing liquid flowing through the third upstream flow path 40C is supplied to the circulation tank 31 on the downstream side in the circulation direction A from the third upstream flow path 40C.

When the downstream valve 52 has been opened, the downstream pump 51 sucks the processing liquid in the circulation tank 31, thereby supplying the processing liquid from the circulation tank 31 to the downstream flow path 50.

In detail, the processing liquid that has been supplied from the circulation tank 31 to the downstream flow path 50 flows through the first downstream flow path 50A from the circulation tank 31 to the connection portion 50a, and then, from the connection portion 50a to the connection portion. 50b flows through the second downstream flow path 50B. The processing liquid flowing through the second downstream flow path 50B is supplied to the third storage tank 20C on the downstream side from the third downstream flow path through the third downstream flow path 50C. In the third circulation step, when the third downstream switching valve 53C is opened, the distance D23 through which the processing liquid flows through the downstream flow path 50 is greater than the distance D1 through which the processing liquid flows through the return flow path 23.

In this way, the processing liquid that has been sent from the third storage tank 20C to the third upstream flow path 40C returns to the third storage tank 20C from the third downstream flow path 50C. That is, in the third storage tank 20C, liquid is circulated through the circulation flow path 21. In the third cycle step, the third storage tank 20C is a supply source storage tank and a supply target storage tank.

In this way, in the first cycle step, the second cycle step, and the third cycle step, the controller 14 controls the upstream switching valve 45A to the upstream switching valve 45C to place the supply source storage tank in the plurality of storage tanks 20A to 20C Make the switch. Further, the controller 14 controls the downstream switching valve 53A to the downstream switching valve 53C, and switches the supply target storage tank between the plurality of storage tanks 20A to 20C so that the supply target storage tank is the same as the supply source storage tank. Storage tank 20A to storage tank 20C (switching step). The upstream switching valve 45A to the upstream switching valve 45C function as an upstream switching unit, and the downstream switching valve 53A to the downstream switching valve 53C function as a downstream switching unit.

By performing the first circulation step, the second circulation step, and the third circulation step, the treatment liquid is circulated in the entirety of the storage tank 20, the upstream flow path 40, and the downstream flow path 50. At this time, the circulation heater 42A to the circulation heater 42C are used to heat the treatment liquid in the upstream flow path 40, thereby adjusting the temperature of the treatment liquid in the circulation flow path 21 (temperature adjustment step). The circulation heater 42A to 42C function as a temperature adjustment unit that adjusts the temperature of the processing liquid in the circulation flow path 21.

After the third cycle step is completed, liquid supply from the storage tank 20 to the processing unit 2 and liquid recovery from the processing unit 2 to the storage tank 20 are performed. After the third cycle step is completed, the plurality of storage tanks 20A to 20C play a role of any one of liquid supply, liquid recovery, and standby. Standby means that the storage tank 20A to the storage tank 20C no longer perform any of the functions of liquid supply and liquid recovery after the third cycle step.

Specifically, at time t4 in FIG. 6, the first upstream switching valve 45A and the second downstream switching valve 53B are opened, and the third upstream switching valve 45C and the third downstream switching valve 53C are closed. The first downstream switching valve 53A and the second upstream switching valve 45B are maintained in a closed state. The upstream valve 44 is closed, and the supply valve 24 is opened.

Therefore, from time t4 to time t5, referring to FIG. 7D, the processing liquid in the first storage tank 20A is supplied to the supply flow path 22 through the upstream flow path 40. The processing liquid supplied to the supply channel 22 is supplied to the processing liquid nozzle 5 of the processing unit 2 (supplying step). The processing liquid supplied to the processing liquid nozzle 5 is discharged toward the upper surface of the substrate W held on the spin chuck 4. Before the supply of the processing liquid to the upper surface of the substrate W is started, the rotation of the substrate W about the rotation axis A1 is started by the rotary chuck 4. The processing liquid that has contacted the upper surface of the substrate W is spread over the entire upper surface of the substrate W due to the centrifugal force. Thereby, the upper surface of the substrate W is processed with the processing liquid. In this way, the liquid supply from the first storage tank 20A to the processing unit 2 is performed. Due to the liquid supply, the amount of the processing liquid in the first storage tank 20A is reduced, and the height of the liquid level of the processing liquid becomes the second reference height H2.

During the period from time t4 to time t5, the processing liquid supplied to the processing unit 2 is returned to the circulation tank 31 via the return flow path 23 (return step). The processing liquid that has been returned to the circulation tank 31 is returned to the second storage tank 20B through the downstream flow path 50. In this way, liquid recovery from the processing unit 2 to the second storage tank 20B is performed. Due to the liquid recovery, the amount of the processing liquid in the second storage tank 20B increases, and the height of the liquid surface becomes higher than the second reference height H2 (for example, the first reference height H1).

The third storage tank 20C stands by while liquid is supplied by the first storage tank 20A and liquid is recovered by the second storage tank 20B. While the third storage tank 20C is on standby, the processing liquid can be supplied from the new liquid tank 25 to the third storage tank 20C. Thereby, the amount of the processing liquid in the processing liquid supply device 3P can be maintained at a predetermined amount or more. It is also possible to adjust the concentration of the processing liquid in the third storage tank 20C by using the supply of the new processing liquid through the new liquid tank 25.

At time t5 in FIG. 6, the third upstream switching valve 45C and the first downstream switching valve 53A are opened, and the first upstream switching valve 45A and the second downstream switching valve 53B are closed. The second upstream switching valve 45B and the third downstream switching valve 53C are maintained in a closed state.

Therefore, from time t5 to time t6, referring to FIG. 7E, the processing liquid in the third storage tank 20C is supplied to the supply flow path 22 through the upstream flow path 40. The processing liquid supplied to the supply channel 22 is supplied to the processing liquid nozzle 5 of the processing unit 2 (supplying step). Liquid supply from the third storage tank 20C to the processing unit 2 is performed. Due to the liquid supply, the amount of the processing liquid in the third storage tank 20C is reduced, and the height of the liquid surface of the processing liquid becomes the second reference height H2.

Then, from time t5 to time t6, the processing liquid that has been supplied to the processing unit 2 is returned to the circulation tank 31 via the return flow path 23 (return step). The processing liquid that has been returned to the circulation tank 31 is returned to the first storage tank 20A through the downstream flow path 50. In this way, liquid recovery from the processing unit 2 to the first storage tank 20A is performed. Due to the liquid recovery, the amount of the processing liquid in the first storage tank 20A increases, and the height of the liquid surface becomes higher than the second reference height H2 (for example, the first reference height H1).

The second storage tank 20B stands by while liquid is supplied by the third storage tank 20C and liquid is recovered by the first storage tank 20A. While the second storage tank 20B is in standby, the processing liquid can be supplied from the new liquid tank 25 to the second storage tank 20B. Thereby, the amount of the processing liquid in the processing liquid supply device 3P can be maintained at a predetermined amount or more. It is also possible to adjust the concentration of the processing liquid in the second storage tank 20B by supplying a new processing liquid through the new liquid tank 25.

Then, at time t6 in FIG. 6, the second upstream switching valve 45B and the third downstream switching valve 53C are opened, and the first downstream switching valve 53A and the third upstream switching valve 45C are closed. The first upstream switching valve 45A and the second downstream switching valve 53B are maintained in a closed state.

Therefore, from time t6 to time t7, referring to Fig. 7F, the processing liquid in the second storage tank 20B is supplied to the supply flow path 22 through the upstream flow path 40. The processing liquid supplied to the supply channel 22 is supplied to the processing liquid nozzle 5 (supplying step). Liquid supply from the second storage tank 20B to the processing unit 2 is performed. Due to the liquid supply, the amount of the processing liquid in the second storage tank 20B is reduced, and the height of the liquid surface becomes the first reference height H1.

Then, the processing liquid supplied to the processing unit 2 is returned to the circulation tank 31 via the return flow path 23 (return step). The processing liquid that has been returned to the circulation tank 31 is returned to the third storage tank 20C through the downstream flow path 50. Liquid recovery from the processing unit 2 to the third storage tank 20C is performed. Due to the liquid recovery, the amount of the processing liquid in the third storage tank 20C increases, and the height of the liquid level of the processing liquid becomes higher than the second reference height H2 (for example, the first reference height H1).

While the liquid is supplied by the second storage tank 20B and the liquid is recovered by the third storage tank 20C, the first storage tank 20A is on standby. While the first storage tank 20A is on standby, the processing liquid can be supplied from the new liquid tank 25 to the first storage tank 20A. Thereby, the amount of the processing liquid in the processing liquid supply device 3P can be maintained at a predetermined amount or more. It is also possible to adjust the concentration of the processing liquid in the first storage tank 20A by supplying a new processing liquid through the new liquid tank 25.

Then, at time t7, the upstream switching valve 45A to the upstream switching valve 45C and the downstream switching valve 53A to the downstream switching valve 53C are controlled in the same manner as the time t4. Thereby, the roles of each of the storage tanks 20A to 20C are switched, and the same substrate processing is performed from time t7 to time t8 as from time t4 to time t5. Subsequent to time t7, the substrate processing with the substrate processing from time t4 to time t7 as a unit is repeated.

According to the second embodiment, the same effects as the first embodiment are achieved.

According to the second embodiment, a plurality of storage tanks 20 (storage tanks 20A to 20C) are provided. Between the time t1 and the time t4 when the liquid circulation is performed, the supply target storage tank is switched among the plurality of storage tanks 20A to 20C so that the supply source storage tank and the supply target storage tank are the same storage tank. Therefore, the processing liquid in each of the storage tanks 20A to 20C can be circulated through the circulation flow path 21 without changing the amount of the processing liquid in each of the storage tanks 20A to 20C. Therefore, the necessary amount of the processing liquid to be supplied to the processing unit can be set for each of the storage tanks 20A to 20C before the circulation of the processing liquid using the circulation flow path 21 is started. This makes it easy to manage the amount of the processing liquid in the storage tank 20A to the storage tank 20C.

FIG. 8 is a schematic diagram showing a configuration of a substrate processing apparatus 1Q according to a third embodiment of the present invention. In FIG. 8, the same reference numerals are given to the same components as those explained so far, and the description thereof is omitted (the same applies to FIGS. 9 and 10A to 10E described later).

The configuration of the substrate processing apparatus 1Q is different from that of the components of the substrate processing apparatus 1 of the first embodiment in the following points.

The processing liquid supply device 3Q of the substrate processing apparatus 1Q includes a plurality of storage tanks 20 (a first storage tank 20A, a second storage tank 20B, and a third storage) similarly to the processing liquid supply apparatus 3P of the substrate processing apparatus 1P of the second embodiment. Slot 20C).

The upstream end of the upstream flow path 40 of the processing liquid supply device 3Q is connected to the first storage tank 20A. The downstream end of the upstream flow path 40 of the processing liquid supply device 3Q is connected to the top portion 31 a of the circulation tank 31. The upstream end of the downstream flow path 50 of the processing liquid supply device 3Q is connected to the bottom portion 31 b of the circulation tank 31. The downstream end of the downstream flow path 50 of the processing liquid supply device 3Q is connected to the first storage tank 20A.

The processing liquid supply device 3Q includes a downstream switching valve 53 that switches whether or not the processing liquid is supplied to the first storage tank 20. The downstream switching valve 53 is interposed in the downstream flow path 50 on the downstream side from the downstream valve 52.

The processing liquid supply device 3Q includes a replenishing flow path 60 for supplying the processing liquid to the first storage tank 20A from the second storage tank 20B and the third storage tank 20C, and recovering the processing liquid that has been supplied to the processing unit 2 to the second storage. The recovery flow path 70 of the tank 20B and the third storage tank 20C.

The replenishment flow path 60 includes a first replenishment flow path 60A for replenishing the processing liquid in the second storage tank 20B to the first storage tank 20A, and a first replenishment flow path for replenishing the processing liquid in the third storage tank 20C to the first storage tank 20A. Second supply flow path 60B.

An upstream end portion of the first supply flow path 60A is connected to the second storage tank 20B. The downstream end of the first replenishing flow path 60A is connected to the first storage tank 20A.

The processing liquid supply device 3Q includes a first supply pump 61A that sends the processing liquid in the first supply flow path 60A to the downstream side, a first supply heater 62A that heats the processing liquid in the first supply flow path 60A, A first supply filter 63A that filters the processing liquid in the first supply flow path 60A, and a first supply valve 64A that opens and closes the first supply flow path 60A. The first replenishment pump 61A, the first replenishment heater 62A, the first replenishment filter 63A, and the first replenishment valve 64A are sequentially arranged from the upstream side and are interposed in the first replenishment flow path 60A.

An upstream end portion of the second supply flow path 60B is connected to the third storage tank 20C. The downstream end portion of the second replenishing flow path 60B is connected to the first replenishing flow path 60A at a downstream side from the first replenishment valve 64A.

The processing liquid supply device 3Q includes a second supply pump 61B that sends the processing liquid in the second supply flow path 60B to the downstream side, a second supply heater 62B that heats the processing liquid in the second supply flow path 60B, A second supply filter 63B for filtering the processing liquid in the second supply flow path 60B, and a second supply valve 64B for opening and closing the second supply flow path 60B. The second replenishment pump 61B, the second replenishment heater 62B, the second replenishment filter 63B, and the second replenishment valve 64B are sequentially arranged from the upstream side and are interposed in the second replenishment flow path 60B.

The recovery flow path 70 includes a first recovery flow path 70A for recovering the processing liquid supplied to the processing unit 2 to the second storage tank 20B, and a recovery flow path 70A for recovering the processing liquid supplied to the processing unit 2 to the third storage tank 20C. Second recovery flow path 70B.

The upstream end of the first recovery flow path 70A is connected to the downstream flow path 50 between the downstream valve 52 and the downstream switching valve 53. The downstream end portion of the first recovery flow path 70A is connected to the second storage tank 20B. The processing liquid supply device 3Q includes a first recovery valve 71A interposed in the first recovery flow path 70A to open and close the first recovery flow path 70A.

An upstream end portion of the second recovery flow path 70B is connected to the first recovery flow path 70A at an upstream side from the first recovery valve 71A. A downstream end portion of the second recovery flow path 70B is connected to the third storage tank 20C. The processing liquid supply device 3Q includes a second recovery valve 71B interposed in the second recovery flow path 70B to open and close the first recovery flow path 70A.

The new liquid flow path 26 of the processing liquid supply device 3Q includes the aforementioned second new liquid flow path 26B and the third new liquid flow path 26C. The second new liquid flow path 26B of the third embodiment is different from the second new liquid flow path 26B of the second embodiment, and is connected to the new liquid tank 25 and the second storage tank 20B. The third new liquid flow path 26C of the third embodiment is different from the third new liquid flow path 26C of the second embodiment, and branches from the second new liquid flow path 26B and is connected to the third storage tank 20C.

FIG. 9 is a timing chart for explaining an example of substrate processing performed by the substrate processing apparatus 1Q. 10A to 10E are schematic diagrams for explaining an example of substrate processing performed by the substrate processing apparatus 1Q. 10A to 10E show operations of the substrate processing apparatus 1Q from time t1 to time t8 in FIG. 6.

Before the substrate processing is started by the substrate processing apparatus 1Q of the third embodiment, the first reference height H1 and the second reference height H2 are set in each of the storage tanks 20A to 20C. The first reference height H1 is set near the top of the storage tank 20A to 20C, and the second reference height H2 is set lower than the first reference height H1 and set near the bottom of the storage tank 20A to 20C.

Before the substrate processing is started by the substrate processing apparatus 1Q of the third embodiment, the liquid level of the processing liquid in the first storage tank 20A and the third storage tank 20C is maintained at the first reference height H1. In addition, the liquid level of the processing liquid in the second storage tank 20B is maintained at the second reference height H2. Before starting the substrate processing, all the valves 24, 29B, 29C, 44, 52, 53, 64A, 64B, 71A, 71B shown in Fig. 8 are closed.

Then, referring to FIG. 10A, the unprocessed substrate W is held on the spin chuck 4. The circulation step of circulating the treatment liquid in the first storage tank 20A through the circulation flow path 21 is performed. Specifically, at time t1 in FIG. 9, the upstream valve 44 is opened. Then, the upstream pump 41 starts suction of the processing liquid in the first storage tank 20A. Thereby, it is supplied from the first storage tank 20A to the circulation tank 31 via the upstream flow path 40.

At time t1 in FIG. 9, similarly to the downstream valve 52 of the first embodiment, the opening and closing control of the downstream valve 52 corresponding to the amount of the processing liquid in the circulation tank 31 is started. FIG. 10A shows a state where the downstream valve 52 has been opened. The opening and closing control of the downstream valve 52 by the controller 14 is continuously performed from time t1 to time t8.

In a state where the downstream valve 52 has been opened, the downstream pump 51 sucks the processing liquid in the circulation tank 31, thereby supplying the processing liquid from the circulation tank 31 to the first storage tank 20A through the downstream flow path 50. In this way, the processing liquid that has been sent from the first storage tank 20A to the upstream flow path 40 returns from the downstream flow path 50 to the first storage tank 20A. That is, in the first storage tank 20A, liquid is circulated through the circulation flow path 21.

After the circulation step is completed, liquid supply from the first storage tank 20A to the processing unit 2 and liquid recovery from the processing unit 2 to the second storage tank 20B or the third storage tank 20C are performed. After the circulation step is completed, the first storage tank 20A functions as a liquid supply. After the circulation step is completed, the second storage tank 20B and the third storage tank 20C perform any of the functions of liquid recovery, standby, and liquid replenishment.

The liquid replenishment refers to replenishing the processing liquid from the second storage tank 20B or the third storage tank 20C to the first storage tank 20A. Standby means that at the end of the circulation step, the storage tanks 20A to 20C no longer perform any of the functions of liquid supply, liquid recovery, and liquid replenishment.

Specifically, at time t2 in FIG. 9, the first recovery valve 71A is opened and the downstream switching valve 53 is closed. The upstream valve 44 is closed, and the supply valve 24 is opened.

Therefore, from time t2 to time t3, referring to FIG. 10B, the processing liquid in the first storage tank 20A is supplied to the supply flow path 22 through the upstream flow path 40. The processing liquid supplied to the supply channel 22 is supplied to the processing liquid nozzle 5 of the processing unit 2 (supplying step). The processing liquid supplied to the processing liquid nozzle 5 is discharged toward the upper surface of the substrate W held on the spin chuck 4. Before the supply of the processing liquid to the upper surface of the substrate W is started, the rotation of the substrate W about the rotation axis A1 is started by the rotary chuck 4. The processing liquid that has contacted the upper surface of the substrate W is spread over the entire upper surface of the substrate W due to the centrifugal force. Thereby, the upper surface of the substrate W is processed with the processing liquid. In this way, the liquid supply from the first storage tank 20A to the processing unit 2 is performed. Due to the liquid supply, the amount of the processing liquid in the first storage tank 20A is reduced, and the height of the liquid level of the processing liquid becomes lower than the first reference height H1.

Then, from time t2 to time t3, the processing liquid that has been supplied to the processing unit 2 is returned to the circulation tank 31 via the return flow path 23 (return step). The processing liquid returned to the circulation tank 31 is sucked by the downstream pump 51 and is supplied to the downstream flow path 50. The processing liquid supplied to the downstream flow path 50 is recovered to the second storage tank 20B via the recovery flow path 70.

In this way, liquid recovery from the processing unit 2 to the second storage tank 20B is performed. Due to the liquid recovery, the amount of the processing liquid in the second storage tank 20B increases, and the height of the liquid level of the processing liquid becomes higher than the second reference height H2.

Between time t2 and time t3, liquid is supplied from the first storage tank 20A and liquid is recovered from the second storage tank 20B, and the third storage tank 20C is on standby. During the standby of the third storage tank 20C, the processing liquid can be supplied from the new liquid tank 25 to the third storage tank 20C. Thereby, the amount of the processing liquid in the processing liquid supply device 3P can be maintained at a predetermined amount or more. It is also possible to adjust the concentration of the processing liquid in the third storage tank 20C by using the supply of the new processing liquid through the new liquid tank 25.

At time t3 in FIG. 9, the second supply valve 64B is opened. Therefore, from time t3 to time t4, as shown in FIG. 10C, the processing liquid in the third storage tank 20C is replenished to the first storage tank 20A via the replenishing flow path 60 (refilling step). In this manner, the liquid is replenished from the third storage tank 20C to the first storage tank 20A. On the other hand, the liquid supply by the first storage tank 20A and the liquid recovery by the second storage tank 20B continue. Therefore, the amount of the processing liquid in the first storage tank 20A and the amount of the processing liquid in the second storage tank 20B increase, and the amount of the processing liquid in the third storage tank 20C decreases. Thereby, the height of the liquid level of the processing liquid in the third storage tank 20C becomes lower than the first reference height H1. On the other hand, the height of the liquid surface of the processing liquid in the first storage tank 20A is the first reference height H1.

At time t4 in FIG. 9, the second recovery valve 71B is opened, and the first recovery valve 71A and the second supply valve 64B are closed.

Therefore, from time t4 to time t5, referring to FIG. 10D, the processing liquid in the first storage tank 20A is supplied to the supply flow path 22 through the upstream flow path 40. The processing liquid supplied to the supply channel 22 is supplied to the processing liquid nozzle 5 of the processing unit 2 (supplying step). Liquid supply from the first storage tank 20A to the processing unit 2 is performed. Due to the liquid supply, the amount of the processing liquid in the first storage tank 20A is reduced, and the height of the liquid level of the processing liquid becomes lower than the first reference height H1.

Then, from time t4 to time t5, the processing liquid that has been supplied to the processing unit 2 is returned to the circulation tank 31 via the return flow path 23 (return step). The processing liquid returned to the circulation tank 31 is sucked by the downstream pump 51 and supplied to the downstream flow path 50. The processing liquid supplied to the downstream flow path 50 is recovered to the third storage tank 20C through the recovery flow path 70. In this way, liquid recovery from the processing unit 2 to the third storage tank 20C is performed. Due to the liquid recovery, the amount of the processing liquid in the third storage tank 20C increases.

Between time t4 and time t5, liquid is supplied by the first storage tank 20A and liquid is recovered by the third storage tank 20C, and the second storage tank 20B is on standby. While the second storage tank 20B is in standby, the processing liquid can be supplied from the new liquid tank 25 to the second storage tank 20B. Thereby, the amount of the processing liquid in the processing liquid supply device 3Q can be maintained at a predetermined amount or more. It is also possible to adjust the concentration of the processing liquid in the second storage tank 20B by supplying a new processing liquid through the new liquid tank 25.

At time t5 in FIG. 9, the first supply valve 64A is opened. Therefore, from time t5 to time t6, as shown in FIG. 10E, the processing liquid in the second storage tank 20B is replenished to the first storage tank 20A via the replenishment flow path 60 (replenishment step). In this way, the liquid is replenished from the second storage tank 20B to the first storage tank 20A. On the other hand, the liquid supply by the first storage tank 20A and the liquid recovery by the third storage tank 20C continue. Therefore, the amount of the processing liquid in the first storage tank 20A and the amount of the processing liquid in the third storage tank 20C increase, and the amount of the processing liquid in the second storage tank 20B decreases. Thereby, the height of the liquid level of the processing liquid in the second storage tank 20B becomes lower than the first reference height H1 (for example, the second reference height H2). On the other hand, the height of the liquid level of the processing liquid in the first storage tank 20A becomes the first reference height H1.

Then, at time t6, the effects of the second storage tank 20B and the third storage tank 20C are switched in the same manner as at time t2. Then, from time t6 to time t8, the same substrate processing as that from time t2 to time t4 is performed. Subsequent to time t6, the substrate processing with the substrate processing from time t2 to time t6 as a unit is repeated.

According to the third embodiment, the same effect as that of the first embodiment is achieved.

The present invention is not limited to the embodiments described above, and may be implemented in other forms.

For example, as shown by two-dot chain lines in FIG. 1, FIG. 5, and FIG. 8, a plurality of processing units 2 may be provided in the substrate processing apparatuses 1, 1P, and 1Q. For example, a processing unit 2A having the same configuration as the processing unit 2 described in the above embodiment is provided. The processing unit 2A is connected to a supply flow path 22A upstream of the supply valve 24 and branching from the supply flow path 22. A supply valve 24 is provided in the supply flow path 22A. An upstream end portion of the return flow path 23A separated from the return flow path 23 is connected to the processing unit 2A. The downstream end of the return flow path 23A is connected to the top portion 31 a of the circulation groove 31 in common with the return flow path 23. In the supplying step, the supply channels 22 and 22A supply the processing liquid to each of the processing units 2 and 2A. In the returning step, each of the returning channels 23, 23A and each of the processing units 2 and 2A guides the processing liquid to the circulation tank 31.

In this way, when the processing liquid that has been supplied from the supply flow path 22 to each of the plurality of processing units 2 is commonly supplied to the circulation tank 31 via the return flow path 23, there is no need to provide a circulation tank for each processing unit 2. 31.

Moreover, unlike the above-mentioned embodiment, a heater for heating the processing liquid in the storage tank 20 may be provided. The heater is used to heat the treatment liquid in the storage tank 20, thereby heating the treatment liquid in the circulation flow path 21 in the circulation step. That is, the heater which heats the processing liquid in the storage tank 20 may function as a temperature adjustment means.

In addition, unlike the above embodiment, the processing liquid supply devices 3, 3P, and 3Q may include a cooler that cools the processing liquid circulating along the circulation flow path 21. It can also be configured to: use the cooler to cool the processing liquid circulating along the circulation flow path 21, or use the circulation heaters 42, 42A, 42B, and 42C to heat the processing liquid circulating along the circulation flow path 21, and thereby The temperature of the processing liquid circulating in the flow path 21 is adjusted. In this case, the temperature adjustment unit is constituted by the circulation heaters 42, 42A, 42B, and 42C and a cooler. Further, as the temperature adjustment unit, a unit having functions of both a heater and a cooler may be provided.

Moreover, unlike the above-mentioned embodiment, the processing liquid supply devices 3, 3P, and 3Q may have a configuration that does not include the downstream pump 51.

The embodiments of the present invention have been described in detail. These are merely specific examples for clarifying the technical content of the present invention. The present invention should not be limited to these specific examples for explanation. The scope of the present invention is only provided by the accompanying Limited by the scope of patent applications.

This application corresponds to Japanese Patent Application No. 2017-016103 filed with the Japan Patent Office on January 31, 2017, the entire disclosure of which is incorporated herein by reference.

Claims (15)

A processing liquid supply device supplies a processing liquid to a processing unit for processing a substrate, and includes: a storage tank to store the processing liquid; a circulation flow path to circulate the processing liquid in the storage tank; and a supply flow path to the circulation flow path. The processing unit supplies a processing liquid; a return flow path to return the processing liquid that has been supplied to the processing unit to the foregoing circulation flow path; and a temperature adjustment unit that adjusts the temperature of the processing liquid circulating in the circulation flow path; the foregoing cycle The flow path includes a circulation tank connected to the return flow path, an upstream flow path connected to the circulation tank from an upstream side of the circulation flow path, and a downstream flow path connected to the circulation tank from a downstream side of the circulation flow path; The distance that the processing liquid flows through the aforementioned return flow path is shorter than the distance that the processing liquid flows through the aforementioned downstream flow path. The processing liquid supply device according to claim 1, wherein the circulation tank includes a top connected to the upstream flow path and the return flow path, and a bottom connected to the downstream flow path. The processing liquid supply device according to claim 2, further comprising: a downstream valve for opening and closing the downstream flow path; and a valve opening and closing unit for maintaining the state of closing the downstream valve until the processing liquid in the circulation tank is maintained. Until the amount reaches the reference amount, the downstream valve is opened when the amount of the processing liquid in the circulation tank reaches the reference amount. The processing liquid supply device according to claim 1 or 2, wherein a plurality of the aforementioned processing units are provided; and the processing liquid which has been supplied from the aforementioned supply flow path to each of the plurality of the processing units is passed through the aforementioned return flow path. It is supplied to the circulation tank in common. The processing liquid supply device according to claim 1 or 2, wherein the circulation tank is disposed lower than a processing chamber provided in the processing unit and configured to receive the substrate. The processing liquid supply device according to claim 5, wherein the circulation tank and the return flow path are housed in a flow path box disposed adjacent to the processing chamber. The processing liquid supply device according to claim 1 or 2, wherein the plurality of storage tanks are provided; the processing liquid supply device further includes an upstream switching unit that supplies a processing liquid to the circulation tank or the processing unit. The aforementioned storage tank is switched among the aforementioned plurality of storage tanks; and the downstream switching unit is configured such that the aforementioned storage tank of the supply target to which the processing liquid is supplied from the aforementioned circulation tank is the same tank as the aforementioned storage tank of the aforementioned supply source, The storage tank of the supply target is switched among the plurality of storage tanks. A substrate processing apparatus includes the processing liquid supply apparatus according to claim 1 or 2 and the aforementioned processing unit. A processing liquid supply method includes supplying a processing liquid to a processing unit for processing a substrate by using the processing liquid, and comprising: a circulation step of circulating a processing liquid in a storage tank storing the processing liquid in a circulation flow path; and a temperature adjustment step for the aforementioned circulation. The temperature of the processing liquid in the flow path is adjusted; the supply step is to supply the processing liquid from the circulation flow path to the processing unit after the temperature adjustment step is started; and the return step is to supply the processing liquid in the supply step to the processing The processing liquid of the unit is returned to the aforementioned circulation flow path; in the aforementioned circulation step, the treatment liquid is sequentially connected to the upstream flow path connected to the circulation tank from the upstream side of the circulation flow path, the circulation tank, and from the circulation flow path. The downstream side is connected to the downstream flow path connected to the circulation tank. The circulation tank is used for returning the processing liquid that has been supplied to the processing unit through the return flow path. In the circulation step, the distance that the treatment liquid flows through the downstream flow path is short. The processing liquid supply method according to claim 9, wherein the circulation tank includes a top connected to the upstream flow path and the return flow path, and a bottom connected to the downstream flow path. The method for supplying a processing liquid according to claim 10, further comprising a valve opening and closing step. The valve opening and closing step maintains a state in which the downstream valve that opens and closes the downstream flow path is closed until the amount of the processing liquid in the circulation tank reaches a reference amount. When the amount of the processing liquid in the circulation tank reaches the aforementioned reference amount, the aforementioned downstream valve is opened. The processing liquid supply method according to claim 9 or 10, wherein the supplying step includes a step of supplying the processing liquid from each of the plurality of processing units from the circulation flow path, and the returning step includes supplying the processed liquid to the plurality of processing units. The processing liquid of each processing unit in a processing unit is supplied to the said circulation tank in common through the said return flow path. The processing liquid supply method according to claim 9 or 10, wherein the circulation tank is disposed below a processing chamber provided in the processing unit and containing the substrate. The method for supplying a processing liquid according to claim 13, wherein the circulation tank and the return flow path are housed in a flow path box disposed adjacent to the processing chamber. The method for supplying a processing liquid according to claim 9 or 10, further comprising a switching step of switching the storage tank of the supply source and the storage tank of the supply target in a plurality of the storage tanks so that The storage tank of the supply source is the same tank as the storage tank of the supply target, wherein the storage tank of the supply source supplies processing liquid to the circulation tank or the processing unit, and the storage tank of the supply target is from The circulation tank is supplied with a processing liquid.