TWI664562B - Pressure sensing module having element protection structure inside - Google Patents
Pressure sensing module having element protection structure inside Download PDFInfo
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- TWI664562B TWI664562B TW107110353A TW107110353A TWI664562B TW I664562 B TWI664562 B TW I664562B TW 107110353 A TW107110353 A TW 107110353A TW 107110353 A TW107110353 A TW 107110353A TW I664562 B TWI664562 B TW I664562B
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Abstract
本發明關於一種壓力感應模組,其包含:第一基板以及第二基板;結構牆,其形成在該第一基板與該第二基板之間,且兩端分別與該第一基板與該第二基板接觸,該第一基板、該第二基板以及該結構牆之間包含第一腔室,該第一腔室包含第一介質以及第二腔室;以及該第二腔室包含氣態介質、壓力感測器以及保護結構,該壓力感測器偵測該第二腔室內的氣壓變化。 The invention relates to a pressure-sensing module, which includes: a first substrate and a second substrate; and a structural wall formed between the first substrate and the second substrate, and two ends of the first and second substrates are respectively connected to the first substrate and the first substrate. The two substrates are in contact. The first substrate, the second substrate, and the structural wall include a first chamber. The first chamber includes a first medium and a second chamber. The second chamber includes a gaseous medium. A pressure sensor and a protection structure. The pressure sensor detects a change in air pressure in the second chamber.
Description
本發明有關於一壓力感應模組,尤其指一種基於氣壓偵測技術、且模組內部設有保護內構件的結構體的平面式壓力感應模組。 The invention relates to a pressure-sensing module, in particular to a flat-type pressure-sensing module based on a barometric pressure detection technology and a structure provided with a protective internal component inside the module.
習知的觸控面板(touch panel),是一種用來偵測觸碰與其發生位置的傳感器(sensor),觸碰可能來自:手指尖、觸控筆頭、導電體、非導電體等,其外型通常製作為平面板狀,依照其偵測觸碰的工作原理,大致上區分電容式、電阻式、紅外線式以及聲波式等,每一類別又再各自細分,例如:電容式觸控面板區分為互容式、自容式等等,觸控面板常見用途就是作為系統的輸入裝置(input device),將所偵測到的觸碰視為輸入訊號、或者控制指令。 The conventional touch panel is a sensor used to detect the touch and the position where it occurs. The touch may come from: fingertip, stylus, conductive body, non-conductive body, etc. Types are usually made into flat plates. According to the working principle of detecting touch, they are roughly divided into capacitive, resistive, infrared, and sonic types, and each category is further subdivided, for example: capacitive touch panels. For mutual-capacitance, self-capacitance, etc., a common use of a touch panel is as an input device of a system, and the detected touch is regarded as an input signal or a control command.
上述幾類觸控面板當中,屬電阻式和電容式的觸碰偵測技術最廣泛受到應用,電阻式觸控面板係透過偵測兩片大面積導電層彼此之間的導通(on)與開路(off)、以及在x方向與y方向上的線性電阻變化,而感知觸控本身並計算其發生位置座標,電容式觸控面板主要透過偵測兩片導電玻璃與觸頭間的電容值變化,來感知觸控本身並計算其發生位置座標,習用觸碰偵測技術從單點觸碰偵測,不斷演進到多點觸碰偵測。 Among the above types of touch panels, resistive and capacitive touch detection technologies are the most widely used. Resistive touch panels detect the on and open circuits of two large-area conductive layers. (off), and the linear resistance change in the x and y directions, and to sense the touch itself and calculate the coordinates of its occurrence position, the capacitive touch panel mainly detects the change in the capacitance between the two conductive glass and the contact In order to sense the touch itself and calculate the coordinates of its occurrence location, the touch detection technology has been used to evolve from single-touch detection to multi-touch detection.
就實際應用層面,觸控面板通常與顯示螢幕共同整合成為一 個觸控螢幕,使用者可對著觸控螢幕所顯示的內容,單純以手指直接又直覺地與系統進行各種互動操作,過程十分人性化、簡易、直覺,因此觸控螢幕早已大量應用在各種裝置上,在例如:智慧手機、平板電腦、端點銷售系統(POS)、互動式媒體資訊站(Kiosk)、自動提款機(ATM)、收銀機(cashier)、汽車隨行駕駛系統、工業人機介面等裝置上,都能看到觸控螢幕的應用。 As far as practical applications are concerned, the touch panel is usually integrated with the display screen into one. Touch screen, users can directly and intuitively perform various interactive operations with the system on the content displayed on the touch screen. The process is very user-friendly, simple and intuitive, so touch screens have been widely used in various On devices, for example: smartphones, tablets, point-of-sale systems (POS), interactive media kiosks, ATMs, cashiers, car driving systems, industrial Touchscreen applications can be seen on devices such as human-machine interfaces.
但在習用技術中,無論是觸控面板本身、或者是與顯示螢幕整合後的觸控螢幕,其對觸碰的偵測能力,都是針對「觸碰本身及其發生位置」,且屬於在二維(2D)平面上實施的觸控技術,這些習用的觸碰偵測技術,對於觸碰的下壓「力度、或者力道」的「大小」與「時間長短」等等變化,則完全缺少偵測的能力。 However, in conventional technology, whether it is the touch panel itself or the touch screen integrated with the display screen, its ability to detect touches is aimed at "touch itself and where it occurs" and belongs to the The touch technology implemented on a two-dimensional (2D) plane. These conventional touch detection technologies are completely lacking in changes such as the "size" and "time" of the pressing force, or force, of a touch. Detection capabilities.
職是之故,申請人鑑於習用技術的缺點,經過悉心試驗與研究,並一本鍥而不捨之精神,終構思出本案「具有元件保護結構的壓力感應模組」,能夠克服上述缺點,以下為本發明之簡要說明。 Due to the shortcomings of the conventional technology, the applicant, after careful testing and research, and a spirit of perseverance, finally conceived the "pressure sensing module with component protection structure" in this case, which can overcome the above shortcomings. Brief description of the invention.
鑑於習用的觸碰偵測技術、或者觸控面板,都是透過配置在基板上的觸控線路,來偵測觸碰與其位置,屬於侷限在二維平面的觸控技術,只能感知觸碰在平面X與Y座標上位置,但無法感知觸碰所產生的下壓力度或力道。 In view of the conventional touch detection technology or touch panel, the touch and its position are detected through the touch circuit arranged on the substrate. The touch technology is limited to a two-dimensional plane and can only sense the touch. Positions on the X and Y coordinates of the plane, but the downforce or force generated by the touch cannot be sensed.
故本發明提出一種壓力感應模組,其基於氣壓力感應技術,專用於感知觸碰的下壓力度或力道,其能夠單獨使用也能輕易的與其它面板模組,例如:觸控面板、顯示面板、或者觸控顯示面板等共同結合、組 裝而進行使用,本發明壓力感應模組,讓觸碰產生的下壓力度,也能夠作為輸入參數之一來傳輸給系統,讓系統變得更有智慧。 Therefore, the present invention proposes a pressure sensing module, which is based on air pressure sensing technology and is dedicated to sensing the pressure or force of a touch. It can be used alone or easily with other panel modules, such as touch panels, displays Panel, or touch display panel, etc. The pressure sensing module of the present invention allows the downforce generated by touch to be transmitted to the system as one of the input parameters, making the system more intelligent.
尤其本發明的壓力感應模組,在所包含的氣室內,建構有具有保護第一介質或者壓力感測器的保護結構,當壓力感應模組接受到力度較大的觸碰時,或者當觸碰位置較接近模組內部壓力感測器時,且在第一介質是較偏軟質的固態介質或者液態介質時,可以防止第一介質產生過大的形變、阻擋過多的第一介質擠入氣室、防止第一介質擠壓到壓力感測器、防止第一介質流動到壓力感測器上、防止第一介質因為過壓而在邊緣處造成的脫膠現象等等。 In particular, the pressure sensing module of the present invention has a protective structure for protecting the first medium or pressure sensor in the contained air chamber. When the pressure sensing module receives a strong touch, or when When the impact position is closer to the internal pressure sensor of the module, and when the first medium is a relatively soft solid or liquid medium, it can prevent the first medium from deforming too much and blocking too much of the first medium from extruding into the air chamber. , Preventing the first medium from being squeezed onto the pressure sensor, preventing the first medium from flowing onto the pressure sensor, preventing the first medium from debonding at the edges due to overpressure, and the like.
本發明提出一種壓力感應模組,其包含:第一基板以及第二基板;結構牆,其形成在該第一基板與該第二基板之間,且兩端分別與該第一基板與該第二基板接觸,該第一基板、該第二基板以及該結構牆之間包含第一腔室,該第一腔室包含第一介質以及第二腔室;以及該第二腔室包含氣態介質、壓力感測器以及保護結構,該壓力感測器偵測該第二腔室內的氣壓變化。 The present invention provides a pressure sensing module, which includes: a first substrate and a second substrate; and a structural wall formed between the first substrate and the second substrate, with two ends respectively connected to the first substrate and the first substrate. The two substrates are in contact. The first substrate, the second substrate, and the structural wall include a first chamber. The first chamber includes a first medium and a second chamber. The second chamber includes a gaseous medium. A pressure sensor and a protection structure. The pressure sensor detects a change in air pressure in the second chamber.
較佳的,該第一腔室內還包含以下其中之一:輔助結構,其包含於該第一腔室內;以及複數該第二腔室,其包含於該第一腔室內,並包含該氣態介質。 Preferably, the first chamber further includes one of the following: an auxiliary structure included in the first chamber; and a plurality of the second chamber included in the first chamber and containing the gaseous medium. .
較佳的,該保護結構之型式包含柱型結構、圍型結構、直型結構、U型結構、L型結構、直角型結構、梯型結構、三角型結構、銳角型結構、鈍角型結構、十字型結構、斜型結構、弧型結構、水平型結構、垂直型結構、圓型結構、口型結構、圓錐型結構、W形結構、Z形結構及其組 合其中之一。 Preferably, the type of the protective structure includes a columnar structure, a surrounding structure, a straight structure, a U-shaped structure, an L-shaped structure, a right-angled structure, a ladder structure, a triangular structure, an acute-angled structure, an obtuse-angled structure, Cross structure, oblique structure, arc structure, horizontal structure, vertical structure, round structure, mouth structure, conical structure, W-shaped structure, Z-shaped structure and its group Combine one of them.
較佳的,該保護結構係設置在該第一基板與該第二基板之間,並設置在該第一基板與該第二基板其中之一上。 Preferably, the protection structure is disposed between the first substrate and the second substrate, and is disposed on one of the first substrate and the second substrate.
較佳的,該保護結構係設置在該壓力感測器與該第一介質之間,該保護結構係設置在該結構牆與該第一介質之間,該保護結構係設置在該第一介質外側,該保護結構係與該壓力感測器設置在同一基板上,或者該保護結構係與該壓力感測器設置在不同基板上。 Preferably, the protective structure is disposed between the pressure sensor and the first medium, the protective structure is disposed between the structural wall and the first medium, and the protective structure is disposed between the first medium Outside, the protection structure is disposed on the same substrate as the pressure sensor, or the protection structure is disposed on a different substrate from the pressure sensor.
較佳的,該保護結構是以均勻分布、非均勻分布、連續分布、不連續分布、對稱分布或者非對稱分布的方式配置在該氣密腔的該氣室中。 Preferably, the protection structure is arranged in the air chamber of the airtight cavity in a manner of uniform distribution, non-uniform distribution, continuous distribution, discontinuous distribution, symmetrical distribution or asymmetric distribution.
較佳的,該第一基板以及該第二基板係為玻璃基板、導電玻璃基板、導電基板以及壓克力基板其中之一,該第一介質係為液態介質、固態介質、低分子量矽膠、光學彈性膜以及軟質彈性膜其中之一。 Preferably, the first substrate and the second substrate are one of a glass substrate, a conductive glass substrate, a conductive substrate, and an acrylic substrate. The first medium is a liquid medium, a solid medium, a low molecular weight silicone, an optical One of an elastic film and a soft elastic film.
較佳的,該結構牆之材質係包含高分子量矽膠、聚氨酯聚合物、雙面膠、環氧樹脂、紫外光固化膠以及封膠其中之一,該保護結構之材質係包含高分子量矽膠、聚氨酯聚合物、雙面膠、環氧樹脂、紫外光固化膠以及封膠其中之一。 Preferably, the material of the structural wall comprises one of high-molecular-weight silicone, polyurethane polymer, double-sided adhesive, epoxy resin, ultraviolet curing adhesive, and sealant. The material of the protective structure includes high-molecular-weight silicone, polyurethane Polymers, double-sided tapes, epoxy resins, UV curing adhesives and sealants.
較佳的,該氣態介質包含氣體、汽體、大氣、氮氣、水汽、空氣及其組合其中之一,該液態介質包含水、凝膠體、酒精及其組合其中之一。 Preferably, the gaseous medium includes one of gas, vapor, atmosphere, nitrogen, water vapor, air, and a combination thereof, and the liquid medium includes one of water, gel, alcohol, and a combination thereof.
101‧‧‧壓力感應模組 101‧‧‧Pressure Sensing Module
120‧‧‧第一基板 120‧‧‧First substrate
121‧‧‧操作表面 121‧‧‧Operating surface
130‧‧‧第二基板 130‧‧‧second substrate
140‧‧‧結構牆 140‧‧‧ Structural Wall
140a‧‧‧紫外光固化膠 140a‧‧‧UV curing adhesive
140b‧‧‧聚氨酯聚合物 140b‧‧‧ polyurethane polymer
140c‧‧‧雙面膠 140c‧‧‧ double-sided tape
150‧‧‧氣密腔 150‧‧‧airtight cavity
151、152‧‧‧氣室 151, 152‧‧‧ air chamber
160‧‧‧氣態介質 160‧‧‧Gaseous medium
170‧‧‧壓力感測器 170‧‧‧Pressure sensor
180‧‧‧第一介質 180‧‧‧ the first medium
181‧‧‧介質邊緣 181‧‧‧Media Edge
190‧‧‧輔助結構 190‧‧‧Auxiliary Structure
600‧‧‧保護結構 600‧‧‧Protection structure
601‧‧‧保護結構 601‧‧‧Protection structure
602‧‧‧保護結構 602‧‧‧Protection structure
PP’‧‧‧剖面線 PP’‧‧‧ hatching
QQ’‧‧‧剖面線 QQ’‧‧‧ section line
b‧‧‧保護結構高度 b‧‧‧ height of protective structure
H‧‧‧間隙高度 H‧‧‧Gap height
第1圖係揭示本發明具有氣室結構之壓力感應模組未受壓時之側剖面 示意圖。 FIG. 1 is a side cross-section of a pressure sensing module with a gas chamber structure of the present invention when it is not under pressure schematic diagram.
第2圖係揭示本發明壓力感應模組在第1圖所示PP’剖面線上之俯視示意圖。 Fig. 2 is a schematic plan view illustrating the pressure sensing module of the present invention on the PP 'section line shown in Fig. 1.
第3圖係揭示本發明具有多重氣室結構之壓力感應模組未受壓時在X平面上之結構示意圖。 FIG. 3 is a schematic diagram illustrating the structure of the pressure sensing module with multiple air chamber structures of the present invention on the X-plane when it is not compressed.
第4圖係揭示本發明具有氣室結構之壓力感應模組受壓時之側剖面示意圖。 FIG. 4 is a schematic side cross-sectional view of a pressure sensing module with an air chamber structure according to the present invention under pressure.
第5A係揭示本發明具有元件保護結構之壓力感應模組之第一實施例之側剖面示意圖。 Section 5A is a schematic side sectional view of a first embodiment of a pressure sensing module with a component protection structure according to the present invention.
第5B係揭示本發明元件保護結構與其鄰近局部結構之側剖面示意圖。 Section 5B is a schematic side cross-sectional view of the element protection structure and its adjacent partial structures of the present invention.
第5C圖係揭示本發明具有元件保護結構之壓力感應模組在第5A圖所示QQ’剖面線上之俯視示意圖。 FIG. 5C is a schematic plan view illustrating the pressure sensing module with a component protection structure of the present invention on the QQ 'section line shown in FIG. 5A.
第6圖係揭示本發明具有元件保護結構之壓力感應模組之第二實施例之側剖面示意圖。 FIG. 6 is a schematic side sectional view of a second embodiment of a pressure sensing module with a component protection structure according to the present invention.
第7圖係揭示本發明具有元件保護結構之壓力感應模組在X平面上之結構示意圖。 FIG. 7 is a schematic diagram showing the structure of a pressure sensing module with a component protection structure on the X-plane of the present invention.
第8圖係揭示本發明具有元件保護結構之壓力感應模組在X平面上之結構示意圖。 FIG. 8 is a schematic diagram illustrating the structure of a pressure sensing module with a component protection structure on the X-plane of the present invention.
第9圖係揭示本發明具有元件保護結構與多重氣室之壓力感應模組在X平面上之結構示意圖。 FIG. 9 is a schematic diagram illustrating the structure of a pressure sensing module with a component protection structure and multiple air chambers on the X-plane of the present invention.
本發明將可由以下的實施例說明而得到充分瞭解,使得熟習 本技藝之人士可以據以完成之,然本發明之實施並非可由下列實施案例而被限制其實施型態;本發明之圖式並不包含對大小、尺寸與比例尺的限定,本發明實際實施時其大小、尺寸與比例尺並非可經由本發明之圖式而被限制。 The present invention will be fully understood from the description of the following examples, so that familiarity Those skilled in the art can complete it, but the implementation of the present invention can not be limited by the following implementation cases; the drawings of the present invention do not include restrictions on size, size and scale. When the present invention is actually implemented, The size, size, and scale are not limited by the drawings of the present invention.
本文中用語“較佳”是非排他性的,應理解成“較佳為但不限於”的開放式用語,不具有限制性含義,不排除其它特徵或步驟;任何說明書或請求項中所描述或者記載的任何步驟可按任何順序執行,而不限於請求項中所述的順序;本發明的範圍應僅由所附請求項及其均等方案確定,不應由實施方式示例的實施例確定;本文中用語“包含”及其變化出現在說明書和請求項中時,是一個開放式的用語,不具有限制性含義,並不排除其它特徵或步驟。 The term "preferred" in this article is non-exclusive and should be understood as an open-ended term "preferably but not limited to", which has no restrictive meaning and does not exclude other features or steps; described or recorded in any specification or claim Any of the steps can be performed in any order, not limited to the order described in the claims; the scope of the present invention should be determined only by the attached claims and their equivalent schemes, and should not be determined by the examples of implementation examples; The term "comprising" and its variations appearing in the description and the claims are open-ended terms, without restrictive meanings, and do not exclude other features or steps.
第1圖係揭示本發明具有氣室結構之壓力感應模組未受壓時之側剖面示意圖;第2圖係揭示本發明壓力感應模組在第1圖所示PP’剖面線上之俯視示意圖;第1圖、第2圖所揭示本發明壓力感應模組101,係包含第一基板120、第二基板130、結構牆140、氣密腔(第一腔室)150、氣室(第二腔室)151、氣態介質160、壓力感測器170、第一介質180、輔助結構190等結構,第一介質180中包含的輔助結構190是一個選擇性結構,第一介質180中可設置也可不設置輔助結構190,其材質係選自固態介質、或者高分子量矽膠等;假設某個與第一基板120或者第二基板130平行的平面為X平面,某個與第一基板120或者第二基板130垂直的平面為Y平面。 FIG. 1 is a schematic side sectional view of a pressure sensing module having an air chamber structure according to the present invention when it is not compressed; FIG. 2 is a schematic top view showing the pressure sensing module of the present invention on the PP ′ section line shown in FIG. 1; The pressure sensing module 101 of the present invention disclosed in FIGS. 1 and 2 includes a first substrate 120, a second substrate 130, a structural wall 140, an airtight cavity (first cavity) 150, and an air cavity (second cavity). Chamber) 151, gaseous medium 160, pressure sensor 170, first medium 180, auxiliary structure 190 and other structures. The auxiliary structure 190 included in the first medium 180 is an optional structure. The first medium 180 may be provided or not. An auxiliary structure 190 is provided, and the material is selected from a solid medium or a high molecular weight silicone; etc. It is assumed that a plane parallel to the first substrate 120 or the second substrate 130 is an X-plane, and a plane parallel to the first substrate 120 or the second substrate The 130 vertical plane is the Y plane.
第一基板120以及第二基板130較佳係為矩形之平面基板,同時具備適當之剛性與輕微可撓性或彈性,可選自玻璃基板、導電玻璃基板、 導電基板或者壓克力基板,第一基板120以及第二基板130之間保有適當間隙,間隙具有間隙高度H,在第一基板120與第二基板130的間隙之間,建構有上下兩端分別接觸到第一基板120與第二基板130、牆體高度與間隙高度H相同、具有密封或氣密效果的結構牆140,在本實施例結構牆140較佳是設置在第一基板120與第二基板130之四個邊緣處,並從四個邊緣包圍住第一基板120與第二基板130間間隙,但結構牆140可以設置在第一基板120與第二基板130間之任意處,且並不須要完全包圍所有的間隙,可以局部性的只包圍一部份的間隙。 The first substrate 120 and the second substrate 130 are preferably rectangular flat substrates, and have appropriate rigidity and slight flexibility or elasticity, and may be selected from glass substrates, conductive glass substrates, The conductive substrate or the acrylic substrate, an appropriate gap is maintained between the first substrate 120 and the second substrate 130, and the gap has a gap height H. Between the gap between the first substrate 120 and the second substrate 130, upper and lower ends are respectively constructed. The structural wall 140 having a sealing or air-tight effect is in contact with the first substrate 120 and the second substrate 130, and has the same wall height and gap height H. In this embodiment, the structural wall 140 is preferably disposed between the first substrate 120 and the first substrate 120. The four edges of the two substrates 130 surround the gap between the first substrate 120 and the second substrate 130 from the four edges, but the structural wall 140 may be disposed anywhere between the first substrate 120 and the second substrate 130, and It is not necessary to completely surround all the gaps, and it is possible to partially surround only a part of the gaps.
因此第一基板120、第二基板130以及結構牆140等結構,可在第一基板120、第二基板130以及結構牆140之間,形成一個有氣密效果的夾層腔體結構即氣密腔150,氣密腔150內部包含氣態介質160、第一介質180以及輔助結構190,氣密腔150能將內部的氣態介質160、第一介質180以及輔助結構190密封住,使其不向外部洩漏,氣密腔150較佳是一個立體三維空間且具有矩形形狀的氣密腔體。 Therefore, structures such as the first substrate 120, the second substrate 130, and the structural wall 140 can form an airtight sandwich structure, that is, an airtight cavity, between the first substrate 120, the second substrate 130, and the structural wall 140. 150, the airtight cavity 150 contains a gaseous medium 160, a first medium 180, and an auxiliary structure 190, and the airtight cavity 150 can seal the internal gaseous medium 160, the first medium 180, and the auxiliary structure 190 so as not to leak to the outside The airtight cavity 150 is preferably a three-dimensional three-dimensional space and has a rectangular shape.
第一基板120的外側表面係作為操作表面121,接受導體、非導體、觸頭或者手指的觸碰輸入,氣態介質160的成分較佳包含氣體、汽體、大氣、氮氣、氧氣、水汽、空氣及其混合物其中之一,結構牆140則是由聚氨酯聚合物、雙面膠、環氧樹脂、紫外光固化膠、封膠或者其組合等材質所製作,第一介質180之材質係選自固態介質、液態介質、低分子量矽膠、光學彈性膜或者軟質彈性膜。 The outer surface of the first substrate 120 is used as the operating surface 121 and accepts touch input from a conductor, a non-conductor, a contact, or a finger. The composition of the gaseous medium 160 preferably includes gas, vapor, atmosphere, nitrogen, oxygen, water vapor, and air. And one of its mixtures, the structural wall 140 is made of polyurethane polymer, double-sided tape, epoxy resin, ultraviolet curing adhesive, sealant or a combination thereof, and the material of the first medium 180 is selected from solid Medium, liquid medium, low molecular weight silicone, optical elastic film or soft elastic film.
第一介質180主要是用來將觸碰所產生的下壓力度傳導至氣室151,其材質之軟或硬,會影響使用者對模組101的觸感,在本實施例, 第一介質180較佳是質地較偏軟、低分子量的矽膠,第一介質180以較大面積的形式分布在第一基板120與第二基板130間隙以及氣密腔150內,並接觸第一基板120與第二基板130,當第一介質180是偏軟式的材質時,雖然可帶給使用者柔軟的觸感,但也可能會吸收觸碰力度,降低觸碰力度傳遞至氣室151的效率。 The first medium 180 is mainly used to transmit the degree of downward pressure generated by the touch to the air chamber 151. The soft or hard material of the first medium 180 will affect the user's touch on the module 101. In this embodiment, The first medium 180 is preferably a relatively soft, low-molecular-weight silicon gel. The first medium 180 is distributed in a large area in the gap between the first substrate 120 and the second substrate 130 and in the airtight cavity 150, and contacts the first The substrate 120 and the second substrate 130, when the first medium 180 is a soft-type material, although it can bring a soft touch to the user, it may also absorb the touch force and reduce the transmission of the touch force to the air chamber 151. effectiveness.
因此透過在第一介質180中可以選擇性的配置輔助結構190,來調整第一介質180之整體軟硬度,並適當導引觸碰力度傳導至氣室151,而且輔助結構190的配置,還可以放大第一介質180在邊緣處的局部體積變化率、調整第一介質180對力度的傳遞效率、防止第一介質180因為過壓而在邊緣處造成的脫膠現象、盡量阻擋第一介質180擠入氣室151等,在本實施例輔助結構190較佳是質地較偏硬、高分子量的矽膠,輔助結構190可設置在第一基板120、或者第二基板130上,在本實施例,輔助結構190係設置在第二基板130上。 Therefore, the auxiliary structure 190 can be selectively arranged in the first medium 180 to adjust the overall softness and hardness of the first medium 180, and appropriately guide the contact force to the air chamber 151, and the configuration of the auxiliary structure 190 also It can enlarge the local volume change rate of the first medium 180 at the edges, adjust the transmission efficiency of the first medium 180 to the force, prevent the degumming phenomenon caused by the first medium 180 at the edges, and try to prevent the first medium 180 from squeezing. Into the gas chamber 151, etc., in this embodiment, the auxiliary structure 190 is preferably a harder, high-molecular-weight silicon rubber. The auxiliary structure 190 may be disposed on the first substrate 120 or the second substrate 130. In this embodiment, the auxiliary structure 190 The structure 190 is disposed on the second substrate 130.
氣密腔150內部還包含較少量的氣態介質160,在氣密腔150內部另外形成一個也是氣密式的氣室即氣室151,氣室151內包含氣態介質160,氣室151所涵蓋的空間範圍就是氣態介質160的分布範圍,當氣態介質160受到溫度或者壓力的影響而使其體積有所變化時,氣室151的體積大小也會隨之對應變化,氣室151的四個轉角上分別配置有四顆壓力感測器170,可偵測氣室151內之氣壓力以及氣壓力變化,壓力感測器170數量沒有任何限制,壓力感測器較佳是MEMS壓力微感測器、液態壓力感測器、或者氣態壓力感測器。 The airtight cavity 150 also contains a relatively small amount of gaseous medium 160. An airtight air chamber 151 is also formed inside the airtight cavity 150. The air chamber 151 contains the gaseous medium 160 and is covered by the air chamber 151. The spatial extent of the gaseous medium 160 is the distribution range of the gaseous medium 160. When the volume of the gaseous medium 160 is affected by temperature or pressure, the volume of the gas chamber 151 changes accordingly, and the four corners of the gas chamber 151 change accordingly. Four pressure sensors 170 are configured on the upper side, which can detect the air pressure in the air chamber 151 and the change in the air pressure. There is no limit on the number of pressure sensors 170. The pressure sensor is preferably a MEMS pressure micro sensor. , Liquid pressure sensors, or gaseous pressure sensors.
第3圖係揭示本發明具有多重氣室結構之壓力感應模組未受 壓時在X平面上之結構示意圖;如第3圖所揭示,氣密腔內150包含多個氣室151,第3圖所揭示本發明壓力感應模組101,係包含第二基板130、結構牆140、氣密腔(第一腔室)150、多個氣室(第二腔室)151、氣態介質160、壓力感測器170、第一介質180等結構,氣密腔150內包含的多個氣室151,是透過結構牆140與第一介質180而形成在氣密腔150內,在某些實施例,多個氣室151是透過輔助結構190、結構牆140或者第一介質180形成。 Figure 3 reveals that the pressure sensing module with multiple air chamber structure of the present invention is not affected. Schematic diagram of the structure on the X plane during pressing; as shown in FIG. 3, the airtight cavity 150 includes a plurality of air chambers 151, and the pressure sensing module 101 of the present invention disclosed in FIG. 3 includes a second substrate 130 and a structure. Structures such as wall 140, airtight cavity (first chamber) 150, multiple air chambers (second chamber) 151, gaseous medium 160, pressure sensor 170, first medium 180, etc. The multiple air chambers 151 are formed in the airtight cavity 150 through the structural wall 140 and the first medium 180. In some embodiments, the multiple air chambers 151 are through the auxiliary structure 190, the structural wall 140, or the first medium 180. form.
第4圖係揭示本發明具有氣室結構之壓力感應模組受壓時之側剖面示意圖;當本發明壓力感應模組101在操作時,例如:當使用者以手指用不同程度力度觸碰第一基板120外側表面即操作表面121時、或者當操作表面121之觸碰產生不同程度力度的減輕時,如第3圖所揭示,這些不同程度力度的觸碰,透過第一基板120以及第一介質180傳遞給氣室151與其內的氣態介質160,使得氣室151體積以及氣室151內氣態介質160之體積皆開始產生對應之縮放,並對應發生氣壓力的上升或者減少變化,透過氣室151內壓力感測器170,即可偵測到氣室151內的氣壓力,受到不同程度力度觸碰時所產生的變化,壓力感應模組101依據偵測到之氣壓力變化經換算後即可感知對應的觸碰之力度。 FIG. 4 is a schematic side sectional view of a pressure sensing module with an air chamber structure according to the present invention when it is under pressure; when the pressure sensing module 101 of the present invention is in operation, for example, when a user touches the first When the outer surface of a substrate 120 is the operation surface 121, or when the touch of the operation surface 121 reduces the degree of force, as shown in FIG. 3, these touches of different degrees of force pass through the first substrate 120 and the first The medium 180 is transmitted to the air chamber 151 and the gaseous medium 160 therein, so that the volume of the air chamber 151 and the volume of the gaseous medium 160 in the air chamber 151 both start to generate corresponding scaling, and correspondingly increase or decrease in air pressure occurs, and pass through the air chamber. The pressure sensor 170 in 151 can detect the air pressure in the air chamber 151, which is changed when touched with different degrees of force. The pressure sensing module 101 converts the detected air pressure according to the change. Can sense the corresponding touch strength.
本發明壓力感應模組101,其第一基板120以及第二基板130間的間隙高度H一般不會太大,其高度較佳小於100um,因此當壓力感應模組101在操作表面121上接受到力度較大的觸碰時,或者當觸碰位置較接近壓力感測器170時,當第一介質180是較偏軟質的固態介質或者液態介質時,第一介質180很容易就會因為擠壓的緣故,而產生較大形變,並朝向結構牆140、氣室151或壓力感測器170方向移動,在某些極端情況下,可能會 發生大量的第一介質180往壓力感測器170的方向移動,導致一部分的第一介質180甚至擠壓到壓力感測器170,這些情況都可能導致壓力感測器170的故障。 In the pressure sensing module 101 of the present invention, the height H of the gap between the first substrate 120 and the second substrate 130 is generally not too large, and its height is preferably less than 100um. Therefore, when the pressure sensing module 101 is received on the operation surface 121 When the touch is stronger, or when the touch position is closer to the pressure sensor 170, when the first medium 180 is a relatively soft solid or liquid medium, the first medium 180 may easily be squeezed. Due to the large deformation, and move towards the structural wall 140, the air chamber 151 or the pressure sensor 170, in some extreme cases, it may A large amount of the first medium 180 moves in the direction of the pressure sensor 170, which causes a part of the first medium 180 to be squeezed even to the pressure sensor 170, which may cause the pressure sensor 170 to fail.
第5A係揭示本發明具有元件保護結構之壓力感應模組之第一實施例之側剖面示意圖;第5B係揭示本發明元件保護結構與其鄰近局部結構之側剖面示意圖;第6圖係揭示本發明具有元件保護結構之壓力感應模組在第5A圖所示QQ’剖面線上之俯視示意圖;第5A圖、第5B圖、第6圖所示的壓力感應模組101,在氣室151內部,在壓力感測器170與第一介質180間、或者在結構牆140與第一介質180間、或者在第一介質180的外側的位置上,設置有一個或者多個保護結構600,保護結構600可設置在第一基板120、或者第二基板130上、或者保護結構600可與壓力感測器170設置在同一基板上或者分設在不同基板上,在本實施例,保護結構600係與壓力感測器170係分別設在不同基板上,保護結構600設置在第一基板120上而壓力感測器170設置在第二基板130上,保護結構600的上下兩端只有一端會與第一基板120、或者第二基板130接觸,保護結構600其材質係選自固態介質、或者高分子量矽膠等。 5A is a schematic side sectional view of a first embodiment of a pressure sensing module with a component protection structure of the present invention; 5B is a schematic side sectional view of a component protection structure of the present invention and its adjacent partial structure; FIG. 6 is a schematic view of the present invention A schematic plan view of a pressure sensing module with a component protection structure on the QQ 'section line shown in FIG. 5A; the pressure sensing module 101 shown in FIG. 5A, FIG. 5B, and FIG. One or more protective structures 600 are provided between the pressure sensor 170 and the first medium 180, or between the structural wall 140 and the first medium 180, or at a position outside the first medium 180. The protective structure 600 may The protection structure 600 may be provided on the first substrate 120 or the second substrate 130 or the protection structure 600 and the pressure sensor 170 on the same substrate or on separate substrates. In this embodiment, the protection structure 600 is related to the pressure sensor. The detector 170 is provided on a different substrate. The protection structure 600 is provided on the first substrate 120 and the pressure sensor 170 is provided on the second substrate 130. Only one end of the upper and lower ends of the protection structure 600 is connected to the first substrate. Substrate 120, or in contact with the second substrate 130, the protective structure 600 which is a solid material selected from medium or high molecular weight silicone and the like.
在本實施例,保護結構600較佳是在X平面上,是以連續結構體的方式形成類似圍牆、或者口型結構的結構體,在第一介質180之外側接近第一介質180之處包圍著第一介質180,保護結構600在Y平面上的保護結構高度b係介於0到小於間隙高度H之間,但較佳大於間隙高度H的一半或者更多,保護結構600以圍型結構192形式的配置,可防止當觸碰位置較接近壓力感測器170時第一介質180產生過大的形變、阻擋過多的第一介質180 擠入氣室151、防止第一介質180擠壓到壓力感測器170、防止第一介質180流動到壓力感測器170上、防止第一介質180因為過壓而在邊緣處造成的脫膠現象等等,上述這些情況會導致第一介質180脫膠、或者壓力感測器170的故障,而可能使得壓力感應模組101產生感應靈敏度降低、作動異常或者故障等。 In this embodiment, the protective structure 600 is preferably formed on the X plane as a continuous wall or a mouth-shaped structure in the form of a continuous structure, and is surrounded on the outside of the first medium 180 near the first medium 180 Concerning the first medium 180, the protective structure height b of the protective structure 600 on the Y plane is between 0 and less than the gap height H, but preferably greater than half or more of the gap height H. The protective structure 600 is a surrounding structure The configuration of 192 can prevent the first medium 180 from being deformed excessively and blocking too much of the first medium 180 when the touch position is closer to the pressure sensor 170 Squeeze into the air chamber 151, prevent the first medium 180 from being squeezed to the pressure sensor 170, prevent the first medium 180 from flowing onto the pressure sensor 170, and prevent the first medium 180 from debonding at the edges due to overpressure For example, the above-mentioned conditions may cause the first medium 180 to be de-glued or the pressure sensor 170 to fail, and may cause the pressure sensing module 101 to have reduced sensitivity, abnormal operation or failure.
如第5B圖所揭示,當壓力感應模組101接受到較大的壓力時,第一介質180的介質邊緣181會朝向結構牆140、氣室151或壓力感測器170方向移動,但在保護結構600的阻擋之下,第一介質180的介質邊緣181會被侷限在保護結構600的範圍內,而避免發生大量的第一介質180往壓力感測器170的方向移動,導致一部分的第一介質180甚至擠壓到壓力感測器170,當第一介質180是較偏軟質的固態介質或者液態介質時,則一部分第一介質180可能會流動到壓力感測器170上等等的問題,第5B圖還包含結構牆140的實施例,在某些實施例中,結構牆140較佳包含一層紫外光固化膠140a、一層聚氨酯聚合物140b、一層雙面膠140c。 As shown in FIG. 5B, when the pressure sensing module 101 receives a larger pressure, the medium edge 181 of the first medium 180 will move toward the structural wall 140, the air chamber 151, or the pressure sensor 170, but the protection Under the obstruction of the structure 600, the medium edge 181 of the first medium 180 will be confined within the range of the protection structure 600, so that a large amount of the first medium 180 cannot move toward the pressure sensor 170, resulting in a part of the first The medium 180 is even squeezed to the pressure sensor 170. When the first medium 180 is a relatively soft solid medium or a liquid medium, a part of the first medium 180 may flow onto the pressure sensor 170, and so on. FIG. 5B also includes an embodiment of the structural wall 140. In some embodiments, the structural wall 140 preferably includes a layer of ultraviolet curing adhesive 140a, a layer of polyurethane polymer 140b, and a layer of double-sided adhesive 140c.
第6係揭示本發明具有元件保護結構之壓力感應模組之第二實施例之側剖面示意圖;在本實施例,第6圖所示的壓力感應模組101,其配置在氣室151內部,在壓力感測器170與第一介質180間、或者在結構牆140與第一介質180間、或者在第一介質180的外側的位置上,所設置的一個或者多個保護結構600,是設置在第二基板130上而與壓力感測器170、以及第二介質190設置在同一基板上,保護結構600的上下兩端只有一端會與第一基板120、或者第二基板130接觸,保護結構600在Y平面上的保護結構高度b係介於0到小於間隙高度H之間,但較佳大於間隙高度H的一半或者更多。 The sixth series discloses a schematic side sectional view of the second embodiment of the pressure sensing module with a component protection structure of the present invention; in this embodiment, the pressure sensing module 101 shown in FIG. 6 is arranged inside the air chamber 151, One or more protection structures 600 provided between the pressure sensor 170 and the first medium 180, or between the structural wall 140 and the first medium 180, or at a position outside the first medium 180 are provided. On the second substrate 130, the pressure sensor 170 and the second medium 190 are disposed on the same substrate. Only one end of the upper and lower ends of the protective structure 600 will contact the first substrate 120 or the second substrate 130. The protective structure The protective structure height b of 600 on the Y plane is between 0 and less than the gap height H, but preferably greater than half or more of the gap height H.
第7圖係揭示本發明具有元件保護結構之壓力感應模組在X平面上之結構示意圖;在某些實施例中,保護結構600只設置在氣室151內鄰近壓力感測器170的位置上,保護結構600較佳是形成在Y平面上投影形狀為柱狀體之柱型結構體(未示出),並且在X平面上的投影形狀在本實施例較佳為鈍角矩形,但也可為矩形、方形或者其他形狀,在本實施例保護結構600是均勻的並且對稱的分布在氣室151內鄰近壓力感測器170的位置上,但保護結構600也可以採取非均勻地、或者非對稱地分布,保護結構600所形成的柱型結構體,在Y平面上的高度係介於0到小於間隙高度H之間,但較佳大於間隙高度H的一半或者更多。 FIG. 7 is a schematic diagram illustrating the structure of a pressure sensing module with a component protection structure on the X plane according to the present invention; in some embodiments, the protection structure 600 is only disposed at a position adjacent to the pressure sensor 170 in the air chamber 151 The protective structure 600 is preferably a columnar structure (not shown) projected into a columnar shape on the Y plane, and the projected shape on the X plane is preferably an obtuse-angled rectangle in this embodiment, but it may also be The protection structure 600 is rectangular, square, or other shapes. In this embodiment, the protection structure 600 is uniform and symmetrically distributed in the air chamber 151 adjacent to the pressure sensor 170. However, the protection structure 600 may also be non-uniform or non-uniform. Symmetrically distributed, the height of the columnar structure formed by the protective structure 600 in the Y-plane is between 0 and less than the gap height H, but preferably greater than half or more of the gap height H.
如第7圖所揭示,當壓力感應模組101接受到較大的壓力時,第一介質180的介質邊緣181會朝向結構牆140、氣室151或壓力感測器170方向移動,但在本實施例,保護結構600是設置在氣室151內鄰近壓力感測器170的位置上,因此在保護結構600的阻擋之下,當第一介質180是較偏軟質的固態介質或者液態介質時,第一介質180的介質邊緣181無法擠壓到壓力感測器170。 As shown in FIG. 7, when the pressure sensing module 101 receives a large pressure, the medium edge 181 of the first medium 180 moves toward the structural wall 140, the air chamber 151, or the pressure sensor 170. In the embodiment, the protection structure 600 is disposed near the pressure sensor 170 in the air chamber 151. Therefore, when the first medium 180 is a relatively soft solid medium or a liquid medium under the block of the protection structure 600, The medium edge 181 of the first medium 180 cannot be pressed to the pressure sensor 170.
第8圖係揭示本發明具有元件保護結構之壓力感應模組在X平面上之結構示意圖;在某些實施例中,保護結構600只設置在氣室151內鄰近壓力感測器170的位置上,保護結構600較佳是形成在Y平面上投影形狀為柱狀體之柱型結構體(未示出),但其在X平面上的投影形狀在本實施例較佳為直角L形,在本實施例保護結構600是均勻的並且對稱的分布在氣室151內鄰近壓力感測器170的位置上,而具有直角L型的保護結構600,因為多出L型的兩道延伸翼牆,因此保護結構600能夠對壓力感測器170提供更完整的 保護,防止第一介質180對壓力感測器170造成影響。 FIG. 8 is a schematic diagram illustrating the structure of the pressure sensing module with a component protection structure on the X plane according to the present invention; in some embodiments, the protection structure 600 is only disposed at a position adjacent to the pressure sensor 170 in the air chamber 151 The protective structure 600 is preferably formed as a columnar structure (not shown) projected into a columnar shape on the Y plane, but its projection shape on the X plane is preferably a right-angled L shape in this embodiment. In this embodiment, the protection structure 600 is uniform and symmetrically distributed in the air chamber 151 adjacent to the pressure sensor 170, and has a right-angle L-shaped protection structure 600, because there are two L-shaped extension wing walls. Therefore, the protection structure 600 can provide more complete pressure sensor 170. Protect the first medium 180 from affecting the pressure sensor 170.
第9圖係揭示本發明具有元件保護結構與多重氣室之壓力感應模組在X平面上之結構示意圖;在某些實施例中,壓力感應模組101的氣密腔150中包含多個氣室151、152,每一個氣室151、152中都包含一個保護結構601、192,在L形的氣室151中,設置有在X平面上是呈現出帶圓弧角的L型結構體的保護結構601,在I形的氣室152中,設置有在X平面上是呈現出直型結構體的保護結構602,或者在I形的氣室152中,也可以設置多個直型結構體的保護結構602。 FIG. 9 is a schematic diagram illustrating the structure of a pressure sensing module with a component protection structure and multiple air chambers on the X plane according to the present invention; in some embodiments, the airtight cavity 150 of the pressure sensing module 101 includes a plurality of air Each of the air chambers 151 and 152 includes a protective structure 601 and 192. The L-shaped air chamber 151 is provided with an L-shaped structure with an arc angle on the X plane. The protective structure 601 is provided with a protective structure 602 showing a straight structure on the X plane in the I-shaped air chamber 152, or a plurality of straight structures may be provided in the I-shaped air chamber 152的 保护 结构 602。 The protective structure 602.
本發明以上各實施例彼此之間可以任意組合或者替換,從而衍生更多之實施態樣,但皆不脫本發明所欲保護之範圍,茲進一步提供更多本發明實施例如次: The above embodiments of the present invention can be arbitrarily combined or replaced with each other, thereby deriving more implementation aspects, but all without departing from the scope of the present invention, and further provide more examples of the present invention:
實施例1:一種壓力感應模組,其包含:第一基板以及第二基板;結構牆,其形成在該第一基板與該第二基板之間,且兩端分別與該第一基板與該第二基板接觸,該第一基板、該第二基板以及該結構牆之間包含第一腔室,該第一腔室包含第一介質以及第二腔室;以及該第二腔室包含氣態介質、壓力感測器以及保護結構,該壓力感測器偵測該第二腔室內的氣壓變化。 Embodiment 1: A pressure-sensing module includes: a first substrate and a second substrate; a structural wall formed between the first substrate and the second substrate, and two ends of the structural wall are respectively connected to the first substrate and the first substrate. A second substrate is in contact, the first substrate, the second substrate, and the structural wall include a first chamber, the first chamber includes a first medium and a second chamber; and the second chamber includes a gaseous medium , A pressure sensor and a protection structure, the pressure sensor detects a change in air pressure in the second chamber.
實施例2:如實施例1所述之壓力感應模組,其中該第一腔室內還包含:輔助結構,其包含於該第一腔室內。 Embodiment 2: The pressure-sensing module according to embodiment 1, wherein the first chamber further includes an auxiliary structure included in the first chamber.
實施例3:如實施例1所述之壓力感應模組,其中該第一腔室內還包含:複數該第二腔室,其包含於該第一腔室內,並包含該氣態介質。 Embodiment 3: The pressure-sensing module according to embodiment 1, wherein the first chamber further comprises: a plurality of the second chambers, which are contained in the first chamber, and contain the gaseous medium.
實施例4:如實施例1所述之壓力感應模組,其中該保護結構 之型式包含柱型結構、圍型結構、直型結構、U型結構、L型結構、直角型結構、梯型結構、三角型結構、銳角型結構、鈍角型結構、十字型結構、斜型結構、弧型結構、水平型結構、垂直型結構、圓型結構、口型結構、圓錐型結構、W形結構、Z形結構及其組合其中之一。 Embodiment 4: The pressure sensing module according to embodiment 1, wherein the protection structure Types include columnar structure, enclosure structure, straight structure, U-shaped structure, L-shaped structure, right-angled structure, ladder structure, triangular structure, acute-angled structure, obtuse-angled structure, cross-shaped structure, and oblique structure. , Arc structure, horizontal structure, vertical structure, round structure, mouth structure, conical structure, W-shaped structure, Z-shaped structure and combinations thereof.
實施例5:如實施例1所述之壓力感應模組,其中該保護結構係設置在該第一基板與該第二基板之間,並設置在該第一基板與該第二基板其中之一上。 Embodiment 5: The pressure sensing module according to Embodiment 1, wherein the protection structure is disposed between the first substrate and the second substrate, and is disposed between one of the first substrate and the second substrate. on.
實施例6:如實施例1所述之壓力感應模組,其中該保護結構係設置在該壓力感測器與該第一介質之間,該保護結構係設置在該結構牆與該第一介質之間,該保護結構係設置在該第一介質外側,該保護結構係與該壓力感測器設置在同一基板上,或者該保護結構係與該壓力感測器設置在不同基板上。 Embodiment 6: The pressure sensing module according to embodiment 1, wherein the protection structure is disposed between the pressure sensor and the first medium, and the protection structure is disposed between the structural wall and the first medium. In between, the protection structure is disposed outside the first medium, the protection structure is disposed on the same substrate as the pressure sensor, or the protection structure is disposed on a different substrate from the pressure sensor.
實施例7:如實施例1所述之壓力感應模組,其中該保護結構是以均勻分布、非均勻分布、連續分布、不連續分布、對稱分布或者非對稱分布的方式配置在該氣密腔的該氣室中。 Embodiment 7: The pressure-sensing module according to embodiment 1, wherein the protection structure is arranged in the airtight cavity in a manner of uniform distribution, non-uniform distribution, continuous distribution, discontinuous distribution, symmetrical distribution, or asymmetric distribution. In the air chamber.
實施例8:如實施例1所述之壓力感應模組,其中該第一基板以及該第二基板係為玻璃基板、導電玻璃基板、導電基板以及壓克力基板其中之一,該第一介質係為液態介質、固態介質、低分子量矽膠、光學彈性膜以及軟質彈性膜其中之一。 Embodiment 8: The pressure sensing module according to Embodiment 1, wherein the first substrate and the second substrate are one of a glass substrate, a conductive glass substrate, a conductive substrate, and an acrylic substrate, and the first medium It is one of liquid medium, solid medium, low molecular weight silicone, optical elastic film and soft elastic film.
實施例9:如實施例1所述之壓力感應模組,其中該結構牆之材質係包含高分子量矽膠、聚氨酯聚合物、雙面膠、環氧樹脂、紫外光固化膠以及封膠其中之一,該保護結構之材質係包含高分子量矽膠、聚氨酯 聚合物、雙面膠、環氧樹脂、紫外光固化膠以及封膠其中之一。 Embodiment 9: The pressure-sensing module according to Embodiment 1, wherein the material of the structural wall comprises one of high-molecular-weight silicone, polyurethane polymer, double-sided adhesive, epoxy resin, ultraviolet curing adhesive, and sealing compound. The material of the protective structure includes high molecular weight silicone and polyurethane Polymers, double-sided tapes, epoxy resins, UV curing adhesives and sealants.
實施例10:如實施例1所述之壓力感應模組,其中該氣態介質包含氣體、汽體、大氣、氮氣、水汽、空氣及其組合其中之一,該液態介質包含水、凝膠體、酒精及其組合其中之一。 Embodiment 10: The pressure sensing module according to embodiment 1, wherein the gaseous medium includes one of gas, vapor, atmosphere, nitrogen, water vapor, air, and a combination thereof, and the liquid medium includes water, gel, Alcohol and one of its combinations.
本發明各實施例彼此之間可以任意組合或者替換,從而衍生更多之實施態樣,但皆不脫本發明所欲保護之範圍,本發明保護範圍之界定,悉以本發明申請專利範圍所記載者為準。 The embodiments of the present invention can be arbitrarily combined or replaced with each other, thereby deriving more implementation aspects, but without departing from the scope of the present invention to be protected and the definition of the scope of protection of the present invention The recorder shall prevail.
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| CN105824471A (en) * | 2016-03-16 | 2016-08-03 | 京东方科技集团股份有限公司 | Pressure sensing panel, manufacturing method of pressure sensing panel, display device and pressure touch method |
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